Method for cleaning v-groove aluminum chips based on aluminum substrate

Abstract

The present disclosure provides an aluminum substrate-based V-cut aluminum scrap cleaning method; the aluminum substrate-based V-cut aluminum scrap cleaning method comprises: obtaining an aluminum substrate; performing a half V-cut operation on the aluminum substrate to form an auxiliary edge groove on the aluminum substrate; performing a windowing operation on the aluminum substrate to form a scrap window on one side of the auxiliary edge groove on the aluminum substrate; performing a V-cut operation on the aluminum substrate by a cutter assembly to form a cut-through groove on the other side of the auxiliary edge groove on the aluminum substrate; driving the cutter assembly to perform a pushing scrap operation towards the scrap window to make the cut-through groove extend towards the scrap window and intersect with the auxiliary edge groove; performing a cutter lifting and scrap cleaning operation on the cutter assembly, and using inertia to make the cutter assembly continue to move towards the scrap window when the cutter assembly is lifted, thereby pushing the aluminum scrap to the scrap window, and finally making the obtained aluminum scrap cleaning plate have less aluminum scrap residue, thereby reducing the probability of short circuit and scrap during use of the finished product.

Description

Technical Field

[0001] This disclosure relates to the technical field of aluminum substrate processing, and in particular to a V-cut aluminum chip cleaning method based on aluminum substrates. Background Technology

[0002] Traditional methods of processing aluminum substrates using CNC machining or die stamping suffer from complex processes and low material utilization. Therefore, most manufacturers employ a process similar to the V-cutting process described in Chinese patent document CN106271663A. This process divides the aluminum substrate into multiple aluminum sub-regions by sequentially performing half-V-cutting and V-penetration operations, thereby simplifying processes and improving panel utilization. However, because the V-penetration operation requires auxiliary grooves formed by the half-V-cutting operation on the aluminum substrate as finishing edges, aluminum chips generated during the V-penetration operation easily accumulate in these grooves during the finishing process. If these aluminum chips mix with the solder paste during the solder paste printing process, it can cause short circuits and render the aluminum substrate unusable. Summary of the Invention

[0003] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a V-cut aluminum chip cleaning method based on an aluminum substrate with less aluminum chip residue.

[0004] The purpose of this disclosure is achieved through the following technical solution: A method for cleaning aluminum chips by V-cutting based on an aluminum substrate includes: Obtain the aluminum substrate; The aluminum substrate is subjected to a half-V cut to form an auxiliary edge groove on the aluminum substrate; A windowing operation is performed on the aluminum substrate to form a chip-leaking window on one side of the auxiliary side groove on the aluminum substrate; A V-cutting operation is performed on the aluminum substrate by a cutting tool assembly to form a cutting groove on the aluminum substrate on the other side of the auxiliary side groove. The cutting blade assembly is driven to move and push chips toward the chip window, so that the cutting groove extends toward the chip window and intersects with the auxiliary side groove; The cutting blade assembly is lifted to remove chips, thereby obtaining an aluminum chip cleaning plate.

[0005] In some embodiments, the blade assembly is lifted to remove chips, specifically including the following steps: The cutting blade assembly is gradually lifted away from the aluminum substrate to form an aluminum chip guide groove between the auxiliary side groove and the chip leakage window; wherein the aluminum chip guide groove is connected to the cutting groove and the auxiliary side groove, and the depth of the aluminum chip guide groove gradually decreases from the cutting groove to the chip leakage window.

[0006] In some embodiments, the step of gradually lifting the cutter assembly away from the aluminum substrate in a direction opposite to the aluminum substrate to form an aluminum chip guiding groove between the cutting groove and the chip leakage window specifically includes the following steps: The upper and lower cutting blades are driven to move in opposite directions and move away from the aluminum substrate at the same time, so that the upper cutting blade forms an aluminum chip guide groove on the upper surface of the aluminum substrate and another aluminum chip guide groove on the lower surface of the aluminum substrate.

[0007] In some embodiments, the distance between the chip-leaking window and the auxiliary side groove is 1.5 mm to 3 mm.

[0008] In some embodiments, the V-cutting operation performed on the aluminum substrate using a cutting tool assembly to form a cutting groove on the aluminum substrate on the other side of the auxiliary side groove specifically includes the following steps: Adjust the aluminum substrate to be positioned between the upper and lower cutting blades; An upper V-groove is created on the aluminum substrate above the other side of the auxiliary side groove using the upper cutting tool, resulting in an upper groove. The lower cutting blade performs a lower V-groove operation on the aluminum substrate below the other side of the auxiliary side groove to obtain a lower cutting groove; wherein the upper cutting groove is connected to the lower cutting groove to form the through-cut groove.

[0009] In some embodiments, the upper V-groove operation is performed simultaneously with the lower V-groove operation; and / or, The upper cutting blade is located in front of the upper cutting blade, so that the cutting edge of the upper cutting blade is offset from the cutting edge of the upper cutting blade by at least 12mm.

[0010] In some embodiments, the upper cutter is a first V-CUT cutter that rotates clockwise; and / or, The lower cutter is a second V-CUT cutter that rotates counterclockwise.

[0011] In some embodiments, the depth of the upper groove is greater than the depth of the lower groove.

[0012] In some embodiments, the step of opening a window on the aluminum substrate to form a chip-leaking window on one side of the auxiliary side groove specifically includes the following steps: The upper surface of the aluminum substrate is scribing to form a window reference frame on one side of the auxiliary side groove; wherein the window reference frame includes a first segment and a second segment, the first segment and the second segment enclosing each other to serve as the edge contour of the chip-leaking window. The first segment is subjected to laser pre-cutting to form folding scratches on the upper surface of the aluminum substrate; wherein, the first segment is the part of the window reference frame near the auxiliary edge groove; The second segment is laser-cut to cut through the aluminum substrate to obtain the movable part; The movable part is folded along the folding scratch towards the auxiliary side groove so that the movable part fits against the lower surface of the aluminum substrate, and the chip-leaking window is obtained.

