A spiral airway heating sheet and a manufacturing process thereof

Abstract

The application discloses a spiral air channel heating sheet and a manufacturing process thereof, which comprises an upper heating body, an intermediate layer substrate and a lower heating body. The intermediate layer substrate is provided with spiral grooves extending from inside to outside and penetrating up and down, and the spiral grooves are arranged in a plurality of and circumferential interval modes. The upper heating body is provided with a first through hole, which is communicated with the outer end of the spiral groove. The lower heating body is provided with a second through hole, which is communicated with the inner end of the spiral groove. The spiral groove and the upper and lower heating bodies form a spiral air channel with an air inlet and an air outlet. In this way, the gas enters the spiral air channel from the air inlet, and the upper and lower heating bodies are used to surround and heat the gas in the spiral air channel, so that the uniformity of gas heating is achieved. Meanwhile, the spiral air channel prolongs the residence time of the gas in the heating area, so that the continuous turbulent contact between the gas and the heating surface is improved, the energy consumption is saved, the overall use reliability is improved, and the application range is wide.

Description

Technical Field

[0001] This invention relates to the field of heating elements, and in particular to a spiral airway heating element and its manufacturing process. Background Technology

[0002] Currently, in special medical equipment (such as the heating and humidification modules of respiratory therapy equipment), high-end moxibustion and aromatherapy stoves, and other application scenarios with stringent requirements for gas heating quality, traditional gas heating solutions mostly adopt the "carrier-type" indirect heating mode. Specifically, a solid metal or ceramic carrier (such as a metal tube or ceramic block) is usually heated first using a heating element (such as a heating wire, PTC, or thick film circuit), and then the gas flowing over the surface of the heat carrier is heated through heat exchange. However, it has the following drawbacks. First, the heat transfer path is long and the efficiency is low. The heat energy needs to be transferred from the heating element to the carrier and then from the surface of the carrier to the gas. There are many intermediate links and the heat loss is large. Furthermore, the uniformity of gas heating is difficult to guarantee. The gas only contacts the outer surface of the carrier, which easily forms laminar flow and a "cold core". This results in uneven temperature at the gas outlet section, making it difficult to meet the stringent requirements for temperature stability and uniformity in medical or high-quality aromatherapy applications. Consequently, it fails to meet user needs, has poor usability, and a limited range of applications.

[0003] Therefore, it is necessary to design a new technical solution to solve the above problems. Summary of the Invention

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a spiral air channel heating element and its manufacturing process. Through the design of each component, the upper and lower heating elements are used to heat the gas in the spiral air channel in a circumferential manner, thereby achieving uniform gas heating. At the same time, the spiral air channel extends the residence time of the gas in the heating area, thereby improving the continuous turbulent contact between the gas and the heating surface, saving energy consumption, improving the overall reliability of use, meeting the user's needs, and having a wide range of applications.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A spiral airway heating element includes, from top to bottom, an upper heating element, a middle substrate, and a lower heating element; wherein: The intermediate layer substrate has a spiral groove extending from the inside out and running vertically through it, and the spiral groove is provided in a plurality of circumferentially spaced arrangement. The upper heating element is provided with a plurality of first through holes arranged in a circumferentially spaced manner corresponding to the spiral grooves. The plurality of first through holes are located at the edge of the upper heating element and are connected to the outer end of the corresponding spiral groove. The lower heating element is provided with a number of second through holes arranged circumferentially at intervals corresponding to the spiral grooves. The number of second through holes is located in the middle of the lower heating element and is connected to the inner end of the corresponding spiral groove. The spiral grooves, the upper heating element, and the lower heating element form a spiral air passage with an air inlet and an air outlet.

[0006] As a preferred embodiment, the thickness of the intermediate layer substrate is greater than the thickness of the upper heating element and the lower heating element.

[0007] As a preferred embodiment, the thickness of the upper heating element is equal to the thickness of the lower heating element.

