Cooling device and cooling unit provided with same

Abstract

The invention provides a cooling device and a cooling unit provided with the same. The cooling device includes a first cold plate, a pair of manifolds, an inflow pipe, and an outflow pipe. The lower surface of the first cold plate is in thermal contact with the heat generating component, and the first cold plate has a first refrigerant flow path through which a refrigerant flows. The pair of manifolds is disposed so as to face each other with the first cold plate therebetween, and has a first refrigerant pipe through which a refrigerant flows. An inflow pipe extends from one manifold to an inflow port of the first cold plate and causes refrigerant to flow into the first cold plate. An outflow pipe extends from an outflow port of the first cold plate to the other manifold and causes refrigerant to flow out to the other manifold. The first refrigerant pipe extends in an intersecting direction intersecting with an opposing direction of the pair of manifolds. At least one of the inflow pipe and the outflow pipe is connected to the first refrigerant pipe via an elbow disposed on the upper surface or the lower surface of the manifold.

Description

TECHNICAL FIELD

[0001] The present application relates to a cooling device and a cooling unit provided with the same. BACKGROUND

[0002] A conventional cooling device includes a cold plate, a pair of manifolds, an inflow pipe, and an outflow pipe. A lower surface of the cold plate is in thermal contact with a heat generating component, and the cold plate has a refrigerant flow path inside for the refrigerant to flow. The pair of manifolds are arranged opposite each other with the cold plate in between. The inflow pipe extends from one of the manifolds to an inflow port of the cold plate to cause the refrigerant to flow into the cold plate. The outflow pipe causes the refrigerant flowing out of an outflow port of the cold plate to flow out to the other of the manifolds. The refrigerant pipe extends in a crossing direction crossing the opposite direction of the pair of manifolds (see, for example, Patent Literature 1). [Patent Literature] [Patent Literature]

[0003] [Patent Literature 1] Chinese Taiwan Patent Application Publication No. 202304283 SUMMARY

[0004] However, in the conventional cooling device, when connecting the inflow pipe and the manifold or when connecting the outflow pipe and the manifold, the assembly workability can be reduced. Further, when causing the cooling air to flow along the inflow pipe and the outflow pipe, the heat of the heat generating component and components arranged around the heat generating component can be exhausted. However, the cooling air collides with the manifolds, and there is a possibility that the cooling effect of the cooling air is reduced.

[0005] An object of the present application is to provide a cooling device capable of improving assembly workability and improving the cooling effect of cooling air, and a cooling unit provided with the same.

[0006] An exemplary cooling device of the present application includes a first cold plate, a pair of manifolds, an inflow pipe, and an outflow pipe. A lower surface of the first cold plate is in thermal contact with a heat generating component, and the first cold plate has a first refrigerant flow path inside for a refrigerant to flow. The pair of manifolds are arranged opposite each other with the first cold plate in between, and have a first refrigerant pipe for the refrigerant to flow. The inflow pipe extends from one of the manifolds to an inflow port of the first cold plate to cause the refrigerant to flow into the first cold plate. The outflow pipe extends from an outflow port of the first cold plate to the other of the manifolds to cause the refrigerant to flow out to the other of the manifolds. The first refrigerant pipe extends in a crossing direction crossing the opposite direction of the pair of manifolds. At least one of the inflow pipe and the outflow pipe is connected to the first refrigerant pipe via an elbow arranged on an upper surface or a lower surface of the manifold.

[0007] According to the exemplary present application, it is possible to provide a cooling device capable of improving assembly workability and improving the cooling effect of cooling air. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1is a perspective view of the cooling device of the first embodiment of the present application. Figure 2 is a perspective view of the cooling device of the first embodiment of the present application. Figure 3 is a perspective view of the cooling device of the first embodiment of the present application. Figure 4 is a side view of the cooling device of the first embodiment of the present application. Figure 5 is a perspective view of the cooling unit of the second embodiment of the present application. Figure 6 is a plan view of the cooling device of the third embodiment of the present application. Figure 7 is a plan view of the cooling device of the third embodiment of the present application. Figure 8 is a longitudinal sectional view of the elbow of the cooling device of the third embodiment of the present application, which is enlarged and schematically shown. Figure 9 is a longitudinal sectional view of the elbow of the cooling device of the third embodiment of the present application, which is enlarged and schematically shown. Figure 10 is a side view of the cooling device of the third embodiment of the present application. Figure 11 is a longitudinal sectional view of the manifold of the cooling device of the third embodiment of the present application, which is enlarged and schematically shown. Figure 12 is a perspective view of a part of the cooling device of the third embodiment of the present application, which is enlarged. DETAILED DESCRIPTION

[0009] Hereinafter, exemplary embodiments of the present application will be described with reference to the drawings. In this application, the direction in which the bracket 50 is arranged with respect to the cold plate 11 is referred to as "upper side", and the opposite side of the direction in which the bracket 50 is arranged is referred to as "lower side". In this application, the direction in which the bracket 50 is arranged with respect to the cold plate 11 is referred to as "vertical direction", and the direction orthogonal to the "vertical direction" is referred to as "horizontal direction", and the shape and positional relationship of each part are described.

[0010] In addition, the direction opposite to the pair of manifolds 21, 22 of the cooling device 1 is set as the opposite direction (X1-X2), and the direction intersecting the opposite direction (X1-X2) is set as the intersecting direction (Y1-Y2). In the present embodiment, the vertical direction (Z1-Z2) is orthogonal to the opposite direction (X1-X2) and the intersecting direction (Y1-Y2). However, this is only to define the vertical direction and the horizontal direction for ease of explanation, and is not to limit the orientation when manufacturing and using the cooling device 1 of the present application.

[0011] Further, in the present application, a "parallel direction" also includes a substantially parallel direction. Further, in the present application, an "orthogonal direction" also includes a substantially orthogonal direction.

[0012] <First Embodiment> (1. Structure of cooling device) A cooling device of an exemplary embodiment of the present application will be described. Figure 1 、 Figure 2 and Figure 3 is a perspective view of a cooling device 1 of an embodiment of the present application. Figure 2 The cooling device is shown from below, and Figure 3 a state in which the top wall portion 51 of the bracket 50 is omitted is shown.

[0013] The cooling device 1 includes a plurality of cold plates (first cold plates) 11, a pair of manifolds 21, 22, an inflow pipe 31, an outflow pipe 32, a supply pipe 41, a discharge pipe 42, and a bracket 50.

[0014] The plurality of cold plates 11 are connected in parallel to the pair of manifolds 21, 22 via the inflow pipe 31 and the outflow pipe 32. The manifold 21 is connected to the supply pipe 41, and the manifold 22 is connected to the discharge pipe 42. The supply pipe 41 and the discharge pipe 42 are connected to a pump (not shown).

