Thermal test cooling device for heat pipes

Abstract

The embodiment of the application provides a kind of for heat pipe thermal test cooling device, it is related to thermal test technical field, thermal test cooling device includes heat collection pipe, heat exchange air gap and cooling pipe, heat collection pipe has assembly cavity, assembly cavity is used to install the heat pipe to be measured, heat exchange air gap is opened in heat collection pipe, heat exchange air gap is surrounded in at least part assembly cavity, the air gap mouth of heat exchange air gap is used to change the pressure of heat exchange gas in heat exchange air gap and heat exchange air gap, cooling pipe is sleeved outside heat collection pipe, cooling pipe and heat collection pipe between there is double-layer cooling channel with bottom communication, cooling medium in cooling channel from top to bottom, via bottom communication space again from bottom to top flow and take away heat at heat collection pipe.

Description

Technical Field

[0001] This application relates to the field of thermal testing technology, and in particular to a thermal testing cooling device for heat pipes. Background Technology

[0002] In the field of energy engineering, such as thermal power generation, nuclear power generation, and chemical engineering, high-temperature heat pipes are a common heat transfer device with advantages such as high heat transfer power and small temperature difference.

[0003] To ensure that high-temperature heat pipes perform better under various real-world conditions, their thermal performance needs to be tested in the laboratory. However, existing testing equipment can only simulate relatively simple operating conditions and cannot adequately simulate the flexible and varied cooling methods encountered in actual working conditions. Summary of the Invention

[0004] In a first aspect, this application provides a cooling device for thermal testing of heat pipes, comprising a heat collector pipe, a heat exchange gap, and a cooling pipe. The heat collector pipe has an assembly cavity for mounting the heat pipe to be tested. The heat exchange gap is formed on the heat collector pipe and surrounds at least part of the assembly cavity. The air gap opening is used to change the pressure of the heat exchange gas within the heat exchange gap and the pressure within the heat exchange gap. The cooling pipe is sleeved outside the heat collector pipe, and a double-layer cooling channel with bottom communication exists between the cooling pipe and the heat collector pipe. The cooling medium in the cooling channel flows from bottom to top, passes through the bottom communication space, and then flows from bottom to top again, carrying away the heat from the heat collector pipe.

[0005] In one possible implementation, the heat exchange gas in the heat exchange gap includes a first gas and a second gas, wherein the thermal conductivity of the first gas is greater than or equal to 5 times that of the second gas.

[0006] In one possible implementation, the radial thickness of the heat exchange gap is less than or equal to 1.5 mm.

[0007] In one possible implementation, the thermal testing cooling device further includes an assembly groove and a temperature measuring element. The assembly groove is formed on the inner wall of the heat collecting tube and communicates with the assembly cavity. The temperature measuring element is disposed in the assembly groove and is used to measure the temperature of the heat pipe under test.

[0008] In one possible implementation, the heat collection tube includes an inner tube and an outer tube, the inner tube having an assembly groove and an assembly cavity. The outer tube surrounds the outside of the inner tube, and a heat exchange air gap with an air gap opening at one end is formed between the outer tube and the inner tube, the air gap opening including an air inlet and an air outlet.

[0009] In one possible implementation, the thermal testing cooling device further includes a mounting base and a plurality of fasteners, the mounting base having a fixing cavity. The plurality of fasteners are movably mounted on the mounting base, a portion of the fasteners extending into the fixing cavity, the ends of the plurality of fasteners being close to each other and forming a fastening space, the heat pipe under test extending into the fastening space and contacting the fasteners.

[0010] In one possible implementation, the cooling pipe includes a pipe body and a partition pipe, the pipe body being connected to the heat collection pipe. The partition pipe is disposed between the pipe body and the heat collection pipe to separate an inlet channel and an outlet channel that are connected at the bottom, the inlet channel and the outlet channel forming a cooling channel.

[0011] In one possible implementation, the water outlet channel is positioned closer to the heat collector tube than the water inlet channel.

[0012] In one possible implementation, the radial thickness of either the inlet channel or the outlet channel is less than or equal to 2 mm.

[0013] In one possible implementation, the thermal test cooling device further includes an end cap, which is sealed to the heat collection tube and the cooling tube. The end cap is provided with a cover air port communicating with the air gap and a cover water port communicating with the cooling channel.

