Dual-fa silicon optical multi-channel chip coupling device and coupling method

Abstract

This application provides a dual-FA silicon photonics multichannel chip coupling device and coupling method, belonging to the field of semiconductor laser technology. The device includes a first feeding mechanism, a second feeding mechanism, two coupling mechanisms, and a dispensing mechanism. The silicon photonics multichannel chip is fixed by the first feeding mechanism, and the transmitter fiber array, receiver fiber array, and multi-core fiber connector are fixed simultaneously by the second feeding mechanism. The two coupling mechanisms can each clamp one fiber array for coupling, thereby avoiding the problem of the other fiber array following and affecting coupling when only one fiber array is clamped. It can simultaneously couple the transmitter fiber array and the receiver fiber array, solving the problem that traditional processes cannot meet the dual-FA coupling requirements.

Description

Technical Field

[0001] This application belongs to the field of semiconductor laser technology, specifically relating to a dual-FA silicon photonic multichannel chip coupling device and coupling method. Background Technology

[0002] Silicon photonics multichannel chips are integrated optoelectronic devices developed based on silicon materials. They integrate multiple optical channels on the same chip through semiconductor processes, enabling high-speed data transmission and low-power control.

[0003] In a silicon photonics multichannel chip, it is necessary to couple the transmitter FA (i.e., transmitter fiber array) and the receiver FA (i.e., receiver fiber array). Since the transmitter FA and receiver FA are connected to the same MPO (multi-core fiber optic connector), and their coupling angles on the silicon photonics chip differ, coupling is difficult. In existing technologies, coupling devices typically only perform single-component coupling. When coupling the transmitter FA and receiver FA in the aforementioned silicon photonics chip, if either the transmitter FA or receiver FA is selected for coupling, the other will move, affecting visual judgment, adhesive dispensing and curing during the coupling process. Therefore, it is impossible to complete the coupling of the transmitter FA and receiver FA in the aforementioned silicon photonics chip. Summary of the Invention

[0004] This application aims to at least solve one of the aforementioned technical problems existing in the prior art. To this end, in a first aspect, this application provides a dual-FA silicon photonics multi-channel chip coupling device capable of solving the coupling problem between the transmitting FA and the receiving FA.

[0005] Secondly, this application proposes a dual-FA silicon photonics multi-channel chip coupling method using the aforementioned dual-FA silicon photonics multi-channel chip coupling device.

[0006] The dual-FA silicon photonics multi-channel chip coupling device according to the first aspect of this application includes: The first feeding mechanism is configured to fix silicon photonics multichannel chips; The second feeding mechanism includes a first positioning part and a second positioning part. The first positioning part is configured to fix a multi-core fiber optic connector, and the second positioning part is configured to simultaneously fix a transmitting fiber optic array and a receiving fiber optic array. The second positioning part has a first state and a second state. In the first state, the second positioning part is located directly above the first feeding mechanism. In the second state, the second positioning part is removed from the area directly above the first feeding mechanism. Two coupling mechanisms are disposed on both sides of the first feeding mechanism along a first direction, and the coupling mechanisms are configured to perform fiber array coupling operations at the transmitting end and fiber array coupling operations at the receiving end, respectively. A dispensing mechanism configured to perform a dispensing operation; The two coupling mechanisms respectively perform fiber array picking at the transmitting end and fiber array at the receiving end when the second positioning part is in the first state, and respectively perform coupling operations when the second positioning part is in the second state.

[0007] The dual-FA silicon photonics multi-channel chip coupling device according to the embodiments of this application has at least the following beneficial effects: In this embodiment, the dual-FA silicon photonics multichannel chip coupling device fixes the silicon photonics multichannel chip through a first feeding mechanism and simultaneously fixes the transmitter fiber array, receiver fiber array, and multi-core fiber connector using a second feeding mechanism. When both the transmitter and receiver fiber arrays are connected to the multi-core fiber connector and remain naturally close, the second positioning part of the second feeding mechanism in this embodiment has a first state and a second state. In the first state, the transmitter and receiver fiber arrays are restricted to a position above the first feeding mechanism. When the transmitter and receiver fiber arrays are coupled downwards onto the silicon photonics multichannel chip, the displacement is relatively small and will not affect the connection between them and the multi-core fiber connector. This embodiment also provides two coupling mechanisms, each capable of clamping and coupling one fiber array, thus avoiding the problem of the other fiber array following and causing interference when only one fiber array is clamped for coupling. Furthermore, during coupling, the second positioning part moves to the second state, allowing the coupling mechanism to directly approach the silicon photonics multichannel chip downwards after clamping the fiber arrays for coupling, avoiding interference and improving coupling efficiency.

