Load bearing device, semiconductor process chamber and semiconductor process apparatus

Abstract

The application discloses a bearing device, a semiconductor process chamber and a semiconductor process equipment, and belongs to the technical field of semiconductor process equipment. The bearing device (100) comprises a boat heating piece (140) and a bottom bearing boat (110), a middle bearing boat (120) and a top bearing boat (130) which are stacked in a first direction. The boat heating piece (140) is arranged on a target bearing boat, and at least one of the bottom bearing boat (110), the middle bearing boat (120) and the top bearing boat (130) is the target bearing boat. The above scheme can solve the problem that the semiconductor process chamber adopts multiple bearing boats stacked, and at least part of the bearing boats are slow in temperature recovery.

Description

Technical Field

[0001] This application belongs to the field of semiconductor process equipment technology, specifically relating to a carrier device, a semiconductor process chamber, and semiconductor process equipment. Background Technology

[0002] In the manufacturing process of solar cells, a film layer with a predetermined function, such as a passivation film, needs to be deposited on the surface of the silicon wafer. Taking the deposition of a passivation film as an example, the passivation film is formed on the surface of the silicon wafer, thereby minimizing the recombination of charge carriers on the silicon wafer surface. The deposition of the film layer on the silicon wafer surface needs to be completed in a semiconductor process chamber.

[0003] With increasing user demand, improving the production capacity of solar cells is a pressing issue for the industry. To address this, related technologies typically increase the length of the carrier boat used for silicon wafer deposition to expand the amount of silicon wafer deposited in a single pass, thereby increasing production capacity. However, in actual operation, increasing the length of the carrier boat has limited effectiveness. Therefore, other related technologies utilize stacked carrier boats in semiconductor process chambers to improve the production capacity of a single process. However, this approach has some problems. Specifically, the carrier boat in the middle position is easily obstructed by the carrier boats above and below it, resulting in slow temperature recovery, which ultimately affects the process efficiency and quality of the carrier boat in the middle position. Of course, due to different heating methods, other carrier boats in the stacked array may also experience slow temperature recovery. Summary of the Invention

[0004] This application discloses a carrier device, a semiconductor process chamber, and semiconductor process equipment to solve the problem that at least some of the carrier boats cool down slowly when multiple carrier boats are stacked in the semiconductor process chamber described in the background art.

[0005] To solve the above-mentioned technical problems, this application provides the following technical solution:

[0006] In a first aspect, embodiments of the present invention disclose a bearing device, the disclosed bearing device including a boat heating element and a bottom bearing boat, an intermediate bearing boat and a top bearing boat stacked sequentially in a first direction, the boat heating element being disposed on a target bearing boat, and at least one of the bottom bearing boat, the intermediate bearing boat and the top bearing boat being the target bearing boat.

[0007] Secondly, embodiments of the present invention disclose a semiconductor process chamber. The disclosed semiconductor process chamber includes a chamber body and the support device described in the first aspect. The chamber body is provided with a process space, and the support device can be disposed in the process space. The first direction is the height direction of the chamber body.

[0008] Thirdly, embodiments of the present invention disclose a semiconductor process apparatus, the disclosed semiconductor process apparatus including the semiconductor process chamber described in the second aspect.

[0009] The bearing device disclosed in this invention addresses the issue of slow temperature recovery by designing boat heating elements on the bottom, middle, and top bearing boats, specifically targeting the bearing boat. These heating elements provide dedicated heating to the target bearing boat. Furthermore, the use of dedicated heating elements on the target bearing boat enables targeted heating and allows the bearing device to heat its own structure. This placement of the heating elements on the target bearing boat facilitates a compact design, avoiding the space-consuming problem of placing them in the process space. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of a semiconductor process chamber disclosed in an embodiment of the present invention. Figure 1 Only one exhaust module 260 is shown in the diagram;

[0011] Figure 2 This is a schematic diagram of the structure of the support device disclosed in the embodiment of the present invention;

[0012] Figure 3 yes Figure 2 Top view;

[0013] Figure 4 yes Figure 2 The right view;

[0014] Figure 5 This is a schematic diagram of the structure of the middle supporting boat;

[0015] Figure 6 yes Figure 5 The right view, Figure 5 and Figure 6 The insulating housing 141 of the boat heating element 140 is not shown in the image.

[0016] Figure 7 This is an exploded view of the power supply terminal.

[0017] Figure 8 This is a schematic diagram of the structure of the semiconductor process chamber disclosed in the embodiments of the present invention when it is opened;

[0018] Figure 9 for Figure 8 An enlarged schematic diagram of part A in the diagram;

[0019] Figure 10 This is a partial cross-sectional schematic diagram of a semiconductor process chamber disclosed in an embodiment of the present invention;

[0020] Figure 11 This is a schematic diagram of a semiconductor process chamber when process gas is introduced, as disclosed in an embodiment of the present invention;

[0021] Figure 12 This is a partial structural schematic diagram of a semiconductor process chamber disclosed in an embodiment of the present invention.

[0022] Explanation of reference numerals in the attached figures:

[0023] 100-Bearing device,

[0024] 110-Bottom-supporting boat,

[0025] 120 - Intermediate support boat, 121 - First sidewall, 122 - Second sidewall, 123 - Boat ear,

[0026] 130-Top-mounted boat,

[0027] 140-Boat heating element, 141-Insulating housing, 142-Electric heating wire, 143-Electrical terminal, 1431-Electrical connection slot, 1432-Watch strap contact finger,

[0028] 200-chamber body,

[0029] 210 - Inner cavity, 211 - Process space, 2111 - First flow equalization space, 2112 - Second flow equalization space, 212 - Sealing space, 213 - First cylinder, 2131 - Second mounting hole, 214 - First front end cover, 215 - First rear end cover, 216 - External pipeline

[0030] 220 - Outer cavity, 221 - Second cylinder, 2211 - First mounting hole, 222 - Second front end cover, 223 - Second rear end cover, 2231 - Third clearance hole, 224 - Elastic connection structure, 2241 - First bolt, 2242 - First elastic element

[0031] 230 - Power supply terminal, 231 - Cable connection part, 232 - Insulation part, 2321 - Annular clamping part, 233 - Electrical connection pin, 234 - Insulating annular protrusion, 235 - Second sealing ring, 236 - First sealing ring, 237 - Cover,

[0032] 240 - Cavity heating assembly, 241 - First heating element, 2411 - First clearance hole, 242 - Second heating element, 243 - Third heating element, 2431 - Second clearance hole

[0033] 250 - Intake module, 251 - Nozzle, 2511 - Third flow equalization hole, 252 - Intake pipe, 253 - Annular connecting plate, 254 - Sixth sealing ring, 255 - Sealing dock assembly, 256 - Mounting base, 257 - Pressure plate, 258 - Seventh sealing ring, 259 - Eighth sealing ring

[0034] 260-exhaust module,

[0035] 270-Top flow equalizer,

[0036] 280 - Bottom flow equalizer. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0038] The technical solutions disclosed in the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0039] Please refer to Figures 1 to 12 This invention discloses a support device 100, which is used to support silicon wafers for processing in a process space 211. The support device 100 disclosed in this invention includes a bottom support boat 110, a middle support boat 120, a top support boat 130, and a boat heating element 140.

[0040] The bottom support boat 110, the middle support boat 120, and the top support boat 130 are stacked sequentially in a first direction. Specifically, the middle support boat 120 is supported on the bottom support boat 110, and the top support boat 130 is supported on the middle support boat 120. There can be one or more middle support boats 120; the specific number of middle support boats 120 is not limited in this embodiment. In embodiments with multiple middle support boats 120, the multiple middle support boats 120 are stacked sequentially on the bottom support boat 110. The first direction can be a vertically upward direction or generally along a vertically upward direction.

[0041] A boat heating element 140 is disposed on the target carrier boat, and the boat heating element 140 is used to heat the target carrier boat to increase its temperature. In this embodiment of the invention, the target carrier boat is at least one of the bottom carrier boat 110, the middle carrier boat 120, and the top carrier boat 130. In other words, at least one of the bottom carrier boat 110, the middle carrier boat 120, and the top carrier boat 130 is the target carrier boat.

[0042] During the process of carrying a silicon wafer in the process space 211 by the carrier device 100 disclosed in this embodiment of the invention, considering the different positions of the heating structures, the temperature unevenness may vary. The bottom carrier boat 110, the middle carrier boat 120, and the top carrier boat 130 may all have slow temperature recovery. Therefore, the bottom carrier boat 110, the middle carrier boat 120, and the top carrier boat 130 may all be target carrier boats that need to be heated. In other scenarios, some of the carrier boats among the bottom carrier boat 110, the middle carrier boat 120, and the top carrier boat 130 may have slow temperature recovery. In this case, some of the carrier boats among the bottom carrier boat 110, the middle carrier boat 120, and the top carrier boat 130 may be target carrier boats that need to be heated. This embodiment of the invention does not limit the specific object corresponding to the target carrier boat. Those skilled in the art can determine the temperature recovery status of the carrier boats included in the carrier device 100 and identify the carrier boat with slow temperature recovery as the target carrier boat.

