Chuck for large-size high-precision wafer alignment and bonding

Abstract

The present application relates to the technical field of temporary wafer bonding, in particular to a chuck for large-size high-precision wafer alignment bonding, which mainly solves the technical problem that the chuck can only be used for wafers with a specific thickness and the rotation resistance of the swing arm cannot be adjusted. The chuck comprises an outer ring frame, an inner disc body and a spacer assembly. The spacer assembly is provided in multiple sets and is uniformly distributed along the circumference of the outer ring frame. The spacer assembly comprises a fixed seat, an adjusting seat, a rotating shaft, a swing arm, a lifting rod and a spacer. The rotating shaft is movably connected to the fixed seat and the adjusting seat. By screwing the adjusting top screw, the mounting part of the adjusting seat can be deflected upward, thereby increasing the pre-pressure of the rotating shaft on the fixed seat and the adjusting seat, and the rotation resistance of the swing arm can be adjusted. Meanwhile, the spacer is indirectly mounted on the swing arm through the lifting rod. The lifting rod can drive the spacer to lift, thereby adjusting the height position of the spacer, and wafers with different thicknesses can be adapted.

Description

Technical Field

[0001] This invention relates to the field of temporary wafer bonding technology, and more particularly to a chuck for large-size, high-precision wafer alignment and bonding. Background Technology

[0002] Temporary wafer bonding refers to the technique of coating a temporary bonding adhesive layer on the surface of the upper wafer and / or the surface of the lower wafer, and then cross-linking the temporary bonding adhesive layer through processes such as UV curing and hot pressing, thereby achieving a tight bond between the upper and lower wafers to form a wafer pair.

[0003] During temporary wafer bonding, the upper and lower wafers need to be aligned on an alignment module before being transported to the bonding cavity by a handling robot to complete the bonding operation. During wafer alignment, appropriate spacers are inserted between the two wafers using a spacer assembly to ensure that air is expelled between them before bonding, preventing bonding voids. Simultaneously, after wafer alignment and during transport, a pre-pressing assembly is used to secure the two wafers to ensure the process proceeds smoothly. Both the spacer assembly and the pre-pressing assembly are integrated into the chuck.

[0004] In the existing technology, chucks have the following drawbacks: First, the spacer assembly of the chuck can only separate wafers of a specific thickness, which limits its applicability. Second, the rotational resistance of the swing arm of the spacer assembly of the chuck is not adjustable. If the resistance is too high, the spacers may not be in place during the automated process. If the resistance is too low, the spacers may slip during the handling process. Both excessive and insufficient resistance will affect the normal operation of the process.

[0005] Therefore, there is an urgent need for a chuck that can be used with wafers of different thicknesses and whose swing arm rotation resistance is adjustable. Summary of the Invention

[0006] To overcome the technical shortcomings of existing chucks, which can only be used for wafers of a specific thickness and whose rotational resistance of the swing arm is not adjustable, this invention provides a large-size, high-precision wafer alignment and bonding chuck.

[0007] The present invention provides a large-size, high-precision wafer alignment and bonding chuck, comprising an outer ring frame, an inner disk body, and multiple sets of spacer assemblies. The inner disk body is coaxially fixed within the central empty area of ​​the outer ring frame, and the multiple sets of spacer assemblies are evenly distributed along the circumference of the outer ring frame. Each spacer assembly includes: A fixing seat is fixed to the lower surface of the outer ring frame, and the lower surface of the fixing seat is provided with a first conical recess; An adjusting seat includes a mounting part located below a fixed seat and an adjusting part extending outward from one side of the fixed seat. The upper surface of the mounting part is provided with a second conical recess. The adjusting part is connected to the lower part of the outer ring frame by a through fastener, and there is a movable allowance between the adjusting part and the fastener. The adjusting part is also equipped with an adjusting screw. The adjusting screw and the mounting part are respectively located on both sides of the fastener. The adjusting screw abuts against the lower surface of the outer ring frame and is used to rotate the mounting part upward with the fastener as the fulcrum by screwing. A rotating shaft, both ends of which are set as tapered tips, and the two tapered tips are respectively inserted into the first tapered recess and the second tapered recess; A swing arm, one end of which is fixed to the rotating shaft and the other end of which extends to the other side of the fixed base; A lifting rod is installed at the other end of the swing arm, and the lifting rod passes through the outer ring frame through a first window opened in the outer ring frame; The partition plate is fixed to the top of the lifting rod. The partition plate has a working state above the inner plate and a avoidance state away from the inner plate by the rotation of the swing arm.

