A processing device of a bidirectional stretch flexible electronic device

Abstract

This invention discloses a processing apparatus for biaxially stretched flexible electronic devices in the field of flexible electronic device processing technology. The apparatus includes a base with a vertical through-slot in the center. A displacement component is fixedly connected to the base, a clamping component is fixedly connected to the outer periphery of the displacement component, and a heating component is fixedly connected to the displacement component. A dehumidification component is located within the through-slot. A display controller is fixedly connected to the side wall of the base. The displacement component, clamping component, heating component, and dehumidification component are all signal-connected to the display controller. This invention utilizes the flexible clamping of airbags and suction cup adsorption to avoid surface scratches caused by excessive friction coefficients on the clamping surfaces. The design of the hot air ring pipe and nozzle allows for electric adjustment of the nozzle's longitudinal angle, ensuring uniform flow of heating air across the upper and lower surfaces of the processed material. This prevents uneven heating that could lead to curing deviations in the flexible electronic substrate, significantly improving the reliability, consistency, and production efficiency of flexible electronic devices, and promoting a higher yield rate.

Description

Technical Field

[0001] This invention belongs to the field of flexible electronic device processing technology, specifically a processing device for biaxially stretched flexible electronic devices. Background Technology

[0002] The rise of flexible electronics technology stems from people's imagination of electronic devices being bendable, stretchable, and even rollable. From health monitoring patches on the wrist to pressure-sensing "skin" covering the surface of robots, these scenarios require electronic devices to withstand repeated deformation in two directions simultaneously without failure. However, the unidirectional traction machines and static imprinting tables commonly used in early laboratories could only stretch the film in one direction, while forcing it to contract or wrinkle in the other. The devices quickly developed cracks under cross-stress. Such unidirectional tools obviously cannot replicate the real mechanical environment of human skin, which can stretch in both directions.

[0003] To overcome this limitation, engineers began experimenting with using pairs of rubber traction rollers to clamp the film from both sides, attempting to synchronously stretch it in both the lateral and longitudinal directions through roller rotation. However, in actual operation, the contact surface between the rollers and the film was only a thin line, and insufficient clamping force caused the film to deviate. Furthermore, the thickness differences between different batches of material made it difficult to adjust the roller spacing precisely at once; thinner materials would slip, while thicker ones would jam. Even a millisecond-level asynchrony between the two sets of motors could tear a diagonal rip in the film. Even with flexible rubber sleeves on the rollers, the difference in strain force between the sleeves and the processed material could easily cause surface scratches or irreversible deformation under stretching conditions. As shown in patent document CN118574331A, stretching is achieved by clamping flexible processed materials with two pairs of rollers on a base, but the aforementioned problems are difficult to avoid.

[0004] Furthermore, existing equipment, when drying the flexible circuit board substrate after processing, is prone to causing a large temperature difference between the upper and lower layers due to the characteristics of the processed materials, resulting in uneven curing. In addition, some processed materials may absorb excessive moisture in high humidity environments, causing delamination problems during stretching.

[0005] Therefore, it is necessary to propose a processing device for biaxially stretched flexible electronic devices that can avoid scratching the material surface due to excessive friction coefficient of the clamping surface by flexibly clamping the material, and can adjust the hot air drying angle according to the stretching area of ​​the material to uniformly heat and solidify the upper and lower surfaces of the circuit board substrate. Summary of the Invention

[0006] To address the aforementioned issues, the present invention aims to provide a processing apparatus for biaxially stretched flexible electronic devices. Through an annular displacement component, a flexible rotational effect is achieved when clamping the processed material. Flexible clamping by an airbag and suction cup adsorption prevent surface scratches caused by excessive friction coefficients on the clamping surfaces. Magnetorheological fluid damping precisely controls clamping and stretching displacement in multiple directions, preventing uneven tension. The design of the hot air ring pipe and nozzle allows for electric adjustment of the nozzle's longitudinal angle, ensuring uniform flow of heating air across the upper and lower surfaces of the processed material. This prevents uneven heating that could lead to curing deviations in the flexible electronic substrate, significantly improving the reliability, consistency, and production efficiency of flexible electronic devices, and promoting a higher yield rate.

[0007] To achieve the above objectives, the technical solution of the present invention is as follows: A processing device for biaxially stretched flexible electronic devices includes a base, a vertical through groove in the center of the base, a displacement component fixedly connected to the base, a clamping component fixedly connected to the outer periphery of the displacement component, a heating component fixedly connected to the displacement component, a dehumidification component provided in the through groove, and a display controller fixedly connected to the side wall of the base. The displacement component, clamping component, heating component, and dehumidification component are all signal connected to the display controller.

[0008] The displacement component is used to rotate and adjust the clamping and stretching direction of the clamping component;

[0009] Clamping assembly for fixing processed materials by deformation adsorption clamping and magnetorheological fluid damping tension locking;

[0010] Heating components are used to generate double-layer vortex hot air to simultaneously and uniformly dry the processed materials.

[0011] Dehumidification components are used for dehumidification using negative pressure molecular sieves and semiconductor condensation, and for moisture prevention using positive pressure nitrogen filling and semiconductor condensation.

[0012] The basic principle of the solution is as follows: A ring-shaped displacement component drives the clamping component to achieve 360° continuous rotation. During rotation, the airbag and suction cup work together. The airbag first conforms to the material contour with flexible deformation, and the suction cup then generates negative pressure to attract the material. This alternating operation converts the shear force at the clamping contact surface into a uniformly distributed normal force, avoiding the high frictional damage of traditional rigid clamps. During the stretching stage, the magnetorheological fluid damper adjusts the excitation current in real time based on the angular velocity signal fed back from the displacement component, causing the liquid damping body to solidify in different directions with a gradient, converting the rotational motion into precise multi-axial stretching displacement. A hot air ring pipe, through an electric nozzle… The longitudinal angle adjustment forms symmetrical vortex layers. The upper vortex blows the material's surface at a 15° upward angle, while the lower vortex blows the surface downward at the same angle. The two airflows converge at the material's centerline, generating turbulence to enhance heat transfer and ensure that the flexible substrate and functional layer reach the curing temperature synchronously. During the negative pressure phase, the dehumidification component uses the mesoporous channels of the molecular sieve to capture water molecules. When the detected dew point temperature exceeds a set threshold, the semiconductor condenser activates the Peltier effect to liquefy and discharge water vapor. Subsequently, 99.99% pure nitrogen is injected to replace the chamber. Under positive pressure, the nitrogen forms an inert atmosphere barrier, blocking the penetration of ambient humidity. The entire system uses a built-in PID algorithm in the display controller to dynamically couple and calculate rotational angular velocity, damping magnetic field strength, nozzle angle, and humidity parameters, achieving sequential coordinated control of stretching, heating, and dehumidification.

[0013] The beneficial effects of the basic solution are: 1. The magnetorheological fluid damper has a millisecond-level magnetic field response speed, and can dynamically adjust the curing strength of the damper in different directions based on the real-time angular velocity data of the displacement component. Specifically, when the rotational speed of the annular displacement component changes, the damper can instantly adjust the magnetic field strength, so that the liquid damper forms a precise gradient curing in the required stretching direction, thereby strictly controlling the error of multiaxial tensile force within ±0.5N, effectively solving the problem of uneven tension caused by the mechanical structure limitations of traditional stretching devices, ensuring that the flexible electronic device is subjected to uniform force during the stretching process, and preventing material damage or deformation caused by excessive local tension.

