High speed data transmission connection system and method

Abstract

The application relates to the technical field of high-speed electric signal connection, in particular to a high-speed data transmission connection system and method, which comprises a power supply module, a cable module, a load end and an intelligent thermal management unit, the power supply module is used for providing electric energy and / or data signals; one end of the cable module is connected with the power supply module, at least two independent electric energy transmission channels are arranged in the cable module, the load end is connected with the other end of the cable module and is used for receiving electric energy and / or data signals; the intelligent thermal management unit is integrated in the load end and / or the power supply module; the intelligent thermal management unit comprises a temperature sensing module, a micro control module and a channel switching execution module, the temperature sensing module is arranged at an electrical connection point of each electric energy transmission channel and is used for collecting temperature data of the channel in real time. The application realizes intelligent temperature control, self-adaptive protection and high-availability operation of the high-speed data transmission connection system.

Description

Technical Field

[0001] This invention relates to the field of high-speed electrical signal connection technology, and in particular to a high-speed data transmission connection system and method. Background Technology

[0002] With the rapid development of high-power fast charging, data centers, new energy, and high-end industrial equipment, unprecedented demands have been placed on the power density and reliability of power transmission systems. Traditional high-current cable solutions face core challenges: First, they only possess a single power transmission function, failing to meet the modern demands for high-speed data exchange between devices, forcing the system to deploy separate data cables, increasing cost and complexity. Second, they lack real-time, accurate online thermal management capabilities. Long-term high-load operation of cables or loose connections can easily lead to abnormal temperature rises. Traditional external temperature monitoring methods are slow to respond and have limited accuracy, posing significant safety hazards such as fires and equipment damage.

[0003] While some existing technologies attempt to integrate temperature measurement into cables, they mostly employ a single type of temperature sensor, making it difficult to balance response speed and measurement accuracy. Furthermore, the monitoring data cannot be effectively uploaded to the power supply for global coordinated control, leaving blind spots in system-level safety management. Therefore, the industry urgently needs an innovative cable solution that integrates high-speed data transmission and intelligent thermal management, fundamentally improving the safety, reliability, and intelligence of high-current power transmission systems. Summary of the Invention

[0004] To address the aforementioned issues, this invention provides a high-speed data transmission connection system and method with intelligent temperature control, adaptive protection, and high availability for high-speed data transmission connection systems.

[0005] The technical solution adopted in this invention is: a high-speed data transmission connection system, comprising a power supply module, a cable module, a load end, and an intelligent thermal management unit. The power supply module is used to provide electrical energy and / or data signals; one end of the cable module is connected to the power supply module, and the cable module has at least two independent power transmission paths internally; the load end is connected to the other end of the cable module and is used to receive electrical energy and / or data signals; the intelligent thermal management unit is integrated into the load end and / or the power supply module. The intelligent thermal management unit includes a temperature sensing module, a micro control module, and a path switching execution module. The temperature sensing module is installed at the electrical connection points of each of the power transmission paths and is used to collect the temperature data of the path in real time. The micro control module is connected to the temperature sensing module and is used to receive and process the temperature data, and generate a path switching command based on a preset temperature threshold. The path switching execution module is connected to the micro control module and is used to receive the switching command and execute the switching of the physical or logical on / off states between each of the power transmission paths.

[0006] A further improvement to the above solution is that the path switching execution module is an electromechanical actuator, which includes a micro drive motor and a transmission mechanism; the conductive contacts of the power transmission path are connected to the transmission mechanism; the micro control module drives the transmission mechanism by controlling the rotation of the micro drive motor, thereby changing the physical contact state between the conductive contacts and the load interface, and realizing path switching.

[0007] A further improvement to the above scheme is that the path switching execution module is a semiconductor switch array, composed of several high-power MOSFETs or IGBTs; the back end of the power transmission path is connected in series with the corresponding switching unit in the semiconductor switch array; the micro control module directly controls the conduction and cutoff of each switching unit by outputting high / low level signals to realize the logic switching of the path.

[0008] A further improvement to the above solution is that the cable module further includes at least one high-speed data path, which is isolated from the power transmission path and adopts a shielded differential pair structure for transmitting high-speed data signals.

