Split type full-automatic temporary wafer bonder

Abstract

The present application relates to the technical field of temporary wafer bonding, and particularly relates to a split type full-automatic temporary wafer bonding machine, which mainly solves the technical problem of lack of full-automatic temporary wafer bonding machine in the prior art. The machine comprises a loading cavity, an alignment cavity, a carrying cavity and a bonding cavity arranged in sequence in the left-right direction. At least two loading tables are arranged on the side of the loading cavity away from the alignment cavity, and the loading tables are used to install wafer cassette boxes. A pre-alignment device and a wafer carrying robot are further arranged in the loading cavity. A chuck storage rack, a cooling station separation device and an alignment device are arranged in the alignment cavity and distributed along the front-rear direction. A chuck carrying robot is arranged in the carrying cavity. A plurality of bonding devices are arranged in the bonding cavity and distributed along the front-rear direction. The machine can realize automatic transfer of wafers and chucks through the structural layout and cooperation with the carrying robot, so as to realize full-automatic temporary wafer bonding operation in cooperation with various processing devices.

Description

Technical Field

[0001] This invention relates to the field of temporary wafer bonding technology, and more particularly to a split-type fully automatic temporary wafer bonding machine. Background Technology

[0002] Temporary wafer bonding refers to the technique of coating a temporary bonding adhesive layer on the surface of an upper wafer and / or a lower wafer, and then cross-linking the temporary bonding adhesive layer through processes such as UV curing and hot pressing, thereby achieving a tight bond between the upper and lower wafers to form a wafer pair. Temporary wafer bonding is generally completed using equipment such as a loading device, an alignment device, a bonding device, and a cooling station separation device.

[0003] In the existing technology, the aforementioned devices are all set up independently, and the entire temporary bonding process is completed through multiple steps and with the cooperation of manual labor. It is impossible to achieve fully mechanical operation, and thus cannot meet the development needs of unmanned and fully automated semiconductor processing industry.

[0004] Therefore, there is an urgent need for a fully automated temporary wafer bonding machine. Summary of the Invention

[0005] To overcome the technical deficiency of the lack of fully automated temporary wafer bonding machines in the prior art, the present invention provides a split-type fully automated temporary wafer bonding machine.

[0006] The present invention provides a split-type fully automatic temporary wafer bonding machine, comprising a loading cavity, an alignment cavity, a transport cavity, and a bonding cavity arranged sequentially in the left-right direction. The loading cavity has at least two loading stages on the side away from the alignment cavity, the loading stages being used to install wafer cassettes. The loading cavity also includes a pre-alignment device and a wafer transport robot. The alignment cavity includes a chuck storage rack, a cooling station separation device, and an alignment device distributed in the front-back direction. The transport cavity includes a chuck transport robot. The bonding cavity includes multiple bonding devices distributed in the front-back direction.

[0007] The wafer handling robot is used to transfer wafers between the wafer cassette and the pre-alignment device, between the pre-alignment device and the alignment device, and between the cooling station separation device and the wafer cassette.

[0008] The chuck handling robot is used to transfer the chuck between the chuck storage rack (21) and the alignment device, between the alignment device and the bonding device, and between the bonding device and the cooling station separation device.

[0009] The technical solution provided by this invention has the following advantages compared with the prior art:

[0010] The present invention provides a split-type fully automatic temporary wafer bonding machine, which includes a loading cavity, an alignment cavity, a transport cavity, and a bonding cavity arranged sequentially in the left-right direction. The loading cavity is equipped with a loading platform, a pre-alignment device, and a wafer transport robot. The alignment cavity is equipped with a chuck storage rack, a cooling station separation device, and an alignment device. The transport cavity is equipped with a chuck transport robot, and the bonding cavity is equipped with a bonding device. Through the above structural layout and in conjunction with the wafer transport robot and the chuck transport robot, the automatic transfer of wafers and chucks can be realized, thereby cooperating with various processing devices to achieve fully automated temporary wafer bonding operations, which can meet the development needs of unmanned and fully automated semiconductor processing industry. Attached Figure Description

[0011] Figure 1 This is a schematic diagram showing the overall structure of the temporary wafer bonding machine in an embodiment of the present invention;

[0012] Figure 2 This is a schematic diagram of the structure of the feeding cavity at a first angle in an embodiment of the present invention;

[0013] Figure 3 This is a schematic diagram of the feeding cavity in an embodiment of the present invention at a second angle;

[0014] Figure 4 This is a schematic diagram of the alignment cavity in an embodiment of the present invention;

[0015] Figure 5 This is a schematic diagram of the structure of the transport cavity in an embodiment of the present invention;

[0016] Figure 6 This is a schematic diagram of the bonding cavity in an embodiment of the present invention;

[0017] Figure 7 This is a schematic diagram of the structure of the wafer handling robot in an embodiment of the present invention;

[0018] Figure 8 This is a schematic diagram of the structure of the chuck handling robot in an embodiment of the present invention;

[0019] Figure 9 This is a schematic diagram of the pre-alignment device in an embodiment of the present invention;

[0020] Figure 10 This is a schematic diagram showing the top surface structure of the chuck adapted in this embodiment of the invention;

[0021] Figure 11 This is a schematic diagram showing the bottom structure of the chuck adapted in this embodiment of the invention;

[0022] Figure 12 This is a schematic diagram of the structure of the chuck storage rack in an embodiment of the present invention;