[0008] In summary, the dual-FA silicon photonics multi-channel chip coupling device of this embodiment can simultaneously couple the transmitter fiber array and the receiver fiber array, solving the problem that traditional devices cannot meet the dual-FA coupling requirements.

[0009] According to some embodiments of this application, the first feeding mechanism includes: A first fixture, wherein a first positioning recess is provided in the first fixture, and the first positioning recess is configured to accommodate the silicon photonics multichannel chip; A first clamping part is slidably connected to the first fixture. A clamping wall is provided on the side of the first clamping part near the first positioning recess. The clamping wall has an inclination angle away from the first positioning recess in a top-to-bottom direction. The clamping wall is configured to slide toward the first positioning recess to press the silicon photonics multichannel chip.

[0010] According to some embodiments of this application, the second positioning part includes: The second fixture has a recessed second positioning recess configured to accommodate the transmitting fiber array. A third fixture is provided with a third positioning recess, which is configured to accommodate the receiving fiber optic array. A negative pressure device, wherein negative pressure holes are provided in both the second positioning recess and the third positioning recess; A feeding drive is connected to the second fixture and the third fixture, and the feeding drive is configured to control the second fixture and the third fixture to move along the first direction; In the first state, the second fixture and the third fixture are located directly above the first feeding mechanism. In the second state, the second fixture and the third fixture are located on both sides of the first feeding mechanism along the first direction.

[0011] According to some embodiments of this application, the coupling mechanism is provided with a suction and clamping integrated claw, which is configured to first adsorb the fiber array under negative pressure and then clamp the fiber array, and along the top-down direction, the suction and clamping integrated claw is inclined towards the side closer to the first feeding mechanism.

[0012] According to some embodiments of this application, the coupling mechanism is further provided with a UV curing module, which is located on the side of the suction-grip integrated claw away from the first feeding mechanism along the first direction.

[0013] According to some embodiments of this application, the dispensing mechanism is provided with two dispensing modules, which are configured to simultaneously dispense adhesive at the coupling positions of the transmitting fiber array and the receiving fiber array.

[0014] According to some embodiments of this application, the dual-FA silicon photonics multi-channel chip coupling device further includes a vision inspection mechanism, which includes: A horizontal vision module is disposed on both sides of the first feeding mechanism along the first direction and is configured to detect the coupling angle between the transmitting fiber array and the receiving fiber array. A vertical vision module is disposed above the first feeding mechanism and configured to detect the coupling position accuracy of the transmitting fiber array and the receiving fiber array.

[0015] According to some embodiments of this application, the vertical vision module is disposed on the dispensing mechanism and includes at least a first camera and a second camera with different magnification.

[0016] According to some embodiments of this application, the first positioning part includes: A fourth fixture is provided with a fourth positioning recess, which is configured to accommodate the multi-core fiber optic connector. A pressure plate, one end of which is rotatably connected to one side of the fourth positioning recess, and the other end of which is provided with a locking member that can be connected to the opposite side of the fourth positioning recess to press the multi-core fiber optic connector.

[0017] The dual-FA silicon photonics multi-channel chip coupling method according to the second aspect of this application, applied to the aforementioned dual-FA silicon photonics multi-channel chip coupling device, includes: The silicon photonics multichannel chip is loaded into the first loading mechanism; Adjust the second positioning part to the first state, and load the transmitter fiber array, receiver fiber array and the multi-core fiber connector connecting the two into the second loading mechanism. The transmitting fiber array and the receiving fiber array are respectively clamped by the two coupling mechanisms, and the second positioning part is adjusted to the second state, while the transmitting fiber array and the receiving fiber array are coupled at the same time.

