Automatic laminating equipment for circuit board

Abstract

The application discloses a circuit board automatic laminating equipment and relates to the technical field of circuit board printing and laminating, which solves the problem that the protective film on the circuit board in the conveying and transferring state is easily deviated or even dropped due to vibration and other reasons, and the protective effect of the protective film on the circuit of the circuit board is affected. The circuit board automatic laminating equipment comprises an equipment base, a control panel installed at the top edge of the equipment base, a pre-storage support installed at one side of the top of the equipment base and located at the back of the control panel, an alignment pre-storage structure installed at the top of the equipment base and located at the side of the pre-storage support, and an automatic laminating flat pressing structure installed at the top of the equipment base and located at the side of the pre-storage support and the alignment pre-storage structure. In the application, the adhesion of the protective film, the installation and positioning of the circuit board, the transfer of the circuit board after the completion of the lamination, the conveying and movement of the circuit board after the completion of the lamination, and the pressing and dust removal of the circuit board after the completion of the lamination can be automatically realized, and the efficiency of the lamination of the circuit board is improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board printing and lamination technology, specifically to automatic circuit board lamination equipment. Background Technology

[0002] Circuit boards are highly reliable and highly flexible printed circuit boards made of polyimide or polyester film as the substrate. They are characterized by high wiring density, light weight, thinness, and good bending properties.

[0003] Circuit board coating (protective film) is mainly used to protect circuit boards from environmental, physical, and chemical damage, while improving their insulation and durability. In actual coating, the cut protective film is generally pasted onto the circuit board to protect it.

[0004] However, this coating equipment has the following drawbacks in practical use:

[0005] 1. Existing laminating equipment requires a protective film, cut to the correct size for the circuit board, to be applied to the circuit board during the laminating process. This is typically done using a vacuum suction cup to adhere the film, followed by heat fusion to ensure a tight bond. However, in practice, the protective film is often adhered to the circuit board surface via an adhesive. During transport and transfer to the heat fusion equipment, the film is prone to shifting or even falling off due to vibration, affecting its protective effect on the circuitry.

[0006] 2. Existing lamination equipment, after laminating the circuit board, requires transferring the laminated circuit board to subsequent equipment (such as hot-melt equipment) for further processing. This is typically done via a conveyor unloading device. However, during this transport, dust can easily adhere to the circuit board and the protective film on both the board and the protective film. This can affect the adhesion of both materials after hot-melt processing and may also cause corrosion or signal interference on the circuit board, impacting its stability. Summary of the Invention

[0007] The purpose of this invention is to provide an automatic circuit board coating equipment to solve the problems mentioned in the background art.

[0008] To achieve the above-mentioned objectives, the present invention adopts the following technical solution:

[0009] This invention provides an automatic circuit board lamination device, comprising: a device base; a control panel mounted on the top edge of the device base; a pre-storage bracket mounted on one side of the top of the device base and located on the back side of the control panel; an alignment pre-storage structure mounted on the top of the device base and located on the side of the pre-storage bracket; and an automatic lamination flat pressing structure mounted on the top of the device base on the sides of the pre-storage bracket and the alignment pre-storage structure.

[0010] The automatic film coating and flat pressing structure includes: a film coating conveying and adsorption assembly installed on the top of the equipment base and located on the back of the alignment pre-storage structure; a conveying and unloading assembly disposed on the side of the film coating conveying and adsorption assembly and installed on the other side of the top of the equipment base; a film coating pressing assembly installed on the outer side of the tail of the conveying and unloading assembly and installed on the top of the equipment base; a rolling rod installed inside the film coating pressing assembly; a reciprocating screw installed at the bottom of the rolling rod and rotatably connected inside the film coating pressing assembly; and a surface cleaning assembly connected to the outside of the reciprocating screw and movably connected to the outside of the rolling rod via ball bearings.

[0011] As a preferred embodiment of the present invention, the alignment pre-storage structure includes: an upper support installed on the top of the equipment base; a linear lifting module installed on the top of the upper support; a concave bracket installed at the center of the top of the linear lifting module; horizontal cylinders installed at the centers of the left and right sides of the top of the upper support; and a horizontal push plate connected to the output end of the horizontal cylinder and slidably connected to the top of the linear lifting module.

[0012] In a preferred embodiment of the present invention, a central protrusion is installed at the center of the side of the horizontal push plate, the central protrusion being slidably connected to the top of the linear lifting module, and the side of the central protrusion abutting against a circuit board.

[0013] The linear lifting module drives the circuit board placed on top to move up and down.

