A composite robot-based ultrasonic dust removal device for the semiconductor industry

Abstract

The application discloses a composite robot-based ultrasonic dust removal device for the semiconductor industry, which comprises an AGV trolley, wherein a mounting frame is arranged on the AGV trolley, a bottom frame is arranged at the bottom of the mounting frame and connected with the AGV trolley, a mechanical arm is arranged at the top of the mounting frame, a free end of the mechanical arm away from the mounting frame is provided with an ultrasonic dust removal device, the ultrasonic dust removal device comprises a dust removal head, a bottom plate of the dust removal head is arranged at the bottom of a cavity of the dust removal head, the dust removal head and the bottom plate of the dust removal head are integrally formed, an air inlet cylinder is arranged at the top of the cavity of the dust removal head, a positive pressure cavity is arranged in the cavity of the dust removal head, a side wall around the positive pressure cavity is vertically arranged on the bottom plate of the dust removal head in the cavity of the dust removal head, a separation distance is arranged between the top plate of the positive pressure cavity and the top end of the cavity of the dust removal head, and the air inlet cylinder is in through connection with the positive pressure cavity. The application can clean the horizontal plane and the vertical door of the carrier, meet more extensive dust removal requirements and greatly increase the application range.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to an ultrasonic dust removal device based on a composite robot for the semiconductor industry, which efficiently cleans dust generated during the operation of production vehicles. Background Technology

[0002] A wafer is the silicon material used in the fabrication of silicon semiconductor integrated circuits. It is used to produce integrated circuit chips. As the carrier of integrated circuits, the cleanliness of the wafer directly determines the product yield. In the semiconductor manufacturing process, wafers are typically placed in wafer pods (FOUPs) and transported to different loadports via AMHS (Automated Material Handling System). See Appendix Figure 15 Display, with Figure 15 This is a schematic diagram of the part of the Load Port 91 that needs to be cleaned. The Load Port 91 is a key device for docking and exchanging between the wafer cassette and the processing equipment. After thousands of process cycles, the horizontal surface 93 of the Load Port 91 and the vertical door 92 at the entrance will inevitably accumulate fine dust contaminants from the environment or its own operation. This dust is a key factor affecting the yield of wafer products.

[0003] Therefore, to ensure product yield, the cleanliness of the carriers must be maintained, and the carriers of semiconductor processing equipment must be cleaned regularly. Existing cleaning methods mostly include manual cleaning, brush cleaning, and automatic tray cleaning. Manual cleaning currently mainly relies on the equipment maintenance window, where technicians manually clean the equipment. This method is highly dependent on manpower, which is not only time-consuming and labor-intensive, but also inefficient, detrimental to the overall working environment, and cannot control the cleanliness or ensure consistency. Other automatic tray cleaning devices have limited dust removal coverage, typically only cleaning the horizontal 93 (horizontal surface) area. The vertical 92 (gate) area becomes an inaccessible cleaning dead zone, unable to remove dust, becoming the place where dust is most likely to accumulate. This limits the application scenarios and prevents truly effective dust removal. Summary of the Invention

[0004] To address the problems existing in the prior art, the purpose of this application is to provide an automated cleaning device for a semiconductor chip production carrier 91 (Load port) that is efficient, non-destructive, thorough, and maintains consistent cleanliness. The device can automatically clean the horizontal surface 93 (tabletop) and the vertical door 92 (gate) area at the entrance of the carrier port 91. It adopts non-contact suspended positive and negative air channels for cleaning. At the same time, the cleaning device achieves air and electricity isolation and independent operation, thereby improving the stability and yield of product processing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An ultrasonic dust removal device based on a composite robot for the semiconductor industry includes an AGV trolley, an AGV trolley with a mounting frame, a bottom frame at the bottom of the mounting frame, and the bottom frame connected to the AGV trolley. A robotic arm is located at the top of the mounting frame, and an ultrasonic dust removal device is located at the free end of the robotic arm away from the mounting frame. The ultrasonic dust removal device includes a dust removal head, a dust removal head base plate at the bottom of the dust removal head cavity, and the dust removal head and the dust removal head base plate are integrally formed; an air inlet duct is provided at the top of the dust removal head cavity, a positive pressure chamber is provided inside the dust removal head cavity, the four sides of the positive pressure chamber are vertically arranged from the dust removal head base plate inside the dust removal head cavity, the top plate of the positive pressure chamber is separated from the top of the dust removal head cavity, and the air inlet duct is connected to the positive pressure chamber. There is an empty space between the outer wall of the positive pressure chamber and the inner wall of the dust collector head chamber. The space between the inner wall of the dust collector head chamber and the outer wall of the positive pressure chamber forms a negative pressure chamber. The negative pressure chamber is located outside the positive pressure chamber and covers the positive pressure chamber. The negative pressure chamber is located in the dust collector head chamber. The bottom plate of the dust removal head of the ultrasonic dust removal device is provided with a multi-stage pulse dust blowing slit that communicates with the positive pressure chamber. The first suction slit that communicates with the negative pressure chamber is provided on both sides of the multi-stage pulse dust blowing slit, and the second suction slit that communicates with the negative pressure chamber is provided at both ends of the multi-stage pulse dust blowing slit. The negative pressure chamber in the dust collector head is connected to the exhaust duct, and the first suction slit and the second suction slit (matching pair) are opened at the bottom of the negative pressure chamber of the dust collector head base plate.