[0014] 2. The heating component adopts a dual-layer vortex hot air system. The upper vortex nozzle precisely blows onto the upper surface of the material at a 15° upward angle, while the lower vortex nozzle blows onto the lower surface at the same angle. The two airflows converge at the centerline of the material to form strong turbulence, enhancing the heat transfer effect. This effectively avoids curing deviations in flexible electronic substrates caused by uneven heating, improving the consistency of device performance.

[0015] 3. The dehumidification component integrates negative pressure molecular sieve and semiconductor condensation technology. The mesoporous channels of the molecular sieve can efficiently capture water molecules under negative pressure. When the dew point temperature inside the chamber exceeds the set threshold, the semiconductor condenser quickly activates the Peltier effect to liquefy and discharge water vapor. Subsequently, by injecting 99.99% pure nitrogen to replace the chamber, an inert atmosphere barrier is built under positive pressure, completely blocking the intrusion of environmental humidity. This provides comprehensive humidity protection for the processing environment of flexible electronic devices, ensuring the stability of humidity-sensitive materials and thus significantly improving the yield of devices.

[0016] 4. The annular displacement component supports 360° continuous rotation. Operators can adjust the stretching direction in real time according to the material texture and process requirements of flexible electronic devices, effectively reducing the stress concentration factor by up to 62%, providing precise adaptation to the anisotropy of materials, and enhancing the flexibility and adaptability of the stretching process.

[0017] 5. The clamping assembly innovatively integrates airbag flexible deformation and suction cup negative pressure adsorption technology. The airbag first gently conforms to the material contour through flexible deformation, while the suction cup then generates negative pressure for stable adsorption. The two work together to convert the shear force at the clamping contact surface into a uniformly distributed normal force. Practical applications show that this clamping method can reduce the surface scratch defect rate of flexible materials to below 0.3%, effectively avoiding the surface scratch problem caused by the high coefficient of friction of traditional rigid clamps, and ensuring the surface quality of the device.

[0018] Furthermore, the displacement assembly includes a processing cavity inside the base, which communicates with a through slot. A first annular bracket and a second annular bracket are fixedly connected to the top and bottom walls of the processing cavity, respectively. Both the first and second annular brackets are sleeved with the through slot. Both the first and second annular brackets have symmetrical annular grooves. A first displacement ring is slidably fitted in the annular groove of the first annular bracket, and a second displacement ring is slidably fitted in the annular groove of the second annular bracket. Displacement tooth grooves are formed on the outer walls of both the first and second displacement rings. A displacement motor is fixedly connected to the outer walls of both the first and second annular brackets. A displacement gear is coaxially fixedly connected to the output shaft of each displacement motor. The displacement gear meshes with the corresponding displacement tooth groove. Both displacement motors are connected to the display controller via signals.

[0019] The beneficial effects of the basic scheme are: 1. The displacement component achieves precise control of multi-axis displacement through the coordinated operation of the annular bracket, displacement ring, toothed groove, and motor. The displacement motor, based on the instructions from the display controller, drives the displacement ring to slide smoothly within the annular groove via the meshing of gears and toothed grooves, ensuring accurate displacement of the clamping component in multiple axes and providing a solid foundation for subsequent stretching operations.

[0020] 2. With the ingenious design of the ring-shaped bracket and displacement ring, the displacement component gives the clamping component flexible bidirectional rotation capability, which can quickly adjust the stretching direction according to the processing requirements of flexible electronic devices, meet the precise requirements of different processes for stretching angle, and improve the flexibility and adaptability of processing.

[0021] Furthermore, the clamping assembly includes four clamping members arranged in a quadrilateral shape. Each clamping member includes a symmetrically arranged "U-shaped" clamping bracket. One end of each clamping bracket is fixedly connected to the outer wall of the first displacement ring, and the other end of each clamping bracket is fixedly connected to the outer wall of the second displacement ring. A tension control cylinder is fixedly connected to the end of each clamping bracket away from the through slot. A clamping rod is fixedly connected between the output shafts of the tension control cylinders on the same side of the clamping bracket. Each tension control cylinder is connected to the display controller signal.

[0022] The beneficial effects of the basic scheme are: 1. The clamping assembly, through four clamping parts distributed in a quadrilateral shape, in conjunction with the stretching electric control cylinder, can realize multi-directional stretching of flexible electronic devices. The symmetrical arrangement of the clamping parts ensures uniform force during the stretching process, avoids material deformation or damage caused by uneven force at a single point, and improves processing quality.

[0023] 2. The "U-shaped" design of the clamping bracket and the fixed connection with the displacement ring provide a stable clamping force, while also being able to adapt to flexible electronic devices of different sizes and shapes, thus enhancing the versatility and adaptability of the device.

[0024] Furthermore, both ends of the clamping rod near the tension control cylinder are rotatably fitted with support gears. The inner bottom wall of the clamping bracket near the clamping rod is provided with support tooth grooves corresponding to the support gears. The support gears are provided with annular damping cavities and coil grooves. Several layers of outer damping rings are fixedly connected to the inner wall of the damping cavity. Several layers of inner damping rings are fixedly connected to the outer periphery of the clamping rod located in the damping cavity. The inner damping rings and the corresponding outer damping rings are interleaved. The damping cavity is filled with magnetorheological fluid. Excitation coils are wound in the coil grooves. The excitation coils are connected to the display controller signal.

[0025] The beneficial effects of the basic scheme are: 1. The meshing of the support gear and the support tooth groove with the magnetorheological fluid damping system can effectively buffer the impact force during the stretching process, achieve precise control of the stretching force, and prevent material deformation or damage caused by excessive or uneven stretching force.

[0026] 2. When the excitation coil is energized, it generates a magnetic field, which changes the viscosity of the magnetorheological fluid, thereby adjusting the damping force. This achieves efficient energy conversion and utilization, improving the stability and response speed of the stretching process. By adjusting the current in the excitation coil, the magnitude of the damping force can be flexibly changed to adapt to different materials and process requirements, enhancing the versatility and flexibility of the equipment. The entire damping system is integrated inside the support gear, resulting in a compact structure, small footprint, reduced external interference, and improved system reliability and durability.

[0027] Furthermore, a clamping groove is axially opened in the middle of the clamping rod, and several clamping feet are symmetrically hinged on the clamping rod and distributed on both sides of the clamping groove. The clamping feet on the same clamping rod are all parallel to the through groove. Each clamping foot is composed of several clamping arms, which are hinged to each other. Several driving airbags are fixedly connected inside each clamping foot. The driving airbags are used to bend and drive the corresponding clamping feet to symmetrically clamp the processed material after inflation. A suction cup is fixedly connected to the side of the clamping arm near the processed material. The bottom wall of the suction cup is opened with a main cavity and several peripheral cavities. The peripheral cavities on the same suction cup are distributed in a ring around the outer periphery of the main cavity. An air passage is connected between the main cavity and the peripheral cavity.

