Capacity management device and method for semiconductor factory plant system

Abstract

The application discloses a capacity management and control device and method of a semiconductor factory system, and the capacity management and control device comprises a demand end module, a supply end module and a capacity control module. The demand end module is used for acquiring position information of machine devices and usage demand information in the semiconductor factory. The supply end module is used for acquiring pipeline position information and pipeline supply capacity of the semiconductor factory system. The capacity control module is used for receiving the position information of the machine devices given by the demand end module and the pipeline position information given by the supply end module, realizing column grid matching of each machine device and each pipeline, receiving the usage demand information given by the demand end module and the pipeline supply capacity given by the supply end module, and realizing capacity management and control of the semiconductor factory system in combination with a point distribution mode. The application realizes data connection of the semiconductor factory system and the machine devices in a space dimension, realizes overall dynamic management and control of the power capacity of the whole factory, and avoids cost waste caused by mismatching of the demand end and the supply end.

Description

Technical Field

[0001] This invention belongs to the technical field of semiconductor factory simulation, specifically relating to a capacity control device and method for a semiconductor factory plant management system. Background Technology

[0002] A semiconductor factory is a complex architectural space comprised of an extremely intricate layout of equipment and a highly precise piping system. Within a semiconductor factory, a vast and complex network of piping must be integrated into the equipment layout to deliver the various core power sources and materials necessary to maintain the operation of the machines.

[0003] Due to rapid technological iteration and the risk of demand fluctuations, improper capacity planning in semiconductor factories can easily lead to huge waste. In addition, with the continuous development of semiconductor processes, the requirements for cleanliness and material purity are constantly increasing. As the core support for manufacturing, the stability of the plant system (ultrapure water, gas, chemicals, etc.) directly affects the yield, capacity, performance, cost, and even the realization of technology nodes of chips (such as anomalies may lead to production line shutdowns, resulting in huge losses such as the scrapping of an entire batch of wafers). Therefore, it is necessary to manage the capacity between the amount of equipment used and the amount provided by the plant system to ensure that the two are matched and to guarantee production continuity.

[0004] Currently, most semiconductor factories still manually adjust their production capacity by aggregating demand. However, this method is difficult to cope with rapidly changing market demands and is prone to waste and inefficiency due to human error. Some companies also operate at full capacity for extended periods to avoid idle capacity, but this method may exacerbate equipment wear and tear and increase maintenance costs.

[0005] Semiconductor factories have also tried various methods, including discrete event simulation, models, and spreadsheets. However, discrete event simulation can only handle single bottleneck tools and cannot dynamically capture the interactions between multiple bottlenecks. Static models (such as spreadsheets) are difficult to simulate the random and nonlinear behavior of complex systems, resulting in low accuracy in capacity management. At the same time, they cannot link plant systems (such as ultrapure water and gas supply) with production plans, leading to resource supply delays or surpluses, affecting production continuity.

[0006] Patent CN119442532A discloses a layout device and method for semiconductor secondary piping installation engineering, including: a file upload module for receiving layout files from a semiconductor production line; a data parsing module for parsing the layout files, obtaining equipment attribute information and location information, and transmitting them to a secondary piping database; a data analysis layout module for generating a secondary piping installation pipeline diagram, and then, in conjunction with a component matching algorithm, obtaining the corresponding piping and instrumentation components from the secondary piping database to form a piping and instrumentation flow diagram; and a three-dimensional space management module for generating a layout model for semiconductor secondary piping installation engineering in conjunction with a three-dimensional model generation algorithm. Through the linkage between semiconductor layout information and the secondary piping database, combined with the component matching algorithm, information on secondary piping components is obtained. Based on the three-dimensional model generation algorithm, the automatic generation of semiconductor secondary piping layout is achieved and visualized in a three-dimensional scene.

[0007] The aforementioned technologies only regulate the layout and connections of equipment in semiconductor factories, without matching supply and demand during equipment operation. The current challenge is to connect the plant management systems and equipment within semiconductor factories to achieve dynamic control over the factory's power capacity, ensuring capacity matching between demand and supply, and improving resource utilization. Summary of the Invention

[0008] To address the deficiencies in the existing technology, this invention provides a capacity control device and method for a semiconductor factory plant management system. The device includes a demand-side module for acquiring the location information and usage demand information of equipment in the semiconductor factory; a supply-side module for acquiring the location information and supply capacity of pipelines in the plant management system; and a capacity control module for receiving the equipment location information from the demand-side module and the pipeline location information from the supply-side module, achieving grid matching between each piece of equipment and each pipeline, and receiving the usage demand information from the demand-side module and the pipeline supply capacity from the supply-side module, and combining this with a point allocation method to achieve capacity control of the semiconductor factory plant management system.