[0018] The dual-FA silicon photonics multi-channel chip coupling method according to the embodiments of this application has at least the following beneficial effects: The dual-FA silicon photonics multi-channel chip coupling method of this embodiment, by applying the aforementioned dual-FA silicon photonics multi-channel chip coupling device, can simultaneously fix the transmitter fiber array, the receiver fiber array, and the multi-core fiber connector, and couple the two fiber arrays at the same time. This avoids the problem of the other fiber array following and causing an impact when only one fiber array is clamped for coupling, and solves the problem that traditional processes cannot meet the dual-FA coupling requirements.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and some of these additional aspects and advantages will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0020] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of an overall axial structure of the dual-FA silicon photonics multi-channel chip coupling device in this application; Figure 2 This is a schematic diagram of an overall structure of the first feeding mechanism in this application; Figure 3 This is a schematic diagram showing the coupling between a silicon photonics multichannel chip and a transmitter fiber array and a receiver fiber array. Figure 4 This is a partial structural diagram of the coupling mechanism in this application; Figure 5 This is a schematic diagram of an overall structure of the coupling mechanism in this application; Figure 6 This is a schematic diagram of an overall structure of the dispensing mechanism in this application; Figure 7 This is a schematic diagram of the first structural view of the dual-FA silicon photonics multichannel chip coupling device in this application; Figure 8 This is a schematic diagram of the second structural perspective of the dual-FA silicon photonics multichannel chip coupling device in this application. Detailed Implementation

[0021] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0022] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0024] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0025] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0026] Reference Figures 1 to 8 The embodiments of this application propose a dual-FA silicon photonics multi-channel chip coupling device, including a first loading mechanism 100, a second loading mechanism 200, two coupling mechanisms 300 and a dispensing mechanism 400. The first loading mechanism 100 is used to fix the silicon photonics multi-channel chip 700, the second loading mechanism 200 is used to fix the transmitter fiber array 701, the receiver fiber array 702 and the multi-core fiber connector 703 connecting the two, the two coupling mechanisms 300 are used to clamp one fiber array for coupling, and the dispensing mechanism 400 is used to perform dispensing operations.

[0027] Reference Figures 1 to 3 Specifically, the second feeding mechanism 200 includes a first positioning part and a second positioning part. The first positioning part is located on one side of the first feeding mechanism 100 and is configured to fix the multi-core fiber optic connector 703. The second positioning part is configured to simultaneously fix the transmitting fiber array 701 and the receiving fiber array 702. The second positioning part has a first state and a second state. In the first state, the second positioning part is located directly above the first feeding mechanism 100; in the second state, the second positioning part is removed from the area directly above the first feeding mechanism 100. It can be understood that since the transmitting fiber array 701, the receiving fiber array 702, and the multi-core fiber optic connector 703 have connecting optical fibers, the second feeding mechanism 200 can fix the multi-core fiber optic connector 703 to one side of the first feeding mechanism 100 through the first positioning part, and limit the transmitting fiber array 701 and the receiving fiber array 702 to a position above the first feeding mechanism 100 through the second positioning part, without affecting the connecting optical fibers, and also facilitating feeding by operators. During coupling, the transmitting fiber array 701 and the receiving fiber array 702 have been taken away by the coupling mechanism 300, and the second positioning part can exit the area above the first feeding mechanism 100 to avoid blocking the silicon photonics multichannel chip 700.

[0028] Two coupling mechanisms 300 are arranged on both sides of the first feeding mechanism 100 along the first direction. One of the two coupling mechanisms 300 is configured to clamp the transmitting end fiber array 701 for coupling operation, and the other is configured to clamp the receiving end fiber array 702 for coupling operation.

[0029] When using the dual-FA silicon photonics multichannel chip coupling device of this embodiment, the silicon photonics multichannel chip 700 is fixed by the first feeding mechanism 100, and the transmitter fiber array 701, receiver fiber array 702 and multi-core fiber connector 703 are fixed simultaneously by the second feeding mechanism 200. Since the transmitter fiber array 701 and receiver fiber array 702 are naturally close to each other because they are both connected to the multi-core fiber connector 703 by connecting optical fibers, the second positioning part of the second feeding mechanism 200 in this embodiment has a first state and a second state. In the first state, the transmitter fiber array 701 and receiver fiber array 702 can be restricted to a position above the first feeding mechanism 100. When the transmitter fiber array 701 and receiver fiber array 702 are coupled downward to the silicon photonics multichannel chip 700 from this position, the displacement is relatively small and will not affect the connection between the two and the multi-core fiber connector 703.

