A laser ablation printing equipment for IC chips

Abstract

This invention discloses an IC chip laser ablation printing equipment, belonging to the field of laser ablation printing. It includes a housing, inside which is an adjustment mechanism. The adjustment mechanism includes a mounting component fixedly connected to the housing, with a limiting component slidably connected internally within the mounting component. A material plate is placed inside the limiting component. The rotating column rotates the arc-shaped plate. When the end of the arc-shaped plate furthest from the rotating column is directly below it, the endpoint of the arc-shaped plate is at the focal point of the laser. The limiting component moves the material plate and the chip downwards, bringing the chip on the surface of the material plate to the same horizontal plane as the endpoint of the rotated arc-shaped plate. This facilitates better laser ablation of the chip, allows for adjustment of different chip specifications, and makes adjusting the distance between the laser and the chip more convenient and efficient.

Description

Technical Field

[0001] This invention relates to the field of laser ablation printing, and more specifically, to an IC chip laser ablation printing apparatus. Background Technology

[0002] Laser ablation printing equipment is a precision processing device that uses a high-energy-density pulsed laser beam as a processing tool. By precisely controlling the laser parameters and beam scanning path, it selectively ablates thin film materials (such as metals, dielectric layers, polymers, etc.) on specific areas of the substrate (such as semiconductor wafers or IC chips), thereby directly and non-contactly etching or "printing" high-precision micro-patterns (such as circuit traces, electrodes, markings, isolation grooves, etc.). The core of this technology lies in using the interaction between the laser and the material to achieve precise removal of micro-area materials. It has advantages such as high resolution, fast processing speed, non-contact and stress-free operation, and applicability to various materials and complex patterns. It is a key process equipment for achieving fine patterning in microelectronics manufacturing.

[0003] Chinese patent CN119747894B discloses an IC chip laser ablation printing equipment. It uses laser ablation to replace manual grinding or chemical etching for text removal. The precise and controllable laser spot energy distribution ensures the uniformity of text removal. At the same time, laser text removal is non-contact and will not cause mechanical damage to the chip. Due to its high precision and stability, laser text removal has become the mainstream choice. It can achieve a custom ablation depth without causing additional damage to the IC chip, ensuring that the chip text removal work can be carried out smoothly and stably.

[0004] While the aforementioned patent can ensure the uniformity of text removal through precise and controllable laser spot energy distribution, the diversity of chips leads to variations in IC chip thickness. These thickness variations result in different distances between the laser and the chip. In the laser ablation of IC chips, the distance between the laser and the chip is one of the core parameters that must be precisely controlled. Different distances can easily lead to different ablation depths. Therefore, the equipment needs to be adjusted every time the printed chip is laser ablated, requiring precise measurement and adjustment, which makes the equipment adjustment process cumbersome. Summary of the Invention

[0005] To address the problems existing in the prior art, the present invention aims to provide an IC chip laser ablation printing device. The device rotates a rotating column, which in turn rotates an arc-shaped plate. When the end of the arc-shaped plate furthest from the rotating column rotates to directly below it, the endpoint of the arc-shaped plate is at the focal point of the laser. A limiting component moves the material board and the chip downwards, ensuring that the chip on the surface of the material board is on the same horizontal plane as the endpoint of the rotated arc-shaped plate. This facilitates better laser ablation of the chip, allows for adjustment of different chip specifications, and makes adjusting the distance between the laser and the chip more convenient and efficient.

[0006] To solve the above problems, the present invention adopts the following technical solution.

[0007] An IC chip laser ablation printing device includes a housing, and an adjustment mechanism is provided inside the housing;

[0008] The adjustment mechanism includes a mounting component fixedly connected to the housing. A limiting component is slidably connected inside the mounting component. A material plate is placed inside the limiting component. An adjustment component is fixedly connected to the top front end of the mounting component. A rotating column is rotatably connected inside the adjustment component. An arc-shaped plate is fixedly connected to the outer surface of the rotating column. The cross-sectional shape of the arc-shaped plate is crescent-shaped.

