An integrated aging test machine and temperature control method

Abstract

The application discloses an integrated aging test machine and a temperature control method, and specifically belongs to the technical field of aging test. The integrated aging test machine comprises a case and a heat preservation module. The internal space of the case is divided into a room temperature zone, a transition zone and a high temperature zone along a first direction. A partition is arranged between the high temperature zone and the transition zone and between the room temperature zone and the transition zone. The first preset temperature of the room temperature zone is lower than the second preset temperature of the high temperature zone. The room temperature zone is provided with a control module, the transition zone is provided with an aging adaptation board, and the high temperature zone is provided with a device to be tested. The control module is electrically connected with the aging adaptation board, and the aging adaptation board is electrically connected with the device to be tested. The heat preservation module comprises a first air circuit and a second air circuit. The first air circuit is arranged in the room temperature zone and is used for maintaining the first preset temperature of the room temperature zone. The second air circuit is arranged in the high temperature zone and is used for maintaining the second preset temperature of the high temperature zone. Through the above arrangement, the control module is integrated into the test machine, and the control module can maintain a stable working temperature.

Description

Technical Field

[0001] This application relates to the field of integrated aging test machine technology, and in particular to an integrated aging test machine and temperature control method. Background Technology

[0002] The bathtub theory states that in the early stages of product use, due to design and manufacturing defects such as improper design, material defects, processing defects, and improper installation, the product failure rate is high but also exhibits a rapid decline. An aging test machine applies this principle by simulating the stress of the working environment to accelerate the early failure period, thus filtering out products that will fail during this early stage and improving the product qualification rate.

[0003] Aging test chambers typically include control devices for complex control tasks, such as computers, power modules, and various resource boards. These control devices require a stable operating environment, especially a stable operating temperature, to ensure the equipment's performance. Correspondingly, when conducting long-term heating tests on products, existing technologies often omit temperature-sensitive control devices and instead use a fixed wiring architecture to route signals directly into the test chamber. In this case, the aging test chamber can only handle one or a few specific test tasks; expanding test functions or performing equipment maintenance requires a complete shutdown, resulting in significant limitations. Another existing technology involves removing the control devices from inside the test chamber using long cables or flexible boards. This not only increases the overall space cost of the machine but also leads to signal attenuation and timing drift issues due to the long cables.

[0004] Therefore, the key research direction at present is how to design a system in which the control device can still be set inside the aging test machine and maintain a stable and suitable operating temperature when the equipment is subjected to long-term high and low temperature tests, thus achieving integrated setup. Summary of the Invention

[0005] In view of the above-mentioned technical problems existing in the prior art, this application provides an integrated aging test machine and a temperature control method.

[0006] In one technical solution of this application, an integrated aging test machine is provided, comprising: a chassis and an insulation module. The internal space of the chassis is divided into a room temperature zone, a transition zone, and a high temperature zone along a first direction. A partition is provided between the high temperature zone and the transition zone, and between the room temperature zone and the transition zone. A first preset temperature of the room temperature zone is lower than a second preset temperature of the high temperature zone. A control module is provided in the room temperature zone, an aging adapter plate is provided in the transition zone, and a device under test is provided in the high temperature zone. The control module is electrically connected to the aging adapter plate, and the aging adapter plate is electrically connected to the device under test. The insulation module includes a first air path and a second air path. The first air path is provided in the room temperature zone to discharge air at a first controlled temperature into the room temperature zone to maintain the first preset temperature. The second air path is provided in the high temperature zone to discharge air at a second controlled temperature into the high temperature zone to maintain the second preset temperature.

[0007] In one technical solution of this application, the control module includes a test motherboard, which is disposed between the room temperature zone and the transition zone. The test motherboard is electrically connected to the aging adapter board, and the test motherboard is disposed in a direction perpendicular to the first direction.

[0008] In one technical solution of this application, along the height direction of the chassis, the test motherboard is disposed at the upper part of the room temperature zone, an air passage for air to pass through is provided between the bottom of the test motherboard and the room temperature zone, and an air outlet is provided at the upper part of the transition zone.

[0009] In one technical solution of this application, the control module further includes: a computer system electrically connected to the test motherboard, the computer system being used to monitor and control the actual temperature of the room temperature zone and the actual temperature of the high temperature zone; a DPS board electrically connected to the test motherboard, the DPS board being used to provide a set voltage to the device under test; a DIGI board electrically connected to the test motherboard, the DIGI board being used to drive and test the device under test; a UTIL board electrically connected to the test motherboard, the UTIL board being used to receive temperature sensor signals installed in the room temperature zone, the transition zone, and the high temperature zone, and convert them into digital values ​​for the computer system to read; and at least some components in the control module are dispersedly arranged in the room temperature zone, and an airflow path for the first air passage to enter the room temperature zone is provided between the dispersed components.