[0030] This embodiment also includes two coupling mechanisms 300, each capable of clamping and coupling a fiber array, thus avoiding the problem of interference caused by the other fiber array following when only one fiber array is clamped for coupling. Furthermore, during coupling, the second positioning part moves to a second state, allowing the coupling mechanism 300 to directly approach the silicon photonics multichannel chip 700 for coupling after clamping the fiber array, avoiding interference and improving coupling efficiency.

[0031] In summary, the dual-FA silicon photonics multi-channel chip coupling device of this embodiment can simultaneously couple the transmitter fiber array 701 and the receiver fiber array 702, solving the problem that traditional devices cannot meet the dual-FA coupling requirements.

[0032] Reference Figure 2 and Figure 3 In some embodiments of this application, the first feeding mechanism 100 is provided with a first fixture 101 and a first clamping part 102, wherein the first fixture 101 is recessed with a first positioning recess, which is configured to accommodate the silicon photonics multichannel chip 700. The first clamping part 102 is slidably connected to the first fixture 101, and a clamping wall is provided on the side of the first clamping part 102 near the first positioning recess. Along the top-down direction, the clamping wall has an inclination angle away from the first positioning recess, and the clamping wall is configured to slide toward the first positioning recess to press the silicon photonics multichannel chip 700.

[0033] When the silicon photonics multichannel chip 700 is placed into the first positioning recess, the first clamping part 102 can be controlled to approach the first positioning recess. The clamping wall abuts against the side of the silicon photonics multichannel chip 700, thus both clamping the silicon photonics multichannel chip 700 with the side wall of the first positioning recess and applying downward pressure to the silicon photonics multichannel chip 700 using its own tilt angle, preventing the silicon photonics multichannel chip 700 from dislodging. It should be noted that the thickness of the silicon photonics multichannel chip 700 is similar to that of a conventional circuit board, making direct clamping from both sides inconvenient. This embodiment, by employing a structure design where the first clamping part 102 presses from the side, effectively maintains the fixation of the silicon photonics multichannel chip 700.

[0034] In practical applications, multiple first clamping parts 102 can be set to fix the silicon photonics multichannel chip 700. Furthermore, the first clamping parts 102 can be driven by cylinders or other driving structures.

[0035] In some embodiments of this application, a pressure sensor is provided on the bottom surface of the first positioning recess of the first fixture 101 to detect whether the silicon photonics multichannel chip 700 is completely attached to the first positioning recess. It is understood that, since the silicon photonics multichannel chip 700 is pressed down by the first clamping part 102, when it is completely attached to the first positioning recess, the pressure value detected by the pressure sensor should be the same as the set pressure value. If the pressure value is less than the set pressure value, there will inevitably be a situation where the attachment is not complete. If the silicon photonics multichannel chip 700 shifts during coupling, it will lead to coupling failure. Therefore, this embodiment uses a pressure sensor to determine this, which can effectively prevent the silicon photonics multichannel chip 700 from shifting during the coupling process.

[0036] In some embodiments of this application, a cooling device is provided on the first fixture 101 for cooling the silicon photonics multichannel chip 700. Since the silicon photonics multichannel chip 700 generates a large amount of heat when it is powered on for detection during coupling, this embodiment effectively solves the heat generation problem during power-on detection by providing a cooling device.

[0037] Specifically, the cooling device uses gas cooling, and its gas ducts can be flexibly configured as needed.

[0038] Reference Figure 2 and Figure 3In some embodiments of this application, the second positioning part includes a second fixture 201, a third fixture 202, a negative pressure device, and a loading drive. The second fixture 201 has a recessed second positioning recess 2011, configured to accommodate the transmitting fiber optic array 701. The third fixture 202 has a recessed third positioning recess 2021, configured to accommodate the receiving fiber optic array 702. The negative pressure device has negative pressure holes in both the second and third positioning recesses 2011 and 2021. The loading drive is connected to the second fixture 201 and the third fixture 202, and is used to control the movement of the second fixture 201 and the third fixture 202 along a first direction. More specifically, the feeding drive controls the second fixture 201 and the third fixture 202 to move towards each other and directly above the first feeding mechanism 100 to achieve the second positioning part switching to the first state, and controls the second fixture 201 and the third fixture 202 to move in the opposite direction to both sides of the first feeding mechanism 100 along the first direction to achieve the second positioning part switching to the second state.

