Sintering pressure module and bonding device

Abstract

This invention belongs to the field of semiconductor processing technology and discloses a sintering pressure module and bonding device. The sintering pressure module includes a main frame, with at least two movable pressure heads disposed within the main frame, each movable pressure head capable of moving along a first direction; an expansion guiding unit includes several expansion guiding structures, with expansion guiding structures disposed around the perimeter of each movable pressure head, wherein two expansion guiding structures are respectively disposed on the two side walls of the movable pressure head along a second direction and slidably connected to the movable pressure head, and the other two expansion guiding structures are respectively disposed on the two side walls of the movable pressure head along a third direction and slidably connected to the movable pressure head, wherein the intersection of the line connecting two expansion guiding structures and the line connecting the other two expansion guiding structures coincides with the symmetrical central axis of the movable pressure head. This invention can suppress disordered expansion of the pressure head in the horizontal direction and can adapt to sintering surfaces with different height differences on the power module.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more particularly to a sintering pressure module and bonding apparatus. Background Technology

[0002] Semiconductor sintering is a core step in semiconductor manufacturing to achieve reliable connections between materials. Through heating, pressurization, or a combination of both, it enables stable physical and chemical bonding of components such as system-level power modules (which integrate multiple chips) and packaging substrates. It is a key technology in fields such as power semiconductors and advanced packaging. With the increase in interconnect density, the spacing between system-level power modules on a single substrate has been drastically compressed, typically to 300μm, and is trending towards even smaller spacing requirements.

[0003] Before formal sintering, the power module and the substrate are bonded together by a medium. Due to the influence of the thickness of the power module, the substrate and the medium layer, the horizontal height of the contact surface between each power module and the sintering head is uneven. The traditional integral rigid head cannot adapt to these differences, resulting in huge differences in the actual pressure of each sintering surface, poor sintering in some areas, and the formation of high thermal resistance points, making it no longer applicable.

[0004] There is an urgent need for a sintering pressurization module that can be applied to sintering pressurization modules where the horizontal height of the contact surfaces between each power module and the sintering pressure head is inconsistent and the spacing between each power module is small. Summary of the Invention

[0005] The purpose of this invention is to provide a sintering pressure module and bonding device that can not only suppress the disordered expansion of the pressure head in the horizontal direction, but also adapt to the sintering surfaces with different height differences and small spacing on the power module.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] The sintering pressure module includes:

[0008] The main frame encloses an installation area;

[0009] At least two movable pressure heads are disposed within the main frame, and each movable pressure head is capable of moving along a first direction;

[0010] An expansion guide unit includes several expansion guide structures. Each movable pressure head is provided with an expansion guide structure around its perimeter. Two expansion guide structures are respectively disposed on the two side walls of the movable pressure head along a second direction and are slidably connected to the movable pressure head. The other two expansion guide structures are respectively disposed on the two side walls of the movable pressure head along a third direction and are slidably connected to the movable pressure head. The intersection of the line connecting two expansion guide structures and the line connecting the other two expansion guide structures coincides with the symmetrical central axis of the movable pressure head.

[0011] As an optional solution for the sintering pressure module, at least two of the movable pressure heads are arranged side by side adjacent to each other within the main frame. Guide grooves are provided around each movable pressure head. Several expansion guide structures are fixedly provided on the inner wall of the main frame. The expansion guide structures are slidably connected to the corresponding guide grooves.

[0012] As an optional solution for the sintering pressure module, an expansion guide structure is provided between two adjacent movable pressure heads. One end of the expansion guide structure is fixedly connected to the guide groove of one of the movable pressure heads, and the other end of the expansion guide structure is slidably connected to the guide groove of the other movable pressure head.

[0013] As an optional embodiment of the sintering pressurization module, the lower wall surface of the guide groove located on both sides of the movable pressure head along the third direction does not penetrate the movable pressure head. When the movable pressure head moves upward along the first direction, the expansion guide structure stops at the lower wall surface of the guide groove. The sintering pressurization module further includes:

[0014] The travel limiters are fixedly disposed on the movable pressure head and located on both sides along the second direction. When the movable pressure head moves downward along the first direction, the expansion guide structure stops at the travel limiters.