[0010] In one technical solution of this application, the DIGI board drives the device under test by generating I / O signals, and the aging adapter board is provided with a dedicated I / O channel for transmitting the I / O signals, which are then transmitted to the device under test through the dedicated I / O channel.

[0011] In one technical solution of this application, the long side of the aging adapter plate is arranged parallel to the first direction; along the first direction, one end of the aging adapter plate near the test motherboard is provided with an interface electrically connected to the test motherboard, and along the first direction, the other end of the aging adapter plate is provided with an interface electrically connected to the device under test.

[0012] In one technical solution of this application, the long side of the aging adapter plate is arranged parallel to the first direction; along the first direction, one end of the aging adapter plate near the test motherboard is provided with an interface electrically connected to the test motherboard, and along the first direction, the other end of the aging adapter plate is provided with an interface electrically connected to the device under test.

[0013] In one technical solution of this application, the interface for the aging adapter board to be electrically connected to the device under test is an aging slot, and the aging slot is partially located in the high-temperature zone, extending beyond the transition zone.

[0014] In one technical solution of this application, the control module further includes a DIGI board, which has multiple first electrical channels and multiple second electrical channels. The multiple first electrical channels are expanded into multiple outputs through multi-level buffers, and the multiple outputs correspond one-to-one with the channels on the aging slot. The multiple second electrical channels are sequentially selected with the channels on the aging slot through a relay network.

[0015] In one technical solution of this application, the first preset temperature range is 140~160℃, the third preset temperature range is 20~30℃; and the first control temperature range is 15~35℃, and the second control temperature range is included in the first preset temperature range.

[0016] In one technical solution of this application, the aging adapter board is provided with a reserved interface, and the room temperature zone is provided with an expansion slot; the expansion slot is used for the expansion of the control module, and the expanded control module is electrically connected to the aging adapter board through the reserved interface.

[0017] In one technical solution of this application, a temperature control method for an integrated aging tester is provided. The device under test is placed in a high-temperature zone and electrically connected to an aging adapter board in a transition zone. A control module in a room-temperature zone is electrically connected to the aging adapter board. The room-temperature zone, the transition zone, and the high-temperature zone are formed by dividing the internal space of the chassis along a first direction. A first preset temperature of the room-temperature zone is lower than a second preset temperature of the high-temperature zone. When the high-temperature zone heats up, the control module begins monitoring the actual temperature of the room-temperature zone and the actual temperature of the high-temperature zone. When the actual temperature of the room-temperature zone exceeds the range of the first preset temperature and / or the actual temperature of the high-temperature zone exceeds the range of the second preset temperature, the control module controls the activation of a first air path and a second air path in the insulation module. The first air path is located in the room-temperature zone to discharge air at a first controlled temperature into the room-temperature zone to maintain the first preset temperature. The second air path is located in the high-temperature zone to discharge air at a second controlled temperature into the high-temperature zone to maintain the second preset temperature.

[0018] In one technical solution of this application, the first air path discharges air within the first preset temperature range into the room temperature zone. After passing through the room temperature zone, the air flows from the air passage provided between the bottom of the test motherboard and the room temperature zone to the transition zone, and is finally discharged from the air outlet provided at the top of the transition zone.

[0019] In one technical solution of this application, the actual temperatures of the room temperature zone, the transition zone, and the high temperature zone are obtained by temperature sensors installed in the room temperature zone, the transition zone, and the high temperature zone; the electrical signals of the temperature sensors are received by a UTIL board, and the UTIL board converts the electrical signals into digital values ​​for the computer system to read; the computer system reads the digital values ​​of the electrical signals to monitor the actual temperature of the room temperature zone and the actual temperature of the high temperature zone.