[0008] As a preferred embodiment, the air inlet is formed on the first through hole, and the air outlet is formed on the second through hole; Alternatively, the air inlet is formed on the second through hole, and the air outlet is formed on the first through hole.

[0009] As a preferred embodiment, the upper heating element includes a first substrate and a second substrate. A first heating circuit is disposed on the upper surface of the first substrate. The second substrate is disposed on the upper end of the first substrate. The first heating circuit is located between the first substrate and the second substrate. A heating circuit electrode is disposed on the upper end of the second substrate. The first substrate is disposed on the upper end of the intermediate layer substrate. The lower heating element includes a third substrate and a fourth substrate. A second heating circuit is provided on the upper surface of the third substrate. The fourth substrate is disposed on the upper end of the third substrate. The second heating circuit is located between the third substrate and the fourth substrate. The fourth substrate is disposed on the lower end of the intermediate layer substrate. The fourth substrate, the intermediate layer substrate, the first substrate, and the second substrate are all provided with electrode holes. The electrodes of the heating circuit are electrically connected to the two ends of the first heating circuit and the two ends of the second heating circuit respectively through the vias.

[0010] As a preferred embodiment, both the first heating circuit and the second heating circuit are printed using at least one of tungsten paste, molybdenum paste, ruthenium paste, and manganese paste.

[0011] As a preferred embodiment, a first blue adhesive layer is provided on the upper surface of the first substrate, the first blue adhesive layer is uniformly applied to the first heating circuit, and the second substrate is bonded and fixed to the first substrate through the first blue adhesive layer.

[0012] As a preferred embodiment, a second blue adhesive layer is provided on the upper surface of the third substrate. The second blue adhesive layer is evenly applied to the second heating circuit, and the fourth substrate is bonded and fixed to the third substrate through the second blue adhesive layer.

[0013] As a preferred embodiment, a third blue adhesive layer is provided on the lower end surface of the first substrate and the upper end surface of the fourth substrate, and the first substrate and the fourth substrate are respectively disposed on the upper and lower ends of the intermediate layer substrate through the third blue adhesive layer.

[0014] A method for preparing a spiral airway heating element includes the following steps: Step 1: Prepare the sheet material. Cut the sheet material into the required size to obtain the first substrate, second substrate, intermediate substrate, third substrate, and fourth substrate. Step 2: First through holes, second through holes, and electrode holes are respectively formed on the first, second, third, and fourth substrates, and spiral grooves and electrode holes are formed on the intermediate layer substrate. Step 3: Set a first heating circuit on the upper surface of the first substrate, set a second heating circuit on the upper surface of the third substrate, and set heating circuit electrodes on the upper surface of the second substrate corresponding to the electrode holes. Step 4: A first blue adhesive layer and a second blue adhesive layer are respectively coated on the surfaces of the first substrate, the first heating circuit, the third substrate, and the second heating circuit; Step 5: Align the edges of the second substrate with the first substrate and place it in the pre-pressing equipment for pre-pressing. Align the edges of the fourth substrate with the third substrate and place it in the pre-pressing equipment for pre-pressing. Step six: A third blue adhesive layer is applied to the lower end of the first substrate and the upper end of the fourth substrate in step five. After the intermediate layer substrate is attached to the lower end of the first substrate and the upper end of the fourth substrate and aligned with the edges, it is placed into the mold. The first substrate, the second substrate, the intermediate layer substrate, the third substrate and the fourth substrate are pressed and bonded firmly by a hydraulic press. Step 7: Transfer the workpiece obtained in Step 6 to the cutting equipment to cut the workpiece into the corresponding shape according to the required size; Step 8: Apply high-temperature powder to the surface of the workpiece obtained in Step 7, and solidify the first substrate, second substrate, intermediate layer substrate, third substrate, and fourth substrate into ceramic by high-temperature sintering. Step 9: Clean the workpiece obtained in Step 8 to remove the high-temperature powder from the surface. Step 10: Inspect the workpieces obtained in Step 9 to determine whether the finished products meet the standards, and classify them according to the inspection results; Step 11: Use solder leads to bond with the heating circuit electrodes. High temperature is used to bond the leads to the heating circuit electrodes to achieve the required tensile strength.