[0006] Furthermore, in some embodiments, the bottom plate of the dust collector head of the positive pressure chamber is provided with a through multi-stage pulse dust blowing slit. The multi-stage pulse dust blowing slit includes a double-stage expansion air passage cavity and a two-stage narrowing surface channel. The multi-stage pulse dust blowing slit is provided with an air inlet spacing D1 with varying air gap spacing, a first narrowing air passage spacing D2, a first-stage expansion cavity spacing D3 of the double-stage expansion air passage cavity, a second narrowing air passage spacing D4, a second-stage expansion cavity spacing D5 of the double-stage expansion air passage cavity, and a dust blowing spacing D6, arranged sequentially from top to bottom. The air gap spacing on the multi-stage pulse dust blowing seam is as follows: the air inlet spacing D1, the first stage expansion cavity spacing D3, and the second stage expansion cavity spacing D5 of the dual-stage expansion airway are the same (D1=D3=D5); the first narrowing airway spacing D2, the second narrowing airway spacing D4, and the dust blowing spacing D6 are the same (D2=D4=D6), and the ratio of air inlet spacing D1 to first narrowing airway spacing D2 is 1:1.5~2 (i.e., D1:D2=1:1.5~2).

[0007] Furthermore, in some embodiments, the robotic arm is a six-axis collaborative robotic arm, and the ultrasonic dust removal device is equipped with a hanging bracket, which is mounted on the end of the robotic arm. The top of the dust collector head is equipped with an exhaust duct, which is connected to the negative pressure chamber. The positive pressure chamber and the negative pressure chamber are independently set in the dust collector head cavity, and the positive pressure chamber and the negative pressure chamber are isolated from each other and do not communicate with each other. The AGV is equipped with a lidar; the end effector of the robotic arm (six-axis collaborative) is equipped with a camera module, which is located next to the dust removal head.

[0008] Furthermore, in some embodiments, the dual-stage expansion airway cavity adopts a square cavity structure, and the width spacing D3 and spacing D5 between the inner sidewalls of the square cavity of the dual-stage expansion airway cavity is the width of the expansion cavity. Alternatively, the dual-stage expansion airway cavity can adopt a circular cavity structure, and the width spacing D3 and D5 between the outer top of the inner wall of the circular cavity of the dual-stage expansion airway cavity is the width of the expansion cavity. Alternatively, the dual-stage expansion airway cavity can adopt a trapezoidal cavity structure, with the bottom width spacing D3 and spacing D5 of the trapezoidal cavity being the width of the expansion cavity.

[0009] Furthermore, in some embodiments, a negative pressure fan is provided on the bottom frame, a negative pressure high-efficiency filter is provided on the negative pressure fan, the negative pressure high-efficiency filter is set in the mounting frame, the negative pressure high-efficiency filter is connected to the exhaust duct on the dust removal head through a duct, and a silencer is provided at the air outlet of the negative pressure fan.

[0010] Furthermore, in some embodiments, a series of annular dust blowing slits consisting of a multi-stage pulse dust blowing slit and a ring group are opened in the concave truncated cone cavity at the bottom of the positive pressure chamber of the dust collector head base plate. Four slender dust blowing slits are opened around the planar area outside the concave truncated cone cavity at the bottom of the positive pressure chamber. The four slender dust blowing slits surround the planar area outside the concave truncated cone cavity. The negative pressure chamber in the dust collector head is connected to the exhaust duct, and the bottom of the negative pressure chamber of the dust collector head base plate is provided with a first suction slit and a second suction slit for matching pairs.

[0011] Furthermore, in some embodiments, the ratio of the height of the positive pressure chamber to the height of the dust collector head chamber is 2 / 3 to 3 / 4:1; the ratio of the air volume of the dust blowing slit to the air volume of the suction slit is 1:1.5 to 2; The ratio of the pressure at the dust blowing gap to the pressure at the suction gap is 8~12:1.

[0012] Furthermore, in some embodiments, the dust removal head of the ultrasonic dust removal device includes a positive pressure chamber and a negative pressure chamber, and the ultrasonic dust removal device is disposed at the end of the robotic arm; the positive pressure fan, the negative pressure fan, and the negative pressure high-efficiency filter are disposed on the bottom frame of the mounting frame, the negative pressure high-efficiency filter is disposed on the negative pressure fan, and the negative pressure high-efficiency filter is connected to the exhaust duct on the ultrasonic dust removal device through a conduit, the conduit being disposed in sections on the robotic arm through sleeves; the positive pressure fan is placed next to the negative pressure fan, the positive pressure fan is connected to the bottom frame through a support frame, and the positive pressure fan is connected to the air inlet duct on the ultrasonic dust removal device through a conduit.