[0020] The beneficial effects that the technical solution of this application can achieve are: by using a partition design and a heat preservation module, the control module is integrated into the testing machine. By controlling the heat preservation module to maintain a stable working temperature in its partition when handling heating tests, the heat preservation module can have good performance and complete the testing task. Attached Figure Description

[0021] Figure 1 This is an exploded view of a specific embodiment of the interior of the box in this invention;

[0022] Figure 2 This is a schematic diagram of a specific embodiment of the first and second air passages of the present invention;

[0023] Figure 3This is a schematic diagram of another specific embodiment of the interior of the box in this invention;

[0024] Figure 4 This is a schematic diagram of a specific embodiment of the path of the first gas path in this invention;

[0025] Figure 5 This is a schematic diagram of a specific embodiment of the control module of the present invention;

[0026] Figure 6 This is a schematic diagram of a specific embodiment of the DPS board of the present invention;

[0027] Figure 7 This is a schematic diagram of a specific embodiment of the DIGI board of the present invention;

[0028] Figure 8 This is a schematic diagram of a specific embodiment of the testing method of the present invention;

[0029] 1. Chassis; 2. Insulation module; 3. Control module; 4. Aging adapter board; 5. Device under test; 11. Room temperature zone; 12. Transition zone; 13. High temperature zone; 201. First air path; 202. Second air path; 301. Test motherboard; 302. Computer system; 303. DPS board; 304. DIGI board; 305. UTIL board; 401. Aging slot. Detailed Implementation

[0030] The preferred embodiments of this application will now be described in detail with reference to the accompanying drawings, so that the advantages and features of this application can be more easily understood by those skilled in the art, thereby providing a clearer and more definite definition of the scope of protection of this application.

[0031] It should be noted that the terms "first," "second," and "third" in the claims and description of this application are used only to distinguish similar objects and should not be construed as describing a specific order or sequence.

[0032] Figure 1 An exploded view of a specific embodiment of the integrated aging test machine of this application is shown. Figure 1 As shown, in this embodiment, the control module 3, the aging adapter board 4 electrically connected to the control module 3, and the device under test 5 electrically connected to the aging adapter board 4 are all integrated into the chassis 1, achieving a high degree of integration. The aging test machine is a device that accelerates the early failure period of the device under test 5 by simulating the working environment stress, thereby screening out most of the devices under test 5 that will fail during the early failure period and improving the pass rate of the devices under test 5.

[0033] Aging testers are used in different fields because of the different working environments and testing conditions they can simulate. For example, testers used to simulate ozone aging environments are mainly used in rubber products and engineering materials; testers used to simulate light aging tests are mainly used in coatings, product shells, and textiles; and aging testers used to simulate high-pressure working environment aging tests are mainly used in batteries, semiconductor components, and solar modules. When the aging tester mainly simulates the high and low temperature aging test of the device under test 5, the aging tester needs to conduct instantaneous or long-term stable high or low temperature tests within the space where the device under test 5 is located. During this period, other electrical signal transmission components and control components arranged inside the aging tester are subjected to heat conduction effects and are in the same high / low temperature environment as the device under test 5.

[0034] Because the other electrical signal transmission components and control module 3 operate normally at room temperature, with a range of 10~40℃, they use circuits arranged on the circuit board to transmit electrical signals, which instruct the aging test machine and direct the device under test 5 to cooperate in the test. The high temperature of the device under test 5 has the following effects: First, the high temperature intensifies the movement of charge carriers inside the semiconductor components of the control module, leading to problems such as CPU calculation errors, program freezes, increased power consumption and reduced lifespan of control module 3, and atomic migration in the chip circuit of control module 3, resulting in open circuits and short circuits; Second, the high temperature causes the power module in control module 3 to enter a protection state, causing the aging test machine to overload and shut down; Third, the high temperature causes the electrolyte in the capacitors, resistors, inductors, and other components of control module 3 to dry out or its frequency to drift with temperature, thus affecting the accuracy and quality of its values. Any one or all of the above are problems that control module 3 should avoid.

[0035] In this embodiment, the internal space of the chassis 1 is divided into a room temperature zone 11, a transition zone 12, and a high temperature zone 13 along a first direction. Furthermore, a partition is used to further divide the room temperature zone 11, transition zone 12, and high temperature zone 13 into three relatively independent spaces. This division into three temperature zones allows for advance planning of the internal space size of the chassis 1 during the design phase, facilitating precise control of the overall size of the aging test machine and forward-looking planning of its construction layout. It also allows for better utilization of the limited space within the chassis 1 to meet actual needs, achieving better integrated design. The partition further clarifies the division of the three spaces. Additionally, during high and low temperature experiments on the device under test 5, the partition reduces the impact of the test temperature in the area where the device under test 5 is located on other zones, effectively isolating hot and cold airflows.

[0036] When the device under test 5 is heated, the first preset temperature of the room temperature zone 11 is lower than the second preset temperature of the high temperature zone 13. The first preset temperature refers to the operating temperature of all components, including the control module 3, set in the room temperature zone 11, and the second preset temperature refers to the test temperature of the device under test 5 in the high temperature zone 13. Since the test temperature is higher than the stable operating temperature of all components, including the control module 3, the first preset temperature is set lower than the second preset temperature to ensure that the control module 3 in the room temperature zone 11 can operate at a stable operating temperature, and that the device under test 5 can ensure test quality regardless of other environmental factors during testing.