[0028] An inflation tube is fixedly sleeved inside the clamping rod. The inflation tube and the corresponding driving airbag are connected to each other through a solenoid valve. The two ends of the inflation tube pass through the two ends of the clamping rod and are connected to an air pump. The air pumps are fixedly connected to the inner wall of the processing cavity. The solenoid valves and air pumps are both connected to the display controller signal.

[0029] The beneficial effects of the basic solution are: 1. By inflating the driving airbag to drive the bending of the clamping feet, combined with the adsorption effect of the suction cup, non-destructive clamping of flexible electronic devices can be achieved, effectively avoiding the problem of material surface scratches caused by excessive friction in traditional mechanical clamping methods. The clamping feet are composed of multiple hinged clamping arms, which have good flexibility and adjustability, and can adapt to processing materials of different shapes and sizes, ensuring the stability and reliability of clamping. Multiple clamping feet are symmetrically distributed and move synchronously, so that the clamping force is evenly distributed on the material surface, preventing material deformation caused by excessive local pressure and improving processing accuracy.

[0030] 2. The suction cup's main and peripheral chambers are designed to generate strong suction force, ensuring stable fixation of materials during processing. Simultaneously, when material release is required, the solenoid valve and air pump can be controlled to quickly expel gas, achieving rapid material release and improving production efficiency. Both the solenoid valve and air pump are connected to the display controller, enabling automated and intelligent control of the clamping process. The clamping force and clamping time can be precisely adjusted according to different process requirements, enhancing the equipment's ease of use and adaptability.

[0031] Furthermore, the heating component includes a hot air blower, which is fixedly connected to the base. The output end of the hot air blower is connected to a "Y"-shaped hot air pipe, and the input end of the hot air blower is covered with a molecular sieve filter. The molecular sieve filter is used to remove the moisture absorbed by the hot air blower. The hot air blower is connected to the display controller for signal connection.

[0032] The beneficial effects of the basic solution are: 1. The hot air blower distributes hot air evenly to the processing area through the "Y"-shaped hot air pipe, ensuring that the flexible electronic device is heated evenly during the heating process, effectively avoiding changes or damage to material properties caused by local overheating or uneven heating.

[0033] 2. The molecular sieve filter is installed at the input end of the hot air blower to effectively remove moisture from the intake air, ensuring the dryness of the hot air and preventing moisture from affecting the processing. It is especially suitable for electronic materials that are sensitive to humidity, thus improving processing quality.

[0034] Furthermore, the heating assembly also includes symmetrically arranged hot air ring pipes. The hot air ring pipes are fixedly connected to the end of the clamping bracket away from the through slot. The two ends of the hot air pipe branch are respectively connected to the two symmetrical sides of the hot air ring pipe. Nozzles are slidably sleeved on the hot air ring pipes. Hot air grooves are opened on the outer wall of the hot air ring pipes corresponding to the nozzles. The hot air grooves are connected to the nozzles. The nozzles on the same hot air ring pipe are all inclined at the same radial angle. The nozzles between different hot air ring pipes correspond to each other. Push rods are hinged to the side walls of the nozzles. The corresponding push rods are coaxial and opposite. Push threads are opened on the push rods. The push threads on the corresponding push rods are opposite. Push sleeves are threaded between the corresponding push rods. Push tooth grooves are opened on the outer circumference of the push sleeves.

[0035] The heating assembly also includes a push gear ring, which is slidably engaged with the end of the clamping bracket. The inner side of the push gear ring has a drive tooth groove, which meshes with the push tooth groove. The end of the clamping bracket is fixedly connected to a push motor. The output shaft of the push motor is coaxially fixedly connected to a push gear. The outer side of the push gear ring has a driven tooth groove, which meshes with the push gear. The push motor is signal-connected to the display controller.

[0036] The basic design offers several advantages: symmetrically arranged hot air rings fixedly connected to the clamping brackets ensure even distribution of hot air around the processed material. The angled nozzle design directs the hot air at a specific angle towards the material, enhancing coverage and heating effect while effectively reducing temperature gradients. The nozzles slide on the hot air rings, and their angle can be flexibly adjusted via the threaded engagement of the push rod and push sleeve, and the meshing of the push gear and push ring. This design allows for precise adjustment of the hot air direction based on material shape and processing requirements, improving heating efficiency and adaptability.

[0037] Furthermore, the dehumidification component includes a ventilation pump, which is fixedly connected to the inner wall of the channel. A dehumidifying molecular sieve is laid at the output end of the ventilation pump, and the input end of the ventilation pump is connected to a nitrogen storage tank through a reversing valve. The reversing valve is also connected to the outside. Both the ventilation pump and the reversing valve are connected to the display controller signal.

[0038] The basic solution offers the following benefits: the dehumidification system, through the coordinated operation of a ventilation pump, dehumidifying molecular sieve, reversing valve, and nitrogen storage tank, achieves efficient dehumidification and moisture prevention. During dehumidification, the ventilation pump draws moisture from the channel, which is then adsorbed by the dehumidifying molecular sieve and discharged, effectively reducing the humidity of the processing environment and ensuring processing quality. The reversing valve allows the ventilation pump to both draw in moisture and introduce dry nitrogen. Precise control via a display controller enables rapid switching of operating modes according to processing requirements, achieving accurate humidity regulation and providing a stable humidity environment for the processing of flexible electronic devices.

[0039] Furthermore, a number of semiconductor condenser plates arranged in a ring around the outer periphery of the through groove are fixedly connected to the top wall of the base. Dehumidification grooves are opened in the top wall of the base between the semiconductor condenser plates to drain condensate.

[0040] The beneficial effects of the basic solution are: the semiconductor condenser is distributed in a ring around the outer periphery of the channel. Through the semiconductor condensation principle, the water vapor in the channel can be quickly condensed into liquid water and discharged through the dehumidification tank, which significantly improves the dehumidification efficiency and ensures the dryness of the processing environment.

[0041] Furthermore, the display controller is equipped with a monitoring module, a processing module, and a control module;

[0042] The monitoring module is used to collect data on strain and physicochemical property changes of the processed materials. It includes a temperature sensor, a humidity sensor, a capacitance sensor, and a fiber optic grating sensor. The temperature sensor is fixedly connected to the top wall of the processing cavity, the humidity sensor is fixedly connected to the through slot, and the capacitance sensor and the fiber optic grating sensor are both fixedly connected to the end of the clamping foot.

[0043] The processing module is used to determine whether the monitored strain and physicochemical property changes exceed preset thresholds based on the preset processing material type.

[0044] The control module is used to control the corresponding components of the above-mentioned device to keep the monitored data within the threshold range based on the judgment result of the processing module.

[0045] The beneficial effects of the basic solution are: the monitoring module built into the display controller collects data on the strain and physicochemical properties of the processed materials in real time through temperature sensors, capacitance sensors and fiber optic grating sensors, realizing comprehensive monitoring of the processing process and ensuring the accuracy of processing parameters.

[0046] Based on the processing module's judgment, the control module automatically controls the corresponding components of the device to dynamically adjust the monitored data to within the threshold range. This closed-loop control system can quickly respond to process changes, ensuring the stability and reliability of the processing. The display controller can integrate and analyze large amounts of real-time data, providing data support for process optimization, driving continuous improvement and technological innovation, and enhancing overall production efficiency. Attached Figure Description

[0047] Figure 1 This is an isometric view of the processing apparatus for biaxially stretched flexible electronic devices in an embodiment of the present invention.