[0013] Furthermore, in some embodiments, the ultrasonic dust removal device is disposed at the end of the robotic arm, the positive pressure fan is embedded in the ultrasonic dust removal device, the positive pressure fan is disposed on the top plate of the positive pressure chamber of the dust removal head, the air outlet of the positive pressure fan is connected to the positive pressure chamber of the dust removal head, and the air inlet of the positive pressure fan is connected to the air inlet duct at the top of the dust removal head. The negative pressure high-efficiency filter and the negative pressure fan are set on the bottom frame. The negative pressure high-efficiency filter is set on the negative pressure fan. The negative pressure high-efficiency filter is connected to the exhaust duct on the ultrasonic dust removal device through a duct. The duct is fixed to the robotic arm in sections by a cable tie.

[0014] Furthermore, in some embodiments, the ultrasonic dust removal device is located at the end of the robotic arm, the positive pressure fan is embedded in the dust removal head of the ultrasonic dust removal device, and the positive pressure fan is connected to the positive pressure chamber of the dust removal head; the negative pressure fan is mounted on the outer wall of the dust removal head via a bracket, the air inlet of the negative pressure fan is connected to the exhaust duct of the dust removal head, and the air outlet of the negative pressure fan is equipped with a silencer.

[0015] This application employs a non-contact dust removal head for cleaning and utilizes automated cleaning equipment. This application cleans the horizontal surface 93 (carrier surface) of the carrier and the vertical door 92 (gate) at the wafer entrance (Note: dust removal can also be performed on some carriers with inclined surfaces), meeting a wider range of dust removal needs and greatly increasing the application scope.

[0016] In typical work environments, there are hundreds or even thousands of wafer processing carriers (positions). These environments are equipped with AGV (Automated Guided Vehicle) mobile systems. The equipment described in this application moves to the corresponding wafer cassette transport position, where a collaborative robotic arm 14 controls the moving dust removal head 38 for cleaning. Once one workstation is cleaned, the AGV (AGV system) transports the cleaning equipment to the next available workstation. By simply following the workstation route map, it can clean each available workstation one by one.

[0017] This application solves the problem of low efficiency in manual removal of fine dust by providing a dust removal head structure that can generate high-frequency, high-speed pulsed airflow and air curtain barrier. The high-frequency, high-speed fluctuating airflow is generated by cavity self-excited oscillation through multi-stage pulse dust blowing slits (variable cross-section channels), which blows up fine dust. An air curtain is formed by suction slits around the perimeter to attract dust and prevent it from escaping into the air. Attached Figure Description

[0018] Figure 1 This is a perspective view of an embodiment of this application; Figure 2 This is a structural schematic diagram of the dust collector head base plate in Embodiment 1; Figure 3 This is a schematic diagram of the robotic arm portion in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the dust collector head base plate in Embodiment 2 of this application; Figure 5 This is a schematic diagram of the airflow in Embodiment 2 of the dust collector head base plate of this application; Figure 6 This is a three-dimensional schematic diagram of the robotic arm portion in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of an embodiment of this application; Figure 8 This is a schematic diagram of the structure of embodiment (i) of the multi-stage pulse dust blowing section of this application; Figure 9 This is a schematic diagram of the structure of embodiment (ii) of the multi-stage pulse dust blowing section of this application; Figure 10 This is a schematic diagram of the structure of embodiment (iii) of the multi-stage pulse dust blowing section of this application; Figure 11 This is a three-dimensional schematic diagram of Embodiment A of the ultrasonic dust removal device of this application; Figure 12 This is a schematic diagram of the structure of embodiment B of the ultrasonic dust removal device of this application; Figure 13 This is a schematic diagram of the structure of embodiment C of the ultrasonic dust removal device of this application; Figure 14 This is a schematic diagram of the airflow in Embodiment 1 of the dust collector head base plate of this application; Figure 15 This is a schematic diagram of the vehicle port. Detailed Implementation

[0019] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. To further understand the features, technical means, and specific objectives and functions achieved by the present invention, and to analyze the advantages and spirit of the present invention, a detailed description of the present invention in conjunction with the accompanying drawings and specific embodiments is provided below.

[0020] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component. The terms "vertical," "horizontal," "front," "back," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0021] This application adopts a non-contact suspended + air-electric isolation design, which uses fluctuating airflow to blow dust and then uses an air curtain to block (negative pressure suction) to close the dust removal working space; a negative pressure high-efficiency filter 28 is installed on the negative pressure fan 29 (suction fan, negative pressure air source) to filter the dust (high efficiency); the positive pressure fan 39 provides a positive pressure air source, so no external air source is required; in addition, it is powered by battery, so no external power source is required.

[0022] Please refer to the attached drawings. The dust removal head 38 (blow-suction head) of this application is cleaned by blowing through the middle multi-stage pulse dust removal slit 31, and the surrounding suction slits (first suction slit 32, second suction slit 33) draw in the dust. The dust removal head 38 is suspended on the carrier port 91 and does not make contact. The middle multi-stage pulse dust removal slit 31 blows while the surrounding suction slits draw in the dust, so the dust will not be exposed. The negative pressure suction (suction slits) around the perimeter will not leak air and can prevent the dust from drifting out.