[0043] In one embodiment, as can be seen from the stacking arrangement of the bottom support boat 110, the middle support boat 120, and the top support boat 130, the middle support boat 120 is located between the bottom support boat 110 and the top support boat 130. When the support device 100 is in the process space 211, the bottom support boat 110 and the top support boat 130 are relatively close to the heating device (such as the cavity heating assembly 240 described later) outside the process space 211. The middle support boat 120, which is located between the bottom support boat 110 and the top support boat 130, is more likely to experience slow temperature recovery due to the influence of the bottom support boat 110 and the top support boat 130. Based on this, in a more optional embodiment, the middle support boat 120 is the target support boat.

[0044] The carrier device 100 disclosed in this embodiment of the invention, through structural design, installs boat heating elements 140 on the target carrier among the bottom carrier 110, the middle carrier 120, and the top carrier 130. The boat heating elements 140 specifically heat the target carrier, thereby solving the problem of slow temperature recovery in the target carrier. Simultaneously, using dedicated boat heating elements 140 on the target carrier enables targeted heating, while also giving the carrier device 100 the ability to heat its own structure. This placement of the boat heating elements 140 on the target carrier facilitates a compact structural design, thus avoiding the problem of the boat heating elements 140 occupying a large space in the process space 211.

[0045] The carrier device 100 disclosed in this embodiment integrates the boat heating element 140 onto the target carrier boat, enabling the boat heating element 140 to follow the carrier device 100 into and out of the process space 211, thereby facilitating the maintenance and repair of the boat heating element 140 outside the process space 211.

[0046] In this embodiment of the invention, the bottom support boat 110, the middle support boat 120, and the top support boat 130 are all provided with wafer carrier spaces, which are used to carry a predetermined number of silicon wafers. Based on this, the target support boat is provided with wafer carrier spaces. Boat heating elements 140 can be disposed at multiple locations on the target support boat to heat it. This embodiment of the invention does not limit the specific installation position of the boat heating elements 140 on the target support boat. For example, the boat heating elements 140 can be disposed in the wafer carrier space of the target support boat. Specifically, the boat heating elements 140 can be disposed in a position within the wafer carrier space that does not affect the placement of the silicon wafers; for example, the boat heating elements 140 can be disposed on the inner surface of the wafer carrier space.

[0047] To avoid occupying the wafer carrier space, in one embodiment, the target carrier boat may include a peripheral sidewall surrounding the wafer carrier space, and the boat heating element 140 may be mounted on the outer surface of the peripheral sidewall. It should be explained that the inner surface of the wafer carrier space may include the inner surface of the bottom wall of the target carrier boat and the inner surface of the peripheral sidewall. The inner surface of the peripheral sidewall is distributed opposite to the outer surface of the peripheral sidewall. The target carrier boat may include a bottom wall and a peripheral sidewall, with the peripheral sidewall disposed on the bottom wall and surrounding the edge of the bottom wall to form the wafer carrier space.

[0048] Specifically, the boat heating element 140 can be installed on the target carrier boat in various ways. For example, the boat heating element 140 can be fixed on the target carrier boat by means of bonding, threaded connection, plug-in connection, etc. The embodiments of the present invention do not limit the specific arrangement of the boat heating element 140 on the target carrier boat. Any installation method that enables the boat heating element 140 to be placed on the target carrier boat and thus follow the carrier device 100 in and out of the process space 211 is acceptable.

[0049] In this embodiment of the invention, the shape of the peripheral sidewalls depends on the shape of the target carrier boat. The process space 211 is typically elongated; therefore, to increase production capacity, the target carrier boat is also elongated. Based on this, in one embodiment, the peripheral sidewalls may include two first sidewalls 121 and two second sidewalls 122 distributed around the wafer space. The two first sidewalls 121 extend along the length direction of the target carrier boat and are opposite to each other, while the two second sidewalls 122 extend along the width direction of the target carrier boat and are opposite to each other. It should be noted that the length direction, width direction, and the first direction mentioned herein are perpendicular to each other. Specifically, one first sidewall 121, one second sidewall 122, another first sidewall 121, and another second sidewall 122 are sequentially connected end-to-end to surround the wafer space.

[0050] The boat heating element 140 can be disposed only on the first sidewall 121, or only on the second sidewall 122, or partially on the first sidewall 121 and partially on the second sidewall 122; this embodiment of the invention does not impose any limitations. Considering that the target carrier boat is a long strip structure, it is difficult to ensure the heating uniformity along its length. Therefore, the boat heating element 140 is disposed on at least the two first sidewalls 121 and extends along the length direction of the first sidewalls 121. This structure allows the boat heating element 140 to heat the target carrier boat over a larger area along its length, which is beneficial for improving the heating uniformity of the target carrier boat. The second sidewall 122 can extend along the width direction of the target carrier boat. It should be explained that the length direction, width direction, and height direction of some components or structures described herein are consistent. For example, the length direction of the target carrier boat is consistent with the length direction of the semiconductor process chamber mentioned later, and the height direction of the chamber body 200 mentioned later is consistent with the height direction of the semiconductor process chamber.

[0051] In this embodiment of the invention, the boat heating element 140 can be an electric heating element, and the boat heating element 140 has an electrical connection terminal 143 to achieve electrical connection. The power supply terminal 230 supplying power to the boat heating element 140 can be at least partially located in the process space 211. The power supply terminal 230 can be electrically connected to the electrical connection terminal 143 after the carrier device 100 enters the process space 211, and can be disconnected from the electrical connection terminal 143 after the carrier device 100 moves out of the process space 211. This embodiment of the invention does not limit the specific position of the electrical connection terminal 143 on the target carrier boat, nor does it limit the specific position of the power supply terminal 230 on the semiconductor process chamber, as long as they can be electrically connected and disconnected as the carrier device 100 enters and exits.

[0052] For example, the power terminal 143 can be located on the first side wall 121, and correspondingly, the power supply terminal 230 can be located on the inner wall of the semiconductor process chamber opposite to the first side wall 121, thereby enabling the electrical connection (e.g., an electrical connection achieved through electrical contact) between the power terminal 143 and the power supply terminal 230 after the carrier device 100 enters the process space 211, and enabling the separation between the power terminal 143 and the power supply terminal 230 after the carrier device 100 is removed from the process space 211.

[0053] To facilitate the movement of the carrier device 100 into and out of the process space 211, the direction in which the carrier device 100 enters and exits the process space 211 can be the length direction of the target carrier boat. To facilitate a stable electrical connection with the power supply terminal 230 during the movement of the carrier device 100 into and out of the process space 211, the power receiving terminal 143 of the boat heating element 140 can be located on the outer surface of the second sidewall 122. The power supply terminal 230 can be positioned opposite each other on the semiconductor process chamber. This structure allows the power receiving terminal 143 to be tightly connected to the power supply terminal 230 by the movement of the carrier device 100, thereby improving the stability of the electrical connection between them.

[0054] To improve the stability of the electrical connection, one of the electrical receiving terminal 143 and the power supply terminal 230 of the boat heating element 140 may be provided with an electrical connection slot 1431, and the other may be inserted into the electrical connection slot 1431 after the carrier device 100 moves into the process space 211, thereby realizing the electrical connection between the electrical receiving terminal 143 and the power supply terminal 230. Specifically, the electrical connection slot 1431 may be provided on the electrical receiving terminal 143 or on the power supply terminal 230. In the embodiment where the electrical connection slot 1431 is provided on the electrical receiving terminal 143, the power supply terminal 230 will be inserted into the electrical connection slot 1431 to realize the electrical connection with the electrical receiving terminal 143. In the embodiment where the electrical connection slot 1431 is provided on the power supply terminal 230, the electrical receiving terminal 143 will be inserted into the electrical connection slot 1431 of the power supply terminal 230 to realize the electrical connection with the power supply terminal 230.

[0055] In one embodiment, the electrical terminal 143 is provided with an electrical connection slot 1431. To facilitate alignment and insertion, in a further embodiment, the slot of the electrical connection slot 1431 can be a flared structure. The flared structure facilitates alignment during insertion, thereby facilitating the guidance of the electrical terminal 143 or the power supply terminal 230 into the insertion position.

[0056] To improve the stability of the electrical connection, in a further embodiment, a watchband contact finger 1432 may be provided in the electrical connection slot 1431. The electrical connection hole of the watchband contact finger 1432 is opposite to the slot of the electrical connection slot 1431, and the watchband contact finger 1432 makes conductive contact with the inner wall of the electrical connection slot 1431. This structure allows the power terminal 143 or the power supply terminal 230 to be inserted into the watchband contact finger 1432 through the slot of the electrical connection slot 1431 during the insertion process, thereby achieving a more stable electrical connection through the watchband contact finger 1432. This structure essentially achieves an indirect electrical connection between the power terminal 143 or the power supply terminal 230 and the electrical connection slot 1431 through the watchband contact finger 1432. In other embodiments, the power terminal 143 or the power supply terminal 230 can be directly inserted into the electrical connection slot 1431, thereby making direct electrical contact with the inner wall of the electrical connection slot 1431.

[0057] Specifically, the two second sidewalls 122 can be a front sidewall facing the front end of the semiconductor process chamber and a rear sidewall facing the rear end of the semiconductor process chamber, respectively. The carrier device 100 enters and exits the process space 211 through the front furnace port at the front end of the semiconductor process chamber. Based on this, the electrical terminal 143 can be provided on the outer surface of the second sidewall 122, which is the rear sidewall.