[0009] A further improvement to the above scheme is that the micro control module of the intelligent thermal management unit communicates with the power supply module through the control line of the high-speed data path, and is used to send temperature status information to the power supply module or receive scheduling instructions from the power supply module.

[0010] A further improvement to the above scheme is that the load end is a charging port and the power supply module is the output end of a DC fast charging pile, used to achieve high-power DC charging of more than 150kW.

[0011] A further improvement to the above scheme is that the temperature sensing module includes at least two types of sensors: a thin-film platinum resistance temperature sensor with fast response and an NTC thermistor for calibration. The micro control module fuses the data from the two types of sensors to obtain an accurate temperature value.

[0012] A control method based on a high-speed data transmission connection system, characterized by the following steps: Step S1: Monitor the temperature data of each power transmission path through the temperature sensing module; In step S2, the micro control unit compares the monitored temperature with a preset first safety threshold T1; Step S3: If the temperature of the currently operating first channel reaches or exceeds T1, the micro control module immediately generates a switching command. Step S4: Receive the instruction through the switching execution module and perform a seamless switching operation: first close the backup second path, then disconnect the first path, so that the power load is transferred to the second path; In step S5, the first channel enters an idle cooling state, and its temperature is continuously monitored until it drops below the second recovery threshold T2. Step S6: When the temperature of the second channel approaches or the temperature of the first channel cools down to T2, the switching operation is performed again to realize the alternating operation and cooling of the two channels.

[0013] A further improvement to the above scheme is that the time interval of the seamless switching operation in step S4 is on the order of milliseconds, ensuring the continuity of power transmission and avoiding the generation of electric arcs due to current interruption.

[0014] A further improvement to the above scheme is that an initialization step is included before step S1: the micro control module powers on and performs a self-test to verify the status of each sensor and actuator, and by default enables the path with stronger current carrying capacity as the first path.

[0015] A further improvement to the above scheme is that the preset temperature thresholds T1 and T2 are not fixed values, but adaptive values ​​that are dynamically adjusted by the micro control module based on the real-time collected total current, ambient temperature and historical temperature rise data.

[0016] The beneficial effects of this invention are: Compared to existing high-speed electrical data transmission, this invention integrates an intelligent thermal management unit at the power supply / load end and deploys temperature sensors at the electrical connection points of each independent power transmission path to achieve real-time, fine-grained monitoring of the path temperature. A micro-control module quickly judges the temperature data based on preset thresholds and generates path switching commands. The path switching execution module can complete physical or logical on / off switching, improving reliability and availability. Seamless switching or load reduction is achieved in the event of overheating, short circuits, or partial faults, avoiding complete link and data transmission interruptions, supporting redundant hot standby and rapid fault recovery; active protection and extended lifespan. Longevity: Real-time suppression of hotspots and overheat accumulation reduces the aging rate of connectors and cables, extending equipment life and reducing maintenance frequency; Dynamic load balancing and performance optimization: Intelligently allocates current based on temperature and operating status, avoiding single-path overload and maintaining the stability and low bit error rate of high-speed data transmission; Enhanced safety and energy efficiency: Reduces fire and overcurrent risks by timely disconnection of abnormal paths, while also cutting off power to idle paths to reduce energy consumption; Scalability and compatibility: Modular design facilitates deployment in different topologies and power levels, supports remote monitoring and policy upgrades, and is suitable for high-density, high-reliability data centers and industrial scenarios. This invention achieves intelligent temperature control and adaptive protection of power transmission links, significantly improving system reliability, safety, and operating efficiency, reducing maintenance costs, and ensuring the continuity and stability of high-speed data transmission.