[0014] Compared with the prior art, the beneficial effects of this application are:

[0015] The thermal test cooling device provided in this application utilizes the circulating cooling medium inside the cooling pipe to remove heat from the condensation section of the heat pipe under test. The heat exchange air gap set inside the heat collector pipe is used to adjust the total heat exchange resistance of the thermal test cooling device, thereby changing the operating temperature and heat transfer of the heat pipe under test. This facilitates the testing of the heat transfer performance of the heat pipe under test under various operating conditions. The double-layer cooling channel has preheating and uniform heat exchange capabilities. At the same time, the heat collector pipe and the cooling pipe are integrated into a simple structure.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 The thermal testing cooling device provided in the embodiments of this application;

[0019] Figure 2A longitudinal section view of a thermal test cooling device provided in one embodiment of this application;

[0020] Figure 3 A cross-sectional view of a thermal test cooling device provided in one embodiment of this application;

[0021] Figure 4 A schematic diagram of the structure of the fixing seat in a thermal test cooling device provided for one embodiment of this application;

[0022] Figure 5 A cross-sectional view of the end cap of a thermal test cooling device provided in one embodiment of this application.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Heat collector tube; 101. Assembly cavity; 102. Heat exchange air gap; 103. Assembly slot.

[0025] 11 Inner tube, 111 Extension end,

[0026] 12 outer tubes,

[0027] 2. Cooling pipe, 21. Pipe body, 22. Divider pipe, 201. Water inlet channel, 202. Water outlet channel.

[0028] 3 fixed bases, 30 fixed cavities

[0029] 4. Fasteners

[0030] 5. End cap, 501 air inlet, 502 air outlet, 503 water inlet, 504 water outlet.

[0031] 6. Heat pipes to be tested. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0034] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0035] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0036] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0037] Firstly, such as Figure 1 , Figure 2 and Figure 3 As shown, this application provides a cooling device for thermal testing of heat pipes, including a heat collection pipe 1, a heat exchange gap 102, and a cooling pipe 2. The heat collection pipe 1 has an assembly cavity 101 for mounting the heat pipe 6 to be tested. The heat exchange gap 102 is formed on the heat collection pipe 1 and surrounds at least part of the assembly cavity 101. The air gap opening of the heat exchange gap 102 is used to change the heat exchange gas inside the heat exchange gap 102 and the pressure of the heat exchange gap 102. The cooling pipe 2 is sleeved outside the heat collection pipe 1, and there is a double-layer cooling channel with bottom communication between the cooling pipe 2 and the heat collection pipe 1. The cooling medium in the cooling channel flows from top to bottom, through the bottom communication space, and then from top to bottom again, carrying away the heat at the heat collection pipe 1.

[0038] The thermal testing cooling device provided in this application includes a heat collection tube 1, a heat exchange air gap 102, and a cooling tube 2. The heat collection tube 1 has an assembly cavity 101 with open ends. The heat pipe 6 to be tested is assembled in the assembly cavity 101 and contacts the inner wall of the heat collection tube 1, which allows the heat collection tube 1 to absorb heat from the heat pipe 6 to be tested more effectively, thereby enabling the heat pipe 6 to cool down quickly.

[0039] The heat collector tube 1 is provided with a heat exchange air gap 102, which is arranged around the center line of the heat collector tube 1 and is an annular air gap. The longitudinal length of the heat exchange air gap 102 is less than or equal to the longitudinal length of the assembly cavity 101. The annular air gap can effectively transfer the heat absorbed at various locations on the heat collector tube 1.

[0040] A cooling pipe 2 is fitted around the outer side of the heat collector tube 1. A cooling channel is formed between the inner wall of the cooling pipe 2 and the outer wall of the heat collector tube 1, and a cooling medium, such as water, flows within the cooling channel. The heat from the heat pipe 6 under test is transferred to the cooling medium through the inner layer of the heat collector tube 1, the heat exchange gap 102, and the outer layer of the heat collector tube 1. The cooling medium circulates and carries away the heat. It is worth noting that the cooling pipe 2 fitted around the outer side of the heat collector tube 1 gives the thermal test cooling device a multi-layer concentric tube structure, which is simple, compact, and easy to operate.