[0009] Furthermore, the front ends of both sides of the limiting member extend toward the mounting member to form a first slider, and the front ends of both sides of the limiting member extend toward the mounting member to form a second slider.

[0010] Furthermore, the mounting component has a second groove inside corresponding to the movement trajectory of the first slider and the second slider. A first spring is welded inside the second groove on the rear side. The first spring is in a naturally extended state when it is not squeezed by the second slider.

[0011] Furthermore, a pressing block is fixedly connected to the part of the rotating column inside the mounting plate, and a limit block is slidably connected inside the mounting plate.

[0012] Furthermore, the top of the limiting block is provided with an inclined groove to accommodate the movement of the extrusion block, and the bottom right side of the limiting block extends to form multiple extension blocks.

[0013] Furthermore, the first slider has a circular hole for accommodating the extension block on the side near the extension block, and a second spring is welded to the side of the limiting block away from the extension block. The second spring is in a stretched state when the extrusion block is inside the inclined groove.

[0014] Furthermore, a moving mechanism is fixed to the rear side of the material plate, and a suction mechanism is provided on the top of the moving mechanism. The suction mechanism includes a first driving member fixedly connected to the moving mechanism. A mounting shell is slidably connected to the left side of the first driving member. A laser head is fixedly connected to the left side of the mounting shell. A hydraulic rod is fixedly connected inside the first driving member. The hydraulic rod is fixedly connected to the mounting shell.

[0015] Furthermore, a second driving member is provided on the inner right side wall of the mounting housing. The second driving member includes a driving wheel rotatably connected to the right side wall of the mounting housing. The driving wheel is rotatably connected to driving teeth. The inner side of the first driving member is provided with a driving groove corresponding to the movement trajectory of the driving teeth.

[0016] Furthermore, a steering component is provided inside the mounting housing. The steering component includes a second steering gear rotatably connected to the mounting housing. The end of the second steering gear near the drive wheel is welded to the drive wheel. A first steering gear is rotatably connected to the center of the interior of the mounting housing. The first steering gear meshes with the second steering gear.

[0017] Furthermore, a first driving component is provided at the bottom of the first steering gear. The first driving component includes a rotating disk fixedly connected to the first steering gear. A fixing plate is fixedly connected inside the mounting housing. The first steering gear passes through the fixing plate. Through holes are provided inside both the fixing plate and the rotating disk. Copper sheets are fixedly connected to the opposite surfaces of the fixing plate and the rotating disk. A copper plate electrically connected to the copper sheets inside the rotating disk is fixedly connected to the bottom of the rotating disk.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] 1. This solution rotates the curved plate by rotating the rotating column. When the end of the curved plate furthest from the rotating column is directly below it, the endpoint of the curved plate is at the focal point of the laser. During the rotation of the curved plate, the chip placed on the surface of the material plate is squeezed by the curved plate, causing the chip to be subjected to a downward force. The chip is on the surface of the material plate, which facilitates the squeezing of the material plate. The material plate is on top of the limiting component, which is squeezed downward. At this time, the limiting component moves the material plate and the chip downward, so that the chip on the surface of the material plate is on the same horizontal plane as the endpoint of the rotated curved plate. This facilitates better laser ablation of the chip, and different specifications of chips can be adjusted. Adjusting the distance between the laser and the chip is also more convenient and efficient.

[0020] 2. This solution uses a crescent-shaped arc plate to extrude the chip more conveniently without damaging it. When the chip is embedded in the surface of the material plate, the rotating arc plate can make better contact with the chip, making the device easier to use. After the chip position is adjusted, the material plate is moved again to the rear of the limiting component, which facilitates subsequent laser ablation printing.

[0021] 3. In this design, a first spring is welded inside the second slide. When the limiting member moves downward with the second slider, the second slider compresses the first spring. When the first spring is not compressed by the second slider, it is in a naturally extended state. When the first spring is compressed, it changes from a naturally extended state to a taut state. At this time, the limiting member can return to its original position under the action of the first spring, so that the device can be reused.