[0008] Optionally, the lower surface of the outer ring frame is evenly distributed with a plurality of first mounting slots along the circumference, and a plurality of sets of spacer assemblies are respectively installed in the plurality of first mounting slots, and the first window is located at one end of the first mounting slot.

[0009] Optionally, the lifting rod is a screw rod, which passes through and is screwed to the other end of the swing arm, and a locking nut is screwed to the lower end of the screw rod.

[0010] Optionally, the lifting rod is provided with an internal threaded hole, the partition overlaps the top surface of the lifting rod and is pressed by a clamping member, the clamping member being fixed by a screw that passes through it and is screwed into the internal threaded hole.

[0011] Optionally, the spacer assembly further includes a cam, which is rotatably mounted below the outer ring frame and whose profile contacts the end of the adjustment part. The cam is used to adjust the horizontal position of the adjustment seat by rotation.

[0012] Optionally, the inner disc is coaxially fixed within the central empty area of ​​the outer ring frame via connecting components. Multiple sets of connecting components are provided, spaced apart circumferentially along the outer ring frame. Each connecting component includes: The U-shaped seat is detachably fixed to the lower surface of the inner disc and has its opening facing upward. A connecting plate, which is detachably fixed to the lower surface of the outer ring frame and inserted into the U-shaped seat.

[0013] Optionally, the lower surface of the outer ring frame is provided with a plurality of second mounting slots spaced apart along the circumference, and the connecting plates of the plurality of connecting components are respectively installed in the plurality of second mounting slots. The lower surface of the inner disc is provided with a plurality of third mounting slots spaced apart along the circumference, and the U-shaped seats of the plurality of connecting components are respectively installed in the plurality of third mounting slots.

[0014] Optionally, the outer ring frame is also fitted with a plurality of positioning pins, which are distributed circumferentially along the outer ring frame and each positioning pin is arranged radially along the outer ring frame. The side wall of the inner disc is provided with positioning holes corresponding to the positioning pins, and the positioning pins are inserted into the positioning holes.

[0015] Optionally, the large-size, high-precision wafer alignment and bonding chuck further includes multiple sets of pre-compression assemblies, which are respectively installed in multiple second windows opened in the outer ring frame and spaced apart circumferentially. The pre-compression assemblies include: A fixed cylinder is fixed to the lower surface of the outer ring frame and arranged vertically along its axis. The cylinder wall of the fixed cylinder is provided with a first limiting hole and a second limiting hole that are spaced apart along the circumference. The first limiting hole is higher than the second limiting hole, and the first limiting hole and the second limiting hole are connected by a connecting channel located above. A lifting shaft is inserted into the fixed cylinder, and the lifting shaft is capable of lifting, lowering and rotating relative to the fixed cylinder; The preload rod is fixed to the top of the lifting shaft and moves through the lifting shaft to have a preloaded state above the inner disc and a retracted state placed in the second window; A limiting pin is fixed on the side wall of the lifting shaft. When the preload rod is in the preload state, the limiting pin is located in the first limiting hole, and when the preload rod is in the retracted state, the limiting pin is located in the second limiting hole. A spring assembly includes a retaining ring, a boss, and a compression spring. The retaining ring is located on the top inner side of the fixed cylinder, the boss is located at the bottom end of the lifting shaft, and the compression spring is sleeved on the lifting shaft and pressed between the retaining ring and the boss.

[0016] Optionally, a preload ball is installed on the lower surface of the preload rod.

[0017] The technical solution provided by this invention has the following advantages compared with the prior art: The large-size, high-precision wafer alignment and bonding chuck provided by this invention features a movable connection structure between the rotating shaft, the fixed seat, and the adjusting seat, all formed by a tapered tip and a tapered recess. By turning the adjusting screw, the mounting part of the adjusting seat can be tilted upwards, thereby increasing the preload of the fixed seat and the adjusting seat on the rotating shaft, thus adjusting the rotational resistance of the swing arm and ultimately adjusting the rotational resistance of the swing arm to a suitable value. Simultaneously, the spacer is indirectly mounted on the swing arm via a lifting rod. The movement of the lifting rod can drive the spacer to rise and fall, thereby adjusting the height of the spacer and adapting it to wafers of different thicknesses. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the top surface structure of the chuck in an embodiment of the present invention; Figure 2 This is a schematic diagram of the bottom structure of the chuck in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the spacer assembly in an embodiment of the present invention; Figure 4 This is an exploded view of the spacer assembly in an embodiment of the present invention; Figure 5 This is a cross-sectional view showing the rotating shaft and related structures in an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of the connecting component in an embodiment of the present invention; Figure 7 This is a schematic diagram of the pre-compression component in an embodiment of the present invention; Figure 8 This is an exploded view of the pre-compression component in an embodiment of the present invention; Figure 9 This is a cross-sectional view of the pre-compression component in an embodiment of the present invention; Figure 10 This is a schematic diagram showing the bottom structure of the outer ring frame in an embodiment of the present invention; Figure 11 express Figure 10 Sectional view at point AA; Figure 12 express Figure 10Sectional view at point BB.