[0039] During loading, the operator places the transmitting fiber array 701 and the receiving fiber array 702 into the second positioning recess 2011 and the third positioning recess 2021 respectively, and fixes them by adsorption through the negative pressure hole. The multi-core fiber connector 703 is placed on the first positioning part for fixation. After the coupling mechanism 300 removes the transmitting fiber array 701 and the receiving fiber array 702, the loading drive controls the second fixture 201 and the third fixture 202 to move in the opposite direction to both sides of the first loading mechanism 100 so that the coupling mechanism 300 can perform the coupling operation next.

[0040] Reference Figure 4 and Figure 5 In some embodiments of this application, the coupling mechanism 300 is provided with a suction-clamping integrated claw 301, which is configured to first adsorb the fiber array under negative pressure and then clamp the fiber array. In the direction from top to bottom, the suction-clamping integrated claw 301 is inclined to the side closer to the first feeding mechanism 100.

[0041] As described in the foregoing embodiments, the transmitting fiber array 701 and the receiving fiber array 702 are embedded in the second positioning recess 2011 and the third positioning recess 2021, and are fixed by negative pressure adsorption, making it inconvenient for the coupling mechanism 300 to dock and remove them. With the structural configuration of this embodiment, after the coupling mechanism 300 docks with the transmitting fiber array 701 and the receiving fiber array 702, the negative pressure device is first turned off, and then the coupling mechanism 300 activates the negative pressure to extract the transmitting fiber array 701 and the receiving fiber array 702, and then clamps and fixes them for removal. This allows for quick and precise clamping of the transmitting fiber array 701 and the receiving fiber array 702.

[0042] Meanwhile, since there are two coupling mechanisms 300, located on both sides of the first feeding mechanism 100 along the first direction, and the transmitting fiber array 701 and the receiving fiber array 702 are in a close proximity to each other, this embodiment tilts the suction and clamping integrated claw 301 towards the side closer to the first feeding mechanism 100, so that the two coupling mechanisms 300 can approach and clamp the transmitting fiber array 701 and the receiving fiber array 702 in a relatively compact space, avoiding mutual interference between the main parts of the coupling mechanisms 300.

[0043] In some embodiments of this application, the coupling mechanism 300 is further provided with a UV curing module 302, which is located on the side of the suction-clamp integrated gripper 301 away from the first feeding mechanism 100 along the first direction.

[0044] It is understood that the two coupling mechanisms 300 in this embodiment need to perform coupling of one fiber array respectively. The proximity of the two fiber arrays makes curing inconvenient. This embodiment effectively cures the UV adhesive at the coupling position by providing a UV curing module 302 on the outside of the integrated clamping jaws 301. It should be noted that the UV curing module 302 can use existing UV curing structures, such as UV curing lamps, which will not be described in detail here.

[0045] Reference Figure 6 In some embodiments of this application, the dispensing mechanism 400 is provided with two dispensing modules 402. The two dispensing modules 402 are configured to simultaneously dispense adhesive at the coupling positions of the transmitter fiber array 701 and the receiver fiber array 702. Specifically, the distance between the two dispensing modules 402 is consistent with the distance between two positions on the silicon photonics multichannel chip 700 where the transmitter fiber array 701 and the receiver fiber array 702 need to be coupled, thereby dispensing adhesive at one coupling position respectively. Furthermore, the two dispensing modules 402 are configured with independent lifting drives for independent height adjustment, which facilitates dispensing adhesive at one coupling position individually according to the operational requirements.

[0046] Reference Figure 1 , Figure 6 and Figure 7 In some embodiments of this application, the dual-FA silicon photonics multichannel chip coupling device further includes a vision inspection mechanism 500, which specifically includes: A horizontal vision module 504 is disposed on both sides of the first feeding mechanism 100 along a first direction and is configured to detect the coupling angle between the transmitting end fiber array 701 and the receiving end fiber array 702. A vertical vision module is disposed above the first feeding mechanism 100 and is configured to detect the coupling position accuracy of the transmitting fiber array 701 and the receiving fiber array 702.

