PCB gluing control method, device and storage medium

Abstract

The application discloses a PCB gluing control method and device and a storage medium. The method comprises the following steps: a reference PCB image of a reference PCB to be calibrated for gluing is captured by a visual acquisition device placed on a processing platform, and a teaching device shooting position is obtained; according to a PCB position matrix and the teaching device shooting position, the target device shooting positions corresponding to each target PCB on the processing platform are calculated; a teaching gluing operation track for the reference PCB image is obtained, and the target gluing path physical coordinates corresponding to each target PCB are determined according to the teaching gluing operation track and the target device shooting positions; and according to the determined target device shooting positions and the corresponding target gluing path physical coordinates, a gluing execution mechanism is controlled to perform gluing processing on the corresponding target PCB. Thus, the repeated operation of traditional manual board-by-board teaching is eliminated, the batch initialization time is significantly shortened, and the high consistency and stability of the gluing path positioning accuracy in batch production are ensured.

Description

Technical Field

[0001] This application relates to the field of precision adhesive coating technology, and in particular to a PCB adhesive coating control method, equipment and storage medium. Background Technology

[0002] In the mass production of printed circuit boards (PCBs), the adhesive application process is a crucial step in ensuring the robustness of component assembly and improving the product's sealing and reliability. Currently, the mainstream control method for platform-based batch PCB adhesive application operations in the industry generally relies on the traditional manual coordinate teaching mode. This requires operators to control the adhesive application actuator (such as a robotic arm) through a teaching pendant, recording the physical positions (such as XY coordinates) of the start and end points of each predetermined adhesive application path (usually a straight line covering the PCB edge or critical area) in the equipment coordinate system for each PCB. This process needs to be repeated for every PCB in the production batch.

[0003] However, traditional teaching methods have significant drawbacks in multi-PCB batch production scenarios, severely restricting production efficiency and accuracy. First, the operation process is extremely cumbersome and inefficient; for a single batch of a large number of PCBs, operators must manually teach all glue application lines (e.g., straight lines or broken lines) for each PCB, resulting in significant time consumption for single model changeovers or batch initializations, becoming a bottleneck for rapid production line changeovers and efficient operation. Second, the consistency and stability of glue application accuracy are difficult to guarantee; the teaching process highly depends on the operator's experience and proficiency. Even for the same PCB, repeated teaching can produce significant deviations in the glue application path position, affecting product quality consistency. Summary of the Invention

[0004] This application provides a PCB adhesive coating control method, device, storage medium, and program product to at least solve one of the above-mentioned technical problems.

[0005] In a first aspect, embodiments of this application provide a PCB adhesive coating control method, comprising: capturing a reference PCB image of a reference PCB to be calibrated for adhesive coating on a processing platform using a vision acquisition device, and obtaining the image capture position of a teaching device when the vision acquisition device captures the reference PCB image; calculating the target device image capture position corresponding to each target PCB on the processing platform based on a PCB position matrix and the image capture position of the teaching device; the PCB position matrix defining the positional arrangement relationship between the reference PCB and each target PCB on the processing platform; acquiring a teaching adhesive coating operation trajectory for the reference PCB image, and determining the target adhesive coating path physical coordinates corresponding to each target PCB based on the teaching adhesive coating operation trajectory and the image capture positions of each target device; and controlling an adhesive coating execution mechanism to perform adhesive coating processing on the corresponding target PCB based on the determined image capture positions of each target device and the corresponding target adhesive coating path physical coordinates.

[0006] Secondly, embodiments of this application provide a storage medium storing one or more programs including execution instructions, which can be read and executed by electronic devices (including but not limited to computers, servers, or network devices) to perform any of the PCB coating control methods described above.

[0007] Thirdly, a computer device is provided, comprising: at least one processor, and a memory communicatively connected to the at least one processor, wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform any of the PCB coating control methods described above in this application.

[0008] Fourthly, embodiments of this application also provide a computer program product, the computer program product including a computer program stored on a storage medium, the computer program including program instructions, which, when executed by a computer, cause the computer to perform any of the above-described PCB adhesive coating control methods.

[0009] The beneficial effects of the embodiments of this application are as follows: By using a vision system to acquire a single image of a reference PCB and teach it the adhesive application trajectory, and combining this with the physical positional arrangement represented by a predefined PCB position matrix, the system automatically calculates the target equipment image positions for all target PCBs on the processing platform to determine the visual positioning points. Based on the spatial mapping relationship of the reference adhesive application trajectory, it batch-generates precise adhesive application paths for each target PCB in the equipment coordinate system. This eliminates the repetitive operation of traditional manual board-by-board teaching, significantly shortening batch initialization time. Furthermore, since all target paths strictly originate from the same set of high-precision teaching data and achieve consistent replication through mathematical spatial transformation, human error is fundamentally eliminated, ensuring high consistency and stability of adhesive application path positioning accuracy in mass production. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 A flowchart illustrating an example of a PCB adhesive coating control method according to an embodiment of this application is shown; Figure 2 A flowchart illustrating an example of determining the physical coordinates of a target adhesive application path according to an embodiment of this application is shown. Figure 3 A flowchart illustrating an example of a control glue-applying actuator performing glue-applying treatment on a corresponding target PCB according to an embodiment of this application is shown. Figure 4 A flowchart illustrating an example of a teaching adhesive application operation trajectory for acquiring a PCB image according to an embodiment of this application is shown. Figure 5 A schematic diagram of an example processing platform suitable for array-type PCB coating is shown. Figure 6 This diagram illustrates an example of the effect of the adhesive application path on a PCB. Figure 7 A flowchart illustrating an example of a PCB adhesive coating control method according to an embodiment of this application is shown; Figure 8A This diagram illustrates the data structure of the PLC storing the photographing location and the glue application control parameters according to an embodiment of this application. Figure 8B A schematic diagram illustrating the storage of Z-axis adhesive application position and system parameters by a PLC according to an embodiment of this application is shown; Figure 9This is a schematic diagram of the structure of an embodiment of the electronic device of this application. Detailed Implementation