[0041] Specifically, during the heat transfer process at the heat pipe 6 under test, the total heat transfer resistance R of the thermal test cooling device includes the following: the contact thermal resistance R between the heat pipe 6 under test and the inner layer of the collector pipe 1. i The thermal resistance R of collector tube 1 c The thermal resistance R of the heat exchange gap 102 g and the thermal resistance R of cooling water convection heat transfer h That is, the total heat transfer resistance R of the thermal test cooling device satisfies:

[0042] R = R i +R c +R g +R h (1)

[0043] The thermal resistance R of the heat exchange gap 102 can be adjusted by regulating the composition of the heat exchange gas and the pressure within the heat exchange gap 102. g This allows for the adjustment of the total heat transfer resistance R of the thermal test cooling device, enabling continuous variation of the total heat transfer resistance R. This allows for precise testing of the heat transfer performance of the heat pipe 6 under test, simulating various operating conditions faced by the heat pipe 6 during actual use, and ensuring the flexibility and accuracy of the test simulation.

[0044] The thermal test cooling device provided in this application uses the cooling medium circulating in the cooling pipe 2 to remove the heat from the heat pipe 6 under test. The heat exchange gap 102 set in the heat collection pipe 1 is used to adjust the total heat exchange resistance of the thermal test cooling device, thereby changing the working temperature and heat transfer of the heat pipe 6 under test, which facilitates the testing of the heat transfer performance of the heat pipe 6 under various working conditions.

[0045] It is worth noting that, for the heat pipe under test 6, depending on its application scenario, it includes an evaporation section, an adiabatic section, and a condensation section. In the evaporation section, the internal working fluid melts and evaporates under the influence of a heat source. The resulting high-temperature steam flows through the adiabatic section, reaches the condensation section, and condenses into liquid under the influence of a heat trap. The condensate then flows back to the evaporation section under the capillary force of the capillary wick, thus forming a cyclical steady-state working process of heating and evaporation – steam flow – condensation and reflux. The heat source in the evaporation section and the heat trap in the condensation section are important external factors affecting the operation of the heat pipe under test 6. The coupling effect of the input power at the heat source and the cooling capacity at the heat trap determines the operating temperature and the ultimate heat transfer of the heat pipe under test 6, significantly influencing its start-up characteristics, steady-state characteristics, and heat transfer limit. The thermal testing cooling device provided in this application is used for cooling the condensation section of the heat pipe under test 6. Here, the heat trap refers to a device or location used to receive or consume waste heat.

[0046] In one possible implementation, the heat exchange gas in the heat exchange gap 102 includes a first gas and a second gas, wherein the thermal conductivity of the first gas is greater than or equal to 5 times the thermal conductivity of the second gas.

[0047] In this embodiment, the heat exchange gas within the heat exchange gap 102 includes at least two gases with significantly different thermal conductivity, such as a mixture of helium and argon. By adjusting the proportions of different gases in the heat exchange gap 102, the thermal resistance R of the heat exchange gap 102 can be adjusted. g Continuous changes can adjust the total heat exchange resistance of the thermal test cooling device, thereby changing the temperature and heat exchange capacity of the heat pipe 6 under test.

[0048] It is worth noting that the heat exchange gap 102 is equipped with an inlet pipe, an outlet pipe, a multi-way valve, a pressure gauge, and a vacuum pump. The inlet pipe is connected to both a helium cylinder and an argon cylinder via the multi-way valve, and the outlet pipe is connected to a gas collecting bottle, thus forming a heat exchange gas passage. A pressure gauge and a vacuum pump are installed in the heat exchange gas passage. The pressure gauge is used to measure the pressure within the heat exchange gap 102 and to monitor the pressure in real time. The vacuum pump is used to extract the gas from the heat exchange gap 102.

[0049] In one possible implementation, the radial thickness of the heat exchange gap 102 is less than or equal to 1.5 mm.

[0050] In one possible implementation, such as Figure 5 As shown, the thermal test cooling device also includes an assembly groove 103 and a temperature measuring element. The assembly groove 103 is formed on the inner wall of the heat collection tube 1 and is connected to the assembly cavity 101. The temperature measuring element is disposed in the assembly groove 103 and is used to measure the temperature of the heat tube 6 under test.