[0047] During operation, the vertical vision module can first identify two coupling positions on the silicon photonics multichannel chip 700. After determining the coupling positions, the coupling mechanism 300 is controlled to perform the coupling operation. During the coupling process, the horizontal vision module 504 observes from both sides whether a fiber array is parallel and attached to the silicon photonics multichannel chip 700. At the same time, the vertical vision module is used to determine the positional accuracy of the fiber array, such as by measuring the distance between it and the edge of the silicon photonics multichannel chip 700, and the distance between it and other devices on the silicon photonics multichannel chip 700.

[0048] Reference Figure 6 In some embodiments of this application, a vertical vision module is disposed on a dispensing mechanism 400 and includes at least a first camera 501 and a second camera 502 with different magnifications. Since coupling mechanisms 300 are already disposed on both sides of the first loading mechanism 100, and the dispensing mechanism 400 is located above the first loading mechanism 100, and the vertical vision module also needs to image the silicon photonics multichannel chip 700 downwards, disposing the vertical vision module on the dispensing mechanism 400 simplifies the structural composition. Furthermore, by setting one of the first camera 501 and the second camera 502 as a high-magnification camera, their combination allows for rapid identification of the coupling position and determination of coupling accuracy.

[0049] Furthermore, a laser rangefinder 503 is also provided on the vertical vision module to detect the distance to the coupling position on the silicon photonics multichannel chip 700, so that the coupling mechanism 300 and the dispensing mechanism 400 can confirm the parameters of moving from their respective coordinate points to the coupling position of the silicon photonics multichannel chip 700.

[0050] Reference Figure 2 and Figure 3 In some embodiments of this application, the first positioning part includes a fourth fixture 203 and a pressure plate 204. Specifically, the fourth fixture 203 is recessed to provide a fourth positioning recess, which is configured to accommodate a multi-core fiber optic connector 703. One end of the pressure plate 204 is rotatably connected to one side of the fourth positioning recess, and the other end of the pressure plate 204 is provided with a locking member 2041, which can be connected to the opposite side of the fourth positioning recess to press the multi-core fiber optic connector 703.

[0051] After the operator places the multi-core fiber optic connector 703 into the fourth positioning recess, they can manually rotate the pressure plate 204 to connect it, thus fixing the multi-core fiber optic connector 703 onto the first positioning part. The locking element 2041 can be a hand-tightening nut or other detachable structure.

[0052] Reference Figures 1 to 8 In some embodiments of this application, the dual-FA silicon photonics multichannel chip coupling device includes a platform 600, a first feeding mechanism 100, a second feeding mechanism 200, a coupling mechanism 300, a dispensing mechanism 400, and a vision inspection mechanism 500.

[0053] Combination Figure 2 and Figure 3 The first feeding mechanism 100 is equipped with a first fixture 101 and a first clamping part 102. The first fixture 101 is mounted on the table 600 and is distributed along its length in the front-to-back direction. A first positioning recess is recessed on the upper end face of the first fixture 101. The left-right dimensions of the first positioning recess match the width of the silicon photonics multichannel chip 700, and the recess depth matches the thickness of the silicon photonics multichannel chip 700. A power connection component is provided on the rear side of the first fixture 101. After the silicon photonics multichannel chip 700 is placed in the first positioning recess, the power connection component can perform power connection operations on the silicon photonics multichannel chip 700. The first clamping part 102 is located on the left and right sides of the first positioning recess and is driven by a cylinder to move left and right, used to clamp the silicon photonics multichannel chip 700 after it is placed in. The first fixture 101 is also equipped with an angle adjustment structure.

[0054] Combination Figure 2 and Figure 3 The second feeding mechanism 200 is mounted on the first fixture 101. Specifically, a fourth fixture 203 is fixedly mounted at the front end of the first fixture 101. A pressure plate 204 is rotatably connected to the left side of the fourth fixture 203, and the pressure plate 204 can be connected to the right side of the fourth fixture 203 to cooperate in pressing the multi-core fiber optic connector 703. The second feeding mechanism 200 has a second fixture 201 and a third fixture 202 respectively mounted on the left and right sides of the first fixture 101. The second fixture 201 and the third fixture 202 are driven to move left and right by a cylinder, thereby switching back and forth between the position above the first fixture 101 and the positions on both sides of the first fixture 101. Along the front-back direction, the distance from the second fixture 201 and the third fixture 202 to the fourth fixture 203 is less than the length of the connecting fiber between the transmitting fiber array 701, the receiving fiber array 702 and the multi-core fiber optic connector 703.