[0009] By rapidly collecting and binding information on the spatial location and usage requirements of equipment, and matching and binding information on the spatial location and supply capacity of pipelines, the system quickly and automatically matches the spatial location of equipment with the location of pipelines based on grid coordinates. It then matches the power requirements of the equipment with the capacity of the pipelines, enabling capacity management within the semiconductor factory's plant administration system. This achieves spatial data connectivity between the plant administration system and equipment, providing comprehensive and dynamic control over the entire plant's power capacity. This avoids cost waste caused by mismatches between demand and supply, and improves the efficiency of solution development when information changes repeatedly during the construction phase of a semiconductor factory. Ultimately, it controls the utilization rate or capacity of equipment and optimizes capacity planning.

[0010] In a first aspect, the present invention provides a capacity control device for a conductor factory plant management system, comprising: The demand-side module is used to obtain the location information and usage requirements of equipment in the semiconductor factory. The supply-side module is used to obtain pipeline location information and pipeline supply capacity in the semiconductor factory's plant management system. The capacity control module is used to receive the machine and equipment location information from the demand-side module and the pipeline location information from the supply-side module, so as to achieve column grid matching between each machine and equipment and each pipeline. It also receives the usage demand information from the demand-side module and the pipeline supply capacity from the supply-side module, and combines the point allocation method to realize the capacity control of the semiconductor factory plant management system.

[0011] Furthermore, the machine equipment location information includes the coordinate information of each structural point of the machine equipment, and the pipeline location information includes the pipeline code, the building and floor where the pipeline is located, and the coordinate information of the pipeline column grid.

[0012] Furthermore, it receives machine location information from the demand-side module and pipeline location information from the supply-side module, and achieves grid matching of spatial coordinates between each machine and each pipeline, specifically including: Multiple key points are identified from various structural points of the machine tool, and the coordinate information of each key point is extracted. The coordinate region of the corresponding machine tool is determined by the maximum two-dimensional information between key points at each location. Based on the coordinate regions of each machine tool, the geometric center point of each machine tool is given. Based on the layout of the semiconductor factory and the location information of the equipment, obtain the column grid and column grid numbering partitions for the semiconductor factory; Using the strategy of being closest to the center point of the column grid numbering zone, and combining the geometric center point of the equipment, the location information of the equipment and the location information of the pipeline are matched with the column grid number respectively.

[0013] Furthermore, using the strategy of being closest to the center point of the column grid numbering zone, and combining the geometric center point of the equipment, the location information of the equipment and the location information of the pipeline are matched with the column grid number, specifically including: Extract the pipeline grid coordinates from the pipeline location information and match them with the grid numbers; Based on the analysis of the distance between the geometric center point of the equipment and the center point of each column grid numbering zone, the column grid numbering zone closest to the geometric center point of the equipment is determined, and the equipment location information and pipeline location information are matched with the column grid number.

[0014] Furthermore, the system receives equipment usage requirements from the demand-side module and pipeline supply capacity from the supply-side module, and combines this with point allocation methods to achieve capacity control of the semiconductor factory management system. Specifically, this includes: Determine the target grid area; Compare and analyze the usage requirements of each machine and equipment within the target column grid area and the pipeline supply capacity of each pipeline; The pipeline supply capacity is dynamically adjusted based on capacity thresholds and cross-axis dispatch points to meet the usage requirements of each machine and equipment within the target column grid area. Traverse all areas of the grid until the usage requirements of each machine and the pipeline supply capacity of each grid area are matched, so as to realize the capacity control of the semiconductor factory plant management system.

[0015] Furthermore, based on capacity thresholds and cross-axis dispatch points, the pipeline supply capacity is dynamically adjusted to meet the usage requirements of each machine and equipment within the target column grid area, specifically including: Based on the usage demand information of each machine and equipment within the target column grid area and the pipeline supply capacity of each pipeline, combined with the threshold of pipeline supply capacity, the first adjustment amount is given. Based on the first adjustment amount, combined with the strategy of minimizing the total connection distance, a second adjustment amount is given for cross-axis point allocation; Based on the first or second adjustment amount, adjust the number of pipelines and the pipeline supply capacity to meet the usage requirements of each machine and equipment within the target column grid area.

[0016] Furthermore, based on the first adjustment amount and combined with a strategy to minimize the total connection distance, a second adjustment amount is given for cross-axis point allocation, specifically including: Based on the analysis of the first adjustment amount, the demand for cross-axis dispatch points is determined; Based on the correspondence between the number of pipelines and equipment and the capacity matching between pipelines and equipment, constraints including the number of pipelines, pipeline supply capacity, and decision-making are formed. Based on the association function between the equipment and the pipeline and the column spacing, an objective function to minimize the total connection distance is given; The objective function of minimizing the total connection distance is analyzed to determine the grid area of ​​the dispatch point and to give the second adjustment amount.

[0017] Furthermore, the number of pipelines, pipeline supply capacity, and the constraints on the decision-making process are specifically expressed as follows:

[0018] Where Z() is the association function between the machine equipment and the pipeline, i is the machine equipment number, j is the pipeline number, n is the total number of pipelines, and i→j is the degree of association between machine equipment i and pipeline j. Let m be any symbol, q be the total number of machines and equipment.i C represents the required quantity of machine tool i. j Let j be the pipeline supply capacity; The objective function for minimizing the total connection distance is specifically expressed as:

[0019] Where MIN is the objective function to minimize the total connection distance, min() is the minimum function, and d ij The column spacing is from machine equipment i to pipe j.