[0048] Figure 2 This is a front cross-sectional view of the processing apparatus for biaxially stretched flexible electronic devices in an embodiment of the present invention.

[0049] Figure 3 This is a top sectional view of the processing apparatus for biaxially stretched flexible electronic devices in an embodiment of the present invention.

[0050] Figure 4 This is a front sectional view of the clamping rod in an embodiment of the present invention.

[0051] Figure 5 for Figure 2 Enlarged view of section A.

[0052] Figure 6 for Figure 2 Enlarged view of section B.

[0053] Figure 7 for Figure 3 Enlarged view of section C.

[0054] Figure 8 for Figure 4 Enlarged view of section D.

[0055] The reference numerals in the accompanying drawings include: 1. Base; 2. Dehumidification tank; 3. Semiconductor condenser plate; 4. Clamping rod; 5. Clamping foot; 6. Through slot; 7. Display controller; 8. Ventilation pump; 9. Reversing valve; 10. Dehumidifying molecular sieve; 11. Nitrogen storage tank; 12. Air pump; 13. Inflating pipe; 14. Hot air loop pipe; 15. Tensioning electric cylinder; 16. Clamping bracket; 18. Push rod; 19. First annular bracket; 20. 21. First displacement ring; 22. Hot air duct; 23. Second displacement ring; 24. Second annular support; 25. Hot air blower; 26. Filter molecular sieve; 27. Push gear ring; 28. Push gear; 29. ​​Support gear; 30. Drive airbag; 31. Clamping arm; 32. Suction cup; 33. Clamping groove; 34. Nozzle; 35. Push sleeve; 36. Excitation coil; 37. Inner damping ring; 38. Outer damping ring; 39. Displacement gear. Detailed Implementation

[0056] The following detailed description illustrates the specific implementation method:

[0057] Example 1

[0058] The basics are as follows: Figures 1 to 8 As shown: A processing apparatus for biaxially stretched flexible electronic devices includes a base 1, a vertical through groove 6 in the center of the base 1, a displacement component welded on the base 1, a clamping component welded to the outer periphery of the displacement component, a heating component welded on the displacement component, a dehumidification component installed in the through groove 6, and a display controller 7 welded to the side wall of the base 1. The displacement component, clamping component, heating component and dehumidification component are all signal connected to the display controller 7.

[0059] The displacement assembly is used to rotate and adjust the clamping and stretching direction of the clamping assembly. The displacement assembly includes a processing cavity inside the base 1, which is connected to the through groove 6. A first annular bracket 19 and a second annular bracket 23 are welded to the top and bottom walls of the processing cavity, respectively. Both the first annular bracket 19 and the second annular bracket 23 are sleeved with the through groove 6. Both the first annular bracket 19 and the second annular bracket 23 have symmetrical annular grooves. A first displacement ring 20 is slidably fitted in the annular groove of the first annular bracket 19, and a second displacement ring 22 is slidably fitted in the annular groove of the second annular bracket 23. Displacement tooth grooves are opened on the outer walls of both the first displacement ring 20 and the second displacement ring 22. Displacement motors are welded to the outer walls of both the first annular bracket 19 and the second annular bracket 23. Displacement gears 38 are coaxially welded to the output shafts of both displacement motors. The displacement gears 38 mesh with the corresponding displacement tooth grooves. Both displacement motors are connected to the display controller 7 via signals.

[0060] A clamping assembly is used to fix processed materials by deformation adsorption clamping and magnetorheological fluid damping tension locking. The clamping assembly includes four clamping members distributed in a quadrilateral shape. Each clamping member includes a symmetrically installed "U-shaped" clamping bracket 16. One end of each clamping bracket 16 is welded to the outer wall of the first displacement ring 20, and the other end of each clamping bracket 16 is welded to the outer wall of the second displacement ring 22. A tension control cylinder 15 is welded to the end of each clamping bracket 16 away from the through groove 6. A clamping rod 4 is welded between the output shafts of the tension control cylinders 15 on the same side of the clamping bracket 16. Each tension control cylinder 15 is connected to the display controller 7. The clamping rod 4 is rotatably sleeved with support gears 28 at both ends near the tension control cylinder 15. The inner bottom wall of the clamping bracket 16 near the clamping rod 4 has support tooth grooves corresponding to the support gears 28. The support gears 28 have annular damping cavities and coil grooves. Several layers of outer damping rings 37 are welded to the inner wall of the damping cavity. Several layers of inner damping rings 36 are welded to the outer periphery of the clamping rod 4 located in the damping cavity. The inner damping rings 36 and the corresponding outer damping rings 37 are interleaved. The damping cavity is filled with magnetorheological fluid. Excitation coils 35 are wound in the coil grooves. The excitation coils 35 are connected to the display controller 7.

[0061] A clamping groove 32 is axially opened in the middle of the clamping rod 4. Several clamping feet 5 are symmetrically hinged on the clamping rod 4 and distributed on both sides of the clamping groove 32. The clamping feet 5 on the same clamping rod 4 are all parallel to the through groove 6. Each clamping foot 5 is composed of several clamping arms 30, which are hinged to each other. Several driving airbags 29 are glued inside each clamping foot 5. The driving airbags 29 are used to bend and drive the corresponding clamping feet 5 to symmetrically clamp the processed material after inflation. A suction cup 31 is glued to the side of the clamping arm 30 near the processed material. The bottom wall of the suction cup 31 has a main cavity and several peripheral cavities. The peripheral cavities on the same suction cup 31 are distributed in a ring around the outer periphery of the main cavity. An air passage connects the main cavity and the peripheral cavity.

[0062] An inflation tube 13 is fixedly sleeved inside the clamping rod 4. The inflation tube 13 and the corresponding driving airbag 29 are respectively connected through a solenoid valve. The two ends of the inflation tube 13 pass through the two ends of the clamping rod 4 and are respectively connected to an air pump 12. The air pump 12 is welded to the inner wall of the processing cavity. The solenoid valve and the air pump 12 are both connected to the display controller 7.

[0063] The heating assembly is used to form a double-layer vortex hot air flow for synchronous and uniform drying of the processed materials. The heating assembly includes a hot air blower 24, which is welded to the base 1. The output end of the hot air blower 24 is connected to a Y-shaped hot air pipe 21. A molecular sieve filter 25 is laid at the input end of the hot air blower 24 to remove moisture absorbed by the hot air blower 24. The hot air blower 24 is connected to a display controller 7. The heating assembly also includes symmetrically arranged hot air ring pipes 14, which are welded to the end of the clamping bracket 16 away from the through groove 6. The two bifurcated ends of the hot air pipe 21 are respectively connected to the hot air ring pipe 14. Both sides of the device are connected. A nozzle 33 is slidably sleeved on each of the hot air ring pipes 14. Hot air grooves are opened on the outer walls of the hot air ring pipes 14 and the nozzles 33, and the hot air grooves are connected to the nozzles 33. The nozzles 33 on the same hot air ring pipe 14 are all inclined at the same radial angle. The nozzles 33 between different hot air ring pipes 14 correspond to each other. A push rod 18 is hinged to the side wall of each nozzle 33. The corresponding push rods 18 are coaxial and opposite to each other. Push threads are opened on each push rod 18. The push threads on the corresponding push rods 18 are opposite. A push sleeve 34 is threaded between the corresponding push rods 18. A push tooth groove is opened on the outer circumference of the push sleeve 34.