[0015] When the pump is driven, refrigerant is supplied from the supply pipe 41 to the manifold 21. The refrigerant supplied to the manifold 21 is branched to each inflow pipe 31, respectively.

[0016] The branched refrigerant flows into each cold plate 11, respectively. The refrigerant flowing into each cold plate 11 flows out to the manifold 22 via the outflow pipe 32, respectively. The refrigerant flowing out to the manifold 22 is returned to the pump again via the discharge pipe 42. Thus, the refrigerant circulates within the cooling device 1, and the lower surface of the cold plate 11 is cooled by the refrigerant.

[0017] (1-1. Detailed structure of cold plate) The lower surface of the cold plate 11 is in thermal contact with a heat generating component (not shown), and the cold plate 11 has a refrigerant flow path (first refrigerant flow path) 11a (see Figure 2 ) inside which the refrigerant flows.

[0018] In the present embodiment, the plurality of cold plates 11 are arranged in the cross direction (Y1-Y2) and connected in parallel via the pair of manifolds 21, 22. Thus, the cold plates 11 are arranged corresponding to the plurality of heat generating components, respectively, and the plurality of heat generating components can be efficiently cooled. In the present embodiment, two cold plates 11 are arranged in the cross direction (Y1-Y2), but one or more than three can also be arranged.

[0019] The cold plate 11 is made of a metal such as copper or aluminum that has high thermal conductivity. The cold plate 11 has a bottom wall portion 111 and a cover portion 110. The bottom wall portion 111 has a recessed portion 111a that is recessed downward (Z2) and a flange portion 111b that extends in the horizontal direction from the upper end periphery of the recessed portion 111a (see FIG. 2). Figure 2 ) The cover portion 110 covers the opening of the recessed portion 111a and is joined to the flange portion 111b. The heat generating component contacts the lower surface of the recessed portion 111a.

[0020] A refrigerant flow path (first refrigerant flow path) 11a is formed in the space surrounded by the recessed portion 111a of the bottom wall portion 111 and the cover portion 110, and a plurality of vanes (not shown) are disposed in the refrigerant flow path (first refrigerant flow path) 11a. The vanes are formed, for example, by cutting the upper surface of the bottom wall portion 111. Thereby, the thermal conductivity from the bottom wall portion 111 to the vanes is improved.

[0021] The cover portion 110 is formed with a flow inlet 110a and a flow outlet 110b that penetrate in the vertical direction (Z1-Z2). The flow inlet 110a and the flow outlet 110b are opposite the recessed portion 111a in the vertical direction (Z1-Z2). The refrigerant flow path (first refrigerant flow path) 11a is formed inside the recessed portion 111a.

[0022] In the present embodiment, the cold plate 11 is rectangular when viewed from above, but is not limited thereto. For example, it can be a polygon having a plurality of angles when viewed from above, or a circular shape.

[0023] (1-2. Detailed structure of the manifolds) A pair of manifolds 21, 22 are disposed opposite each other with the cold plate 11 therebetween, and each has a refrigerant pipe (first refrigerant pipe) 21a, 22a through which a refrigerant flows. In the present embodiment, the manifolds 21, 22 are formed in a cuboid shape, and the refrigerant pipes 21a, 22a extend in the cross direction (Y1-Y2). Further, the refrigerant pipes 21a, 22a extend parallel to each other, and the opposite direction (X1-X2) and the cross direction (Y1-Y2) are orthogonal. Thereby, it is possible to suppress the large size of the cooling device 1.

[0024] The inflow pipe 31 extends from one manifold 21 to the flow inlet 110a of the cold plate 11 and causes a refrigerant to flow into the cold plate 11. The outflow pipe 32 extends from the flow outlet 110b of the cold plate 11 to the other manifold 22 and causes a refrigerant to flow out to the other manifold 22.

[0025] In the present embodiment, the inflow pipe 31 and the outflow pipe 32 extend in parallel along the relative direction (X1-X2) and orthogonally to the extending direction of the refrigerant pipes 21a, 22a. In addition, the inflow pipe 31 and the outflow pipe 32 can also not extend in a straight line over the entire length in the relative direction (X1-X2). For example, a part of the inflow pipe 31 and the outflow pipe 32 can extend in parallel along the relative direction (X1-X2) while being curved.

[0026] The inflow pipe 31 is connected to the refrigerant pipe 21a at the relative direction one side (X1) end via an elbow 81 provided on the upper surface of the manifold 21. The inflow pipe 31 is connected to the refrigerant flow path 11a at the relative direction other side (X2) end via an elbow 83 provided on the upper surface of the cover portion 110 of the cold plate 11.

[0027] The outflow pipe 32 is connected to the refrigerant pipe 22a at the relative direction other side (X2) end via an elbow 82 provided on the upper surface of the manifold 22. The outflow pipe 32 is connected to the refrigerant flow path 11a at the relative direction one side (X1) end via an elbow 84 provided on the upper surface of the cover portion 110 of the cold plate 11.

[0028] The elbow 81 changes the flow direction of the refrigerant and connects the inflow pipe 31 and the refrigerant pipe 21a. The elbow 82 changes the flow direction of the refrigerant and connects the outflow pipe 32 and the refrigerant pipe 22a. The elbow 81 changes the flow direction of the refrigerant flowing in the cross direction (Y1-Y2) to the relative direction (X1-X2). The elbow 82 changes the flow direction of the refrigerant flowing in the relative direction (X1-X2) to the cross direction (Y1-Y2).

[0029] By providing the elbows 81, 82 on the upper surfaces of the manifolds 21, 22, the working space is expanded and the inflow pipe 31 and the refrigerant pipe 21a can be easily connected. In addition, the outflow pipe 32 and the refrigerant pipe 22a can be easily connected. Thus, the assembly workability of the cooling device 1 is improved.

[0030] Further, when the cooling air is caused to flow in the relative direction (X1-X2) along the inflow pipe 31 and the outflow pipe 32, the heat of the heat generating component and the components provided around the heat generating component can be exhausted. At this time, the cooling air flowing in the relative direction (X1-X2) easily passes over the upper surfaces of the manifolds 21, 22 without colliding with the manifolds 21, 22. Thus, the cooling effect of the cooling air can be improved. Further, the cooling effect on the components provided around the cooling device 1 can also be improved by the cooling air that has passed over the upper surfaces of the manifolds 21, 22.

[0031] In addition, the elbow 83 connects the inflow pipe 31 and the refrigerant flow path 11a. The elbow 84 connects the outflow pipe 32 and the refrigerant flow path 11a.