[0020] Furthermore, it also includes a standardization module and a management output module; The standardization module is used to perform consistency processing on the original equipment location information and original usage demand information in the semiconductor factory, and transmit the equipment location information and usage demand information to the demand-side module; and to perform consistency processing on the original pipeline location information and original pipeline supply capacity in the plant management system of the semiconductor factory, and transmit the pipeline location information and pipeline supply capacity to the supply-side module. The management output module is connected to the capacity control module and is used to output factory planning information and factory cost accounting data. The factory planning information includes pipeline capacity and quantity information, and information on the expansion or reduction of supply.

[0021] Secondly, the present invention also provides a capacity control method for a semiconductor factory plant management system, employing a capacity control device for a semiconductor factory plant management system as described in any of the above-mentioned embodiments, specifically including the following steps: Obtain the location information of machine equipment in the semiconductor factory and the location information of pipelines in the plant management system of the semiconductor factory; Based on the location information of the equipment and pipelines, the column grid matching between each equipment and each pipeline is realized; Obtain information on the usage requirements of equipment in a semiconductor factory and the pipeline supply capacity of the plant management system in the semiconductor factory. Capacity control of the semiconductor factory plant management system is achieved by combining usage demand information and pipeline supply capacity with point allocation methods.

[0022] The present invention provides a capacity control device and method for a semiconductor factory plant management system, which has at least the following beneficial effects: (1) By binding the machine equipment location information and usage demand information obtained by the demand-side module, and matching and binding the pipeline location information and pipeline supply capacity obtained by the supply-side module, the capacity control module quickly matches the column network of each machine equipment with each pipeline, and then matches the usage demand information and pipeline supply capacity. Combined with the point allocation method, the capacity control of the semiconductor factory system is realized, realizing the data connection between the factory system and the machine equipment in the spatial dimension, and comprehensively and dynamically controlling the power capacity of the semiconductor factory, avoiding cost waste caused by the mismatch between the demand side and the supply side, so as to achieve the effect of controlling the utilization rate or capacity of the machine equipment and optimizing the capacity planning.

[0023] (2) By using the column grid as a connector, the equipment and pipelines can be matched and capacity control can be achieved. The location of the equipment and pipelines can be quickly located based on the semiconductor factory. However, the traditional two-dimensional coordinate system cannot be closely connected with the actual structure of the semiconductor factory, which leads to the need for position conversion when locating the equipment and pipelines, reducing the positioning efficiency. The use of the column grid provides an accurate position basis for the matching and control of equipment and pipelines, ensuring the control efficiency of the semiconductor factory.

[0024] (3) The management output module, as the output of the capacity control device of the semiconductor factory plant management system, generates relevant suggestions for plant construction planning by integrating the results of other modules, such as suggestions on pipeline capacity and quantity, expansion or reduction of supply, cost accounting, etc., to reduce redundant construction; the standardization module processes various types of non-fixed data such as equipment layout diagram, machine power demand table, plant management system pipeline location diagram and plant construction information table into standard, and checks and verifies according to rules, establishes relevant reminder mechanisms, ensures design consistency, efficiently and accurately processes data into identifiable data structures, and outputs results such as equipment spatial location, equipment power consumption (usage demand), plant management system pipeline location, and plant management system pipeline capacity, providing a data foundation for the capacity control device of the semiconductor factory plant management system. Attached Figure Description

[0025] Figure 1 A structural block diagram of a capacity control device for a semiconductor factory plant management system provided in an embodiment of the present invention; Figure 2 A flowchart illustrating location information matching for embodiments of the present invention; Figure 3 A flowchart for column grid number matching provided in an embodiment of the present invention; Figure 4 A schematic diagram illustrating column grid number matching for an embodiment of the present invention; Figure 5 A flowchart illustrating capacity management in an embodiment of the present invention; Figure 6 A flowchart illustrating the dynamic adjustment of pipeline supply capacity provided in an embodiment of the present invention; Figure 7 A structural block diagram of the standardized module and management output module provided in the embodiments of the present invention; Figure 8 A flowchart of a capacity control method for a semiconductor factory management system provided in an embodiment of the present invention.

[0026] Among them, 201 is the demand-side module; 202 is the supply-side module; 203 is the capacity control module; 204 is the standardization module; and 205 is the management output module. Detailed Implementation

[0027] To better understand the above technical solutions, a detailed description of the solutions will be provided below in conjunction with the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0028] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of this invention and the appended claims are also intended to include the plural forms, and “multiple” generally includes at least two unless the context clearly indicates otherwise.

[0029] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or device that includes said element.

[0030] Due to challenges such as nanoscale process precision, ultrapure material supply, and ultra-clean environments, semiconductor factories have reached the pinnacle of industrial manufacturing complexity. Furthermore, semiconductor factories involve massive investments, and improper capacity planning can easily lead to enormous waste.