[0023] Figure 13 This is a schematic diagram of the alignment device in an embodiment of the present invention;

[0024] Figure 14 This is a schematic diagram of the vision mechanism in an embodiment of the present invention;

[0025] Figure 15 This is a schematic diagram of the structure of the adsorption platform in an embodiment of the present invention;

[0026] Figure 16 This is a schematic diagram of the structure of the adjustment platform in an embodiment of the present invention;

[0027] Figure 17 This is a schematic diagram of the structure of the first group of leveling components in an embodiment of the present invention;

[0028] Figure 18 This is a schematic diagram of the structure of the second group of leveling components in an embodiment of the present invention;

[0029] Figure 19 This is a schematic diagram showing the structure of the top plate and auxiliary components in an embodiment of the present invention;

[0030] Figure 20 This is a schematic diagram showing the structure of the base plate and auxiliary components in an embodiment of the present invention;

[0031] Figure 21 This is a schematic diagram of the bonding device in an embodiment of the present invention.

[0032] Figure 22 This is a schematic diagram of the structure of the cooling station separation device in an embodiment of the present invention;

[0033] Figure 23 This is an exploded view of the cooling mechanism in an embodiment of the present invention;

[0034] Figure 24 This is a schematic diagram of the drive mechanism in an embodiment of the present invention;

[0035] Figure 25 This is a schematic diagram of the lifting mechanism in an embodiment of the present invention.

[0036] In the picture:

[0037] 1. Feeding cavity;

[0038] 11. Loading platform; 12. Pre-alignment device; 121. Support frame; 122. Z-axis drive pair; 123. Mounting plate; 124. Support block; 125. Clamping block; 126. Positioning sensor; 13. Wafer handling robot; 131. First mounting plate; 132. First front and rear drive pair; 133. Mounting frame; 134. First lifting drive pair; 135. Drive link; 136. First rotation drive pair; 137. Wafer handling finger; 14. Operating device; 141. Connecting frame; 142. Input component; 143. Display component;

[0039] 2. Align with the cavity;

[0040] 21. Chuck storage rack; 211. Fixed platform; 212. Fixed frame; 213. Support plate; 214. Actuating structure; 22. Cooling station separation device; 221. Support platform; 2211. Support column; 2212. Platform; 222. Second gantry frame; 2221. Crossbeam; 2222. Column; 223. Cooling mechanism; 2231. Support component; 2232. Cooling plate; 22321. Chassis; 22322. Top cover; 22323. Cooling channel; 22324. Inlet end; 22325. Outlet end; 22326. Positioning pin; 22327. Adsorption Components; 22328, Separator; 22329, Flow equalization strip; 224, Temperature measuring mechanism; 225, Drive mechanism; 2251, Second lifting drive pair; 2252, Second rotary drive pair; 2253, Second claw; 226, Positive pressure separation mechanism; 2261, Bracket; 2262, Vertical cylinder; 2263, Nozzle; 227, Air separation mechanism; 2271, Connecting seat; 2272, Air blowing head; 228, Lifting mechanism; 2281, Suction nozzle; 2282, Lifting drive component; 2283, Mounting plate; 2284, Tension sensor; 229, Optical alignment mechanism 2291. Optical transceiver; 2292. Reflector; 23. Alignment device; 231. Frame; 2311. Base; 23111. Base frame; 23112. Marble slab; 23113. Shock-absorbing pad; 2312. First gantry frame; 232. Vision mechanism; 2321. Moving plate; 2322. Vision camera; 2323. Edge-mounted camera; 233. Adsorption platform; 2331. Notch; 2332. Detection port; 234. XYZ three-axis platform; 235. Rotary platform; 236. Adjustment platform; 2361. Base plate; 2362. Top plate; 2363. 23631. Leveling assembly; 23632. Fixed base; 23633. Sliding block; 23634. Lifting block; 23635. Connecting rod; 23636. First crossed roller guide; 23637. Second crossed roller guide; 2364. Negative pressure connection assembly; 2365. First drive assembly; 23651. Telescopic cylinder; 23652. Lever; 2366. Second drive assembly; 23661. Lifting and rotating combination drive pair; 23662. First chuck; 2367. Lifting assembly; 23671. Lifting drive component; 23672. Ejector pin; 2368. Support plate;

[0041] 3. Transporting the cavity;

[0042] 31. Chuck handling robot; 311. Second mounting plate; 312. Second front and rear drive pairs; 313. Multi-joint robotic arm; 314. End effector;

[0043] 4. Bonding cavity;

[0044] 41. Bonding device; 411. Vacuum bonding chamber; 412. Gate valve; 413. Vacuuming assembly; 414. Pressurization assembly;

[0045] 51. Air purification device; 52. Ionizing air device;

[0046] 100. Inner disc body; 200. Outer ring frame; 300. Spacer assembly; 400. Pre-compression assembly; 500. Adsorption assembly; 600. Adsorption channel; 700. Adapter assembly; 800. Positioning hole; 900. Alignment hole. Detailed Implementation