[0037] The partition alone is insufficient to block the heat conduction effect. The heat generated in the high-temperature zone 13 during heating tests can be transferred to the room temperature zone 11 through the transition zone 12. Alternatively, during low-temperature tests, the temperature in the high-temperature zone 13 may be lower than that in the transition zone 12 and the room temperature zone 11. The heat from the transition zone 12 and the room temperature zone 11 is conducted to the high-temperature zone 13, resulting in inaccurate test temperatures in the high-temperature zone 13.

[0038] like Figure 2 As shown, to maintain the first preset temperature, a heat preservation module 2 is provided in this embodiment. The heat preservation module 2 includes a first air passage 201 and a second air passage 202. The first air passage 201 is located in the room temperature zone 11, and maintains the first preset temperature in the room temperature zone 11 by introducing air at the first controlled temperature. The first controlled temperature has a value range of being lower than / higher than / equal to the first preset temperature. The appropriate first controlled temperature is introduced by comparing the actual temperature of the room temperature zone 11 with the first preset temperature. For example, if the actual temperature in the high temperature zone 13 is higher than the temperature in the room temperature zone 11, while the temperature in the room temperature zone 11 is gradually increasing due to the heat conduction effect and is higher than the value range of the first preset temperature, the first air passage 201 introduces air at a temperature lower than the first preset temperature to bring the actual temperature in the room temperature zone 11 back to the value range of the first preset temperature.

[0039] The second air path 202 is located in the high-temperature zone 13 and is used to discharge air at the second controlled temperature into the high-temperature zone 13 to maintain the second preset temperature. The aging tester has an independent temperature control module, which can reach the high or low temperature required for testing. However, due to the thermal conduction effect, the heat in the high-temperature zone 13 is constantly dissipated or absorbed. The second air path 202 can compensate for the temperature of the high-temperature zone 13. By introducing a second controlled temperature that is higher than / equal to / lower than the second preset temperature, the temperature of the high-temperature zone 13 can be maintained within a more precise temperature range, thereby improving the test quality of the aging tester.

[0040] In one specific embodiment of the present invention, such as Figure 3As shown, the control module 3 includes a test motherboard 301, which is the core backbone connecting the control module 3 and the aging adapter board 4. The test motherboard 301 establishes a pyramid-shaped hierarchical structure for the various test components within the aging tester. As a hub, the test motherboard 301 enables power distribution, signal routing, and system communication during the testing process. During testing, the test motherboard 301 provides services and resources to the aging adapter board 4, forming a motherboard-daughterboard relationship. In one embodiment of the invention, the aging adapter board 4 and the test motherboard 301 are integrated by welding, becoming part of the test motherboard 301.

[0041] Furthermore, such as Figure 4 As shown, the test motherboard 301 is positioned between the room temperature zone 11 and the transition zone 12, with its orientation perpendicular to the first direction. Replacing the partition between the room temperature zone 11 and the transition zone 12 with this test motherboard 301 not only saves on the material cost of the partition but also makes more efficient use of the internal space of the chassis 1, improving the rationality of the internal layout of the aging tester. Furthermore, the direct connection between the test motherboard 301 and the adapter board, without any gap between them, saves time and effort during the planning and installation phases. The perpendicular orientation of the test motherboard 301 to the first direction maximizes the utilization of its plate area, thereby blocking airflow between the transition zone 12 and the room temperature zone 11 and ensuring a stable temperature within the room temperature zone 11.

[0042] In one specific embodiment of the present invention, the test motherboard 301 is disposed on the upper part of the room temperature zone 11 along the height direction of the chassis 1. Simultaneously, the length of the test motherboard 301 along the height direction of the chassis 1 is less than the height of the chassis 1, allowing the test motherboard 301 to be placed on the upper part of the room temperature zone 11 along the height direction of the chassis 1. An air passage is formed between the bottom of the test motherboard 301 and the room temperature zone 11, allowing air to pass through. The size of the air passage along the height direction of the chassis 1 is the difference between the height of the chassis 1 and the length of the test motherboard 301. The top of the test motherboard 301 is in close contact with the upper part of the chassis 1, and an air outlet is provided on the upper part of the transition zone 12.

