A PCB board compatible with multiple mounting modes

Abstract

This invention relates to a PCB board compatible with multiple mounting modes, comprising: a PCB substrate, wherein a circuit layer is arranged on the upper surface of the PCB substrate, and a plurality of blind holes are drilled from the bottom of the PCB substrate, with a thin layer of predetermined thickness left at the top of the blind holes; a reusable pad disposed on the upper surface of the PCB substrate corresponding to the blind holes, the reusable pad comprising an outer ring portion and an inner ring portion, the outer ring portion and the inner ring portion being arranged concentrically, the center of the inner ring portion having a plurality of break lines radiating from the center, and a plurality of cutout lines being disposed between the outer ring portion and the inner ring portion; when used for surface mounting, the reusable pad is used to support and solder corresponding components; when used for through-hole mounting, the inner ring portion is pierced downward to form a through hole; when the inner ring portion is pierced downward by external force, the break lines make the inner ring portion easy to break and bend downward, and the copper foil outside the cutout lines unfolds and attaches to the downwardly bent portion of the inner ring portion.

Description

Technical Field

[0001] This invention relates to the field of PCB boards, specifically to a PCB board compatible with multiple mounting modes. Background Technology

[0002] A PCB (Printed Circuit Board) is a board on an insulating substrate where circuit connections and printed components are formed according to design. It serves as the support for electronic components and the carrier for their electrical interconnection. Electronic products are formed by placing electronic components on the surface of the PCB and then soldering them onto the PCB. There are two methods for placing electronic components on the PCB surface: surface mount technology (SMT) and through-hole mounting (THT). SMT soldering involves placing components directly on the PCB surface and fixing them using surface soldering, typically employing solder paste and reflow soldering techniques. It does not require penetrating the PCB and therefore does not require through-holes. THT soldering involves components with leads that need to be inserted through holes in the PCB before soldering. This requires the PCB to have suitable through-holes for insertion, and these holes must maintain a certain diameter, position, and mechanical strength during the insertion process.

[0003] In the current technology, PCB boards only support one of surface mount technology or through-hole mounting, and it is not yet possible to achieve simultaneous compatibility between surface mount technology and through-hole mounting.

[0004] The purpose of this invention is to design a PCB board that is compatible with multiple mounting modes to address the problems existing in the prior art. Summary of the Invention

[0005] In view of the problems existing in the prior art, the present invention provides a PCB board that is compatible with multiple mounting modes, which can effectively solve at least one of the problems existing in the prior art.

[0006] The technical solution of this invention is: A PCB board compatible with multiple mounting modes, including: A PCB substrate, wherein a circuit layer is arranged on the upper surface of the PCB substrate, and a number of blind holes are drilled from the bottom of the PCB substrate, and a thin layer of predetermined thickness is left at the top of the blind holes. A reused pad is disposed on the upper surface of the PCB substrate corresponding to the blind hole. The reused pad includes an outer ring portion and an inner ring portion. The outer ring portion and the inner ring portion are disposed at the same center. The center of the inner ring portion is provided with several broken lines radiating from the center. Several hollow lines are provided between the outer ring portion and the inner ring portion. When used for surface mount, the reused pads are used to support and solder the corresponding components. When used for through-hole mounting, the inner ring is pierced downward to form a hole. When the inner ring is pierced downward by external force, the fracture line makes the inner ring easy to break and bend downward. The copper foil outside the cutout line unfolds and attaches to the downwardly bent part of the inner ring.

[0007] Furthermore, the hollowed-out lines have a bent structure.

[0008] Furthermore, the opening of the hollow line faces the circumferential direction between the inner ring portion and the outer ring portion.

[0009] Furthermore, the hollow line includes an outer bend and an inner bend, wherein the length of the outer bend is greater than the length of the inner bend.

[0010] Furthermore, the preset thickness of the thin layer at the top of the blind hole is 0.1 mm to 0.2 mm.

[0011] Furthermore, the diameter of the blind hole is smaller than the inner diameter of the outer ring portion, and the diameter of the blind hole is larger than the outer diameter of the inner ring portion.

[0012] Furthermore, the fracture line is formed by etching the corresponding position of the inner ring portion.