[0013] An aluminum chip cleaning plate is prepared by the V-cut aluminum chip cleaning method based on an aluminum substrate according to any of the above embodiments.

[0014] The aforementioned V-cut aluminum chip cleaning method based on an aluminum substrate involves performing a V-cut operation on the acquired aluminum substrate and driving the cutting blade assembly towards the chip-discharging window. The cutting blade assembly pushes the aluminum chips generated during the V-cut operation towards the chip-discharging window. When the cutting groove intersects with the auxiliary edge groove of the upper half of the V-cut operation on the aluminum substrate, the cutting blade assembly enters the auxiliary edge groove, squeezing out the aluminum chips accumulated thereto and moving them to the process edge area, thus reducing the amount of aluminum chips remaining in the auxiliary edge groove. Afterwards, the cutting blade assembly is lifted to clean the chips, using inertia to continue moving towards the chip-discharging window, pushing the aluminum chips towards it. Ultimately, this results in less aluminum chip residue on the cleaned aluminum chip plate, reducing the probability of short circuits and scrapping during product use. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a flowchart of a V-cut aluminum chip cleaning method based on an aluminum substrate according to an embodiment of the present disclosure; Figure 2 for Figure 1 A schematic diagram showing the state of V-pass operation on an aluminum substrate. Figure 3 for Figure 2 The enlarged view shown at point A in the middle; Figure 4 For the process Figure 1 A schematic diagram of the aluminum chip cleaning plate obtained by the method shown. Figure 5 for Figure 4 The enlarged view shown at point B in the middle; Figure 6 For the process Figure 1 A schematic diagram of the vertical cross-section of the aluminum chip cleaning plate obtained by the method shown. Figure 7 This is a partial vertical cross-sectional view of an aluminum chip cleaning plate obtained by a V-cut aluminum chip cleaning method based on an aluminum substrate according to another embodiment of this disclosure. Figure 8 For the process Figure 1 A schematic diagram of a partial transverse cross-section of the aluminum chip cleaning plate obtained by the method shown.

[0017] Figure label: 100. Aluminum substrate; 110. Aluminum base general area; 1110. Aluminum base sub-area; 120. Process edge area; 101. Auxiliary edge groove; 102. Chip leakage window; 1021. Folding scratch; 1022. Moving part; 1023. Inertia buffer section; 103. Cut-through groove; 1031. Upper cut groove; 1032. Lower cut groove; 104. Aluminum chip guide groove; 1111. Copper foil circuit layer; 1112. Thermally conductive insulating layer; 1113. Aluminum base layer; 200. Cutting blade assembly; 210. Upper cutting blade; 220. Lower cutting blade; 300. Aluminum shavings cleaning plate; 310. V-shaped residue. Detailed Implementation

[0018] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0019] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0021] This invention relates to a V-cut aluminum chip cleaning method based on an aluminum substrate. In one embodiment, the V-cut aluminum chip cleaning method based on an aluminum substrate includes: obtaining an aluminum substrate; performing a half-V-cut operation on the aluminum substrate to form an auxiliary side groove on the aluminum substrate; performing a windowing operation on the aluminum substrate to form a chip-leaking window on one side of the auxiliary side groove on the aluminum substrate; performing a V-piercing operation on the aluminum substrate using a cutting blade assembly to form a cutting-through groove on the aluminum substrate on the other side of the auxiliary side groove; driving the cutting blade assembly to advance and push chips towards the chip-leaking window, so that the cutting-through groove extends towards the chip-leaking window and intersects with the auxiliary side groove; and performing a lifting chip-removing operation on the cutting blade assembly to obtain an aluminum chip cleaning plate.

[0022] It is understandable that by performing a V-cutting operation on the obtained aluminum substrate and driving the cutting blade assembly to move towards the chip-leaking window, the aluminum chips generated during the V-cutting operation can be pushed towards the chip-leaking window by the cutting blade assembly. When the cutting groove intersects with the auxiliary edge groove of the upper half of the V-cutting operation on the aluminum substrate, the cutting blade assembly enters the auxiliary edge groove, thereby squeezing out the aluminum chips accumulated in the auxiliary edge groove to the process edge area, thus reducing the residue of aluminum chips in the auxiliary edge groove. Afterwards, the cutting blade assembly is lifted to clear chips. Using inertia, the cutting blade assembly continues to move towards the chip-leaking window when it is lifted, thereby pushing the aluminum chips towards the chip-leaking window. Ultimately, the aluminum chip cleaning board has less aluminum chip residue, thereby reducing the probability of short circuit and scrap when the finished product is used.

[0023] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments: Please see Figure 1 An embodiment of a V-cut aluminum chip cleaning method based on an aluminum substrate includes some or all of the following steps.

[0024] S2, Obtain the aluminum substrate; Please see Figure 2 and Figure 3 In this embodiment, the aluminum substrate 100 includes, from top to bottom, a copper foil circuit layer 1111, a thermally conductive insulating layer 1112, and an aluminum base layer 1113. For example only, the copper foil circuit layer 1111 has a thickness of 0.035 mm, the thermally conductive insulating layer 1112 has a thickness of 0.15 mm, and the aluminum base layer 1113 has a thickness of 1.3 mm. Due to tolerances in each layer, the total thickness of the aluminum substrate 100 is 1.6 mm.