[0047] Reference Figures 1 to 6 This embodiment provides a split-type fully automatic temporary wafer bonding machine, including a loading chamber 1, an alignment chamber 2, a transport chamber 3, and a bonding chamber 4 arranged sequentially in the left-right direction. The loading chamber 1 has at least two loading stages 11 on the side away from the alignment chamber 2, which are used to mount wafer cassettes. The loading chamber 1 also includes a pre-alignment device 12 and a wafer transport robot 13. The alignment chamber 2 has a chuck storage rack 21, a cooling station separation device 22, and an alignment device 23 distributed in the front-back direction. The transport chamber 3 contains a chuck transport robot 3. 1. The bonding cavity 4 is provided with multiple bonding devices 41 distributed in the front-to-back direction; the wafer handling robot 13 is used to realize the transfer of wafers between the wafer cassette and the pre-alignment device 12, between the pre-alignment device 12 and the alignment device 23, and between the cooling station separation device 22 and the wafer cassette; the chuck handling robot 31 is used to realize the transfer of chucks between the chuck storage rack 21 and the alignment device 23, between the alignment device 23 and the bonding device 41, and between the bonding device 41 and the cooling station separation device 22.

[0048] Reference Figure 7 The wafer handling robot 13 includes a first mounting plate 131, a first front-rear drive pair 132, a mounting frame 133, a first lifting drive pair 134, a drive link 135, a first rotary drive pair 136, and wafer handling fingers 137. The first mounting plate 131 is connected to the inner wall of the loading cavity 1. The fixed part of the first front-rear drive pair 132 is connected to the first mounting plate 131. The mounting frame 133 is connected to the output part of the first front-rear drive pair 132. The fixed part of the first lifting drive pair 134 is connected to the mounting frame 133. One end of the drive link 135 is connected to the output part of the second lifting drive pair 135. The fixed part of the first rotary drive pair 136 is connected to the other end of the drive link 135, and the rotation axis of the first rotary drive pair 136 is arranged horizontally. The wafer handling fingers 137 are connected to the output part of the first rotary drive pair 136.

[0049] During operation, the first front-to-back drive pair 132 provides left-to-right displacement for the wafer handling finger 137, enabling the wafer handling finger 137 to switch between different cartridges and pre-alignment devices 12; the first lifting drive pair 134 provides vertical displacement for the wafer handling finger 137 to meet the height requirements during different docking operations; the first rotation drive pair 136 drives the wafer handling finger 137 to complete the flipping action, so that after picking up the wafer, it can dock with the adsorption platform 233 of the alignment device 23; the wafer handling finger 137 has a built-in vacuum adsorption structure, which can adsorb the wafer through negative pressure.

[0050] Reference Figure 8 The chuck handling robot 31 includes a second mounting plate 311, a second front and rear drive pair 312, a multi-joint robotic arm 313, and an end effector 314. The second mounting plate 311 is connected to the bottom wall of the handling cavity 3. The fixed part of the second front and rear drive pair 312 is connected to the second mounting plate 311. The bottom end of the multi-joint robotic arm 313 is connected to the output part of the second front and rear drive pair 312. The end effector 314 is connected to the top end of the multi-joint robotic arm 313 and is a chuck handling finger used to pick up and put down the chuck.

[0051] During operation, the second front and rear drive joints 312 cooperate with the multi-joint robotic arm 313 to provide multi-axis motion for the end effector 314, thereby facilitating the interaction between the chuck-carrying fingers and the chuck storage rack 21 and the alignment device 23, the alignment device 23 and the bonding device 41, and the bonding device 41 and the cooling station separation device 22. In this embodiment, the second front and rear drive joints 312 and the multi-joint robotic arm 313 cooperate to form a six-axis robot.

[0052] Reference Figure 9 The pre-alignment device 12 includes a support frame 121, a Z-axis drive pair 122, a mounting plate 123, support blocks 124, a Z-axis rotary joint, clamping blocks 125, and a positioning sensor. The support frame 121 is fixed inside the loading cavity 1. The fixed part of the Z-axis drive pair 122 is connected to the support frame 121. The mounting plate 123 is connected to the output part of the Z-axis drive pair 122, and the mounting plate 123 is provided with a plurality of support blocks 124 for supporting the edge of the wafer. The Z-axis rotary joint is fixedly connected to the support frame 121. There are a plurality of clamping blocks 125, all of which are mounted on the output part of the Z-axis rotary joint. The plurality of clamping blocks 125 are located around the mounting plate 123 and are driven to move radially along the mounting plate 123 to clamp the wafer from the side. The positioning sensor 126 is connected to the support frame 121 and is used to detect the circumferential angle of the wafer.

[0053] During operation, the wafer handling robot 13 first places the wafer on multiple support blocks 124; then multiple clamping blocks 125 move radially inward until they clamp the edge of the wafer, and the wafer position is initially calibrated by the structural accuracy of the multiple clamping blocks 125; then the Z-axis drive joint 122 drives the mounting plate 123 and the support blocks 124 to descend, causing the wafer to detach from the support blocks 124; then the Z-axis rotary joint drives the clamping blocks 125 and the wafer to rotate around the Z-axis until the positioning sensor 126 detects that the wafer has rotated to the target circumferential angle, and the pre-calibration is completed; finally, the wafer handling robot 13, in conjunction with the radial outward movement of the clamping blocks 125, picks up the pre-calibrated wafer again.

[0054] Specifically, the clamping block 125 has a V-shaped groove on its surface for clamping the wafer, and the edge of the wafer is placed in the V-shaped groove to achieve stable support.

[0055] Specifically, the positioning sensor 126 is configured as two opposing infrared sensors. Utilizing the structural characteristics of the wafer itself, infrared light can only penetrate the wafer when the wafer is rotated to the target circumferential angle, thereby enabling the infrared sensor to receive a signal. At other circumferential angles, the infrared light is blocked by the wafer.