[0014] As a preferred embodiment of the present invention, the film-coated conveying and adsorption assembly includes: a side support mounted on the top of the equipment base; a horizontal slide rail system mounted on the side of the side support; a horizontal slide block mounted on the side of the horizontal slide rail system; a slide block mounted on the side of the horizontal slide block by screws and slidably connected to the side support; a vertical slide rail system mounted on the side of the slide block; a vertical slide block mounted on the side of the vertical slide rail system; and a bending frame mounted on the side of the vertical slide block by screws.

[0015] The horizontal slide rail system is provided in two parts, and each horizontal slide rail system has a horizontal slide block installed on its side.

[0016] In a preferred embodiment of the present invention, a lower metal plate is fixedly mounted to the bottom of the bending frame by screws. A guide rod is slidably connected at the included angle of the lower metal plate. A lower connecting plate located below the lower metal plate is mounted at the bottom of the guide rod. Multiple vacuum suction cups are mounted at the bottom edge of the lower connecting plate.

[0017] The guide rod has a buffer spring connected to the top of the lower metal plate on its outer side, and the bottom of the vacuum suction cup has a circuit board and a protective film attached to it.

[0018] As a preferred embodiment of the present invention, the conveying and unloading assembly includes: an assembly support mounted on the other side of the top of the equipment base; side assembly frames mounted on both sides of the top of the assembly support; a linear drive source mounted on one side of the side assembly frame; a transmission belt connected to the output end of the linear drive source via a synchronous pulley and movably disposed on the side of the side assembly frame; a drive shaft connected to the inner side of the transmission belt via a synchronous pulley and movably extending into the interior of the side assembly frame; a conveying gear mounted on the outer side of the drive shaft and movably disposed inside the side assembly frame; and a conveying belt meshing with the outer side of the conveying gear and movably disposed inside the side assembly frame.

[0019] The side mounting frame and the conveyor belt are provided in twos, and the conveyor gears are provided in fours.

[0020] In a preferred embodiment of the present invention, a horizontal unloading plate movably disposed on the top of the conveyor belt is mounted on the top of the side assembly frame. A longitudinal slide rail system is mounted on both sides of the top of the horizontal unloading plate. A longitudinal slide block is mounted on the top of the longitudinal slide rail system. An L-shaped slider movably disposed on the top of the horizontal unloading plate is mounted on the top of the longitudinal slide block by screws.

[0021] The L-shaped slider is equipped with a compression cylinder on its side, and the output end of the compression cylinder is connected to an L-shaped compression block. The circuit board is pressed and fixed on the side of the L-shaped compression block.

[0022] As a preferred embodiment of the present invention, the film-coating pressing assembly includes: an I-beam base mounted on the top of the equipment base; a T-shaped plate mounted on the top of the I-beam base by screws; a pressing slide rail system mounted on the side of the T-shaped plate; a pressing slide block mounted on the side of the pressing slide rail system; a guide seat mounted between the two pressing slide blocks; a rotary drive source mounted on one side of the top of the guide seat; a first gear connected to the output end of the rotary drive source; a second gear meshing with the bottom of the first gear and movably disposed inside the guide seat; a third gear meshing with the bottom of the second gear and movably disposed inside the guide seat; and an electrostatic dust-collecting roller connected to the third gear and movably disposed at the bottom of the guide seat.

[0023] The second gear has a rolling rod rotatably connected inside the guide seat on its side, and the rolling rod is positioned above the electrostatic dust collection roller.

[0024] In a preferred embodiment of the present invention, the surface cleaning assembly includes: a lead screw slide connected to the outside of the reciprocating lead screw via ball bearings; and a cleaning roller mounted on the side of the lead screw slide, the cleaning roller being movably connected to the outside of a rolling rod.

[0025] The roller has multiple cams mounted on its outer side, and these cams are movably positioned inside the cleaning roller, with sufficient space inside the cleaning roller for the cams to move.

[0026] Compared with existing technologies, one or more of the above technical solutions have the following beneficial effects:

[0027] 1. In automatic circuit board lamination equipment, after lamination of the circuit board, the system automatically presses down and continuously rotates the protective film adhering to the circuit board, ensuring a tight fit. This reduces the probability of misalignment, displacement, or even falling off the protective film when moving the circuit board to subsequent processing equipment (such as hot melt equipment). Simultaneously, during the pressing and positioning of the protective film on the circuit board, an electrostatic magnetic field is generated on the pressing electrostatic suction roller, causing dust on the circuit board to become charged. This achieves automatic dust adsorption and cleaning, reducing the impact of dust on the circuit board and protective film on the quality of subsequent circuit board processing.

[0028] It should be noted that this invention can automatically perform the following operations: protective film adhesion, circuit board installation and positioning, post-coating circuit board transfer, post-coating circuit board conveying and movement, and post-coating circuit board pressing and dust removal, thus improving the efficiency of circuit board coating.