[0051] In this embodiment, an assembly groove 103 is provided on the inner wall of the heat collection tube 1. The assembly groove 103 communicates with the assembly cavity 101. Specifically, the opening of the assembly groove 103 faces the heat tube 6 to be tested. The temperature sensing element is disposed in the assembly groove 103. When the heat tube 6 to be tested is located in the assembly cavity 101, the temperature sensing element can contact the wall surface of the heat tube 6 to be tested, thereby realizing the temperature measurement of the heat tube 6 to be tested. It is conceivable that the number and arrangement of the temperature sensing elements can be reasonably arranged according to the testing requirements of the heat tube 6 to be tested.

[0052] The temperature sensing element can be fixed to the wall of the heat pipe 6 to be tested by silver brazing or stainless steel patch spot welding.

[0053] It should be noted that when the heat pipe 6 to be tested is installed in the assembly cavity 101, after the heat pipe 6 to be tested expands slightly due to heat, the gap between the heat pipe 6 to be tested and the heat collector 1 is basically zero, that is, the contact thermal resistance between the heat pipe 6 to be tested and the heat collector 1 can be ignored.

[0054] The assembly slots 103 are multiple, and are evenly spaced around the center of the assembly cavity 101. When there are multiple temperature sensing elements, each element is installed in one of the multiple assembly slots 103. The axial depth of the multiple temperature sensing elements extending into the assembly slots 103 can be the same, not exactly the same, or completely different, and can be set according to testing requirements; this application does not impose any limitations.

[0055] In one possible implementation, such as Figure 2 As shown, the heat collection tube 1 includes an inner tube 11 and an outer tube 12. The inner tube 11 has an assembly groove 103 and an assembly cavity 101. The outer tube 12 surrounds the outer side of the inner tube 11, and a heat exchange air gap 102 with an air gap at one end is formed between the outer tube 12 and the inner tube 11. The air gap includes an air inlet 501 and an air outlet 502.

[0056] In this embodiment, the heat collection tube 1 includes an inner tube 11 and an outer tube 12 sleeved outside the inner tube 11, with the inner tube 11 and outer tube 12 coaxially arranged. The inner tube 11 has an assembly groove 103 on its inner wall and an assembly cavity 101. A heat exchange air gap 102 is formed between the outer tube 12 and the inner tube 11. The axial lengths of the inner tube 11 and the outer tube 12 may be the same or different.

[0057] Specifically, the principle for adjusting the gas composition and pressure within the heat exchange gap 102 to regulate the total heat exchange resistance of the thermal test cooling device is as follows:

[0058] According to equation (1), the total heat transfer resistance R consists of four parts, and the calculation formula for the resistance of each part is as follows:

[0059] Regarding the contact thermal resistance R between the inner layer of the heat pipe 6 and the collector pipe 1 under test i ,satisfy:

[0060]

[0061] In equation (2), d1 is the outer diameter of the heat pipe 6 to be tested; h i l is the equivalent heat transfer coefficient in the contact heat conduction model; c The length of the condensation section of the heat pipe 6 to be tested is located in the assembly cavity 101.

[0062] Regarding the thermal resistance R of collector tube 1 c ,satisfy:

[0063]

[0064] In equation (3), k c d1 is the thermal conductivity of collector tube 1; d2 is the outer diameter of inner tube 11; d3 is the inner diameter of outer tube 12; d4 is the outer diameter of outer tube 12. When collector tube 1 is made of stainless steel, then k c The value represents the thermal conductivity of stainless steel.

[0065] Regarding the thermal resistance R of the heat exchange gap 102. g ,satisfy:

[0066]

[0067] In equation (4), k g The value is the thermal conductivity of the gas inside the heat exchange gap 102.

[0068] Regarding the thermal resistance R of cooling water convection heat transfer. h ,satisfy:

[0069]

[0070] In equation (5), h is the convective heat transfer coefficient between the cooling water and the wall of the outer pipe 12.

[0071] Regarding the heat exchange q of the cooling water, the following condition is met:

[0072]

[0073] In equation (6), T c T represents the average wall temperature of the condenser section of heat pipe 6 under test. f This represents the average temperature of the cooling water.

[0074] Among them, due to the low thermal conductivity of gas, without considering radiation heat transfer, the thermal resistance R of the heat transfer gap 102 is... g Much greater than the other three heat transfer resistances, such as R i R cR h Therefore, for the total heat transfer resistance R, the heat transfer resistance R of the heat transfer gap 102 is... g Dominant.