[0021] In the picture: 1. Outer ring frame; 11. First window; 12. First mounting slot; 13. Second mounting slot; 14. Positioning pin; 15. Second window; 2. Inner disc; 21. Third mounting slot; 22. Adsorption channel; 23. Adapter assembly; 231. Adapter block; 232. Connecting pipe; 233. Negative pressure interface; 24. Positioning slot; 25. Ventilation slot; 3. Partition assembly; 31. Fixing base; 311. First conical recess; 312. Mounting post; 313. Mounting disc; 32. Adjusting base; 321. Mounting part; 322. Adjusting part; 323. Second conical recess; 324. Mounting hole; 325. 33. Adjusting screw; 34. Rotating shaft; 35. Swing arm; 36. Actuating part; 37. Lifting rod; 38. Partition plate; 39. Locking nut; 40. Pressing part; 51. Cam; 52. Connecting assembly; 53. U-shaped seat; 54. Connecting plate; 55. Preload assembly; 56. Fixed cylinder; 57. First limiting hole; 58. Second limiting hole; 59. Connecting channel; 50. Flange; 51. Lifting shaft; 52. Preload rod; 53. Limiting pin; 54. Spring assembly; 55. Retaining ring; 55. Boss; 55. Compression spring; 55. Annular groove; 56. Preload ball; 57. Bearing. Detailed Implementation

[0022] To better understand the above-mentioned objectives, features, and advantages of the present invention, the solutions of the present invention will be further described below. It should be noted that, unless otherwise specified, the embodiments of the present invention and the features thereof can be combined with each other.

[0023] In this description, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. It should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joint" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the invention, but the invention may also be practiced in other ways different from those described herein; obviously, the embodiments in the specification are only some embodiments of the invention, and not all embodiments.

[0025] The following is combined with Figures 1 to 12 Specific embodiments of the present invention will be described in detail below. Example 1

[0026] This embodiment provides a large-size, high-precision wafer alignment and bonding chuck, including an outer ring frame 1, an inner disk body 2, and a spacer assembly 3.

[0027] The inner disc 2 is coaxially fixed in the central empty area of ​​the outer ring frame 1.

[0028] Specifically, the upper surface of the inner disk 2 is provided with an adsorption channel 22 to adsorb the lower wafer.

[0029] The structural design of the adsorption channel 22 is not limited. For example, in this embodiment, the adsorption channel 22 is arranged at the edge of the inner disk 2 and is annular. The adsorption channel 22 extends to the negative pressure interface 233 of the outer ring frame 1 through the adapter component 23. The adapter component 23 includes an adapter block 231 and a connecting tube 232. The adapter block 231 is fixed in the outer ring frame 1 and has a negative pressure interface 233 on its lower surface. One end of the connecting tube 232 is inserted into the adapter block 231 and communicates with the negative pressure interface 233. The other end of the connecting tube 232 is inserted into the inner disk 2 and communicates with the adsorption channel 22.

[0030] Specifically, the lower surface of the inner disc 2 is provided with a positioning groove 24 and a venting groove 25. The positioning groove 24 is used for positioning when the chuck is installed on the bonding table, and the venting groove 25 is used to prevent van der Waals forces from being generated between the inner disc 2 and the bonding table.