[0022] 4. This solution uses an extension block to engage with the first slider at its current position, thus fixing the limiting component and maintaining its current state. When the limiting component is in this state, the chip surface is positioned at the laser's focal point when the subsequent chip placement board is placed inside the limiting component, eliminating the need for frequent positioning and making the device more convenient to use. When chip printing needs to be changed, simply rotate the rotating column to disengage the extrusion block from the inclined groove. At this point, the extrusion block no longer restricts the rotating column. A second spring is welded to the side of the limiting block away from the extension block. This second spring is under tension when the extrusion block is inside the inclined groove. When the rotating column, carrying the extrusion block, disengages from the inclined groove, the extension block disengages from the circular hole under the pull of the second spring. At this point, the limiting component and the mounting component are no longer fixed, allowing for height adjustment of other chips and broadening the device's applicability.

[0023] 5. This solution uses a hydraulic rod to control the movement of the mounting shell along with the laser head. The movement of the mounting shell and the laser head is synchronized. When the laser head is ablating and printing on the chip, the mounting shell is on top of the chip. The smoke generated during ablation is processed by the mounting shell. As the mounting shell moves with the laser head, it can accurately process the smoke generated during ablation. This prevents the smoke from adhering to the chip surface and causing defects due to the distance between the smoke and the existing processing unit, which would otherwise cause the smoke to be slow to process.

[0024] 6. In this design, the first steering gear rotates, causing the rotating disk to rotate while the fixed plate remains stationary. This keeps the copper sheet inside the rotating disk rotating, generating static electricity between the rotating disk and the fixed plate. This static electricity attracts particles generated by the laser head's ablation process, resulting in more precise adsorption. The rotating disk also rotates the copper plate, and the suction force generated by the copper plate's rotation guides the particles generated by the laser head's ablation process, allowing them to enter the mounting housing for collection more quickly. The copper plate is electrically connected to the copper sheet inside the rotating disk, creating static electricity on the copper plate, which causes the particles to adhere to its surface, facilitating the processing of these particles. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the printing equipment of the present invention;

[0026] Figure 2 This is a schematic diagram of the internal structure of the printing equipment of the present invention;

[0027] Figure 3 This is a schematic diagram of the adjustment mechanism of the present invention;

[0028] Figure 4 This is a partial cross-sectional view of the adjusting mechanism of the present invention;

[0029] Figure 5 This is a side sectional view of the adjustment mechanism of the present invention;

[0030] Figure 6 This is a schematic diagram of the structure of the limiting block of the present invention;

[0031] Figure 7 This is a schematic diagram of the material suction mechanism of the present invention;

[0032] Figure 8 This is a schematic diagram of the internal structure of the material suction mechanism of the present invention;

[0033] Figure 9 This is a schematic diagram of the electrostatic module of the present invention;

[0034] Figure 10 This is a schematic diagram of the internal structure of the first driving component of the present invention.

[0035] Explanation of the labels in the diagram:

[0036] 1. Housing; 2. Adjusting mechanism; 21. Mounting component; 212. Second slide groove; 22. Limiting component; 221. First slider; 222. Circular hole; 223. Second slider; 224. First spring; 23. Adjusting component; 231. Rotating column; 232. Mounting plate; 233. Extrusion block; 234. Arc plate; 24. Limiting block; 241. Extension block; 242. Second spring; 243. Inclined groove; 25. Material plate; 3. 4. Moving mechanism; 41. Suction mechanism; 42. Mounting housing; 43. First driving component; 44. Hydraulic rod; 45. Driving groove; 46. Electrostatic module; 47. Fixing plate; 48. Rotary disk; 49. Copper sheet; 40. Copper plate; 41. Through hole; 42. Steering component; 43. First steering gear; 44. Second steering gear; 45. Second driving component; 46. Driving wheel; 47. Driving gear; 5. Laser head. Detailed Implementation