[0058] In this embodiment of the invention, the boat heating element 140 can have various structures. For example, the boat heating element 140 can be a common cable, and a groove can be opened on the outer surface of the peripheral wall of the target carrier boat, where the cable can be positioned. This structure does not cause the boat heating element 140 to occupy additional space. In other embodiments, the boat heating element 140 disclosed in this embodiment of the invention may include an insulating shell 141 and an electric heating wire 142. The electric heating wire 142 is fixed inside the insulating shell 141, thereby isolating it from the target carrier boat through the insulating shell 141, thus avoiding interference with the potential on the target carrier boat. The aforementioned power terminal 143 is electrically connected to the electric heating wire 142 and exposed outside the insulating shell 141, thereby supplying power to the electric heating wire 142 after the power terminal 143 is electrically connected to the power supply terminal 230. The insulating shell 141 is disposed (e.g., fixed) on the target carrier boat, thereby realizing the installation of the entire boat heating element 140. Specifically, the insulating shell 141 can be fixed to the outer surface of the peripheral wall of the target carrier boat.

[0059] The heating wire 142 can be bent and extended within the insulating shell 141, thereby enabling the heating wire 142 to cover a larger area as much as possible to heat a wider area of ​​the target carrier boat, which is beneficial to improving the uniformity of heating.

[0060] In this embodiment of the invention, the boat heating element 140 can be fixed to the outer surface of the peripheral wall of the target carrier boat using fasteners (e.g., screws, bolts, etc.). In other embodiments, the outer surface of the peripheral wall of the target carrier boat may be provided with protruding boat ears 123, which are located outside the carrier space. The boat heating element 140 can be located on the boat ears 123, thereby achieving installation on the target carrier boat through the support of the boat ears 123. In this embodiment, the boat ears 123 are not only used to cooperate with the conveying mechanism of the semiconductor process equipment to enable the conveying mechanism to drive the carrier device 100 into and out of the process space 211, but also to support the boat heating element 140, thereby achieving the purpose of multiple uses. To improve the stability of the support, the outer surface of the peripheral wall of the target carrier boat may be provided with multiple boat ears 123, which are spaced apart and jointly support the boat heating element 140. This embodiment of the invention does not limit the specific number of boat ears 123 on the target carrier boat.

[0061] In a more specific embodiment, each of the two first sidewalls 121 may be provided with one or more lugs 123. The boat heating element 140 may extend at least to the two first sidewalls 121 and be supported on the lugs 123 of the two first sidewalls 121. This structure allows the boat heating element 140 to make limiting contact with the two first sidewalls 121 in the width direction of the target carrier boat, thereby making the boat heating element 140 less likely to fall off and thus more stably supported on the target carrier boat. In an embodiment where the boat heating element 140 includes an insulating shell 141 and an electric heating wire 142, the portions of the insulating shell 141 opposite to the two first sidewalls 121 are respectively supported on the lugs 123 of the corresponding first sidewalls 121, and the portions of the insulating shell 141 opposite to the two first sidewalls 121 make limiting contact with the two first sidewalls 121 in the width direction of the target carrier boat.

[0062] To improve the installation stability of the boat heating element 140, the boat heating element 140 can be located on the boat lug 123 and fixed to the outer surface of the peripheral sidewall of the target carrier boat by fasteners. This method combines multiple means to improve the installation stability of the boat heating element 140.

[0063] In an embodiment where the boat heating element 140 includes an insulating shell 141 and an electric heating wire 142, the insulating shell 141 is located on the boat lug 123, thereby enabling the entire boat heating element 140 to be installed. In other embodiments, the insulating shell 141 can also be installed on the outer surface of the peripheral sidewall of the target carrier boat using the fasteners described above, thereby enabling the entire boat heating element 140 to be installed on the target carrier boat.

[0064] Based on the carrier device 100 disclosed in the embodiments of the present invention, the present invention discloses a semiconductor process chamber. The disclosed semiconductor process chamber includes a chamber body 200 and the carrier device 100 described in the above embodiments. The chamber body 200 is provided with a process space 211, and the carrier device 100 can be disposed in the process space 211. The first direction mentioned above is the height direction of the chamber body 200, which is also the height direction of the semiconductor process chamber and the height direction of the process space 211.

[0065] In the semiconductor process chamber disclosed in this embodiment of the invention, the chamber body 200 may include a power supply terminal 230, which can be detachably electrically connected to the boat heating element 140. Specifically, the power supply terminal 230 is detachably electrically connected to the power receiving terminal 143 of the boat heating element 140. Specifically, the electrical connection method between the power supply terminal 230 and the power receiving terminal 143 can be as described above, and specific details can be found in the corresponding descriptions above.

[0066] The chamber body 200 disclosed in the embodiments of the present invention may include an air intake module 250. The air intake module 250 is disposed on the side of the top support boat 130 away from the middle support boat 120. The air intake module 250 is connected to the process space 211 and is used to deliver process gas into the process space 211.

[0067] The chamber body 200 disclosed in the embodiments of the present invention may include an exhaust module 260. The exhaust module 260 is located on the side of the bottom support boat 110 away from the middle support boat 120. The exhaust module 260 is connected to the process space 211 and is used to discharge the waste gas formed after the process gas in the process space 211 participates in the process to the process space 211.

[0068] The structure of the chamber body 200 enclosing the process space 211 can be varied. In one embodiment, the chamber body 200 may include a cavity structure with the process space 211. An air intake module 250 is installed on the top of the cavity structure, located on the side of the top support boat 130 opposite to the middle support boat 120. An exhaust module 260 is installed on the bottom of the cavity structure, located on the side of the bottom support boat 110 opposite to the middle support boat 120. The air intake module 250 and the cavity structure are sealed together, and the exhaust module 260 is also sealed together. The mounting points of the air intake module 250 and the exhaust module 260 are sealed structures, which helps to ensure the airtightness of the process space 211.

[0069] The cavity structure can be a single-layer structure or a double-layer structure, and the embodiments of the present invention are not limited thereto. In one embodiment, the cavity structure may include an inner cavity 210 and an outer cavity 220, and the inner cavity 210 is provided with a process space 211. The inner cavity 210 is located inside the outer cavity 220, and the outer cavity 220 is provided with a first mounting hole 2211 for sealing and cooperating with the intake module 250 or the exhaust module 260. The first end of the intake module 250 is sealed and installed at the corresponding first mounting hole 2211 on the outer cavity 220 and exposed outside the outer cavity 220, and the first end of the exhaust module 260 is sealed and installed at the corresponding first mounting hole 2211 on the outer cavity 220 and exposed outside the outer cavity 220.

[0070] It should be noted that the first mounting hole 2211 corresponding to the intake module 250 is located at the top of the outer cavity 220, and the first mounting hole 2211 corresponding to the exhaust module 260 is located at the bottom of the outer cavity 220. The bottom and top of the outer cavity 220 are distributed sequentially in the first direction.

[0071] The inner cavity 210 is provided with a second mounting hole 2131 for sealing and engaging with the intake module 250 or the exhaust module 260. The second end of the intake module 250 is sealed and installed at the corresponding second mounting hole 2131 on the inner cavity 210 and communicates with the process space 211. The second end of the exhaust module 260 is sealed and installed at the corresponding second mounting hole 2131 on the inner cavity 210 and communicates with the process space 211. In this case, a sealed space 212 is formed between the inner cavity 210 and the outer cavity 220. Specifically, the inner cavity 210, the outer cavity 220, the intake module 250, and the exhaust module 260 enclose the sealed space 212, which is sealed and isolated from the process space 211.

[0072] This embodiment designs the cavity structure as a double-layer structure including an inner cavity 210 and an outer cavity 220. This allows the intake module 250 and exhaust module 260 to be installed and communicate with the process space 211 respectively. At the same time, the intake module 250 and exhaust module 260, together with the inner cavity 210 and the outer cavity 220, form a sealed space 212. Since the sealed space 212 is also a sealed structure, once the process space 211 leaks, the leaked toxic process gas will enter the sealed space 212 and will not directly enter the external environment where the semiconductor process chamber is located. This can prevent toxic process gas from leaking into the external environment and causing safety accidents such as poisoning of workers.

[0073] In the semiconductor process chamber disclosed in this embodiment of the invention, there may be one or more air intake modules 250, and this embodiment of the invention does not limit the specific number of air intake modules 250. Similarly, there may be one or more exhaust modules 260, and this embodiment of the invention does not limit the specific number of exhaust modules 260.

[0074] To ensure the uniformity of process gas intake, multiple intake modules 250 can be used. These modules can be spaced apart along the length of the semiconductor process chamber. This structure allows multiple intake modules 250 to simultaneously input process gas into the process space 211 along the length, thereby improving the uniformity of the process gas. Optionally, the multiple intake modules 250 are evenly distributed along the length of the semiconductor process chamber.

[0075] Similarly, considering the uniformity of process gas in the process space 211, there can be multiple exhaust modules 260, which can be distributed at intervals along the length of the semiconductor process chamber. This structure allows multiple exhaust modules 260 to simultaneously guide the exhaust gas from the bottom of the process space 211 outwards along the length, thus mitigating the adverse effects on the uniformity of process gas in the process space 211. Optionally, the multiple exhaust modules 260 are evenly distributed along the length of the semiconductor process chamber.