[0031] Specifically, the inner disc 2 is coaxially fixed to the central empty area of ​​the outer ring frame 1 via connecting components 4. Multiple sets of connecting components 4 are provided, spaced apart circumferentially along the outer ring frame 1. Each connecting component 4 includes a U-shaped seat 41 and a connecting plate 42: the U-shaped seat 41 is detachably fixed to the lower surface of the inner disc 2 with its opening facing upwards; the connecting plate 42 is detachably fixed to the lower surface of the outer ring frame 1 and inserted into the U-shaped seat 41. During installation, the connecting plate 42 is first fixed to the lower surface of the outer ring frame 1, and then the U-shaped seat 41 is fixed to the lower surface of the inner disc 2, so that the connecting plate 42 is inserted into the U-shaped seat 41. The inner disc 2 is fixed relative to the outer ring frame 1 through the cooperation of multiple sets of connecting components 4. Installation is simple, the connection is highly reliable, and the coaxiality between the inner disc 2 and the outer ring frame 1 is guaranteed by the assembly precision of the connecting components 4. Of course, the inner disc 2 can also be coaxially fixed by other structures. For example, both the inner disc 2 and the outer ring frame 1 are provided with connecting ears, and then they are fixed by bolts that pass through the connecting ears; or, for example, the inner disc 2 and the outer ring frame 1 are fixed with magnets at specific positions and fixed by magnetic attraction of the magnets.

[0032] The detachable fixing structure between the U-shaped seat 41 and the inner plate 2, as well as the detachable fixing structure between the connecting plate 42 and the outer ring frame 1, are not limited. For example, in this embodiment, the detachable fixing between the U-shaped seat 41 and the inner plate 2, and the detachable fixing between the connecting plate 42 and the outer ring frame 1 are achieved by using hexagonal socket head cap screws.

[0033] The number of connecting components 4 is not limited. For example, in this embodiment, there are five sets of connecting components 4.

[0034] The shape of the connecting plate 42 is not limited. For example, in this embodiment, the connecting plate 42 is designed as a T-shaped plate. The large end of the T-shaped plate is fixed by two internal hex bolts, and the small end of the T-shaped plate is inserted into the U-shaped seat 41.

[0035] In some embodiments, multiple second mounting slots 13 are distributed circumferentially on the lower surface of the outer ring frame 1, and the connecting plates 42 of the multiple sets of connecting components 4 are respectively installed in the multiple second mounting slots 13. Multiple third mounting slots 21 are distributed circumferentially on the lower surface of the inner disk 2, and the U-shaped seats 41 of the multiple sets of connecting components 4 are respectively installed in the multiple third mounting slots 21. Through the design of the second mounting slots 13 and the third mounting slots 21, the connecting components 4 can be accommodated inside the outer ring frame 1 and the inner disk 2, effectively avoiding structural interference caused by the outward protrusion of the connecting components 4 when the chuck moves.

[0036] In some embodiments, multiple positioning pins 14 may be inserted into the outer ring frame 1. These positioning pins 14 are spaced apart circumferentially along the outer ring frame 1, and each positioning pin 14 is arranged radially along the outer ring frame 1. The sidewall of the inner disc 2 has positioning holes corresponding to the positioning pins 14, and the positioning pins 14 are inserted into these positioning holes. During installation, the inner disc 2 and the outer ring frame 1 are initially positioned using the connecting component 4, and then the positioning pins 14 are inserted into the outer ring frame 1 and into the positioning holes. The design of the positioning pins 14 and the positioning holes enables precise positioning of the inner disc 2 and the outer ring frame 1, thereby reducing the assembly accuracy requirements of the connecting component 4 and thus reducing the installation difficulty of the connecting component 4.

[0037] The partition assembly 3 includes multiple sets evenly distributed along the circumference of the outer ring frame 1. The partition assembly 3 includes a fixed base 31, an adjusting base 32, a rotating shaft 33, a swing arm 34, a lifting rod 35, and partitions 36. The fixed base 31 is fixed to the lower surface of the outer ring frame 1, and the lower surface of the fixed base 31 has a first conical recess 311. The adjusting base 32 includes a mounting part 321 located below the fixed base 31 and an adjusting part 322 extending outward from one side of the fixed base 31. The upper surface of the mounting part 321 has a second conical recess 323. The adjusting part 322 is connected to the lower part of the outer ring frame 1 by a through-fastener, with a certain amount of movement between the adjusting part 322 and the fastener. The adjusting part 322 is also equipped with an adjusting screw 325. The adjusting screw 325 and the adjusting... Mounting parts 321 are located on both sides of the fastener. Adjusting screws 325 abut against the lower surface of the outer ring frame 1 and are used to rotate the mounting parts 321 upward with the fastener as the fulcrum by screwing. Both ends of the rotating shaft 33 are provided with conical tips, and the two conical tips are respectively inserted into the first conical recess 311 and the second conical recess 323. One end of the swing arm 34 is fixed on the rotating shaft 33 and the other end extends to the other side of the fixed seat 31. The lifting rod 35 is installed on the other end of the swing arm 34. The lifting rod 35 passes through the outer ring frame 1 through the first window 11 opened in the outer ring frame 1. The partition 36 is fixed on the top of the lifting rod 35. The partition 36 has a working state above the inner plate 2 and a clearance state away from the inner plate 2 due to the rotation of the swing arm 34.