[0017] This control method for high-speed data transmission connection systems achieves proactive thermal management and online fault tolerance through real-time temperature monitoring of each transmission path, rapid judgment based on preset thresholds, and a seamless switching strategy of "closing the backup path first and then disconnecting the working path." It improves system reliability and continuity by rapidly transferring load in the early stages of path overheating, preventing link interruptions or device damage; it enables dynamic load distribution and thermal rotation, balancing current load and reducing thermal stress in single paths, thereby extending cable and connector lifespan and reducing failure rates; it enhances operational safety and energy efficiency by timely isolating abnormal paths to reduce overcurrent, short circuit, and fire risks, while simultaneously cutting off power to idle paths to save energy; it reduces maintenance costs and downtime frequency, supports remote monitoring and strategy adjustment, and facilitates preventative maintenance; it ensures power supply and data signal continuity during switching, reduces bit errors and performance jitter, and facilitates integration with existing redundant architectures, making it suitable for high-density data centers, communication, and industrial power supply scenarios. This invention achieves intelligent temperature control, adaptive protection, and high-availability operation for high-speed data transmission connection systems. Attached Figure Description

[0018] Figure 1 This is a connection diagram of the high-speed data transmission connection system of the present invention; Figure 2 for Figure 1 A connection diagram of one embodiment of a medium-to-high-speed data transmission connection system; Figure 3 for Figure 1 A connection diagram of another embodiment of a medium-to-high-speed data transmission connection system; Figure 4 for Figure 1 A connection diagram of the temperature sensing module in a medium-to-high-speed data transmission connection system; Figure 5 This is a flowchart illustrating the control method for the high-speed data transmission connection system of the present invention.

[0019] Explanation of reference numerals in the attached diagram: Power supply module 1, Cable module 2, High-speed data path 21, Load end 3, Intelligent thermal management unit 4, Temperature sensing module 41, Thin film platinum resistance temperature sensor 411, NTC thermistor 412, Micro control module 42, Path switching execution module 43, Micro drive motor 431, Transmission mechanism 432, Power transmission path 5. Detailed Implementation

[0020] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0021] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0023] like Figures 1-5As shown, in one embodiment of the present invention, a high-speed data transmission connection system is provided, including a power supply module 1, a cable module 2, a load end 3, and an intelligent thermal management unit 4. The power supply module 1 is used to provide electrical energy and / or data signals. One end of the cable module 2 is connected to the power supply module 1, and the cable module 2 has at least two independent power transmission paths 5. The load end 3 is connected to the other end of the cable module 2 and is used to receive electrical energy and / or data signals. The intelligent thermal management unit 4 is integrated into the load end 3 and / or the power supply module 1. The intelligent thermal management unit 4 includes a temperature sensing module 41, a micro control module 42, and a path switching execution module 43. The temperature sensing module 41 is deployed at the electrical connection points of each power transmission path 5 and is used to collect the temperature data of the path in real time. The micro control module 42 is connected to the temperature sensing module 41 and is used to receive and process the temperature data, and generate a path switching command according to a preset temperature threshold. The path switching execution module 43 is connected to the micro control module 42 and is used to receive the switching command and execute the switching of the physical or logical on / off states between each power transmission path 5.

[0024] This embodiment integrates an intelligent thermal management unit 4 at the power supply / load end 3 and deploys temperature sensors at the electrical connection points of each independent power transmission path 5 to achieve real-time, fine-grained monitoring of the path temperature. A micro-control module 42 quickly judges the temperature data based on preset thresholds and generates path switching commands. The path switching execution module 43 can complete physical or logical on / off switching, improving reliability and availability. It can achieve seamless switching or load reduction in the event of overheating, short circuits, or partial faults, avoiding complete link and data transmission interruptions, supporting redundant hot standby and rapid fault recovery; active protection and extended lifespan. This invention achieves intelligent temperature control and adaptive protection for power transmission links, significantly improving system reliability, safety, and operating efficiency, reducing maintenance costs, and ensuring the continuity and stability of high-speed data transmission. It features real-time suppression of hotspots and overheating accumulation, reducing the aging rate of connectors and cables, extending equipment lifespan, and decreasing maintenance frequency. Dynamic load balancing and performance optimization intelligently allocate current based on temperature and operating status, avoiding single-path overload and maintaining the stability and low bit error rate of high-speed data transmission. Enhanced safety and energy efficiency are achieved by promptly disconnecting abnormal paths to reduce fire and overcurrent risks, while also cutting off power to idle paths to reduce energy consumption. Scalability and compatibility are ensured by its modular design, facilitating deployment in different topologies and power levels, supporting remote monitoring and policy upgrades, and making it suitable for high-density, high-reliability data centers and industrial scenarios.