[0076] The chamber body 200 disclosed in this embodiment of the invention may further include a top flow equalization plate 270. The top flow equalization plate 270 has multiple first flow equalization holes and is disposed in the process space 211, located above the top support boat 130. Specifically, the top flow equalization plate 270 is fixed in the process space 211. The top flow equalization plate 270 and the top inner wall of the process space 211 form a first flow equalization space 2111, and the support device 100 is located below the first flow equalization space 2111. The air intake module 250 communicates with the first flow equalization space 2111, and the multiple first flow equalization holes communicate with the first flow equalization space 2111. In this structure, after the air intake module 250 outputs the process gas, the process gas first enters the first flow equalization space 2111 for equalization, and then flows into the space where the support device 100 is located through the multiple first flow equalization holes to participate in the process. This structure can improve the uniformity of the process gas participating in the process.

[0077] In an embodiment where the chamber body 200 includes an inner cavity 210, the top flow equalization plate 270 can be fixed in the inner cavity 210 and form a first flow equalization space 2111 with the top inner wall of the inner cavity 210. In this case, the top inner wall of the process space 211 is essentially the top inner wall of the inner cavity 210.

[0078] In the specific process, the airflow uniformity on the inlet and outlet sides of the process space 211 is crucial to the uniformity of the process gas in the space where the support device 100 is located. Therefore, the chamber body 200 disclosed in this embodiment may further include a bottom flow equalization plate 280. The bottom flow equalization plate 280 has multiple second flow equalization holes. The bottom flow equalization plate 280 is disposed in the process space 211 and located below the bottom support boat 110. Specifically, the bottom flow equalization plate 280 is fixed in the process space 211. The bottom flow equalization plate 280 and the bottom inner wall of the process space 211 form a second flow equalization space 2112, and the support device 100 is located above the second flow equalization space 2112. The exhaust module 260 communicates with the second flow equalization space 2112, and the multiple second flow equalization holes communicate with the second flow equalization space 2112. In this structure, the waste gas formed after the process gas participates in the process will enter the second uniform flow space 2112 through the bottom uniform flow plate 280. Under the uniform flow effect of the multiple second uniform flow holes of the bottom uniform flow plate 280 and the second uniform flow space 2112, the airflow at the bottom of the process space 211 can be made more uniform, which is conducive to maintaining the uniformity of the distribution of process gas in the process space 211.

[0079] In an embodiment where the chamber body 200 includes an inner cavity 210, the bottom flow equalization plate 280 can be fixed in the inner cavity 210 and form a second flow equalization space 2112 with the bottom inner wall of the inner cavity 210. In this case, the bottom inner wall of the process space 211 is essentially the bottom inner wall of the inner cavity 210.

[0080] In this embodiment of the invention, the top flow equalizer 270 and the bottom flow equalizer 280 can be fixedly connected to the inner wall of the process space 211 by means of welding, snap-fitting, or connecting with connectors. This embodiment of the invention does not limit their specific fixing methods.

[0081] As mentioned above, the top flow equalization plate 270 has multiple first flow equalization holes. During operation, some of the first flow equalization holes opposite to the air intake module 250 allow more process gas to pass through, while those not opposite the air intake module 250 allow less process gas to pass through, resulting in a need to improve the uniformity of process gas distribution. Therefore, in one embodiment, the area on the top flow equalization plate 270 directly opposite the air intake module 250 is designated as the first region, and the area on the top flow equalization plate 270 offset from the air intake module 250 is designated as the second region. The distribution density of the first flow equalization holes in the first region can be less than that in the second region. This distribution method balances the amount of process gas passing through the first and second regions by adjusting the distribution density of the first flow equalization holes in different regions, thereby further improving the uniformity of the process gas distribution.

[0082] Similarly, the bottom flow equalization plate 280 has multiple second flow equalization holes. During operation, some of the second flow equalization holes opposite to the exhaust module 260 will allow more exhaust gas to pass through, while those not opposite the exhaust module 260 will allow less. This results in the process gas distribution uniformity at the bottom of the process space 211 needing further improvement. Therefore, in one embodiment, the area on the bottom flow equalization plate 280 directly opposite the exhaust module 260 is designated as the third region, and the area on the bottom flow equalization plate 280 misaligned with the exhaust module 260 is designated as the fourth region. The distribution density of the second flow equalization holes in the third region can be less than that in the fourth region. This structure balances the amount of exhaust gas passing through the third and fourth regions by adjusting the distribution density of the second flow equalization holes in different regions, thereby alleviating the problem of uneven process gas distribution caused by uneven exhaust gas emission.

[0083] In the semiconductor process chamber disclosed in this embodiment of the invention, the chamber body 200 may further include a chamber heating assembly 240. The chamber heating assembly 240 is sleeved outside the inner cavity 210 and fits against the outer wall of the inner cavity 210. First clearance holes 2411 are provided on the chamber heating assembly 240 at locations opposite to the air intake module 250 and the exhaust module 260. The first clearance hole 2411 opposite to the air intake module 250 is used to avoid the air intake module 250, thereby allowing the air intake module 250 to seal and connect with the second mounting hole 2131. The first clearance hole 2411 opposite to the exhaust module 260 is used to avoid the exhaust module 260, thereby allowing the exhaust module 260 to seal and connect with the second mounting hole 2131. This method of fitting the chamber heating assembly 240 against the outer wall of the inner cavity 210 can improve the heating efficiency of the process space 211.

[0084] In a more specific embodiment, the outer port of the second mounting hole 2131 (i.e. the opening adjacent to the outer cavity 220) is flush with the outer wall of the inner cavity 210, thereby facilitating the fit of the cavity heating assembly 240 to the outer wall of the inner cavity 210.

[0085] In this embodiment of the invention, the cavity heating assembly 240 can have various structures. In one embodiment, the cavity heating assembly 240 may include a first heating element 241. The inner cavity 210 may include a first cylindrical body 213, a first front end cover 214, and a first rear end cover 215. The first cylindrical body 213 has a second mounting hole 2131. The first front end cover 214 and the first rear end cover 215 are respectively located at two ports of the first cylindrical body 213. Specifically, the first front end cover 214 and the first rear end cover 215 can respectively seal and block the two opposite ports of the first cylindrical body 213 and form a process space 211 with the first cylindrical body 213. The central axis of the first cylindrical body 213 extends along the length direction of the semiconductor process chamber. The first heating element 241 is sleeved outside the first cylindrical body 213 and fits against the outer wall of the first cylindrical body 213. The first heating element 241 has the first clearance hole 2411 described above at the part opposite to the air inlet module 250 and the exhaust module 260. The first heating element 241 is sleeved and attached to the outer wall of the first cylinder 213, so that the process space 211 can be heated evenly in the circumference of the first cylinder 213 (i.e., the direction around the central axis of the first cylinder 213).

[0086] To further improve the heating uniformity of the cavity heating assembly 240, the cavity heating assembly 240 disclosed in this embodiment of the invention may further include a second heating element 242, which may be attached to the outer surface of the first front end cover 214. The way the second heating element 242 is attached to the outer surface of the first front end cover 214 minimizes the distance between the second heating element 242 and the first front end cover 214, thereby improving the heating efficiency of the second heating element 242 on the process space 211.

[0087] Similarly, to further improve the heating uniformity of the cavity heating assembly 240, the cavity heating assembly 240 disclosed in this embodiment of the invention may further include a third heating element 243, which may be attached to the outer surface of the first rear end cover 215. The way the third heating element 243 is attached to the outer surface of the first rear end cover 215 minimizes the distance between the third heating element 243 and the first rear end cover 215, thereby improving the heating efficiency of the third heating element 243 on the process space 211.

[0088] In an embodiment where the cavity heating assembly 240 includes a first heating element 241, a second heating element 242, and a third heating element 243, the first heating element 241, the second heating element 242, and the third heating element 243 can enable the cavity heating assembly 240 to cover the inner cavity 210 in all directions, thereby achieving balanced heating in all directions, which is beneficial to improving the temperature uniformity of the process space 211 during the process.

[0089] As described above, the second mounting hole 2131 is formed on the first cylinder 213. Specifically, the outer surface of the second mounting hole 2131 is the outer wall of the first cylinder 213, meaning that the outer surface of the second mounting hole 2131 is flush with the outer wall of the first cylinder 213. This structure ensures that the second mounting hole 2131 does not protrude from the outer wall of the first cylinder 213. During the installation of the first heating element 241, the first heating element 241 can be pushed by the operator from the side where the first front cover 214 is located or the side where the first rear cover 215 is located, along the outer wall of the first cylinder 213 until the first heating element 241 is in place. Furthermore, the first heating element 241 passes through the area where the second mounting hole 2131 is located without obstruction, and is supported by the first cylinder 213 against its outer wall. The operator only needs to push the first heating element 241 to move it; there is no need to lift it. This structure avoids the problem of excessive operational load caused by lifting the heavier first heating element 241. Furthermore, in this structure, the first heating element 241 is attached to the outer wall of the first cylinder 213, thereby minimizing the distance between the first heating element 241 and the process space 211, which in turn improves the heating efficiency of the process space 211.