[0038] It should be noted that, Figure 4 Fasteners are not shown, but they are installed in mounting holes 324.

[0039] It is easy to understand that the first conical recess 311 and the second conical recess 323 can be in the form of a conical groove or a conical hole, as long as a conical recess can be formed.

[0040] Specifically, the mounting base 31 consists of a mounting post 312 and a mounting plate 313 connected to the lower end of the mounting post 312. The mounting post 312 is inserted into the outer ring frame 1, and the first conical recess 311 is located on the lower surface of the mounting plate 313. The first conical recess 311 is supported on the conical tip of the rotating shaft 33 to fix the mounting base 31 relative to the outer ring frame 1. This structure is easy to assemble and disassemble, and a gap can be maintained between the mounting post 312 and the outer ring frame 1 to facilitate the deflection of the rotating shaft 33. Of course, the mounting base 31 can also be designed as a plate-like structure and directly fixed to the outer ring frame 1 by bolts.

[0041] Specifically, the end of the swing arm 34 furthest from the rotating shaft 33 is equipped with a toggle part 341. An external robotic arm drives the swing arm 34 to rotate via the toggle part 341, thereby switching the partition 36 between the working state and the avoidance state. This structure eliminates the need for a rotary drive component on the chuck, making the structure lighter and easier to handle. Of course, the rotating shaft 33 can also be connected to a rotary drive component, which drives the rotating shaft 33 to rotate.

[0042] Specifically, the lifting rod 35 is a screw rod that passes through and is screwed to the other end of the swing arm 34. A locking nut 37 is screwed to the lower end of the screw rod. By turning the screw rod, the height of the top of the screw rod can be adjusted, thereby adjusting the height of the partition 36. The locking nut 37 can lock the screw rod to keep the height of the partition 36 constant. This lifting rod 35 has a simple structure and is easy to adjust. Of course, the lifting rod 35 can also be slidably inserted into the swing arm 34 and connected to a linear drive component for driving to achieve lifting.

[0043] Specifically, the lifting rod 35 has an internal threaded hole. The partition 36 overlaps the top surface of the lifting rod 35 and is pressed together by a clamping member 38. The clamping member 38 is fixed by a screw that passes through it and is screwed into the internal threaded hole. The clamping member 38, the screw, and the internal threaded hole cooperate to form a detachable structure, facilitating the replacement of the partition 36. It should be noted that the screw... Figure 4 Not shown in the diagram. Of course, the partition 36 can also be fixed to the top of the lifting rod 35 by means of magnetic attraction, welding, etc.

[0044] During installation, first install the fixed base 31, then assemble the rotating shaft 33, swing arm 34, lifting rod 35 and partition 36, then place the upper conical tip of the rotating shaft 33 into the first conical recess 311 of the fixed base 31, and finally install the adjusting base 32, so that the lower conical tip of the rotating shaft 33 abuts into the second conical recess 323 of the adjusting base 32. When the preload needs to be increased, the adjusting screw 325 is turned upwards. Since the adjusting screw 325 abuts against the lower surface of the outer ring frame 1, turning the adjusting screw 325 upwards will increase the distance between the lower surface of the outer ring frame 1 and the adjusting part 322. The adjusting part 322 is connected to the outer ring frame 1 by a fastener. Therefore, turning the adjusting screw 325 will cause the mounting part 321 on the other side of the fastener to deflect upwards with the fastener as the fulcrum. This will ultimately cause the mounting part 321 and the fixed seat 31 to generate a greater clamping force on the rotating shaft 33, thereby increasing the preload. When the preload needs to be decreased, the operation is reversed. When it is necessary to adapt to lower wafers of different thicknesses, the height of the spacer 36 can be adjusted by lifting rod 35.

[0045] It should be noted that the deflection of the mounting part 321 caused by adjusting the set screw 325 is very small, so high-precision adjustment of the preload can be achieved. At the same time, the design of the movable margin and the tapered tip is also more conducive to the deflection of the mounting part 321.