[0032] By providing the bends 83, 84 on the upper surface of the cover portion 110 of the cold plate 11, the working space is enlarged, and the refrigerant flow path 11a and the inflow pipe 31 can be easily connected. In addition, the refrigerant flow path 11a and the outflow pipe 32 can be easily connected. Thus, the assembly workability of the cooling device 1 is further improved.

[0033] The supply pipe 41 supplies refrigerant to one manifold 21. The discharge pipe 42 discharges refrigerant from the other manifold 22. In the present embodiment, the supply pipe 41 is connected to the refrigerant pipe 21a via the bend 85 provided on the upper surface of the manifold 21. On the other hand, the discharge pipe 42 is connected to the side surface of the manifold 22 on the opposite side (X2) to the opposite direction. In addition, the discharge pipe 42 can also be connected to the upper surface of the manifold 22 via a bend. That is, it is preferable that at least one of the supply pipe 41 and the discharge pipe 42 be connected to the refrigerant pipe 21a, 22a via the bend 85 provided on the upper surface of the manifold 21, 22.

[0034] By providing the bend 85 on the upper surface of the manifold 21, the working space can be enlarged, and the supply pipe 41 and the refrigerant pipe 21a can be easily connected. Thus, the assembly workability of the cooling device 1 is further improved.

[0035] In addition, in the present embodiment, the supply pipe 41 and the discharge pipe 42 are drawn to the opposite side (the same direction side X2 of the opposite direction) of the opposite direction, and the supply pipe 41 is connected to the refrigerant pipe 21a at the end portion of the manifold 21 on the intersecting direction side (Y1). Here, the manifold 21 is provided on the opposite side of the drawing direction (X2) of the supply pipe 41 and the discharge pipe 42.

[0036] In addition, in the case where the supply pipe 41 and the discharge pipe 42 are drawn to the opposite direction side (X1) of the opposite direction, the discharge pipe 42 is connected to the refrigerant pipe 22a at the end portion of the manifold 22 on the intersecting direction other side (Y2). That is, the supply pipe 41 and the discharge pipe 42 are drawn to the same direction side of the opposite direction (X1-X2), and one of the supply pipe 41 and the discharge pipe 42 is connected to the refrigerant pipe 21a, 22a at the end portion of the manifold 21, 22 on the intersecting direction (Y1-Y2) provided on the opposite side of the drawing direction of the supply pipe 41 and the discharge pipe 42.

[0037] Thus, even if the inflow pipe 31 and the outflow pipe 32 are connected to the manifolds 21, 22, respectively, first, the supply pipe 41 or the discharge pipe 42 connected later can be easily connected to the refrigerant pipe 21a or the refrigerant pipe 22a. On the other hand, even if the supply pipe 41 or the discharge pipe 42 is connected to the manifolds 21, 22, respectively, first, the inflow pipe 31 and the outflow pipe 32 connected later can be easily connected to the refrigerant pipe 21a or the refrigerant pipe 22a. Therefore, the assembly workability of the cooling device 1 is further improved.

[0038] Further, in the present embodiment, the end portion of the manifold 21 in the cross direction (Y1) on the opposite side (X1) of the leading direction is more protruded toward the cross direction (Y1) than the end portion of the manifold 22 in the cross direction (Y1) on the leading direction side (X2). Thereby, the supply tube 41 is led in the opposite direction (X1-X2) without contacting the end portion of the manifold 22 in the cross direction (Y1) on the leading direction side (X2). Therefore, the large size of the cooling device 1 can be further suppressed.

[0039] Further, when the supply tube 41 and the discharge tube 42 are led to the opposite direction side (X1), it is preferable that the end portion of the manifold 22 in the cross direction (Y2) on the opposite side (X2) of the leading direction is more protruded toward the cross direction (Y2) than the end portion of the manifold 21 in the cross direction (Y2) on the leading direction side (X1). Thereby, the discharge tube 42 is led in the opposite direction (X1-X2) without contacting the end portion of the manifold 21 in the cross direction (Y2) on the leading direction side (X1).

[0040] (1-3. Detailed structure of the bracket) Figure 4 is a side view of the cooling device 1. The bracket 50 protects the cold plate 11. The bracket 50 has a top wall portion 51 and a leg portion 52. The top wall portion 51 is a plate-shaped metal member that covers the cold plate 11 from above (Z1). The leg portion 52 extends downward (Z2) from the outer peripheral portion of the top wall portion 51, and is disposed at a position further outward in the cross direction (Y1-Y2) than the manifolds 21, 22. The manifolds 21, 22 are fixed to the leg portion 52.

[0041] In the present embodiment, the top wall portion 51 is formed in a rectangular shape when viewed from above, and the leg portion 52 is provided at four corners of the top wall portion 51. The leg portion 52 is fixed to the outer side surface in the cross direction (Y1-Y2) of the manifolds 21, 22.

[0042] Further, the top wall portion 51 at least partially overlaps the bends 81, 82 disposed on the upper surfaces of the manifolds 21, 22 when viewed from above. Thereby, the bends 81, 82 are covered and protected by the top wall portion 51.

[0043] By fixing the bracket 50 and the manifolds 21, 22, the cooling device 1 can be easily integrated. At this time, the positioning of the manifolds 21, 22 becomes easy, and the assembly efficiency of the cooling device 1 is further improved. Further, by providing the leg portion 52, a gap is formed between the top wall portion 51 and the manifolds 21, 22. Thereby, the cooling air that flows through the gap between the top wall portion 51 and the cold plate 11 in the opposite direction (X1-X2) easily passes through the gap between the top wall portion 51 and the manifolds 21, 22. Thereby, the cooling effect of the cooling air is further improved.

[0044] Further, it is preferable that the gap between the top wall portion 51 and the manifolds 21, 22 in the up-down direction (Z1-Z2) be larger than the gap between the manifolds 21, 22 and the cover portion 110 of the cold plate 11 in the up-down direction (Z1-Z2). Thereby, the flow amount of the cooling air passing through the gap between the top wall portion 51 and the manifolds 21, 22 can be increased. Thus, the cooling effect of the cooling air is further improved. In addition, by providing a larger gap between the top wall portion 51 and the manifolds 21, 22, the installation space of the elbow arranged on the upper surface of the manifold can be sufficiently ensured. Thereby, the assembly workability of the cooling device 1 is further improved.

[0045] In the present embodiment, the lower ends of the manifolds 21, 22 are located at positions lower (Z2) than the upper end of the cold plate 11 and upper (Z1) than the lower end of the cold plate 11. In addition, the lower ends of the manifolds 21, 22 can also be arranged at positions upper (Z1) than the upper end of the cold plate 11.