[0025] In the above embodiments, the temperature sensing module 41 is directly deployed at the electrical connection points of each power transmission path 5, enabling it to capture local hot spots and contact point temperature rises in real time, compensating for the blind spots of single-environment temperature measurement, and identifying potential contact defects, local overcurrent, or structural overheating problems from the source. Secondly, the micro-control module 42 performs local rapid processing of temperature data and compares it with a preset (adaptive) temperature threshold, generating precise path switching commands within millisecond-level decision time. This achieves rapid, targeted protection and load redistribution, reducing the impact on downstream high-frequency data links and maintaining signal integrity and service continuity. The path switching execution module 43 performs physical or logical on / off switching according to commands, ensuring seamless or near-seamless switching without affecting data transmission, suppressing arc generation, reducing connector wear, and extending the lifespan of key components.

[0026] Example 1 See Figure 2 As shown, the path switching execution module 43 is an electromechanical actuator, comprising a micro drive motor 431 and a transmission mechanism 432. The conductive contacts of the power transmission path 5 are connected to the transmission mechanism 432. The micro control module 42 controls the rotation of the micro drive motor 431 to drive the transmission mechanism 432, thereby changing the physical contact state between the conductive contacts and the load interface, and realizing path switching. In this embodiment, the electromechanical drive can achieve precise position and speed control, allowing slow contact or graded engagement according to a set curve, thus significantly suppressing contact transient current and arc generation, reducing contact erosion and thermal shock, and extending the life of the connector and contacts. Controllable contact force and stroke improve the reliability of contact repeatability, reduce intermittent failures caused by vibration or poor contact, and help maintain low-resistance contact and ensure the integrity of power and high-speed signal transmission. Mechanical isolation provides a clear physical disconnection state, which is more controllable than pure electronic switches in terms of isolation safety and resistance to fault propagation, facilitating fault isolation and maintenance. The micro-driver can achieve synchronous or off-peak operation of parallel contacts, supports current sharing and soft switching strategies, and coordinates with the intelligent thermal management unit 4 to improve the system's steady-state capability under high load and thermal anomalies.

[0027] Example 2 See Figure 3As shown, the path switching execution module 43 is a semiconductor switch array composed of several high-power MOSFETs or IGBTs. The back end of the power transmission path 5 is connected in series with the corresponding switching unit in the semiconductor switch array. The micro control module 42 directly controls the conduction and cutoff of each switching unit by outputting high / low level signals, thereby realizing the logical switching of the path. In this embodiment, the response speed of the semiconductor switch is much faster than that of the electromechanical actuator in Embodiment 1, and the path switching can be completed in microseconds to milliseconds, thereby minimizing the loss of data packets or link jitter caused by switching, and improving service continuity and latency stability. The logical switching can realize fine-grained state control (soft start, PWM current limiting, graded conduction, etc.), which can smooth current transfer, suppress transient voltage / current surges and reduce the risk of arcing, and protect downstream high-speed transceivers and power modules. The semiconductor solution has no mechanical wear, high reliability, low maintenance requirements, and is easy to achieve high-density, small-volume integrated design, which is beneficial to system lightweighting and mass production consistency. By using parallel / parallel grouping and active current sharing control, current sharing and redundant switching can be achieved, improving the system's fault tolerance under high loads or unit failures. Combined with temperature and current closed-loop monitoring, rapid overcurrent and overtemperature protection and automatic reconfiguration can be achieved. The semiconductor array is easily linked digitally with the micro-control module 42, supporting fault diagnosis, event logging, and remote policy distribution, enhancing automated operation and maintenance and predictive maintenance capabilities. Of course, to ensure the above effects, appropriate gate drivers, current sensing, heat dissipation, and suppression networks (such as RC absorption, TVS, or soft switching strategies) need to be designed to reduce conduction losses, control electromagnetic interference, and ensure electrical isolation and safety compliance.