[0015] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it mainly achieves uniform gas heating by designing each component so that gas enters the spiral air passage from the air inlet and is heated in a circumferential manner by the upper and lower heating elements. At the same time, the spiral air passage extends the residence time of the gas in the heating area, thereby improving the continuous turbulent contact between the gas and the heating surface, saving energy consumption, improving the overall reliability of use, meeting the user's needs, having good usability, and a wide range of applications. Furthermore, the first and second blue adhesive layers ensure that the first and second heating circuits form a reliable insulating layer between their respective substrates, preventing short circuits and leakage risks and ensuring product stability. Simultaneously, the third blue adhesive layer creates a sealing layer between the intermediate substrate and the upper and lower heating elements, preventing external moisture or dust from seeping into the spiral air passage through the gaps between the intermediate substrate and the upper and lower heating elements. This ensures uniform heating of the spiral air passage, enhancing overall reliability and practicality.

[0016] To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0017] Figure 1 This is a perspective view of an embodiment of the present invention; Figure 2 This is an exploded view of an embodiment of the present invention; Figure 3 This is a cross-sectional view of an embodiment of the present invention; Figure 4 yes Figure 3 An enlarged view of position A in the middle.

[0018] Explanation of reference numerals in the attached diagram: 101. Electrode hole; 102. Third blue adhesive layer; 10. Upper heating element; 11. First through hole; 12. First substrate; 13. Second substrate; 14. First heating circuit; 15. Heating circuit electrode; 16. First blue adhesive layer; 17. Lead wire; 20. Intermediate layer substrate; 21. Spiral groove; 211. Spiral air passage 30. Lower heating element; 31. Second through hole; 32. Third substrate; 33. Fourth substrate; 34. Second heating circuit; 35. Second blue adhesive layer. Detailed Implementation

[0019] Please refer to Figures 1 to 4 As shown, it illustrates the specific structure of an embodiment of the present invention.

[0020] A spiral airway heating element includes an upper heating element 10, an intermediate substrate 20, and a lower heating element 30 arranged sequentially from top to bottom; wherein: The intermediate layer substrate 20 has a spiral groove 21 extending from the inside out and penetrating vertically, and the spiral groove 21 is provided in a plurality of circumferentially spaced arrangement. The upper heating element 10 is provided with a plurality of first through holes 11 arranged in a circumferentially spaced manner corresponding to the spiral grooves. The plurality of first through holes 11 are located at the edge of the upper heating element 10 and are connected to the outer end of the corresponding spiral groove 21. The lower heating element 30 is provided with a plurality of second through holes 31 arranged in a circumferentially spaced manner with corresponding spiral grooves. The plurality of second through holes 31 are located in the middle position of the lower heating element 30 and are connected to the inner end of the corresponding spiral groove 21. The spiral groove 21, together with the upper heating element 10 and the lower heating element 20, forms a spiral air passage 211 with an air inlet and an air outlet. Specifically, the thickness of the intermediate substrate 20 is greater than the thickness of the upper heating element 10 and the lower heating element 30, while the thickness of the upper heating element 10 is equal to the thickness of the lower heating element 30. Thus, through the design of each component, gas enters the spiral air passage from the air inlet, and the upper and lower heating elements heat the gas in the spiral air passage in a circumferential manner, thereby achieving uniform gas heating. Simultaneously, the spiral air passage extends the residence time of the gas in the heating area, improving the continuous turbulent contact between the gas and the heating surface, saving energy consumption, enhancing overall reliability, meeting user needs, and offering excellent usability and wide applicability.

[0021] Furthermore, the air inlet is formed on the first through hole 11, and the air outlet is formed on the second through hole 31; or, the air inlet is formed on the second through hole 31, and the air outlet is formed on the first through hole 11.