[0043] When the first air passage 201 discharges air at the first controlled temperature into the room temperature zone 11, the pressure in the room temperature zone 11 increases as air is discharged. The air in the room temperature zone 11 flows into the transition zone 12 through the air passage formed between the bottom of the test motherboard 301 and the room temperature zone 11. During the heating test, the heat conducted by the high temperature zone 13 preferentially heats the air in the transition zone 12. The heated air, being lighter, floats at the top of the transition zone 12, and some of it is discharged from the transition zone 12 through the air outlet at the top. The air flowing into the transition zone 12 from the room temperature zone 11 is relatively cooler and accumulates at the bottom of the transition zone. As the pressure increases due to the continuous inflow, it flows towards the top of the transition zone 12. During the flow towards the top of the transition zone 12, the heated air that was not originally discharged from the top is preferentially discharged through the air outlet at the top of the transition zone 12, followed by the air flowing in from the room temperature zone 11. This design ensures that the heated air in the transition zone 12 can be discharged from the transition zone 12 in a timely manner, blocking the intermediate path for heat transfer from the high temperature zone 13 to the room temperature zone 11, and ensuring the stability of the actual temperature in the room temperature zone 11.

[0044] In one specific embodiment of the present invention, such as Figure 5 As shown, control module 3 includes various resource boards, one of which is UTIL board 305, a general-purpose board mainly used to provide necessary general functions, system management, and auxiliary support for the test system, ensuring that core test tasks can be performed efficiently, reliably, and automatically. Through temperature sensors installed in the room temperature zone 11, transition zone 12, and high temperature zone 13, UTIL board 305 can receive signals from each temperature sensor and further convert the signals into digital values.

[0045] Meanwhile, a computer system 302 electrically connected to the test motherboard 301 is provided. The computer system 302 is used to monitor and control the actual temperature of the room temperature zone 11 and the actual temperature of the high temperature zone 13. The monitoring of the actual temperature of the room temperature zone 11 and the actual temperature of the high temperature zone 13 is achieved by reading the digital value converted by the temperature sensor signal by the UTIL board 305. The control of the actual temperature of the room temperature zone 11 and the actual temperature of the high temperature zone 13 is achieved by controlling the first air path 201 and the second air path 202.

[0046] The resource card also includes the DPS board 303, which is a board that integrates power supply, measurement, and protection. It is one of the most important resource boards in aging test. Through programming the DPS board 303, a settable voltage value can be output to a specific pin of the device under test 5. At the same time, by measuring a sharp rise in current, the DPS board 303 can cut off the power supply within microseconds to protect the device under test 5 and the aging test machine itself from being burned out.

[0047] In one specific embodiment of the present invention, such as Figure 6 As shown, the DPS board 303 used can support up to eight channels of parallel output, achieving higher power and larger current output requirements.

[0048] In one specific embodiment of the present invention, the resource card also includes a DIGI board 304, which is used to generate digital excitation signals and send them to the device under test (DUT) 5, and simultaneously collect and compare the digital response signals returned by the DUT 5 to determine whether the logic function of the DUT 5 is correct. By simulating the high / low temperature environment in the aging test, combined with the judgment of the DIGI board 304, most of the products that fail within the early failure period can be screened out, thereby improving the overall pass rate of the DUT 5.

[0049] In one specific embodiment of the present invention, the components of the control module 3, including the computer system 302, DPS board 303, DIGI board 304, and UTIL board 305, are dispersedly arranged in the room temperature zone 11. Almost all components generate heat during operation. Taking the computer system 302 as an example, the computer system 302 contains a computing chip composed of billions of MOSFET transistors. The chip performs computational tasks by continuously and rapidly switching between on and off states, thereby increasing power consumption and generating heat. Each heat-generating component requires heat dissipation treatment; otherwise, it may trigger frequency reduction protection or shutdown. Dispersing the components in the room temperature zone 11 ensures that each component has sufficient contact with the air flowing in through the first air passage 201 from its maximum surface area. The airflow carries away the heat dissipated from its surface in a timely manner, thus more efficiently maintaining the actual temperature within the room temperature zone 11 within the first preset temperature range.

[0050] In one specific embodiment of the present invention, such as Figure 7 As shown, the aging adapter board 4 has a dedicated I / O channel for transmitting I / O signals. The digital excitation signals generated by the DIGI board 304 include I / O signals, which are used to control, excite, and monitor the device under test 5 during testing. The power supply channel is provided by the DPS board 303, thus physically separating the power supply channel and the dedicated I / O channel. This is because the power supply channel requires a stable high current and has a slightly slower response; the I / O channel requires high speed and precision but has lower power requirements. This separation ensures that mutual interference between the two is avoided, achieving specialization and thus improving the overall performance and stability of the system.