[0064] The heating assembly also includes a push gear ring 26, which is slidably engaged with the end of the clamping bracket 16. The inner side of the push gear ring 26 has a drive tooth groove, which meshes with the push tooth groove. The end of the clamping bracket 16 is welded with a push motor, and the output shaft of the push motor is coaxially welded with a push gear 27. The outer side of the push gear ring 26 has a driven tooth groove, which meshes with the push gear 27. The push motors are all connected to the display controller 7 via signals.

[0065] The dehumidification component is used for dehumidification using negative pressure molecular sieves and semiconductor condensation, and for moisture prevention using positive pressure nitrogen filling and semiconductor condensation. The dehumidification component includes a ventilation pump 8, which is welded to the inner wall of the channel 6. A dehumidification molecular sieve 10 is laid at the output end of the ventilation pump 8. The input end of the ventilation pump 8 is connected to the outside and a nitrogen storage tank 11 through a reversing valve 9. Both the ventilation pump 8 and the reversing valve 9 are connected to the display controller 7. Several semiconductor condensation plates 3 are welded in a ring around the outer periphery of the channel 6 on the top wall of the base 1. A dehumidification groove 2 is opened on the top wall of the base 1 between the semiconductor condensation plates 3. The dehumidification groove 2 is used to drain condensate.

[0066] The specific implementation process is as follows: Since the existing biaxial stretching flexible electronic device processing equipment mostly uses paired clamping rollers to stretch and displace materials, the high friction material on the surface of the clamping rollers can easily scratch the processed materials. Furthermore, the heating and drying equipment during the processing can easily cause uneven temperatures on the upper and lower surfaces of the processed materials due to the shape of the processed materials, thus affecting the curing uniformity of the electronic substrate. This device is designed to solve these problems.

[0067] When the device is started, the display controller 7 first initiates the initialization of the entire system. It detects and calibrates the initial state of the displacement component, clamping component, heating component and dehumidification component to ensure that each component is in the preset starting position, such as the displacement ring returning to the zero point of the annular groove, the tension electric control cylinder 15 being in the contracted state, and the excitation coil 35 having no current input. At the same time, it verifies whether the signal connection between each component and the display controller 7 is smooth, so as to provide a stable control foundation for subsequent processing.

[0068] Subsequently, combined Figure 1 and Figure 2 As shown, the dehumidification component enters the working state first, creating a dry environment for processing. The display controller 7 sends signals to the ventilation pump 8 and the reversing valve 9. The reversing valve 9 first switches to the state of being connected to the outside. After the ventilation pump 8 starts, it begins to draw air from the channel 6. When the air passes through the dehumidifying molecular sieve 10 at the output end of the ventilation pump 8, the moisture in it is adsorbed and removed. At the same time, the semiconductor condenser 3 on the top wall of the base 1 is energized and cooled, causing the residual moisture in the air in the channel 6 to condense into small water droplets. These water droplets are discharged along the dehumidification groove 2 between the semiconductor condenser 3. This process rapidly reduces the humidity in the channel 6 through the dual action of negative pressure molecular sieve adsorption and semiconductor condensation dehumidification. When the humidity drops to the preset threshold, the reversing valve 9 switches to the state of being connected to the nitrogen storage tank 11. The ventilation pump 8 injects nitrogen into the channel 6, creating a positive pressure environment in the channel 6. Utilizing the inertness and drying properties of nitrogen, the intrusion of external moisture is effectively isolated, providing a stable low-humidity environment for the processing of flexible electronic devices and avoiding the impact of moisture on device performance.

[0069] After environmental pretreatment, the device enters the material clamping stage. The display controller 7 controls the displacement assembly to adjust the clamping direction based on the size and stretching requirements of the flexible electronic device to be processed. Upon receiving a signal, the displacement motor starts, and its output shaft drives the displacement gear 38 to rotate. The displacement gear 38 meshes with the displacement grooves on the outer walls of the first displacement ring 20 and the second displacement ring 22, thereby driving the first displacement ring 20 and the second displacement ring 22 to slide synchronously within the annular grooves of the first annular support 19 and the second annular support 23. Since the two ends of the "U-shaped" clamping bracket 16 of the clamping assembly are fixedly connected to the first displacement ring 20 and the second displacement ring 22 respectively, the rotation of the displacement rings will drive the four quadrilaterally distributed clamping components to rotate as a whole, ultimately ensuring that the clamping components are precisely aligned with the four corners of the material, preparing the position for subsequent clamping.

[0070] Immediately afterwards, combined Figure 3 , Figure 4 and Figure 5As shown, the display controller 7 sends a signal to the stretching electric cylinder 15, causing the output shaft of the stretching electric cylinder 15 to extend and push the clamping rod 4 to move closer to the material. During this process, the support gears 28 at both ends of the clamping rod 4 roll along the support tooth grooves on the inner bottom wall of the clamping bracket 16, which not only guides the movement of the clamping rod 4 but also enhances the stability of the clamping rod 4, preventing it from tilting during movement. When the clamping rod 4 moves to the edge of the material, the display controller 7 controls the air pump 12 to start, and the air inflator 13 inflates the drive airbag 29 in the clamping foot 5 through the solenoid valve. After the drive airbag 29 is inflated, it expands and bends, driving the clamping foot 5, which is made up of multiple clamping arms 30 hinged together, to move closer to the center of the clamping groove 32, so that the symmetrically distributed clamping feet 5 clamp the material from both sides. When the suction cup 31 on the clamping arm 30 contacts the material surface, the gas in the main cavity of the suction cup 31 is discharged through the peripheral cavity. The main cavity adsorbs the central area of ​​the material, while the peripheral cavity assists in fixing the edge of the material. This synchronous adsorption structure of the center and the edge can not only ensure that the material is firmly clamped, but also adapt to the deformation characteristics of flexible electronic devices through the flexible contact of the suction cup 31 and the hinge structure of the multi-segment clamping arm 30, thus avoiding excessive clamping force that could damage the material.

[0071] When bidirectional stretching of the material is required, the display controller 7 controls the output shaft of the stretching electric control cylinder 15 to continuously extend or retract according to the stretching parameters, driving the clamping rod 4 to move away from or towards the center of the through groove 6, thereby stretching the material through the clamping foot 5 to produce deformation. At the same time, the display controller 7 supplies current to the excitation coil 35 in the support gear 28. The excitation coil 35 generates a magnetic field, causing the magnetorheological fluid in the damping cavity to instantly change from a liquid state to a semi-solid state with a certain shear yield strength. Since the outer damping ring 37 in the damping cavity and the inner damping ring 36 on the clamping rod 4 are intertwined, after the magnetorheological fluid solidifies, it will tightly combine the inner damping ring 36 and the outer damping ring 37, forming a strong damping force, preventing the support gear 28 from rolling in the support tooth groove, thereby locking the position of the clamping rod 4 and achieving precise positioning during the stretching process. This magnetorheological fluid damping locking method responds quickly and can adjust the excitation current in real time according to the change of stretching force, flexibly changing the damping strength, ensuring that the stretching process is stable and controllable, and avoiding irregular deformation of the material due to fluctuations in stretching force. Figure 6 and Figure 7 As shown.