[0025] S4, Perform a half-V cut on the aluminum substrate to form an auxiliary edge groove on the aluminum substrate; Please see Figure 2 and Figure 4In this embodiment, by performing a half-V-cut operation on the obtained aluminum substrate 100, an auxiliary side groove 101 can be formed on the aluminum substrate 100. The auxiliary side groove 101 can divide the surface of the aluminum substrate 100 into an aluminum base area 110 and a process side area 120. Specifically, the aluminum base area 110 is located inside the auxiliary side groove 101, while the process side area 120 is located outside the auxiliary side groove 101. The process side area 120 on the aluminum substrate 100 is only used to assist in the handling process during production. The auxiliary side groove 101 is processed into a V-shaped blind groove, which reduces the connection force between the aluminum base area 110 and the process side area 120, making it easier for operators to break the aluminum substrate 100 along the auxiliary side groove 101 to quickly remove the process side area 120 on the aluminum substrate 100.

[0026] S6, Perform a windowing operation on the aluminum substrate to form a chip-leaking window on one side of the auxiliary side groove on the aluminum substrate. Please see Figure 2 and Figure 4 In this embodiment, after the aluminum base region 110 and the process edge region 120 on the surface of the aluminum substrate 100 are separated by the half-V-cut operation, a chip-leaking window 102 can be formed on one side of the auxiliary edge groove 101 by performing a windowing operation on the aluminum substrate 100. Specifically, the chip-leaking window 102 is formed on the process edge region 120 of the aluminum substrate 100 and is distributed close to the auxiliary edge groove 101. The chip-leaking window 102 can be rectangular, circular, or triangular in shape.

[0027] S8, V-piercing operation is performed on the aluminum substrate by the cutter assembly to form a piercing groove on the aluminum substrate on the other side of the auxiliary side groove; Please see Figure 2 In this embodiment, after a chip-leaking window 102 is formed on one side of the auxiliary side groove 101, a V-piercing operation is performed on the aluminum substrate 100 by the cutting tool assembly 200, which allows a cutting groove 103 to be formed on the side of the auxiliary side groove 101 on the aluminum substrate 100 opposite to the chip-leaking window 102. Please refer to... Figure 4 Specifically, since the chip-leaking window 102 is opened in the process edge area 120, the through-cut groove 103 is opened in the aluminum substrate area 110. The through-cut groove 103 is a through groove used as a cutting line of the aluminum substrate 100.

[0028] S10, drive the cutter assembly to move towards the chip window to push the chip, so that the cutting groove extends toward the chip window and intersects with the auxiliary side groove; Please see Figure 2 and Figure 4In this embodiment, when the cutting assembly 200 performs a V-piercing operation on the aluminum substrate 100, it is driven to move towards the chip-discharging window 102, causing the cutting assembly 200 to move in the direction Q towards the chip-discharging window 102. Simultaneously, it pushes the aluminum chips generated by the aluminum substrate 100 during the V-piercing operation towards the chip-discharging window 102. As the cutting groove 103 extends towards the chip-discharging window 102 in the direction Q, the aluminum chips accumulate in that direction. When the cutting groove 103 intersects with the auxiliary side groove 101, the cutting assembly 200 enters the auxiliary side groove 101, thereby extruding the accumulated aluminum chips into the process edge area 120, reducing the amount of aluminum chips remaining in the auxiliary side groove 101. The cutting groove 103 divides the total aluminum substrate area 110 into multiple aluminum substrate sub-areas 1110, that is, it separates adjacent aluminum substrate sub-areas 1110.

[0029] S12, perform a blade lifting and chip removal operation on the cutter assembly to obtain an aluminum chip cleaning plate.

[0030] Please see Figure 2 In this embodiment, after the aluminum chips are extruded from the auxiliary side groove 101, the cutting blade assembly 200 is lifted and chip-clearing is performed, causing the cutting blade assembly 200 to gradually move away from the aluminum substrate 100, thus retracting the cutting blade assembly 200. Simultaneously, the cutting blade assembly 200 continues to move towards the chip-draining window 102 under inertia, thereby acting on the aluminum chips on the process edge area 120, causing the aluminum chips to fall into the chip-draining window 102 and be cleaned up. This reduces the amount of aluminum chips remaining on the aluminum substrate 100, resulting in an aluminum chip cleaning plate 300. The aluminum chip cleaning plate 300 has even less aluminum chip residue, thereby reducing the probability of short circuits and scrapping during the use of the finished product.

[0031] It is understood that by performing a V-cutting operation on the obtained aluminum substrate 100 and driving the cutting blade assembly 200 to move towards the chip-discharging window 102, the aluminum chips generated by the V-cutting operation on the aluminum substrate 100 can be pushed towards the chip-discharging window 102 by the cutting blade assembly 200. When the cutting groove 103 intersects with the upper half of the V-cutting operation auxiliary side groove 101 on the aluminum substrate 100, the cutting blade assembly 200 enters into the auxiliary side groove 101, thereby squeezing out the aluminum chips accumulated in the auxiliary side groove 101 to the process edge area 120, thereby reducing the residue of aluminum chips in the auxiliary side groove 101. Then, the cutting blade assembly 200 is lifted to clean the chips. Using inertia, the cutting blade assembly 200 continues to move towards the chip-discharging window 102 when it is lifted, thereby pushing the aluminum chips to the chip-discharging window 102. Finally, the aluminum chip cleaning plate 300 has less aluminum chip residue, thereby reducing the probability of short circuit and scrap when the finished product is used. Among them, according to statistics, the failure rate of aluminum shavings residue in aluminum substrate 100 decreased from 85.3% to 3.5%.