[0090] In one embodiment, the first heating element 241 can be a one-piece cylindrical component. The shape of the cavity of the first heating element 241 can be adapted to the shape of the first cylindrical body 213, thereby allowing the first heating element 241 to be sleeved outside the first cylindrical body 213 and to fit against the outer wall of the first cylindrical body 213. For example, if the first cylindrical body 213 is a cylindrical structure, the cavity shape of the first heating element 241 is correspondingly cylindrical. As another example, if the first cylindrical body 213 is a square cylindrical structure, the cavity shape of the first heating element 241 is correspondingly square. This embodiment of the invention does not limit the specific shapes of the first heating element 241 and the first cylindrical body 213.

[0091] In another embodiment, the first heating element 241 can be a split structure, comprising multiple heating plates. These heating plates are circumferentially attached to the outer wall of the first cylinder 213, thereby achieving the fitting of the first heating element 241 (formed by multiple heating plates) onto the first cylinder 213 and also achieving adhesion between the first heating element 241 and the outer wall of the first cylinder 213. For example, the first cylinder 213 is a cylindrical structure, and correspondingly, the multiple heating plates are arc-shaped plates that can adhere to the outer wall of the cylindrical structure. As another example, the first cylinder 213 is a square cylindrical structure, and correspondingly, there are four heating plates, each attached to one of the four outer walls of the square cylindrical structure.

[0092] In this embodiment of the invention, the structure of the outer cavity 220 can be varied, and the specific structure of the outer cavity 220 is not limited. In one embodiment, the outer cavity 220 may include a second cylindrical body 221, a second front end cover 222, and a second rear end cover 223. The second front end cover 222 and the second rear end cover 223 are respectively located at two ports of the second cylindrical body 221. Specifically, the second front end cover 222 and the second rear end cover 223 can respectively seal and block the two opposite ports of the second cylindrical body 221. The second cylindrical body 221 is sleeved outside the first cylindrical body 213. A first mounting hole 2211 can be formed on the second cylindrical body 221, and the first mounting hole 2211 can be distributed opposite to the second mounting hole 2131 formed on the first cylindrical body 213. In this case, the second cylindrical body 221 is opposite to the first cylindrical body 213, the second front end cover 222 is opposite to the first front end cover 214, and the second rear end cover 223 is opposite to the first rear end cover 215. The second front end cover 222 and the second rear end cover 223 are respectively sealed to the two opposite ports of the second cylinder 221, thereby forming the outer sealing structure of the chamber body 200, which is conducive to the formation of the sealing space 212. The first front end cover 214 and the first rear end cover 215 are respectively sealed to the first cylinder 213, thereby forming the process space 211 of the chamber body 200.

[0093] In other embodiments, the first front end cover 214 and the second front end cover 222 are spaced apart and form a first subspace between them; the first rear end cover 215 and the second rear end cover 223 are spaced apart and form a second subspace between them; and the first cylinder 213 and the second cylinder 221 are spaced apart and form a third subspace between them. The sealing space 212 mentioned above may include at least one of the first subspace, the second subspace, and the third subspace. When the cavity heating assembly 240 includes a first heating element 241, a second heating element 242, and a third heating element 243, the first heating element 241 may be located in the third subspace, the second heating element 242 may be located in the first subspace, and the third heating element 243 may be located in the second subspace.

[0094] Before the process begins, the carrier device 100 carries the unprocessed silicon wafer into the process space 211. After the process is completed, the carrier device 100 removes the processed silicon wafer from the process space 211. Both processes require opening the process space 211. In one embodiment, the second front cover 222 and the first front cover 214 can be opened sequentially to open the process space 211. Similarly, the first front cover 214 and the second front cover 222 can be closed sequentially to close the process space 211.

[0095] To improve operational efficiency, in another embodiment, the first front cover 214 is connected to the second front cover 222, so that the first front cover 214 can open and close along with the second front cover 222. This structure allows the operator to open the first front cover 214 simultaneously with the second front cover 222, thereby opening the process space 211. Conversely, closing the second front cover 222 will cause the first front cover 214 to achieve a sealing fit with the first cylinder 213, thereby closing the process space 211. This structure allows the operator to open and close the first front cover 214 and the second front cover 222 simultaneously, thus improving the efficiency of opening and closing the process space 211.

[0096] As described above, the cavity heating assembly 240 may include a second heating element 242, which may be attached to the outer surface of the first front end cover 214. Specifically, the second heating element 242 may be attached to the outer surface of the first front end cover 214 by means of adhesive bonding, snap-fitting, or other methods. This embodiment of the invention does not limit the specific connection method between the second heating element 242 and the first front end cover 214. In one embodiment, the first front end cover 214 is connected to the second front end cover 222 and clamps the second heating element 242 so that the second heating element 242 is attached to the outer surface of the first front end cover 214. This method can achieve the fixation of the second heating element 242 by means of the connection between the first front end cover 214 and the second front end cover 222, without the need for a dedicated structure for installing the second heating element 242, ultimately simplifying the structure of the cavity body 200.

[0097] The embodiments of the present invention do not limit the specific connection method between the first front end cover 214 and the second front end cover 222. In one embodiment, the first front end cover 214 and the second front end cover 222 can be connected by means of screw connection, adhesive bonding, etc.

[0098] In another embodiment, the outer cavity 220 disclosed in this invention may further include an elastic connection structure 224. The elastic connection structure 224 is connected between the second front end cover 222 and the first front end cover 214. When the second front end cover 222 is connected to the port of the corresponding second cylinder 221, the elastic connection structure 224 deforms to drive the first front end cover 214 to abut against the port of the corresponding first cylinder 213. This structure enables the first front end cover 214 to abut against the port of the first cylinder 213 in advance when the ports of the second front end cover 222 and the second cylinder 221 are sealed, thereby causing the elastic connection structure 224 to compress and deform. After being compressed, the elastic connection structure 224 will, in turn, apply elastic force to the first front end cover 214, thereby driving the first front end cover 214 to abut against the port of the first cylinder 213, thus ensuring a stable seal between the ports of the first front end cover 214 and the first cylinder 213. The elastic connection structure 224 not only serves to connect the first front cover 214 and the second front cover 222, but also avoids the sealing problem that may easily exist between the opposite ports of the first front cover 214 and the first cylinder 213 after the opposite ports of the second front cover 222 and the second cylinder 221 are sealed together.

[0099] In this embodiment of the invention, the elastic connection structure 224 can be of various types. For example, the elastic connection structure 224 can include only a spring, with the two ends of the spring connected to the second front end cover 222 and the first front end cover 214, respectively.

[0100] This invention discloses a specific elastic connection structure 224, which may include a first bolt 2241 and a first elastic element 2242. The bolt 2241 passes through the aperture of the first front end cover 214 and is threadedly connected to a threaded blind hole on the inner surface of the second front end cover 222. The nut of the first bolt 2241 makes limiting contact with the inner surface of the first front end cover 214. The first elastic element 2242 is elastically supported between the outer surface of the first front end cover 214 and the inner surface of the second front end cover 222. When the second front end cover 222 is connected to the corresponding port on the second cylinder 221, the first elastic element 2242 is in a compressed state and drives the inner surface of the first front end cover 214 to seal against the opposite port of the first cylinder 213, thereby closing the process space 211. In this elastic connection structure 224, the elastic force of the first elastic element 2242 drives the first front end cover 214 to move along the thread of the first bolt 2241 to seal and abut against the opposite port of the first cylinder 213. At the same time, the first bolt 2241 enables the first front end cover 214 and the second front end cover 222 to be positioned and engaged, thereby preventing the first front end cover 214 from shifting laterally relative to the second front end cover 222. It should be explained that lateral shift refers to the offset of the first front end cover 214 relative to the second front end cover 222 in a plane perpendicular to the axis of the first bolt 2241.

[0101] In this embodiment of the invention, the first elastic element 2242 can be a helical spring, torsion spring, etc., and the specific type of the first elastic element 2242 is not limited. To improve the stability of the elastic deformation of the first elastic element 2242, in a more specific embodiment, the first elastic element 2242 can be sleeved outside the screw and can extend and retract along the screw. In this structure, the screw of the first bolt 2241 can also act as a guide for the elastic deformation of the first elastic element 2242, which helps the first elastic element 2242 apply a spring force parallel to the central axis of the first cylinder 213, ultimately improving the sealing effect between the opposite ports of the first front end cover 214 and the first cylinder 213. A third sealing ring can be provided around the corresponding port between the end faces of the opposite ports of the first front end cover 214 and the first cylinder 213. The third sealing ring can achieve a sealing fit between the opposite ports of the first front end cover 214 and the first cylinder 213 under the pressure of the first front end cover 214. Specifically, the third sealing ring can be installed on the edge of the inner surface of the first front end cover 214, or on the end face of the opposite port of the first cylinder 213. This embodiment of the invention does not impose any limitations.

[0102] Similarly, a fourth sealing ring can be provided between the opposite ports of the second front end cover 222 and the second cylinder 221. The fourth sealing ring can be located on the edge of the inner surface of the second front end cover 222, or on the end face of the second cylinder 221 where the opposite port of the second front end cover 222 is located. The fourth sealing ring is used to achieve a seal between the opposite ports of the second front end cover 222 and the second cylinder 221.