[0031] Currently, capacity management in semiconductor factory systems is typically achieved through manual adjustments or static models. This approach fails to respond promptly to changes in system demand and struggles to simulate the random and nonlinear behavior of complex systems, potentially leading to resource shortages or surpluses and disrupting production continuity. Furthermore, equipment and piping matching relies on manual experience and lacks dynamic control capabilities. When data is replaced, updated, or added, a rapid response cannot be guaranteed, further impacting resource supply.

[0032] To address the aforementioned problems, this invention provides a capacity management device for a semiconductor factory plant management system, comprising a demand-side module, a supply-side module, and a capacity management module. The demand-side module acquires the location information and usage demand information of equipment in the semiconductor factory. The supply-side module acquires the location information and supply capacity of pipelines in the semiconductor factory plant management system. The equipment location information includes the coordinates of each structural point of the equipment, and the pipeline location information includes the pipeline code, the building and floor where the pipeline is located, and the coordinates of the pipeline's column grid. The capacity management module receives the equipment location information from the demand-side module and the pipeline location information from the supply-side module, enabling column grid matching between each piece of equipment and each pipeline. It also receives the usage demand information from the demand-side module and the pipeline supply capacity from the supply-side module, and, in conjunction with the point allocation method, implements capacity management for the semiconductor factory plant management system.

[0033] By rapidly collecting and binding information on the spatial location and usage requirements of equipment, and matching and binding the spatial location and supply capacity of pipelines; then, based on the column grid coordinate information, quickly and automatically matching the spatial location of equipment with the location of pipelines, and further matching the power requirements of equipment with the capacity of pipelines, through functions such as intelligent point allocation, point status management, branch pipe capacity threshold control, and dynamic adjustment of equipment simultaneous use coefficient, capacity management of the semiconductor factory plant management system is realized. This achieves data connectivity between the plant management system and equipment in the spatial dimension, enabling comprehensive and dynamic control of the entire plant's power capacity, avoiding cost waste caused by mismatch between demand and supply, and improving the efficiency of solution proposals when information changes repeatedly during the construction phase of the semiconductor factory, thereby controlling the utilization rate or capacity of equipment and optimizing capacity planning.

[0034] like Figure 1As shown in the figure, this embodiment of the invention provides a capacity management device for a semiconductor factory plant management system, specifically including: a demand-side module, a supply-side module, and a capacity management module. The demand-side module is used to acquire the location information and usage demand information of the equipment in the semiconductor factory. The supply-side module is used to acquire the location information and supply capacity of the pipelines in the plant management system of the semiconductor factory. The equipment location information includes the coordinate information of each structural point of the equipment, and the pipeline location information includes the pipeline code, the building and floor where the pipeline is located, and the coordinate information of the pipeline's column grid. The capacity management module is used to receive the equipment location information from the demand-side module and the pipeline location information from the supply-side module, to achieve column grid matching between each piece of equipment and each pipeline, and to receive the usage demand information from the demand-side module and the pipeline supply capacity from the supply-side module, and to combine this with the point allocation method to achieve capacity management of the semiconductor factory plant management system.

[0035] Furthermore, it receives machine location information from the demand-side module and pipeline location information from the supply-side module, and achieves columnar matching of spatial coordinates between each machine and each pipeline, referring to... Figure 2 Specifically, it includes: Multiple key points are identified from various structural points of the machine tool, and the coordinate information of each key point is extracted. The coordinate region of the corresponding machine tool is determined by the maximum two-dimensional information between key points at each location. Based on the coordinate regions of each machine tool, the geometric center point of each machine tool is given. Based on the layout of the semiconductor factory and the location information of the equipment, obtain the column grid and column grid numbering partitions for the semiconductor factory; Using the strategy of being closest to the center point of the column grid numbering zone, and combining the geometric center point of the equipment, the location information of the equipment and the location information of the pipeline are matched with the column grid number respectively.

[0036] In one specific implementation, the coordinate information of each structural point in the machine is obtained based on the machine location information acquired by the demand module. The key location points can be all structural points or only some, depending on the actual situation. In the implementation provided by this invention, the key location points are structural points that include the maximum and minimum coordinate values ​​in each orientation. For example, if the key location points are the four corner points of the machine (top left, bottom left, top right, and bottom right), the corresponding coordinate information would be (20, 40), (20, 0), (50, 50), and (50, 10). In other examples, the key location points can also be endpoints of edges, boundary points of circles / arcs, vertices of polylines, etc., within the machine. Based on the coordinate information of the key points, the maximum two-dimensional information is obtained. This maximum two-dimensional information includes the maximum and minimum values ​​of the x-coordinate, y-coordinate, and vertical coordinate. Combining this maximum two-dimensional information, the coordinate region where the machine is located can be defined. For example, if the maximum x-coordinate is 50, the minimum x-coordinate is 20, the maximum y-coordinate is 50, and the minimum y-coordinate is 0, then the coordinate region of the machine is the area enclosed by x=20, x=50, y=0, and y=50. Once the coordinate region is determined, the geometric center point of the coordinate region can also be understood as the geometric center point of the machine. For example, the geometric center point could be x=(20+50) / 2=30, y=(0+50) / 2=25.

