同质一体化的双模态传感器及其制备方法

By using a homogeneous integrated design and mold casting process, a flexible force-tactile proximity dual-modal sensor with a planar complementary labyrinth structure was fabricated. This solved the problems of structural complexity and measurement inaccuracy of existing sensors, enabling a sensor with a larger sensing distance and range, and improving robustness and stability.

CN121364028BActive Publication Date: 2026-07-17BEIJING INST OF TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING INST OF TECH
Filing Date
2025-10-20
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing flexible force-tactile proximity dual-modal sensors suffer from problems such as high structural complexity, signal crosstalk, inaccurate measurement, small sensing distance of planar capacitive sensors, small force-tactile range, and poor stability of the packaging interface.

Method used

Adopting a homogeneous integrated design, the coil layer, air gap layer, and piezoresistive layer are prepared by designing a planar complementary labyrinth structure for the coil layer and a porous piezoresistive layer, combined with a mold casting process. Polydimethylsiloxane prepolymer and conductive carbon particle composite material are used to form the encapsulation layer and functional layer, ensuring that the materials of each part are consistent.

Benefits of technology

This improves the sensor's sensing distance and force tactile range, enhances the sensor's robustness and durability, simplifies the manufacturing process, reduces costs, and improves measurement stability and environmental adaptability.

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Abstract

本发明涉及一种同质一体化双模态传感器及其制备方法,属于传感器制备技术领域,解决了采用现有方法制得双模态传感器测量稳定性差、知量程小、工艺流程复杂的问题。所述方法包括:(1)设计平面互补迷宫结构的线圈层;(2)模具浇注获得图案化的线圈层基底;(3)在线圈层基底上填涂获得线圈层;(4)模具浇注获得压阻层;(5)浇注固化获得支撑框,所述支撑框的内腔尺寸大于所述压阻层的体积尺寸,高度差构成封装后制得传感器的气隙层;(6)封装,其中,封装固化后构成封装层与功能层基体的材质相同。由本发明方法制得传感器具有同质一体化结构和较大感知量程,改善鲁棒性和耐用性,且简化了工艺制备流程。
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