[0015] As an optional solution for the sintering pressure module, the outer edge of the main frame is provided with a number of connecting ears, each of which is provided with a connecting hole, through which fasteners can pass to connect with the sintering equipment.

[0016] As an optional solution for the sintering pressure module, the sintering equipment is provided with a number of positioning posts, and the main frame is provided with a number of positioning holes, with the positioning posts inserted into the corresponding positioning holes.

[0017] As an optional solution for the sintering pressure module, the main frame is provided with four positioning holes, all of which are strip-shaped holes. Two of the positioning holes are respectively located on both sides of the main frame along the second direction and both extend along the second direction. The other two positioning holes are respectively located on both sides of the main frame along the third direction and both extend along the third direction. The intersection of the line connecting two of the positioning holes and the line connecting the other two positioning holes coincides with the symmetrical central axis of the main frame.

[0018] As an optional solution for the sintering pressurization module, the sintering pressurization module further includes:

[0019] A heater is embedded in the movable pressure head and is used to heat the movable pressure head.

[0020] As an optional solution for the sintering pressurization module, the sintering pressurization module further includes:

[0021] A heat-conducting layer is disposed on the lower pressure surface of the movable pressure head.

[0022] A bonding apparatus, characterized in that it includes a sintering device and a sintering pressure module as described in any of the preceding claims, the sintering pressure module being mounted on the sintering device, the sintering device being provided with at least two pressure rods, the pressure rods being used to press against corresponding movable pressure heads.

[0023] The beneficial effects of this invention are:

[0024] The sintering pressurization module provided by this invention has at least two movable pressure heads positioned within the installation area of ​​the main frame. Each movable pressure head can independently move along a first direction and press against the product. When there is a height difference between different sintering surfaces on the power module, the movement of the movable pressure heads can be controlled according to this height difference, allowing the sintering pressurization module to compensate for the height difference and expand its applicability. Furthermore, expansion guide structures are provided around each movable pressure head. Since the intersection of the line connecting two expansion guide structures and the line connecting two other expansion guide structures coincides with the symmetrical central axis of the movable pressure head, this layout forms a unique cross-shaped expansion positioning layout. That is, when the movable pressure head expands due to heat during sintering, its own symmetrical central axis is always aligned with the sintering surface on the power module. The expansion direction of the movable pressure head can only be along its own symmetrical central axis in a second and third direction, which can suppress disordered expansion of the movable pressure head in the horizontal direction, prevent misalignment between the movable pressure head and the sintering surface on the power module, ensure uniform stress on the sintering surface, and improve the connection strength after bonding and sintering between the power module and the heat sink substrate. Because the expansion guide structure is slidably connected to the movable pressure head, the expansion guide structure can also guide the movable pressure head to move up and down.

[0025] The bonding device provided by this invention has a sintering pressure module installed on a sintering equipment. The pressure rod of the sintering equipment is used to press against the corresponding movable pressure head. During the sintering process, the expansion direction of the movable pressure head can only be expanded along the second or third direction from its own symmetrical central axis, which avoids misalignment between the movable pressure head and the sintering surface on the power module, so that the sintering surface is subjected to uniform force and improves the connection strength of the power module and the heat dissipation substrate after bonding and sintering. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the assembly of the sintering pressure module in an embodiment of the present invention;

[0028] Figure 2 This is a top view of the sintering pressure module in an embodiment of the present invention;

[0029] Figure 3 This is a side view of the sintering pressure module in an embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of the structure of the sintering pressure module with the main frame removed in an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram illustrating the direction of thermal expansion of the movable pressure head in an embodiment of the present invention;

[0032] Figure 6 A top view showing the initial positioning of multiple devices on a substrate via a medium;

[0033] Figure 7 A side view showing the initial positioning of multiple devices on a substrate via a medium;

[0034] Figure 8 This is a schematic diagram of the unconstrained, disordered expansion of the pressure head during sintering.

[0035] Figure 9 This is a schematic diagram of the center expansion after being constrained by the moving pressure head during the sintering process.