[0022] Furthermore, the upper heating element 10 includes a first substrate 12 and a second substrate 13. A first heating line 14 is provided on the upper end surface of the first substrate 12. The second substrate 13 is disposed on the upper end of the first substrate 12. The first heating line 14 is located between the first substrate 12 and the second substrate 13. A heating line electrode 15 is provided on the upper end of the second substrate 13. The first substrate 12 is disposed on the upper end of the intermediate layer substrate 20. The first through hole 11 is disposed on both the first substrate 12 and the second substrate 13. The lower heating element 30 includes a third substrate 32 and a fourth substrate 33. The second through hole 31 is disposed on the third substrate 32 and the fourth substrate 33. A second heating line 34 is disposed on the upper end surface of the third substrate 32. The fourth substrate 33 is disposed on the upper end of the third substrate 32. The second heating line 34 is located between the third substrate 32 and the fourth substrate 33. The fourth substrate 33 is disposed on the lower end of the intermediate layer substrate 20. The fourth substrate 33, the intermediate layer substrate 20, the first substrate 12, and the second substrate 13 are all provided with electrode holes 101. The heating line electrodes 15 are electrically connected to both ends of the first heating line 14 and both ends of the second heating line 34 through through holes. Preferably, the first heating line 14 and the second heating line 34 are printed using at least one of tungsten paste, molybdenum paste, ruthenium paste, and manganese paste.

[0023] Furthermore, a first blue adhesive layer 16 is provided on the upper surface of the first substrate 12. The first blue adhesive layer 16 is evenly coated on the first heating circuit 14, and the second substrate 13 is bonded and fixed to the first substrate 12 through the first blue adhesive layer 16. The upper surface of the third substrate 32 is provided with a second blue adhesive layer 35, which is uniformly applied to the second heating circuit 34. The fourth substrate 33 is bonded and fixed to the third substrate 32 through the second blue adhesive layer 35. Thus, the provision of the first and second blue adhesive layers ensures that the first and second heating circuits form a reliable insulating layer between their respective substrates, preventing short circuits and leakage risks and ensuring the stability of the product.

[0024] Furthermore, a third blue adhesive layer 102 is provided on the lower end surface of the first substrate 12 and the upper end surface of the fourth substrate 33. The first substrate 12 and the fourth substrate 33 are respectively disposed on the upper and lower ends of the intermediate substrate 20 through the third blue adhesive layer 102. In this way, the third blue adhesive layer forms a sealing layer between the intermediate substrate and the upper and lower heating elements, preventing external moisture or dust from penetrating into the joint gap between the intermediate substrate and the upper and lower heating elements and entering the spiral air passage, thereby ensuring the uniform heating effect of the gas in the spiral air passage, improving the overall reliability, and making it highly practical.