[0037] Understandably, when determining the geometric center point of a machine tool, parameters such as the insertion point, scaling ratio, and rotation angle can be determined according to actual needs, or the coordinates of the geometric center point can be converted to world coordinates.

[0038] The grid of a semiconductor factory is a spatial coordinate system that encodes each area of ​​the semiconductor factory according to a grid. Each area in the grid numbering partition corresponds to a grid number (i.e., the grid number). In the embodiment provided by the present invention, the horizontal axis of the grid is Arabic numerals and the vertical axis is uppercase English letters.

[0039] It's important to understand that a column grid is a structural layout within a semiconductor factory, providing fundamental support and spatial division for equipment installation, piping arrangement, and personnel movement. The column grid divides the internal space of a semiconductor factory into multiple zones, facilitating the layout of equipment and the organization of production processes. Furthermore, the column grid provides reference points for equipment installation, ensuring that equipment can be securely installed in its designated positions. It also provides pathways for piping, ensuring that pipes can be laid along the grid and avoiding intersections and conflicts. The spacing of the column grid needs to be designed based on the factory's size, equipment dimensions, and production process requirements to ensure the rational utilization of space.

[0040] Furthermore, using the strategy of being closest to the center point of the column grid numbering zone, and combining the geometric center point of the equipment, the location information of the equipment and the pipeline location information are matched with the column grid number, respectively, referring to... Figure 3 Specifically, it includes: Extract the pipeline grid coordinates from the pipeline location information and match them with the grid numbers; Based on the analysis of the distance between the geometric center point of the equipment and the center point of each column grid numbering zone, the column grid numbering zone closest to the geometric center point of the equipment is determined, and the equipment location information and pipeline location information are matched with the column grid number.

[0041] In a specific example, the pipeline location information is numbered "Fab1;F3;XPM,E4;01" in the pipeline location table, where E4 is the pipeline grid coordinate information, which is the grid number. The pipeline grid coordinate information is associated with the grid number to complete the matching between the pipeline and the grid.

[0042] It is important to understand that each pipe has a unique grid number, but one grid number can correspond to multiple pipes. Multiple pipes with the same or different purposes can be installed in the same location or area.

[0043] In one specific implementation, the Manhattan distance formula is used. The distance between the geometric center point of the computer station equipment and the center points of each grid numbered partition is sorted according to the grid numbered partition center point closest to the geometric center point of the equipment. The equipment is then associated with the grid number corresponding to the nearest grid numbered partition center point, achieving cross-source data matching. This allows for rapid and automatic classification of equipment locations on the demand side and pipeline locations on the supply side. Figure 4 As shown in the figure, the circle represents the machine equipment numbered XXX-01, and each small square represents a different column grid numbering zone. The column grid number corresponding to machine equipment (XXX-01) is E4, which is the E4 area corresponding to machine equipment in the red box.

[0044] Furthermore, the system receives equipment usage requirements from the demand-side module and pipeline supply capacity from the supply-side module, and combines this with point allocation methods to achieve capacity control of the semiconductor factory management system, referring to... Figure 5 Specifically, it includes: Determine the target grid area; Compare and analyze the usage requirements of each machine and equipment within the target column grid area and the pipeline supply capacity of each pipeline; The pipeline supply capacity is dynamically adjusted based on capacity thresholds and cross-axis dispatch points to meet the usage requirements of each machine and equipment within the target column grid area. Traverse all areas of the grid until the usage requirements of each machine and the pipeline supply capacity of each grid area are matched, so as to realize the capacity control of the semiconductor factory plant management system.

[0045] Furthermore, based on capacity thresholds and cross-axis dispatch points, the pipeline supply capacity is dynamically adjusted to meet the usage requirements of each machine and equipment within the target column grid area, referring to... Figure 6 Specifically, it includes: Based on the usage demand information of each machine and equipment within the target column grid area and the pipeline supply capacity of each pipeline, combined with the threshold of pipeline supply capacity, the first adjustment amount is given. Based on the first adjustment amount, combined with the strategy of minimizing the total connection distance, a second adjustment amount is given for cross-axis point allocation; Based on the first or second adjustment amount, adjust the number of pipelines and the pipeline supply capacity to meet the usage requirements of each machine and equipment within the target column grid area.

[0046] Furthermore, based on the first adjustment amount and combined with a strategy to minimize the total connection distance, a second adjustment amount is given for cross-axis point allocation, specifically including: Based on the analysis of the first adjustment amount, the demand for cross-axis dispatch points is determined; Based on the correspondence between the number of pipelines and equipment and the capacity matching between pipelines and equipment, constraints including the number of pipelines, pipeline supply capacity, and decision-making are formed. Based on the association function between the equipment and the pipeline and the column spacing, an objective function to minimize the total connection distance is given; The objective function of minimizing the total connection distance is analyzed to determine the grid area of ​​the dispatch point and to give the second adjustment amount.