[0036] Figure label:

[0037] 001. Substrate; 002. Device; 003. Dielectric; 004. Indenter;

[0038] 1. Main frame; 2. Movable pressure head; 3. Expansion guide structure; 4. Stroke limit component; 5. Heater; 6. Heat-conducting layer;

[0039] 11. Connecting ear; 111. Connecting hole; 12. Positioning hole;

[0040] 21. Guide groove; 211. Lower wall surface. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0042] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0043] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0045] Semiconductor sintering, a crucial step in semiconductor manufacturing, skillfully employs heating, pressurization, or a combination of both to process key components such as system-level power modules and packaging substrates. The system-level power modules are highly integrated, incorporating multiple chips with different functions that work together to achieve complex circuitry. The packaging substrate provides stable physical support and electrical connections for these chips. With continuous innovation and advancements in semiconductor technology, increasing interconnect density has become an unstoppable trend. Against this backdrop, the spacing between system-level power modules on a single substrate has been drastically reduced. Currently, this spacing is typically 300μm in common applications; however, to meet the demands of higher performance and more compact designs, this spacing is continuously shrinking. Smaller spacing means that more power modules can be integrated within a limited space, thereby further improving device integration and performance.

[0046] However, existing semiconductor sintering technologies have revealed many problems that urgently need to be solved in practical applications.

[0047] First, there is a risk of misalignment due to thermal expansion. During the sintering process, a high-temperature environment is required, causing the pressure head to expand. Since the horizontal expansion of the pressure head is disordered, the resulting expansion force can cause the entire pressure head to twist and shift. For example... Figures 6-8 As shown, multiple devices 002 are initially positioned on the substrate 001 via a dielectric 003 and then sintered by pressing down with a pressure head 004. The pressure head, originally flat and precisely aligned with the sintering surface on the power module, changes shape and position under the influence of high-temperature expansion force, no longer perfectly fitting the sintering surface but becoming misaligned. This misalignment directly leads to uneven stress on the various sintering surfaces of the power module, causing the originally uniform pressure to become unbalanced, thus significantly reducing the connection strength after sintering. Reduced connection strength after sintering affects the reliability of the connection between the power module and the substrate, potentially leading to problems such as poor contact.

[0048] Secondly, existing technologies cannot compensate for height differences. Before the formal sintering process begins, the power module and the substrate are adhered together using a specific medium. During actual manufacturing, due to various factors (primarily uniformity errors in the dielectric layer, compounded by processing errors in the substrate and chip; the initial dielectric layer is paste-like, easily deformed under stress, and more prone to introducing height errors), manufacturing tolerances are unavoidable. This results in the sintering surfaces on each power module potentially not being at the same horizontal level, but exhibiting certain height differences. However, the currently used integral rigid pressure head's structural characteristics dictate that it cannot adapt to these height differences between sintering surfaces. When using this rigid pressure head for sintering, the inability to adjust according to the height of different sintering surfaces leads to significant differences in the actual pressure exerted on each surface. Some sintering surfaces may be damaged due to excessive pressure, while others may fail to achieve good contact and sintering due to insufficient pressure, resulting in poor sintering in localized areas. These poorly sintered areas will form high thermal resistance points, preventing heat from being effectively conducted away. This will cause the power module to reach excessively high local temperatures during operation, which will not only affect the performance of the power module itself, but may also negatively impact the heat dissipation of the entire high-power converter system, thereby threatening the safe and stable operation of the system.

[0049] To suppress the disordered expansion of the pressure head in the horizontal direction and to adapt to the different height differences and small spacing of the sintering surfaces on the power module, this embodiment provides a sintering pressure module and a bonding device, which are described below in conjunction with... Figures 1 to 5 and combination Figure 9 The specific content of this embodiment will be described in detail. It should be emphasized that the technical solution described in this embodiment has a clear and precise definition of direction. Specifically, the first direction mentioned in this embodiment refers to... Figure 1 The direction is clearly marked as Z, i.e., the up-down direction; the second direction mentioned in this embodiment refers to the direction of... Figure 1 The X direction in this context refers to the left-right direction; the third direction mentioned in this embodiment refers to the direction in the left-right direction. Figure 1 The Y direction is represented by the 'Y' direction, which is the forward and backward direction.

