一种芯片焊接机光学检出的方法、装置及设备
By adding real-time detection of the position and orientation of the lead frame (BA) in the chip bonding machine, combined with lead frame information, and using a parallel zoom lens and image processing system, the problem of insufficient welding position accuracy in the chip bonding machine was solved, thereby improving welding accuracy and product reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- QUICK INTELLIGENT EQUIP CO LTD
- Filing Date
- 2025-10-17
- Publication Date
- 2026-07-17
AI Technical Summary
Existing optical inspection systems for chip bonding machines cannot monitor chip offset errors and the movement posture of the bonding arm (BA) during the handling process in real time, resulting in insufficient bonding position accuracy, which affects bonding yield and product reliability.
By adding real-time detection of the BA position and orientation, combined with leadframe position information, and using parallel high-resolution zoom lenses and image processing systems, the relative position of the chip and leadframe is calculated and corrected in real time.
It enables real-time detection of chip position and precise correction of leadframe soldering position, improving soldering accuracy and bonding yield, and enhancing product reliability.
Smart Images
Figure CN121297664B_ABST