[0012] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0013] It should also be noted that, in this document, the terms "comprising" or "including" include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0014] It should be noted that current PCB coating systems lack the necessary production flexibility and intelligence. Coating path parameters (coordinate points) and process parameters such as speed and line width are often fixed in the teaching program. When processing different PCB batches, or when there are slight differences in coating requirements or individual dimensional deviations (e.g., ±0.1mm) between different PCBs within the same batch, the entire coating path must be re-taught, a time-consuming and labor-intensive process, making it impossible to quickly and flexibly adjust the parameters.

[0015] Furthermore, current technologies often require individual teaching of each PCB in a single batch when controlling the adhesive application of large quantities of PCBs. This necessitates calling the taught path separately for each PCB, making truly efficient batch synchronous processing difficult. As the number of PCBs increases, the accumulated teaching time for each PCB significantly extends the overall production cycle time (e.g., with more than 10 PCBs, the cycle time per PCB may exceed 5 seconds), failing to meet the stringent efficiency and response speed requirements of modern highly automated production lines (e.g., 1.5-2 seconds per PCB). Each time a PCB model is changed, the entire adhesive application path must be re-taught. For multi-product mixed-line production, a single teaching session can take 30-60 minutes, severely restricting changeover efficiency.

[0016] Furthermore, PCBs inevitably experience positional deviations on the processing platform, and traditional teaching methods cannot adequately compensate for these deviations, easily leading to adhesive application misalignment. Specifically, the teaching process is significantly affected by the operator's experience; repeated teaching paths for the same PCB can deviate by up to ±0.05mm, and cannot compensate for rotational deviations during PCB placement (such as ±1°), resulting in adhesive breaks or overflows at corner joints in straight adhesive application.

[0017] It should be understood that the above description of the relevant technologies is intended only to help the public better understand the inventive spirit and motivation of this application, and is not intended to limit this application. Furthermore, the technical solutions described in the above-mentioned relevant technologies are not prior art, and may also be undisclosed technical solutions, such as those under research or in the laboratory stage.

[0018] The technical solutions in this application, including the collection, storage, use, processing, transmission, provision, and disclosure of users' personal information, comply with relevant laws and regulations and do not violate public order and good morals.

[0019] Figure 1 A flowchart illustrating an example of a PCB adhesive coating control method according to an embodiment of this application is shown.

[0020] Regarding the execution subject of the method in the embodiments of this application, it can be any controller or processor with computing or processing capabilities. In some examples, the method in the embodiments of this application can be integrated and configured in an electronic device or terminal through software, hardware or a combination of software and hardware, and the type of terminal or electronic device can be diverse, such as mobile phone, tablet computer, desktop computer or vehicle terminal, etc.

[0021] For example, the execution subject of the method in this application embodiment can be a PCB coating control platform. By establishing a visual calibration model of a reference PCB and combining it with the PCB position matrix, the spatial coordinates of multiple target PCBs are calculated and the coating path is mapped in batches. This allows the reference trajectory obtained from a single teaching session to be automatically applied to the entire PCB array, improving the efficiency and stability of the coating operation.

[0022] like Figure 1 As shown, in step S110, a reference PCB image of the reference PCB to be coated and calibrated is captured by a vision acquisition device and the position of the teaching device when the vision acquisition device captures the reference PCB image is obtained.

[0023] In some implementations, a high-resolution reference image of a reference PCB placed at a designated reference position on the coating platform is acquired by using a vision acquisition device (e.g., an industrial camera or a vision module with positioning function) positioned above the coating platform. Specifically, the vision acquisition device and the coating teaching device (e.g., a teaching robot arm) are in the same coordinate system, or a stable coordinate correspondence can be established after coordinate calibration. Simultaneously with capturing the reference PCB image, the system records the spatial attitude parameters of the vision acquisition device at the moment of capture, i.e., the image capture position of the teaching device, including its translational position and attitude angle information (e.g., X, Y, Z axis coordinates and rotation angle) in the device coordinate system. This establishes a correlation between the visual image coordinates and the device coordinates.

[0024] In step S120, the target device's photographing position corresponding to each target PCB on the processing platform is calculated based on the PCB position matrix and the photographing position of the teaching device.

[0025] Here, the PCB position matrix defines the positional arrangement between the reference PCB and each target PCB in the processing platform, such as row and column spacing, offset direction, inter-board spacing, and relative rotation angle. By using the photographed position of the reference PCB as a benchmark, and based on the position transformation parameters in the matrix (which may include translation, rotation, mirroring, etc.), the corresponding photographed position of each target PCB in the device coordinate system on the processing platform is calculated. Thus, through the position matrix deduction mechanism, the spatial positions of multiple PCBs can be batch-derived without repeatedly photographing and calibrating each PCB, significantly reducing manual intervention and teaching time.

[0026] In step S130, the teaching adhesive application operation trajectory for the reference PCB image is obtained, and the physical coordinates of the target adhesive application path corresponding to each target PCB are determined according to the teaching adhesive application operation trajectory and the photo-taking position of each target device.

[0027] After calculating the target device's photographic location, the adhesive application trajectory is taught on a reference PCB image using a teaching device. For example, the teaching operation can be performed in a manual teaching mode with a human-computer interaction interface, where the operator marks the reference PCB image in the visual interface to record the start and end points of the adhesive application path and its shape. Alternatively, the teaching operation can be combined with intelligent algorithms, such as intelligently identifying key points in the reference PCB image and generating corresponding teaching adhesive application trajectories.

