A three-dimensional modeling apparatus and method for a semiconductor factory

Abstract

The application discloses a kind of three-dimensional modeling device and method of semiconductor factory, comprising: acquisition module obtains semiconductor factory interface layout information and connecting element data;Equipment modeling module receives semiconductor factory interface layout information, determines three-dimensional modeling starting point, generates semiconductor factory equipment model containing equipment interface;Connecting element modeling module is with semiconductor factory starting equipment or factory affairs interface, combines element interface matching rule and the logical relationship information between each element, and fusion three-dimensional touch automatic checking algorithm and the optimal path algorithm based on safety distance correction, determine element connection path, realize the interface connection between each semiconductor factory equipment model in equipment modeling module in element, complete the three-dimensional modeling of semiconductor factory.The application fuses layout information and connecting element information, by the logical relationship between connecting element and three-dimensional touch automatic checking algorithm, efficiently, accurately realize the three-dimensional modeling of semiconductor factory.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor factory modeling technology, specifically relating to a three-dimensional modeling device and method for semiconductor factories. Background Technology

[0002] Semiconductor factories are complex architectural spaces comprised of extremely intricate equipment layouts and highly precise piping systems. A vast and complex network of pipes must be integrated into the equipment layout to deliver various core power sources and materials necessary for the machines to operate. These pipes have near-stringent requirements for cleanliness, pressure stability, and material compatibility; even the slightest leak or contamination can affect the production efficiency of the semiconductor factory. Therefore, the reliability of the piping system directly determines the efficiency and yield rate of the semiconductor factory's production line.

[0003] How to construct the layout of pipeline networks and factory equipment to achieve global optimization of equipment positioning and pipeline routing, spatial collision detection, and thus preemptively resolve installation conflicts, accurately count materials, and effectively guide construction? 3D design is key to avoiding rework and saving costs in semiconductor factories, and it is also a solid foundation for ensuring the efficient and stable operation of semiconductor factories.

[0004] Patent CN117077459A discloses a method and apparatus for constructing a semiconductor manufacturing simulation model integrating logistics. The method includes the following steps: obtaining simulated manufacturing parameters based on semiconductor manufacturing processes, wherein the simulated manufacturing parameters include process parameters and simulation parameters; constructing an initial simulation model for semiconductor manufacturing, wherein the initial simulation model includes a production module and a logistics module; setting interaction parameters based on the initial simulation model and in combination with the simulated manufacturing parameters, associating the production module and the logistics module to form a loop between the production module and the logistics module connected by the interaction parameters; iteratively training the initial simulation model in combination with updated interaction parameters until the index conditions are met, thus completing the construction of the integrated logistics semiconductor manufacturing simulation model.

[0005] Current 3D design methods cannot combine complex building modeling with pipeline modeling. Semiconductor equipment has numerous interfaces (hundreds of them), and there is a lack of means to quickly batch-draw these interfaces, resulting in low efficiency and a high error rate. At the same time, for the unique requirements of semiconductors (such as special materials for ultrapure systems, double sealing requirements, and fine layout of interface components), current standardized 3D component libraries and design rule libraries are still not perfect and widespread, relying on engineers' experience and easily leading to design inconsistencies.

[0006] Therefore, how to combine complex building modeling with pipeline modeling to achieve efficient and accurate 3D modeling of semiconductor factories and ensure their efficient and stable operation is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0007] To address the shortcomings of existing technologies, this invention provides a 3D modeling apparatus and method for semiconductor factories. The apparatus includes: a data acquisition module for acquiring semiconductor factory interface layout information and connection component data, wherein the connection component data includes component interface matching rules, component attribute information, and logical relationship information between various components; an equipment modeling module for receiving the semiconductor factory interface layout information from the acquisition module, determining the 3D modeling starting point, and generating a semiconductor factory equipment model containing equipment interfaces; and a connection component modeling module for determining component types and component connection paths based on the semiconductor factory interface layout information and 3D modeling starting point received from the acquisition module, using the semiconductor factory starting equipment or plant interface, combining the component interface matching rules and logical relationship information between various components received from the acquisition module, and integrating a 3D touch automatic verification algorithm and an optimal path algorithm based on safety distance correction. Combined with the component attribute information from the acquisition module, it realizes the interface connections between components in the various semiconductor factory equipment models in the equipment modeling module, thus completing the 3D modeling of the semiconductor factory. This invention integrates layout information and connection component information, and through the logical relationships between connection components and the 3D touch automatic verification algorithm, achieves efficient and accurate 3D modeling of semiconductor factories.

[0008] In a first aspect, the present invention provides a three-dimensional modeling apparatus for a semiconductor factory, comprising: The acquisition module is used to acquire semiconductor factory interface layout information and connection component data. The connection component data includes component interface matching rules, component attribute information, and logical relationship information between various components. The equipment modeling module is used to receive the semiconductor factory interface layout information from the acquisition module, determine the starting point for 3D modeling, and generate a semiconductor factory equipment model that includes the equipment interfaces. The component modeling module is used to determine the component type and connection path based on the semiconductor factory interface layout information and 3D modeling starting point from the receiving and acquisition module, starting with the semiconductor factory's initial equipment or plant interface. It combines the component interface matching rules of the receiving and acquisition module and the logical relationship information between various components, and integrates the 3D touch automatic verification algorithm and the optimal path algorithm based on safety distance correction. Combined with the component attribute information of the acquisition module, it realizes the interface connection between components in the various semiconductor factory equipment models in the equipment modeling module, thus completing the 3D modeling of the semiconductor factory.

[0009] Further, obtaining the connection element data specifically includes the following steps: Obtain component interface matching rules and initial component attribute information; The initial attribute information of the components is tagged, and based on the tags of each component, the logical relationships between the components are constructed to form the logical relationship information between the components.

[0010] Furthermore, by combining component interface matching rules and logical relationship information between components, and integrating a 3D touch automatic verification algorithm and an optimal path algorithm based on safety distance correction, the component type and component connection path are determined, specifically including the following steps: In response to the determination of the starting point of 3D modeling, obtain the component interface matching rules of the starting equipment model or plant interface of the semiconductor factory; Determine the component connection logic based on the semiconductor factory interface layout information; Based on the logical relationship information between various components and combined with the component connection logic, by matching and filtering the data of connected components, a set of all feasible component connection paths and corresponding component types are given. By integrating safety distances and using a modified optimal path algorithm, the initial component connection path is determined from the set of all feasible component connection paths; Based on the three-dimensional touch automatic verification algorithm, the components in the initial component connection path are verified to determine the component type and the corresponding component connection path.