[0050] This embodiment provides a sintering pressurization module including a main frame 1, at least two movable pressure heads 2, and an expansion guide unit. The main frame 1 serves as the foundational support structure of the entire module, enclosing an installation area that provides a stable and suitable spatial environment for the subsequent installation and operation of components such as the movable pressure heads 2. At least two movable pressure heads 2 are disposed within the main frame 1, each capable of moving independently along a first direction. In practical applications, this module demonstrates good adaptability to the common problem of height differences between different sintering surfaces on power modules. Because each movable pressure head 2 can move independently, the movement of each head can be adjusted and controlled according to the specific height difference between the sintering surfaces. This allows the sintering pressurization module to effectively compensate for height differences in the sintering surfaces, greatly expanding its applicability. It achieves good sintering pressurization effects for power modules with both small and large height differences, providing a reliable solution for sintering power modules of different specifications and requirements.

[0051] The expansion guiding unit includes several expansion guiding structures 3. Each movable pressure head 2 has expansion guiding structures 3 arranged around its perimeter. Two expansion guiding structures 3 are respectively located on the two side walls of the movable pressure head 2 along the second direction and are slidably connected to the movable pressure head 2. The other two expansion guiding structures 3 are respectively located on the two side walls of the movable pressure head 2 along the third direction and are slidably connected to the movable pressure head 2. This layout forms a unique cross-shaped expansion positioning layout. More importantly, the intersection of the line connecting two of the expansion guiding structures 3 and the line connecting the other two of the expansion guiding structures 3 coincides with the symmetrical central axis of the movable pressure head 2. When the movable pressure head 2 expands due to heat during sintering, due to its unique structural constraints, its own symmetrical central axis can always accurately align with the sintering surface on the power module. This means that the expansion direction of the movable pressure head 2 is strictly constrained; it can only expand along its own symmetrical central axis in the second and third directions, and cannot expand randomly in the horizontal direction. This effective suppression of the expansion direction fundamentally avoids misalignment between the movable pressure head 2 and the sintering surface on the power module. During the sintering process, each sintering surface is subjected to uniform pressure, which greatly improves the sintering uniformity. Improved sintering uniformity ensures a tighter and more reliable connection between the power module and the heat sink substrate, effectively reducing contact thermal resistance, improving heat transfer efficiency, and thus enhancing the overall system performance and stability, and extending the system's lifespan. Furthermore, since the expansion guide structure 3 and the movable pressure head 2 are connected by a sliding connection, this connection not only restricts the expansion direction of the movable pressure head 2 but also guides its vertical movement. During the movement of the movable pressure head 2 along the first direction, the expansion guide structure 3 provides stable guidance, ensuring the smoothness and accuracy of its movement and preventing deviation or wobbling, further guaranteeing the smooth progress of the sintering process and the reliability of the sintering quality. In addition, the two movable pressure heads 2 are arranged adjacent to each other within the main frame, suitable for scenarios where the spacing between power modules is small.

[0052] Furthermore, at least two movable pressure heads 2 are arranged adjacent to each other within the main frame 1, which makes more rational use of space, resulting in a compact module structure and reducing unnecessary space occupation. To better achieve precise movement and expansion control of the movable pressure heads 2, guide grooves 21 are provided around each movable pressure head 2, and several expansion guide structures 3 are fixedly installed on the inner wall of the main frame 1. The expansion guide structures 3 are slidably connected to the corresponding guide grooves 21. This sliding connection method ensures that the movable pressure heads 2 can move smoothly when subjected to external forces, while also effectively constraining their direction of movement and expansion.

[0053] Through the tight cooperation between the expansion guide structure 3 and the guide groove 21, when the movable pressure head 2 expands under high temperature during sintering, the guide groove 21 restricts the expansion guide structure 3, ensuring that the movable pressure head 2 can only expand along the direction specified by the guide groove 21. This prevents the movable pressure head 2 from twisting or shifting arbitrarily in the horizontal plane, effectively avoiding misalignment between the movable pressure head 2 and the sintering surface on the power module. Regarding improved bonding strength, the effective control of the expansion of the movable pressure head 2 allows for a more uniform pressure distribution on each sintering surface. This uniform pressure distribution results in a tighter contact between the power module and the heat dissipation substrate, reducing contact thermal resistance, improving heat conduction efficiency, and thus significantly enhancing bonding strength. In guiding the movement of the movable pressure head 2, the guide groove 21 provides a clear path for its movement. The sliding connection of the expansion guide structure 3 within the guide groove 21 ensures that the movable pressure head 2 can move accurately and smoothly along the predetermined first direction (vertical direction), without deviation or wobbling, guaranteeing the smooth progress of the sintering process and the reliability of the sintering quality.