[0029] 2. In the automatic circuit board laminating equipment, when adsorbing dust on the circuit board and pressing down and positioning the protective film on the circuit board, multiple annular electrostatic protrusions are set on the outer surface of the electrostatic dust suction roller. On the one hand, the uneven surface of the electrostatic dust suction roller reduces air bubbles and streaks in the protective film adhering to the circuit board, ensuring the flatness of the circuit board after lamination. On the other hand, dust can move towards the arc-shaped concave part, reducing the probability of dust sticking together when adsorbing dust on the circuit board, and reducing the probability of damaging the protective film when the electrostatic dust suction roller rotates to adhere to the protective film on the circuit board.

[0030] 3. In the automatic circuit board coating equipment, when the electrostatic dust-collecting roller is rotated by the gear meshing transmission structure to press and adhere the protective film on the circuit board, the gear meshing transmission structure can also drive the cleaning roller to move horizontally back and forth through the lead screw transmission. This cleans the dust on the pressed and dust-collecting electrostatic dust-collecting roller, ensuring that the surface of the electrostatic dust-collecting roller is clean and reducing the probability of secondary contamination of the protective film on the circuit board. At the same time, the rolling rod that drives the lead screw transmission structure can also clean the dust adhering to the cleaning roller by rotating its outer cam, thus protecting the cleaning roller's cleaning ability against the electrostatic dust-collecting roller.

[0031] 4. In the automatic circuit board coating equipment, when conveying and unloading the coated circuit boards, multiple L-shaped extrusion blocks that move horizontally and vertically can position the coated circuit boards and protective film, reducing the probability of misalignment and displacement of the circuit boards during longitudinal conveying and unloading. Simultaneously, by installing a positioning sensor module (equipped with pressure detection, infrared ranging, and angle detection functions) at the center of the bottom of the placed circuit boards, the conveyed and unloaded circuit boards can be accurately positioned, thereby achieving automated circuit board coating operations. Attached Figure Description

[0032] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0033] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linking," and "socketing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0034] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0035] Figure 2 This is a side view of the overall structure of the present invention;

[0036] Figure 3 This is a top view of the overall structure of the invention;

[0037] Figure 4 This is a schematic diagram of the overall front view of the present invention;

[0038] Figure 5This is a schematic diagram of the pre-stored alignment structure of the present invention;

[0039] Figure 6 This is a schematic diagram of the structure of the film-coated delivery and adsorption assembly of the present invention;

[0040] Figure 7 This is a schematic diagram of the connection between the sliding base and the vacuum suction cup of the present invention;

[0041] Figure 8 This is a schematic diagram of the structure of the conveying and unloading assembly of the present invention;

[0042] Figure 9 This is a schematic diagram of the connection between the horizontal unloading plate and the L-shaped extrusion block of the present invention;

[0043] Figure 10 This is a schematic diagram of the structure of the film-coated pressing assembly of the present invention;

[0044] Figure 11 This is the present invention. Figure 10 Enlarged structural diagram of region A in the middle;

[0045] Figure 12 This is a front view of the structure of the connection between the film pressing component and the surface cleaning component of the present invention;

[0046] Figure 13 This is a front cross-sectional view of the connection between the film-coating pressing component and the surface cleaning component of the present invention;

[0047] Figure 14 This is a schematic cross-sectional view of the connection between the second gear and the surface cleaning assembly of the present invention;

[0048] In the picture:

[0049] 10. Equipment base; 20. Control panel; 30. Pre-storage bracket;

[0050] 40. Alignment pre-storage structure; 401. Upper support; 402. Linear lifting module; 403. Concave bracket; 404. Horizontal cylinder; 405. Horizontal push plate; 406. Intermediate protrusion;

[0051] 50. Automatic film coating and flat pressing structure; 501. Film coating conveying and adsorption assembly; 502. Conveying and unloading assembly; 503. Film coating and pressing assembly; 504. Rolling rod; 505. Reciprocating screw; 506. Surface cleaning assembly;

[0052] 5011, Side support; 5012, Horizontal slide rail system; 5013, Horizontal slide block; 5014, Sliding block; 5015, Vertical slide rail system; 5016, Vertical slide block; 5017, Bending frame; 50171, Lower metal plate; 50172, Guide rod; 50173, Lower connecting plate; 50174, Vacuum suction cup; 50175, Buffer spring;