[0056] It is easy to understand that the pre-alignment device 12 in this embodiment achieves wafer spatial position calibration through the clamping block 125, and achieves wafer circumferential angle calibration through the Z-axis rotary joint and the positioning sensor 126. The two work together to achieve wafer pre-calibration.

[0057] To more clearly describe the structure of the chuck storage rack 21, the alignment device 23, the cooling station separation device 22, and the bonding device 41, the following is a combination of... Figures 10 to 11 The chuck adapted to the device in this embodiment will be described.

[0058] The chuck includes an inner disc body 100 and an outer ring frame 200. The chuck is equipped with a spacer assembly 300, a pre-compression assembly 400, and an adsorption assembly 500. The spacers of the spacer assembly 300 have a working state above the inner disc body 100 and a clearance state away from the inner disc body 100 by being pulled. The pre-compression rod of the pre-compression assembly 400 has a pre-compression state above the inner disc body 100 and a storage state placed inside the outer ring frame 200 by lifting, lowering, and rotating. The adsorption assembly 500 includes an annular adsorption channel 600 located at the edge of the top surface of the inner disc body 100. The adsorption channel 600 extends to the bottom surface of the outer ring frame 200 through a transition assembly 700. The bottom surface of the inner disc body 100 is also provided with two positioning holes 800, and the edge of the outer ring frame 200 is provided with two alignment holes 900.

[0059] Reference Figure 12The chuck storage rack 21 includes a fixed platform 211, a fixed frame 212, and a support plate 213. The fixed platform 211 is connected to the bottom wall of the alignment cavity 2. The fixed frame 212 is connected to the fixed platform 211. The support plate 213 has multiple layers and is connected to the fixed frame 212. Each layer of the support plate 213 is arranged horizontally, and the top layer of the support plate 213 is equipped with a toggle structure 214 for moving the chuck spacer.

[0060] During operation, each support plate 213 is used to place a chuck. After the chuck is picked up from the support plate 213 below, the chuck transport robot 31 first places it on the support plate 213 on the top layer. Then, the chuck's partition is moved to the avoidance state by the toggle mechanism 214. Finally, the chuck transport robot 31 transports the chuck to the alignment device 23.

[0061] Reference Figures 13 to 20 The alignment device 23 includes a frame 231, a vision mechanism 232, an adsorption platform 233, an XYZ three-axis platform 234, a rotary platform 235, and an adjustment platform 236.

[0062] The frame 231 includes a base 2311 and a first gantry 2312, with the first gantry 2312 fixed to the base 2311.

[0063] Specifically, in this embodiment, the base 2311 includes a base frame 23111, a marble slab 23112, and a shock-absorbing pad 23113. The marble slab 23112 is fixed to the base frame 23111 by the shock-absorbing pad 23113. The marble slab 23112 has good flatness, and the shock-absorbing pad 23113 can improve the buffering capacity of the device. In other embodiments, the base 2311 may also adopt a box-shaped structure, etc.

[0064] The vision mechanism 232 is installed above the crossbeam 2221 of the first gantry 2312, and the adsorption platform 233 is fixed below the crossbeam 2221 of the first gantry 2312. The lower surface of the adsorption platform 233 is used for vacuum adsorption of the wafer, and the adsorption platform 233 is provided with a notch 2331 for visual alignment.

[0065] Specifically, in this embodiment, the adsorption stage 233 has two notches 2331 distributed at °. The vision mechanism 232 includes two sets of vision components. Each vision component includes a movable plate 2321 and a vision camera 2322. The movable plate 2321 is mounted above the crossbeam 2221 of the first gantry 2312 and is driven to move along the line connecting the two notches 2331. The vision camera 2322 is mounted on the movable plate 2321 and is driven to rise and fall. The movable plate 2321 and the vision camera 2322 can be driven by linear power components such as a linear slide. By sliding the movable plate 2321, the vision camera 2322 can be moved to different positions to adapt to wafers with different marking positions. The cooperation of the two sets of vision components can improve the accuracy of vision alignment. In other embodiments, one or three sets of vision components may also be provided.

[0066] Furthermore, the vision mechanism 232 also includes edge cameras 2323. Three sets of edge cameras 2323 are provided, with two sets mounted on two movable plates 2321 and collinear with the vision cameras 2322 of the two vision components. The remaining set of edge cameras 2323 is mounted on the crossbeam 2221 of the first gantry 2312, and the adsorption platform 233 has a detection port 2332 corresponding to the edge camera 2323. Each set of edge cameras 2323 is driven to move up and down. The edge cameras 2323 can be driven by linear motion components such as linear slides. The position of the remaining set of edge cameras 2323 is not limited, but it is preferably installed in the middle position of the vision cameras 2322 of the two vision components. The three sets of edge cameras 2323 can detect the edges of the wafer, and in conjunction with the vision cameras 2322, the detection accuracy can be improved.

[0067] It should be noted that the adsorption platform 233 in the figure has two notches 2331 and two detection ports 2332. A vision component is installed at each of the two notches 2331, and only one detection port 2332 is equipped with an edge camera 2323.

[0068] Specifically, in this embodiment, the adsorption platform 233 is a microporous ceramic adsorption plate, which has advantages such as high flatness and high cleanliness. In other embodiments, the adsorption platform 233 may also be a metal suction cup, etc.