[0054] For example, both the mounting area and the movable pressure head 2 have rectangular cross-sectional shapes. The rectangular structure has high strength and rigidity, capable of withstanding various forces generated during sintering, ensuring that the movable pressure head 2 does not deform or break during movement and pressurization. The rectangular structure is relatively simple to manufacture, reducing manufacturing costs and improving production efficiency. Furthermore, the rectangular structure facilitates integration and assembly with other components, promoting the integrated and standardized production of the entire module.

[0055] Furthermore, an expansion guide structure 3 is provided between two adjacent movable pressure heads 2. One end of the expansion guide structure 3 is fixedly connected to the guide groove 21 of one of the movable pressure heads 2. This fixed connection ensures the relative position stability between the expansion guide structure 3 and the movable pressure head 2, providing stable support and guidance for the movable pressure head 2. The other end of the expansion guide structure 3 is slidably connected to the guide groove 21 of the other movable pressure head 2. This slidable connection allows the other movable pressure head 2 to have a certain degree of freedom relative to the expansion guide structure 3 during movement and expansion, while also being constrained by it. By utilizing such an expansion guide structure 3 between two adjacent movable pressure heads 2, the expansion guidance function of both can be achieved with only one structure. This not only reduces the number of expansion guide structures 3, lowering the complexity and cost of the module, but also simplifies the structure and improves the reliability and stability of the entire module.

[0056] Furthermore, the lower wall surfaces 211 of the guide grooves 21 located on both sides of the movable pressure head 2 along the third direction do not penetrate the movable pressure head 2. When the movable pressure head 2 moves upward along the first direction, the expansion guide structure 3 stops at the lower wall surfaces 211 of the guide grooves 21. As the movable pressure head 2 moves upward along the first direction (vertical direction), the expansion guide structure 3, which is slidably connected to the guide grooves 21, gradually approaches the lower wall surfaces 211 of the guide grooves 21. Since the lower wall surfaces 211 of the guide grooves 21 do not penetrate the movable pressure head 2, when the expansion guide structure 3 moves to this point, it will be blocked by the lower wall surfaces 211 and stop moving, thereby limiting the extreme position of the upward movement of the movable pressure head 2. This limiting method is precise and reliable, ensuring that the movable pressure head 2 will not collide with other components or exceed the reasonable working range due to excessive movement during upward movement, thus ensuring the safety and stability of the entire module during operation.

[0057] Furthermore, the sintering pressure module is specially equipped with two stroke limiters 4. These two stroke limiters 4 are securely fixed to the movable pressure head 2 using bolts or screws, and are located on either side of the movable pressure head 2 along the second direction. When the movable pressure head 2 moves downward along the first direction, the expansion guide structure 3 stops at the stroke limiters 4. As the movable pressure head 2 moves downward along the first direction, the expansion guide structure 3 slides within the guide groove 21 of the movable pressure head 2. As the downward movement continues, the expansion guide structure 3 gradually approaches the stroke limiters 4. When the expansion guide structure 3 touches the stroke limiters 4, it is blocked, causing the movable pressure head 2 to stop moving downward, thus limiting the maximum downward movement of the movable pressure head 2. The presence of the stroke limiters 4 prevents the movable pressure head 2 from damaging its fit with the lower components or applying excessive pressure to the sintering surface due to excessive downward movement, thereby ensuring the smooth progress of the sintering process and the stability of the sintering quality.