[0053] 5021. Assembly support; 5022. Side assembly frame; 5023. Linear drive source; 5024. Transmission belt; 5025. Drive shaft; 5026. Conveyor gear; 5027. Conveyor belt; 50271. Horizontal unloading plate; 50272. Longitudinal slide rail system; 50273. Longitudinal slide block; 50274. L-shaped slider; 50275. Extrusion cylinder; 50276. L-shaped extrusion block; 50277. Positioning sensor module;

[0054] 5031, T-shaped plate; 5032, T-shaped plate; 5033, downward sliding rail system; 5034, downward sliding block; 5035, guide seat; 5036, rotary drive source; 5037, first gear; 5038, second gear; 5039, third gear; 50310, electrostatic dust collection roller;

[0055] 5061, lead screw slide; 5062, cleaning roller; 5063, cam;

[0056] 60. Electromagnetic module; 601. Conductive module; 602. Static bump. Detailed Implementation

[0057] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application. Example 1

[0058] Please see Figures 1-14The automatic circuit board laminating equipment includes a base 10; a control panel 20 installed at the top edge of the base 10; a pre-storage bracket 30 installed on one side of the top of the base 10 and located on the back side of the control panel 20; an alignment pre-storage structure 40 installed on the top of the base 10 and located on the side of the pre-storage bracket 30; and an automatic laminating flat pressing structure 50 installed on the top of the base 10 and located on the sides of the pre-storage bracket 30 and the alignment pre-storage structure 40. The automatic laminating flat pressing structure 50 includes a laminating conveyor installed on the top of the base 10 and located on the back of the alignment pre-storage structure 40. The equipment includes: a conveying and adsorption assembly 501; a conveying and unloading assembly 502 disposed on the side of the film conveying and adsorption assembly 501 and mounted on the other side of the top of the equipment base 10; a film pressing assembly 503 mounted on the outer side of the tail of the conveying and unloading assembly 502 and mounted on the top of the equipment base 10; a rolling rod 504 mounted inside the film pressing assembly 503; a reciprocating screw 505 mounted at the bottom of the rolling rod 504 and rotatably connected inside the film pressing assembly 503; and a surface cleaning assembly 506 connected to the outside of the reciprocating screw 505 and movably connected to the outside of the rolling rod 504 via ball bearings.

[0059] The working principle is as follows: When applying a protective film to a circuit board, the circuit board to be coated is positioned on top of the alignment pre-storage structure 40. The protective film for coating is placed on the pre-storage bracket 30 and is automatically placed on top of the circuit board by adsorption and fixation through the coating conveying adsorption component 501, thus realizing the coating operation (it should be noted that when placing the protective film on the circuit board, adhesive can be injected onto the circuit board using an adhesive injection device). After the coating operation is completed, the circuit board can be moved to the top of the conveying and unloading component 502 by adsorption and fixation through the coating conveying adsorption component 501, and the circuit board is conveyed and unloaded through the conveying and unloading component 502. At this time, when the conveying and unloading component 502 conveys and unloads the circuit board, the design of the coating pressing component 503 can press down and position the protective film adhering to the circuit board, ensuring that the protective film will not shift, shake, or even fall off during the conveying and movement of the circuit board, thus ensuring the effect and quality of subsequent processing of the coated circuit board. Meanwhile, the operation of the film pressing assembly 503 can drive the rolling rod 504 and the reciprocating screw 505 to rotate, and cause the surface cleaning assembly 506 connected to the outside of the reciprocating screw 505 to operate, cleaning the dust adsorbed on the film pressing assembly 503, ensuring that the film pressing assembly 503 is always in a clean state when pressing down the protective film and adsorbing dust on the circuit board, and is less likely to cause secondary pollution of the circuit board (due to dust).

[0060] For details, please refer to the following: Figure 5The alignment pre-storage structure 40 includes: an upper support 401 installed on the top of the equipment base 10; a linear lifting module 402 installed on the top of the upper support 401; a concave bracket 403 installed at the center of the top of the linear lifting module 402; a horizontal cylinder 404 installed at the center of the left and right sides of the top of the upper support 401; and a horizontal push plate 405 connected to the output end of the horizontal cylinder 404 and slidably connected to the top of the linear lifting module 402.

[0061] In this invention, a central protrusion 406 is installed at the center of the side of the horizontal push plate 405. The central protrusion 406 is slidably connected to the top of the linear lifting module 402, and the side of the central protrusion 406 abuts against the circuit board. The linear lifting module 402 drives the circuit board placed on top to move up and down.

[0062] In the automatic circuit board coating equipment of the present invention, when the circuit board is coated with a protective film, the circuit board is placed inside the concave bracket 403. By activating the horizontal cylinder 404, the horizontal push plate 405 and the intermediate protrusion 406 connected to the output end of the horizontal cylinder 404 are driven to move horizontally, and the circuit board on the side of the intermediate protrusion 406 is squeezed and positioned inside the concave bracket 403, thereby improving the stability when the protective film is coated.