[0051] In one specific embodiment of the present invention, the DIGI board 304 is provided with multiple first electrical channels and multiple second electrical channels. The first electrical channels are used to output drive signals. It should be noted that the drive signal output from the first electrical channel is a single signal that simultaneously drives multiple channels of the device under test (DUT) 5, requiring a relatively large number of channels. The second electrical channels are used to output I / O signals. The I / O signals need to be measured accurately, and the second electrical channels are more expensive. Each first electrical channel is connected to a buffer, which allows the first electrical channel to be expanded into multiple channels, so that each electrical channel can simultaneously drive multiple channels of the corresponding drive aging slot 401 and corresponding multiple channels of the DUT 5.

[0052] The second electrical channel drives different channels on the aging slot 401 at different time periods through a multi-level relay network, thereby driving different channels of the device under test 5 to perform testing, and completing the testing of the same number of devices under test 5 in this way.

[0053] This allows the signal output from the first electrical channel to be expanded into multiple channels. On the other hand, although the second electrical channel cannot be expanded arbitrarily due to its precise measurement characteristics, the time-division multiplexing method can meet the testing requirements of multiple devices under test (DUTs) 5 with the same number of channels.

[0054] In one specific embodiment of the present invention, the long side of the aging adapter plate 4 is arranged parallel to the first direction, so that the surface of the aging adapter plate 4 is arranged perpendicular to the surface of the test mother plate 301. This allows the length of the transition zone 12 to be maximized along the first direction without wasting the chamber space. A longer transition zone 12 means a longer heat conduction path and a longer heat conduction time, resulting in more time and heat being conducted to the room temperature zone 11.

[0055] In one specific embodiment of the present invention, the aging adapter plate 4 has an interface for electrical connection with the test motherboard 301 at one end near the test motherboard 301, and an interface for electrical connection with the device under test 5 at the other end along the first direction. By placing the interfaces for electrical connection with the test motherboard 301 and the device under test 5 at opposite ends along the first direction of the aging adapter plate 4, the interfaces can be positioned closer to the test motherboard 301 and the device under test 5, thereby simplifying the installation process.

[0056] In one specific embodiment of the present invention, the interface for the electrical connection between the aging adapter plate 4 and the device under test 5 is an aging slot 401, which extends beyond the transition zone 12 and is located in the high-temperature zone 13. On the one hand, by providing the aging slot 401, the device under test 5 can be replaced by extending into the transition zone 12 to connect with the aging adapter plate 4, thus preventing the portion of the device under test 5 extending into the transition zone 12 from receiving sufficient testing results. On the other hand, the aging slot 401 reduces the difficulty of installing the device under test 5 and the aging adapter plate 4. Furthermore, the aging slot 401, through its detachable nature, allows for the installation of devices under test 5 of different specifications and interfaces, thereby expanding the range of test objects.

[0057] In one specific embodiment of the present invention, the aging adapter board 4 is provided with a reserved interface, and the room temperature zone 11 is provided with an expansion slot; the expansion slot is used for the expansion of the control module 3, and the expanded control module 3 is electrically connected to the aging adapter board 4 through the reserved interface. Through the reserved expansion slot, the various components of the control module 3 can be easily replaced and upgraded, supporting flexible upgrades in the future.

[0058] In a specific embodiment of the present invention, the first preset temperature range is 20~30℃, and the first control temperature range is 15~35℃; 20~30℃ is the suitable operating temperature of the control module 3 in the present invention. At the same time, since the temperature of the room temperature zone 11 is not in an excessively high temperature range, the range of the first control temperature is slightly larger than the range of the first preset temperature. By introducing a first control temperature that is slightly larger / slightly smaller than the range of the first preset temperature, the temperature in the room temperature zone 11 is quickly adjusted to the range of the first preset temperature.

[0059] The second preset temperature range is 140~160℃; and the second control temperature range is included within the first preset temperature range. This is because the temperature in the high-temperature zone 13 is already quite high, and the test device 5 under test within the second preset temperature range already includes extreme conditions. Exceeding this temperature range could easily cause large-scale damage to the test device 5. At the same time, including the second control temperature range within the first preset temperature range also allows for more precise temperature regulation within the high-temperature zone 13.

[0060] In one specific embodiment of the present invention, such as Figure 8 As shown, a temperature control method for an integrated aging tester applicable to any of the above embodiments is provided. The first step is to set the device under test 5 in the high temperature zone 13 and electrically connect it to the aging adapter plate 4 in the transition zone 12. The control module 3 set in the room temperature zone 11 is electrically connected to the aging adapter plate 4 to complete the preparation work before the test.