[0037] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0038] Please see Figures 1 to 10An IC chip laser ablation printing device includes a housing 1. An adjustment mechanism 2 is disposed inside the housing 1. The adjustment mechanism 2 includes a mounting component 21 fixedly connected to the housing 1. A limiting component 22 is slidably connected inside the mounting component 21. A material plate 25 is placed inside the limiting component 22. A chip is first placed on the surface of the material plate 25, and the material plate 25 is pushed into the limiting component 22. An adjustment component 23 is fixedly connected to the top front end of the mounting component 21. A rotating column 231 is rotatably connected inside the adjustment component 23. By rotating the rotating column 231, the rotating column 231 rotates within the adjustment component 23. An arc-shaped plate 234 is fixedly connected to the outer surface of the rotating column 231. The rotation of the rotating column 231 rotates the arc-shaped plate 234. When the end of the arc-shaped plate 234 furthest from the rotating column 231 rotates to directly below the rotating column 231, the endpoint of the arc-shaped plate 234 is at the focal point of the laser. During the rotation of the arc-shaped plate 234, the chip placed on the surface of the material plate 25 is ablated by the arc-shaped plate 234. The chip is compressed, applying a downward force to its surface. The chip is positioned on the material plate 25, facilitating compression. The material plate 25 is also positioned on top of the limiting member 22, causing it to be compressed downwards. This causes the limiting member 22 to move downwards along with the material plate 25 and the chip, bringing the chip on the surface of the material plate 25 to the same horizontal plane as the end point of the rotated arc plate 234. This improves the laser ablation effect on the chip and allows for adjustment of different chip sizes. Adjusting the distance between the laser and the chip is also more convenient. The arc plate 234 has a crescent-shaped cross-section, which facilitates chip compression without damaging the chip. When the chip is embedded in the surface of the material plate 25, the rotating arc plate 234 makes better contact with the chip, enhancing the device's usability. After the chip position is adjusted, the material plate 25 is moved again to the rear of the limiting member 22, facilitating subsequent laser ablation printing.

[0039] like Figures 1 to 10As shown, the front ends of both sides of the limiting member 22 extend towards the mounting member 21 to form the first slider 221, and the front ends of both sides of the limiting member 22 extend towards the mounting member 21 to form the second slider 223. When the limiting member 22 is pressed downward, it can move the first slider 221 and the second slider 223 downward. The mounting member 21 has a second groove 212 inside corresponding to the movement trajectory of the first slider 221 and the second slider 223, which makes it easier for the first slider 221 and the second slider 223 to move inside the second groove 212. A first spring 224 is welded inside the second groove 212 on the rear side. When the limiting member 22 moves downward with the second slider 223, the second slider 223 presses against the first spring 224. When the first spring 224 is not pressed by the second slider 223, it is in a naturally extended state. When the first spring 224 is pressed, it changes from a naturally extended state to a taut state. At this time, the limiting member 22 can return to its original position under the action of the first spring 224, so that the device can be reused.