[0055] Combination Figure 4 and Figure 5A slide rail is provided on the table 600 along the left-right direction on the rear side of the first fixture 101, and two coupling mechanisms 300 are mounted on the slide rail. The coupling mechanism 300 is equipped with a six-dimensional adjustment structure. The two coupling mechanisms 300 are provided with a suction-clip integrated gripper 301 and a UV curing module 302 along the direction of mutual proximity. The UV curing module 302 is located on the side of the suction-clip integrated gripper 301 opposite to the first fixture 101.

[0056] Combination Figures 7 to 8 The dispensing mechanism 400 is equipped with a gantry 401, which is configured as a three-dimensional moving structure. Two dispensing modules 402 are installed at the transmission end of the gantry 401 (i.e., capable of three-dimensional movement adjustment). Both dispensing modules 402 are equipped with lifting structures for independent lifting operations. The distance between the two dispensing modules 402 matches the distance between two positions on the silicon photonics multichannel chip 700 where the transmitter fiber array 701 and the receiver fiber array 702 need to be coupled.

[0057] Combination Figure 1 , Figure 7 and Figure 8 The visual inspection mechanism 500 has horizontal visual modules 504 installed on both sides of the first fixture 101. The horizontal visual modules 504 have observation cameras positioned along the left-right direction. These cameras are used to horizontally observe the coupling positions of the transmitting fiber array 701 and the receiving fiber array 702 to determine the coupling status. Furthermore, the horizontal visual modules 504 can use refractive lenses to adjust the line-of-sight path to avoid interference. The visual inspection mechanism 500 also has a vertical visual module installed at the transmission end of the gantry 401. The vertical visual module has a first camera 501 and a second camera 502 arranged side-by-side, one being a high-magnification camera and the other a standard camera. The visual inspection mechanism 500 also has a rear observation camera 505 installed behind the first fixture 101. Additionally, the vertical visual module is equipped with a laser rangefinder 503.

[0058] Based on the structural design of the above embodiments, embodiments of this application also propose a coupling method for a dual-FA silicon photonics multichannel chip 700, comprising: Move the second fixture 201 and the third fixture 202 to the left and right sides, and load the silicon photonics multichannel chip 700 onto the first fixture 101 for fixation; Then move the second fixture 201 and the third fixture 202 closer together, and load the transmitting fiber array 701, the receiving fiber array 702 and the multi-core fiber connector 703 connecting the two into the second fixture 201, the third fixture 202 and the fourth fixture 203, and fix them. The two coupling mechanisms 300 are controlled to clamp the transmitting fiber array 701 and the receiving fiber array 702 respectively, and then the second fixture 201 and the third fixture 202 are moved to the sides. Combined with the glue dispensing mechanism 400, the transmitting fiber array 701 and the receiving fiber array 702 are coupled at the same time.

[0059] It should be noted that the visual inspection agency 500 can set the intervention timing as needed during the above process, which will not be described in detail here. The coupling process of the fiber optic array can refer to the relevant settings of existing technologies, such as pre-coupling judgment, primary adhesive coupling, and secondary adhesive final curing.

[0060] The dual-FA silicon photonics multi-channel chip 700 coupling method of this embodiment, by applying the aforementioned dual-FA silicon photonics multi-channel chip coupling device, can simultaneously fix the transmitter fiber array 701, the receiver fiber array 702 and the multi-core fiber connector 703, and couple the two fiber arrays at the same time. This avoids the problem of the other fiber array following and causing an impact when only one fiber array is clamped for coupling, and solves the problem that traditional processes cannot meet the dual-FA coupling requirements.