[0011] Furthermore, by incorporating safety distances and employing a modified optimal path algorithm, initial component connection paths are determined from the set of all feasible component connection paths. This process includes the following steps: Set a safe distance and determine the path cost function; By using the optimal path algorithm, the path length and obstacle distance are combined to form the first element connection path set; The comprehensive cost of each feasible component connection path in the set of all feasible component connection paths and the comprehensive cost of each first component connection path in the set of first component connection paths are given respectively. The baseline cost is determined by the combined cost of each first element connection path in the first element connection path set; Based on the baseline cost, all feasible component connection paths are filtered to form a second set of component connection paths; Analyze the Manhattan distance between each second element connection path in the set of second element connection paths and the nearest obstacle, and combine it with the safety distance to give the safety factor function of the second element connection path; Based on the evaluation and screening function, the path length, safety factor function and path cost function are integrated to evaluate the connection path of each second element and determine the initial element connection path.

[0012] Furthermore, by employing an optimal path algorithm, path length and obstacle distance are integrated to form a set of connection paths for the first element, specifically including the following steps: Based on the spatial information of the semiconductor factory building, a grid-based layout map composed of cells is generated, and the location of obstacles is determined; Based on breadth-first search, spread out over all obstacles and calculate the Manhattan distance from each cell to the nearest obstacle; By integrating path length and obstacle penalty terms, a weight relationship between semiconductor factory equipment nodes is formed, a modified optimal path algorithm is given, and a set of first component connection paths is generated.

[0013] Furthermore, by integrating path length and obstacle penalty terms to form a weight relationship between device nodes, a revised optimal path algorithm is given, specifically expressed as follows:

[0014] Where cost(i) is the weight of semiconductor factory equipment node i, length(i) is the path length from the 3D modeling starting point to semiconductor factory equipment node i, λ is the obstacle weight parameter, and d obs (i) represents the distance from semiconductor factory equipment node i to the nearest obstacle, and d safe For safe distance.

[0015] Furthermore, the safety factor function is specifically expressed as:

[0016] The evaluation filtering function is specifically expressed as follows:

[0017] Where S(P) is the safety factor function of the second element connection path, d obs (i) represents the distance from semiconductor factory equipment node i to the nearest obstacle, and d safe For a safe distance, ∏ i P is the product of the relative safety degrees of all semiconductor factory equipment nodes along the second component connection path. k Let F(P) be the selection function for the optimal k paths, F(P) be the path cost function for the second element connection path, and length(P) be the total length of the second element connection path.

[0018] Furthermore, based on the 3D touch automatic verification algorithm, the components in the initial component connection path are verified to determine the component type and the corresponding component connection path. Specifically, this includes the following steps: Using the initial component connection path and the attribute extraction function, component attribute information is extracted to form a set of component attributes to be verified. The set of attributes of the components to be verified is verified using a verification function. Based on the verification and filtering rules, the component type and the corresponding component connection path are determined.

[0019] Furthermore, the set of attributes of the components to be inspected is validated using a validation function, specifically including:

[0020] in, Verification function for components between nodes A and B in a semiconductor factory, where m is the ID of a certain attribute of the component. Let f be any symbol, M be the set of component attributes, and f m () is the attribute extraction function, f m (P) A ) is a specified attribute of semiconductor factory equipment node A, f m (P) B ) is a specified attribute of semiconductor factory equipment node B.

[0021] Furthermore, it also includes a collaborative design module and an output management module; The collaborative design module is connected to the equipment modeling module and the connecting element modeling module. It is used to obtain information changes on the semiconductor factory equipment model and the interface connections between components in the semiconductor factory equipment model and to update the information in a timely manner to realize multi-segment collaborative design. The output management module is connected to the connection element modeling module and is used to visualize the 3D model of the semiconductor factory output by the connection element modeling module.

[0022] Secondly, the present invention also provides a three-dimensional modeling method for a semiconductor factory, employing a three-dimensional modeling apparatus for a semiconductor factory as described in any of the above-mentioned embodiments, specifically including the following steps: Obtain semiconductor factory interface layout information and connection component data, including component interface matching rules, component attribute information, and logical relationship information between various components; Based on the semiconductor factory interface layout information, the starting point for 3D modeling is determined, and a semiconductor factory equipment model containing equipment interfaces is generated. Based on the semiconductor factory interface layout information and the starting point of 3D modeling, starting with the semiconductor factory's initial equipment or plant interface, combined with component interface matching rules and logical relationship information between various components, and integrating a 3D touch automatic verification algorithm and an optimal path algorithm based on safety distance correction, the component type and component connection path are determined, realizing the interface connection between components in various semiconductor factory equipment models, and completing the 3D modeling of the semiconductor factory.

[0023] The present invention provides a three-dimensional modeling apparatus and method for a semiconductor factory, which has at least the following beneficial effects: (1) By setting up the acquisition module, the semiconductor factory interface layout information and the connection element data including component interface matching rules, component attribute information and logical relationship information between each component are obtained, which provides a data foundation for deepening the model information dimension and reducing the professional usage threshold. At the same time, the two-dimensional process pipeline and instrumentation diagram (PID) information is stored and cross-referenced with the three-dimensional information to achieve data consistency. Through the interaction of the equipment modeling module and the connection element modeling module, the complex building modeling and pipeline modeling are combined to realize the reasonable layout of equipment across floors, automatically generate the semiconductor factory equipment model containing equipment interfaces, reduce the error rate of personnel, and save time and cost. The three-dimensional pipeline design is completed in a limited space through the connection element modeling module to ensure the power requirements of the machine equipment in the semiconductor factory. At the same time, the three-dimensional touch automatic verification algorithm and the optimal path algorithm based on safety distance correction are integrated to reduce the learning difficulty, improve the efficiency and quality of three-dimensional design, and realize the three-dimensional modeling of the semiconductor factory efficiently and accurately.

[0024] (2) By labeling the initial attribute information of the components, it can be ensured that the initial attribute information of the components is effectively labeled, and the logical relationship between the components built based on these labels can be accurately reflected in the three-dimensional design, thereby improving design efficiency and quality.