[0028] Subsequently, based on the calculated image positions of each target device, the teaching trajectory undergoes spatial coordinate transformation and position mapping. Specifically, according to the spatial transformation relationship between the image positions of the target devices and the image positions of the teaching devices, translation and rotation operations are performed on all coordinate points of the teaching adhesive application operation trajectory to ensure that they accurately fall on the corresponding areas of the target PCB, thereby obtaining the corresponding physical coordinates of the target adhesive application path. Thus, by combining the teaching trajectory with the PCB position matrix, the teaching process is transformed from single-board teaching to automatic generation of multi-board paths, avoiding the time consumption and error accumulation caused by repeated teaching through an automatic mapping mechanism.

[0029] In step S140, based on the determined photographic positions of each target device and the corresponding physical coordinates of the target adhesive application path, the adhesive application execution mechanism is controlled to apply adhesive to the corresponding target PCB.

[0030] In some implementations, these path coordinates are sent to the control module of the gluing actuator (such as a three-axis or multi-axis robotic arm), which then completes the gluing operation block by block according to the predetermined path. Furthermore, in array-type gluing processing scenarios, the execution sequence can be optimized based on calculation results to achieve continuous gluing across boards or parallel regional operations, further improving production line cycle time and equipment utilization.

[0031] This application establishes an automated glue application control system for multiple PCBs completed in a single teaching cycle. It utilizes visual pose calibration as its core support, spatial matrix calculation as its computational basis, and trajectory mapping as its control core, forming a fully automated closed-loop process from single-board teaching to multi-board execution. This achieves high-precision, high-consistency, and high-efficiency control for batch PCB glue application operations, significantly improving the automation level and production efficiency of the production line.

[0032] Figure 2 A flowchart illustrating an example of determining the physical coordinates of a target adhesive application path according to an embodiment of this application is shown.

[0033] like Figure 2 As shown, in step S210, the visual calibration parameters of the visual acquisition device are obtained, and the teaching glue application operation trajectory is converted according to the visual calibration parameters and the photo-taking position of the teaching device to obtain the corresponding physical coordinates of the teaching glue application path in the global coordinate system of the processing platform.

[0034] Specifically, the visual calibration parameters of the visual acquisition device can include the camera's intrinsic parameters (such as focal length, principal point coordinates, distortion coefficients, etc.) and extrinsic parameters (i.e., the spatial pose relationship between the camera coordinate system and the processing platform coordinate system). For example, these parameters are obtained during the device initialization phase using methods such as calibration board photography, checkerboard calibration, or laser interferometry calibration to ensure high accuracy and long-term stability of the calibration results.

[0035] After visual calibration, the teaching adhesive application trajectory is transformed from the visual coordinate system of the teaching image point to the global coordinate system of the processing platform, based on the calibration parameters and the image capture position of the teaching pendant. Specifically, after the operator completes the teaching of the adhesive application trajectory for the reference PCB, the coordinate point set of this trajectory in the visual coordinate system is recorded. Then, combining the visual calibration parameters and the image capture pose of the teaching pendant, the transformation matrix of the visual coordinate system relative to the platform's global coordinate system is calculated, thereby obtaining the physical coordinates of the teaching adhesive application path in the platform's global coordinate system. Thus, through coordinate transformation based on the visual calibration parameters and the image capture position of the teaching pendant, the teaching adhesive application trajectory obtains a definite physical expression in the global coordinate system of the processing platform, achieving a precise mapping from the local space of the equipment to the global processing space.

[0036] In some examples of embodiments of this application, the teaching adhesive application operation trajectory is transformed into coordinates based on visual calibration parameters to generate local path physical coordinates with the teaching device's photographing position as the reference. Specifically, the data points of the teaching adhesive application operation trajectory (e.g., image pixel coordinates) are input into the calibration transformation model. Based on the visual calibration parameters, the trajectory data is transformed from the local coordinate system of the teaching device into a local path physical coordinate system with the teaching device's photographing position as the reference. At this time, the obtained local path physical coordinates not only reflect the path spatial distribution of the teaching device near the photographing position, but also maintain the spatial accuracy and posture characteristics during the teaching process, establishing a spatial coupling relationship between the adhesive application trajectory and the photographing pose.

[0037] Then, the physical coordinates of the image capture point of the teaching pendant in the platform reference coordinate system of the processing platform are determined. These coordinates describe the precise position of the optical center or end effector of the teaching pendant in the platform's global coordinate system when performing visual imaging. For example, the spatial calibration relationship between the visual acquisition device and the processing platform can be used to directly convert the image capture pose data of the teaching pendant into platform reference coordinates; alternatively, during operation, the precise position of the image capture point in the platform coordinate system can be calculated in real time by using positioning markers (such as calibration points, QR codes, or feature point arrays) on the visual recognition platform, combined with the teaching pendant's own pose feedback data.

[0038] Furthermore, based on the physical coordinates of the image capture point, the physical coordinates of the local path are transformed to the platform's reference coordinate system to generate the corresponding global teaching adhesive application path physical coordinates for the processing platform. Specifically, using the physical coordinates of the image capture point as spatial anchor points, the physical coordinates of the local path are transformed into the global coordinate system of the processing platform. For example, a transformation matrix is ​​established between the visual coordinate system of the image capture point and the platform's global coordinate system. This matrix is ​​defined by the spatial pose information of the image capture point (including translation vectors and rotation matrices). Subsequently, spatial transformation calculations are performed on each trajectory point in the local path coordinates, mapping the entire local path to the platform's global coordinate system. Thus, through coordinate transformation based on the physical coordinates of the image capture point, a precise mapping of the adhesive application trajectory from local coordinates to the platform's global coordinates is achieved.