[0032] Please see Figure 2 and Figure 5 In some embodiments, the cutter assembly 200 is lifted to remove chips, specifically including the following steps: The blade assembly 200 is gradually lifted away from the aluminum substrate 100 to form an aluminum chip guide groove 104 between the auxiliary side groove 101 and the chip leakage window 102. The aluminum chip guide groove 104 is connected to the cutting groove 103 and the auxiliary side groove 101, and the depth of the aluminum chip guide groove 104 gradually decreases from the cutting groove 103 to the chip leakage window 102.

[0033] It is understood that by gradually moving the cutter assembly 200 away from the aluminum substrate 100, the cutter assembly 200 is gradually lifted. Due to inertia, the cutter assembly 200 will continue to move towards the chip-extraction window 102 during the lifting process, thereby creating an aluminum chip guide groove 104 on the aluminum substrate 100. The aluminum chip guide groove 104 will be located at the end of the cutting groove 103 and will penetrate the auxiliary side groove 101, so that the aluminum chip guide groove 104 can connect the cutting groove 103 and the auxiliary side groove 101, so that the aluminum chips in the cutting groove 103 and the aluminum chips in the auxiliary side groove 101 will move along the aluminum chip guide groove 104 under the push of the cutter assembly 200. Meanwhile, as the lifting distance of the cutter assembly 200 increases, the depth of the aluminum chip guiding groove 104 opened by the cutter assembly 200 on the aluminum substrate 100 will gradually decrease, thereby causing the depth of the aluminum chip guiding groove 104 to gradually decrease from the cutting groove 103 to the chip leakage window 102. That is, the aluminum chip guiding groove 104 gradually extends towards the surface of the aluminum substrate 100, so that the aluminum chips can be carried out to the surface of the aluminum substrate 100 under the guidance of the aluminum chip guiding groove 104. The aluminum chips can fall into the chip leakage window 102 more under the action of inertia, so that less aluminum chips remain on the aluminum chip cleaning plate 300.

[0034] Please see Figure 2 and Figure 6 In some embodiments, the cutter assembly 200 is gradually lifted away from the aluminum substrate 100 to form an aluminum chip guide groove 104 between the cutting groove 103 and the chip leakage window 102, specifically including the following steps: The upper cutter 210 and the lower cutter 220 are driven to move in opposite directions and move away from the aluminum substrate 100 at the same time, so that the upper cutter 210 forms an aluminum chip guide groove 104 on the upper surface of the aluminum substrate 100 and another aluminum chip guide groove 104 on the lower surface of the aluminum substrate 100.

[0035] It is understood that the cutting assembly 200 includes an upper cutting blade 210 and a lower cutting blade 220. In this embodiment, the upper cutting blade 210 cuts the upper surface of the aluminum substrate 100, and the lower cutting blade 220 cuts the lower surface of the aluminum substrate 100, thereby creating a cutting groove 103 on the aluminum substrate 100. The cutting assembly 200 is gradually moved away from the aluminum substrate 100, that is, the upper cutting blade 210 and the lower cutting blade 220 gradually move in opposite directions. Specifically, the upper cutting blade 210 is gradually raised in the direction away from the upper surface of the aluminum substrate 100, thereby forming an aluminum chip guiding groove 104 on the upper surface of the aluminum substrate 100. At the same time, the lower cutting blade 220 is gradually lowered in the direction away from the lower surface of the aluminum substrate 100, thereby forming another aluminum chip guiding groove 104 on the lower surface of the aluminum substrate 100. The aluminum chip guiding grooves 104 can respectively guide the aluminum chips formed on the upper and lower surfaces of the aluminum substrate 100 to move towards the chip leakage window 102. Furthermore, a V-shaped residual portion 310 is formed on the cross-section of the aluminum substrate 100 between the two aluminum chip guide grooves 104. The cross-sectional thickness of the V-shaped residual portion 310 gradually decreases from the chip leakage window 102 toward the auxiliary side groove 101, thereby helping the operator to break the aluminum substrate 100 along the auxiliary side groove 101.

[0036] Typically, in order to improve the utilization rate of the aluminum substrate 100, the process edge area 120 is usually set to a width of up to 12mm, that is, the distance between the auxiliary edge groove 101 and the outer edge of the aluminum substrate 100 is at most 12mm. When the cutting blade assembly 200 is lifted to remove chips, the cutting blade assembly 200 can easily penetrate the chip window 102 due to the lifting delay, and cut the entire process edge area 120 under the action of inertia, so that the aluminum substrate 100 will fall apart.

[0037] Please see Figure 2 and Figure 7 To reduce the occurrence of the process edge area 120 being cut off, in some embodiments, the distance G between the chip-extracting window 102 and the auxiliary edge groove 101 is 1.5 mm to 3 mm.

[0038] It is understood that by maintaining a distance of 1.5mm to 3mm between the chip-extraction window 102 and the auxiliary side groove 101, an inertial buffer section 1023 can be formed on the aluminum substrate 100 during the lifting process of the cutting assembly 200. The inertial buffer section 1023 can provide resistance to the continued movement of the cutting assembly 200, thereby reducing the occurrence of the cutting assembly 200 penetrating the chip-extraction window 102, and further reducing the risk of the cutting assembly 200 cutting through the entire process edge area 120. Specifically, by setting the distance G between the chip-extraction window 102 and the auxiliary side groove 101 to 1.5mm to 3mm, it is possible not only to avoid the cutting assembly 200 cutting through the chip-extraction window if the distance is too short, but also to avoid the aluminum chips not being pushed to the chip-extraction window 102 if the distance is too long.