[0025] (3) The EID model ensures compatibility and interoperability between devices by describing interface information in detail. At the same time, clear interface descriptions help to quickly locate and solve problems, and improve the maintenance efficiency of devices.

[0026] (4) By obtaining the component interface matching rules, determining the component connection logic, matching and filtering the component connection paths, and finally determining the final connection path through the three-dimensional touch automatic verification algorithm and the optimal path algorithm, the three-dimensional modeling of the semiconductor factory is judged to ensure the accuracy and reliability of the three-dimensional modeling.

[0027] (5) By introducing an obstacle penalty term, the path planning algorithm can be made to choose paths that have a longer straight distance but fewer obstacles. It takes into account not only the straight distance but also the influence of obstacles, thereby ensuring the feasibility and efficiency of the paths in the first element connection path set.

[0028] (6) By using the three-dimensional touch automatic verification algorithm and the optimal path algorithm to verify the components in the initial component connection path, the component type and the corresponding component connection path can be determined. This enables automated and intelligent path planning in semiconductor three-dimensional modeling, improving the layout efficiency of the factory and the accuracy of equipment and pipeline connections. Attached Figure Description

[0029] Figure 1 A structural block diagram of a three-dimensional modeling device for a semiconductor factory provided in an embodiment of the present invention; Figure 2 This is a schematic diagram illustrating the effect of a semiconductor factory equipment model including a device interface provided in an embodiment of the present invention. Figure 3 A flowchart for determining the component type and component connection path provided in an embodiment of the present invention; Figure 4 This is a schematic diagram illustrating the effect of determining the component connection path provided in an embodiment of the present invention; Figure 5 A flowchart for determining the initial component connection path provided in an embodiment of the present invention; Figure 6 This is a flowchart illustrating the generation of a first element connection path set provided in an embodiment of the present invention; Figure 7 A flowchart illustrating a three-dimensional modeling method for a semiconductor factory, as provided in an embodiment of the present invention.

[0030] Among them, 10 is the semiconductor factory equipment model; 11 is the equipment interface; 201 is the acquisition module; 202 is the equipment modeling module; and 203 is the connection element modeling module. Detailed Implementation

[0031] To better understand the above technical solutions, a detailed description of the solutions will be provided below in conjunction with the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0032] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of this invention and the appended claims are also intended to include the plural forms, and “multiple” generally includes at least two unless the context clearly indicates otherwise.

[0033] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or device that includes said element.

[0034] Currently, the 3D design of pipelines in semiconductor factories still faces significant challenges and shortcomings, specifically as follows: (1) There is no 3D design software specifically for the semiconductor industry that can combine complex building modeling with pipeline modeling. Building system software cannot quickly and conveniently design complex pipelines and lacks professionalism. Furthermore, pipeline modeling software cannot achieve reasonable layout of thousands of devices; (2) The lag in standards and specifications means that standardized 3D component libraries and design rule libraries for semiconductor-specific needs (such as special materials for ultrapure systems, double sealing requirements, and fine layout of interface components) are still not perfect and widespread. Reliance on engineer experience can easily lead to design inconsistencies; (3) There are numerous machine interfaces in semiconductor factories, and there is a lack of software for quickly batch drawing equipment interfaces. The methods are inefficient and have a high error rate; (4) The current 3D design model is not deep enough and the information integrity is insufficient. Many models focus on geometric and physical collisions, but lack sufficient engineering attribute data (such as accurate material specifications, welding process records, non-destructive testing requirements, ultra-high purity certification documents) and operation and maintenance information (such as valve serial numbers, maintenance manual links), which makes it difficult to support refined construction, quality control and intelligent operation and maintenance (weak digital twin foundation); (5) The current 3D modeling software is difficult to learn, has a high skill threshold, poor user interaction logic performance, and requires users to have semiconductor process, pipeline engineering and 3D software skills, resulting in uneven design quality; (6) The two-dimensional data information and three-dimensional data information in the semiconductor factory are not consistent, which causes trouble for construction personnel.

[0035] To address this, the present invention provides a 3D modeling apparatus and method for semiconductor factories. The apparatus includes: a data acquisition module for acquiring semiconductor factory interface layout information and connection component data, wherein the connection component data includes component interface matching rules, component attribute information, and logical relationship information between various components; an equipment modeling module for receiving the semiconductor factory interface layout information from the acquisition module, determining the 3D modeling starting point, and generating a semiconductor factory equipment model containing equipment interfaces; and a connection component modeling module for determining component types and component connection paths based on the semiconductor factory interface layout information and 3D modeling starting point received from the acquisition module, using the semiconductor factory starting equipment or plant interface, combining the component interface matching rules and logical relationship information between various components received from the acquisition module, and integrating a 3D touch automatic verification algorithm and an optimal path algorithm based on safety distance correction. Combined with the component attribute information from the acquisition module, the module achieves interface connections between components in the various semiconductor factory equipment models, thus completing the 3D modeling of the semiconductor factory. This invention integrates layout information and connection component information, and through the logical relationships between connection components and the 3D touch automatic verification algorithm, efficiently and accurately achieves 3D modeling of semiconductor factories.

[0036] By setting up a data acquisition module, the system obtains semiconductor factory interface layout information, as well as connection component data including component interface matching rules, component attribute information, and logical relationship information between various components. This provides a data foundation for deepening the model's information dimension and lowering the professional usage threshold. Simultaneously, it stores 2D process and instrumentation diagram (PID) information, cross-referencing and verifying it with 3D information to ensure data consistency. Through the interaction of the equipment modeling module and the connection component modeling module, complex building modeling is combined with pipeline modeling to achieve a reasonable layout of equipment across floors. It automatically generates semiconductor factory equipment models including equipment interfaces, reducing human error rates and saving time and costs. The connection component modeling module completes 3D pipeline design within a limited space, ensuring the power requirements of equipment in the semiconductor factory. Furthermore, it integrates a 3D touch automatic verification algorithm and an optimal path algorithm based on safety distance correction, reducing learning difficulty, improving 3D design efficiency and quality, and achieving efficient and accurate 3D modeling of the semiconductor factory.