[0075] At a temperature of 800K and a pressure of 0.1MPa, the thermal conductivity of helium is 0.308W / (m·K) and that of argon is 0.037W / (m·K), which is nearly 10 times different. Therefore, when the heat exchange gap 102 is filled with 0.1MPa of helium or argon, the thermal resistance of the gap layer and even the total thermal resistance will differ significantly.

[0076] As shown in equation (6), the wall temperature and heat transfer of the heat pipe 6 under test will vary significantly: under the same heat transfer conditions, the wall temperature of the heat pipe 6 under test will differ considerably, and under the same wall temperature, the heat transfer will also differ considerably. When the gas in the heat exchange gap 102 is helium, and the heat pipe 6 under test has not reached its heat transfer limit, the cooling water can remove more heat, greatly improving the heat transfer capacity. In this embodiment, by adjusting the ratio of helium to argon in the heat exchange gap 102, the thermal resistance R of the heat exchange gap 102 is adjusted. g Continuous variation means that the heat exchange capacity can be continuously adjusted.

[0077] The thermal testing cooling device provided in this application can be used to test the heat transfer performance of the heat pipe 6 under various operating conditions. Specifically, the thermal testing cooling device can achieve continuously adjustable heat exchange capacity and accurately measure the wall temperature of the condenser section of the heat pipe 6 under test through temperature sensing elements, thereby enabling accurate testing of the heat transfer performance of the heat pipe 6 under test. Specifically, it can be used for start-up, steady-state, transient, and heat transfer limit tests of high-temperature heat pipes under various operating conditions.

[0078] The device can be equipped with a bracket on the outer wall of the thermal test cooling device, and the tilt angle can be adjusted by connecting it to the tilt angle adjustment device. This allows for the testing of the performance of the heat pipe 6 under different tilt angles. The thermal test cooling device has good overall integrity, compact structure, and is easy to assemble and expand its functions.

[0079] In one possible implementation, such as Figure 2 and Figure 4 As shown, the thermal testing cooling device also includes a fixed base 3 and multiple fasteners 4. The fixed base 3 has a fixing cavity 30. The multiple fasteners 4 are movably mounted on the fixed base 3, with a portion of each fastener 4 extending into the fixing cavity 30. The ends of the multiple fasteners 4 are close to each other, forming a fastening space. The heat pipe 6 to be tested extends into the fastening space and contacts the fasteners 4.

[0080] In this embodiment, the inner tube 11 and the outer tube 12 have different longitudinal lengths, with the inner tube 11 having a longer longitudinal length than the outer tube 12. The inner tube 11 includes an extension end 111, which extends downward relative to the outer tube 12, and the air gap opening of the heat exchange air gap 102 is positioned upward. The extension end 111 is used to assist in the installation and fixation of the experimental device.

[0081] The thermal test cooling device also includes a fixing seat 3 with a fixing cavity 30, which is annular in shape. Multiple fasteners 4 are detachably provided on the fixing seat 3, each fastener 4 extending into the fixing cavity 30.

[0082] When the heat pipe 6 to be tested is installed in the assembly cavity 101, the length of the heat pipe 6 to be tested is greater than the length of the inner tube 11. The middle part of the heat pipe 6 to be tested will extend into the fixing cavity 30, and the ends of multiple fasteners 4 will abut against the tube wall of the heat pipe 6 to achieve a stable position of the bottom end of the heat pipe 6 to be tested.

[0083] The cooling pipe 2 is mounted on the fixed base 3, for example, the cooling pipe 2 is welded to the fixed base 3.

[0084] In one possible implementation, such as Figure 2 As shown, the cooling pipe 2 includes a pipe body 21 and a partition pipe 22. The pipe body 21 is connected to the heat collection pipe 1. The partition pipe 22 is located between the pipe body 21 and the heat collection pipe 1 to separate and form a bottom-connected water inlet channel 201 and a water outlet channel 202. The water inlet channel 201 and the water outlet channel 202 constitute a cooling channel.

[0085] In this embodiment, the cooling pipe 2 includes a pipe body 21, which is sleeved outside the heat collection pipe 1. A partition pipe 22 is disposed between the pipe body 21 and the heat collection pipe 1, thereby forming an inlet channel 201 and an outlet channel 202. Cooling water enters from the inlet channel 201 and then flows out through the outlet channel 202. During the flow in the cooling channel, it carries away the heat from the heat collection pipe 1.