[0046] Thereby, the cooling air flowing along the opposite direction (X1-X2) through the gap between the top wall portion 51 and the cold plate 11 easily passes through the lower surface of the manifolds 21, 22. Thereby, the cooling effect of the cooling air is further improved.

[0047] <Second Embodiment> Next, a second embodiment of the present application will be described. Figure 5 is a perspective view of a cooling unit 200 of the second embodiment, showing a state in which the top wall portion 51 of the bracket 50 is omitted. For ease of explanation, the same components as those of the cooling device 1 of the first embodiment shown in FIG. 1 are assigned the same reference numerals. The cooling unit 200 of the second embodiment is configured by arranging the cooling device 1 and a cooling device 201 in the cross direction (Y1-Y2). The other parts are the same as in the first embodiment. Figures 1 to 4

[0048] The cooling device 201 includes a plurality of cold plates 211, a pair of manifolds 221, 222, an inflow pipe 231, an outflow pipe 232, a supply pipe 241, a discharge pipe 242, and a bracket 50.

[0049] The plurality of cold plates 211 are connected in parallel to the pair of manifolds 221, 222 via the inflow pipe 231 and the outflow pipe 232. The manifold 221 is connected to the supply pipe 241, and the manifold 222 is connected to the discharge pipe 242.

[0050] When the pump is driven, the refrigerant is supplied from the supply pipe 241 to the manifold 221. The refrigerant supplied to the manifold 221 is branched to each inflow pipe 231, respectively.

[0051] ​The branched refrigerant flows into each cold plate 211. The refrigerant flowing into each cold plate 211 flows out to the manifold 222 via the outlet pipe 232. The refrigerant flowing out of the manifold 222 returns to the pump via the discharge pipe 242.

[0052] The manifold 21 connected to the inlet pipe 31 and the manifold 222 connected to the outlet pipe 232 are adjacent in the crossing direction (Y1-Y2). In addition, the manifold 221 connected to the inlet pipe 231 and the manifold 22 connected to the outlet pipe 32 are adjacent in the crossing direction (Y1-Y2).

[0053] Heat exchange occurs between adjacent manifolds 21 and 222 in the cross direction (Y1-Y2). Furthermore, heat exchange occurs between adjacent manifolds 22 and 221 in the cross direction (Y1-Y2). This reduces the likelihood that the overall cooling effect of the cooling unit 200 is biased towards one side of the opposite direction (X1-X2).

[0054] In addition, the support 50 is omitted in this embodiment, but it is preferable that the top wall 51 covers the cold plate 11 and the cold plate 211 from above (Z1) to integrate the cooling device 1 and the cooling device 201.

[0055] <Third Implementation Method> Next, the third embodiment of the present invention will be described. Figure 6 and Figure 7 This is a top view of the cooling device 301 according to the third embodiment. Figure 7 The top wall portion 51 of the support 50 is shown without the support 50. For ease of explanation, the above-described... Figures 1 to 5 The same components as those in the cooling device 1 of the first embodiment are referred to by the same reference numerals. In the cooling device 301 of the third embodiment, a plurality of cold plates (first cold plates) 311 are arranged between a pair of manifolds 21, 22. Furthermore, an inflow pipe 331 extends from one manifold 21 and branches to connect with each inlet 110a of the plurality of cold plates 311. In addition, an outflow pipe 332 extends from the other manifold 22 and branches to connect with each outlet 110b of the plurality of cold plates 311.

[0056] In this embodiment, two cold plates (first cold plates) 311 are arranged in opposite directions (X1-X2) to form a cold plate group 311A. In the cold plate group 311A, the cold plates (first cold plates) 311 are connected in parallel. Furthermore, the two cold plate groups 311A ​​are arranged in intersecting directions (Y1-Y2) and connected in parallel by a pair of manifolds 21, 22.

[0057] Thus, the cold plate 311 can be configured to correspond to multiple heat-generating components arranged in opposite directions (X1-X2) to further efficiently cool the multiple heat-generating components.

[0058] In the present embodiment, two cold plates (first cold plates) 311 are connected in parallel in the cold plate group 311A, but three or more cold plates can also be connected in parallel. Furthermore, in the present embodiment, two cold plate groups 311A are connected in parallel, but three or more cold plate groups can also be connected in parallel. In addition, only one cold plate group 311A can be provided between the pair of manifolds 21, 22.

[0059] Furthermore, in the present embodiment, the inflow pipe 331 branches at the bend 384B that is provided on the upper surface of the lid portion 110 of the cold plate (first cold plate) 311 on the upstream side XI. In addition, the outflow pipe 332 branches at the bend 383A that is provided on the upper surface of the lid portion 110 of the cold plate (first cold plate) 311 on the downstream side X2. That is, the inflow pipe 331 or the outflow pipe 332 branches at the bend 383A, 384B that is provided on the upper surface of one cold plate (first cold plate) 311.

[0060] By providing the bends 383A, 384B on the upper surface of the lid portion 110 of the cold plate 311, the work space is expanded, and the refrigerant flow path (first refrigerant flow path) 11a and the inflow pipe 331 can be easily connected. In addition, the refrigerant flow path (first refrigerant flow path) 11a and the outflow pipe 332 can be easily connected. Thus, the assembly workability of the cooling device 301 is further improved.

[0061] Figure 8 is a longitudinal sectional view that enlarges and schematically shows the bend 384B. In Figure 8 , the flow of the refrigerant is shown by arrows. The bend 384B connects the inflow pipe 331 and the refrigerant flow path 11a. More specifically, the bend 384B is a T-shaped pipe, and the bend 384B is connected to the inflow pipe 331 at both ends in the opposite direction (XI-X2), respectively. In addition, the lower end portion of the bend 384B is connected to the inflow port 110a of the cold plate 311 provided on the upstream side XI.

[0062] The bend 384A is an L-shaped pipe, and the end portion on the upstream side XI is connected to the inflow pipe 331 (refer to Figure 7 ). In addition, the lower end of the bend 384A is connected to the inflow port 110a of the cold plate 311 provided on the downstream side X2. Thus, a portion of the refrigerant from the refrigerant pipe 21a of the manifold 21 toward the cold plate 311 provided on the downstream side X2 branches at the bend 384B and flows into the refrigerant flow path 11a from the inflow port 110a.

[0063] Figure 9 is a longitudinal sectional view that enlarges and schematically shows the bend 383A. In Figure 9In the middle, the flow of the refrigerant is shown by an arrow. The bend 383A connects the outflow pipe 332 and the refrigerant flow path 11a. More specifically, the bend 383A is a T-shaped pipe, and both ends of the bend 383A in the opposite direction (X1-X2) are connected to the outflow pipe 332, respectively. In addition, the lower end of the bend 383A is connected to the flow outlet 110b of the cold plate 311 disposed on the downstream side X2.