[0028] The cable module 2 also includes at least one high-speed data path 21, which is isolated from the power transmission path 5 and employs a shielded differential pair structure for transmitting high-speed data signals. Specifically, the micro control module 42 of the intelligent thermal management unit 4 communicates with the power supply module 1 through the control line of the high-speed data path 21, and is used to send temperature status information to the power supply module 1 or receive scheduling commands from the power supply module 1. In this embodiment, the physical isolation and shielded differential pair structure provides excellent common-mode noise suppression and disturbance rejection, controllable impedance, and low crosstalk, ensuring that the control signal can still be reliably transmitted in environments with high electromagnetic interference and power switching, thereby preventing interference or being affected by the switching transients of the power supply path, and ensuring the signal integrity and low jitter of the main data channel. Two-way real-time communication enables the micro-control module 42 to report temperature, overcurrent, and other statuses with low latency, and to receive scheduling commands (such as soft handover, current limiting, paralleling / cutoff strategies, firmware or parameter updates) from the power supply module 1. This achieves closed-loop collaborative dynamic thermal / power management, which helps to avoid sudden thermal instability or data errors through predictive and distributed control when operating gigabit or higher speed links. Third, this channel supports precise timing coordination (e.g., handover during data idle windows), synchronous handover strategies, and tiered current limiting, thereby suppressing bit errors and retransmissions caused by transient voltage / current, and improving service continuity and link reliability.

[0029] Load end 3 is the charging port, and the power supply module 1 is the output end of the DC fast charging pile, used to realize high-power DC charging of more than 150kW. In this embodiment, under extremely high current and high power transmission conditions, the electromagnetic compatibility and signal integrity of the high-speed data path 21 are guaranteed; through physical isolation of power and signal paths, shielding of differential pairs, and suppression network design, common-mode / differential-mode interference caused by switching transients and conduction losses can be effectively suppressed, avoiding bit errors and link jitter. The thermal stress and contact resistance problems caused by high-power charging can be addressed through real-time monitoring of the intelligent thermal management unit 4 and coordinated scheduling of the power supply module 1 (soft switching, current limiting, paralleling, etc.), achieving dynamic thermal control and safety protection, extending the life of connectors and cables, and reducing the failure rate. Thirdly, the fast response and redundancy design for fast charging scenarios (semiconductor switch array or electromechanical isolation) can complete power supply reconstruction or fault isolation in milliseconds, ensuring charging continuity.

[0030] See Figure 4As shown, the temperature sensing module 41 includes at least two types of sensors: a fast-response thin-film platinum resistance temperature sensor 411 and an NTC thermistor 412 for calibration. The micro-control module 42 fuses the data from the two types of sensors to obtain an accurate temperature value. In this embodiment, the fast response of the thin-film platinum resistance temperature sensor can provide instantaneous feedback within millisecond timescales when temperature abrupt changes occur (such as a sudden increase in contact resistance, short-term overcurrent, or transient semiconductor switching), ensuring a rapid closed-loop response in thermal management and reducing contact degradation or transmission errors caused by temperature rise. The NTC thermistor 412, as a reference calibration element, can compensate for measurement deviations of the platinum resistance temperature sensor under different operating points, long-term drift, and manufacturing errors. Sensor fusion algorithms (weighted fusion, Kalman filtering, or model prediction correction) improve the accuracy and stability of temperature estimation and reduce false alarms and missed alarms. Multi-sensor fusion also enhances the robustness and fault tolerance of the system: when a sensor malfunctions or is affected by electromagnetic interference, the fusion algorithm can identify and eliminate abnormal data, ensuring the reliability of thermal control decisions. Precise temperature information enables the intelligent thermal management unit 4 to implement more refined power scheduling (dynamic current limiting, step derating, local heat dissipation triggering, or parallel reconfiguration), which protects cables, plugs, and semiconductor switches in high-power DC fast charging scenarios, while maximizing the signal integrity and continuity of high-speed data links.