[0086] In one possible implementation, the water outlet channel 202 is positioned closer to the heat collector tube 1 than the water inlet channel 201.

[0087] In this embodiment, the water outlet channel 202 is positioned closer to the heat collector tube 1 than the water inlet channel 201, meaning the water inlet channel 201 is positioned further out than the water outlet channel 202. Cooling water enters through the outer water inlet channel 201 and then flows out through the inner water outlet channel 202, which is closer to the heat collector tube 1. The water inlet channel 201 and the water outlet channel 202 are connected at the bottom.

[0088] The inlet 503 and outlet 504 of the water inlet channel 201 and the outlet channel 202 are both located at the top. The cool water with a lower temperature flows in from top to bottom through the outer water inlet channel 201, is preheated to a uniform and stable temperature, and then flows out from bottom to top through the outlet channel 202, absorbing heat from the heat collector tube 1. The temperature of the cool water increases, and the heat exchange is sufficient and relatively uniform.

[0089] In this embodiment, the heat transfer of the heat pipe 6 under test can be calculated by measuring the mass flow rate and temperature change of the cooling water.

[0090] The cooling water undergoes forced convection heat transfer within the cooling channel. Both the cooling water inlet 503 and outlet 504 are located at the top of the thermal test cooling device. The cooling water flows from top to bottom into the inlet channel 201 through the inlet 503. The inlet channel 201 is an outer annular flow channel. The water then enters the outlet channel 202 through the bottom connecting space. The outlet channel 202 is an inner annular cooling flow channel composed of the separator pipe 22 and the heat collector pipe 1. The water then flows out from bottom to top, absorbing heat from the heat collector pipe 1 to cool the heat pipe 6 under test and carrying away the heat from the heat pipe 6 under test.

[0091] During the cooling water circulation process, the flow rate of the cooling water is relatively uniform, which allows for sufficient heat exchange between the cooling water and the heat pipe under test 6. In this embodiment, the heat transfer q of the heat pipe can be calculated by measuring the mass flow rate and temperature change of the cooling water.

[0092] q = C pl m l (T out -T in (7)

[0093] In equation (7), m l C is the mass flow rate of the cooling water. pl T is the specific heat capacity of cooling water at constant pressure. in and T out These are the temperatures at the cooling water inlet 503 and outlet 504, respectively.

[0094] To reduce the heat transfer deviation of the heat pipe 6 under test caused by temperature measurement error, a low flow rate is used at low power and a high flow rate is used at high power, which can achieve a better match of the thermal parameters of the cooling water.

[0095] Based on the aforementioned equations (1) to (7), the formula for calculating the total heat transfer resistance R of the thermal test cooling device can be obtained:

[0096]

[0097] In one possible implementation, the radial thickness of either the inlet channel 201 or the outlet channel 202 is less than or equal to 2 mm.

[0098] In one possible implementation, the thermal test cooling device further includes an end cover 5, which is sealed to the heat collection tube 1 and the cooling tube 2. The end cover 5 is provided with a cover air port communicating with the air gap and a cover water port communicating with the cooling channel.

[0099] In this embodiment, an end cap 5 is provided at the top of the heat collection pipe 1 and the cooling pipe 2. The end cap 5 is connected by welding to improve the overall sealing performance of the thermal test cooling device.

[0100] Specifically, the end cap 5 has a cover air port that communicates with the air gap. The cover air port includes an air inlet 501 and an air outlet 502. The air inlet 501 is connected to the air inlet pipe, and the air outlet 502 is connected to the air outlet pipe, so as to realize the regulation of the gas ratio and pressure in the heat exchange air gap 102.

[0101] Specifically, the end cap 5 is also provided with a water inlet that communicates with the cooling channel. The water inlet includes an inlet 503 and an outlet 504. The inlet 503 communicates with the water inlet channel 201, and the outlet 504 communicates with the water outlet channel 202. In a specific embodiment, the inlet 503 is positioned away from the assembly cavity 101 relative to the outlet 504.

[0102] It is worth noting that the heat collection tube 1, cooling tube 2, end cap 5, and fixing base 3 involved in the thermal test cooling device are all connected by welding, resulting in good overall sealing of the thermal test cooling device. No additional sealing structure is required, making the structure compact and small in size. The connection between the heat exchange gap 102, the interface at the cooling channel, and the external circuit can use flexible joints, such as three-way valves or flexible hoses. During the assembly of the heat pipe 6 under test, it is only necessary to insert the heat pipe 6 under test into the innermost heat collection tube 1, and then fix it with the fixing base 3 and fasteners 4, which allows for quick installation, debugging, and disassembly, making it convenient to use.