[0072] During the stretching process, the heating components are activated to dry the material. The display controller 7 controls the hot air blower 24. Outside air is heated after being filtered through the molecular sieve 25 at the input of the hot air blower 24 to remove moisture. The hot airflow is then delivered through a "Y"-shaped hot air duct 21 to symmetrically arranged hot air ring pipes 14. The nozzles 33 on the hot air ring pipes 14 are connected to the hot air troughs, spraying out the hot airflow. Since the nozzles 33 on the same hot air ring pipe 14 are all tilted at the same radial angle, and the nozzles 33 on different hot air ring pipes 14 correspond to each other, two layers of intersecting hot airflow are initially formed. To further improve heating uniformity, the display controller 7 activates the drive motor. The output shaft of the drive motor drives the drive gear 27 to rotate. The drive gear 27 meshes with the driven tooth groove on the outer side of the drive gear ring 26, causing the drive gear ring 26 to slide at the end of the clamping bracket 16. The drive tooth groove on the inner side of the push ring 26 meshes with the drive tooth groove on the outer circumference of the push sleeve 34, causing the push sleeve 34 to rotate. Since the threads of the push rods 18 at both ends of the push sleeve 34 are opposite, the rotation of the push sleeve 34 will drive the push rods 18 at both ends to move closer or further away synchronously, thereby causing the nozzle 33 to slide on the hot air ring pipe 14. The movement of the nozzle 33 combined with the tilt angle can make the ejected hot air flow form a dynamic vortex. The interaction of the two layers of vortex hot air can evenly cover all areas of the material, avoiding the local overheating problem caused by traditional fixed heating methods, ensuring that the flexible electronic device is heated evenly during the stretching process, and improving the processing quality.

[0073] Combination Figure 8 As shown, the dehumidification component remains operational throughout the entire processing. The display controller 7 adjusts the operating parameters of the ventilation pump 8 and the semiconductor condenser 3 in real time based on the humidity within the channel 6. When the humidity is too high, the reversing valve 9 switches to extraction mode, and the ventilation pump 8 continuously draws air from the channel 6 and dehumidifies it through the dehumidifying molecular sieve 10. Simultaneously, the semiconductor condenser 3 cools and enhances condensation dehumidification. Once the humidity reaches the target level, the reversing valve 9 switches to nitrogen filling mode, maintaining a positive pressure nitrogen environment within the channel 6 to ensure the material remains dry throughout the processing.

[0074] After processing, the display controller 7 sequentially controls the reset of each component. Finally, the flexible electronic device, which has undergone bidirectional stretching, uniform drying, and stable clamping, is removed. The entire process, through the precise coordination of the display controller 7, achieves seamless cooperation among the components, ensuring processing accuracy while adapting to the material characteristics of the flexible electronic device, significantly improving processing efficiency and finished product quality.

[0075] Example 2

[0076] The difference from the above embodiments is that the display controller 7 is equipped with a monitoring module, a processing module and a control module;

[0077] The monitoring module is used to collect data on strain and physicochemical property changes of the processed materials. It includes a temperature sensor, a humidity sensor, a capacitance sensor and a fiber optic grating sensor. The temperature sensor is fixedly connected to the top wall of the processing cavity, the humidity sensor is fixedly connected to the through groove 6, and the capacitance sensor and the fiber optic grating sensor are both fixedly connected to the end of the clamping foot 5.

[0078] The processing module is used to determine whether the monitored strain and physicochemical property changes exceed preset thresholds based on the preset processing material type.

[0079] The control module is used to control the corresponding components of the above-mentioned device to keep the monitored data within the threshold range based on the judgment result of the processing module.

[0080] The specific implementation process is as follows: Throughout the entire processing of the biaxially stretched flexible electronic device, the monitoring module, processing module, and control module of the display controller 7 always work together to ensure the accuracy and stability of the processing process through real-time data acquisition, intelligent judgment, and dynamic regulation.

[0081] After processing begins, the monitoring module is the first to enter the working state, and each sensor completes self-test and starts continuously collecting data. The temperature sensor on the top wall of the processing chamber monitors the temperature changes of the processing environment in real time, providing basic data for the control of the heating components; the humidity sensor in the through groove 6 works with the dehumidification component to continuously track the humidity value in the through groove 6, ensuring the stability of the drying environment; the capacitance sensor and fiber optic grating sensor at the end of the clamping foot 5 are in close contact with the material surface. The capacitance sensor reflects the change of physical and chemical properties (such as dielectric constant) of the material by detecting the capacitance change caused by deformation, while the fiber optic grating sensor accurately measures the degree of strain of the material by using the offset of the wavelength of the reflected light from the grating. Together, they form a real-time monitoring network for the material processing status, and the data is continuously transmitted to the processing module of the display controller 7 through signal lines.

[0082] After receiving the monitoring data, the processing module calls the corresponding threshold parameter library according to the preset processing material type (such as polymer-based flexible circuits, metal nanowire flexible electrodes, etc.). For example, for polymer-based materials, the preset temperature threshold may be 60-80℃, the humidity threshold may be below 30% RH, and the maximum strain threshold may be 5%. The processing module compares the real-time collected temperature, humidity, capacitance, and strain data with these thresholds. If any data is close to the upper limit of the threshold, the processing module will issue a warning signal; if it exceeds the threshold, it will immediately generate an adjustment command to ensure that the processing is always carried out within the range that the material can withstand.

[0083] The control module precisely adjusts the corresponding components of the device based on the judgment results of the processing module. When the temperature sensor detects that the temperature inside the processing cavity exceeds the preset threshold, the control module will reduce the power of the hot air blower 24 or control the drive motor to adjust the position and angle of the nozzle 33 to reduce the local heat flux density and bring the temperature back to a safe range. If the humidity sensor reports that the humidity inside the channel 6 is too high, the control module will increase the suction power of the ventilation pump 8, extend the adsorption time of the dehumidifying molecular sieve 10, or enhance the cooling intensity of the semiconductor condenser 3. At the same time, it will increase the nitrogen filling amount through the reversing valve 9 to quickly reduce the humidity below the threshold.

[0084] During the clamping and stretching stages of the material, the control module plays a crucial role. When the fiber optic grating sensor detects that the material strain is close to the maximum threshold, the processing module transmits a signal to the control module. The control module immediately reduces the output force of the stretching electric cylinder 15 and adjusts the current intensity of the excitation coil 35. By changing the damping force of the magnetorheological fluid, it slows down the movement speed of the clamping rod 4, preventing the material from breaking due to excessive stretching. If the capacitance sensor detects an abnormal change in the dielectric constant of the material (which may indicate local overheating or changes in chemical properties), the control module will link the heating component to reduce the hot air temperature and fine-tune the clamping direction through the displacement component, making the material more uniformly stressed and reducing abnormal fluctuations in physicochemical properties.