[0058] Along the path of the expansion guide structure 3 sliding up and down within the guide groove 21, a complete and efficient movement limiting system is formed by setting the lower wall surface 211 of the guide groove 21 and the stroke limiting component 4. This system has several significant technical benefits. From the perspective of connection strength control, it can precisely limit the movement of the movable pressure head 2, ensuring that the movable pressure head 2 accurately reaches the predetermined position during its up and down movement. Whether moving upwards or downwards, the movable pressure head 2 can move within the set range, avoiding problems such as uneven sintering pressure and poor contact of the sintering surface caused by excessive or insufficient movement, thereby greatly improving the strength and quality of sintering. From the perspective of safety and reliability, this movement limiting system can prevent the movable pressure head 2 from colliding or interfering with other components during movement, reducing the probability of equipment failure and extending the service life of the module. At the same time, it can also prevent damage to the power module and heat sink substrate caused by uncontrolled movement of the movable pressure head 2, ensuring the safe and reliable operation of the entire sintering process. From the perspective of adaptability and flexibility, by adjusting the position of the lower wall 211 of the guide groove 21 and the position of the stroke limiter 4, the range of movement of the movable pressure head 2 can be easily changed, thereby adapting to the sintering process of power modules with different specifications and requirements. This makes the sintering pressure module more widely applicable and able to meet the sintering needs of various different scenarios.

[0059] Furthermore, the outer edge of the main frame 1 is provided with several connecting ears 11, each with a connecting hole 111 through which fasteners can pass to connect with the sintering equipment. The design of the connecting ears 11 and connecting holes 111 simplifies and speeds up the installation process between the sintering pressure module and the sintering equipment. Operators simply need to pass the fasteners through the connecting holes 111 sequentially and tighten them to complete the module's installation and fixation, significantly reducing installation time and improving work efficiency. The tight fit between the fasteners and the connecting holes 111 provides strong connection force, ensuring a firm and reliable connection between the main frame 1 and the sintering equipment. This stable connection effectively prevents the module from loosening or shifting under stress, ensuring the stability and consistency of the sintering process. Even during high-intensity, long-duration sintering operations, a reliable connection between the module and the sintering equipment is maintained, avoiding sintering quality problems caused by loose connections. When the module requires maintenance, repair, or replacement, the operator can easily remove the module from the sintering equipment simply by loosening the fasteners. The removal process is quick and easy and will not damage the module or the sintering equipment.

[0060] Furthermore, the sintering equipment is equipped with several positioning posts, and the main frame 1 is provided with several positioning holes 12, with the positioning posts inserted into the corresponding positioning holes 12. During installation, the positioning posts can be accurately inserted into the corresponding positioning holes 12. This plug-in positioning method provides a highly accurate foundation for the initial positioning of the entire device, effectively avoiding subsequent processing errors caused by positioning deviations, and greatly improving the accuracy and reliability of the connection between the sintering equipment and the main frame 1.

[0061] Furthermore, to achieve more precise positioning and more effective expansion control in the complex and variable sintering environment, four positioning holes 12 are provided on the main frame 1. All four positioning holes 12 are strip-shaped. Two of the positioning holes 12 are located on both sides of the main frame 1 along the second direction, and both extend along the second direction. The other two positioning holes 12 are located on both sides of the main frame 1 along the third direction, and both extend along the third direction. This layout forms a unique cross-shaped positioning arrangement. More importantly, the intersection of the line connecting two of the positioning holes 12 and the line connecting the other two positioning holes 12 coincides with the symmetrical central axis of the main frame 1, laying the foundation for the stable operation and precise control of the entire device. During the sintering process, the main frame 1 will inevitably be affected by high temperatures and undergo thermal expansion. Since metal materials expand and contract when heated, if not effectively controlled, the expansion of the main frame 1 may cause its position to shift, thereby affecting the strength and quality of the sintering. However, this design cleverly utilizes the structural features that all four positioning holes 12 are strip-shaped holes and that the intersection of their connecting lines coincides with the axis of symmetry, so that the positioning columns located in the positioning holes 12 play an important role in guiding the expansion during the expansion of the main frame 1.