[0037] like Figure 1 As shown, this embodiment of the invention provides a three-dimensional modeling device for a semiconductor factory, specifically including: The acquisition module is used to acquire semiconductor factory interface layout information and connection component data. The connection component data includes component interface matching rules, component attribute information, and logical relationship information between various components. The interface layout information includes 2D and / or 3D standard layout libraries, construction drawings, 3D modeling design requirements, and requirement information data standards. Requirement information data standards include standard templates for 3D design requirements data for secondary piping projects, specification data requirements, and data types. For example, a standard template for machine power requirements must include the machine code (unique identifier), machine type, machine interface location and connection system information, flow information, pressure information, interface information, and equipment-end valve information. For instance, interface information includes codes, associated distribution systems, and pipe colors, dimensions, materials, spatial locations, and angles used to distinguish distribution systems. Drafting standards include 2D / 3D standard libraries and construction drawing (PID / MLD) standards. These include the drawing scope, referenced standards (GB / T 14689-2008, ASME Y14.5-2018, etc.), drawing templates (A3, A4), standard styles (font, font size, arrow styles, etc.), coordinate systems, and views.

[0038] The equipment modeling module is used to receive the semiconductor factory interface layout information from the acquisition module, determine the starting point for 3D modeling, and generate a semiconductor factory equipment model that includes the equipment interfaces. The component modeling module is used to determine the component type and connection path based on the semiconductor factory interface layout information and 3D modeling starting point from the receiving and acquisition module, starting with the semiconductor factory's initial equipment or plant interface. It combines the component interface matching rules of the receiving and acquisition module and the logical relationship information between various components, and integrates the 3D touch automatic verification algorithm and the optimal path algorithm based on safety distance correction. Combined with the component attribute information of the acquisition module, it realizes the interface connection between components in the various semiconductor factory equipment models in the equipment modeling module, thus completing the 3D modeling of the semiconductor factory.

[0039] Further, obtaining the connection element data specifically includes the following steps: Obtain component interface matching rules and initial component attribute information; The initial attribute information of the components is tagged, and based on the tags of each component, the logical relationships between the components are constructed to form the logical relationship information between the components.

[0040] In one specific implementation, component interface matching rules are rules that define the technical specifications and operational procedures of the components corresponding to the interface. These include interface-related attribute information in two-dimensional drawings (i.e., two-dimensional PID diagrams), logical relationships between three-dimensional components, and the correspondence between interfaces and three-dimensional components in two-dimensional drawings. Component interface matching rules also include design specification requirements for technical rules and piping logic to reduce the difficulty of three-dimensional design and improve the efficiency of three-dimensional modeling. Technical rules include rules for selecting pipe materials and diameters, and pipe bending rules. For example, component interface matching rules include flange end face type, pressure matching, and matching of internal and external threaded connections. Design specification requirements for technical rules include the use of SSC material for acidic exhaust systems and SUS316L-BA material for bulk pure N2 gas. Pipe bending rules include a pipe bending angle of 90° and a pipe length of 60 mm.

[0041] It's important to understand that semiconductor factories typically consist of 11 distribution systems (such as ultrapure water, waste gas, and wastewater systems). Each distribution system has sub-distribution systems. For example, a waste gas distribution system might have sub-distribution systems for acidic exhaust, alkaline exhaust, and general exhaust. Different sub-distribution systems may use different or the same piping materials.

[0042] The initial attribute information of components includes the geometric information and engineering attributes of the 3D components, which are used to ensure the correct connection and drawing of 3D components (pipelines) between plant-end pipe interfaces and equipment-end interfaces, and between equipment. The geometric information of 3D components includes basic dimensions (such as length, width, height, diameter, radius, thickness, etc.), shape type (such as rectangle, circle, triangle, polygon, etc.), edge type (such as right angle, rounded corner, chamfer, etc.), surface features (such as groove, protrusion, hole, etc.), spatial position (such as position coordinates, orientation, tilt angle, etc.), assembly features (such as assembly holes, assembly surfaces, assembly direction, etc.), fit type (such as clearance fit, interference fit, etc.), complex geometric features (such as complex curved surfaces, complex structures), geometric constraints (such as parallel, perpendicular, tangent, etc.), and geometric analysis parameters (such as center of gravity, moment of inertia, etc.). The engineering attributes of three-dimensional components include physical attributes (such as size, weight, material, color, surface treatment, etc.), electrical attributes (such as voltage rating, current rating, insulation class, etc.), thermal attributes (such as heating temperature, heat resistance, etc.), compliance attributes (such as safety certification, environmental protection requirements, industry standards, etc.), manufacturer attributes (such as manufacturer name, manufacturer standards, etc.), and pressure attributes (such as Class 150, 300, etc.).

[0043] The collected initial attribute information of the components is organized, and multiple labels are determined based on the geometric information and / or engineering properties of the 3D components. These labels are then categorized, for example, into categories such as "material," "pressure," "system," and "function."

[0044] Based on multiple tags, the initial attribute information of each component is tagged, and a corresponding tag is assigned to each component. Potential relationships between components are identified based on their tags. For example, if two components both have the tag "Electrical System," they may be connected via a power line. Logical relationships between components are constructed based on the identified relationships, including the order, direction, and type of connection. These logical relationships are recorded to form the logical relationship information between each component. This logical relationship information details how each component connects to other components.

[0045] In a specific example, labels are categorized based on the function and material of the pipes. For instance, labels include pipes, fittings, valves, equipment, and interfaces. In an ultrapure water system requiring polyvinylidene fluoride (PVDF) pipes, fittings include tees, elbows, reducers, etc.; valves are diaphragm valves; equipment includes pure water treatment units; and interfaces include flanges, socket welds, unions, etc. In an exhaust gas acid / alkali discharge system requiring Teflon-coated stainless steel ducts, fittings include tees, elbows, pressure gauges, test ports, gas detectors; valves are butterfly valves; equipment includes exhaust fans and exhaust gas treatment equipment; and interfaces include flanges, threads, clamps, etc.

[0046] By tagging the initial attribute information of components, it can be ensured that the initial attribute information of components is effectively tagged, and the logical relationships between components built based on these tags can be accurately reflected in the 3D design, thereby improving design efficiency and quality.

[0047] The 3D modeling design requirements in the semiconductor factory interface layout information include interface information for different devices at various locations within the semiconductor factory, including electrical interfaces, pure wastewater interfaces, and gas interfaces. Based on this interface information, the starting interface can be determined, thus defining the starting point for 3D modeling, generating a semiconductor factory equipment model 10 containing device interfaces 11, such as... Figure 2 As shown, the device interface 11 in the semiconductor factory equipment model 10, which includes device interface 11, is an equipment interface description model (EID). The EID model is a unique feature of semiconductor equipment, and its interfaces are quite complex. It is used to describe in detail the interface information of each device in the semiconductor factory. This interface information is crucial for equipment integration, debugging, and maintenance.