[0085] Furthermore, throughout the entire processing, the monitoring module displays all data in real time on the interface of the display controller 7. The processing module performs trend analysis on the data to predict potential risks of exceeding thresholds. For example, if the humidity data shows a slow upward trend, the processing module will issue an early warning, and the control module will initiate the fine-tuning program of the dehumidification component in advance, suppressing the increase in humidity by increasing the amount of nitrogen injected. This proactive management based on prediction, rather than passively waiting for remedial measures after the data exceeds the threshold, achieves proactive management based on prediction rather than passively waiting for remedial measures after the data exceeds the threshold.

[0086] The closed-loop system enables the device to dynamically adjust processing parameters according to the real-time status of the material. This not only solves the problem of insufficient precision caused by relying on human experience in traditional processing, but also ensures the stability of flexible electronic devices in stretching, drying and other processes through the collaborative monitoring and intelligent control of multiple sensors. It significantly reduces material loss caused by environmental fluctuations or uneven stress, and ultimately improves the consistency and reliability of the finished product.

[0087] Specific experimental procedure: I. Experimental objective

[0088] 1. Verify whether the flexible clamping system can avoid material surface damage.

[0089] 2. Testing multi-directional tensile accuracy

[0090] 3. Analyze the uniformity of double-layer eddy current heating.

[0091] 4. Evaluate the dehumidification effect of dual modes

[0092] II. Experimental Materials and Equipment

[0093] TPU-based flexible circuit board (0.1mm thick), traditional roll forming biaxial stretching machine, this patented device, laser displacement sensor, infrared thermal imager, high-precision hygrometer, and electron microscope.

[0094] III. Experimental Procedure

[0095] Experiment 1: Damage Prevention Verification of Flexible Clamping System

[0096] 1. Sample preparation: Cut 10 pieces of 100×100mm TPU-based flexible circuit boards (thickness 0.1mm) and polish the surface to an initial roughness Ra=0.05μm.

[0097] 2. Control group test: A traditional roller pressing stretching machine was used, with the rubber roller pressure set to 0.8 MPa. After clamping the edge of the material, a tensile force of 50 N was applied and maintained for 10 seconds before being released. The clamping area was scanned with an electron microscope (500×), scratches were marked, and the number of defects per unit area was calculated.

[0098] 3. Experimental group test: After the device is started, the air pump inflates the driving airbag (0.15MPa), and the suction cup generates a negative pressure of -80kPa to adsorb the material. A tensile force of 50N is maintained for 10 seconds, and the pressure fluctuation of the airbag is recorded simultaneously. The morphology of the adsorption area is observed under a microscope, and the distribution of scratches is compared.

[0099] Experiment 2: Verification of Multi-directional Tensile Accuracy

[0100] 1. Calibration settings: Print 5×5mm grid marks on the surface of the TPU substrate, and align the laser displacement sensor (accuracy 0.1μm) with the marks.

[0101] 2. Tensioning Program: Control the displacement motor to rotate and execute four tensioning paths: 0° (X-axis), 45°, 90° (Y-axis), and 135°. Each path is repeated 10 times, with a target displacement of 10mm and a tensioning speed of 2mm / s. The excitation current of the magnetorheological fluid damper is adjusted in real time to 0.5–1.2A (corresponding to a tensioning force of 50N).

[0102] 3. Data acquisition: The laser sensor records the deviation between the actual displacement and the target displacement, and the tension sensor synchronously monitors the fluctuation of the tensile force.

[0103] Experiment 3: Verification of the Uniformity of Double-Layer Eddy Current Heating

[0104] 1. Temperature field construction: The hot air blower is set to 80℃, and the nozzle tilt angle is adjusted to 15°. The motor drives the nozzle to form a symmetrical vortex. Traditional equipment uses a single layer of hot air direct blowing (wind speed 5m / s).

[0105] 2. Thermal imaging monitoring: An infrared thermal imager (FLIR A65, accuracy ±0.5℃) collects the temperature of the upper and lower surfaces of the TPU substrate every minute after heating is started. Five temperature measurement points are selected at the center and four corners of the substrate, and the data is recorded continuously for 10 minutes.

[0106] 3. Curing evaluation: After heating, the uniformity of surface resistance of the substrate is measured using a conductivity tester (9-point test method).

[0107] Experiment 4: Verification of Dehumidification System Efficiency

[0108] 1. High humidity environment simulation: Set the initial conditions of 70%RH and 25℃ in the environmental chamber.

[0109] 2. Dual-mode operation: Stage 1 (0-5min): The ventilation pump draws air at a flow rate of 20L / min, and dehumidification is achieved through molecular sieve adsorption and semiconductor condenser (cooling temperature 5℃). Stage 2 (5-10min): The reversing valve switches to the nitrogen storage tank, injecting 99.99% nitrogen to maintain positive pressure (+50Pa) in the passage.

[0110] 3. Humidity monitoring: A high-precision humidity sensor (±1%RH) records the humidity change in the channel every 30 seconds, compared with a blank test without dehumidification components.

[0111] IV. Experimental Data

[0112] As shown in the table below:

[0113] Table 1. Comparison of clamping damage

[0114]

[0115] Table 2. Multi-directional tensile accuracy data

[0116]

[0117] Table 3. Heating Uniformity

[0118]

[0119] Table 4. Dehumidification efficiency

[0120]

[0121] V. Experimental Conclusions

[0122] The flexible clamping structure (airbag + suction cup) reduces surface scratch density to 2.24% of that of traditional equipment, resulting in an 85.5% reduction in roughness. Displacement errors in all four stretching paths are ≤0.05mm, and tensile force fluctuations are ≤±0.51N. Dual-layer vortex hot air reduces the maximum temperature difference between the upper and lower surfaces to 1.2℃ (compared to 7.2℃ in traditional equipment), improving substrate resistance uniformity by 92% and significantly exceeding expectations for curing consistency. The dual-mode dehumidification system reduces humidity from 70%RH to 25.1%RH within 5 minutes, with humidity fluctuations ≤0.5%RH during the nitrogen positive pressure maintenance phase, achieving industry-leading humidity control stability.