[0013] Furthermore, a stress relief hole is provided at the end of the fracture line.

[0014] Furthermore, the PCB substrate has several through-hole pads near its edge. These through-hole pads are electrically connected to the multiplex pads via connecting lines. The spacing between the through-hole pads in the same group is greater than the spacing between the multiplex pads in the same group.

[0015] Therefore, the present invention provides the following effects and / or advantages: This application improves upon the reused pad structure, blind via design, and break line placement to ensure that the PCB design can simultaneously support surface mount and through-hole mounting modes. By modifying the shape of the cutout lines, the size of the blind vias, and the location of the break lines, this application enhances the stability of the through-hole formation when the inner ring is pierced, preventing debris and edge cracks from forming during the through-hole process.

[0016] This application uses a perforated line to create a hinge structure around the corresponding copper foil, causing the copper foil to deform and unfold when the inner ring is punctured. This allows the copper foil to remain attached to the edge of the broken inner ring, preventing the break from forming an irregular shape and affecting the socket performance.

[0017] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained through the structures particularly pointed out in the description and the drawings.

[0018] It should be understood that the above summary and the following detailed description of the invention are exemplary and explanatory, and are intended to provide further explanation of the invention as claimed. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the PCB substrate.

[0020] Figure 2 This is a schematic diagram of the structure of one of the reused pads.

[0021] Figure 3 for Figure 2 AA sectional view. Detailed Implementation

[0022] To facilitate understanding by those skilled in the art, the structure of the present invention will now be described in further detail with reference to the accompanying drawings: refer to Figure 1-3 A PCB board compatible with multiple mounting modes, including: PCB substrate 1, the upper surface of which is provided with a circuit layer 11, and the PCB substrate 1 has a plurality of blind holes 12 drilled from the bottom, and the top of the blind holes 12 has a thin layer of a predetermined thickness. In this embodiment, a circuit layer 11 is provided on the upper surface of the PCB substrate 1, which is responsible for connecting various parts of the circuit. Blind vias 12 at the bottom provide support for subsequent insertion and soldering. By drilling blind vias 12 at the bottom and leaving a thin layer, this location can both support surface mount component soldering and be easily pierced to form through-holes for insertion, allowing component leads to pass through. This provides the basic structure for the same PCB substrate to simultaneously support SMD and THT.

[0023] A reused pad 2 is disposed on the upper surface of the PCB substrate 1 corresponding to the blind hole 12. The reused pad 2 includes an outer ring portion 21 and an inner ring portion 22. The outer ring portion 21 and the inner ring portion 22 are disposed at the same center. The center of the inner ring portion 22 is provided with a plurality of fracture lines 23 radiating from the center. A plurality of hollow lines 3 are provided between the outer ring portion 21 and the inner ring portion 22. In this embodiment, the multiplex pad 2 serves as a support structure for surface mount components to be soldered or punctured. Specifically, the multiplex pad 2 is divided into an outer ring 21 and an inner ring 22. The inner ring 22 is preferably circular and is located at the center of the entire multiplex pad 2. Several fracture lines 23 radiating from the center can form a cross, Y, or star shape, etc. When the thin layer structure of the inner ring 22 is punctured, the area of ​​the inner ring 22 other than the cutout lines 3 and fracture lines 23 is covered with copper foil. If there are no fracture lines 23, the copper foil is attached to the surface of the entire inner ring 22, which can prevent the inner ring 22 from being punctured. The copper foil itself has strong toughness and will not break easily. Instead, it will first undergo severe plastic deformation (bulging) like a drumhead until the stress exceeds its limit, and finally tear randomly and irregularly at the weakest point. This embodiment features a fracture line 23, which significantly weakens the structural strength of the inner ring 22 beforehand and precisely guides the stress direction. When the ejector pin pierces downwards, the inner ring 22 will focus on breaking along the preset fracture line, making the process controllable and predictable.