[0063] It should be noted that the linear lifting module 402 can operate, driving the circuit board to move up and down, facilitating the adsorption and transfer of the circuit board by the film-coating conveying adsorption component 501.

[0064] For details, please refer to the following: Figure 6 and Figure 7 The film-coated conveying adsorption assembly 501 includes: a side support 5011 mounted on the top of the equipment base 10; a horizontal slide rail system 5012 mounted on the side of the side support 5011; a horizontal slide block 5013 mounted on the side of the horizontal slide rail system 5012; a slide block 5014 mounted on the side of the horizontal slide block 5013 by screws and slidably connected to the side support 5011; a vertical slide rail system 5015 mounted on the side of the slide block 5014; a vertical slide block 5016 mounted on the side of the vertical slide rail system 5015; and a bending frame 5017 mounted on the side of the vertical slide block 5016 by screws. There are two horizontal slide rail systems 5012, and each horizontal slide rail system 5012 has a horizontal slide block 5013 mounted on its side.

[0065] In the automatic circuit board coating equipment of the present invention, when the protective film is adhered and the circuit board is transported, the bending frame 5017 and its bottom parts device for adsorbing and fixing the protective film and the circuit board can be moved horizontally by activating the horizontal slide rail system 5012, thereby realizing the adjustment and transport operation of the protective film and the circuit board position. The bending frame 5017 and its bottom parts device for adsorbing and fixing the protective film and the circuit board can be moved up and down by activating the vertical slide rail system 5015.

[0066] For details, please refer to the following: Figure 6 and Figure 7 The bottom of the bending frame 5017 is fixed with a lower metal plate 50171 by screws. A guide rod 50172 is slidably connected at the inner corner of the lower metal plate 50171. A lower connecting plate 50173 located below the lower metal plate 50171 is installed at the bottom of the guide rod 50172. Multiple vacuum suction cups 50174 are installed at the bottom edge of the lower connecting plate 50173. A buffer spring 50175 connected to the top of the lower metal plate 50171 is provided on the outside of the guide rod 50172. A circuit board and a protective film are adsorbed and fixed at the bottom of the vacuum suction cup 50174.

[0067] In the automatic circuit board coating equipment of the present invention, when the protective film is adhered and the circuit board is transported, the design of multiple vacuum suction cups 50174 can vacuum adsorb multiple positions of the protective film and the circuit board, ensuring the stability of the protective film and the circuit board during subsequent conveying and transport. The design of the buffer springs 50175 can also buffer the protective film and the circuit board during adhesion and transport, reducing the probability of collisions during the adhesion of the protective film and the transport and installation of the circuit board, thus ensuring high safety.

[0068] For details, please refer to the following: Figure 8 and Figure 9 The conveying and unloading assembly 502 includes: an assembly support 5021 installed on the other side of the top of the equipment base 10; side assembly frames 5022 installed on both sides of the top of the assembly support 5021; a linear drive source 5023 installed on one side of the side assembly frame 5022; a transmission belt 5024 connected to the output end of the linear drive source 5023 via a synchronous pulley and movably disposed on the side of the side assembly frame 5022; a drive shaft 5025 connected to the inside of the transmission belt 5024 via a synchronous pulley and movably extending into the interior of the side assembly frame 5022; a conveying gear 5026 installed on the outside of the drive shaft 5025 and movably disposed inside the side assembly frame 5022; and a conveying belt 5027 meshing with the outside of the conveying gear 5026 and movably disposed inside the side assembly frame 5022. There are two side assembly frames 5022 and two conveying belts 5027, and four conveying gears 5026.

[0069] In the automatic circuit board coating equipment of the present invention, when the circuit board is conveyed and unloaded, the linear drive source 5023 is activated, driving the transmission belt 5024 connected to the outer side of the output end of the linear drive source 5023 via a synchronous pulley, and causing the drive shaft 5025 connected to the inner side of the transmission belt 5024 via the synchronous pulley to rotate. When the drive shaft 5025 rotates, the conveying gear 5026 mounted on its outer side rotates, driving the conveying belt 5027 meshing with the outer side of the conveying gear 5026 to rotate, driving the horizontal unloading plate 50271 connected to the top of the conveying belt 5027 to move horizontally.