[0048] The EID model ensures compatibility and interoperability between devices by describing interface information in detail. Furthermore, clear interface descriptions facilitate quick problem identification and resolution, improving equipment maintenance efficiency. The standardized interface descriptions also make it easier to integrate devices from different vendors into a single system.

[0049] In a specific example, a reference point or benchmark is selected from the semiconductor factory interface layout information as the starting point for 3D modeling. A coordinate system is defined in the 3D modeling software to ensure it matches the actual factory layout. Based on the collected equipment data, a geometric model of the equipment (i.e., the semiconductor factory equipment model) is created in the 3D modeling software. The semiconductor factory equipment model is placed in 3D space according to the actual layout. Attributes are defined for each equipment interface, such as type, size, location, and orientation. A geometric model of the interface is created in the 3D modeling software and associated with the corresponding semiconductor factory equipment model. Detailed interface information, such as interface name, type, and connection requirements, is annotated in the semiconductor factory equipment model. The accuracy and completeness of the semiconductor factory equipment model and EID model are checked using 3D views. Through these steps, the starting point for 3D modeling is determined, and a detailed semiconductor factory equipment model containing equipment interfaces is constructed, providing strong support for the design, layout, and equipment integration of the semiconductor factory.

[0050] Furthermore, by combining component interface matching rules and logical relationship information between components, and integrating a 3D touch automatic verification algorithm and an optimal path algorithm based on safety distance correction, the component type and component connection path are determined, referring to... Figure 3 Specifically, it includes the following steps: In response to the determination of the starting point of 3D modeling, obtain the component interface matching rules of the starting equipment model or plant interface of the semiconductor factory; Determine the component connection logic based on the semiconductor factory interface layout information; Based on the logical relationship information between various components and combined with the component connection logic, by matching and filtering the data of connected components, a set of all feasible component connection paths and corresponding component types are given. By integrating safety distances and using a modified optimal path algorithm, the initial component connection path is determined from the set of all feasible component connection paths; Based on the three-dimensional touch automatic verification algorithm, the components in the initial component connection path are verified to determine the component type and the corresponding component connection path.

[0051] In one specific implementation, based on the determined 3D modeling starting point, the semiconductor plant's initial equipment model or plant interface and its component interface matching rules corresponding to the 3D modeling starting point can be obtained. In a specific example, in semiconductor manufacturing equipment, it is necessary to match the exhaust system output interface of a cleaning device with the input interface of the plant system. Component interface matching rules may include interface type, pressure rating, interface system, etc.

[0052] The component connection logic defines the connection relationships between various components. These relationships involve the physical location, interface direction, and connection sequence of the components. For example, component A can be connected to component B, but component A cannot be connected to component C. Another example is the automatic generation of corresponding elbows when drawing 1 / 4-inch to 2-inch pipes, and the automatic recommendation of different types of valves for that size when inserting valves, etc., to draw 3D pipes. The exhaust pipe is drawn starting from the machine interface, locating connection points. When connecting to the machine interface, a 3D touch automatic verification algorithm is used to verify the pipe material, size, and interface information of the machine interface. Inserting valves or fittings at pipe ports or in the middle of the pipe triggers the component connection logic, inserting fittings of the corresponding size. Specifically, in a semiconductor factory's exhaust system, the exhaust system pipes need to connect the cleaning equipment's exhaust interface to the plant management system interface. The multiple exhaust interfaces of the cleaning equipment have specific interface requirements, including pressure requirements, interface type requirements, and interface system requirements. The pressure requirements define the pressure matching rules for the selected interface and piping types; interface type requirements and system requirements ensure interface type compatibility and correct connection of interface subsystems; ensure correct connection of each interface, and plan the component connection path from one point to another, including turning, avoidance, and other actions. Figure 4 The diagram shown is a result display of the component connection path selection process. The red and blue dashed lines represent other component connection paths, the yellow pipe represents the optimal component connection path, and the component connection paths corresponding to the red and blue dashed lines are far apart.

[0053] It is understandable that for each component, there may be multiple other components that can be connected. By sequentially matching and filtering the connection component data of the other components that can be connected, a set of all feasible component connection paths corresponding to each component and the component type of each component in each component connection path can be obtained.

[0054] It is understandable that there are corresponding safety distances between each component. Based on these safety distances, a safety factor is determined for each component, and the optimal path algorithm is modified accordingly. Using the modified optimal path algorithm, the initial component connection path is determined from the set of all feasible component connection paths. After determining the initial component connection path, a 3D automatic touch verification algorithm is used to verify the components in the initial component connection path and determine the component type. According to the output management module, it is determined whether there is a collision between the connections established based on the initial component connection path in the 3D environment. If a collision exists, the connection relationship or component position is adjusted; if no collision exists, the component positions of the initial component connection path are retained. After collision detection is completed for each component in the initial component connection path, the final component type and corresponding component connection path are determined. The 3D automatic touch verification algorithm verifies the pipe diameter and pipe material corresponding to the contacting device interface and provides the corresponding component type when a collision occurs between the device interface and other device interfaces / plant interfaces.

[0055] Through the above steps, starting from obtaining component interface matching rules, to determining component connection logic, then matching and filtering component connection paths, and finally determining the final component connection path through a 3D touch automatic verification algorithm, the 3D model of the semiconductor factory is judged to ensure the accuracy and reliability of the 3D model.

[0056] Furthermore, by incorporating safety distances and employing a modified optimal path algorithm, initial component connection paths are determined from the set of all feasible component connection paths, referencing... Figure 5 Specifically, it includes the following steps: Set a safe distance and determine the path cost function; By using the optimal path algorithm, the path length and obstacle distance are combined to form the first element connection path set; The comprehensive cost of each feasible component connection path in the set of all feasible component connection paths and the comprehensive cost of each first component connection path in the set of first component connection paths are given respectively. The baseline cost is determined by the combined cost of each first element connection path in the first element connection path set; Based on the baseline cost, all feasible component connection paths are filtered to form a second set of component connection paths; Analyze the Manhattan distance between each second element connection path in the set of second element connection paths and the nearest obstacle, and combine it with the safety distance to give the safety factor function of the second element connection path; Based on the evaluation and screening function, the path length, safety factor function and path cost function are integrated to evaluate the connection path of each second element and determine the initial element connection path.