[0039] Furthermore, to enhance the inertial buffering effect of the inertial buffer section 1023 on the cutter assembly, thereby reducing the occurrence of the cutter assembly 200 penetrating the chip-extraction window 102, in some embodiments, the step of opening a window on the aluminum substrate 100 to form a chip-extraction window 102 on one side of the auxiliary side groove 101 specifically includes the following steps: A scribing operation is performed on the upper surface of the aluminum substrate 100 to form a window reference frame on one side of the auxiliary side groove 101 on the aluminum substrate 100; wherein the window reference frame includes a first segment and a second segment, the first segment and the second segment enclosing each other to serve as the edge contour of the chip-leaking window 102. Please see Figure 7 In this embodiment, the upper surface of the aluminum substrate 100 is a copper foil circuit layer 1111. By performing a scribing operation on the upper surface of the aluminum substrate 100, that is, drawing the window opening reference frame on the surface of the copper foil circuit layer 1111, the window opening reference frame can be formed by the first segment and the second segment that enclose each other. The window opening reference frame is the edge outline of the chip-leaking window 102. That is, the chip-leaking window 102 can be obtained by opening a window on the aluminum substrate 100 along the window opening reference frame.

[0040] The first segment is laser pre-cut to form a folding scratch 1021 on the upper surface of the aluminum substrate 100; wherein the first segment is the part of the window reference frame near the auxiliary side groove 101; Please see Figure 7 In this embodiment, since the first segment is the part of the window reference frame near the auxiliary side groove 101, the first segment is subjected to laser pre-cutting operation, that is, the copper foil circuit layer 1111 and the thermally conductive insulating layer 1112 of the aluminum substrate 100 are cut along the first segment by laser, while retaining all or part of the thickness of the aluminum base layer 1113. In this way, a folding scratch 1021 can be formed on the upper surface of the aluminum substrate 100. The folding scratch 1021 is a blind groove structure. The folding scratch 1021 is the edge line of the chip leakage window 102 near the auxiliary side groove 101.

[0041] The second segment is laser-cut to cut through the aluminum substrate 100 to obtain the movable part 1022; Please see Figure 7 In this embodiment, the second segment is the other part on the window opening reference frame, that is, the second segment includes the part on the window opening reference frame that is away from the auxiliary side groove 101. The second segment is laser-cut, that is, the copper foil circuit layer 1111, the thermally conductive insulating layer 1112 and the aluminum base layer 1113 of the aluminum substrate 100 are cut along the second segment. In this way, the aluminum substrate 100 can be cut through along the second segment to obtain the movable part 1022. The movable part 1022 is the part corresponding to the chip-leaking window 102 on the aluminum substrate 100.

[0042] The movable part 1022 is folded along the folding scratch 1021 toward the auxiliary side groove 101 so that the movable part 1022 fits against the lower surface of the aluminum substrate 100, and the chip-leaking window 102 is obtained.

[0043] Please see Figure 7 In this embodiment, since the folding scratch 1021 is a blind groove structure, the aluminum substrate 100 still retains part of the thickness of the aluminum base layer 1113 at the folding scratch 1021. The movable part 1022 is folded along the folding scratch 1021 towards the auxiliary side groove 101. The ductility of the aluminum base layer 1113 allows the movable part 1022 to be folded downwards onto the lower surface of the aluminum substrate 100, so that the movable part 1022 overlaps with the inertial buffer section 1023, thereby improving the buffering effect of the inertial buffer section 1023 on the cutter assembly 200. Moreover, after laser cutting, the edge of the movable part 1022 will have residual molten copper and aluminum. At this time, the molten copper or aluminum will also adhere to the lower surface of the aluminum substrate 100. After the copper and aluminum solidify, the movable part 1022 can form a reliable connection with the inertial buffer section 1023. After folding the movable part 1022, the cutout formed in the aluminum substrate 100 is the chip-leaking window 102.

[0044] It is understood that by pre-cutting the portion of the window opening reference frame near the auxiliary edge groove 101, a portion of the aluminum base layer 1113 of thickness can be retained at the folding scratch 1021 on the aluminum substrate 100. Then, by cutting through other portions of the window opening reference frame with a laser, a movable portion 1022 can be formed on the aluminum substrate 100. The movable portion 1022 can be folded along the folding scratch 1021 onto the lower surface of the aluminum substrate 100, thereby allowing the movable portion 1022 to overlap with the inertial buffer section 1023, thereby improving the buffering effect of the inertial buffer section 1023 on the cutter assembly 200.

[0045] Typically, when the laser cuts the copper foil circuit layer 1111 and the aluminum base layer 1113, due to the low melting point and high fluidity of copper and aluminum, the molten copper and aluminum easily adhere to the bottom of the folding scratch 1021 to form burrs. After the movable part 1022 is folded along the folding scratch 1021, the burrs at the bottom of the folding scratch 1021 will be exposed. The exposed burrs will intercept the aluminum chips moving towards the chip leakage window 102, resulting in a large amount of aluminum chips remaining at the edge of the chip leakage window 102.

[0046] In some embodiments, the laser pre-cutting operation on the first segment also includes the following steps: The first segment is adsorbed using a suction device.

[0047] It is understandable that when the first segment is laser pre-cut, the copper foil circuit layer 1111 and the aluminum base layer 1113 of the aluminum substrate 100 will melt. At this time, the first segment is simultaneously adsorbed by the suction device, which can quickly adsorb the liquid metal formed by the melting of the copper foil circuit layer 1111 and the aluminum base layer 1113, thereby reducing the burrs formed by the molten copper and aluminum at the bottom of the folding scratch 1021.