[0023] Furthermore, in one embodiment, the dust removal head 38 has a suction slit around each of its four sides, and the width of the suction slit is greater than the width of the blowing slit. The air blown down from the multi-stage pulse blowing slit 31 in the middle of the dust removal head 38 (working gun) diffuses to both sides, and a suction slit (air curtain) is provided on each of the four sides, which then sucks away the dust; the suction slits around the four sides form an suction air curtain; this prevents dust from spreading out of the blowing gun, improves cleaning efficiency, and enhances the automation level of the equipment.

[0024] This application solves the problems of damaging the surface of the carrier and generating static electricity, and provides a non-contact suspended + gas-electric isolation design scheme to realize that the dust removal head 38 structure of this application is suspended on the production carrier 91 (Loadport) and has no contact with the surface of the production carrier 91, thus avoiding the risk of damage to the surface of the carrier.

[0025] Furthermore, in one embodiment, this application addresses the problem of small cleaning area by providing a moving solution for a six-axis collaborative robotic arm 14 equipped with a dust removal head 38, see attached diagram. Figure 3 Appendix Figure 6 As shown, the multi-joint linkage of the robotic arm 14 moves the dust removal head 38 to the vertical door 92 (dust removal range) and horizontal plane 93 (dust removal range) area of ​​the carrier port 91, so as to achieve cleaning of the vertical door 92 and horizontal plane 93 area of ​​the carrier port 91.

[0026] This application solves the problem of cleaning dead corners. In the first embodiment of the dust removal head base plate 22 of this application, see Appendix Figure 2 As shown, attached Figure 2 To address the inwardly recessed structure of the dust collector head base plate 22, an improved ultrasonic dust removal device 21 provides a concave frustum-shaped cavity 36 structure with an inwardly recessed positive pressure air outlet area in the dust collector head base plate 22 (bottom surface). (See attached diagram.) Figure 14 As shown, attached Figure 14 This is a schematic diagram of the airflow in Embodiment 1 of the dust removal head base plate 22, which is used to clean hard-to-reach areas such as nails.

[0027] This application solves the problem of cleaning consistency by providing an automated device design for a composite robot consisting of an AGV and a collaborative robot. By adopting a programmed cleaning process, the motion trajectory and duration of each cleaning operation are kept highly consistent on each vehicle, fundamentally eliminating the randomness of manual cleaning.

[0028] See appendix Figure 7 As shown, attached Figure 7 This is a schematic diagram of the overall structure of this application. This application includes an AGV (Automated Guided Vehicle) 11, which is the transport mechanism of the equipment. The AGV 11 is equipped with a mounting frame 12, and the bottom of the mounting frame 12 is equipped with a bottom frame 18. The bottom frame 18 is connected to the AGV 11 by bolts.

[0029] Furthermore, in one embodiment, a robotic arm 14 is provided on the top of the mounting frame 12. The robotic arm 14 is a six-axis collaborative robotic arm, and an ultrasonic dust removal device 21 (working gun) is provided at the free end of the robotic arm 14 (six-axis collaborative) away from the mounting frame 12. The negative pressure component is installed on the bottom frame 18, and the bottom frame 18 is equipped with a negative pressure fan 29. The negative pressure fan 29 is equipped with a negative pressure high-efficiency filter 28, which is set in the mounting frame 12. The mounting frame 12 is also equipped with an embedded controller, battery, etc.

[0030] Furthermore, in one embodiment, a negative pressure fan 29 (suction fan) is provided below the negative pressure HEPA filter 28, and is connected to the base frame 18 via a support frame; an air inlet shell is fitted around the outside of the negative pressure fan 29, and an exhaust shell is fitted around the top of the negative pressure fan 29; the negative pressure HEPA filter 28 is connected to the exhaust duct 23 on the dust removal head 38 (blowing and suction head) via a duct 16. A silencer 42 is provided at the air outlet of the negative pressure fan 29. The camera module 15 is mounted on the end effector of the robotic arm 14 (six-axis collaborative), placed next to the dust removal head 38. The overall device structure is shown in the attached figure. Figure 2 As shown.

[0031] AGV Module 11: It has omnidirectional driving capability, autonomous positioning and navigation, and intelligent path planning; AGV Module 11 is equipped with LiDAR 13, which has a laser detection range of 30m, and can agilely avoid obstacles to adapt to mixed human and machine operations; it is equipped with a vision positioning system with a position accuracy of + / -5mm; when used with a matching charging pile, it can realize low battery warning, intelligent path planning and autonomous charging; the body is anti-static and ESD, no guardrails are required, and it will stop immediately upon contact with external force.