[0039] In step S220, the photographing position deviation of each target device photographing position relative to the photographing position of the teaching device is determined, and the physical coordinates of the target adhesive path corresponding to each target PCB are determined accordingly in combination with the physical coordinates of the teaching adhesive path.

[0040] In some implementations, the spatial photographing position deviation is calculated based on the relationship between the photographing position of each target device and the photographing position of the reference teaching device. For example, the photographing position deviation is used to characterize the pose difference of the target PCB relative to the reference PCB in the processing platform coordinate system, including position offset (ΔX, ΔY, ΔZ) and attitude offset (ΔRx, ΔRy, ΔRz).

[0041] For example, a transformation matrix is ​​obtained by performing matrix operations on the reference and target image pose matrices. This matrix can be expressed through a combination of translation, rotation, or affine transformations, thus fully describing the relative pose of the target PCB in space. For scenarios with multiple PCB arrays, the image positions of each target are automatically generated based on the PCB position matrix, thereby batch calculating their corresponding deviation parameters and completing efficient data derivation.

[0042] After obtaining the photographic position deviation, the physical coordinates of the taught adhesive application path are used as a reference path template. Combining the photographic position deviation of each target PCB, corresponding spatial transformation operations are performed on the taught path coordinates to obtain the physical coordinates of the target adhesive application path corresponding to that target PCB. Specifically, the offset is used for spatial translation of the path, and the attitude deviation is used for directional rotation of the path, thereby matching the path in space with the actual position of the target PCB. Furthermore, after the path calculation is completed, the system can also perform geometric consistency verification on the results, verifying whether key features such as path endpoints, direction vectors, and adhesive line lengths are consistent with the reference path, ensuring that the finally generated target path meets the adhesive application requirements.

[0043] This application's embodiments achieve automated coordinate transformation and precise mapping from the teaching trajectory of a reference PCB to the adhesive application path of multiple target PCBs. The introduction of visual calibration parameters ensures the accurate positioning of the teaching trajectory in the platform's global coordinate system, while the calculation of the image position deviation enables spatial reuse of the trajectory across multiple PCBs. Thus, while maintaining geometric accuracy, it significantly improves path generation efficiency and batch operation consistency, ensuring the spatial accuracy and repeatability of the adhesive application path across the entire PCB array.

[0044] Figure 3 An example operation flowchart is shown for controlling the adhesive application actuator to perform adhesive application on a corresponding target PCB according to an embodiment of this application.

[0045] like Figure 3 As shown, in step S310, the mobile vision acquisition device is controlled sequentially according to the photo-taking position of each target device.

[0046] Here, the visual acquisition device can be an industrial camera, vision module, or intelligent sensing unit with pose feedback function installed on the end effector of a robotic arm or on a movable track, used to perform positioning recognition and adhesive application path alignment. In some embodiments, a movement path planning instruction is generated based on the spatial coordinates (including position and posture information) of the image capture position of each target device, so that the visual acquisition device moves to each target position one by one along a preset motion trajectory.

[0047] In step S320, when the visual acquisition device is detected to have moved to the first target device's photo-taking position, the adhesive application execution mechanism is controlled to perform adhesive application on the first target PCB to be coated, based on the physical coordinates of the first target adhesive application path corresponding to the first target device's photo-taking position.

[0048] In some implementations, the adhesive application actuator can be a three-axis or multi-axis robotic arm with an adhesive dispensing device, a dispensing head, or a spraying mechanism. The control system generates corresponding motion trajectories and adhesive application control commands based on the coordinate sequence of the physical coordinates of the target adhesive application path, guiding the actuator to move precisely along the target path. Furthermore, to ensure the uniformity and reliability of the adhesive application quality, the execution speed and adhesive dispensing volume can be dynamically adjusted during execution based on feedback signals (such as feedback from displacement sensors or flow monitoring devices) to address the process requirements or surface height differences of different path segments.

[0049] Preferably, to ensure spatial alignment between the path and the target PCB, attitude verification or visual calibration can be performed before execution to ensure that the adhesive application trajectory is consistent with the actual geometric position of the PCB. More specifically, an image of the working PCB of the first target PCB is acquired, and a reference PCB image is compared with the working PCB image to identify the attitude deviation information of the first target PCB. The attitude deviation information includes the position offset and / or rotation angle deviation of the PCB.

[0050] Here, the working PCB image is a visual image reflecting the current placement state of the target PCB, including its actual position, angle, and edge features on the processing platform. By comparing and matching this working PCB image with the reference PCB image acquired during the teaching phase, various feature extraction algorithms (such as SIFT, ORB, or SURF feature matching algorithms) can be used to identify key point features in the two images. Furthermore, by calculating the spatial correspondence between feature points, the pose deviation information of the target PCB relative to the reference PCB can be derived. For example, the translational offset of the target PCB relative to the reference PCB on the processing platform can be expressed by the position offset, and the pose rotation difference of the target PCB relative to the reference PCB can be expressed by the rotation angle deviation.

[0051] Then, based on the attitude deviation information, the physical coordinates of the target adhesive application path corresponding to the first target PCB are corrected. For example, based on the translational offset and rotational angle deviation of the PCB, an affine transformation or homogeneous coordinate matrix transformation operation is performed on the path coordinates to achieve synchronous adjustment of the path's spatial position and direction. For instance, when a translational offset of the target PCB in the XY plane is detected, the system translates all coordinate points of the path by the corresponding offset.