[0069] The XYZ three-axis platform 234 is mounted on the base 2311 and located inside the first gantry 2312.

[0070] It is easy to understand that the XYZ three-axis platform 234 is a mature structure in this field, and will not be elaborated here.

[0071] The rotary platform 235 is mounted on the XYZ three-axis platform 234 and the rotation axis is arranged along the Z direction.

[0072] Specifically, the structure of the rotating platform 235 is not limited. For example, the rotating platform 235 in this embodiment is an air-floating rotating structure with low friction and high precision.

[0073] The adjustment platform 236 includes a base plate 2361, a top plate 2362, and a leveling assembly 2363. The base plate 2361 is fixed on the rotating platform 235. The leveling assembly 2363 is connected between the base plate 2361 and the top plate 2362 and is distributed in multiple sets at intervals along the circumference. The top plate 2362 is used to absorb the chuck. The top plate 2362 is also provided with a negative pressure connection assembly 2364 for docking with the negative pressure channel of the chuck. The base plate 2361 is also provided with a first drive assembly 2365 for moving the chuck partition and a second drive assembly 2366 for moving the chuck preload rod. The second drive assembly 2366 is arranged corresponding to the notch 2331.

[0074] Specifically, the leveling component 2363 in this embodiment includes a fixed base 23631, a sliding block 23632, a lifting block 23633, and a connecting rod 23634. The fixed base 23631 is fixed on the base plate 2361. The sliding block 23632 is mounted on the fixed base 23631 and is driven to move horizontally. The lifting block 23633 is mounted on the fixed base 23631 and can move freely up and down. The lifting block 23633 and the sliding block 23632 are slidably connected by a wedge structure so that the lifting block 23633 moves up and down when the sliding block 23632 moves horizontally. The bottom end of the connecting rod 23634 is fixedly connected to the lifting block 23633, and the top end is movably connected to the top plate 2362. The sliding block 23632 can be driven by a linear slide or other linear power component. The lifting block 23633 can be freely raised and lowered by a guide rail pair, a column 2222 sleeve pair, or other commonly used guide pairs. During operation, the horizontal movement of the sliding block 23632 is converted into the lifting and lowering of the lifting block 23633 through the wedge structure, thereby adjusting the height of the top plate 2362.

[0075] More specifically, the bottom of the sliding block 23632 is connected to the fixed seat 23631 via the first crossed roller guide 23635, and the top of the sliding block 23632 is connected to the lifting block 23633 via the second crossed roller guide 23636. The second crossed roller guide 23636 is arranged at an angle to form a wedge-shaped structure. The crossed roller guide has the advantages of low friction and high precision. In other embodiments, a guide rail pair can also be used to connect the sliding block 23632 to the fixed seat 23631, or a wedge-shaped structure can be formed by the cooperation of an inclined guide groove and a sliding rod.

[0076] Specifically, the leveling components 2363 in this embodiment are provided in two sets distributed at °. The first set of leveling components 2363 includes two sets of leveling components 2363, and the top end of the connecting rod 23634 of the first set of leveling components 2363 is movably connected to the top plate 2362 through a ball-and-V-groove fitting structure. The second set of leveling components 2363 includes one set of leveling components, and the top end of the connecting rod 23634 of the second set of leveling components 2363 is movably connected to the top plate 2362 through a ball-and-joint structure. Since the top plate 2362 will not only shift vertically but also horizontally during the leveling process, this embodiment sets the leveling components 2363 in two sets arranged opposite to each other: one set adopts a ball-and-V-groove fitting structure, which can simultaneously compensate for vertical and horizontal shifts; the other set adopts a ball-and-joint structure to ensure that the position of the top plate 2362 does not shift significantly, and can also compensate for the angle changes of the top plate 2362 during the leveling process.

[0077] Specifically, the structure of the negative pressure connection component 2364 is not limited. For example, in this embodiment, the negative pressure connection component 2364 adopts an elastic structure so that it can abut against the negative pressure channel of the chuck with a certain elastic force, thereby ensuring a sealed connection.

[0078] The first drive component 2365 and the second drive component 2366 need to be designed according to the configured chuck structure, which should be easy for those skilled in the art to design.

[0079] For example, the chuck structure configured in the high-precision wafer alignment device 23 of this embodiment is shown in the figure. The chuck includes an inner disk body 100 and an outer ring frame 200. The chuck is provided with a spacer assembly 300 and a pre-pressing assembly 400. The spacers of the spacer assembly 300 have a working state above the inner disk body 100 and a clearance state away from the inner disk body 100 by being pulled. The pre-pressing rod of the pre-pressing assembly 400 has a pre-pressing state above the inner disk body 100 and a storage state placed in the outer ring frame 200 by being raised, lowered and rotated.

[0080] Therefore, the first drive assembly 2365 in this embodiment is designed as a combination of a telescopic cylinder 23651 and a lever 23652. The telescopic cylinder 23651 is arranged horizontally, and the lever 23652 is driven to move horizontally through the telescopic cylinder 23651, and the lever 23652 pulls the partition. The second drive assembly 2366 is designed as a combination of a lifting and rotating combined drive pair 23661 and a first claw 23662. The lifting and rotating combined drive pair 23661 drives the first claw 23662 to lift and rotate, and the first claw 23662 drives the pre-compression assembly 400 to lift and rotate.