[0025] A method for preparing a spiral airway heating element includes the following steps: Step 1: Prepare the sheet material. Cut the sheet material into the required size to obtain the first substrate 12, the second substrate 13, the intermediate layer substrate 20, the third substrate 32, and the fourth substrate 33. Step 2: First through holes 11, second through holes 31, and electrode holes 101 are respectively opened on the first substrate 12, the second substrate 13, the third substrate 32, and the fourth substrate 33, and spiral grooves 21 and electrode holes 101 are opened on the intermediate layer substrate 20. Step 3: A first heating line 14 is provided on the upper surface of the first substrate 12, a second heating line 34 is provided on the upper surface of the third substrate 32, and a heating line electrode 15 is provided on the upper end of the second substrate 13 corresponding to the electrode hole. Step 4: A first blue adhesive layer 16 and a second blue adhesive layer 35 are respectively coated on the surfaces of the first substrate 12, the first heating circuit 14, the third substrate 32, and the second heating circuit 34. Step 5: Align the edges of the second substrate 13 with the first substrate 12 and place them in a pre-pressing device for pre-pressing. Align the edges of the fourth substrate 33 with the third substrate 32 and place them in a pre-pressing device for pre-pressing. Step six: A third blue adhesive layer 102 is applied to the lower end of the first substrate 12 and the upper end of the fourth substrate 33 in step five. After the intermediate layer substrate 20 is aligned with the lower end of the first substrate 12 and the upper end of the fourth substrate 33, it is placed into the mold. The first substrate 12, the second substrate 13, the intermediate layer substrate 20, the third substrate 32, and the fourth substrate 33 are pressed and bonded firmly by a hydraulic press. Step 7: Transfer the workpiece obtained in Step 6 to the cutting equipment to cut the workpiece into the corresponding shape according to the required size; Step 8: Apply high-temperature powder to the surface of the workpiece obtained in Step 7, and solidify the first substrate 12, the second substrate 13, the intermediate layer substrate 20, the third substrate 32, and the fourth substrate 33 into ceramic by high-temperature sintering. Step 9: Clean the workpiece obtained in Step 8 to remove the high-temperature powder from the surface. Step 10: Inspect the workpieces obtained in Step 9 to determine whether the finished products meet the standards, and classify them according to the inspection results; Step 11: Use solder leads 17 to bond with heating circuit electrodes 15. High temperature is used to bond leads 17 and heating circuit electrodes 15 to achieve the required tensile strength.

[0026] The key design feature of this invention is that, through the design of each component, gas enters the spiral air passage from the air inlet. The upper and lower heating elements circulate and heat the gas within the spiral air passage, thereby achieving uniform gas heating. At the same time, the spiral air passage design extends the residence time of the gas in the heating area, thereby improving the continuous turbulent contact between the gas and the heating surface, saving energy consumption, improving overall reliability, meeting user needs, and offering excellent usability and wide applicability. Furthermore, the first and second blue adhesive layers ensure that the first and second heating circuits form a reliable insulating layer between their respective substrates, preventing short circuits and leakage risks and ensuring product stability. Simultaneously, the third blue adhesive layer creates a sealing layer between the intermediate substrate and the upper and lower heating elements, preventing external moisture or dust from seeping into the spiral air passage through the gaps between the intermediate substrate and the upper and lower heating elements. This ensures uniform heating of the spiral air passage, enhancing overall reliability and practicality.

[0027] The above description is merely a preferred embodiment of the present invention and does not constitute any limitation on the technical scope of the present invention. Therefore, any minor modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A spiral airway heating element, characterized in that: It includes, from top to bottom, an upper heating element, a middle substrate, and a lower heating element; wherein: The intermediate layer substrate has a spiral groove extending from the inside out and running vertically through it, and the spiral groove is provided in a plurality of circumferentially spaced arrangement. The upper heating element is provided with a plurality of first through holes arranged in a circumferentially spaced manner corresponding to the spiral grooves. The plurality of first through holes are located at the edge of the upper heating element and are connected to the outer end of the corresponding spiral groove. The lower heating element is provided with a number of second through holes arranged circumferentially at intervals corresponding to the spiral grooves. The number of second through holes is located in the middle of the lower heating element and is connected to the inner end of the corresponding spiral groove. The spiral grooves, the upper heating element, and the lower heating element form a spiral air passage with an air inlet and an air outlet.

2. The spiral airway heating element according to claim 1, characterized in that: The thickness of the intermediate substrate is greater than the thickness of the upper heating element and the lower heating element.

3. The spiral airway heating element according to claim 1, characterized in that: The thickness of the upper heating element is equal to the thickness of the lower heating element.

4. The spiral airway heating element according to claim 1, characterized in that: The air inlet is formed on the first through hole, and the air outlet is formed on the second through hole; Alternatively, the air inlet is formed on the second through hole, and the air outlet is formed on the first through hole.