[0024] Simultaneously, this embodiment also includes a perforated line 3, located between the inner ring portion 22 and the outer ring portion 21. Specifically, there is a ring-shaped copper foil between the inner ring portion 22 and the outer ring portion 21, which connects the copper foil of the inner ring portion 22 and the outer ring portion 21. The perforated line 3 creates a weakened structure between the inner ring portion 22 and the outer ring portion 21. Without these perforated lines 3, the inner and outer ring portions of the reused pad would be a completely integrated copper foil without any weakening design. When the pin pierces through, the enormous force would act directly on the edge connecting the inner and outer ring portions, causing the thin layer below the inner ring portion 22 to fracture brittlely due to excessive stretching, resulting in several independent, detachable fragments and a hole with irregular holes. With the perforated line 3 in place, stress is concentrated here during piercing, making the copper foil here more prone to stretching, bending and bending, forming a hinge-like structure that allows the inner ring to fold down while holding it firmly, preventing debris from being generated and controlling the edge shape of the formed perforation.

[0025] When used for surface mount, the reused pad 2 is used to support and solder the corresponding components. When used for through-hole mounting, the inner ring 22 is pierced downward to form a hole. When the inner ring 22 is pierced downward by external force, the fracture line 23 makes the inner ring 22 easy to break and bend downward. The copper foil outside the cutout line 3 unfolds and attaches to the downwardly bent part of the inner ring 22.

[0026] By setting the position and shape of the above-mentioned fracture line 23 and hollow line 3, it is possible to effectively form a perforation and control the shape and edge of the perforation to avoid generating debris, forming a socket for the pins of components to pass through, while the thin layer at the top of the blind hole has sufficient support to support the components when the inner ring 22 is not pierced, thus achieving compatibility with two mounting modes at the same time.

[0027] Furthermore, the hollow line 3 has a bent structure.

[0028] Furthermore, the opening of the hollow line 3 faces the circumferential direction between the inner ring portion and the outer ring portion.

[0029] In this embodiment, the cutout line 3 is a bent structure, and the corresponding copper foil around it also forms a bent structure. When the inner ring 22 is pierced, the copper foil with the bent structure can naturally unfold. When the reuse pad 2 is subjected to external force, it provides better deformation and adhesion, and improves the stability during the welding and insertion process.

[0030] By orienting the opening of the cutout line 3 toward the circumferential direction between the inner and outer rings, the cutout line 3 can smoothly unfold and connect with the inner ring portion 22 of the reused pad when subjected to external force. Furthermore, when the inner ring portion 22 is pierced, due to the ductility of the PCB substrate material, the destructive force will cause the thin layer below the inner ring portion 22 to undergo downward stretching deformation. The orientation of the cutout line 3 opening allows the thin layer to undergo downward stretching deformation, causing the opening of the copper foil around the cutout line 3 to expand in the vertical direction, thereby increasing the stability during piercing and avoiding uneven stress.

[0031] Furthermore, the hollow line 3 includes an outer bend 31 and an inner bend 32, wherein the length of the outer bend 31 is greater than the length of the inner bend 32.

[0032] In this embodiment, the length of the outer bend 31 is greater than that of the inner bend 32. This design gives the outer bend a stronger load-bearing capacity, better supporting the bending of the inner ring and preventing premature breakage of the reused pads. The inner bend is shorter, allowing it to deform quickly during insertion, ensuring that the inner ring can bend downwards smoothly and remain connected to the outer ring.

[0033] Furthermore, the preset thickness of the thin layer at the top of the blind hole 12 is 0.1 mm to 0.2 mm.

[0034] In this embodiment, by precisely controlling the thickness of the blind via top, sufficient soldering strength is ensured while avoiding damage to the reusable pads caused by excessive pressure during insertion. This thickness design enables the blind via to exhibit high stability in various application scenarios.

[0035] Furthermore, the diameter of the blind hole 12 is smaller than the inner diameter of the outer ring portion 21, and the diameter of the blind hole 12 is larger than the outer diameter of the inner ring portion 22.

[0036] By limiting the diameter, the edge of the thin layer corresponding to the blind hole 12 is located between the outer ring portion 21 and the inner ring portion 22. At this time, the hollow line 3 is also located at the edge of the thin layer. In this case, it can be ensured that when the inner ring portion 22 is bent, the bending position corresponds to the area of ​​the hollow line 3.

[0037] Furthermore, the fracture line 23 is formed by etching the corresponding position of the inner ring portion 22.