[0081] It should be noted that multiple support plates 2368 are provided between the base plate 2361 and the top plate 2362. A clearance is provided between the support plates 2368 and the top plate 2362 to compensate for any positional shift of the top plate 2362 during leveling. The support plates 2368 are mainly used to support the top plate 2362 and its associated structures when not in operation.

[0082] Furthermore, the top plate 2362 is also equipped with lifting components 2367. Multiple sets of lifting components 2367 are distributed circumferentially. Each lifting component 2367 includes a lifting drive 23671 and a lifting pin 23672. The lifting drive 23671 is installed below the top plate 2362. The lifting pin 23672 is connected to the output end of the lifting drive 23672 and can penetrate the top plate 2362 and the chuck under the action of the lifting drive 23671. The lifting pins 23672 of the multiple sets of lifting components 2367 are used to engage the edge of the wafer to achieve initial positioning. The lifting components 2367 can be made using linear power components such as cylinders. After the wafer handling robot 13 picks up the wafer, it first places it between multiple ejector pins 23672, so that the edge of the wafer is simultaneously engaged in the multiple ejector pins 23672, thereby achieving initial positioning. Then, the lifting drive 23671 drives the ejector pins 23672 and the wafer to descend as a whole until the wafer falls onto the chuck. This can improve the positional accuracy of the wafer and avoid large errors.

[0083] The working principle of the high-precision wafer alignment device 23 in this embodiment is as follows:

[0084] 1) The chuck transport robot 31 transfers the chuck to the top plate 2362, and the chuck is fixed to the top plate 2362 by negative pressure adsorption;

[0085] 2) The wafer handling robot 13 transfers the upper wafer to the adsorption platform 233, and the upper wafer is fixed to the lower surface of the adsorption platform 233 by negative pressure adsorption.

[0086] 3) The lifting drive 23671 drives the ejector pin 23672 to extend, and the wafer handling robot 13 transfers the lower wafer to the ejector pin 23672. The edge of the lower wafer is engaged with the inside of multiple ejector pins 23672.

[0087] 4) The lifting drive component 23671 drives the ejector pin 23672 to retract, and the lower wafer falls onto the chuck and is fixed by negative pressure adsorption;

[0088] 5) The vision unit 232 detects the markings on the upper and lower wafers and obtains the position difference signal;

[0089] 6) The leveling component 2363, the XYZ three-axis platform 234 and the rotary platform 235 work together according to the position difference signal to make a small adjustment to the lower wafer until the lower wafer and the upper wafer are aligned.

[0090] 7) The first drive component 2365 drives the partition to move, causing the partition to switch to the working state;

[0091] 8) The XYZ three-axis platform 234 drives the rotary platform 235, the adjustment platform 236, the chuck, and the lower wafer to move upward as a whole until the lower wafer contacts the upper wafer;

[0092] 9) The second drive component 2366 drives the preload rod to move, causing the preload rod to switch to the preload state;

[0093] 10) When the negative pressure of the adsorption platform 233 fails, the XYZ three-axis platform 234 descends, the negative pressure of the top plate 2362 fails, and the chuck handling robot 31 transfers the chuck, upper wafer and lower wafer as a whole to the next process.

[0094] The high-precision wafer alignment device 23 provided in this embodiment, on the one hand, identifies the markings of the upper and lower wafers through the vision mechanism 232, and performs fine-tuning of the chuck position through the leveling component 2363, the XYZ three-axis platform 234, and the rotary platform 235, thereby achieving position calibration between the lower and upper wafers and ensuring alignment accuracy. On the other hand, after visual alignment, the XYZ three-axis platform 234 drives the lower wafer, chuck, and adjustment platform 236 to rise as a whole, so that the lower wafer contacts the upper wafer. Then, the second drive component 2366 with a corresponding notch moves the pre-pressure rod to complete the clamping and fixing of the upper and lower wafers. The entire process does not require the wafer to detach from its original adsorption surface, which can avoid the decrease in accuracy caused by removal, transfer, and placement. The combination of these two aspects enables this device to ensure the accuracy when the upper and lower wafers are finally fixed, thereby meeting process requirements.

[0095] Reference Figure 21 The bonding device 41 includes a vacuum bonding chamber 411, which is equipped with a gate valve 412. The vacuum bonding chamber 411 is connected to a vacuum pumping assembly 413. The vacuum bonding chamber 411 is equipped with an upper pressure head and a lower pressure head. The upper pressure head is connected to a pressurizing assembly 414. Both the upper pressure head and the lower pressure head are equipped with a heating plate and a cooling plate 2232.

[0096] It should be noted that the bonding device 41 is a mature structure in this field, and its main function is to apply pressure and heat to the wafer pair on the chuck in a vacuum environment to complete the bonding; for example, as described in the patent with publication number CN119517763A. The bonding device 41 needs to be equipped with a toggle component for moving the chuck spacers. Before applying pressure, the toggle component moves the chuck spacers to a clearance state so that the upper and lower wafers can be fully bonded.