[0052] Then, according to the physical coordinates of the corrected adhesive application path, the first target PCB is sprayed with adhesive. Here, the actuator moves point by point according to the corrected path instructions and completes the adhesive application process, ensuring that the actual adhesive application line is consistent with the corrected trajectory. Through the path execution control after attitude calibration, precise adhesive application to the target PCB can still be achieved even when there is an actual attitude error between the target PCB and the reference PCB, realizing adaptive correction control of the adhesive application path to the actual attitude of the PCB.

[0053] In some examples of embodiments of this application, glue application process parameters are obtained and associated with the physical coordinates of at least one corresponding target glue application path. The glue application process parameters include at least one of the following: glue application line width parameter, glue dispensing speed parameter, and pen lifting height parameter.

[0054] Here, the methods for obtaining the adhesive application process parameters can be diverse. For example, operators can input the corresponding parameter values ​​through a human-machine interface during the teaching or process programming phase, or retrieve preset process templates from the process database. For different product models or adhesive application path types (such as straight lines, broken lines, and corner sections), corresponding parameter groups can be set to achieve customized matching between the path and the process.

[0055] The glue application linewidth parameter defines the required width of the glue application line during path execution, determining the glue application pressure and flow rate control strategy. The glue application speed parameter controls the linear speed of the actuator along the target path and can automatically adjust the speed curve based on the path's geometric complexity (such as corners or straight sections) to maintain uniform glue application. The nozzle lift-off height parameter defines the lift-off height of the glue application nozzle at the start and end points of the path or between segments to prevent scratches on the PCB surface or glue stringing in non-coated sections, ensuring smooth path switching. Specifically, it can support the automatic generation of recommended parameters based on different glue application scenarios. Thus, by introducing adjustable process parameters at the path level, dynamic binding between process and geometric path is achieved, enabling the system to automatically match the optimal glue application strategy based on path characteristics.

[0056] Figure 4 A flowchart illustrating an example of a teaching adhesive application operation trajectory for acquiring a PCB image according to an embodiment of this application is shown.

[0057] like Figure 4 As shown, in step S410, at least one path segment is generated on the reference PCB image, and each path segment has a corresponding segment number.

[0058] In some implementations, at least one path segment is generated on a reference PCB image, each path segment having a corresponding segment number to distinguish different adhesive application trajectory segments. The path segment can be represented as a continuous line segment covering a PCB edge, component boundary, or specific protective area, forming a complete adhesive application trajectory network. Specifically, in one example, user interaction is detected based on the reference image to generate at least one path segment on the reference PCB image. Alternatively or additionally, in another example, adhesive application area features in the reference PCB image are identified, and an adapted path segment is generated based on these features, which include at least one of the following: the outline of the PCB solder mask window, the outline of the electronic component package boundary, and the geometric center line of the protective adhesive groove.

[0059] In one implementation example, path segments can be generated based on user interaction. Specifically, the system provides an interactive editing interface, allowing operators to mark the adhesive application path on a reference PCB image by clicking, dragging, connecting lines, or drawing. Upon detecting user input, the system automatically records the path's start, end, and intermediate nodes, and displays the path segment generation process in real time. This approach flexibly addresses irregularly shaped adhesive application areas or special process requirements, combining human experience with visual guidance.

[0060] In another implementation example, path segments are automatically generated based on image recognition algorithms. Specifically, computer vision algorithms such as edge detection, contour recognition, or region segmentation are used to identify the features of the adhesive application area in a reference PCB image. The boundary of the conductive area to be adhesive-coated is defined by the edge contour of the PCB solder mask opening, the boundary contour of the electronic component package is used to form a sealing protective ring on the outer edge of the component, and the geometric center line of the protective adhesive groove is used to automatically generate a path along the center of the adhesive groove.

[0061] By combining user-interactive annotation with automatic feature recognition, the system achieves high-precision generation of adhesive application path segments on reference PCB images, satisfying both the operability of flexible manual editing and the efficiency and consistency of automatic algorithms.

[0062] In step S420, the pixel coordinates of key nodes in each path segment are extracted to obtain the corresponding path segment pixel coordinates.

[0063] After generating the path segments, key nodes are extracted for each path segment. Key nodes describe the geometry and spatial form of the path segment and typically include the path's start point, end point, polygonal corners, and necessary curve control points.

[0064] In some implementations, for path segments generated by user interaction, the node coordinate data (i.e., mouse click points or drawing points) in the user's operation trajectory can be directly obtained; for automatically generated path segments, representative nodes, such as equally spaced sampling points, curvature change points, or feature contour inflection points, can be automatically extracted from the path fitting results. After extraction, the position of each node in the image is recorded as a set of pixel coordinate points.

[0065] In step S430, the path segment pixel coordinates of each path segment are summarized according to the corresponding segment number to form the glue application pixel path coordinates.

[0066] In some implementations, the pixel coordinate data of each path segment are summarized and combined according to the segment number to form a complete adhesive application pixel path coordinate system. For example, the coordinate point sets of each segment are stitched together according to the path segment number to generate a globally continuous trajectory data structure. After summarization, the output adhesive application pixel path coordinate system is the final expression of the taught adhesive application operation trajectory in the reference image space. Thus, a complete and structured path data model is established, realizing a traceable association from local segments to the overall trajectory.

[0067] Figure 5 A schematic diagram of an example processing platform suitable for array-type PCB coating is shown.

[0068] like Figure 5 As shown, the processing platform includes a vision acquisition device, a glue application mechanism, a workpiece support platform, and a control system mounted on the main frame. The vision acquisition device may include an industrial camera and a ring light source assembly for image acquisition and feature recognition of the PCBs within the processing area. The glue application mechanism, located adjacent to the vision acquisition device, can perform dispensing or spraying glue along a preset path under the drive of the control system. The workpiece support platform is used to place multiple PCBs to be processed and can achieve array-style fixed positioning. The control system coordinates the action logic of vision acquisition, path calculation, and glue application execution, realizing automated control of the entire machine. This platform structure allows for simultaneous visual recognition, path coordinate calculation, and glue application of multiple PCBs, providing a basic hardware environment for multi-PCB array-style batch operations.