[0031] See Figures 1-5As shown, a control method based on a high-speed data transmission connection system is characterized by the following steps: Step S1, temperature data of each power transmission path 5 is monitored by a temperature sensing module 41; Step S2, the micro control unit compares the monitored temperature with a preset first safety threshold T1; Step S3, if the temperature of the currently operating first path reaches or exceeds T1, the micro control module 42 immediately generates a switching command; Step S4, the switching execution module receives the command and performs a seamless switching operation: first closing the backup second path, then disconnecting the first path, so that the power load is transferred to the second path; Step S5, the first path enters an idle cooling state, and its temperature is continuously monitored until it drops below the second recovery threshold T2; Step S6, when the temperature of the second path approaches or the first path cools down to T2, the switching operation is performed again to realize the alternating operation and cooling of the two paths. This embodiment achieves active thermal management and online fault tolerance through real-time temperature monitoring of each transmission path, rapid determination based on preset thresholds, and a seamless switching strategy of "closing the backup path first and then disconnecting the operating path". This invention enhances system reliability and continuity by rapidly transferring loads in the early stages of path overheating, preventing link interruptions or device damage. It enables dynamic load distribution and thermal rotation, balancing current loads and reducing thermal stress in single paths, thereby extending cable and connector lifespan and reducing failure rates. It also improves operational safety and energy efficiency by timely isolating abnormal paths to reduce overcurrent, short-circuit, and fire risks, while disconnecting power to idle paths to save energy. Furthermore, it reduces maintenance costs and downtime frequency, supports remote monitoring and strategy adjustments, and facilitates preventative maintenance. It ensures power supply and data signal continuity during switching, reduces bit errors and performance jitter, and is easy to integrate with existing redundant architectures. It is suitable for high-density data centers, communication systems, and industrial power supplies. This invention achieves intelligent temperature control, adaptive protection, and high-availability operation for high-speed data transmission connection systems.

[0032] The seamless switching operation in step S4 operates at millisecond intervals, ensuring continuous power transmission and preventing arcing caused by current interruptions. In this embodiment, millisecond-level switching ensures continuous power transmission, avoiding significant current interruptions during path switching, thereby effectively suppressing arcing during contact separation and reducing connector erosion, conductor damage, and fire hazards caused by arcing. Fast switching significantly reduces voltage dips and transient spikes, minimizing impact on downstream loads and electronic equipment, maintaining signal integrity and bit error rate in data transmission links, and ensuring service continuity and QoS for high-density data centers and communication equipment. Millisecond-level switching reduces the probability of protection device malfunctions and system reclosing triggers, avoiding unnecessary system shutdowns or redundant path switching, improving availability, and extending the lifespan of connectors and switching components. The speed level facilitates the implementation of hot-swapping strategies, achieving online cooling and load balancing without sacrificing power supply continuity, thereby reducing long-term thermal stress and maintenance frequency and costs.

[0033] Before step S1, an initialization step is included: the microcontroller module 42 performs a power-on self-test, verifies the status of each sensor and actuator, and defaults to using the path with stronger current carrying capacity as the first path. In this embodiment, the power-on self-test and sensor / actuator verification can detect hardware faults, communication anomalies, or measurement deviations in a timely manner before the system is put into operation, avoiding transient instability or malfunctions caused by powering on faulty components. Defaulting to using the path with stronger current carrying capacity as the first path provides greater redundancy and thermal capacity in the initial state, reducing the risk of localized heating and arcing caused by overload or contact resistance during initial power-on, and reducing mechanical and electrical stress on connectors and switches. When the main path has been verified and is a high-current-carrying-capacity path, the risk of switching operations and the impact on downstream loads are further reduced, thereby ensuring power supply continuity and signal integrity during switching.

[0034] The preset temperature thresholds T1 and T2 are not fixed values; they are adaptive values ​​dynamically adjusted by the micro-control module 42 based on the real-time collected total current, ambient temperature, and historical temperature rise data. In this embodiment, the adaptive thresholds can automatically relax or tighten temperature limits based on actual operating conditions. Under high load and good heat dissipation conditions, higher safe operating currents are allowed, thereby improving the system's load-bearing capacity and transmission bandwidth utilization. Conversely, in harsh environments or when components are aging, the thresholds are proactively lowered to trigger protection or load reduction in advance, reducing the risk of thermal runaway and arcing. Dynamic thresholds reduce false alarms and false switching caused by fixed thresholds, reduce unnecessary millisecond-level switching frequency, reduce interference with signal integrity and service continuity, and improve system availability and QoS. By combining historical temperature rise curves and real-time data, the module can achieve more accurate thermal life prediction and predictive maintenance, extending the lifespan of key components such as connectors, switches, and PCBs while reducing maintenance costs.