[0057] The path cost function is a relational expression with path length and path cost as independent variables, and the safety distance is a parameter in the path cost function. The relationship between the safety distance and path length and path cost is determined according to the specific scenario. The path cost function can be expressed as:

[0058] Where F(P) is the path cost function of the second element connection path, d safe For the safety distance, length(P) is the path length of path P, and cost(P) is the path cost of path P.

[0059] In one specific implementation, after determining the first set of component connection paths, the comprehensive cost of each first component connection path in the first set is analyzed using a path cost function. This comprehensive cost is then used as a benchmark cost to evaluate and filter the comprehensive costs of all feasible component connection paths in the set of all feasible component connection paths, resulting in a second set of component connection paths. Based on the second set of component connection paths, the Manhattan distance between each second component connection path and the nearest obstacle is analyzed, and a safety factor function for the second component connection path is derived by combining this with a safety distance. An evaluation and filtering function, including path length, safety factor function, and path cost function, is used to evaluate each second component connection path and determine the initial component connection paths.

[0060] Furthermore, through an optimal path algorithm, path length and obstacle distance are integrated to form a set of connection paths for the first element, referring to... Figure 6 Specifically, it includes the following steps: Based on the spatial information of the semiconductor factory building, a grid-based layout map composed of cells is generated, and the location of obstacles is determined; Based on breadth-first search, spread out over all obstacles and calculate the Manhattan distance from each cell to the nearest obstacle; By integrating path length and obstacle penalty terms, a weight relationship between semiconductor factory equipment nodes is formed, a modified optimal path algorithm is given, and a set of first component connection paths is generated.

[0061] In one specific implementation, the first step is to create a gridded layout map corresponding to the semiconductor factory based on its architectural spatial information. This architectural spatial information includes the location of the semiconductor factory and its various equipment and facilities, as well as their relative positions. This information can also be acquired by a data acquisition module and provided to the component modeling module. The gridded layout map consists of multiple cells, which can be used to plan component connection paths and analyze the distances between various equipment, facilities, or components. For example, a semiconductor factory may contain multiple pieces of equipment, such as lithography machines, etching machines, and cleaning equipment. The gridded layout map determines the location of each piece of equipment on the map, providing a basis for subsequent path planning. In addition to marking the locations of various facilities, equipment, and components, the gridded layout map also marks the locations of various obstacles affecting path planning within the semiconductor factory, such as support columns, walls, and other equipment.

[0062] After determining the obstacle locations, a breadth-first search (BFS) algorithm is used to expand the search to all obstacles, calculating the Manhattan distance from each cell to the nearest obstacle. The Manhattan distance is the shortest path length from one point to another within a gridded map. For example, on a gridded map, the path from the lithography machine to the etching machine might be blocked by multiple obstacles. By calculating the Manhattan distance, the feasibility and priority of different paths can be evaluated. The BFS algorithm starts from the initial node and visits its neighboring nodes hierarchically until all reachable nodes have been visited.

[0063] In path planning, it's crucial to consider not only the straight-line length of the path but also the impact of obstacles. By introducing an obstacle penalty term, paths can be weighted, and a modified optimal path algorithm can be applied to make the path planning more reasonable. The resulting weight relationships of semiconductor factory equipment nodes reflect the advantages and disadvantages of different paths, thus determining the optimal set of first-component connection paths. For example, in a semiconductor factory, some paths may have shorter straight-line distances but require bypassing multiple obstacles. By introducing an obstacle penalty term, the path planning algorithm can favor paths with longer straight-line distances but fewer obstacles, considering not only straight-line distance but also the impact of obstacles, thereby ensuring the feasibility and efficiency of the paths in the first-component connection path set.

[0064] Furthermore, by integrating path length and obstacle penalty terms to form a weight relationship between device nodes, a revised optimal path algorithm is given, specifically expressed as follows:

[0065] Where cost(i) is the weight of semiconductor factory equipment node i, length(i) is the path length from the 3D modeling starting point to semiconductor factory equipment node i, λ is the obstacle weight parameter, and d obs (i) represents the distance from semiconductor factory equipment node i to the nearest obstacle, and d safe For safe distance.

[0066] Furthermore, the safety factor function is specifically expressed as:

[0067] The evaluation filtering function is specifically expressed as follows:

[0068] Where S(P) is the safety factor function of the second element connection path, d obs (i) represents the distance from semiconductor factory equipment node i to the nearest obstacle, and d safe For a safe distance, ∏ i P is the product of the relative safety degrees of all semiconductor factory equipment nodes along the second component connection path. k Let F(P) be the selection function for the optimal k paths, F(P) be the path cost function for the second element connection path, length(P) be the total length of the second element connection path, and argtopk() be the function to select k initial element connection paths from the second element connection paths.

[0069] Furthermore, based on the 3D touch automatic verification algorithm, the components in the initial component connection path are verified to determine the component type and the corresponding component connection path. Specifically, this includes the following steps: Using the initial component connection path and the attribute extraction function, component attribute information is extracted to form a set of component attributes to be verified. The set of attributes of the components to be verified is verified using a verification function. Based on the verification and filtering rules, the component type and the corresponding component connection path are determined.

[0070] Furthermore, the set of attributes of the components to be inspected is validated using a validation function, specifically including:

[0071] in, Verification function for components between nodes A and B in a semiconductor factory, where m is the ID of a certain attribute of the component. Let f be any symbol, M be the set of component attributes, and f m () is the attribute extraction function, f m (P) A ) is a specified attribute of semiconductor factory equipment node A, fm (P) B ) is a specified attribute of semiconductor factory equipment node B.

[0072] In one specific implementation, after determining the initial component connection path, the attribute information of each component in the initial component connection path is also determined. An attribute extraction function is used to retrieve the attribute information of each component in the initial component connection path, such as size, pressure, material, and system, to obtain a set of attributes for the components to be verified. For example, if a lithography machine and an etching machine need to be connected via pipes, the interface dimensions, pipe diameter, material properties, and other attribute information of these two devices are extracted to form a set of attributes for the components to be verified. A verification function is then used to verify the set of attributes for the components to be verified. The verification includes checking whether the component dimensions match, whether the materials are compatible, and whether the interfaces are correctly connected. For example, the verification function is used to check whether the pipe interfaces between the lithography machine and the etching machine match, whether the pipe material meets the process requirements, and whether the pipe dimensions match the interface. Based on the verification and filtering rules, and combined with the verification results, the component type and the corresponding component connection path are determined. The verification and filtering rules include the shortest path, the safest path, and the lowest cost path. For example, based on the verification results and the verification and filtering rules, a path that meets both technical requirements and has the highest cost-effectiveness is selected to connect the lithography machine and the etching machine. The path may need to bypass certain obstacles or select specific pipe materials to adapt to process requirements. For example, M = {material, interface type, pipe diameter, standard, pressure rating}.