[0032] Furthermore, in one embodiment, the dust removal module includes an ultrasonic dust removal device 21, a positive pressure fan 39, a negative pressure fan 29, and a negative pressure high-efficiency filter 28. The ultrasonic dust removal device 21 includes a dust removal head 38, with a dust removal head base plate 22 at the bottom of the dust removal head 38 cavity. The dust removal head 38 and the dust removal head base plate 22 are integrally formed, and a frame sealing cover is provided at the top of the dust removal head 38 cavity. An air inlet duct 24 is provided at the top of the dust removal head 38 cavity, and a frame sealing cover is provided at the air inlet duct 24 at the top of the dust removal head 38 cavity. A positive pressure chamber 27 is provided inside the dust removal head 38 cavity. The positive pressure chamber 27 is vertically arranged from the bottom plate 22 of the dust collector 38 cavity. The top plate 26 of the positive pressure chamber is separated from the top of the dust collector 38 cavity by a separation gap. The air inlet duct 24 is connected to the positive pressure chamber 27. Furthermore, there is an empty space between the outer wall of the positive pressure chamber 27 and the inner wall of the dust collector 38 cavity. The space between the inner wall of the dust collector 38 cavity and the outer wall of the positive pressure chamber 27 forms a negative pressure chamber 25. The negative pressure chamber 25 is arranged on the outer periphery of the positive pressure chamber 27 and covers the positive pressure chamber 27. The negative pressure chamber 25 is arranged in the dust collector 38 cavity. See appendix Figure 2 Appendix Figure 14 As shown, this application's dust collector head base plate 22 is an example of embodiment one: In Embodiment 1: The concave frustum cavity 36 (recessed area) in the center of the bottom surface of the positive pressure chamber 27 of the dust collector head base plate 22 has a multi-stage pulse dust blowing slit 31 (vertical dust blowing port) and several annular dust blowing slits 35 (annular dust blowing ports). Four slender dust blowing slits 34 are formed around the planar area outside the concave frustum cavity 36 on the bottom surface of the positive pressure chamber 27 (dust collector head base plate 22), surrounding the planar area outside the concave frustum cavity 36. The negative pressure chamber 25 in the dust collector head 38 is connected to the exhaust duct 23 (suction port). The bottom of the negative pressure chamber 25 of the dust collector head base plate 22 has a matching first suction slit 32 and a second suction slit 33 (four slender suction slits), as shown in the attached diagram. Figure 14 As shown.

[0033] Furthermore, in one embodiment, the top of the dust removal head 38 is provided with an exhaust duct 23, which is connected to the negative pressure chamber 25; the positive pressure chamber 27 and the negative pressure chamber 25 are respectively arranged in the cavity of the dust removal head 38, and the positive pressure chamber 27 and the negative pressure chamber 25 are isolated from each other and do not communicate with each other; the height of the positive pressure chamber 27 to the height of the dust removal head 38 is 2 / 3 to 3 / 4:1; the ultrasonic dust removal device 21 is provided with a hanging frame, which is arranged on the cooperative robotic arm 14; the air volume relationship is: the air volume of the dust blowing gap (blowing gap) to the air volume of the suction gap (exhaust gap) is 1:1.5 to 2; the pressure relationship is: the pressure of the dust blowing gap to the pressure of the suction gap is 8 to 12:1.

[0034] See appendix Figure 4 Appendix Figure 5 As shown, this application's dust collector head base plate 22 is an example of a second embodiment: See appendix Figure 5 As shown, attached Figure 5 The image shows the airflow gap design of the ultrasonic dust removal device 21; the dust removal head base plate 22 of the ultrasonic dust removal device 21 has a multi-stage pulse dust blowing slit 31 that communicates with the positive pressure chamber 27, the multi-stage pulse dust blowing slit 31 has a first suction slit 32 that communicates with the negative pressure chamber 25 on both sides, the multi-stage pulse dust blowing slit 31 has a second suction slit 33 that communicates with the negative pressure chamber 25 at both ends, and the multi-stage pulse dust blowing slit 31 has a slender dust blowing slit 34 (longitudinal dust blowing slit) that is perpendicular to it, and the slender dust blowing slit 34 (longitudinal dust blowing slit) is connected to the positive pressure chamber 27.

[0035] See appendix Figure 8As shown in the schematic diagram of the multi-stage pulse dust blowing slit 31, the bottom plate 22 (bottom surface) of the dust collector head of the positive pressure chamber 27 is provided with a through multi-stage pulse dust blowing slit 31. The multi-stage pulse dust blowing slit 31 includes a double-stage expansion airway cavity 47 (secondary cavity) and a two-stage narrowing surface channel. The multi-stage pulse dust blowing slit 31 is provided with the following structures in sequence from top to bottom (from inside to outside): air inlet spacing D1, first narrowing airway spacing D2, first stage expansion cavity spacing D3 of the double-stage expansion airway cavity 47, second narrowing airway spacing D4, second stage expansion cavity spacing D5 of the double-stage expansion airway cavity 47, and dust blowing spacing D6 (air outlet spacing).