[0035] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A high-speed data transmission connection system, characterized in that: The system includes a power supply module, a cable module, a load terminal, and an intelligent thermal management unit. The power supply module provides electrical energy and data signals. One end of the cable module is connected to the power supply module. The cable module internally has at least two independent power transmission paths, including a currently operating first path and a backup second path. The cable module also includes at least one high-speed data path, which is isolated from the power transmission paths and uses a shielded differential pair structure for transmitting high-speed data signals. The load terminal is connected to the other end of the cable module and receives electrical energy and / or data signals. The intelligent thermal management unit is integrated within the load terminal and / or the power supply module. The intelligent thermal management unit includes a temperature sensing module, a micro control module, and a path switching execution module. The temperature sensing module is installed at the electrical connection points of each power transmission path and is used to collect the temperature data of the path in real time. The micro control module is connected to the temperature sensing module and is used to receive and process the temperature data, and generate a path switching command based on a preset temperature threshold. The path switching execution module is connected to the micro control module and is used to receive the switching command and execute the switching of the physical or logical on / off states between each power transmission path. When the temperature of the currently operating first path reaches or exceeds the first safety threshold T1, the micro control module generates the path switching command. The path switching execution module first closes the backup second path and then disconnects the first path, transferring the power load to the second path. After the first path is disconnected, it enters an idle cooling state. The temperature sensing module continuously monitors the temperature of the first path until it drops below the second recovery threshold T2. When the temperature of the first path drops below the second recovery threshold T2, the micro control module controls the path switching execution module to perform the switching operation again, transferring the power load from the second path to the first path, thereby realizing the alternating operation and cooling of the first and second paths.

2. The high-speed data transmission connection system according to claim 1, characterized in that: The path switching execution module is an electromechanical actuator, which includes a micro drive motor and a transmission mechanism; the conductive contacts of the power transmission path are connected to the transmission mechanism; the micro control module controls the rotation of the micro drive motor to drive the transmission mechanism, thereby changing the physical contact state between the conductive contacts and the load interface, and realizing path switching.

3. The high-speed data transmission connection system according to claim 1, characterized in that: The path switching execution module is a semiconductor switch array, composed of several high-power MOSFETs or IGBTs; the back end of the power transmission path is connected in series with the corresponding switching unit in the semiconductor switch array; the micro control module directly controls the conduction and cutoff of each switching unit by outputting high / low level signals to realize the logic switching of the path.

4. The high-speed data transmission connection system according to claim 1, characterized in that: The load end is a charging port, and the power supply module is the output end of a DC fast charging pile, used to achieve high-power DC charging of more than 150kW.

5. The high-speed data transmission connection system according to claim 1, characterized in that: The temperature sensing module includes at least two types of sensors: a thin-film platinum resistance temperature sensor with fast response and an NTC thermistor for calibration. The micro control module fuses the data from the two types of sensors to obtain an accurate temperature value.

6. A control method based on the high-speed data transmission connection system according to any one of claims 1 to 5, characterized in that: Includes the following steps: Step S1: Monitor the temperature data of each power transmission path through the temperature sensing module; In step S2, the micro control unit compares the monitored temperature with a preset first safety threshold T1; Step S3: If the temperature of the currently operating first channel reaches or exceeds T1, the micro control module immediately generates a switching command. Step S4: Receive the instruction through the switching execution module and perform a seamless switching operation: first close the backup second path, then open the first path, so that the power load is transferred to the second path. The time interval of the seamless switching operation is on the order of milliseconds to ensure the continuity of power transmission and avoid current interruption that could cause an electric arc. In step S5, the first channel enters an idle cooling state, and its temperature is continuously monitored until it drops below the second recovery threshold T2. Step S6: When the first channel cools down to below T2, the switching operation is performed again to realize the alternating operation and cooling of the two channels; Wherein, the first safety threshold T1 and the second recovery threshold T2 are adaptive values ​​that are dynamically adjusted by the micro control module based on the real-time collected total current, ambient temperature and historical temperature rise data.

7. The control method for the high-speed data transmission connection system according to claim 6, characterized in that: Before step S1, an initialization step is also included: the micro control module powers on and performs a self-test, verifies the status of each sensor and actuator, and defaults to enabling the path with stronger current carrying capacity as the first path.

Images