[0064] The bend 383B is an L-shaped pipe, and the end on the downstream side X2 is connected to the outflow pipe 332 (see FIG. 6). In addition, the lower end of the bend 383B is connected to the flow outlet 110b of the cold plate 311 disposed on the upstream side X1. Thus, the refrigerant flowing out of the flow outlet 110b of the cold plate 311 disposed on the upstream side X1 merges with the refrigerant flowing out of the flow outlet 110b of the cold plate 311 disposed on the downstream side X2, and flows toward the refrigerant pipe 22a of the manifold 22. Figure 7

[0065] In the present embodiment, the inflow pipe 331 and the outflow pipe 332 are formed of the same pipe material, and are configured by the inner diameter portion 33a and the outer diameter portion 33b. The inner diameter portion 33a configures a flow path of the refrigerant, and is in a cylindrical shape. The outer diameter portion 33b covers and protects the inner diameter portion 33a, and is in a cylindrical shape. The inner diameter portion 33a is made of a resin having a lower water absorption rate than the outer diameter portion 33b. In addition, the outer diameter portion 33b is made of a resin having a greater bending stress than the inner diameter portion 33a.

[0066] For example, a polypropylene resin having a low water absorption is suitable for the inner diameter portion 33a. By using a resin having a low water absorption for the inner diameter portion 33a, leakage of the refrigerant can be prevented. For example, nylon (nylon 66) having a large bending stress is suitable for the outer diameter portion 33b. By using a resin having a large bending stress for the outer diameter portion 33b, even if the inflow pipe 331 and the outflow pipe 332 are bent to be disposed within the cooling device 301, the inflow pipe 331 and the outflow pipe 332 can be less likely to be broken. Thus, the inflow pipe 331 and the outflow pipe 332 can be easily coiled, and the assembly workability of the cooling device 301 is further improved.

[0067] Further, it is preferable that the linear expansion coefficient of the resin configuring the inner diameter portion 33a be substantially the same as the linear expansion coefficient of the resin configuring the outer diameter portion 33b. Thus, the inflow pipe 331 and the outflow pipe 332 can be inhibited from being deformed due to the heat of the refrigerant flowing therethrough when the cooling device 301 is driven. Thus, the refrigerant can be smoothly circulated, and the driving power of the cooling device 301 can be reduced.

[0068] In addition, it is preferable that the flow path cross-sectional area S1a of the inflow pipe 331 disposed on the upstream side of the bend (branch point) 384B be greater than the flow path cross-sectional area S1b of the inflow pipe 331 disposed on the downstream side of the bend (branch point) 384B (see FIG. 6). Thus, the inflow pipe 331 can be less likely to be broken, and the assembly workability of the cooling device 301 can be further improved. Figure 8 ​). Thus, the flow amount of the refrigerant in the inflow pipe 331 before the branching can be increased, and the refrigerant can flow smoothly. In addition, it is preferable that the flow path cross-sectional area S2b of the outflow pipe 332 disposed at the downstream side of the bend (branching point) 383A be larger than the flow path cross-sectional area S2a of the outflow pipe 332 disposed at the upstream side of the bend (branching point) 383A. Thus, the flow amount of the refrigerant in the outflow pipe 332 after the merging can be increased, and the refrigerant can flow smoothly.

[0069] In addition, the inflow pipe 331 and the outflow pipe 332 are provided with a band portion 34 that fastens the outer peripheral surface with respect to the bend 81, 383A, 383B, 384A, 384B, 386, and the connector 382. By providing the band portion 34, it is possible to prevent the inflow pipe 331 and the outflow pipe 332 from being detached from the bend 81, 383A, 383B, 384A, 384B, 386, and the connector 382, while it is possible to suppress leakage of the refrigerant. In addition, the band portion 34 can be provided only on one of the inflow pipe 331 and the outflow pipe 332.

[0070] In addition, the top wall portion 51 has an opening portion 51a that is opposite to the band portion 34 in the up-down direction (Z1-Z2) and is open. Thus, it is possible to prevent the band portion 34 and the top wall portion 51 from being in contact, and it is possible to prevent poor connection between the inflow pipe 331 and the bend 384A, 384B or poor connection between the outflow pipe 332 and the bend 383A, 383B.

[0071] In addition, in the present embodiment, the inflow pipe 331 is connected to the refrigerant pipe (first refrigerant pipe) 21a through the bend 81, 386 provided on the upper surface of the manifold 21, and the outflow pipe 332 is connected to the refrigerant pipe (first refrigerant pipe) 22a through the connector 382 provided on the side surface of the manifold 22.

[0072] The connector 382 changes the flow direction of the refrigerant flowing in the opposite direction (X1-X2) to the crossing direction (Y1-Y2). By connecting the outflow pipe 332 through the connector 382 provided on the side surface of the manifold 22, the cooling air flowing in the opposite direction (X1-X2) smoothly passes through the upper surface of the manifold 22. Thus, it is possible to further improve the cooling effect of the components disposed around the cooling device 301.

[0073] In addition, the outflow pipe 332 can be connected to the refrigerant pipe (first refrigerant pipe) 22a through a bend provided on the upper surface of the manifold 22, and the inflow pipe 331 can be connected to the refrigerant pipe (first refrigerant pipe) 21a through a connector provided on the side surface of the manifold 21. In addition, the bend 81, 386 can be provided on the lower surface of the manifold 21 to connect the inflow pipe 331 and the refrigerant pipe 21a.

[0074] Furthermore, in this embodiment, the elbow 386 disposed on the upper surface of the manifold 21 has a protrusion 386b and an extension 386a (see...). Figure 7 The protrusion 386b protrudes further in the opposite direction (X2) towards the cold plate (first cold plate) 311 than the periphery of the manifold 21. This ensures that the space adjacent to the protrusion 386b in the intersecting direction (Y1-Y2) is a suitable space for screw tightening. Consequently, the screw 385a can be easily tightened without obstruction by the inflow pipe 331, further improving the ease of assembly of the cooling device 301.

[0075] Furthermore, the extension 386a extends further away from the cold plate (first cold plate) 311 in the opposite direction (X1-X2) than the center of the manifold 21. As a result, the cantilever support strength of the elbow 386 is improved.

[0076] In addition, if an elbow is provided on the upper or lower surface of the manifold 22, the elbow provided on the manifold 22 may also be provided with a protrusion 386b and an extension 386a.