[0047] Furthermore, by integrating the number of pipelines, pipeline supply capacity, and decision-making constraints, the specific expression is as follows:

[0048] Where Z() is the association function between the machine equipment and the pipeline, i is the machine equipment number, j is the pipeline number, n is the total number of pipelines, and i→j is the degree of association between machine equipment i and pipeline j. Let m be any symbol, q be the total number of machines and equipment. i C represents the required quantity of machine tool i. j Let j be the pipeline supply capacity; The objective function for minimizing the total connection distance is specifically expressed as:

[0049] Where MIN is the objective function to minimize the total connection distance, min() is the minimum function, and d ijLet be the column spacing from machine equipment i to pipe j. The column spacing can be calculated using the column grid numbers corresponding to machine equipment i and pipe j in the column grid of a semiconductor factory.

[0050] In one specific implementation, a target grid area within the semiconductor factory is first determined. This target grid area can be any construction area within the semiconductor factory. Then, the equipment and piping within the target grid area are analyzed, comparing the usage requirements of the equipment with the available piping capacity. Based on the varying relationships between usage requirements and piping capacity, and considering piping capacity thresholds and cross-axis dispatch points, the piping capacity within the target grid area is adjusted to meet the equipment usage requirements. This process is repeated across all areas within the semiconductor factory's grid, comparing usage requirements with piping capacity for each area and adjusting the piping capacity accordingly to achieve capacity control within the semiconductor factory's plant management system.

[0051] In comparing the usage demand information and the pipeline supply capacity, the process first determines whether the pipeline supply capacity in the current target column network area meets the usage demand of the equipment. If it does, i.e., the pipeline supply capacity is greater than or equal to the usage demand information, the difference between the pipeline supply capacity and the usage demand information is calculated to obtain the first adjustment amount, and the pipeline capacity in the target column network area is adjusted accordingly. If the current pipeline supply capacity cannot meet the current usage demand information, i.e., the pipeline supply capacity is less than the usage demand information, then the difference between the pipeline supply capacity threshold and the usage demand information is calculated based on the threshold of the pipeline supply capacity in the target column network area to obtain the first adjustment amount, and the pipeline capacity in the target column network area is adjusted accordingly. If adjusting all pipelines in the target column network area to the pipeline supply capacity threshold still cannot meet the usage demand information of the equipment, a second adjustment amount is given by cross-axis point assignment, based on the strategy of minimizing the total connection distance. That is, according to the strategy of minimizing the total connection distance, the assignment column network area is determined by traversal optimization, and the second adjustment amount is given. The specific method and algorithm of traversal optimization are not limited. Therefore, by utilizing the pipelines in the designated grid area (i.e., other grid areas) for capacity control, the usage demand information of the machine equipment in the target grid area is obtained, and the usage demand of the machine equipment in the target grid area is met. Finally, if the usage demand of the machine equipment still cannot be met according to the second adjustment, the number or capacity of pipelines in the target grid area can be expanded through the management output module to output factory planning information.

[0052] Minimizing the total connection distance is equivalent to minimizing the sum of the products of the distances from all equipment to their connecting pipes and the connection decision variables. These connection decision variables are determined by the association function Z() between the equipment and the pipes. A Z(i→j) value of 1 indicates that equipment i is connected to pipe j, while a Z(i→j) value of 0 indicates that equipment i is not connected to pipe j. Furthermore, each equipment must be connected to one and only one pipe, and the sum of the usage requirements of all equipment connected to pipe j cannot exceed the supply capacity of pipe j.

[0053] In a specific example, within the target column grid area E4, the plant system's piping supply capacity (21704m³) 3 / h) < Equipment usage requirements (30000 m 3 The current pipeline supply capacity ( / h) indicates that the current supply capacity cannot meet the current demand, requiring dynamic adjustment of the pipeline supply capacity in the target grid area. Assuming the original capacity threshold was 0.6, and it is now increased to 0.7, then the current pipeline capacity is 21704 * 0.7 / 0.6 = 25321 m³. 3 / h; therefore, the current threshold for new pipeline supply capacity is 25321 m³. 3 / h, still less than the equipment usage requirements (30000 m). 3 ( / h), meaning the first adjustment amount cannot meet the usage requirements of the equipment in the target column grid area. In this case, a second adjustment amount needs to be given to adjust the capacity by combining the strategy of minimizing the total connection distance and assigning points across axes. For example, according to the strategy of minimizing the total connection distance, the nearest pipe to equipment XXX-01 is E4, followed by E5. If the remaining capacity of pipe E5 is extremely abundant, then equipment XXX-01 will be assigned to pipe E5; if there is only a small amount of surplus, then equipment XXX-01 can be connected to both pipes E4 and E5 simultaneously. If the remaining capacity of E5 is 50,000 m³... 3 If / h, then machine equipment XXX-01 will be dispatched to E5, entering the judgment logic, and the pipeline supply capacity of the plant system (50000 m) will be checked. 3 / h) ≥ Equipment usage requirements (30000 m 3 / h), complete the point allocation, and adjust the pipeline supply capacity accordingly to achieve capacity control of the semiconductor factory plant management system. If the remaining capacity of E5 is 10000m 3 If / h, then machine XXX-01 will be dispatched to E4 and E5, entering the judgment logic, and the pipeline supply capacity of the plant system (10000+25321 m) will be checked. 3 / h) ≥ Equipment usage requirements (30000 m 3 / h), completing the point allocation. In rare cases, cross-axis point allocation still cannot meet the normal capacity matching of the plant management system, for example, the remaining capacity of E5 is 1000 m³. 3 / h, machine equipment XXX-01 is dispatched to E4 and E5, entering the judgment logic, the pipeline supply capacity of the plant system (1000+25321 m) 3 / h) < Equipment usage requirements (30000 m 3 If the pipeline capacity is / h, then the only solution is to increase the number or capacity of pipelines to meet the capacity requirements.

