一种纳米孔弥散强化铜材料及其制备方法和应用

By preparing nanoporous dispersion-reinforced copper materials in a copper matrix, the "inverted" relationship between strength and conductivity in high-strength, high-conductivity copper alloys has been resolved, achieving a synergistic improvement in both strength and conductivity. This method is suitable for applications such as high-end lead frames, power transmission, and communication devices.

CN121380661BActive Publication Date: 2026-07-17辽宁材料实验室
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
辽宁材料实验室
Filing Date
2025-10-27
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

The bottleneck of existing high-strength and high-conductivity copper alloy materials is that there is an "inverted" relationship between strength and conductivity. Traditional strengthening methods are prone to introducing impurity elements and are difficult to promote in easily oxidized metal systems. The preparation process of nanoporous dispersion strengthening model materials is complicated and it is difficult to achieve a synergistic improvement in strength and conductivity.

Method used

A two-step method using copper-cuprous oxide (Cu-Cu2O) precursors was used to prepare nanoporous dispersion-reinforced copper materials. By forming uniformly distributed nanopores in the copper matrix, closed nanopores were generated inside the copper matrix using a gas-phase reduction method, avoiding the introduction of heterogeneous elements and achieving a synergistic improvement in strength and conductivity.

Benefits of technology

The prepared nanoporous dispersion-reinforced copper material exhibits excellent comprehensive performance without the introduction of impurity elements, with a tensile strength ≥500 MPa and an electrical conductivity ≥94.7% IACS. It is suitable for high-end lead frames, power transmission and communication devices, and has good prospects for industrial application.

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Abstract

本发明提供一种纳米孔弥散强化铜材料及其制备方法。所述材料通过先氧化、再还原的两步法获得：首先在铜中添加氧元素，即以铜与氧化铜制备具有Cu‑Cu2O两相组织的前驱体，可采用粉末包覆—激光粉末床熔融或电弧熔炼—凝固工艺；随后在还原性气氛下热还原，使前驱体中的氧化亚铜被还原并原位转变成封闭纳米孔。所得材料由具有微米级晶粒的铜基体与均匀弥散分布的纳米级孔洞组成。本发明通过调节Cu与O的原子比、凝固冷却速度、还原温度 / 时间、以及高温退火后处理调节前驱体中Cu2O相的体积占比的大小，进而实现孔隙度与孔径的调控。该方法不引入异质元素，工艺普适、成本友好，所得材料兼具高强度与高电导率并具备优良的高温结构稳定性。
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Citation Information

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