[0048] Typically, because the copper foil circuit layer 1111 and aluminum base layer 1113 of the aluminum substrate 100 have high reflectivity, a large amount of laser light will be reflected in all directions during laser cutting. The suction equipment generally uses plastic suction nozzles, which are easily damaged and leaked by the reflected laser light, thus affecting the adsorption effect on molten copper and aluminum.

[0049] To reduce the impact of reflected laser light on the suction operation of the suction device, in one embodiment, the plastic nozzle of the suction device is covered with a reflective protective sleeve. The upper surface of the aluminum substrate 100 is scribing to form a window reference frame on one side of the auxiliary side groove 101 on the aluminum substrate 100. This process specifically includes the following steps: The first and second segments are drawn using light-absorbing paint to obtain the window reference frame.

[0050] It is understandable that by using light-absorbing paint to paint the first and second sections, when laser pre-cutting is performed on the first section and laser cutting is performed on the second section, more of the laser light can be absorbed into the aluminum substrate 100. This reduces the reflection of the laser light onto the plastic suction nozzle of the suction device. Furthermore, by covering the plastic suction nozzle with a reflective protective sleeve, the laser light reflected onto the plastic suction nozzle can be further reflected back, thereby reducing damage to the plastic suction nozzle and improving the stability of the suction operation. The light-absorbing paint can be black ink.

[0051] Typically, suction equipment uses a small suction pump. Molten metal enters the small suction pump through the plastic nozzle and then adheres to the impeller. As the metal accumulates on the impeller, its rotation is affected.

[0052] To reduce the impact of molten metal on the impeller, in some embodiments, the suction device includes a plastic nozzle, a condenser bend, and a suction pump body connected in sequence. A first end of the condenser bend is detachably connected to the plastic nozzle, and a second end of the condenser bend is detachably connected to the suction pump body.

[0053] As is understandable, the impeller is located within the suction pump body. Since the plastic suction nozzle is connected to the suction port of the suction pump body via a condenser bend, the molten metal entering through the plastic suction nozzle can first be condensed in the condenser bend, thereby reducing the accumulation of molten metal within the impeller of the suction pump body. Simultaneously, because the first end of the condenser bend is detachably connected to the plastic suction nozzle, and the second end is detachably connected to the suction pump body, the condenser bend can be periodically removed to clean the metal, preventing blockage.

[0054] Please see Figure 2 In some embodiments, a V-shaped piercing operation is performed on the aluminum substrate 100 by the cutter assembly 200 to form a piercing groove 103 on the aluminum substrate 100 on the other side of the auxiliary side groove 101. Specifically, this includes the following steps: Adjust the aluminum substrate 100 to be between the upper cutter 210 and the lower cutter 220; Please see Figure 3 In this embodiment, the cutting assembly 200 includes an upper cutting blade 210 and a lower cutting blade 220, with an aluminum substrate 100 disposed between the upper cutting blade 210 and the lower cutting blade 220. In this embodiment, the upper cutting blade 210 faces the upper surface of the aluminum substrate 100, that is, the upper cutting blade 210 faces the copper foil circuit layer 1111, and the lower cutting blade 220 faces the lower surface of the aluminum substrate 100, that is, the lower cutting blade 220 faces the aluminum base layer 1113.

[0055] The upper V-groove is made on the aluminum substrate 100 above the other side of the auxiliary side groove 101 by the upper cutter 210, and an upper groove 1031 is obtained. Please see Figure 2 In this embodiment, an upper V-groove operation is performed on the aluminum substrate 100 above the auxiliary side groove 101 using an upper cutter 210. Specifically, the upper cutter 210 cuts the copper foil circuit layer 1111 within the aluminum base area 110 of the aluminum substrate 100. The upper cutter 210 can sequentially cut through the copper foil circuit layer 1111 and the thermally conductive insulating layer 1112 to the aluminum base layer 1113, thereby forming an upper groove 1031 on the upper surface of the aluminum substrate 100. Because the upper groove 1031 has a shallow effect on the aluminum base layer 1113, the amount of aluminum chips generated by the upper cutter 210 during the upper V-groove operation is reduced, thus reducing the accumulation of aluminum chips on the upper surface of the aluminum substrate 100.

[0056] The lower cutter 220 performs a lower V-groove operation on the aluminum substrate 100 below the other side of the auxiliary side groove 101 to obtain a lower cut groove 1032; wherein, the position of the lower cut groove 1032 corresponds to the position of the upper cut groove 1031, and the upper cut groove 1031 is connected to the lower cut groove 1032 to form a through cut groove 103.

[0057] Please see Figure 2 and Figure 8In this embodiment, a lower V-groove operation is performed on the aluminum substrate 100 below the other side of the auxiliary side groove 101 by the lower cutter 220. That is, the lower cutter 220 cuts the aluminum base layer 1113 in the aluminum base total area 110 of the aluminum substrate 100. The lower cutter 220 can form a lower cutting groove 1032 on the lower surface of the aluminum substrate 100, and can cut through the bottom of the upper cutting groove 1031 by the lower cutter 220, so that the upper cutting groove 1031 is connected to the lower cutting groove 1032 to form a through groove 103. Since the lower cutter 220 cuts through the bottom of the upper cutter groove 1031, the upper cutter groove 1031 can be connected to the lower cutter groove 1032. This allows the aluminum chips accumulated in the upper cutter groove 1031 to fall below the aluminum substrate 100 through the lower cutter groove 1032. Furthermore, more aluminum chips generated by the lower cutter 220 during the lower V-groove operation will fall naturally under the influence of gravity, thereby further reducing the residue of aluminum chips on the aluminum substrate 100.