[0070] For details, please refer to the following: Figure 8 and Figure 9 A horizontal unloading plate 50271 is movably mounted on the top of the conveyor belt 5027 and is mounted on the top of the side assembly frame 5022. A longitudinal slide rail system 50272 is mounted on both sides of the top of the horizontal unloading plate 50271. A longitudinal slide block 50273 is mounted on the top of the longitudinal slide rail system 50272. An L-shaped slider 50274 is movably mounted on the top of the horizontal unloading plate 50271 by screws on the top of the longitudinal slide block 50273. A compression cylinder 50275 is mounted on the side of the L-shaped slider 50274. An L-shaped compression block 50276 is connected to the output end of the compression cylinder 50275. A circuit board is compression-fixed on the side of the L-shaped compression block 50276.

[0071] It should be noted that a positioning sensor module 50277 is set in the middle of the horizontal unloading plate 50271. The positioning sensor module 50277 has the functions of pressure detection, infrared ranging and angle detection.

[0072] In the automatic circuit board coating equipment of the present invention, when the circuit board is placed on top of the horizontal unloading plate 50271, the position and angle of the circuit board can be determined by the design of the positioning sensor module 50277. Then, based on the determined position and angle, the longitudinal slide rail system 50272 is activated, driving the L-shaped extrusion block 50276 to move longitudinally. The extrusion cylinder 50275 is then activated, driving the L-shaped extrusion block 50276 to move horizontally, precisely positioning and extruding the circuit board and its protective film.

[0073] For details, please refer to the following: Figure 10 , Figure 11 , Figure 12 and Figure 13The film-coating pressing assembly 503 includes: an I-beam base 5031 mounted on the top of the equipment base 10; a T-shaped plate 5032 mounted on the top of the I-beam base 5031 by screws; a pressing slide rail system 5033 mounted on the side of the T-shaped plate 5032; a pressing slide block 5034 mounted on the side of the pressing slide rail system 5033; a guide seat 5035 mounted between the two pressing slide blocks 5034; a rotary drive source 5036 mounted on the top side of the guide seat 5035; and a first gear 5037 connected to the output end of the rotary drive source 5036. A second gear 5038 is meshed with the bottom of the first gear 5037 and movably disposed inside the guide seat 5035; a third gear 5039 is meshed with the bottom of the second gear 5038 and movably disposed inside the guide seat 5035; an electrostatic dust collection roller 50310 is connected to the third gear 5039 and movably disposed inside the bottom of the guide seat 5035, wherein a rolling rod 504 is rotatably connected to the side of the second gear 5038 and is disposed above the electrostatic dust collection roller 50310.

[0074] In the automatic circuit board coating equipment of the present invention, when the protective film adhered to the circuit board is pressed down, the pressing slide system 5033 is activated to operate, driving the pressing slide block 5034 provided on the side of the pressing slide system 5033 to move up and down, and causing the guide seat 5035 and the electrostatic dust suction roller 50310 installed on the side of the pressing slide block 5034 to move up and down, adjusting the position of the electrostatic dust suction roller 50310 and attaching it to the top of the circuit board and the protective film.

[0075] The rotary drive source 5036 is activated, causing the first gear 5037 connected to its output end to rotate, which in turn causes the second gear 5038, which is meshed with the bottom of the first gear 5037, to rotate. When the second gear 5038 rotates, the third gear 5039, which is meshed with its bottom, will rotate, causing the electrostatic dust-collecting roller 50310 connected to the side of the third gear 5039 to rotate. This, in conjunction with the horizontal movement of the circuit board, enables the downward positioning operation of the protective film on the top of the circuit board.

[0076] It should be noted that when the second gear 5038 rotates, the rolling rod 504 connected to its side will rotate, and drive the reciprocating screw 505 connected to the side of the rolling rod 504 to rotate.

[0077] For details, please refer to the following: Figure 14The surface cleaning assembly 506 includes: a lead screw slide 5061 connected to the outside of a reciprocating lead screw 505 via ball bearings; a cleaning roller 5062 mounted on the side of the lead screw slide 5061, the cleaning roller 5062 being movably connected to the outside of a rolling rod 504, wherein a plurality of cams 5063 are mounted on the outside of the rolling rod 504, the cams 5063 being movably disposed inside the cleaning roller 5062, and the interior of the cleaning roller 5062 having sufficient space for the movement of the cams 5063.

[0078] In the automatic circuit board coating equipment of the present invention, when the reciprocating lead screw 505 rotates, the lead screw slide 5061 connected to its outer side by ball bearings will move horizontally (reciprocate), driving the cleaning roller 5062 mounted on the side of the lead screw slide 5061 to move horizontally and reciprocate outside the rolling rod 504, and cleaning the dust on the electrostatic dust suction roller 50310 set at the bottom.

[0079] It should be noted that the outer side of the cleaning roller 5062 is configured as a dust adhesion layer, the inside of the dust adhesion layer is configured with a rubber layer, and the inside of the rubber layer is configured with a rolling rod 504.