[0061] The second step involves activating the temperature control module of high-temperature zone 13 to reach its second preset temperature. As high-temperature zone 13 heats up, control module 3 simultaneously monitors both the actual temperature of room temperature zone 11 and the actual temperature of high-temperature zone 13. When the actual temperature of room temperature zone 11 exceeds the range of the first preset temperature and / or the actual temperature of high-temperature zone 13 exceeds the range of the second preset temperature, control module 3 activates the first air path 201 and the second air path 202 in the insulation module 2. The first air path 201 discharges air at the first control temperature into room temperature zone 11 to maintain the first preset temperature; the second air path 202 discharges air at the second control temperature into high-temperature zone 13 to maintain the second preset temperature. In this process, the first air path 201 primarily regulates the actual temperature of room temperature zone 11, while the second air path 202 adjusts and compensates based on the temperature control module of high-temperature zone 13.

[0062] In a specific embodiment of the present invention, the first air passage 201 discharges air within a first preset temperature range into the room temperature zone 11. Specifically, multiple air inlets can be set at intervals along the width direction of the chassis 1 on the side of the chassis 1 where the room temperature zone 11 is located, so that the air at the first controlled temperature is discharged into the room temperature zone 11 along the length direction of the chassis 1. After passing through the room temperature zone 11, the air flows from the air passage set between the bottom of the test motherboard 301 and the room temperature zone 11 to the transition zone 12, and finally is discharged from the air outlet set at the top of the transition zone 12.

[0063] In one specific embodiment of the present invention, when the high-temperature zone 13 heats up, temperature sensors installed in the room temperature zone 11, transition zone 12, and high-temperature zone 13 are activated to read the actual temperatures in these zones and send electrical signals. The feedback frequency of the temperature sensors is between 100 milliseconds and 30 seconds. The electrical signals from the temperature sensors are received by the UTIL board 305 and converted into digital values ​​for the computer system 302 to read. The computer system 302 reads the digital values ​​of the electrical signals to monitor the actual temperatures of the room temperature zone 11 and the high-temperature zone 13.

[0064] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0065] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0066] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An integrated aging test machine, characterized in that, include: The chassis (1) and the insulation module (2) divide the internal space of the chassis (1) into a room temperature zone (11), a transition zone (12) and a high temperature zone (13) along a first direction. A partition is provided between the high temperature zone (13) and the transition zone (12), and between the room temperature zone (11) and the transition zone (12). The first preset temperature of the room temperature zone (11) is lower than the second preset temperature of the high temperature zone (13). The room temperature zone (11) is equipped with a control module (3), the transition zone (12) is equipped with an aging adapter plate (4), and the high temperature zone (13) is equipped with a device under test (5). The control module (3) is electrically connected to the aging adapter plate (4), and the aging adapter plate (4) is electrically connected to the device under test (5). The heat preservation module (2) includes a first air passage (201) and a second air passage (202). The first air passage (201) is located in the room temperature zone (11) and is used to discharge air at a first controlled temperature into the room temperature zone (11) to maintain the first preset temperature. The second air passage (202) is located in the high temperature zone (13) and is used to discharge air at a second controlled temperature into the high temperature zone (13) to maintain the second preset temperature. The control module (3) includes a test motherboard (301), which is disposed between the room temperature zone (11) and the transition zone (12). The test motherboard (301) is electrically connected to the aging adapter plate (4), and the test motherboard (301) is disposed in a direction perpendicular to the first direction. Along the height direction of the chassis (1), the test motherboard (301) is located on the upper part of the room temperature zone (11), and an air passage for air to pass through is provided between the bottom of the test motherboard (301) and the room temperature zone (11), and an air outlet is provided on the upper part of the transition zone (12).

2. The integrated aging tester according to claim 1, characterized in that, The control module (3) further includes: Computer system (302), which is electrically connected to the test motherboard (301), is used to monitor and control the actual temperature of the room temperature zone (11) and the actual temperature of the high temperature zone (13); The DPS board (303) is electrically connected to the test motherboard (301), and the DPS board (303) is used to provide a set voltage to the device under test (5); The DIGI board (304) is electrically connected to the test motherboard (301), and the DIGI board (304) is used to drive and test the device under test (5). The UTIL board (305) is electrically connected to the test motherboard (301). The UTIL board (305) is used to receive temperature sensor signals installed in the room temperature zone (11), the transition zone (12) and the high temperature zone (13), and convert them into digital values ​​for the computer system (302) to read. Furthermore, at least some components in the control module (3) are dispersed in the room temperature zone (11), and an air flow path is provided between the dispersed components for the first air passage (201) to discharge into the room temperature zone (11).