[0058] It is understood that by sequentially performing V-groove operations on the aluminum substrate 100 using the upper cutter 210 and the lower cutter 220, that is, by connecting the bottom of the lower cutter 1032 to the bottom of the upper cutter 1031, a through-cut groove 103 can be formed on the aluminum substrate 100. Specifically, by overlapping the end of the V-shaped lower cutter 1032 with the end of the V-shaped upper cutter 1031, the groove diameter K of the through-cut groove 103 can be narrowed, thereby improving the utilization rate of the aluminum substrate 100 and reducing the amount of aluminum chips generated by the cutter assembly 200 during the V-cut operation.

[0059] Please see Figure 2 and Figure 8 In some embodiments, the upper V-groove operation and the lower V-groove operation are performed simultaneously.

[0060] It is understandable that since the upper V-groove operation and the lower V-groove operation are carried out simultaneously, the lower V-groove 1032 connects to the bottom of the upper V-groove 1031 as the upper V-groove 1031 is formed, thereby quickly forming the through-cut groove 103 and improving the efficiency of the V-cut operation.

[0061] Please see Figure 2 and Figure 3In some embodiments, the upper cutting blade 210 is positioned in front of the lower cutting blade 220, such that the cutting edge of the upper cutting blade 210 is offset from the cutting edge of the lower cutting blade 220 by at least 12 mm (H1). It is understood that by positioning the upper cutting blade 210 in front of the lower cutting blade 220, the upper groove 1031 formed by the upper cutting blade 210 remains in front of the lower groove 1032 formed by the lower cutting blade 220, ensuring continuous connection between the lower groove 1032 and the upper groove 1031 formed in front, thereby improving the efficiency of V-piercing operations on the aluminum substrate 100. Simultaneously, the offset of the cutting edge of the upper cutting blade 210 from the cutting edge of the lower cutting blade 220 by at least 12 mm (H1) reduces the likelihood of the upper cutting blade 210 and the lower cutting blade 220 colliding during V-piercing operations, thus reducing the risk of damage to both cutting blades.

[0062] Please see Figure 2 In some embodiments, the upper cutter 210 is a clockwise rotating first V-CUT cutter. It can be understood that since the upper cutter 210 is a clockwise rotating first V-CUT cutter, when the first V-CUT cutter performs the upper V-groove operation on the aluminum substrate 100, the rotation direction of the first V-CUT cutter is opposite to the extension direction of the cutting groove 103. This causes more aluminum chips to be thrown backward F1 towards the rear of the first V-CUT cutter under the action of the cutting edge. Thus, more aluminum chips can fall through the cutting groove 103 to the bottom of the aluminum substrate 100, ultimately reducing the amount of aluminum chips remaining on the aluminum substrate 100.

[0063] Please see Figure 2 In some embodiments, the lower cutter 220 is a second V-CUT cutter that rotates counterclockwise. It can be understood that since the lower cutter 220 is a second V-CUT cutter that rotates counterclockwise, when the second V-CUT cutter performs the V-groove operation on the aluminum substrate 100, the rotation direction of the second V-CUT cutter is the same as the extension direction of the cutting groove 103. This causes more aluminum chips to be thrown backward F2 by the blade of the second V-CUT cutter, thus allowing more aluminum chips to fall through the cutting groove 103 to the bottom of the aluminum substrate 100, ultimately reducing the amount of aluminum chips remaining on the aluminum substrate 100.

[0064] Typically, when the upper cutting blade 210 cuts to the aluminum base layer 1113, aluminum burrs remain in the groove of the upper cutting groove 1031 due to the good flexibility of aluminum. The aluminum burrs at the bottom of the upper cutting groove 1031 are often difficult to clean, making the cleaning efficiency of aluminum burrs very slow.

[0065] Please see Figure 2 and Figure 8To improve the efficiency of removing aluminum burrs, in some embodiments, the depth H2 of the upper groove 1031 is greater than the depth H3 of the lower groove 1032. It is understood that by making the depth H2 of the upper groove 1031 greater than the depth H3 of the lower groove 1032, the end of the V-shaped lower groove 1032 overlaps with the end of the V-shaped upper groove 1031, so that the lower cutter 220 can simultaneously remove the burrs formed at the bottom of the upper groove 1031 during the lower V-groove operation. In this embodiment, when the thickness of the aluminum substrate 100 is 1.6 mm, the depth H2 of the upper groove 1031 is 0.9 mm, the depth H3 of the lower groove 1032 is 0.85 mm, and there will be an overlap of 0.15 mm between the upper groove 1031 and the lower groove 1032.

[0066] Please see Figure 4 In some embodiments, the area of ​​the chip-leaking window 102 is at least 6 square millimeters. It is understood that by setting the area of ​​the chip-leaking window 102 to at least 6 square millimeters, aluminum chips can pass through the chip-leaking window 102 smoothly, thereby reducing the occurrence of aluminum chips clogging the chip-leaking window 102.

[0067] This disclosure also provides an aluminum chip cleaning plate 300, which is prepared by the V-cut aluminum chip cleaning method based on an aluminum substrate according to any of the above embodiments. It is understood that by performing a V-cutting operation on the obtained aluminum substrate 100 and driving the cutting blade assembly 200 to move towards the chip-discharging window 102, the aluminum chips generated by the V-cutting operation on the aluminum substrate 100 can be pushed towards the chip-discharging window 102 by the cutting blade assembly 200. When the cutting groove 103 intersects with the upper half of the V-cutting operation auxiliary side groove 101 on the aluminum substrate 100, the cutting blade assembly 200 enters into the auxiliary side groove 101, thereby squeezing out the aluminum chips accumulated in the auxiliary side groove 101 to the process edge area 120, thereby reducing the residue of aluminum chips in the auxiliary side groove 101. Then, the cutting blade assembly 200 is lifted to clean the chips. Using inertia, the cutting blade assembly 200 continues to move towards the chip-discharging window 102 when it is lifted, thereby pushing the aluminum chips to the chip-discharging window 102. Finally, the aluminum chip cleaning plate 300 has less aluminum chip residue, thereby reducing the probability of short circuit and scrap when the finished product is used.