[0077] Figure 10 This is a side view of the cooling device 301. Figure 11 This is an enlarged and schematic longitudinal sectional view of the manifold 21. In this embodiment, a cold plate (second cold plate) 312 is also provided, which is disposed at the lower part of the manifold 21. The lower surface of the cold plate (second cold plate) 312 is in thermal contact with the heat-generating component. In addition, the cold plate (second cold plate) 312 has a second refrigerant flow path 312a that communicates with the refrigerant pipe (first refrigerant pipe) 21a and allows refrigerant to flow through it.

[0078] Additionally, a cold plate (second cold plate) 313 is disposed at the lower part of the manifold 22. The cold plate 313 has a second refrigerant flow path 313a that communicates with the refrigerant pipe (first refrigerant pipe) 22a and allows refrigerant to flow through it.

[0079] By configuring cold plates (second cold plates) 312 and 313, the heat-generating components located below manifolds 21 and 22 can be cooled efficiently.

[0080] More specifically, the cold plate 312 is made of a metal with high thermal conductivity, such as copper or aluminum. The cold plate 312 has a bottom wall portion 3111 and a cover portion 3110. The bottom wall portion 3111 has a recess 3111a formed by downward (Z2) indentation, and a flange portion 3111b extending horizontally from the upper periphery of the recess 3111a. The cover portion 3110 covers the opening of the recess 3111a and engages with the flange portion 3111b. The heating element contacts the lower surface of the recess 3111a.

[0081] A second refrigerant flow path 312a is formed in a space surrounded by the recessed portion 311 la of the bottom wall portion 3111 and the lid portion 3110, and a plurality of fins (not shown) are arranged in the second refrigerant flow path 312a. The fins are formed, for example, by cutting the upper surface of the bottom wall portion 3111. Thereby, the thermal conductivity from the bottom wall portion 3111 to the fins is improved.

[0082] The lid portion 3110 has a through-hole 3110a that penetrates in the up-down direction (Z1-Z2). In the present embodiment, the refrigerant pipe (first refrigerant pipe) 21a communicates with the second refrigerant flow path 312a via the through-hole 3110a. Thereby, the refrigerant flows through the second refrigerant flow path 312a in the cross direction (Y1-Y2).

[0083] In the present embodiment, the cold plate 312 is rectangular when viewed from above, but is not limited thereto. For example, it can also be a polygon having a plurality of angles when viewed from above, or a circular shape. In addition, the cold plate 313 also has the same structure as the cold plate 312, and the refrigerant flows through the second refrigerant flow path 313a in the cross direction (Y1-Y2).

[0084] Figure 12 is an enlarged perspective view showing a portion of the cold plate 311. The cold plate (first cold plate) 311 has an inclined surface 311a. The inclined surface 311a inclines the upper end portion of the surface opposite to the manifold 21 in the opposite direction (X1-X2) toward the direction X2 away from the manifold 21 in the opposite direction (X1-X2) as it goes toward the upper Z1.

[0085] In addition, the inclined surface 311a of the cold plate (first cold plate) 311 opposite to the manifold 22 inclines toward the direction X1 away from the manifold 22 in the opposite direction (X1-X2) as it goes toward the upper Z1.

[0086] Thereby, when the inflow pipe 331 or the outflow pipe 332 is connected to the manifold 21, 22, it is possible to prevent the inflow pipe 331 or the outflow pipe 332 from being damaged by coming into contact with the cold plate (first cold plate) 311.

[0087] In addition, the cooling device 301 preferably further has a buffer member (not shown) sandwiched by the cold plate (first cold plate) 311 and the manifold 21, 22 in the opposite direction (X1-X2). Thereby, it is possible to prevent the cold plate (first cold plate) 311 from coming into contact with the manifold 21, 22, for example, due to vibration during transportation, and to prevent the manifold 21, 22 from being damaged.

[0088] Further, it is preferable that the cooling device 301 further has a buffer member (not shown) sandwiched by the top wall portion 51 and the manifolds 21, 22 in the up-down direction (Z1-Z2). Thereby, it is possible to prevent the top wall portion 51 and the manifolds 21, 22 from contacting each other, for example, due to vibration during transportation, and to prevent the manifolds 21, 22 from being damaged.

[0089] (Other) The above-described embodiments are merely examples of the present application. The structure of the embodiments can be appropriately changed within the scope of the technical idea of the present application. Further, the embodiments can be combined as far as possible. For example, in the above-described embodiments, the bends 81, 82 are disposed on the upper surfaces of the manifolds 21, 22, but the bends 81, 82 can be disposed on the lower surfaces of the manifolds 21, 22.

[0090] That is, the inflow pipe 31 is connected to the refrigerant pipe 21a at the opposite direction one side (X1) end via the bend 81 disposed on the lower surface of the manifold 21. Further, the outflow pipe 32 is connected to the refrigerant pipe 22a at the opposite direction other side (X2) end via the bend 82 disposed on the lower surface of the manifold 22. At this time, it is preferable that the lower ends of the manifolds 21, 22 are disposed at positions higher (Z1) than the upper end of the cold plate 11. Thereby, the working space is enlarged, and it is possible to easily connect the inflow pipe 31 and the refrigerant pipe 21a. Further, it is possible to easily connect the outflow pipe 32 and the refrigerant pipe 22a.

[0091] (Postscript) As described above, the cooling device 1 of one aspect of the present application includes: a first cold plate 11 whose lower surface is in thermal contact with a heat generating member, and which has a first refrigerant flow path 11a inside for a refrigerant to flow; a pair of manifolds 21, 22 disposed in opposition across the first cold plate, and having first refrigerant pipes for the refrigerant to flow; an inflow pipe 31 extending from one of the manifolds to a flow inlet 110a of the first cold plate, and causing the refrigerant to flow into the first cold plate; and an outflow pipe 32 extending from a flow outlet 110b of the first cold plate to the other of the manifolds, and causing the refrigerant to flow out to the other of the manifolds, the first refrigerant pipes extending in a cross direction (Y1-Y2) intersecting an opposite direction (X1-X2) of the pair of manifolds, at least one of the inflow pipe and the outflow pipe being connected to the first refrigerant pipes via bends 81, 82 disposed on upper surfaces or lower surfaces of the manifolds (first structure).

[0092] Further, in the above-described first structure, it is also possible to be configured such that the inflow pipe and the outflow pipe are connected to the first refrigerant flow path via bends 83, 84 disposed on the upper surface of the first cold plate.

[0093] Further, in the first structure or the second structure, it can be configured to further include a supply pipe 41 that supplies the refrigerant to one of the manifolds and a discharge pipe 42 that discharges the refrigerant from the other of the manifolds, at least one of the supply pipe and the discharge pipe being connected to the first refrigerant pipe via an elbow 85 disposed on an upper surface or a lower surface of the manifold (third structure).