[0036] Furthermore, in one embodiment, the air gap spacing on the multi-stage pulse dust blowing slit 31 is as follows: the inlet air gap D1, the first-stage expansion cavity spacing D3 of the dual-stage expansion airway cavity 47, and the second-stage expansion cavity spacing D5 of the dual-stage expansion airway cavity 47 are the same (D1=D3=D5); the first narrowing airway spacing D2, the second narrowing airway spacing D4, and the dust blowing spacing D6 are the same (D2=D4=D6), and the spacing D1:D2 ratio is 1:1.5~2 (D1:D2=1:1.5~2), and the airflow passes through D1→D 2→D3→D4→D5→D6, the air duct oscillates from wide at D1 to narrow at D2, from wide at D3 to narrow at D4, from wide at D5 to narrow at D6. When the airflow enters the wide air duct from the narrow air duct, the airflow on both sides of the air duct develops into a free shear flow, forming a large vortex at the wide air duct. The main airflow continues to flow downward and merges with the airflow in the wide air duct at the duct opening and continues to move downward, resulting in a high-frequency, high-speed pulsed airflow. The airflow pulse frequency reaches the ultrasonic frequency, and the air outlet of the multi-stage pulse dust blowing slit 31 (dust blowing distance D6) performs impact dust blowing and sweeping.

[0037] Example 1: Multi-stage pulse dust blowing slit 31 cavity structure See appendix Figure 8 As shown, attached Figure 8 This is a schematic diagram of the design scheme of the cavity structure of the multi-stage pulse dust blowing slit 31 in embodiment (i). The dual-stage expansion airway cavity 47 adopts a square cavity structure. The square cavity has clear edges and walls, which is conducive to the formation of a stable separation zone and promotes the development of the shear layer. The width of the square cavity of the dual-stage expansion airway cavity 47 is shown in the attached diagram. Figure 8 The spacing D3 and D5 of the mid-section structure expands the cavity width (spacing), enhances the periodic generation and collision of the vortex ring, and is the best solution to achieve high-intensity and high-stability pulse jets.

[0038] Example 2 of the multi-stage pulse dust blowing slit 31 cavity structure: See appendix Figure 9 As shown, the dual-stage expansion airway cavity 47 adopts a circular cavity structure, providing a solution that emphasizes energy efficiency and stability; the width of the circular cavity of the dual-stage expansion airway cavity 47 (see attached diagram). Figure 9 The spacing D3 and D5 of the mid-section structure is the width of the expanded cavity (spacing). The streamlined inner wall of the circular cavity minimizes the local energy loss caused by flow separation and vortex generation, allowing for smoother airflow. Under the same input power, this structure can achieve higher overall flow efficiency, which helps to reduce the energy consumption of the system.

[0039] Example 3 of the multi-stage pulse dust blowing slit 31 cavity structure: See appendix Figure 10 As shown, the dual-stage expansion airway cavity 47 adopts a trapezoidal cavity structure, providing an alternative suitable for specific scenarios; the width of the lower base of the trapezoidal cavity of the dual-stage expansion airway cavity 47 (see attached diagram). Figure 11 The trapezoidal bottom spacing (D3, D5) of the mid-section structure expands the cavity width (spacing). The trapezoidal cavity can induce strong, transient flow separation, establish initial oscillations more quickly, and achieve rapid response. In space-constrained applications, the trapezoidal structure allows for a more compact nozzle layout.

[0040] As described in the above examples, this application greatly enhances the adaptability of its dust removal device by providing a variety of optional cavity structures (dual-stage expansion airway cavity 47). Users can flexibly select a suitable solution based on a comprehensive consideration of dust removal efficiency, energy consumption level, and specific operating conditions, overcoming the shortcomings of the single solution in existing technologies.

[0041] To address different spatial and dust removal needs, this application provides three structural design schemes for ultrasonic dust removal devices 21.

[0042] Example A of ultrasonic dust removal device 21: See appendix Figure 11 The illustrated embodiment A separates the ultrasonic dust removal device 21 from the positive pressure fan 39 and the negative pressure fan 29, thereby minimizing the size of the ultrasonic dust removal device 21 at the end of the robotic arm 14 and maximizing its dust removal flexibility. The dust removal head 38 of the ultrasonic dust removal device 21 includes a positive pressure chamber 27 and a negative pressure chamber 25, and is installed at the end of the robotic arm 14. The positive pressure fan 39, the negative pressure fan 29, and the negative pressure high-efficiency filter 28 are placed on the bottom frame 18 of the mounting frame 12. The negative pressure high-efficiency filter 28 is installed on the negative pressure fan 29 and is connected to the exhaust duct 23 on the ultrasonic dust removal device 21 via a conduit 16. The conduit 16 is segmented and mounted on the robotic arm 14 via sleeves 17. The positive pressure fan 39 is placed next to the negative pressure fan 29 and connected to the bottom frame 18 via a support frame. It is also connected to the air inlet duct 24 on the ultrasonic dust removal device 21 via the conduit 16.