[0062] When the main frame 1 expands due to heat, the positioning posts remain in place because they are fixed to the sintering equipment. The strip-shaped positioning holes 12 on the main frame 1 provide space and guidance for the expansion. In the second direction, the positioning holes 12 extending along this direction allow the main frame 1 to expand to a certain extent in this direction, while the relative sliding of the positioning posts within the positioning holes 12 guides the expansion, ensuring that the expansion of the main frame 1 in the second direction is orderly and along a predetermined path. Similarly, in the third direction, the cooperation of the other two strip-shaped positioning holes 12 and the positioning posts also ensures that the expansion of the main frame 1 in this direction is also orderly and controllable. Because the expansion guides in the two directions cooperate with each other, and the intersection point coincides with the symmetrical central axis of the main frame 1, the position of the symmetrical central axis of the main frame 1 remains constant throughout the expansion process. In other words, the expansion direction of the main frame 1 can only be uniformly expanded along its own symmetrical central axis in the second and third directions, thus effectively suppressing the disorderly expansion of the main frame 1 in the horizontal direction.

[0063] Furthermore, the sintering pressurization module also includes a heater 5, which is embedded within the movable pressure head 2. The heater 5 is used to heat the movable pressure head 2. To achieve precise and efficient heating control of the workpiece during sintering, the sintering pressurization module specifically adds the heater 5. This heater 5 is installed inside the movable pressure head 2 in an embedded manner. The movable pressure head 2 has some unused space; embedding the heater 5 within it avoids occupying valuable external space while ensuring a tight integration between the heater 5 and the movable pressure head 2, forming a unified whole. This embedded installation minimizes the thermal resistance between the heater 5 and the movable pressure head 2, allowing the heat generated by the heater 5 to be quickly and efficiently transferred to the movable pressure head 2, thereby achieving rapid temperature increase and precise control of the movable pressure head 2. In the sintering process, suitable temperature is one of the key factors ensuring sintering quality. By heating the movable pressure head 2 with the heater 5, the movable pressure head 2 can evenly transfer heat to the surface of the workpiece, providing the necessary energy for the sintering reaction, promoting bonding, and thus improving the density and strength of the sintered part. Moreover, the heater 5 can stably control the temperature of the movable pressure head 2 within a set range according to different sintering materials and process requirements, ensuring the stability and consistency of the sintering process.

[0064] Furthermore, the sintering pressurizing module also includes a heat-conducting layer 6, which is disposed on the lower pressing surface of the movable pressure head 2. To further improve heat transfer efficiency and ensure rapid and uniform heat exchange between the lower pressing surface of the movable pressure head 2 and the workpiece, the sintering pressurizing module also includes a heat-conducting layer 6. The lower pressing surface of the movable pressure head 2 is the part that directly contacts the workpiece, and heat is mainly transferred to the workpiece through this surface. The presence of the heat-conducting layer 6 can greatly accelerate the heat transfer speed and reduce heat loss during the transfer process.

[0065] For example, the movable pressure head 2 is made of aluminum alloy. Aluminum alloy has many excellent properties, making it an ideal material for the movable pressure head 2. First, aluminum alloy has a low density, which allows the movable pressure head 2 to reduce its weight while maintaining a certain strength. The lighter weight reduces the inertia of the moving parts of the module during operation, lowering energy consumption and improving the module's response speed and motion accuracy. Second, aluminum alloy has good machinability, making it easy to manufacture movable pressure heads 2 of various complex shapes through various processing techniques to meet the needs of different sintering processes. Furthermore, aluminum alloy also has a certain degree of thermal conductivity, which can transfer heat to some extent, but further optimization is needed to achieve more efficient heat transfer.

[0066] For example, the heat-conducting layer 6 is made of metallic copper. Copper is one of the materials with extremely excellent thermal conductivity, with a thermal conductivity much higher than that of aluminum alloys. Using metallic copper as the heat-conducting layer 6 on the lower pressing surface of the movable pressure head 2 fully utilizes its high thermal conductivity. When the heater 5 heats the movable pressure head 2, the heat absorbed by the movable pressure head 2 is rapidly transferred to the surface of the workpiece through the heat-conducting layer 6. Due to the fast thermal conductivity of copper, the surface temperature of the workpiece can be raised and made uniform in a short time, thus greatly shortening the preheating time for sintering and improving sintering efficiency. At the same time, the uniform temperature distribution helps avoid sintering defects such as cracks and deformation caused by excessively high or low local temperatures in the workpiece, further improving the quality of the sintered part.