[0038] By etching, a fracture line 23 is formed in the inner ring 22 to ensure that the reuse pad 2 can break along a predetermined path when subjected to external force, so that the inner ring 22 can be bent smoothly and inserted. At the same time, this method can set the fracture line 23 when the trace is formed on the PCB substrate surface.

[0039] Furthermore, a stress relief hole 24 is provided at the end of the fracture line 23.

[0040] In this embodiment, the stress relief hole 24 provided at the end of the fracture line 23 can effectively reduce stress concentration, prevent the crack from continuing to extend unexpectedly along the fracture line to the outer ring or other circuit areas, protect the integrity of the overall structure of the reuse pad 2 and the surrounding circuits, and improve the reliability of the product.

[0041] Furthermore, the PCB substrate 1 has a plurality of socket pads 4 near its edge. The socket pads 4 are electrically connected to the multiplex pads 2 via connecting lines. The spacing between the socket pads 4 in the same group is greater than the spacing between the multiplex pads 2 in the same group.

[0042] In this embodiment, when the spacing of the same set of multiplex pads 2 cannot meet the pin width of the pin component, the pin component can be installed through the socket pad 4. Since the socket pad 4 is electrically connected to the multiplex pad 2 through the connecting line, and the multiplex pad 2 can be connected to the corresponding chip, device, etc. on the PCB substrate, the socket pad 4 can also be connected to the corresponding chip, device, etc. on the PCB substrate to realize device installation.

[0043] It should be noted that any reference signs placed between parentheses in the claims should not be construed as limiting the claims. The word "comprising" does not exclude the presence of components or steps not listed in the claims. The word "a" or "an" preceding a component does not exclude the presence of a plurality of such components. The invention can be implemented by means of hardware comprising several different components and by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

[0044] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0045] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0046] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

Claims

1. A PCB board compatible with multiple mounting modes, characterized in that: include: A PCB substrate, wherein a circuit layer is arranged on the upper surface of the PCB substrate, and a number of blind holes are drilled from the bottom of the PCB substrate, and a thin layer of predetermined thickness is left at the top of the blind holes. A reused pad is disposed on the upper surface of the PCB substrate corresponding to the blind hole. The reused pad includes an outer ring portion and an inner ring portion. The outer ring portion and the inner ring portion are disposed at the same center. The center of the inner ring portion is provided with several broken lines radiating from the center. Several hollow lines are provided between the outer ring portion and the inner ring portion. When used for surface mount, the reused pads are used to support and solder the corresponding components. When used for through-hole mounting, the inner ring is pierced downward to form a hole. When the inner ring is pierced downward by external force, the fracture line makes the inner ring easy to break and bend downward. The copper foil outside the cutout line unfolds and attaches to the downwardly bent part of the inner ring.

2. The PCB board compatible with multiple mounting modes according to claim 1, characterized in that: The hollowed-out lines have a bent structure.

3. A PCB board compatible with multiple mounting modes according to claim 2, characterized in that: The opening of the hollow line faces the circumferential direction between the inner ring and the outer ring.

4. A PCB board compatible with multiple mounting modes according to claim 2, characterized in that: The hollow line includes an outer bend and an inner bend, and the length of the outer bend is greater than the length of the inner bend.

5. A PCB board compatible with multiple mounting modes according to claim 1, characterized in that: The preset thickness of the thin layer at the top of the blind hole is 0.1 mm to 0.2 mm.

6. A PCB board compatible with multiple mounting modes according to claim 1, characterized in that: The diameter of the blind hole is smaller than the inner diameter of the outer ring portion, and the diameter of the blind hole is larger than the outer diameter of the inner ring portion.

7. A PCB board compatible with multiple mounting modes according to claim 1, characterized in that: The fracture line is formed by etching the corresponding position of the inner ring portion.

8. A PCB board compatible with multiple mounting modes according to claim 1, characterized in that: The end of the fracture line is provided with a stress relief hole.

9. A PCB board compatible with multiple mounting modes according to claim 1, characterized in that: The PCB substrate has several through-hole pads near its edge. The through-hole pads are electrically connected to the multiplex pads via connecting lines. The spacing between the through-hole pads in the same group is greater than the spacing between the multiplex pads in the same group.

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