[0043] Example B of Ultrasonic Dust Removal Device 21: See appendix Figure 12The illustrated embodiment B utilizes a built-in positive pressure integrated dust removal structure, combining the positive pressure fan 39 and the ultrasonic dust removal device 21 into a single module. This reduces the power required by the positive pressure fan 39 and the length of the duct 16. This design significantly reduces energy loss from the positive pressure fan 39 to the outlet of the dust removal head 38 (multi-stage pulse dust blowing slit 31). See Appendix. Figure 4 As shown, attached Figure 4 The structure of the ultrasonic dust removal device 21 of Embodiment B is shown in the attached diagram; see also the appendix. Figure 12 As shown, attached Figure 12 The diagram illustrates the connection architecture of Embodiment B. The ultrasonic dust removal device 21 is installed at the end of the robotic arm 14. The positive pressure fan 39 is embedded in the ultrasonic dust removal device 21 and is located on the top plate 26 of the positive pressure chamber. The outlet of the positive pressure fan 39 is connected to the positive pressure chamber 27 of the dust removal head, and the inlet of the positive pressure fan 39 is connected to the air inlet duct 24 at the top of the dust removal head 38. The negative pressure high-efficiency filter 28 and the negative pressure fan 29 are located on the bottom frame 18. The negative pressure high-efficiency filter 28 is located on the negative pressure fan 29 and is connected to the exhaust duct 23 on the ultrasonic dust removal device 21 through the conduit 16. The conduit 16 is fixed to the robotic arm 14 in sections by the cable ties 17.

[0044] See appendix Figure 5 As shown, attached Figure 5 The ultrasonic dust removal device 21 of embodiment B is shown in the airflow gap design. The dust removal head base plate 22 of the ultrasonic dust removal device 21 is provided with a multi-stage pulse dust blowing slit 31 that communicates with the positive pressure chamber 27. The multi-stage pulse dust blowing slit 31 is provided with a first suction slit 32 that communicates with the negative pressure chamber 25 on both sides. The multi-stage pulse dust blowing slit 31 is provided with a second suction slit 33 that communicates with the negative pressure chamber 25 at both ends. The multi-stage pulse dust blowing slit 31 is provided with a slender dust blowing slit 34 (longitudinal dust blowing slit) that is perpendicular to it. The slender dust blowing slit 34 (longitudinal dust blowing slit) communicates with the positive pressure chamber 27.

[0045] Example C of Ultrasonic Dust Removal Device 21: See appendix Figure 13The illustrated embodiment C is an integrated positive and negative pressure system that integrates the negative pressure fan 29, the positive pressure fan 39 (embedded in the dust removal head 38), and the ultrasonic dust removal device 21 into a single module. This reduces the power required by the positive and negative pressure fans 39 and the length of the duct 16. Because the airflow transmission distance between the positive and negative pressure fans 39 and the dust removal head 38 is reduced, the airflow loss rate is lowered. The ultrasonic dust removal device 21 is installed at the end of the robotic arm 14. The positive pressure fan 39 is embedded in the dust removal head 38 of the ultrasonic dust removal device 21 and connected to the positive pressure chamber 27 of the dust removal head. The negative pressure fan 29 is mounted on the outer wall of the dust removal head 38 via a bracket 41. The air inlet of the negative pressure fan 29 is connected to the exhaust duct 23 of the dust removal head 38, and the air outlet of the negative pressure fan 29 is equipped with a silencer 42.

[0046] The above three schemes have different structures, which have different effects on the volume of the ultrasonic dust removal device 21 at the end of the robotic arm 14 and the power and energy loss of the fan during dust removal. The corresponding structural scheme can be selected according to the specific space requirements and dust removal energy consumption requirements.

[0047] The above-described embodiments are quite specific and detailed, and are merely product examples of this application, illustrating only a few implementation methods. They should not be construed as limiting. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, by referring to the specification and examples disclosed herein. Other implementation methods of this application will be readily apparent, and all of these fall within the scope of protection of this application. In other words, the specification and embodiments should be carefully understood as exemplary, while the true scope and spirit of this application are specified in the appended claims.