[0094] Further, in any one of the first structure to the third structure, it can be configured such that the supply pipe and the discharge pipe are led out on the same direction side (X2) of the relative direction, and one of the supply pipe and the discharge pipe is connected to the first refrigerant pipe at an end portion in the cross direction of the manifold disposed on the opposite side (X1) of the leading-out direction of the supply pipe and the discharge pipe (fourth structure).

[0095] Further, in any one of the first structure to the fourth structure, it can be configured such that the end portion in the cross direction of the manifold disposed on the opposite side of the leading-out direction protrudes more in the cross direction than the end portion in the cross direction of the manifold disposed on the leading-out direction side (fifth structure).

[0096] Further, in any one of the first structure to the fifth structure, it can be configured to further include a bracket 50 having a plate-shaped top wall portion 51 that covers the first cold plate from above and a leg portion 52 that extends downward from an outer peripheral portion of the top wall portion and is disposed at an outer side in the relative direction or the cross direction of the manifold, the manifold being fixed to the leg portion (sixth structure).

[0097] Further, in any one of the first structure to the sixth structure, it can be configured such that a lower end of the manifold is located at a position higher than an upper end of the first cold plate (seventh structure).

[0098] Further, in any one of the first structure to the seventh structure, it can be configured such that a gap in the vertical direction between the top wall portion and the manifold is larger than a gap in the vertical direction between the manifold and the first cold plate (eighth structure).

[0099] Further, in any one of the first structure to the eighth structure, it can be configured such that the top wall portion at least partially overlaps the elbow disposed on the upper surface of the manifold when viewed from above (ninth structure).

[0100] Further, in any one of the first structure to the ninth structure, it can be configured such that the relative direction and the cross direction are orthogonal (tenth structure).

[0101] Further, in any one of the first structure to the tenth structure described above, the first cold plate can be configured with a plurality of the first cold plates arranged in the crossing direction, and connected in parallel via a pair of the manifolds (eleventh structure).

[0102] Further, in any one of the first structure to the eleventh structure described above, a plurality of the first cold plates can be arranged between a pair of the manifolds, the inflow pipe can extend from one of the manifolds and branch to connect to each of the inflow ports of the plurality of the first cold plates, and the outflow pipe can extend from the other of the manifolds and branch to connect to each of the outflow ports of the plurality of the first cold plates (twelfth structure).

[0103] Further, in the twelfth structure described above, two of the first cold plates can be arranged in the opposite direction (thirteenth structure).

[0104] Further, in the twelfth structure described above, the inflow pipe or the outflow pipe can branch at a bend arranged on the upper surface of one of the first cold plates (fourteenth structure).

[0105] Further, in the twelfth structure described above, a flow path cross-sectional area of the inflow pipe arranged on an upstream side from a branching point can be larger than a flow path cross-sectional area of the inflow pipe arranged on a downstream side from the branching point, a flow path cross-sectional area of the outflow pipe arranged on the downstream side from the branching point can be larger than a flow path cross-sectional area of the outflow pipe arranged on the upstream side from the branching point (fifteenth structure).

[0106] Further, in any one of the first structure to the fifteenth structure described above, the inflow pipe and the outflow pipe can be configured by a cylindrical inner diameter portion that configures a flow path of the refrigerant and a cylindrical outer diameter portion that covers and protects the inner diameter portion, the inner diameter portion can be made of a resin having a lower water absorption rate than the outer diameter portion, and the outer diameter portion can be made of a resin having a greater bending stress than the inner diameter portion (sixteenth structure).

[0107] Further, in any one of the first structure to the sixteenth structure described above, one of the inflow pipe and the outflow pipe can be connected to the first refrigerant pipe via a bend arranged on the upper surface or the lower surface of the manifold, and the other of the inflow pipe and the outflow pipe can be connected to the first refrigerant pipe via a connector 382 arranged on the side surface of the manifold (seventeenth structure).

[0108] Further, in any one of the first structure to the seventeenth structure, it can also be configured to further include a second cold plate 312 whose lower surface is in thermal contact with the heat generating component and which is disposed at a lower portion of the manifold, the second cold plate having a second refrigerant flow path 312a that communicates with the first refrigerant pipe and in which refrigerant flows (the eighteenth structure).

[0109] Further, in any one of the first structure to the eighteenth structure, it can also be configured such that at least one of the inflow pipe and the outflow pipe is provided with a band portion 34 that fastens and fixes an outer peripheral surface of at least one of the inflow pipe and the outflow pipe with respect to the elbow, The top wall portion has an opening portion 51a that is open in the up-down direction opposite the band portion (the nineteenth structure).

[0110] Further, in any one of the first structure to the nineteenth structure, it can also be configured such that the first cold plate has an inclined surface 311a that inclines an upper end portion of a surface opposite the manifold in the opposite direction toward the opposite direction away from the manifold as it goes upward (the twentieth structure).

[0111] Further, in any one of the first structure to the twentieth structure, it can also be configured such that the elbow disposed at the upper surface or the lower surface of the manifold has a protruding portion that protrudes more toward the opposite direction closer to the first cold plate than the periphery of the manifold (the twenty-first structure).

[0112] Further, in the twenty-first structure, it can also be configured such that the elbow disposed at the upper surface or the lower surface of the manifold has an extending portion that extends more toward the opposite direction away from the first cold plate than the center of the manifold (the twenty-second structure).

[0113] Further, in any one of the first structure to the twenty-second structure, it can also be configured to further include a cushioning member sandwiched by the first cold plate and the manifold in the opposite direction (the twenty-third structure).

[0114] Further, in any one of the first structure to the twenty-third structure, it can also be configured to further include a cushioning member sandwiched by the top wall portion and the manifold in the up-down direction (the twenty-fourth structure).

[0115] Further, in the cooling unit 200 in which a plurality of any one of the first structure to the twenty-fourth structure described above is arranged in the cross direction, the manifold connected to the inflow pipe and the manifold connected to the outflow pipe can be adjacent in the cross direction (twenty-fifth structure). Explanation of symbols

[0116] 1, 201, 301 cooling device 11, 211, 311 cold plate (first cold plate) 11a refrigerant flow path (first refrigerant flow path) 21, 22, 221, 222 manifold 21a, 22a refrigerant pipe (first refrigerant pipe) 31, 231, 331 inflow pipe 32, 232, 332 outflow pipe 33a inner diameter portion 33b outer diameter portion 34 band portion 41, 241 supply pipe 42, 242 discharge pipe 50 bracket 51 top wall portion 51a opening portion 52 leg portion 81 to 85, 383A, 383B, 384A, 384B, 386 elbow 110, 3110 cover portion 110a inflow port 110b outflow port 111, 3111 bottom wall portion 111a, 3111a recess 111b, 3111b flange portion 200 cooling unit 311A cold plate group 311a inclined surface 312 cold plate (second cold plate) 312a, 313a second refrigerant flow path 385a screw 386a extension portion 386B protruding portion 3110a through hole

Claims

1. Cooling device, characterized in that including: a first cold plate whose lower surface is in thermal contact with a heat generating component and which has a first refrigerant flow path inside through which a refrigerant flows; a pair of manifolds that are disposed opposite each other with the first cold plate interposed therebetween and that have first refrigerant pipes through which the refrigerant flows; an inflow pipe that extends from one of the manifolds to an inflow port of the first cold plate and causes the refrigerant to flow into the first cold plate; and an outflow pipe that extends from an outflow port of the first cold plate to the other of the manifolds and causes the refrigerant to flow out of the other of the manifolds, the first refrigerant pipes extend in a crossing direction that crosses the opposite direction of the pair of manifolds, at least one of the inflow pipe and the outflow pipe is connected to the first refrigerant pipes via an elbow that is disposed on an upper surface or a lower surface of the manifold.