[0097] During the operation, the chuck transport robot 31 places the chuck with the wafer pair into the vacuum bonding chamber 411 through the insert valve 412, and the insert valve 412 is closed. Then, the vacuum pumping assembly 413 is activated to evacuate the vacuum bonding chamber 411. Next, the toggle assembly moves the chuck's spacer to a clearance position. Then, the pressurizing assembly 414 lowers the upper pressure head to apply pressure to the wafer. When the pressure reaches the set value, it is held at the temperature for a preset time. After that, the cooling plate 2232 is attached to the heating plate of the corresponding pressure head to cool the wafer. When the temperature drops to the preset value, the cooling plate 2232 separates from the heating plate. Finally, the upper pressure head rises and fills the vacuum bonding chamber 411 with nitrogen gas until the gas pressure in the vacuum bonding chamber 411 equals atmospheric pressure. The insert valve 412 is then opened, and the chuck transport robot 31 removes the chuck with the bonded wafer pair.

[0098] Reference Figures 22 to 25 The cooling station separation device 22 includes a support platform 221, a second gantry frame 222, a cooling mechanism 223, a temperature measuring mechanism 224, a drive mechanism 225, a positive pressure separation mechanism 226, an air blowing separation mechanism 227, and a lifting mechanism 228.

[0099] The support platform 221 is mainly used to provide hardware support for other components. Its structure is not limited. For example, in this embodiment, the support platform 221 includes four support columns 2211 and a platform 2212 fixed to the top of the support columns 2211 and arranged horizontally.

[0100] The second gantry 222 is mounted on the support platform 221.

[0101] It is easy to understand that the second gantry 222 includes a crossbeam 2221 and columns 2222 respectively connected to the lower ends of the crossbeam 2221. The bottom end of the column 2222 is fixed on the platform 2212.

[0102] The cooling mechanism 223 includes a support member 2231 provided on the support platform 221, and a horizontally arranged cooling plate 2232 installed on the support member 2231. The cooling plate 2232 is used to position the inner plate 100 of the adsorption chuck.

[0103] Specifically, in this embodiment, the support member 2231 is a columnar structure and is supported at the center of the cooling plate 2232. The cooling plate 2232 includes a chassis 22321 and a top cover 22322. A cooling channel 22323 is provided on the upper surface of the chassis 22321. The inlet end 22324 and the outlet end 22325 of the cooling channel 22323 both extend to the bottom of the chassis 22321 through connectors to connect to the cooling source. The top cover 22322 covers the chassis 22321. The surface of the top cover 22322 is provided with a positioning pin 22326 for positioning the chuck and an adsorption part 22327 for adsorbing the chuck. The adsorption part 22327 extends through the chassis 22321 to the bottom of the chassis 22321 to connect to the negative pressure source. In use, the cooling medium enters the cooling channel 22323 through the inlet end 22324 and then flows out through the outlet end 22325, thus forming a circulating cooling system. The adsorption part 22327 is connected to a negative pressure source to generate negative pressure, thereby adsorbing and fixing the chuck. The positioning pin 22326 is inserted into the positioning hole 800 corresponding to the chuck, thereby achieving precise positioning of the chuck. Water is preferred as the cooling medium, so that the cooling plate 2232 adopts a water-cooling method. In this embodiment, the cooling mechanism 223 adopts a circulating cooling method, which has a better cooling effect. The support member 2231 adopts a columnar structure, which can also reserve more installation space above the support platform 221. In other embodiments, the cooling mechanism 223 can also be designed as a box-shaped structure. The top of the box-shaped structure is provided with a positioning pin 22326 and an adsorption part 22327, and the chuck is cooled down by the cooling medium inside the box-shaped structure.

[0104] More specifically, in this embodiment, the cooling channel 22323 is generally circular, and a radially arranged partition bar 22328 is provided inside the cooling channel 22323. The inlet end 22324 and the outlet end 22325 of the cooling channel 22323 are located on both sides of the partition bar 22328, respectively. The circular cooling channel 22323 can fit the inner plate 100 of the chuck, thereby increasing the contact area between the cooling channel 22323 and the inner plate 100, and thus improving the cooling effect. The partition bar 22328 separates the inlet end 22324 and the outlet end 22325, so that the cooling medium entering the cooling channel 22323 from the inlet end 22324 must bypass the partition bar 22328 before flowing out from the outlet end 22325, so that the cooling medium can fully exchange heat with the chuck, thereby improving the cooling effect. Of course, the cooling channel 22323 can also be designed as a strip or other shapes.

[0105] As an improvement to the cooling channel 22323, this embodiment further adds multiple radially arranged flow equalization strips 22329, which are formed by multiple spaced flow equalization blocks. The flow equalization strips 22329 enable the cooling medium to flow more uniformly, allowing for more thorough heat exchange and further improving the cooling effect.

[0106] More specifically, the adsorption unit 22327 in this embodiment includes an adsorption plate and a rubber ring disposed around the adsorption plate. The rubber ring enables a sealed connection with the chuck, thereby creating a sealed environment for the adsorption plate. A negative pressure is then generated in this sealed environment through the adsorption holes on the adsorption plate, ultimately securing the chuck firmly. The number of adsorption units 22327 is not limited; for example, four adsorption units 22327 are distributed circumferentially in the figure. Of course, the adsorption unit 22327 can also use a suction nozzle 2281 or other structures.

[0107] The temperature measuring mechanism 224 is installed on the support platform 221 and is used to detect the temperature of the outer ring frame 200 of the chuck.

[0108] Specifically, the type of temperature measuring mechanism 224 is not limited. For example, in this embodiment, the temperature measuring mechanism 224 is an infrared temperature measuring head.