5. A spiral airway heating element according to claim 1, characterized in that: The upper heating element includes a first substrate and a second substrate. A first heating circuit is provided on the upper end surface of the first substrate. The second substrate is disposed on the upper end of the first substrate. The first heating circuit is located between the first substrate and the second substrate. A heating circuit electrode is provided on the upper end of the second substrate. The first substrate is disposed on the upper end of the intermediate layer substrate. The lower heating element includes a third substrate and a fourth substrate. A second heating circuit is provided on the upper surface of the third substrate. The fourth substrate is disposed on the upper end of the third substrate. The second heating circuit is located between the third substrate and the fourth substrate. The fourth substrate is disposed on the lower end of the intermediate layer substrate. The fourth substrate, the intermediate layer substrate, the first substrate, and the second substrate are all provided with electrode holes. The electrodes of the heating circuit are electrically connected to the two ends of the first heating circuit and the two ends of the second heating circuit respectively through the vias.

6. A spiral airway heating element according to claim 5, characterized in that: Both the first heating circuit and the second heating circuit are printed using at least one of tungsten paste, molybdenum paste, ruthenium paste, and manganese paste.

7. A spiral airway heating element according to claim 5, characterized in that: A first blue adhesive layer is provided on the upper surface of the first substrate. The first blue adhesive layer is evenly applied to the first heating circuit. The second substrate is bonded and fixed to the first substrate through the first blue adhesive layer.

8. A spiral airway heating element according to claim 5, characterized in that: The upper surface of the third substrate is provided with a second blue adhesive layer, which is uniformly applied to the second heating circuit. The fourth substrate is bonded and fixed to the third substrate by the second blue adhesive layer.

9. A spiral airway heating element according to claim 5, characterized in that: A third blue adhesive layer is provided on the lower end surface of the first substrate and the upper end surface of the fourth substrate. The first substrate and the fourth substrate are respectively disposed on the upper and lower ends of the intermediate layer substrate through the third blue adhesive layer.

10. A method for preparing a spiral airway heating element as described in any one of claims 1 to 9, characterized in that: Includes the following steps: Step 1: Prepare the sheet material. Cut the sheet material into the required size to obtain the first substrate, second substrate, intermediate substrate, third substrate, and fourth substrate. Step 2: First through holes, second through holes, and electrode holes are respectively formed on the first, second, third, and fourth substrates, and spiral grooves and electrode holes are formed on the intermediate layer substrate. Step 3: Set a first heating circuit on the upper surface of the first substrate, set a second heating circuit on the upper surface of the third substrate, and set heating circuit electrodes on the upper surface of the second substrate corresponding to the electrode holes. Step 4: A first blue adhesive layer and a second blue adhesive layer are respectively coated on the surfaces of the first substrate, the first heating circuit, the third substrate, and the second heating circuit; Step 5: Align the edges of the second substrate with the first substrate and place it in the pre-pressing equipment for pre-pressing. Align the edges of the fourth substrate with the third substrate and place it in the pre-pressing equipment for pre-pressing. Step six: A third blue adhesive layer is applied to the lower end of the first substrate and the upper end of the fourth substrate in step five. After the intermediate layer substrate is attached to the lower end of the first substrate and the upper end of the fourth substrate and aligned with the edges, it is placed into the mold. The first substrate, the second substrate, the intermediate layer substrate, the third substrate and the fourth substrate are pressed and bonded firmly by a hydraulic press. Step 7: Transfer the workpiece obtained in Step 6 to the cutting equipment to cut the workpiece into the corresponding shape according to the required size; Step 8: Apply high-temperature powder to the surface of the workpiece obtained in Step 7, and solidify the first substrate, second substrate, intermediate layer substrate, third substrate, and fourth substrate into ceramic by high-temperature sintering. Step 9: Clean the workpiece obtained in Step 8 to remove the high-temperature powder from the surface. Step 10: Inspect the workpieces obtained in Step 9 to determine whether the finished products meet the standards, and classify them according to the inspection results; Step 11: Use solder leads to bond with the heating circuit electrodes. High temperature is used to bond the leads to the heating circuit electrodes to achieve the required tensile strength.

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