2. The cooling device according to claim 1, wherein the inflow pipe and the outflow pipe are connected to the first refrigerant flow path via elbows that are disposed on an upper surface of the first cold plate. further including:

3. Cooling device according to claim 1 or 2, characterized in that a supply pipe that supplies the refrigerant to one of the manifolds; and a discharge pipe that discharges the refrigerant from the other of the manifolds, at least one of the supply pipe and the discharge pipe is connected to the first refrigerant pipes via an elbow that is disposed on an upper surface or a lower surface of the manifold.

4. The cooling device according to claim 3, wherein the supply pipe and the discharge pipe are led out on the same direction side of the opposite direction, one of the supply pipe and the discharge pipe is connected to the first refrigerant pipes at an end portion in the crossing direction of the manifold that is disposed on the opposite side of the supply pipe and the discharge pipe from the leading direction.

5. The cooling device according to claim 4, wherein the end portion in the crossing direction of the manifold that is disposed on the opposite side of the leading direction protrudes more toward the crossing direction than the end portion in the crossing direction of the manifold that is disposed on the leading direction side.

6. The cooling device according to claim 1 or 2, further comprising a bracket that has: a plate-shaped top wall portion that covers the first cold plate from above; and a leg portion that extends downward from an outer peripheral portion of the top wall portion and is disposed at an outer side in the opposite direction or the crossing direction of the manifolds, the manifolds are fixed to the leg portion.

7. The cooling device according to claim 6, wherein lower ends of the manifolds are positioned at a position that is higher than an upper end of the first cold plate.

8. The cooling device according to claim 7, wherein a gap in the vertical direction between the top wall portion and the manifolds is larger than a gap in the vertical direction between the manifolds and the first cold plate.

9. The cooling device according to claim 6, wherein the top wall portion and the elbow that is disposed on an upper surface of the manifold at least partially overlap when viewed from above.

10. The cooling device according to claim 1 or 2, wherein the opposite direction and the crossing direction are orthogonal. ​ ​ ​ 11. The cooling device according to claim 1 or 2, characterized in that a plurality of the first cold plates are arranged in the crossing direction, and are connected in parallel via a pair of the manifolds.

12. The cooling device according to claim 1 or 2, characterized in that a plurality of the first cold plates are arranged in a pair of manifolds, the inflow pipe extends from one of the manifolds, and branches to connect to each of the inflow ports of the plurality of the first cold plates, the outflow pipe extends from the other of the manifolds, and branches to connect to each of the outflow ports of the plurality of the first cold plates.

13. The cooling device according to claim 12, characterized in that two of the first cold plates are arranged in the opposite direction.

14. The cooling device according to claim 12, characterized in that the inflow pipe or the outflow pipe branches at a bend arranged on an upper surface of one of the first cold plates.

15. The cooling device according to claim 12, characterized in that a flow path cross-sectional area of the inflow pipe arranged on an upstream side from the branching point is larger than a flow path cross-sectional area of the inflow pipe arranged on a downstream side from the branching point, a flow path cross-sectional area of the outflow pipe arranged on the downstream side from the branching point is larger than a flow path cross-sectional area of the outflow pipe arranged on the upstream side from the branching point.

16. The cooling device according to claim 1 or 2, characterized in that the inflow pipe and the outflow pipe are configured by a cylindrical inner diameter portion that configures a flow path of refrigerant, and a cylindrical outer diameter portion that covers and protects the inner diameter portion, the inner diameter portion is made of a resin having a lower water absorption rate than the outer diameter portion, the outer diameter portion is made of a resin having a greater bending stress than the inner diameter portion.

17. The cooling device according to claim 1 or 2, characterized in that one of the inflow pipe and the outflow pipe is connected to the first refrigerant pipe via a bend arranged on an upper surface or a lower surface of the manifold, the other of the inflow pipe and the outflow pipe is connected to the first refrigerant pipe via a connector arranged on a side surface of the manifold.

18. The cooling device according to claim 1 or 2, characterized in that a second cold plate is further provided, a lower surface of the second cold plate is in thermal contact with a heat generating component, and the second cold plate is arranged on a lower portion of the manifold, the second cold plate has a second refrigerant flow path that communicates with the first refrigerant pipe and in which refrigerant flows.

19. The cooling device according to claim 6, characterized in that at least one of the inflow pipe and the outflow pipe is provided with a band portion that fastens and fixes an outer peripheral surface of at least one of the inflow pipe and the outflow pipe with respect to a bend, the top wall portion has an opening portion that is open and opposed to the band portion in the vertical direction.

20. The cooling device according to claim 1 or 2, characterized in that the first cold plate has an inclined surface that inclines an upper end portion of a surface of the first cold plate that is opposite to the manifold in the opposite direction, toward a direction away from the manifold in the opposite direction, as it goes upward.

21. The cooling device according to claim 1 or 2, wherein the bend provided on the upper surface or the lower surface of the manifold has a protruding portion that protrudes more toward the direction of the first cold plate than the periphery of the manifold in the opposite direction.

22. The cooling device according to claim 21, wherein the bend provided on the upper surface or the lower surface of the manifold has an extending portion that extends more away from the first cold plate than the center of the manifold in the opposite direction.

23. The cooling device according to claim 1 or 2, further comprising a buffer member sandwiched by the first cold plate and the manifold in the opposite direction.

24. The cooling device according to claim 6, further comprising a buffer member sandwiched by the top wall portion and the manifold in the up-down direction.

25. A cooling unit in which a plurality of the cooling devices according to claim 1 or 2 are arranged in the cross direction, wherein the manifold connected to the inflow pipe and the manifold connected to the outflow pipe are adjacent in the cross direction. ​ ​ ​ ​ ​

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