[0103] In this embodiment of the invention, there can be multiple elastic connection structures 224, which can be distributed at intervals along the edge of the first front cover 214, thereby connecting the first front cover 214 and the second front cover 222 at multiple locations. More specifically, the multiple elastic connection structures 224 can be evenly distributed circumferentially on the first front cover 214. The cooperative connection of the multiple elastic connection structures 224 between the first front cover 214 and the second front cover 222 can improve the stability of the connection. At the same time, it can also apply a more balanced elastic force to the first front cover 214, so that the edge of the first front cover 214 achieves a more balanced seal against the opposite port of the first cylinder 213.

[0104] In embodiments where the cavity heating assembly 240 includes a second heating element 242, the elastic connection structure 224 can avoid contact with the second heating element 242. For example, the second heating element 242 can be located in the area surrounded by multiple elastic connection structures 224 and between the second front end cover 222 and the first front end cover 214. Figure 8 As shown. For example, a fourth clearance hole can be provided on the second heating element 242, and the elastic connection structure 224 can pass through the fourth clearance hole to connect the first front end cover 214 and the second front end cover 222 respectively.

[0105] The chamber body 200 disclosed in this embodiment of the invention may include a power supply terminal 230, which may be at least partially disposed in the process space 211 for electrical connection with the boat heating element 140. Considering that the power supply terminal 230 requires an external power source, the power supply terminal 230 may extend from the outside of the chamber body 200 into the process space 211. The power supply terminal 230 may be sealed to the portion of the chamber body 200 through which it (i.e., the power supply terminal 230) passes, to ensure the airtightness of the process space 211 and the sealed space 212. The carrier device 100 may enter and exit the process space 211 to drive the boat heating element 140 to electrically connect or disconnect from the power supply terminal 230.

[0106] There are various ways to achieve a seal between the power supply terminal 230 and the mating part on the chamber body 200, and the embodiments of the present invention are not limited thereto. For example, the power supply terminal 230 can be installed on the chamber body 200 through an integrated machining and sealing process.

[0107] In this embodiment of the invention, the power supply terminal 230 can be sealed and fixed on the second rear end cover 223. The boat heating element 140 includes a power connection terminal 143. The first end of the power supply terminal 230 passes through the second rear end cover 223 and the first rear end cover 215 in sequence and extends into the process space 211. When the port that is sealed and engaged with the second front end cover 222 is opened (i.e., when the process space 211 is opened), the carrier device 100 can move into the inner cavity 210 through the port (which is sealed and engaged with the second front end cover 222) to drive the power connection terminal 143 to be plugged into and electrically connected with the first end of the power supply terminal 230. The carrier device 100 can move out of the inner cavity 210 through the corresponding port to drive the separation of the power connection terminal 143 from the first end of the power supply terminal 230.

[0108] This invention discloses a sealed mounting structure for a power supply terminal 230, specifically as follows: The second rear end cover 223 may have a third clearance hole 2231. The power supply terminal 230 may include a cable connection portion 231, an insulating portion 232, and an electrical connection pin 233. The insulating portion 232 is sealed to the third clearance hole 2231. The first ends of the cable connection portion 231 and the electrical connection pin 233 are electrically connected and both are fixed to the insulating portion 232. The insulating portion 232 insulates and isolates the cable connection portion from the second rear end cover 223, thus preventing electrical connection with the second rear end cover 223 from affecting the potential on the outer cavity 220. The second end of the electrical connection pin 233 passes sequentially through the second rear end cover 223 and the first rear end cover 215 to extend into the process space 211. The electrical connection pin 233 is insulated from the first rear end cover 215. In this embodiment, the second end of the electrical connection pin 233 is the first end of the power supply terminal 230 mentioned above. This method enables the power supply terminal 230 to achieve insulation and sealing with the second rear cover 223 through the insulating part 232, thereby ensuring the sealing and isolation between the sealed space 212 and the external environment of the semiconductor process chamber.

[0109] In an embodiment where the cavity heating assembly 240 includes a third heating element 243, the third heating element 243 may have a second clearance hole 2431. The second end of the electrical connection pin 233 passes sequentially through the second rear end cover 223, the second clearance hole 2431 of the third heating element 243, and the first rear end cover 215 to extend into the process space 211, thereby avoiding the influence of the third heating element 243 on the installation of the electrical connection pin 233. The electrical connection pin 233 may have gaps between itself and the third heating element 243 and the first rear end cover 215, respectively, so that they do not contact each other, thereby achieving insulation isolation between the power supply terminal 230 and the first rear end cover 215, and between the power supply terminal 230 and the third heating element 243.

[0110] In a further embodiment, an extended conduit 216 can be sealed and fixed to the outside of the first rear end cover 215. Specifically, the extended conduit 216 can be integrally manufactured with the first rear end cover 215 using a manufacturing process (e.g., welding) to achieve a seal at their connection point, or a sealing connection with the first rear end cover 215 can be achieved by pressing a sealing ring (i.e., a fifth sealing ring) using a flange structure. The first end of the extended conduit 216 communicates with the process space 211. The second end of the extended conduit 216 extends away from the process space 211. The second end of the electrical connection pin 233 passes through the extended conduit 216 and extends into the process space 211. The electrical connection pin 233 does not contact the extended conduit 216, thereby achieving insulation isolation between them. An insulating annular protrusion 234 can be provided in the area between the two ends of the electrical connection pin 233. A first sealing ring 236 can be sandwiched between the insulating annular protrusion 234 and the end face of the second end of the extended conduit 216. The first sealing ring 236 and the insulating annular protrusion 234 cooperate to seal the second end of the extended conduit 216, thereby achieving a seal where the electrical connection pin 233 enters the extended conduit 216. At the same time, the second end of the extended conduit 216 is far away from the process space 211. Therefore, this structure can achieve a seal on the process space 211 at a position relatively far away from the process space 211, thus making the first sealing ring 236 less susceptible to the high temperature inside the process space 211. This structure also allows the first sealing ring 236 to be relatively far away from the third heating element 243, thus making it less susceptible to the high temperature of the third heating element 243, and thus making the first sealing ring 236 less prone to aging.

[0111] In one embodiment, the second end of the extended conduit 216 may be located between the third heating element 243 and the second rear end cap 223. In this case, the second end of the extended conduit 216 extends to the inside of the second rear end cap 223. Please refer to... Figure 10 In another embodiment, the second end of the extended conduit 216 can pass through the third clearance hole 2231 and extend to the outside of the second rear end cap 223. This structure allows the first sealing ring 236, which seals with the second end of the extended conduit 216, to be further away from the third heating element 243 and also further away from the high-temperature process space 211, thereby further mitigating the aging effect of high temperature on the first sealing ring 236. In this structure, an annular gap can be formed between the extended conduit 216 and the wall of the third clearance hole 2231, thus facilitating the passage of the extended conduit 216 through the third clearance hole 2231 during assembly.

[0112] In this embodiment of the invention, the insulating part 232 may include an annular clamping part 2321, which is fixedly connected to the second rear end cover 223. The power supply terminal 230 may also include a second sealing ring 235, which surrounds the third clearance hole 2231 and is clamped between the annular clamping part 2321 and the second rear end cover 223. This method can achieve a sealed fit and fixed connection between the power supply terminal 230 and the second rear end cover 223, thus achieving a sealed fit between the insulating part 232 and the third clearance hole 2231. Specifically, the annular clamping part 2321 and the second rear end cover 223 can be fixedly connected by multiple connectors (e.g., screws). At the same time, in this structure, the annular clamping part 2321 presses the second sealing ring 235 against the outer surface of the second rear end cover 223, and the annular clamping part 2321 plays a limiting fit role with the second rear end cover 223, which can prevent the power supply terminal 230 from excessively extending into the process space 211.

[0113] Please refer to this again. Figure 10 The outer opening of the third clearance hole 2231 is located on the outer surface of the second rear end cover 223. In one embodiment, the annular clamping part 2321 can directly press the second sealing ring 235 against the outer surface of the second rear end cover 223, thereby achieving a sealing fit between the insulating part 232 and the third clearance hole 2231. Please refer again. Figure 10 In another embodiment, a cover 237 may be fixed to the outer surface of the second rear end cover 223. The cover 237 seals over the outer opening of the third clearance hole 2231. The second end of the electrical connection pin 233 may extend into the process space 211 by passing through the cover 237 and the third clearance hole 2231 in sequence. The annular clamping part 2321 may be fixedly connected to the cover 237 and press the second sealing ring 235 onto the cover 237. The second sealing ring 235 is disposed around the hole (i.e., the third through hole) through which the second end of the power supply connection pin 233 on the cover 237 passes. The second sealing ring 235 is pressed between the cover 237 and the annular pressing part 2321, thereby achieving a seal on the cover 237. Since the cover 237 is sealed over the third clearance hole 2231, this structure can indirectly achieve a seal on the third clearance hole 2231 after the second sealing ring 235 and the annular pressing part 2321 are engaged, thereby achieving a sealed fit and fixed connection between the power supply terminal 230 and the second rear end cover 223. More specifically, the cover 237 can be an integral structure with the second rear end cover 223.