[0068] Compared with the prior art, this disclosure has at least the following advantages: The above-described V-cut aluminum chip cleaning method based on an aluminum substrate involves performing a V-cut operation on the obtained aluminum substrate 100 and driving the cutting blade assembly 200 to move towards the chip leakage window 102. The cutting blade assembly 200 pushes the aluminum chips generated by the V-cut operation on the aluminum substrate 100 towards the chip leakage window 102. When the cutting groove 103 intersects with the upper half of the V-cut operation auxiliary side groove 101 on the aluminum substrate 100, the cutting blade assembly 200 enters the auxiliary side groove 101, thereby squeezing out the aluminum chips accumulated in the auxiliary side groove 101 to the process edge area 120, thus reducing the residue of aluminum chips in the auxiliary side groove 101. Then, the cutting blade assembly 200 is lifted to clean the chips. Using inertia, the cutting blade assembly 200 continues to move towards the chip leakage window 102 when it is lifted, thereby pushing the aluminum chips to the chip leakage window 102. Finally, the aluminum chip cleaning plate 300 has less aluminum chip residue, thereby reducing the probability of short circuit and scrapping when the finished product is used.

[0069] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A method for cleaning aluminum chips by V-cutting based on an aluminum substrate, characterized in that, include: Obtain the aluminum substrate; The aluminum substrate is subjected to a half-V cut to form an auxiliary edge groove on the aluminum substrate; A windowing operation is performed on the aluminum substrate to form a chip-leaking window on one side of the auxiliary side groove on the aluminum substrate; A V-cutting operation is performed on the aluminum substrate by a cutting tool assembly to form a cutting groove on the aluminum substrate on the other side of the auxiliary side groove. The cutting blade assembly is driven to move and push chips toward the chip window, so that the cutting groove extends toward the chip window and intersects with the auxiliary side groove; The cutting blade assembly is lifted to remove chips, thereby obtaining an aluminum chip cleaning plate; The chip removal operation of the cutting blade assembly specifically includes the following steps: The cutting blade assembly is gradually lifted away from the aluminum substrate to form an aluminum chip guide groove between the auxiliary side groove and the chip leakage window; wherein the aluminum chip guide groove is connected to the cutting groove and the auxiliary side groove, and the depth of the aluminum chip guide groove gradually decreases from the cutting groove to the chip leakage window. The step of gradually lifting the cutter assembly away from the aluminum substrate in a direction opposite to the aluminum substrate, so as to form an aluminum chip guiding groove between the cutting groove and the chip leakage window, specifically includes the following steps: The upper and lower cutting blades are driven to move in opposite directions and move away from the aluminum substrate at the same time, so that the upper cutting blade forms an aluminum chip guide groove on the upper surface of the aluminum substrate and another aluminum chip guide groove on the lower surface of the aluminum substrate.

2. The V-cut aluminum chip cleaning method based on an aluminum substrate according to claim 1, characterized in that, The distance between the chip-leaking window and the auxiliary side groove is 1.5mm to 3mm.

3. The V-cut aluminum chip cleaning method based on an aluminum substrate according to claim 1, characterized in that, The step of performing a V-cutting operation on the aluminum substrate using a cutting tool assembly to form a cutting groove on the aluminum substrate on the other side of the auxiliary edge groove specifically includes the following steps: Adjust the aluminum substrate to be positioned between the upper and lower cutting blades; An upper V-groove is created on the aluminum substrate above the other side of the auxiliary side groove using the upper cutting tool, resulting in an upper groove. The lower cutting blade performs a lower V-groove operation on the aluminum substrate below the other side of the auxiliary side groove to obtain a lower cutting groove; wherein the upper cutting groove is connected to the lower cutting groove to form the through-cut groove.

4. The V-cut aluminum chip cleaning method based on an aluminum substrate according to claim 3, characterized in that, The upper V-groove operation is performed synchronously with the lower V-groove operation; and / or... The upper cutting blade is located in front of the upper cutting blade, so that the cutting edge of the upper cutting blade is offset from the cutting edge of the upper cutting blade by at least 12mm.

5. The V-cut aluminum chip cleaning method based on an aluminum substrate according to claim 3, characterized in that, The upper cutting blade is a first V-CUT blade that rotates clockwise; and / or... The lower cutter is a second V-CUT cutter that rotates counterclockwise.

6. The V-cut aluminum chip cleaning method based on an aluminum substrate according to claim 3, characterized in that, The depth of the upper groove is greater than the depth of the lower groove.

7. The V-cut aluminum chip cleaning method based on an aluminum substrate according to claim 1, characterized in that, The step of opening a window on the aluminum substrate to form a chip-leaking window on one side of the auxiliary side groove specifically includes the following steps: The upper surface of the aluminum substrate is scribing to form a window reference frame on one side of the auxiliary side groove; wherein the window reference frame includes a first segment and a second segment, the first segment and the second segment enclosing each other to serve as the edge contour of the chip-leaking window. The first segment is subjected to laser pre-cutting to form folding scratches on the upper surface of the aluminum substrate; wherein, the first segment is the part of the window reference frame near the auxiliary edge groove; The second segment is laser-cut to cut through the aluminum substrate to obtain the movable part; The movable part is folded along the folding scratch towards the auxiliary side groove so that the movable part fits against the lower surface of the aluminum substrate, and the chip-leaking window is obtained.

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