[0040] like Figures 1 to 10As shown, a pressing block 233 is fixedly connected to the surface of the rotating column 231 inside the mounting plate 232. By rotating the rotating column 231, the pressing block 233 is rotated along with it. A limiting block 24 is slidably connected inside the mounting plate 232. The top of the limiting block 24 has an inclined groove 243 to accommodate the movement of the pressing block 233. The rotating pressing block 233 presses against the inner wall of the inclined groove 243, causing the limiting block 24 to be pressed and move towards the arc plate 234. Multiple extension blocks 241 extend from the bottom right side of the limiting block 24. The extension blocks 241 can be moved towards the first slider 221 by moving the limiting block 244. The movement of the extension blocks 241 is more convenient. A circular hole 222 to accommodate the extension blocks 241 is opened on the side of the first slider 221 near the extension blocks 241. When the limiting member 22 moves under the pressure of the arc plate 234, the extension blocks 241 are inserted into the first slider 221 at this position, thus realizing the limiting member 22. The fixing of 21 ensures that the limiting member 22 remains in its current state. When the limiting member 22 remains in this state, the chip surface is at the focal point of the laser when the subsequent chip placement material board 25 is placed inside the limiting member 22, eliminating the need for frequent positioning and making the device more convenient to use. When it is necessary to change the chip printing, simply rotate the rotating column 231 to disengage the extrusion block 233 on the surface of the rotating column 231 from the inside of the inclined groove 243. At this time, the extrusion block 233 no longer restricts the rotating column 231. A second spring 242 is welded to the side of the limiting block 24 away from the extension block 241. The second spring 242 is in a stretched state when the extrusion block 233 is inside the inclined groove 243. When the rotating column 231 disengages from the inside of the inclined groove 243 with the extrusion block 233, the extension block 241 disengages from the inside of the round hole 222 under the pull of the second spring 242. At this time, the limiting member 22 and the mounting member 21 are no longer fixed, and the height of other chips can be adjusted, making the device more widely applicable.

[0041] like Figures 1 to 10As shown, a moving mechanism 3 is fixed to the rear side of the material board 25. A suction mechanism 4 is provided on the top of the moving mechanism 3. The suction mechanism 4 includes a first driving member 42 fixedly connected to the moving mechanism 3. The moving mechanism 3 controls the first driving member 42 to move left and right. A mounting shell 41 is slidably connected to the left side of the first driving member 42. The first driving member 42 controls the mounting shell 41 to move back and forth, making the movement of the mounting shell 41 more convenient. A laser head 5 is fixedly connected to the left side of the mounting shell 41. At this time, the laser head 5 can move inside the shell 1 under the action of the first driving member 42 and the moving mechanism 3 to achieve the printing of multiple sets of chips. A hydraulic rod 421 is fixedly connected inside a drive unit 42. The hydraulic rod 421 is fixedly connected to the mounting shell 41. The hydraulic rod 421 controls the mounting shell 41 to move the laser head 5. At this time, the movement of the mounting shell 41 and the laser head 5 is synchronized. When the laser head 5 is ablation printing on the chip, the mounting shell 41 is on top of the chip. The smoke generated by ablation is processed by the mounting shell 41. As the laser head 5 moves, the mounting shell 41 can accurately process the smoke generated by ablation. The smoke will not adhere to the chip surface and cause defects in the chip because the ablation smoke is far away from the existing processing unit and the processing unit processes the smoke slowly.