[0069] Figure 6 This is a schematic diagram illustrating an example of the effect of the adhesive application path on a PCB.

[0070] like Figure 6 As shown, this illustrates a typical adhesive application path for a single PCB, which has several linear adhesive application paths. For example, in the illustrated embodiment, the system identifies and generates four straight adhesive application paths for protective adhesive application along the PCB edge or component package area. Each adhesive application path is defined by a start and end point, and its coordinates can be obtained in the pixel coordinate system of the visual image. These paths can be drawn, identified, and numbered through the teaching function of the vision software or an automatic feature extraction algorithm. Subsequently, the system converts the pixel coordinates into physical coordinates according to the vision calibration parameters, which are then invoked and executed by the adhesive application actuator. In this way, precise planning and high-consistency control of adhesive application lines in key areas of the PCB can be achieved.

[0071] Figure 7 A flowchart illustrating an example of a PCB adhesive coating control method according to an embodiment of this application is shown.

[0072] To overcome the shortcomings of low efficiency and low level of intelligence in current multi-PCB adhesive application processes, this paper provides a control method for linear adhesive application paths by visual positioning and positioning parameter conversion of multiple PCBs. Through visual positioning and automatic coordinate conversion technology, the operation process is simplified and the adhesive application efficiency and accuracy are greatly improved.

[0073] like Figure 7 As shown, in the automatic control scenario of multi-PCB array adhesive application, the PCB adhesive application control method includes the following operations: Multiple PCB loading and positioning planning. Multiple PCBs to be processed are fixed onto the fixture of the processing platform in a preset array pattern, forming a regular or irregular array layout. The system records the platform's reference coordinates and the position information matrix of the PCB array, providing a global reference for subsequent visual positioning and coordinate transformation.

[0074] Single PCB image location teaching. Operators only need to teach the reference PCB to the image location once. By controlling a vision acquisition device (such as an industrial camera) to move to the image area above the reference PCB and adjusting the focus and lighting, a clear reference image is obtained. The system records the device coordinates (such as robotic arm coordinates) of this image location and automatically calculates the corresponding image locations for other PCBs in the same batch based on the array matrix, achieving coordinate matching that is applicable to multiple boards with a single teaching session.

[0075] Glue application line drawing and pixel coordinate acquisition. In the vision software, operators can manually draw or automatically generate glue application paths (such as PCB edge protection glue application lines or component fixing glue application lines) based on reference PCB images. The system automatically extracts the start, end, and direction information of each path, records its pixel coordinate values ​​in the image coordinate system, and forms glue application pixel path data (including the start and end pixel coordinates of each straight line).

[0076] Positioning parameter conversion and glue application path coordinate generation. The system converts the acquired pixel coordinates into local physical coordinates based on the image capture position using visual calibration parameters (including camera intrinsic and extrinsic parameters and the mapping relationship between pixels and physical distance). Subsequently, combined with the reference coordinates of the processing platform and the PCB array position matrix, the local physical coordinates are further converted into global physical coordinates, thereby generating the target glue application path physical coordinates that can be directly called by the glue application actuator (such as a glue application robot arm or glue application nozzle).

[0077] Multi-PCB individual adhesive application is performed. The adhesive application mechanism automatically applies adhesive to each target PCB sequentially according to the generated path coordinates. During the process, a vision acquisition device can detect the actual position image of the PCB in real time and perform minor compensation on the path coordinates to correct any possible placement deviations. The system coordinates the path execution and adhesive dispensing actions through synchronous control, ensuring that each adhesive application line maintains consistent geometric accuracy and process quality on different PCBs.

[0078] Through the above operations, the vision positioning, path calculation and execution control of multi-PCB batch gluing operations are integrated, which can effectively simplify the operation process, avoid teaching board by board, significantly improve production efficiency and gluing accuracy, and is suitable for electronic assembly and packaging manufacturing scenarios with high consistency requirements.

[0079] Figure 8A A schematic diagram of the data structure for storing photographic locations and adhesive application control parameters in a PLC according to an embodiment of this application is shown.

[0080] like Figure 8A As shown, the PLC control module is equipped with a structured data unit for storing the image capture position. Each position unit contains the corresponding X, Y, and Z coordinate values. This position array is used to record the position parameters of the image capture point of the vision acquisition device in the multi-PCB array. For example, "Position [1]" to "Position

[20] " correspond to the image capture position coordinates of different target PCBs.

[0081] When the system performs a vision acquisition operation, the PLC automatically retrieves the coordinates of the corresponding image capture position based on the glue application sequence index, and drives the vision acquisition device to move to the corresponding position to acquire the image via the communication interface. This structured coordinate management method enables automatic indexing and rapid switching between multiple PCB image capture positions, significantly improving vision positioning efficiency and the stability of coordinate retrieval.

[0082] By storing the photo-taking positions and control parameters in a structured manner in the PLC, unified management and efficient retrieval of visual positioning and path control data are achieved. This enables automatic matching and rapid switching of photo-taking, positioning, and gluing instructions at each station in multi-board processing, improving the real-time control performance and intelligence of the system.

[0083] Figure 8B A schematic diagram showing the PLC storing the Z-axis adhesive application position and system parameters according to an embodiment of this application is shown.

[0084] like Figure 8BAs shown, the PLC module is configured with a parameter array for recording the Z-axis height information of the adhesive application actuator. Each Z-axis adhesive application position data is matched with the corresponding path segment or target PCB, indicating the lifting height and working height of the adhesive nozzle at different stations or path segments. The system can automatically select the corresponding Z-axis adhesive application position based on path attributes (such as path start point, end point, corner sections, etc.), realizing dynamic control and real-time switching of nozzle height.