[0080] Furthermore, when the roller 504 rotates, it will drive the cam 5063 mounted on the outside of the roller 504 to rotate, continuously squeezing and rebounding the cleaning roller 5062 at different positions, which facilitates the cleaning of dust adhering to the cleaning roller 5062 during the bonding and installation of the circuit board (the first two steps). Example 2

[0081] For details, please refer to the following: Figure 13 The middle position of the electrostatic dust collection roller 50310 is set to be recessed inward, and the recessed part is fitted with an electromagnetic module 60. The electromagnetic module 60 is located on the outside of the shaft of the electrostatic dust collection roller 50310. The power transmission end of the electromagnetic module 60 is electrically connected to multiple conductive modules 601 extending into the interior of the electrostatic dust collection roller 50310. Multiple electrostatic protrusions 602 are provided on the outside of the electrostatic dust collection roller 50310. The conductive modules 601 adsorb dust on the circuit board through the electrostatic protrusions 602.

[0082] In the automatic circuit board coating equipment of the present invention, when cleaning dust adhering to the circuit board and protective film, the electromagnetic module 60 operates, generating an electrostatic magnetic field through the conductive module 601 and the electrostatic protrusions 602. This electrostatic magnetic field alters the ionization state of the dust in the air, causing the dust to become charged and then attracting it to the circuit board and protective film via electrostatic adsorption. The outer surface of the electrostatic dust-collecting roller 50310, formed by the electrostatic protrusions 602, is more uneven, improving the downward adhesion effect on the protective film while creating an arc-shaped electrostatic adsorption area. This avoids the problem of dust accumulating in clumps on a circular surface, making it less likely to damage the protective film during dust adsorption.

[0083] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

[0084] The terms “center,” “longitudinal,” “lateral,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present invention and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of the present invention.

[0085] Therefore, any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this invention, based on the technical solution and inventive concept of this invention, should be covered within the protection scope of this invention.

Claims

1. An automatic circuit board coating equipment, characterized in that, include: Equipment base (10); control panel (20) installed at the top edge of the equipment base (10); pre-storage bracket (30) installed on one side of the top of the equipment base (10) and on the back side of the control panel (20); alignment pre-storage structure (40) installed on the top of the equipment base (10) and on the side of the pre-storage bracket (30); automatic film-coating flat pressing structure (50) installed on the top of the equipment base (10) on the side of the pre-storage bracket (30) and the alignment pre-storage structure (40). The automatic film coating and flat pressing structure (50) includes: a film coating conveying and adsorption assembly (501) installed on the top of the equipment base (10) and located on the back of the alignment pre-storage structure (40); a conveying and unloading assembly (502) disposed on the side of the film coating conveying and adsorption assembly (501) and installed on the other side of the top of the equipment base (10); a film coating pressing assembly (503) installed on the outer side of the tail of the conveying and unloading assembly (502) and installed on the top of the equipment base (10); a rolling rod (504) installed inside the film coating pressing assembly (503); a reciprocating screw (505) installed at the bottom of the rolling rod (504) and rotatably connected inside the film coating pressing assembly (503); and a surface cleaning assembly (506) connected to the outside of the reciprocating screw (505) and movably connected to the outside of the rolling rod (504) via ball bearings. The conveying and unloading assembly (502) includes: an assembly support (5021) installed on the other side of the top of the equipment base (10); side assembly frames (5022) installed on both sides of the top of the assembly support (5021); a linear drive source (5023) installed on one side of the side assembly frame (5022); a transmission belt (5024) connected to the output end of the linear drive source (5023) via a synchronous pulley and movably disposed on the side of the side assembly frame (5022); a drive shaft (5025) connected to the inside of the transmission belt (5024) via a synchronous pulley and movably extending into the inside of the side assembly frame (5022); a conveying gear (5026) installed on the outside of the drive shaft (5025) and movably disposed inside the side assembly frame (5022); and a conveying belt (5027) meshing with the outside of the conveying gear (5026) and movably disposed inside the side assembly frame (5022). The side mounting bracket (5022) and conveyor belt (5027) are each provided in two units, and the conveyor gears (5026) are provided in four units. The conveyor belt (5027) is equipped with a horizontal unloading plate (50271) that is movably mounted on the top of the side assembly frame (5022). The horizontal unloading plate (50271) is equipped with longitudinal slide rail systems (50272) on both sides of its top. The longitudinal slide rail system (50272) is equipped with a longitudinal slide block (50273) on its top. The longitudinal slide block (50273) is equipped with an L-shaped slider (50274) that is movably mounted on the top of the horizontal unloading plate (50271) by screws. The L-shaped slider (50274) is equipped with a compression cylinder (50275) on its side. The output end of the compression cylinder (50275) is connected to an L-shaped compression block (50276). The circuit board is pressed and fixed on the side of the L-shaped compression block (50276). The film-coating pressing assembly (503) includes: an I-beam base (5031) mounted on the top of the equipment base (10); a T-shaped plate (5032) mounted on the top of the I-beam base (5031) by screws; a pressing slide rail system (5033) mounted on the side of the T-shaped plate (5032); a pressing slide block (5034) mounted on the side of the pressing slide rail system (5033); a guide seat (5035) mounted between the two pressing slide blocks (5034); and a [missing information - likely a component or component] mounted on the top side of the guide seat (5035). A rotary drive source (5036); a first gear (5037) connected to the output end of the rotary drive source (5036); a second gear (5038) meshing with the bottom of the first gear (5037) and movably disposed inside the guide seat (5035); a third gear (5039) meshing with the bottom of the second gear (5038) and movably disposed inside the guide seat (5035); and an electrostatic dust collection roller (50310) connected to the third gear (5039) and movably disposed at the bottom of the guide seat (5035). The second gear (5038) has a rolling rod (504) rotatably connected to the inside of the guide seat (5035) mounted on its side. The rolling rod (504) is positioned above the electrostatic dust collection roller (50310). The surface cleaning assembly (506) includes: a lead screw slide (5061) connected to the outside of the reciprocating lead screw (505) via ball bearings; and a cleaning roller (5062) mounted on the side of the lead screw slide (5061), the cleaning roller (5062) being movably connected to the outside of the rolling rod (504). The outer side of the rolling rod (504) is equipped with multiple cams (5063), which are movably disposed inside the cleaning roller (5062). The cleaning roller (5062) has sufficient space inside for the movement of the cams (5063). The electrostatic dust collection roller (50310) is recessed in the middle, and an electromagnetic module is installed in the recessed part. The electromagnetic module is located on the outside of the shaft of the electrostatic dust collection roller (50310). The power transmission end of the electromagnetic module is electrically connected to multiple conductive modules extending into the interior of the electrostatic dust collection roller (50310). Multiple electrostatic protrusions are provided on the outside of the electrostatic dust collection roller (50310). The conductive modules adsorb dust on the circuit board through the electrostatic protrusions.