[0054] Reference Figure 7 The capacity control device of the semiconductor factory plant management system also includes a standardization module and a management output module. The standardization module is used to process the original equipment location information and original usage demand information in the semiconductor factory for consistency, and transmit the equipment location information and usage demand information to the demand-side module; and to process the original pipeline location information and original pipeline supply capacity in the semiconductor factory plant management system for consistency, and transmit the pipeline location information and pipeline supply capacity to the supply-side module; the management output module is connected to the capacity control module and is used to output factory planning information and factory cost accounting data, wherein the factory planning information includes pipeline capacity and quantity information, and supply expansion or reduction information.

[0055] The management output module, as the output of the capacity control device in the semiconductor factory's plant management system, integrates the results from other modules to generate relevant information for plant construction planning, such as pipeline capacity and quantity information, supply expansion or reduction information, and cost accounting data. Specifically, the cost accounting data is represented as follows:

[0056] Where Initial_Cost is the initial construction cost, and Expansion_Cost is the expansion cost. j Let be the expansion cost of the j-th pipeline, and n be the total number of pipelines.

[0057] The standardization module can standardize various types of data provided by the owner, such as equipment layout diagrams, machine power demand tables, plant system piping location diagrams, and plant construction information tables. The processing includes, but is not limited to, data cleaning, parsing, verification, unit standardization, and thresholding. Key information is extracted, such as building floors, associated systems, equipment coordinates, piping locations, usage requirements, and piping capacity. Verification is performed according to rules; all input data is automatically validated. If validation passes, the data is stored in the database; if validation fails, the data is returned, and problematic cells are highlighted. For example, for CAD drawings, mapping rules can unify the origin coordinates of different locations into a standard coordinate system; for tables such as .xlsx and .csv, different units of demand or capacity can be identified, unifying units for easier capacity management later. A relevant reminder mechanism is established to ensure design consistency, efficiently and accurately processing data into a recognizable data structure, outputting results such as equipment spatial locations, equipment power consumption (usage requirements), plant system piping locations, and plant system piping capacity for subsequent use.

[0058] The management output module can also intuitively display the current capacity and point operation status of equipment and pipelines through charts and dashboards, quickly obtain key information, reduce operation steps, support drag-and-drop interaction, reduce user learning costs and improve efficiency, and output pipeline configuration suggestions to reduce redundant construction.

[0059] Reference Figure 8 This invention provides a capacity control method for a semiconductor factory management system, the specific steps of which include: Obtain the location information of machine equipment in the semiconductor factory and the location information of pipelines in the plant management system of the semiconductor factory; Based on the location information of the equipment and pipelines, the column grid matching between each equipment and each pipeline is realized; Obtain information on the usage requirements of equipment in a semiconductor factory and the pipeline supply capacity of the plant management system in the semiconductor factory. Capacity control of the semiconductor factory plant management system is achieved by combining usage demand information and pipeline supply capacity with point allocation methods.

[0060] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working process of the described steps can be referred to the corresponding process in the foregoing device embodiments, and will not be repeated here.

[0061] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention. Clearly, those skilled in the art can make various alterations and modifications to the invention without departing from its spirit and scope. Thus, if these modifications and variations of the invention fall within the scope of the claims and their equivalents, the invention is also intended to include these modifications and variations.

