一种半导体二极管全自动贴片固晶机
By designing an alternating work unit and a motor-driven fully automatic semiconductor diode chip bonding machine, seamless alternation between dispensing and bonding is achieved, solving the problems of long waiting time, significant vibration impact, and complex machine adjustment of traditional bonding equipment, thus improving production efficiency and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JIANGSU SHUNYE ELECTRONICS CO LTD
- Filing Date
- 2025-10-17
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional die bonders cannot perform dispensing and die bonding processes simultaneously, leading to increased equipment waiting time, vibration affecting accuracy and stability, high production line equipment costs and susceptibility to failure, complex machine setup, and single-point failure causing complete machine shutdown.
Design a fully automated semiconductor diode chip bonding machine. It adopts an alternating work unit to perform alternating dispensing and die bonding operations on substrates at two stations, achieving seamless alternation between dispensing and die bonding, reducing processing waiting time. The machine also uses a crossbeam and motor drive to achieve head repositioning and substrate transport.
It achieves seamless alternation between dispensing and die bonding, reduces processing waiting time, improves equipment stability and precision, reduces vibration impact, simplifies equipment setup, and avoids machine downtime caused by single-point failure.
Smart Images
Figure CN121335458B_ABST