[0085] Furthermore, the PLC incorporates a systematic control parameter structure for unified management of process parameters during the adhesive application process. This includes motion control parameters such as starting speed, idle speed, and adhesive application speed; process timing parameters such as delay time and curing time; spatial calibration parameters such as reference pose and compensation coefficients; and execution accuracy parameters such as adhesive quantity calibration coefficients and dispensing pressure coefficients. By reading these parameters in real-time during the execution phase, the timing logic between visual positioning, path calculation, and adhesive application is coordinated, thereby ensuring the stability of equipment operation and the consistency of process control.

[0086] Through centralized management and real-time access to the above parameters, the speed, glue dispensing volume, and height of the actuator can be automatically adjusted according to different PCB models, path segment characteristics, and adhesive properties. This enables a high degree of integration and configurability of motion control and process parameters in the gluing process, ensuring the consistency of motion accuracy and glue volume of the gluing actuator on different paths and different PCBs. It achieves flexible process control and improves the controllability of the production process and product yield.

[0087] In this embodiment, by introducing a visual positioning and automatic coordinate conversion mechanism, the traditional method of teaching the coating coordinates of each PCB individually is optimized into a batch processing mode based on reference teaching and array calculation. This reduces teaching time by more than 80%, significantly improving production efficiency. This method supports simultaneous positioning of multiple PCBs and individual coating, achieving an efficiency improvement of approximately 50% to 100% depending on the batch size. Operators only need to complete two core operations: photographing the position for teaching and drawing the coating path, to achieve full-process control. Complex coordinate calculations and equipment debugging are unnecessary, significantly lowering the operational threshold.

[0088] Furthermore, the automatic coordinate transformation function in this embodiment effectively eliminates manual teaching errors, ensuring that the adhesive application position deviation can be stably controlled within ±0.1 mm, meeting the requirements of high-precision PCB manufacturing. This method boasts excellent compatibility and flexibility, applicable to PCB batches of different sizes and process requirements. New models can be quickly adapted simply by adjusting the photography position teaching parameters and path drawing scheme, without requiring equipment modifications, and can be seamlessly integrated with existing automated production lines. Therefore, while maintaining accuracy, it achieves significant efficiency improvements and intelligent control, providing an efficient, accurate, and scalable adhesive application control solution for PCB mass production.

[0089] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of combined actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Secondly, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application. In the above embodiments, the descriptions of each embodiment have their own emphasis; for parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0090] In some embodiments, this application also provides a computer program product, the computer program product including a computer program stored on a non-volatile computer-readable storage medium, the computer program including program instructions, which, when executed by a computer, cause the computer to perform any of the above-described PCB adhesive application control methods.

[0091] In some embodiments, this application also provides an electronic device, which includes: at least one processor and a memory communicatively connected to the at least one processor, wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform a PCB adhesive application control method.

[0092] The apparatus described in the embodiments of this application can be used to execute the PCB adhesive coating control method of this application, and accordingly achieve the technical effects achieved by the PCB adhesive coating control method of this application, which will not be elaborated further here. In the embodiments of this application, the relevant functional modules can be implemented by a hardware processor.

[0093] Figure 9 This is a schematic diagram of the hardware structure of an electronic device for performing a PCB adhesive coating control method according to another embodiment of this application, as shown below. Figure 9 As shown, the device includes: One or more processors 910 and memory 920, Figure 9 Take the 910 processor as an example.

[0094] The device for performing the PCB adhesive application control method may also include an input device 930 and an output device 940.

[0095] The processor 910, memory 920, input device 930, and output device 940 can be connected via a bus or other means. Figure 9 Taking the example of a connection between China and Israel via a bus.

[0096] The memory 920, as a non-volatile computer-readable storage medium, can be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as the program instructions / modules corresponding to the PCB adhesive coating control method in the embodiments of this application. The processor 910 executes various functional applications and data processing of the server by running the non-volatile software programs, instructions, and modules stored in the memory 920, thereby implementing the PCB adhesive coating control method of the above-described method embodiments.

[0097] The memory 920 may include a program storage area and a data storage area, wherein the program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the device, etc. Furthermore, the memory 920 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 920 may optionally include memory remotely located relative to the processor 910, and these remote memories may be connected to the device via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0098] Input device 930 can receive input digital or character information and generate signals related to user settings and function control of the device. Output device 940 may include display devices such as a display screen.

[0099] The one or more modules are stored in the memory 920, and when executed by the one or more processors 910, they execute the PCB adhesive application control method in any of the above method embodiments.

[0100] The above-described product can perform the methods provided in the embodiments of this application, and has the corresponding functional modules and beneficial effects for performing the methods. Technical details not described in detail in this embodiment can be found in the methods provided in the embodiments of this application.

[0101] The electronic devices in this application embodiments exist in various forms, including but not limited to: (1) Mobile communication devices: These devices are characterized by their mobile communication capabilities and primarily aim to provide voice and data communication. These terminals include: smartphones (e.g., iPhones), multimedia phones, feature phones, and low-end phones, etc.

[0102] (2) Ultra-mobile personal computer devices: These devices fall under the category of personal computers, possessing computing and processing capabilities, and generally also have mobile internet access features. These terminals include PDAs, MIDs, and UMPCs, such as the iPad.

[0103] (3) Portable entertainment devices: These devices can display and play multimedia content. This category includes: audio and video players (such as iPods), handheld game consoles, e-books, as well as smart toys and portable car navigation devices.