Claims

1. A capacity control device for a semiconductor factory plant management system, characterized in that, Specifically, it includes: The demand-side module is used to obtain the location information and usage requirements of equipment in the semiconductor factory. The supply-side module is used to obtain pipeline location information and pipeline supply capacity in the semiconductor factory's plant management system. The capacity control module receives equipment location information from the demand-side module and pipeline location information from the supply-side module to achieve grid matching between equipment and pipelines. It also receives equipment usage requirements from the demand-side module and pipeline supply capacity from the supply-side module. Combined with point allocation methods, it implements capacity control for the semiconductor factory system. Specifically, this includes: determining the target grid area; comparing and analyzing the usage requirements of each equipment and the pipeline supply capacity within the target grid area; and dynamically adjusting the pipeline supply capacity based on capacity thresholds and cross-axis point allocation to meet demand. The usage requirements of each machine and equipment within the target grid area specifically include: based on the usage requirements of each machine and equipment within the target grid area and the pipeline supply capacity of each pipeline, combined with the pipeline supply capacity threshold, a first adjustment amount is given; based on the first adjustment amount, combined with the strategy of minimizing the total connection distance, a second adjustment amount is given using cross-axis dispatching, specifically including: based on the analysis of the first adjustment amount, determining the demand for cross-axis dispatching; according to the correspondence between the number of pipelines and machine and equipment and the capacity matching between pipelines and machine and equipment, a constraint condition containing the number of pipelines, pipeline supply capacity, and decision is formed, specifically expressed as: ； Where Z() is the association function between the machine equipment and the pipeline, i is the machine equipment number, j is the pipeline number, n is the total number of pipelines, and i→j is the degree of association between machine equipment i and pipeline j. Let m be any symbol, q be the total number of machines and equipment. i C represents the required quantity of machine tool i. j Let j be the pipeline supply capacity; The objective function for minimizing the total connection distance is specifically expressed as: ； Where MIN is the objective function to minimize the total connection distance, min() is the minimum function, and d ij The column spacing between machine equipment i and pipe j; Based on the correlation function between equipment and pipelines and the column spacing, a target function for minimizing the total connection distance is given. The target function for minimizing the total connection distance is analyzed to determine the distribution point column grid area, and a second adjustment amount is given. Based on the first or second adjustment amount, the number of pipelines and the pipeline supply capacity are adjusted to meet the usage requirements of each equipment within the target column grid area. All areas of the column grid are traversed until the usage requirements of each equipment within each column grid area are matched with the pipeline supply capacity, thus realizing capacity control of the semiconductor factory plant management system.

2. The capacity control device for a semiconductor factory plant management system as described in claim 1, characterized in that, The machine equipment location information includes the coordinate information of each structural point of the machine equipment, and the pipeline location information includes the pipeline code, the building and floor where the pipeline is located, and the coordinate information of the pipeline column grid.

3. The capacity control device for a semiconductor factory plant management system as described in claim 2, characterized in that, The system receives equipment location information from the demand-side module and pipeline location information from the supply-side module, and performs grid matching of spatial coordinates between each piece of equipment and each pipeline. Specifically, this includes: Multiple key points are identified from various structural points of the machine tool, and the coordinate information of each key point is extracted. The coordinate region of the corresponding machine tool is determined by the maximum two-dimensional information between key points at each location. Based on the coordinate regions of each machine tool, the geometric center point of each machine tool is given. Based on the layout of the semiconductor factory and the location information of the equipment, obtain the column grid and column grid numbering partitions for the semiconductor factory; Using the strategy of being closest to the center point of the column grid numbering zone, and combining the geometric center point of the equipment, the location information of the equipment and the location information of the pipeline are matched with the column grid number respectively.

4. The capacity control device for a semiconductor factory plant management system as described in claim 3, characterized in that, Using the strategy of being closest to the center point of the column grid numbering zone, and combining the geometric center point of the equipment, the location information of the equipment and the location information of the pipeline are matched with the column grid number, specifically including: Extract the pipeline grid coordinates from the pipeline location information and match them with the grid numbers; Based on the analysis of the distance between the geometric center point of the equipment and the center point of each column grid numbering zone, the column grid numbering zone closest to the geometric center point of the equipment is determined, and the equipment location information and pipeline location information are matched with the column grid number.

5. The capacity control device for a semiconductor factory plant management system as described in claim 1, characterized in that, It also includes a standardization module and a management output module; The standardization module is used to perform consistency processing on the original equipment location information and original usage requirement information in the semiconductor factory, and to transmit the equipment location information and usage requirement information to the demand-side module. In addition, the original pipeline location information and original pipeline supply capacity of the plant management system in the semiconductor factory are processed for consistency, and the pipeline location information and pipeline supply capacity are transmitted to the supply-side module. The management output module is connected to the capacity control module and is used to output factory planning information and factory cost accounting data. The factory planning information includes pipeline capacity and quantity information, and information on the expansion or reduction of supply.

6. A capacity control method for a semiconductor factory plant management system, characterized in that, The capacity control device of the semiconductor factory plant management system as described in any one of claims 1-5 specifically includes the following steps: Obtain the location information of machine equipment in the semiconductor factory and the location information of pipelines in the plant management system of the semiconductor factory; Based on the location information of the equipment and pipelines, the column grid matching between each piece of equipment and each pipeline is realized; Obtain information on the usage requirements of equipment in a semiconductor factory and the pipeline supply capacity of the plant management system in the semiconductor factory. Capacity control of the semiconductor factory plant management system is achieved based on usage demand information and pipeline supply capacity, combined with point allocation methods.

Images