3. The integrated aging tester according to claim 2, characterized in that, The DIGI board (304) drives the device under test (5) by generating I / O signals. The aging adapter board (4) is provided with a dedicated I / O channel for transmitting the I / O signals. The I / O signals are transmitted to the device under test (5) through the dedicated I / O channel.

4. The integrated aging tester according to claim 1, characterized in that, The long side of the aging adapter plate (4) is arranged parallel to the first direction; along the first direction, the end of the aging adapter plate (4) near the test motherboard (301) is provided with an interface electrically connected to the test motherboard (301), and along the first direction, the other end of the aging adapter plate (4) is provided with an interface electrically connected to the device under test (5).

5. The integrated aging tester according to claim 4, characterized in that, The interface between the aging adapter plate (4) and the device under test (5) is an aging slot (401), and the aging slot (401) is partially located in the high temperature zone (13) beyond the transition zone (12).

6. The integrated aging tester according to claim 5, characterized in that, The control module (3) also includes a DIGI board (304), which is provided with multiple first electrical channels and multiple second electrical channels. The multiple first electrical channels are expanded into multiple outputs through multi-level buffers. The multiple outputs correspond one-to-one with the channels on the aging slot (401). Multiple second electrical channels are sequentially selected with channels on the aging slot (401) via a relay network.

7. The integrated aging tester according to claim 1, characterized in that, The first preset temperature range is 20~30℃, and the second preset temperature range is 140~160℃. Furthermore, the first control temperature ranges from 15 to 35°C, and the second control temperature range is included within the first preset temperature range.

8. The integrated aging tester according to claim 1, characterized in that, The aging adapter plate (4) is provided with a reserved interface, and the room temperature zone (11) is provided with an expansion position; the expansion position is used for the expansion of the control module (3), and the expanded control module (3) is electrically connected to the aging adapter plate (4) through the reserved interface.

9. A temperature control method for an integrated aging tester, characterized in that, include: The device under test (5) is placed in the high temperature zone (13) and electrically connected to the aging adapter plate (4) in the transition zone (12). The control module (3) in the room temperature zone (11) is electrically connected to the aging adapter plate (4). The room temperature zone (11), the transition zone (12) and the high temperature zone (13) are formed by dividing the internal space of the chassis (1) along the first direction. The first preset temperature of the room temperature zone (11) is lower than the second preset temperature of the high temperature zone (13). When the high-temperature zone (13) heats up, the control module (3) starts monitoring the actual temperature of the room temperature zone (11) and the actual temperature of the high-temperature zone (13); when the actual temperature of the room temperature zone (11) exceeds the range of the first preset temperature and / or the actual temperature of the high-temperature zone (13) exceeds the range of the second preset temperature, the control module (3) controls the activation of the first air path (201) and the second air path (202) in the heat preservation module (2), wherein the first air path (201) is set in the room temperature zone (11) to discharge air at the first control temperature into the room temperature zone (11) to maintain the first preset temperature; the second air path (202) is set in the high-temperature zone (13) to discharge air at the second control temperature into the high-temperature zone (13) to maintain the second preset temperature; The first air passage (201) discharges air within the first preset temperature range into the room temperature zone (11). After passing through the room temperature zone (11), the air flows from the air passage between the bottom of the test motherboard (301) and the room temperature zone (11) to the transition zone (12), and finally exits from the air outlet at the top of the transition zone (12). The test motherboard (301) is located between the room temperature zone (11) and the transition zone (12). The test motherboard (301) is electrically connected to the aging adapter board (4). The test motherboard (301) is set in a direction perpendicular to the first direction. Along the height direction of the chassis (1), the test motherboard (301) is located at the upper part of the room temperature zone (11). The air passage is located between the bottom of the test motherboard (301) and the room temperature zone (11). An air outlet is provided at the upper part of the transition zone (12).

10. The temperature control method for the integrated aging tester according to claim 9, characterized in that, The actual temperatures of the room temperature zone (11), the transition zone (12), and the high temperature zone (13) are obtained by temperature sensors installed in the room temperature zone (11), the transition zone (12), and the high temperature zone (13); The UTIL board (305) receives the electrical signal from the temperature sensor and converts the electrical signal into a digital value for the computer system (302) to read. The computer system (302) reads the digital value of the electrical signal to monitor the actual temperature of the room temperature zone (11) and the actual temperature of the high temperature zone (13).

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