[0073] By employing a 3D touch-based automatic verification algorithm to verify the initial component connection path and determine the component connection path, automated and intelligent path planning can be achieved in semiconductor 3D modeling, improving factory layout efficiency and equipment connection accuracy.

[0074] The 3D modeling device for a semiconductor factory also includes a collaborative design module and an output management module. The collaborative design module is connected to the equipment modeling module and the connector modeling module. It is used to acquire information changes on the semiconductor factory equipment model and the interface connections between components in the semiconductor factory equipment model and to update the information in a timely manner to realize multi-segment collaborative design. The output management module is connected to the connector modeling module and is used to visualize the 3D model of the semiconductor factory output by the connector modeling module.

[0075] The collaborative design module is a system component designed to support multiple people working on designs simultaneously. It aims to improve design efficiency, reduce errors and conflicts, ensure simultaneous design by multiple people, timely information updates, and real-time visualization and sharing.

[0076] The collaborative design module allows multiple designers to work simultaneously on the same project, with each designer making independent modifications without interfering with others. Any changes to design information are updated in real time, ensuring all designers have access to the latest design data. This updated data is presented visually, allowing designers to view the progress and deliverables of other designers in real time. Through real-time monitoring and intelligent prompts, errors and conflicts during the design process are reduced, ensuring design consistency and accuracy.

[0077] The collaborative design module enables collaborative work and information sharing, improving the overall work efficiency of the design team and shortening the design cycle.

[0078] The output management module is responsible for converting the 3D model of the semiconductor factory into executable construction drawings and bills of materials. During the output presentation of the 3D model of the semiconductor factory, it automatically detects potential collisions between pipes to ensure design feasibility, while simultaneously managing space, optimizing spatial layout, ensuring the rational arrangement of equipment and piping, and improving space utilization.

[0079] The output management module also automatically generates detailed construction drawings based on the 3D model of the semiconductor factory, including equipment layout and piping routes, guiding on-site construction through virtual reality (VR) / augmented reality (AR) technology. It also generates material lists and bills of materials, including quantity, specifications, and models, to facilitate cost control and procurement. The output management module serves as an integrated data carrier, combining design data, construction drawings, and bills of materials for easy management and retrieval. Furthermore, it can integrate with simulation systems for more in-depth analysis and verification, such as fluid dynamics simulation and structural strength analysis.

[0080] Reference Figure 7 This invention provides a method for three-dimensional modeling of a semiconductor factory, the specific steps of which include: Obtain semiconductor factory interface layout information and connection component data, including component interface matching rules, component attribute information, and logical relationship information between various components; Based on the semiconductor factory interface layout information, the starting point for 3D modeling is determined, and a semiconductor factory equipment model containing equipment interfaces is generated. Based on the 3D design requirements information in the semiconductor factory interface layout information, starting with the semiconductor factory's initial equipment or plant interface, combined with component interface matching rules and logical relationship information between various components, and integrating a 3D touch automatic verification algorithm and an optimal path algorithm based on safety distance correction, the component type and component connection path are determined, realizing the interface connection between components in each semiconductor factory equipment model, and completing the 3D modeling of the semiconductor factory.

[0081] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working process of the described steps can be referred to the corresponding process in the foregoing device embodiments, and will not be repeated here.

[0082] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention. Clearly, those skilled in the art can make various alterations and modifications to the invention without departing from its spirit and scope. Thus, if these modifications and variations of the invention fall within the scope of the claims and their equivalents, the invention is also intended to include these modifications and variations.

Claims

1. A three-dimensional modeling device for a semiconductor factory, characterized in that, Specifically, it includes: The acquisition module is used to acquire semiconductor factory interface layout information and connection component data. The connection component data includes component interface matching rules, component attribute information, and logical relationship information between various components. The equipment modeling module is used to receive the semiconductor factory interface layout information from the acquisition module, determine the starting point for 3D modeling, and generate a semiconductor factory equipment model that includes the equipment interfaces. The component modeling module, based on the semiconductor factory interface layout information and 3D modeling starting point obtained from the receiving and acquisition module, uses the semiconductor factory's starting equipment or plant interface as the starting point. In response to the determination of the 3D modeling starting point, it acquires the component interface matching rules for the semiconductor factory's starting equipment model or plant interface. Based on the semiconductor factory interface layout information, it determines the component connection logic. Based on the logical relationships between components and combined with the component connection logic, it matches and filters the component connection data to provide a set of all feasible component connection paths and their corresponding component types. It sets safety distances and determines the path cost function. Based on the semiconductor factory's building space information, it forms a gridded layout map composed of cells and determines obstacle locations. Using breadth-first search, it diffuses all obstacles and calculates the Manhattan distance from each cell to the nearest obstacle. Finally, it fuses path length and obstacle penalty. This paper establishes the weight relationship of semiconductor factory equipment nodes, provides a modified optimal path algorithm, and generates a first set of component connection paths. It then provides the comprehensive cost of each feasible component connection path in all feasible component connection path sets and the comprehensive cost of each first component connection path in the first set of component connection paths. A baseline cost is determined based on the comprehensive cost of each first component connection path in the first set of component connection paths. Based on the baseline cost, all feasible component connection paths are filtered to form a second set of component connection paths. The Manhattan distance between each second component connection path in the second set and the nearest obstacle is analyzed, and a safety factor function for the second component connection path is given in conjunction with the safety distance. Based on the evaluation and filtering function, the path length, safety factor function, and path cost function are integrated to evaluate each second component connection path and determine the initial component connection path. The safety factor function is specifically expressed as follows: ； The evaluation filtering function is specifically expressed as follows: ； Where S(P) is the safety factor function of the second element connection path, d obs (i) represents the distance from semiconductor factory equipment node i to the nearest obstacle, and d safe For a safe distance, ∏ i P is the product of the relative safety degrees of all semiconductor factory equipment nodes along the second component connection path. k Let F(P) be the selection function for the optimal k paths, F(P) be the path cost function for the second element connection path, and length(P) be the total length of the second element connection path. Based on the 3D touch automatic verification algorithm, the elements in the initial element connection path are verified to determine the element type and the corresponding element connection path. Specifically, this includes the following steps: using the initial element connection path and combining it with the attribute extraction function, extract the element attribute information to form a set of attributes of the elements to be verified; verify the set of attributes of the elements to be verified using the verification function, specifically including: ； in, Verification function for components between nodes A and B in a semiconductor factory, where m is the identifier of a component attribute, ∀ represents an arbitrary symbol, M is the set of component attributes, and f m () represents the attribute extraction function, f m (P) A ) is a specified attribute of semiconductor factory equipment node A, f m (P) B ) is a specified attribute of semiconductor factory equipment node B; Based on the verification and screening rules, the component type and the corresponding component connection path are determined. Among them, the three-dimensional touch automatic verification algorithm verifies the pipe diameter and pipe material corresponding to the contacting device interface when the device interface touches other device interfaces / plant interfaces and provides the corresponding component type. Combined with the component attribute information of the acquisition module, the interface connection between components in each semiconductor factory equipment model in the equipment modeling module is realized, and the three-dimensional modeling of the semiconductor factory is completed.