[0114] The electrical connection pin 233 can avoid contact with the cover 237, thereby preventing electrical connection with the cover 237 and ensuring insulation between the electrical connection pin 233 and the second rear end cover 223, ultimately achieving insulation isolation between the electrical connection pin 233 and the outer cavity 220. In other embodiments, the cover 237 can be a rigid insulating member. In this case, the electrical connection pin 233 can be insulated from the second rear end cover 223 through the cover 237, ultimately achieving insulation isolation between the electrical connection pin 233 and the outer cavity 220.

[0115] In the embodiment where the extended pipe 216 is sealed and fixed on the outside of the first rear end cover 215, the cover 237 is sealed and covered on the outer opening of the third clearance hole 2231, and the cover 237 has a certain height. Therefore, this structure is more conducive to the extension of the second end of the extended pipe 216 to the outside of the second rear end cover 223, and is conducive to keeping the first sealing ring 236, which is sealed and matched with the second end of the extended pipe 216, away from the high-temperature process space 211 and the third heating element 243.

[0116] In this embodiment of the invention, the structure of the air intake module 250 can be varied, and the specific structure of the air intake module 250 is not limited. In one embodiment, the air intake module 250 may include a nozzle 251 and at least one air intake pipe 252 for inputting process gas. The nozzle 251 has a plurality of third flow equalization holes 2511 communicating with the process space 211. The nozzle 251 is sealed and fixed at the second mounting hole 2131. The part of the nozzle 251 located in the sealed space 212 is provided with at least one air intake interface. The first end of the air intake pipe 252 is sealed and fixed at the first mounting hole 2211 and exposed outside the outer cavity 220 through the first mounting hole 2211. The second end of the air intake pipe 252 is sealed and connected to the corresponding air intake interface. The plurality of third flow equalization holes 2511 enable the air intake module 250 to have a flow equalization function, thereby enabling the process gas to be ejected from the air intake module 250 more evenly, thus providing a good foundation for the uniform distribution of the process gas in the process space 211.

[0117] The intake pipe 252 can be one or multiple, and correspondingly, the intake interface can be one or multiple. This embodiment of the invention does not limit the specific number of intake pipes 252 and intake interfaces. In embodiments with multiple intake pipes 252 and multiple intake interfaces, the second ends of the multiple intake pipes 252 are sealed and connected to the multiple intake interfaces in a one-to-one correspondence. The semiconductor process chamber disclosed in this embodiment of the invention can perform atomic layer deposition (ALD) processes. During ALD processes, the multiple intake pipes 252 are used to alternately input different types of process gases to alternately input into the process space 211 for film deposition.

[0118] In this embodiment of the invention, the intake pipe 252 can be a rigid pipe. To accommodate assembly errors, in one embodiment, the intake pipe 252 can be a flexible pipe. For example, the intake pipe 252 can be a corrugated pipe, a rubber hose, etc.

[0119] There are several ways to achieve the sealing and fixing of the nozzle 251 at the second mounting hole 2131. For example, the second mounting hole 2131 is a first sealing threaded hole, and the nozzle 251 is provided with a first sealing external thread. The nozzle 251 can achieve the sealing and fixing installation at the second mounting hole 2131 by sealing the first sealing external thread with the first sealing threaded hole.

[0120] Please refer to Figure 12 In another embodiment, the nozzle 251 may be connected to an annular connecting plate 253. The annular connecting plate 253 surrounds the nozzle 251, and the annular connecting plate 253 and the nozzle 251 can be fixedly connected by means of sealing connection such as adhesive bonding or welding, while ensuring the seal at their connection point. The annular connecting plate 253 can be fixed to the outer wall of the inner cavity 210 by a first screw, thereby indirectly fixing the nozzle 251 at the second mounting hole 2131. A sixth sealing ring 254 may be provided between the annular connecting plate 253 and the outer wall of the inner cavity 210. The sixth sealing ring 254 surrounds the second mounting hole 2131 and is pressed between the annular connecting plate 253 and the outer wall of the inner cavity 210 (i.e., the outer wall of the first cylinder 213), thereby achieving a seal at the second mounting hole 2131.

[0121] There are several ways to achieve a sealed connection between the second end of the intake pipe 252 and the corresponding intake port. For example, the intake pipe 252 can be sealed to the corresponding intake port by adhesive bonding. Please refer to [the relevant documentation] again. Figure 12 In another embodiment, the intake pipe 252 and the corresponding intake port can be sealed together by a sealing assembly 255. In one embodiment, the sealing assembly 255 can be a clamping component, the edge of the intake port is provided with a first annular flange, the second end of the intake pipe 252 can be provided with a second annular flange, and a sealing ring (i.e., a ninth sealing ring) can be provided between the first annular flange and the second annular flange. The clamping component clamps the first annular flange and the second annular flange, so that the first annular flange and the second annular flange clamp the sealing ring between them, thereby achieving a sealed connection between the intake pipe 252 and the corresponding intake port. In other embodiments, the sealing assembly 255 can be a sealing clamp.

[0122] There are several ways to achieve a sealed fixation of the first end of the intake pipe 252 at the first mounting hole 2211. For example, the intake pipe 252 can pass through the first mounting hole 2211 and be filled with sealant between itself and the hole wall of the first mounting hole 2211, thereby achieving a sealed fixation of the intake pipe 252 at the first mounting hole 2211.

[0123] Please refer to this again. Figure 12 In another embodiment, a mounting base 256 is sealed and fixed in the first mounting hole 2211. The mounting base 256 can be sealed and fixed in the first mounting hole 2211 by means of a sealing thread structure, sealant, etc. The mounting base 256 has a first through hole corresponding to the air intake pipe 252. A pressure plate 257 is fixed on the outside of the mounting base 256. The pressure plate 257 has a second through hole corresponding to the air intake pipe 252. The inner wall of the second through hole has an annular pressing surface facing the mounting base 256. The first end of the air intake pipe 252 passes through the first through hole and the second through hole in sequence. The outer wall of the portion of the intake pipe 252 located in the second perforation may be provided with a pressing mating surface, the pressing mating surface facing away from the mounting base 256. A seventh sealing ring 258 is provided between the pressure plate 257 and the mounting base 256, the seventh sealing ring 258 surrounding the corresponding first perforation. An eighth sealing ring 259 is fitted on the intake pipe 252, the eighth sealing ring 259 being located between the corresponding annular pressing surface and the pressing mating surface. The pressure plate 257 is fixed to the mounting base 256 by a second screw, thereby pressing the seventh sealing ring 258 onto the mounting base 256 and pressing the eighth sealing ring 259 onto the pressing mating surface of the intake pipe 252, thus achieving a seal between the intake pipe 252 and the inner wall of the second perforation, as well as a seal between the pressure plate 257 and the mounting base 256, ultimately achieving a sealed and fixed installation of the intake pipe 252 at the first mounting hole 2211.

[0124] Based on the semiconductor process chamber disclosed in the embodiments of the present invention, the present invention discloses a semiconductor process apparatus, which may include the semiconductor process chamber described in the above embodiments. In a specific embodiment, the semiconductor process apparatus disclosed in the embodiments of the present invention may further include a process gas source, which can be connected to the inlet module 250 through a process gas delivery pipeline, thereby enabling the delivery of process gas to the process space 211 through the inlet module 250.

[0125] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different features of the various embodiments are not contradictory, they can be combined to form more specific embodiments. For the sake of brevity, they will not be described in detail here.

[0126] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A supporting device, characterized in that, It includes a boat heating element (140) and a bottom support boat (110), a middle support boat (120) and a top support boat (130) stacked sequentially in a first direction. The boat heating element (140) is disposed on a target support boat, and at least one of the bottom support boat (110), the middle support boat (120) and the top support boat (130) is the target support boat. The target carrier boat is provided with a sheet-carrying space, and the target carrier boat includes a peripheral sidewall surrounding the sheet-carrying space. The boat heating element (140) is installed on the outer surface of the peripheral sidewall. The boat heating element (140) includes an electrical terminal (143), and a power supply terminal (230) is at least partially located in the process space (211). The power supply terminal (230) is electrically connected to the electrical terminal (143) after the carrier device (100) enters the process space (211), and the power supply terminal (230) is disconnected from the electrical terminal (143) after the carrier device (100) moves out of the process space (211).

2. The bearing device according to claim 1, characterized in that, The peripheral sidewalls include two first sidewalls (121) and two second sidewalls (122) distributed around the space of the substrate. The two first sidewalls (121) extend along the length direction of the target carrier boat and are opposite to each other. The two second sidewalls (122) extend along the width direction of the target carrier boat and are opposite to each other. The length direction, the width direction and the first direction are perpendicular to each other. The boat heating element (140) is provided on at least the two first sidewalls (121) and extends along the length direction of the first sidewalls (121).

3. The bearing device according to claim 2, characterized in that, The power terminal (143) is located on the outer surface of the second sidewall (122).

4. The bearing device according to claim 1, characterized in that, The boat heating element (140) is fixed to the outer surface of the peripheral sidewall by fasteners; and / or, the outer surface of the peripheral sidewall is provided with a protruding boat lug (123), and the boat heating element (140) is located on the boat lug (123).