[0104] (4) Server: A device that provides computing services. The components of a server include a processor, hard disk, memory, system bus, etc. Servers are similar to general computer architectures, but because they need to provide highly reliable services, they have higher requirements in terms of processing power, stability, reliability, security, scalability, and manageability.

[0105] (5) Other electronic devices with data interaction functions.

[0106] In some embodiments, this application also provides a mobile platform on which the computer device described in any embodiment of this application is installed. The mobile platform includes, but is not limited to, vehicles, tracked robots, bipedal robots, quadrupedal robots, etc., wherein the vehicle can be a passenger car, pickup truck, truck, etc. It should be noted that the above are merely examples, and this application does not limit the specific form of the mobile platform.

[0107] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0108] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented using software plus a general-purpose hardware platform, or of course, using hardware. Based on this understanding, the above technical solutions, in essence or the parts that contribute to the related technology, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A method for controlling PCB adhesive application, comprising: The reference PCB image to be coated and calibrated is captured by a vision acquisition device and placed on the processing platform. The position of the teaching device when the vision acquisition device captures the reference PCB image is also obtained. Based on the PCB position matrix and the image capture position of the teaching device, the image capture position of the target device corresponding to each target PCB on the processing platform is calculated; the PCB position matrix defines the positional arrangement relationship between the reference PCB and each target PCB in the processing platform; Obtain the teaching adhesive application operation trajectory for the reference PCB image, and determine the physical coordinates of the target adhesive application path corresponding to each target PCB based on the teaching adhesive application operation trajectory and the photo capture position of each target device. Based on the determined photographic locations of each target device and the corresponding physical coordinates of the target adhesive application path, the adhesive application actuator is controlled to apply adhesive to the corresponding target PCB. The step of determining the physical coordinates of the target adhesive application path corresponding to each target PCB based on the teaching adhesive application operation trajectory and the photographing positions of each target device includes: Obtain the visual calibration parameters of the visual acquisition device, and convert the teaching glue application operation trajectory according to the visual calibration parameters and the photo capture position of the teaching device to obtain the corresponding physical coordinates of the teaching glue application path in the platform global coordinate system of the processing platform; Determine the position deviation of each target device's photo-taking position relative to the teaching device's photo-taking position, and combine this with the physical coordinates of the teaching adhesive application path to determine the physical coordinates of the target adhesive application path corresponding to each target PCB. The step of converting the teaching adhesive application operation trajectory based on the visual calibration parameters and the image capture position of the teaching device includes: The coordinate transformation of the teaching glue application operation trajectory is performed according to the visual calibration parameters to generate local path physical coordinates based on the photo-taking position of the teaching device; Determine the physical coordinates of the photographing point of the teaching device in the platform reference coordinate system of the processing platform; Based on the physical coordinates of the photographing point, the physical coordinates of the local path are transformed to the platform reference coordinate system to generate the physical coordinates of the teaching glue application path of the corresponding processing platform globally.

2. The method according to claim 1, wherein, The step of controlling the adhesive application mechanism to apply adhesive to the corresponding target PCB based on the determined photographic locations of each target device and the corresponding physical coordinates of the target adhesive application path includes: Based on the image capture positions of each target device, the visual acquisition device is moved sequentially. When the vision acquisition device is detected to have moved to the first target device's photo-taking position, the glue-applying execution mechanism is controlled to perform glue-applying processing on the first target PCB to be glue-applying, based on the physical coordinates of the first target glue-applying path corresponding to the first target device's photo-taking position.

3. The method according to claim 2, wherein, The step of controlling the adhesive application mechanism to perform adhesive application processing on the first target PCB to be coated based on the physical coordinates of the first target adhesive application path corresponding to the photographed position of the first target device includes: A working PCB image of the first target PCB is acquired, and the reference PCB image is compared with the working PCB image to identify the attitude deviation information of the first target PCB; the attitude deviation information includes the position offset and / or rotation angle deviation of the PCB; Based on the attitude deviation information, the physical coordinates of the target adhesive application path corresponding to the first target PCB are corrected; The first target PCB is sprayed according to the physical coordinates of the adhesive application path of the corrected target.

4. The method according to claim 1, wherein, The step of obtaining the teaching adhesive application operation trajectory for the reference PCB image includes: At least one path segment is generated on the reference PCB image, and each path segment has a corresponding segment number. Extract the pixel coordinates of key nodes in each path segment to obtain the corresponding path segment pixel coordinates; The pixel coordinates of each path segment are summarized according to the corresponding segment number to form the glue application pixel path coordinates.

5. The method according to claim 4, wherein, Generating at least one path segment on the reference PCB image includes: Based on the reference PCB image, user interaction operations are detected to generate at least one path segment on the reference PCB image; and / or Identify the adhesive coating area features in the reference PCB image and generate a suitable path segment based on the adhesive coating area features; the adhesive coating area features include at least one of the following: the outline of the PCB solder mask window, the outline of the electronic component package boundary, and the geometric center line of the protective adhesive groove.

6. The method according to claim 1, wherein, Before controlling the adhesive application actuator to apply adhesive to the corresponding target PCB based on the determined photographic locations of each target device and the corresponding physical coordinates of the target adhesive application path, the method further includes: Obtain the glue application process parameters and associate the glue application process parameters with the physical coordinates of at least one corresponding target glue application path; the glue application process parameters include at least one of the following: glue application line width parameter, glue application speed parameter, and pen lifting height parameter.

7. A computer device, comprising a memory, a processor, and a computer program stored in the memory, wherein, The processor executes the computer program to implement the steps of the method according to any one of claims 1-6.

8. A storage medium storing one or more programs including executable instructions, wherein, The execution instructions can be read and executed by an electronic device to perform the steps of the method according to any one of claims 1-6.

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