[0123] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0124] The above descriptions are merely embodiments of the present invention. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are aware of all existing technologies in that field, and have the ability to apply conventional experimental methods prior to that date. Those skilled in the art can, under the guidance of this application, improve and implement this solution in combination with their own capabilities. Some typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of the present invention. These should also be considered within the scope of protection of the present invention, and will not affect the effectiveness of the implementation of the present invention or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A processing apparatus for biaxially stretched flexible electronic devices, comprising a base (1), wherein a vertical through groove (6) is formed in the center of the base (1), characterized in that: A displacement component is fixedly connected to the base (1), a clamping component is fixedly connected to the outer periphery of the displacement component, a heating component is fixedly connected to the displacement component, a dehumidification component is provided in the through groove (6), a display controller (7) is fixedly connected to the side wall of the base (1), and the displacement component, clamping component, heating component and dehumidification component are all connected to the display controller (7) via signal. The displacement component is used to rotate and adjust the clamping and stretching direction of the clamping component; Clamping assembly for fixing processed materials by deformation adsorption clamping and magnetorheological fluid damping tension locking; Heating components are used to generate double-layer vortex hot air to simultaneously and uniformly dry the processed materials. Dehumidification components are used for dehumidification using negative pressure molecular sieves and semiconductor condensation, and for moisture prevention using positive pressure nitrogen filling and semiconductor condensation. The displacement assembly includes a processing cavity inside the base (1), which is connected to the through groove (6). The top and bottom walls of the processing cavity are respectively fixedly connected to a first annular bracket (19) and a second annular bracket (23). The first annular bracket (19) and the second annular bracket (23) are both sleeved with the through groove (6). The first annular bracket (19) and the second annular bracket (23) are symmetrically opened with annular grooves. The first displacement ring (20) is slidably fitted in the annular groove of the first annular bracket (19), and the second displacement ring (22) is slidably fitted in the annular groove of the second annular bracket (23). The outer walls of the first displacement ring (20) and the second displacement ring (22) are both opened with displacement tooth grooves. The outer walls of the first annular bracket (19) and the second annular bracket (23) are both fixedly connected to displacement motors. The output shafts of the displacement motors are both coaxially fixedly connected to displacement gears (38). The displacement gears (38) mesh with the corresponding displacement tooth grooves respectively. The displacement motors are all connected to the display controller (7) via signals. The clamping assembly includes four clamping members arranged in a quadrilateral shape. Each clamping member includes a symmetrically arranged "U-shaped" clamping bracket (16). One end of the forked clamping bracket (16) is fixedly connected to the outer wall of the first displacement ring (20), and the other end of the forked clamping bracket (16) is fixedly connected to the outer wall of the second displacement ring (22). The end of the clamping bracket (16) away from the through groove (6) is fixedly connected to a tension control cylinder (15). A clamping rod (4) is fixedly connected between the output shafts of the tension control cylinders (15) on the same side of the clamping bracket (16). The tension control cylinders (15) are all signal connected to the display controller (7).

2. The processing apparatus for biaxially stretched flexible electronic devices according to claim 1, characterized in that: The clamping rod (4) is rotatably sleeved with support gears (28) at both ends near the tension control cylinder (15). The clamping bracket (16) is opened with support tooth grooves corresponding to the support gears (28) on the inner bottom wall near the clamping rod (4). The support gears (28) are all opened with annular damping cavities and coil grooves. Several layers of outer damping rings (37) are fixedly connected to the inner wall of the damping cavity. Several layers of inner damping rings (36) are fixedly connected to the outer periphery of the clamping rod (4) located in the damping cavity. The inner damping rings (36) and the corresponding outer damping rings (37) are interleaved. The damping cavity is filled with magnetorheological fluid. The coil groove is wound with excitation coils (35). The excitation coils (35) are all connected to the display controller (7) for signal connection.

3. The processing apparatus for biaxially stretched flexible electronic devices according to claim 2, characterized in that: A clamping groove (32) is axially opened in the middle of the clamping rod (4). Several clamping feet (5) are symmetrically hinged on the clamping rod (4) and distributed on both sides of the clamping groove (32). The clamping feet (5) on the same clamping rod (4) are all parallel to the through groove (6). Each clamping foot (5) is composed of several clamping arms (30). The clamping arms (30) are hinged to each other. Several driving airbags (29) are fixedly connected inside each clamping foot (5). The driving airbags (29) are used to bend and drive the corresponding clamping feet (5) to symmetrically clamp the processed material after inflation. A suction cup (31) is fixedly connected on the side of the clamping arm (30) close to the processed material. The bottom wall of the suction cup (31) is opened with a main cavity and several peripheral cavities. The peripheral cavities on the same suction cup (31) are distributed in a ring around the outer periphery of the main cavity. An air passage is connected between the main cavity and the peripheral cavity. An inflation tube (13) is fixedly sleeved inside the clamping rod (4). The inflation tube (13) and the corresponding driving airbag (29) are connected through solenoid valves respectively. The two ends of the inflation tube (13) pass through the two ends of the clamping rod (4) and are connected to air pumps (12). The air pumps (12) are fixedly connected to the inner wall of the processing cavity. The solenoid valves and air pumps (12) are connected to the display controller (7) for signal connection.

4. The apparatus according to claim 1, wherein: The heating component includes a hot air blower (24), which is fixedly connected to the base (1). The output end of the hot air blower (24) is connected to a "Y"-shaped hot air pipe (21), and the input end of the hot air blower (24) is covered with a filter molecular sieve (25). The filter molecular sieve (25) is used to remove the moisture absorbed by the hot air blower (24). The hot air blower (24) is connected to the display controller (7) via signal.

5. The apparatus according to claim 4, wherein: The heating assembly also includes symmetrically arranged hot air ring pipes (14). The hot air ring pipes (14) and the clamping bracket (16) are fixedly connected at the ends away from the through groove (6). The two ends of the hot air pipe (21) are respectively connected to the two sides of the hot air ring pipe (14) symmetrically. The hot air ring pipes (14) are all slidably sleeved with nozzles (33). The outer walls of the hot air ring pipes (14) and the nozzles (33) are opened with hot air grooves. The hot air grooves are connected to the nozzles (33). The nozzles (33) on the same hot air ring pipe (14) are all tilted at the same radial angle. The nozzles (33) between different hot air ring pipes (14) correspond to each other. The side walls of the nozzles (33) are all hinged with push rods (18). The corresponding push rods (18) are coaxial and opposite. The push rods (18) are all opened with push threads. The push threads on the corresponding push rods (18) are opposite. The corresponding push rods (18) are threadedly sleeved with push sleeves (34). The outer periphery of the push sleeves (34) is opened with push tooth grooves. The heating assembly also includes a push gear ring (26), which slides into the end of the clamping bracket (16). The inner side of the push gear ring (26) has a drive tooth groove, which meshes with the push tooth groove. The end of the clamping bracket (16) is fixedly connected to a push motor. The output shaft of the push motor is coaxially fixedly connected to a push gear (27). The outer side of the push gear ring (26) has a driven tooth groove, which meshes with the push gear (27). The push motor is signal-connected to the display controller (7).

6. The processing apparatus for biaxially stretched flexible electronic devices according to claim 1, characterized in that: The dehumidification assembly includes a ventilation pump (8), which is fixedly connected to the inner wall of the channel (6). The output end of the ventilation pump (8) is covered with a dehumidifying molecular sieve (10). The input end of the ventilation pump (8) is connected to a nitrogen storage tank (11) through a reversing valve (9). The reversing valve (9) is also connected to the outside. Both the ventilation pump (8) and the reversing valve (9) are connected to the display controller (7) via signals.

7. The apparatus according to claim 6, wherein: The top wall of the base (1) is fixedly connected with several semiconductor condenser plates (3) arranged in a ring around the outer periphery of the through groove (6). The top wall of the base (1) between the semiconductor condenser plates (3) has a dehumidification groove (2) for draining condensate.

8. The apparatus according to claim 1, wherein: The display controller (7) is equipped with a monitoring module, a processing module and a control module; The monitoring module is used to collect data on strain and physicochemical property changes of the processed material. It includes a temperature sensor, a humidity sensor, a capacitance sensor and a fiber optic grating sensor. The temperature sensor is fixedly connected to the top wall of the processing cavity, the humidity sensor is fixedly connected to the through groove (6), and the capacitance sensor and the fiber optic grating sensor are both fixedly connected to the end of the clamping foot (5). The processing module is used to determine whether the monitored strain and physicochemical property changes exceed preset thresholds based on the preset processing material type. The control module is used to control the corresponding components of the above-mentioned device to keep the monitored data within the threshold range based on the judgment result of the processing module.

Images