5. The bearing device according to claim 1, characterized in that, The boat heating element (140) includes an insulating shell (141) and an electric heating wire (142) fixed inside the insulating shell (141), the insulating shell (141) being disposed on the target carrier boat.

6. The bearing device according to claim 1, characterized in that, The electrical terminal (143) is provided with an electrical connection slot (1431), and the slot of the electrical connection slot (1431) is an flared structure.

7. The bearing device according to claim 6, characterized in that, The electrical connection slot (1431) is provided with a watch strap finger (1432), the electrical connection hole of the watch strap finger (1432) is opposite to the slot of the electrical connection slot (1431), and the watch strap finger (1432) is in conductive contact with the inner wall of the electrical connection slot (1431).

8. A semiconductor process chamber, characterized in that, The device includes a chamber body (200) and a support device (100) as described in any one of claims 1-7. The chamber body (200) is provided with a process space (211), and the support device (100) is disposed in the process space (211). The first direction is the height direction of the chamber body (200).

9. The semiconductor process chamber according to claim 8, characterized in that, The chamber body (200) includes an air intake module (250) and an exhaust module (260); the air intake module (250) is located on the side of the top support boat (130) away from the middle support boat (120) and is connected to the process space (211); the exhaust module (260) is located on the side of the bottom support boat (110) away from the middle support boat (120) and is connected to the process space (211).

10. The semiconductor process chamber according to claim 9, characterized in that, The chamber body (200) further includes a top flow equalizer (270) and / or a bottom flow equalizer (280); the top flow equalizer (270) is located above the top support boat (130) and forms a first flow equalizer space (2111) with the top inner wall of the process space (211); the top flow equalizer (270) has a plurality of first flow equalizer holes that are all connected to the first flow equalizer space (2111); the air intake module (250) is connected to the first flow equalizer space (2111); the bottom flow equalizer (280) is located below the bottom support boat (110) and forms a second flow equalizer space (2112) with the bottom inner wall of the process space (211); the exhaust module (260) is connected to the second flow equalizer space (2112); the bottom flow equalizer (280) has a plurality of second flow equalizer holes that are connected to the second flow equalizer space (2112).

11. The semiconductor process chamber according to claim 10, characterized in that, The top flow equalizer (270) includes a first region directly opposite the intake module (250) and a second region offset from the intake module (250), wherein the distribution density of the first flow equalizer holes in the first region is less than the distribution density of the first flow equalizer holes in the second region; and / or, The bottom flow equalization plate (280) includes a third region directly opposite the exhaust module (260) and a fourth region offset from the exhaust module (260). The distribution density of the second flow equalization holes in the third region is less than that in the fourth region.

12. The semiconductor process chamber according to claim 9, characterized in that, The chamber body (200) further includes an outer cavity (220) and an inner cavity (210). The inner cavity (210) is located inside the outer cavity (220) and is provided with the process space (211). The first end of the air intake module (250) and the first end of the exhaust module (260) are respectively sealed and installed at the corresponding first mounting hole (2211) on the outer cavity (220) and exposed outside the outer cavity (220). The second end of the air intake module (250) and the second end of the exhaust module (260) are respectively sealed and installed at the corresponding second mounting hole (2131) on the inner cavity (210) and communicate with the process space (211). A sealed space (212) is formed between the inner cavity (210) and the outer cavity (220).

13. The semiconductor process chamber according to claim 12, characterized in that, The outer port of the second mounting hole (2131) is flush with the outer wall of the inner cavity (210). The chamber body (200) also includes a cavity heating assembly (240), which is sleeved outside the inner cavity (210) and fits against the outer wall of the inner cavity (210). The cavity heating assembly (240) has a first clearance hole (2411) to avoid the air intake module (250) and the exhaust module (260).

14. The semiconductor process chamber according to claim 13, characterized in that, The cavity heating assembly (240) includes a first heating element (241). The inner cavity (210) includes a first cylindrical body (213) and a first front end cover (214) and a first rear end cover (215) located at two ports of the first cylindrical body (213). The first heating element (241) is sleeved outside the first cylindrical body (213) and fits against the outer wall of the first cylindrical body (213). The first cylindrical body (213) has a second mounting hole (2131), and the first heating element (241) has a first clearance hole (2411). The central axis of the first cylindrical body (213) extends along the length direction of the semiconductor process cavity.

15. The semiconductor process chamber according to claim 12, characterized in that, The inner cavity (210) includes a first cylindrical body (213) and a first front end cap (214) and a first rear end cap (215) located at two ports of the first cylindrical body (213). The outer cavity (220) includes a second cylindrical body (221) sleeved outside the first cylindrical body (213) and a second front end cap (222) and a second rear end cap (223) located at two ports of the second cylindrical body (221). The first mounting hole (2211) is opened on the second cylindrical body (221). The first front end cap (214) is connected to the second front end cap (222).

16. The semiconductor process chamber according to claim 15, characterized in that, The outer cavity (220) further includes an elastic connection structure (224), which is connected between the second front end cover (222) and the first front end cover (214). When the second front end cover (222) is connected to the port of the corresponding second cylinder (221), the elastic connection structure (224) deforms to drive the first front end cover (214) to abut against the port of the corresponding first cylinder (213).

17. The semiconductor process chamber according to claim 12, characterized in that, The air intake module (250) includes a nozzle (251) and at least one air intake pipe (252) for inputting process gas. The nozzle (251) has a plurality of third flow equalization holes (2511) communicating with the process space (211). The nozzle (251) is sealed and fixed at the second mounting hole (2131). The part of the nozzle (251) located in the sealed space (212) is provided with an air intake interface. The first end of the air intake pipe (252) is sealed and fixed at the first mounting hole (2211) and exposed outside the outer cavity (220). The second end of the air intake pipe (252) is sealed and connected to the corresponding air intake interface.

18. The semiconductor process chamber according to claim 17, characterized in that, The air intake module (250) also includes an annular connecting plate (253) and a sixth sealing ring (254). The annular connecting plate (253) is arranged around the nozzle (251) and is sealed to the nozzle (251). The annular connecting plate (253) is fixed on the outer wall of the inner cavity (210). The sixth sealing ring (254) is arranged around the second mounting hole (2131) and is located between the annular connecting plate (253) and the outer wall of the inner cavity (210).

19. The semiconductor process chamber according to claim 17 or 18, characterized in that, The intake module (250) further includes a mounting base (256), a seventh sealing ring (258), and an eighth sealing ring (259). The mounting base (256) is sealed and fixed in the first mounting hole (2211). The mounting base (256) has a first through hole corresponding to the intake pipe (252). A pressure plate (257) is fixed on the outer side of the mounting base (256). The pressure plate (257) has a second through hole corresponding to the intake pipe (252). The inner wall of the second through hole has an annular pressing surface facing the mounting base (256). The first end of the air intake pipe (252) passes through the first perforation and the second perforation in sequence, and the outer wall of the part of the air intake pipe (252) located in the second perforation is provided with a pressing mating surface. The pressing mating surface faces away from the mounting base (256). The seventh sealing ring (258) is arranged around the first perforation. The seventh sealing ring (258) is pressed between the pressure plate (257) and the mounting base (256). The eighth sealing ring (259) is sleeved on the air intake pipe (252) and is pressed between the annular pressing surface and the pressing mating surface.

20. The semiconductor process chamber according to claim 15, characterized in that, The chamber body (200) also includes a power supply terminal (230), which extends from the outside of the chamber body (200) into the process space (211); the carrier device (100) can enter and exit the process space (211) to drive the boat heating element (140) to be electrically connected or disconnected from the power supply terminal (230).

21. The semiconductor process chamber according to claim 20, characterized in that, The second rear end cover (223) has a third clearance hole (2231). The power supply terminal (230) includes a cable connection part (231), an insulation part (232), and an electrical connection pin (233). The insulation part (232) is sealed to the third clearance hole (2231). The first ends of the cable connection part (231) and the electrical connection pin (233) are electrically connected and fixed on the insulation part (232) and are insulated from the second rear end cover (223) through the insulation part (232). The second end of the electrical connection pin (233) passes through the second rear end cover (223) and the first rear end cover (215) in sequence and extends into the process space (211). The electrical connection pin (233) is insulated from the first rear end cover (215). The electrical connection pin (233) is used to connect to the boat heating element (140).

22. The semiconductor process chamber according to claim 21, characterized in that, An extended conduit (216) is sealed and fixed on the outer side of the first rear end cover (215). The first end of the extended conduit (216) is connected to the process space (211). The second end of the extended conduit (216) extends away from the process space (211). The second end of the electrical connection pin (233) passes through the extended conduit (216) and extends into the process space (211). An insulating annular protrusion (234) is provided in the area between the two ends of the electrical connection pin (233). A first sealing ring (236) is sandwiched between the insulating annular protrusion (234) and the end face of the second end of the extended conduit (216).

23. The semiconductor process chamber according to claim 21 or 22, characterized in that, The insulating part (232) includes an annular clamping part (2321), which is fixedly connected to the second rear end cover (223). The power supply terminal (230) also includes a second sealing ring (235), which is arranged around the third clearance hole (2231) and clamped between the annular clamping part (2321) and the second rear end cover (223).

24. A semiconductor process apparatus, characterized in that, Includes the semiconductor process chamber as described in any one of claims 8-23.

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