[0061] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A dual-FA silicon optical multi-channel chip coupling device, characterized by, include: The first feeding mechanism is configured to fix silicon photonics multichannel chips; The second feeding mechanism includes a first positioning part and a second positioning part. The first positioning part is configured to fix a multi-core fiber optic connector, and the second positioning part is configured to simultaneously fix a transmitting fiber optic array and a receiving fiber optic array. The second positioning part has a first state and a second state. In the first state, the second positioning part is located directly above the first feeding mechanism. In the second state, the second positioning part is removed from the area directly above the first feeding mechanism. Two coupling mechanisms are disposed on both sides of the first feeding mechanism along a first direction, and the coupling mechanisms are configured to perform fiber array coupling operations at the transmitting end and fiber array coupling operations at the receiving end, respectively. A dispensing mechanism configured to perform a dispensing operation; The two coupling mechanisms respectively perform fiber array picking at the transmitting end and fiber array picking at the receiving end when the second positioning part is in the first state, and respectively perform coupling operation when the second positioning part is in the second state. The second positioning part includes: a second fixture, the second fixture having a recessed second positioning recess configured to accommodate the transmitting fiber array; a third fixture, the third fixture having a recessed third positioning recess configured to accommodate the receiving fiber array; a negative pressure device, the negative pressure device having negative pressure holes in both the second and third positioning recesses; and a feeding drive, the feeding drive being connected to the second fixture and the third fixture, the feeding drive being configured to control the second fixture and the third fixture to move along the first direction; wherein, in the first state, the second fixture and the third fixture are located directly above the first feeding mechanism, and in the second state, the second fixture and the third fixture are located on both sides of the first feeding mechanism along the first direction.

2. The dual-FA silicon optical multi-channel chip coupling device of claim 1, wherein, The first feeding mechanism includes: A first fixture, wherein a first positioning recess is provided in the first fixture, and the first positioning recess is configured to accommodate the silicon photonics multichannel chip; A first clamping part is slidably connected to the first fixture. A clamping wall is provided on the side of the first clamping part near the first positioning recess. The clamping wall has an inclination angle away from the first positioning recess in a top-to-bottom direction. The clamping wall is configured to slide toward the first positioning recess to press the silicon photonics multichannel chip.

3. The dual-FA silicon optical multi-lane chip coupling device of claim 1, wherein, The coupling mechanism is equipped with a suction and clamping integrated claw, which is configured to first adsorb the fiber array under negative pressure and then clamp the fiber array. In the direction from top to bottom, the suction and clamping integrated claw is inclined towards the side closer to the first feeding mechanism.

4. The dual-FA silicon optical multi-channel chip coupling device of claim 3, wherein, The coupling mechanism is also provided with a UV curing module, which is located on the side of the suction-grip integrated claw away from the first feeding mechanism along the first direction.

5. The dual-FA silicon photonics multi-channel chip coupling device according to claim 1, characterized in that, The dispensing mechanism is provided with two dispensing modules, which are configured to simultaneously dispense adhesive at the coupling positions of the transmitting fiber array and the receiving fiber array.

6. The dual-FA silicon photonics multi-channel chip coupling device according to claim 1, characterized in that, The dual-FA silicon photonics multi-channel chip coupling device further includes a vision inspection mechanism, which comprises: A horizontal vision module is disposed on both sides of the first feeding mechanism along the first direction and is configured to detect the coupling angle between the transmitting fiber array and the receiving fiber array. A vertical vision module is disposed above the first feeding mechanism and configured to detect the coupling position accuracy of the transmitting fiber array and the receiving fiber array.

7. The dual-FA silicon photonics multi-channel chip coupling device according to claim 6, characterized in that, The vertical vision module is disposed on the dispensing mechanism and includes at least a first camera and a second camera with different magnification.

8. The dual-FA silicon photonics multi-channel chip coupling device according to claim 1, characterized in that, The first positioning unit includes: A fourth fixture is provided with a fourth positioning recess, which is configured to accommodate the multi-core fiber optic connector. A pressure plate, one end of which is rotatably connected to one side of the fourth positioning recess, and the other end of which is provided with a locking member that can be connected to the opposite side of the fourth positioning recess to press the multi-core fiber optic connector.

9. A dual-FA silicon photonics multi-channel chip coupling method, characterized in that, The dual-FA silicon photonics multichannel chip coupling device according to any one of claims 1 to 8 comprises: The silicon photonics multichannel chip is loaded into the first loading mechanism; Adjust the second positioning part to the first state, and load the transmitter fiber array, receiver fiber array and the multi-core fiber connector connecting the two into the second loading mechanism. The transmitting fiber array and the receiving fiber array are respectively clamped by the two coupling mechanisms, and the second positioning part is adjusted to the second state, while the transmitting fiber array and the receiving fiber array are coupled at the same time.

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