[0067] This embodiment also provides a bonding device, which includes a sintering device and the aforementioned sintering pressure module. The sintering pressure module is installed on the sintering device, which is provided with at least two pressure rods for pressing against corresponding movable pressure heads 2. The bonding device can suppress disordered expansion of the pressure heads in the horizontal direction and can adapt to sintering surfaces with different height differences on the power module.

[0068] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. Sintering press module, characterized in that, The utility model relates to a sintering and pressing equipment, including: A main body frame (1) is surrounded and is formed with installation interval; At least two movable pressure heads (2) are arranged in the main body frame (1), each movable pressure head (2) can move along the first direction; Expansion guide unit includes several expansion guide structures (3), each movable pressure head (2) is provided with expansion guide structure (3) around, two expansion guide structures (3) are arranged on the two side walls of movable pressure head (2) along the second direction respectively and are connected with movable pressure head (2) slidingly, and the other two expansion guide structures (3) are arranged on the two side walls of movable pressure head (2) along the third direction respectively and are connected with movable pressure head (2) slidingly, and the intersection of the line of two expansion guide structures (3) and the line of the other two expansion guide structures (3) coincides with the symmetry center axis of movable pressure head (2).

2. The sintering press tool set of claim 1, wherein, At least two movable pressure heads (2) are adjacent and arranged side by side in the main body frame (1), the movable pressure head (2) is provided with guide groove (21) around, the inner wall surface of main body frame (1) is fixedly provided with several expansion guide structures (3), and the expansion guide structure (3) is connected with corresponding guide groove (21) slidingly.

3. The sintering press tooling set of claim 2, wherein, One expansion guide structure (3) is arranged between adjacent two movable pressure heads (2), one end of expansion guide structure (3) is fixedly connected with the guide groove (21) of one of movable pressure heads (2), and the other end of expansion guide structure (3) is slidingly connected with the guide groove (21) of the other movable pressure head (2).

4. The sintering press tool set of claim 2, wherein, The lower wall surface (211) of guide groove (21) on the two sides of movable pressure head (2) along the third direction does not penetrate movable pressure head (2), and when movable pressure head (2) moves upwards along the first direction, expansion guide structure (3) is stopped on the lower wall surface (211) of guide groove (21). The sintering and pressing module further includes: Two stroke limiters (4) are fixedly arranged on movable pressure head (2) and located on the two sides along the second direction, and when movable pressure head (2) moves downwards along the first direction, expansion guide structure (3) is stopped on stroke limiter (4).

5. The sintering press tooling set of claim 1, wherein, The outer edge of main body frame (1) is provided with several connecting ears (11), each connecting ear (11) is provided with a connecting hole (111), and a fastener can pass through the connecting hole (111) and be connected with a sintering equipment.

6. The sintering press tooling set of claim 5, wherein, A plurality of positioning columns are arranged on the sintering equipment, and a plurality of positioning holes (12) are arranged on the main body frame (1), and the positioning columns are inserted into the corresponding positioning holes (12).

7. The sintering press tooling set of claim 6, wherein, The main frame (1) is provided with four positioning holes (12), the four positioning holes (12) are all strip-shaped holes, two of the positioning holes (12) are respectively arranged on the two sides of the main frame (1) along the second direction and both extend along the second direction, and the other two positioning holes (12) are respectively arranged on the two sides of the main frame (1) along the third direction and both extend along the third direction, and the intersection of the connecting lines of the two positioning holes (12) and the connecting lines of the other two positioning holes (12) coincides with the center axis of symmetry of the main frame (1).

8. The sintering press tooling set of any one of claims 1-7, wherein, The sintering and pressing module further comprises: A heater (5) embedded in the movable pressure head (2), the heater (5) is used for heating the movable pressure head (2).

9. The sintering and pressing module according to claim 8, further comprising: A heat-conducting layer (6) arranged on the lower pressing surface of the movable pressure head (2).

10. Bonding apparatus characterized by, A sintering device and a sintering and pressing module according to any one of claims 1-9, the sintering and pressing module is installed on the sintering device, and the sintering device is provided with at least two pressure rods used for pressing corresponding movable pressure heads (2).

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