Claims

1. An ultrasonic dust removal device based on a composite robot for the semiconductor industry, comprising: An AGV trolley (11) is provided with an installation frame (12), and a bottom frame (18) is provided at the bottom of the installation frame (12), which is connected to the AGV trolley (11). The feature is that a robotic arm (14) is provided on the top of the mounting frame (12), and an ultrasonic dust removal device (21) is provided at the free end of the robotic arm (14) away from the mounting frame (12). The ultrasonic dust removal device (21) includes a dust removal head (38), a dust removal head base plate (22) is provided at the bottom of the dust removal head (38) cavity, and the dust removal head (38) and the dust removal head base plate (22) are integrally formed; an air inlet duct (24) is provided at the top of the dust removal head (38) cavity, a positive pressure chamber (27) is provided in the dust removal head (38) cavity, the four sides of the positive pressure chamber (27) are vertically arranged from the dust removal head base plate (22) in the dust removal head (38) cavity, the top plate (26) of the positive pressure chamber is provided with a separation gap from the top of the dust removal head (38) cavity, and the air inlet duct (24) is connected to the positive pressure chamber (27). An empty space is provided between the outer wall of the positive pressure chamber (27) and the inner wall of the dust removal head (38) cavity. The space between the inner wall of the dust removal head (38) cavity and the outer wall of the positive pressure chamber (27) forms a negative pressure chamber (25). The negative pressure chamber (25) is located outside the periphery of the positive pressure chamber (27) and covers the positive pressure chamber (27). The negative pressure chamber (25) is located in the cavity of the dust removal head (38). The bottom plate (22) of the dust removal head of the ultrasonic dust removal device (21) is provided with a multi-stage pulse dust blowing slit (31) that communicates with the positive pressure chamber (27). The first suction slit (32) that communicates with the negative pressure chamber (25) is provided on both sides of the multi-stage pulse dust blowing slit (31). The second suction slit (33) that communicates with the negative pressure chamber (25) is provided at both ends of the multi-stage pulse dust blowing slit (31). The negative pressure chamber (25) in the dust collector head (38) is connected to the exhaust duct (23), and the first suction slit (32) and the second suction slit (33) are opened at the bottom of the negative pressure chamber (25) of the dust collector head base plate (22); The positive pressure fan (39) is embedded in the ultrasonic dust removal device (21). The positive pressure fan (39) is set on the top plate (26) of the positive pressure chamber of the dust removal head (38). The air outlet of the positive pressure fan (39) is connected to the positive pressure chamber (27) of the dust removal head, and the air inlet of the positive pressure fan (39) is connected to the air inlet duct (24) at the top of the dust removal head (38). The negative pressure high-efficiency filter (28) and the negative pressure fan (29) are set on the bottom frame (18). The negative pressure high-efficiency filter (28) is set on the negative pressure fan (29). The negative pressure high-efficiency filter (28) is connected to the exhaust duct (23) on the ultrasonic dust removal device (21) through the conduit (16). The conduit (16) is fixed in sections on the robotic arm (14) through the cable tie (17). In the concave truncated cone cavity (36) at the bottom of the positive pressure chamber (27) of the dust collector head base plate (22), a multi-stage pulse dust blowing slit (31) and several annular dust blowing slits (35) of the ring group are opened. Four slender dust blowing slits (34) are opened around the planar area outside the concave truncated cone cavity (36) at the bottom of the positive pressure chamber (27). The four slender dust blowing slits (34) surround the planar area outside the concave truncated cone cavity (36). The negative pressure chamber (25) in the dust removal head (38) is connected to the exhaust duct (23). The bottom of the negative pressure chamber (25) of the dust removal head base plate (22) is provided with a first suction slit (32) and a second suction slit (33) for matching pairs.

2. The ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 1, characterized in that, The bottom plate (22) of the dust collector head of the positive pressure chamber (27) is provided with a through multi-stage pulse dust blowing slit (31). The multi-stage pulse dust blowing slit (31) includes a double-stage expansion airway cavity (47) and a two-stage narrowing surface channel. The multi-stage pulse dust blowing slit (31) is provided with an air gap spacing of varying D1, a first narrowing airway spacing D2, a first-stage expansion cavity spacing D3, a second narrowing airway spacing D4, a second-stage expansion cavity spacing D5, and a dust blowing spacing D6 from top to bottom. The air gap spacing on the multi-stage pulse dust blowing slit (31) is the same as: the air inlet spacing D1, the first stage expansion cavity spacing D3 of the dual-stage expansion airway cavity (47), and the second stage expansion cavity spacing D5 of the dual-stage expansion airway cavity (47); the first narrowing airway spacing D2, the second narrowing airway spacing D4, and the dust blowing spacing D6 are the same, and the ratio of air inlet spacing D1 to first narrowing airway spacing D2 is 1:1.5~2; The dual-stage expansion airway cavity (47) adopts a square cavity structure. The width spacing D3 and spacing D5 between the inner sidewalls of the square cavity of the dual-stage expansion airway cavity (47) are the width of the expansion cavity. Alternatively, the dual-stage expansion airway cavity (47) adopts a circular cavity structure, and the width spacing D3 and spacing D5 between the outer top of the circular arc of the inner wall of the dual-stage expansion airway cavity (47) is the width of the expansion cavity. Alternatively, the dual-stage expansion airway cavity (47) adopts a trapezoidal cavity structure, and the bottom width spacing D3 and spacing D5 of the trapezoidal cavity of the dual-stage expansion airway cavity (47) is the width of the expansion cavity.

3. The ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 1, characterized in that, The robotic arm (14) is a six-axis collaborative robotic arm. The ultrasonic dust removal device (21) is equipped with a hanging frame and is mounted on the end of the robotic arm (14) through the hanging frame. The top of the dust collector head (38) is provided with an exhaust duct (23), which is connected to the negative pressure chamber (25); the positive pressure chamber (27) and the negative pressure chamber (25) are respectively independently set in the cavity of the dust collector head (38), and the positive pressure chamber (27) and the negative pressure chamber (25) are isolated from each other and do not communicate with each other; The AGV (11) is equipped with a lidar (13); the end effector of the robotic arm (14) is equipped with a camera module (15), which is located next to the dust removal head (38).

4. The ultrasonic dust removal device based on a composite robot for the semiconductor industry according to claim 1, characterized in that, The ratio of the height of the positive pressure chamber (27) to the height of the dust collector head (38) is 2 / 3 to 3 / 4:1; The ratio of air volume at the dust blowing gap to that at the suction gap is 1:1.5~2; The ratio of the pressure at the dust blowing gap to the pressure at the suction gap is 8~12:1.

Images