[0046] In some embodiments, a cam 39 may be added to the spacer assembly 3. The cam 39 is rotatably mounted below the outer ring frame 1 and its outline contacts the end of the adjusting part 322. The cam 39 is used to adjust the horizontal position of the adjusting seat 32 by rotation. Since there is a margin of movement between the adjusting part 322 and the fastener, it is easy for the axis of the rotating shaft 33 to not coincide with the axis of the second conical recess 323 during assembly. In this case, the cam 39 rotates to drive the adjusting seat 32 to shift horizontally, thereby ensuring that the rotating shaft 33 and the second conical recess 323 are coaxial.

[0047] The structural form of the cam 39 is not limited. For example, in this embodiment, an eccentric wheel with a circular profile is used as the cam 39. Of course, a common cam 39 with an irregular curve profile can also be used.

[0048] In some embodiments, multiple first mounting slots 12 are evenly distributed circumferentially on the lower surface of the outer ring frame 1, and multiple sets of spacer assemblies 3 are respectively installed in the multiple first mounting slots 12, with the first window 11 located at one end of the first mounting slot 12. Through the design of the first mounting slots 12, the spacer assembly 3 can be accommodated inside the outer ring frame 1, effectively avoiding structural interference caused by the outward protrusion of the spacer assembly 3 when the chuck moves.

[0049] The working process of the large-size, high-precision wafer alignment and bonding chuck in this embodiment is as follows: First, adjust the rotational resistance of the swing arm 34 by turning the set screw 325 to maintain a suitable value. Then, adjust the height of the lifting rod 35 according to the thickness of the lower wafer to be installed, so that the spacer 36 is at a suitable height position. Next, the lower wafer is adsorbed and fixed on the upper surface of the inner disk 2 through the adsorption channel. Finally, rotate the swing arm 34 to switch the spacer 36 from the avoidance state to the working state, so that it overlaps the top surface of the lower wafer. Example 2

[0050] This embodiment provides a large-size, high-precision wafer alignment and bonding chuck, which is based on the large-size, high-precision wafer alignment and bonding chuck described in Embodiment 1, with the addition of a pre-pressure component 5.

[0051] The pre-compression assembly 5 comprises multiple sets, which are respectively installed in multiple second windows 15 opened on the outer ring frame 1 and distributed circumferentially. The pre-compression assembly 5 includes a fixed cylinder 51, a lifting shaft 52, a pre-compression rod 53, a limiting pin 54, and a spring assembly 55. The fixed cylinder 51 is fixed to the lower surface of the outer ring frame 1 and its axis is arranged vertically. The cylinder wall of the fixed cylinder 51 is provided with a first limiting hole 511 and a second limiting hole 512 distributed circumferentially. The first limiting hole 511 is higher than the second limiting hole 512, and the first limiting hole 511 and the second limiting hole 512 are connected by a connecting channel 513 located above. The lifting shaft 52 is inserted into the fixed cylinder 51 and can move up and down relative to the fixed cylinder 51. The preload rod 53 is fixed to the top of the lifting shaft 52 and moves through the lifting shaft 52, having a preloaded state above the inner disc 2 and a retracted state placed in the second window 15; the limiting pin 54 is fixed to the side wall of the lifting shaft 52, and when the preload rod 53 is in the preloaded state, the limiting pin 54 is located in the first limiting hole 511, and when the preload rod 53 is in the retracted state, the limiting pin 54 is located in the second limiting hole 512; the spring assembly 55 includes a retaining ring 551, a boss 552 and a compression spring 553, the retaining ring 551 is located on the top inner side of the fixed cylinder 51, the boss 552 is located at the bottom end of the lifting shaft 52, and the compression spring 553 is sleeved on the lifting shaft 52 and pressed between the retaining ring 551 and the boss 552.

[0052] Specifically, the axis of the preload rod 53 is perpendicular to the axis of the fixed cylinder 51, that is, the preload rod 53 is arranged horizontally. Of course, the preload rod 53 can also be arranged at an angle, as long as it can abut against the wafer to play a preload role.

[0053] Specifically, a flange 514 extends outward from the top of the fixing cylinder 51, and the flange 514 is pressed and fixed to the lower surface of the outer ring frame 1 by through-bolts. Of course, the fixing cylinder 51 can also be fixed to the lower surface of the outer ring frame 1 by magnetic attraction, snap-fit, or other means.