[0042] like Figures 1 to 10As shown, a second driving member 45 is provided on the inner right side wall of the mounting housing 41. The second driving member 45 includes a driving wheel 451 rotatably connected to the right side wall of the mounting housing 41. A driving tooth 452 is rotatably connected inside the driving wheel 451. During the movement of the mounting housing 41, the driving wheel 451 moves with the mounting housing 41. A driving groove 422 is provided inside the first driving member 42 corresponding to the movement trajectory of the driving tooth 452. The driving tooth 452 is squeezed by the driving groove 422, causing the driving tooth 452 to rotate the driving wheel 451, making the rotation of the driving wheel 451 more convenient. A steering member 44 is provided inside the mounting housing 41. The steering member 44 includes a second steering gear 442 rotatably connected to the mounting housing 41. The second steering gear 442 is close to One end of the drive wheel 451 is welded to the drive wheel 451. The rotation of the drive wheel 451 drives the second steering gear 442 to rotate, making the rotation of the second steering gear 442 more convenient. The first steering gear 441 is rotatably connected to the center of the mounting housing 41. The first steering gear 441 meshes with the second steering gear 442. The rotation of the second steering gear 442 drives the first steering gear 441 to rotate, making the rotation of the first steering gear 441 more convenient. A first driving member 42 is provided at the bottom of the first steering gear 441. The first driving member 42 includes a rotating disk 432 fixedly connected to the first steering gear 441. The rotation of the first steering gear 441 drives the rotating disk 432 to rotate, making the rotation of the rotating disk 432 more convenient. A fixing plate 431 is fixedly connected inside the mounting shell 41. A first steering gear 441 passes through the fixing plate 431. Copper sheets 433 are fixedly connected to the opposite surfaces of the fixing plate 431 and the rotating disk 432. The rotation of the first steering gear 441 causes the rotating disk 432 to rotate, while the fixing plate 431 remains fixed, causing the copper sheets 433 inside the rotating disk 432 to rotate. At this time, static electricity is generated between the rotating disk 432 and the fixing plate 431. The static electricity ablates particles from the laser head 5, resulting in more precise adsorption. A copper plate 434 is fixedly connected to the bottom of the rotating disk 432 and is electrically connected to the copper sheets 433 inside the rotating disk 432. The rotation of the rotating disk 432 causes the copper plate 434 to rotate, and the attraction generated by the rotation of the copper plate 434 can... The particles generated by the laser head 5 ablation are guided to enter the mounting shell 41 for collection more quickly. The copper plate 434 is electrically connected to the copper sheet 433 inside the rotating disk 432, causing static electricity to adhere to its surface, facilitating particle processing. Both the fixing plate 431 and the rotating disk 432 have through holes 435, allowing the adsorbed particles to reach the top of the mounting shell 41 for collection, effectively preventing particles from leaving the shell. A mesh plate is fixed to the bottom of the mounting shell 41, and a reset mechanism is formed between the drive gear 452 and the drive wheel 451 via a torsion spring and a rotating shaft.When the mounting housing 41, carrying the laser head 5 and the electrostatic module 43, moves its rear half back and forth, the drive wheel 451, with its drive teeth 452, presses against the first drive component 42, causing the drive teeth 452 to retract into the drive wheel 451, preventing the drive wheel 451 from rotating. At this time, the second drive component 45 also stops rotating, thus preventing the electrostatic module 43 from activating. This effectively prevents the rotating disk 432 from rotating in the opposite direction with the copper plate 434, which would blow the collected particles out of the mounting housing 41 and affect the quality of the chip.

[0043] The above are merely preferred embodiments of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concept, should be covered within the scope of protection of the present invention.

Claims

1. An IC chip laser ablation printing device, comprising a housing (1), characterized in that: An adjustment mechanism (2) is provided inside the housing (1); The adjustment mechanism (2) includes a mounting component (21) fixedly connected to the housing (1). A limiting component (22) is slidably connected inside the mounting component (21). A material plate (25) is placed inside the limiting component (22). An adjustment component (23) is fixedly connected to the top front end of the mounting component (21). The adjustment component (23) includes a mounting plate (232). A rotating column (231) is rotatably connected inside the adjustment component (23). An arc plate (234) is fixedly connected to the outer surface of the rotating column (231). The cross-sectional shape of the arc plate (234) is crescent-shaped. The front ends of the limiting member (22) extend toward the mounting member (21) to form a first slider (221), and the rear ends of the limiting member (22) extend toward the mounting member (21) to form a second slider (223). The mounting member (21) has a second groove (212) inside corresponding to the movement trajectories of the first slider (221) and the second slider (223). A first spring (224) is welded inside the rear second groove (212). The first spring (224) is in a naturally extended state when not compressed by the second slider (223). The rotating column (231) is fixedly connected to the surface of the portion inside the mounting plate (232). The extrusion block (233) is slidably connected to the mounting plate (232) by a limiting block (24). The top of the limiting block (24) is provided with a sloping groove (243) to accommodate the movement of the extrusion block (233). Multiple extension blocks (241) are formed by extending from the bottom right side of the limiting block (24). The first slider (221) is provided with a round hole (222) to accommodate the extension block (241) on the side near the extension block (241). A second spring (242) is welded to the side of the limiting block (24) away from the extension block (241). The second spring (242) is in a stretched state when the extrusion block (233) is inside the sloping groove (243).

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