2. The automatic circuit board coating equipment according to claim 1, characterized in that: The alignment pre-storage structure (40) includes: an upper support (401) installed on the top of the equipment base (10); a linear lifting module (402) installed on the top of the upper support (401); a concave bracket (403) installed at the center of the top of the linear lifting module (402); a horizontal cylinder (404) installed at the center of the left and right sides of the top of the upper support (401); and a horizontal push plate (405) connected to the output end of the horizontal cylinder (404) and slidably connected to the top of the linear lifting module (402).

3. The automatic circuit board coating equipment according to claim 2, characterized in that: A central protrusion (406) is installed at the center of the side of the horizontal push plate (405). The central protrusion (406) is slidably connected to the top of the linear lifting module (402). The side of the central protrusion (406) abuts against the circuit board. The linear lifting module (402) drives the circuit board placed on top to move up and down.

4. The automatic circuit board coating equipment according to claim 1, characterized in that: The film-coated conveying and adsorption assembly (501) includes: a side support (5011) mounted on the top of the equipment base (10); a horizontal slide rail system (5012) mounted on the side of the side support (5011); a horizontal slide block (5013) mounted on the side of the horizontal slide rail system (5012); a slide block (5014) mounted on the side of the horizontal slide block (5013) by screws and slidably connected to the side support (5011); a vertical slide rail system (5015) mounted on the side of the slide block (5014); a vertical slide block (5016) mounted on the side of the vertical slide rail system (5015); and a bending frame (5017) mounted on the side of the vertical slide block (5016) by screws. There are two horizontal slide rail systems (5012), and each horizontal slide rail system (5012) has a horizontal slide block (5013) installed on its side.

5. The automatic circuit board coating equipment according to claim 4, characterized in that: The bottom of the bending frame (5017) is fixed with a lower metal plate (50171) by screws. A guide rod (50172) is slidably connected at the inner corner of the lower metal plate (50171). A lower connecting plate (50173) located below the lower metal plate (50171) is installed at the bottom of the guide rod (50172). Multiple vacuum suction cups (50174) are installed at the bottom edge of the lower connecting plate (50173). The guide rod (50172) is provided with a buffer spring (50175) connected to the top of the lower metal plate (50171) on its outer side, and the bottom of the vacuum suction cup (50174) is attached to and fixed with a circuit board and a protective film.

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