[0054] Specifically, a bearing 57 is fixed to the inner top of the fixed cylinder 51. The bearing 57 supports the lifting shaft 52. A retaining ring 551 is fitted onto the lifting shaft 52 with a clearance and, under the action of a compression spring 553, abuts against the lower part of the inner ring of the bearing 57 for fixation. The bearing 57 here needs to support the lifting shaft 52's lifting, lowering, and rotation. Therefore, a small clearance fit is required between the lifting shaft 52, the bearing 57, and the retaining ring 551. This ensures that when the lifting shaft 52 rotates, it can drive the inner ring of the bearing 57 and the retaining ring 551 to rotate as a whole, while preventing excessive friction between the lifting shaft 52 and the inner ring of the bearing 57 and the retaining ring 551 during lifting, thus guaranteeing the operational accuracy of the lifting shaft 52. Alternatively, the bearing 57 can be omitted, or a bushing or other structure can be used instead.

[0055] Specifically, the upper surface of the boss 552 is provided with an annular groove 554 so that the lower part of the compression spring 553 is placed in the annular groove 554 to improve structural stability. Of course, the annular groove 554 can also be omitted, and the compression spring 553 can be directly abutted against the top surface of the boss 552.

[0056] Before use, the preload rod 53 is in the retracted state. During use, the lifting shaft 52 performs the following actions: first, it rises to move the limiting pin 54 into the connecting channel 513; then, it rotates to position the limiting pin 54 above the first limiting hole 511; finally, it falls to position the limiting pin 54 within the first limiting hole 511. During this process, the preload rod 53 follows the lifting rod 35, rising, rotating, and falling sequentially to complete the switch from the retracted state to the preloaded state.

[0057] In some embodiments, a preload ball 56 may also be installed on the lower surface of the preload rod 53. By using a pressing method in which the preload ball 56 makes point contact with the upper wafer, it is possible to avoid cracking caused by the non-parallelism between the pressing surface and the upper wafer when pressing in a surface contact manner, as well as wafer displacement caused by static friction between the pressing surface and the upper wafer.

[0058] The working process of the large-size, high-precision wafer alignment and bonding chuck in this embodiment is as follows: After the spacer 36 is placed on the top surface of the lower wafer, the robot places the visually aligned upper wafer above the lower wafer and separates it with the spacer 36. Finally, the upper wafer is pressed by the pre-pressing component 5, so that the upper wafer, lower wafer and chuck form a whole for subsequent handling and other operations.

[0059] The above are merely specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Although detailed descriptions have been provided with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments, and they should all be covered within the protection scope of the claims.

Claims

1. A chuck for large-size, high-precision wafer alignment and bonding, characterized in that, It includes an outer ring frame (1), an inner disc body (2), and multiple sets of partition assemblies (3). The inner disc body (2) is coaxially fixed in the central empty area of ​​the outer ring frame (1). The multiple sets of partition assemblies (3) are evenly distributed along the circumference of the outer ring frame (1). The partition assembly (3) includes: A fixing seat (31) is fixed to the lower surface of the outer ring frame (1), and the lower surface of the fixing seat (31) is provided with a first conical recess (311). Adjustment seat (32) includes a mounting part (321) located below the fixed seat (31) and an adjustment part (322) extending out of the fixed seat (31) on one side. The upper surface of the mounting part (321) is provided with a second conical recess (323). The adjustment part (322) is connected to the lower part of the outer ring frame (1) by a through fastener and there is a movable allowance between the adjustment part (322) and the fastener. The adjustment part (322) is also equipped with an adjustment screw (325). The adjustment screw (325) and the mounting part (321) are located on both sides of the fastener. The adjustment screw (325) abuts against the lower surface of the outer ring frame (1) and is used to rotate the mounting part (321) upward with the fastener as the fulcrum by screwing. The rotating shaft (33) has tapered tips at both ends, and the two tapered tips are respectively inserted into the first tapered recess (311) and the second tapered recess (323). A swing arm (34), one end of which is fixed to the rotating shaft (33) and the other end extends to the other side of the fixed seat (31); A lifting rod (35) is installed at the other end of the swing arm (34), and the lifting rod (35) passes through the outer ring frame (1) through a first window (11) opened in the outer ring frame (1). The partition (36) is fixed to the top of the lifting rod (35). The partition (36) has a working state above the inner plate (2) and a avoidance state away from the inner plate (2) by the rotation of the swing arm (34).

2. The chuck for large-size, high-precision wafer alignment and bonding according to claim 1, characterized in that, The lower surface of the outer ring frame (1) is evenly distributed with multiple first mounting slots (12) along the circumference. Multiple sets of partition assemblies (3) are respectively installed in multiple first mounting slots (12), and the first window (11) is located at one end of the first mounting slot (12).