2. The three-dimensional modeling apparatus for a semiconductor factory as described in claim 1, characterized in that, Obtaining connection element data specifically includes the following steps: Obtain component interface matching rules and initial component attribute information; The initial attribute information of the components is tagged, and based on the tags of each component, the logical relationships between the components are constructed to form the logical relationship information between the components.

3. The three-dimensional modeling apparatus for a semiconductor factory as described in claim 1, characterized in that, By integrating path length and obstacle penalty terms to form the weight relationship of device nodes, a modified optimal path algorithm is given, specifically expressed as follows: ； Where cost(i) is the weight of semiconductor factory equipment node i, length(i) is the path length from the 3D modeling starting point to semiconductor factory equipment node i, λ is the obstacle weight parameter, and d obs (i) represents the distance from semiconductor factory equipment node i to the nearest obstacle, and d safe For a safe distance.

4. The three-dimensional modeling apparatus for a semiconductor factory as described in claim 1, characterized in that, It also includes a collaborative design module and an output management module; The collaborative design module is connected to the equipment modeling module and the connecting element modeling module. It is used to obtain information changes on the semiconductor factory equipment model and the interface connections between components in the semiconductor factory equipment model and to update the information in a timely manner to realize multi-segment collaborative design. The output management module is connected to the connection element modeling module and is used to visualize the 3D model of the semiconductor factory output by the connection element modeling module.

5. A three-dimensional modeling method for a semiconductor factory, characterized in that, The three-dimensional modeling apparatus for a semiconductor factory as described in any one of claims 1-4 specifically includes the following steps: Obtain semiconductor factory interface layout information and connection component data, including component interface matching rules, component attribute information, and logical relationship information between various components; Based on the semiconductor factory interface layout information, the starting point for 3D modeling is determined, and a semiconductor factory equipment model containing equipment interfaces is generated. Based on the semiconductor factory interface layout information and the starting point of 3D modeling, starting with the semiconductor factory's initial equipment or plant interface, and responding to the determination of the 3D modeling starting point, the component interface matching rules for the semiconductor factory's initial equipment model or plant interface are obtained. According to the semiconductor factory interface layout information, the component connection logic is determined. Based on the logical relationship information between various components, and combined with the component connection logic, through matching and filtering of the connected component data, a set of all feasible component connection paths and their corresponding component types are given. A safety distance is set, and the path cost function is determined. Based on the semiconductor factory's building space information, a gridded layout map composed of cells is formed, and the location of obstacles is determined. Using breadth-first search, all obstacles are diffused, and the Manhattan distance from each cell to the nearest obstacle is calculated. The path length and obstacle penalty term are fused to form the semiconductor factory... Based on the weight relationship of device nodes, a modified optimal path algorithm is given to generate a first set of component connection paths. The comprehensive cost of each feasible component connection path in all feasible component connection path sets and the comprehensive cost of each first component connection path in the first set of component connection paths are given respectively. A baseline cost is determined based on the comprehensive cost of each first component connection path in the first set of component connection paths. Based on the baseline cost, all feasible component connection path sets are filtered to form a second set of component connection paths. The Manhattan distance between each second component connection path in the second set and the nearest obstacle is analyzed, and a safety factor function for the second component connection path is given in conjunction with the safety distance. Based on the evaluation and filtering function, the path length, safety factor function, and path cost function are integrated to evaluate each second component connection path and determine the initial component connection path. The safety factor function is specifically expressed as follows: ； The evaluation filtering function is specifically expressed as follows: ； Where S(P) is the safety factor function of the second element connection path, d obs (i) represents the distance from semiconductor factory equipment node i to the nearest obstacle, and d safe For a safe distance, ∏ i P is the product of the relative safety degrees of all semiconductor factory equipment nodes along the second component connection path. k Let F(P) be the selection function for the optimal k paths, F(P) be the path cost function for the second element connection path, and length(P) be the total length of the second element connection path. Based on the 3D touch automatic verification algorithm, the elements in the initial element connection path are verified to determine the element type and the corresponding element connection path. Specifically, this includes the following steps: using the initial element connection path and combining it with the attribute extraction function, extract the element attribute information to form a set of attributes of the elements to be verified; verify the set of attributes of the elements to be verified using the verification function, specifically including: ； in, Verification function for components between nodes A and B in a semiconductor factory, where m is the ID of a certain attribute of the component. Let f be any symbol, M be the set of component attributes, and f m () represents the attribute extraction function, f m (P) A ) is a specified attribute of semiconductor factory equipment node A, f m (P) B ) is a specified attribute of semiconductor factory equipment node B; Based on the verification and screening rules, the component type and the corresponding component connection path are determined. Among them, the three-dimensional touch automatic verification algorithm verifies the pipe diameter and pipe material corresponding to the contacting device interface and gives the corresponding component type when the device interface is connected to other device interfaces / plant interfaces. This realizes the interface connection between components in each semiconductor factory equipment model and completes the three-dimensional modeling of the semiconductor factory.

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