[0103] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A cooling device for thermal testing of heat pipes, characterized in that, include: A heat collection tube having an assembly cavity for mounting a heat pipe to be tested; the heat collection tube includes an inner tube and an outer tube surrounding the outer side of the inner tube, the inner tube having the assembly cavity, and a heat exchange gap being formed between the outer tube and the inner tube; The heat exchange gap is located outside at least part of the assembly cavity. The air gap opening is used to change the heat exchange gas inside the heat exchange gap and the pressure of the heat exchange gap. The heat exchange gap is used to adjust the total heat exchange resistance of the thermal test cooling device. The air gap opening includes an inlet and an outlet. The heat exchange gap is equipped with an inlet pipe, an outlet pipe, a multi-way valve, a pressure gauge, and a vacuum pump. The inlet pipe is connected to a helium cylinder and an argon cylinder respectively through the multi-way valve. The outlet pipe is connected to a gas collecting bottle, thereby forming a heat exchange gas passage. The pressure gauge is used to measure and monitor the pressure inside the heat exchange gap in real time. The vacuum pump is used to extract the gas inside the heat exchange gap. A cooling pipe is fitted outside the heat collector pipe. The cooling pipe and the heat collector pipe have a double-layer cooling channel with a bottom connection. The cooling medium in the cooling channel flows from top to bottom, through the bottom connection space and then from bottom to top, carrying away the heat at the heat collector pipe. The cooling pipe includes a pipe body and a partition pipe. The partition pipe is located between the pipe body and the heat collector pipe to separate and form a bottom-connected water inlet channel and a water outlet channel. The water inlet channel is an outer annular flow channel, and the water outlet channel is an inner annular cooling flow channel composed of the partition pipe and the heat collector pipe. The water outlet channel is located closer to the heat collector pipe than the water inlet channel.

2. The thermal test cooling device according to claim 1, characterized in that, The heat exchange gas within the heat exchange gap comprises a first gas and a second gas, wherein the thermal conductivity of the first gas is greater than or equal to five times that of the second gas; and / or The radial thickness of the heat exchange air gap is less than or equal to 1.5 mm.

3. The thermal test cooling device according to claim 1, characterized in that, The heat exchange q of the cooling water in the thermal test cooling device satisfies: ， The total heat transfer resistance R of the thermal test cooling device satisfies: ， Among them, C pl For the isobaric specific heat capacity of cooling water, m l T is the mass flow rate of the cooling water. out T represents the temperature at the cooling water outlet. in T represents the temperature at the cooling water inlet. c T is the average temperature of the condenser section wall of the heat pipe under test. f R is the average temperature of the cooling water. i R is the contact thermal resistance between the heat pipe under test and the heat collector pipe. c The thermal resistance of the heat collection tube, R g R is the thermal resistance of the heat exchange gap when the cooling medium is cooling water. h The thermal resistance is for heat transfer during cooling water convection.

4. The thermal test cooling device according to claim 1, characterized in that, The thermal test cooling device also includes: An assembly groove is formed on the inner wall of the heat collection tube, and the assembly groove communicates with the assembly cavity; A temperature sensing element is disposed in the assembly slot, and the temperature sensing element is used to measure the temperature of the heat pipe to be tested.

5. The thermal test cooling device according to claim 1, characterized in that, The thermal test cooling device also includes: The fixing seat has a fixing cavity; Multiple fasteners are movably mounted on the fixed base, with a portion of each fastener extending into the fixed cavity, and the ends of the multiple fasteners approaching each other to form a fastening space. The heat pipe to be tested extends into the fastening space and comes into contact with the fastener.

6. The thermal test cooling device according to claim 1, characterized in that, The radial thickness of either the inlet channel or the outlet channel is less than or equal to 2 mm.

7. The thermal test cooling device according to any one of claims 1 to 6, characterized in that, The thermal test cooling device also includes: An end cap is sealed to the heat collection tube and the cooling tube. The end cap is provided with a cover air port communicating with the air gap and a cover water port communicating with the cooling channel.

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