3. The chuck for large-size, high-precision wafer alignment and bonding according to claim 1, characterized in that, The lifting rod (35) is a screw rod, which passes through and is screwed to the other end of the swing arm (34), and a locking nut (37) is screwed to the lower end of the screw rod.

4. The chuck for large-size, high-precision wafer alignment and bonding according to claim 1, characterized in that, The lifting rod (35) is provided with an internal threaded hole. The partition (36) overlaps the top surface of the lifting rod (35) and is pressed by a clamping member (38). The clamping member (38) is fixed by a screw that passes through it and is screwed into the internal threaded hole.

5. The large-size, high-precision wafer alignment and bonding chuck according to any one of claims 1 to 4, characterized in that, The partition assembly (3) also includes a cam (39) which is rotatably mounted below the outer ring frame (1) and whose outline contacts the end of the adjustment part (322). The cam (39) is used to adjust the horizontal position of the adjustment seat (32) by rotation.

6. The chuck for large-size, high-precision wafer alignment and bonding according to claim 1, characterized in that, The inner disc (2) is coaxially fixed within the central empty area of ​​the outer ring frame (1) via a connecting assembly (4). Multiple sets of the connecting assembly (4) are provided, and these sets are spaced apart circumferentially along the outer ring frame (1). The connecting assembly (4) includes: U-shaped seat (41), which is detachably fixed to the lower surface of the inner disc (2) and has its opening facing upward; The connecting plate (42) is detachably fixed to the lower surface of the outer ring frame (1) and inserted into the U-shaped seat (41).

7. The chuck for large-size, high-precision wafer alignment and bonding according to claim 6, characterized in that, The lower surface of the outer ring frame (1) is provided with a plurality of second mounting slots (13) spaced apart along the circumference. The connecting plates (42) of the multiple sets of connecting components (4) are respectively installed in the multiple second mounting slots (13). The lower surface of the inner disc (2) is provided with a plurality of third mounting slots (21) spaced apart along the circumference. The U-shaped seats (41) of the multiple sets of connecting components (4) are respectively installed in the multiple third mounting slots (21).

8. The chuck for large-size, high-precision wafer alignment and bonding according to claim 6 or 7, characterized in that, The outer ring frame (1) is also fitted with a plurality of positioning pins (14). The plurality of positioning pins (14) are distributed circumferentially along the outer ring frame (1) and each positioning pin (14) is arranged radially along the outer ring frame (1). The side wall of the inner disc (2) is provided with positioning holes corresponding to the positioning pins (14), and the positioning pins (14) are inserted into the positioning holes.

9. The chuck for large-size, high-precision wafer alignment and bonding according to claim 1, characterized in that, It also includes multiple sets of pre-compression components (5), which are respectively installed in multiple second windows (15) opened in the outer ring frame (1) and distributed circumferentially. The pre-compression components (5) include: A fixed cylinder (51) is fixed to the lower surface of the outer ring frame (1) and its axis is arranged vertically. The cylinder wall of the fixed cylinder (51) is provided with a first limiting hole (511) and a second limiting hole (512) distributed circumferentially. The first limiting hole (511) is higher than the second limiting hole (512), and the first limiting hole (511) and the second limiting hole (512) are connected through a connecting channel (513) located above. A lifting shaft (52) is inserted into the fixed cylinder (51), and the lifting shaft (52) is capable of lifting and rotating relative to the fixed cylinder (51); The preload rod (53) is fixed to the top of the lifting shaft (52) and moves through the lifting shaft (52) to have a preloaded state above the inner disc (2) and a retracted state placed in the second window (15); The limiting pin (54) is fixed on the side wall of the lifting shaft (52), and when the preload rod (53) is in the preload state, the limiting pin (54) is located in the first limiting hole (511), and when the preload rod (53) is in the retracted state, the limiting pin (54) is located in the second limiting hole (512). The spring assembly (55) includes a retaining ring (551), a boss (552) and a compression spring (553). The retaining ring (551) is located on the inner side of the top of the fixed cylinder (51), the boss (552) is located at the bottom end of the lifting shaft (52), and the compression spring (553) is sleeved on the lifting shaft (52) and pressed between the retaining ring (551) and the boss (552).

10. The chuck for large-size, high-precision wafer alignment and bonding according to claim 9, characterized in that, A preload ball (56) is installed on the lower surface of the preload rod (53).

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