[0109] It should be noted that the inner plate 100 of the chuck is adsorbed and fixed on the cooling plate 2232, so the temperature of the inner plate 100 of the chuck should be lower than or equal to that of the outer ring frame 200. When the temperature measuring mechanism 224 detects that the temperature of the outer ring frame 200 is lower than the target temperature, the temperature of the inner plate 100 will also be lower than the target temperature.

[0110] The drive mechanism 225 is mounted on the support platform 221 and is used to actuate the preload rod of the chuck.

[0111] It is easy to understand that the design of the drive mechanism 225 should be adapted to the structure of the chuck's preload assembly 400. For example, in this embodiment, the drive mechanism 225 includes a second lifting drive pair 2251, a second rotating drive pair 2252, and a second jaw 2253. The fixed part of the second lifting drive pair 2251 is located on the support platform 221, the fixed part of the second rotating drive pair 2252 is located on the output part of the second rotating drive pair 2252, and the second jaw 2253 is located on the output part of the second rotating drive pair 2252. The second jaw 2253 actuates the chuck's preload rod through lifting and rotating movements. The second lifting drive pair 2251 provides lifting motion for the second jaw 2253, and the second rotating drive pair 2252 provides rotating motion for the second jaw 2253. The second jaw 2253 drives the preload rod to lift and rotate, thereby realizing the switching of the lifting rod between the preload state and the retracted state. Of course, in other embodiments, if the pre-pressurization component 400 of the chuck is designed with a different structure, the drive mechanism 225 can be designed accordingly.

[0112] Specifically, the structure of the second lifting drive pair 2251 and the second rotary drive pair 2252 is not limited. The second lifting drive pair 2251 can be a linear power element such as a cylinder or an electric cylinder, and the second rotary drive pair 2252 can be a rotary power element such as a rotary cylinder or a rotary motor.

[0113] The positive pressure separation mechanism 226 is mounted on the support platform 221 and is used to connect with the adsorption channel 600 of the chuck when the chuck is positioned and adsorbed onto the cooling plate 2232.

[0114] Specifically, the positive pressure separation mechanism 226 of this embodiment includes a support 2261, a vertical cylinder 2262, and a nozzle 2263. The support 2261 is mounted on a support platform 221, the vertical cylinder 2262 is mounted on the support 2261 and its bottom is used to connect to a positive pressure source, and the nozzle 2263 is located at the top of the vertical cylinder 2262. In use, the bottom end of the vertical cylinder 2262 is connected to the positive pressure source, and the positive pressure gas is sequentially blown through the vertical cylinder 2262, the nozzle 2263, and the adsorption channel 600 of the chuck towards the edge of the wafer pair to achieve separation of the wafer pair edge from the chuck.

[0115] It is easy to understand that, in order for the chuck to be attached to the cooling plate 2232, the nozzle 2263 should be able to align with the bottom surface of the outer ring frame 200 of the chuck, and the height of the nozzle 2263 should be adapted to the cooling plate 2232.

[0116] As an improvement to the positive pressure separation mechanism 226, the vertical cylinder 2262 can be flexibly installed on the bracket 2261. On the one hand, this can reduce the height requirement of the nozzle 2263, and on the other hand, it can also press the nozzle 2263 into the bottom surface of the outer ring frame 200 of the chuck with a certain pre-tightening force, which is more conducive to ensuring the sealing of the docking.

[0117] The air-blowing separation mechanism 227 is installed on the column 2222 of the second gantry 222 and is used to blow air between the chuck and the wafer pair.

[0118] Specifically, the air-blowing separation mechanism 227 includes a connecting seat 2271 and an air-blowing head 2272. The connecting seat 2271 is mounted on the column 2222 of the second gantry 222 and its vertical position is adjustable. The connecting seat 2271 has an air inlet channel, and the air-blowing head 2272 is located on the connecting seat 2271 and connected to the air inlet channel. In use, the air inlet channel is connected to an air source, and the gas is ejected from the air-blowing head 2272 after passing through the air inlet channel. The vertically adjustable design of the connecting seat 2271 makes it easier to align the air-blowing head 2272 with the position between the wafer pair and the chuck. The structure upon which the position of the connecting seat 2271 is adjustable is easily designed by those skilled in the art and will not be described in detail here.

[0119] It should be noted that the air-blowing separation mechanism 227 and the aforementioned positive pressure separation mechanism 226 work together. The positive pressure separation mechanism 226 is used to separate the edges of the wafer pair, while the air-blowing separation mechanism 227 is used to separate the main body of the wafer pair. During operation, the positive pressure separation mechanism 226 should first create a gap between the edges of the wafer pair and the chuck, and then the air-blowing separation mechanism 227 should blow air to completely separate the wafer pair from the chuck. The positive pressure separation mechanism 226 only needs to blow in a slightly positive pressure gas, while the air-blowing separation mechanism 227 needs to blow in a large flow rate of gas.

[0120] The lifting mechanism 228 includes a suction nozzle 2281 and a lifting drive 2282. The fixed part of the lifting drive 2282 is located on the crossbeam 2221 of the second gantry 222, and the output part extends outward below the crossbeam 2221 of the second gantry 222. The suction nozzle 2281 is installed on the output part of the lifting drive 2282 and is located above the cooling plate 2232. In use, after the wafer pair and the chuck are completely separated by the positive pressure separation mechanism 226 and the air blowing separation mechanism 227, the lifting drive 2282 first drives the suction nozzle 2281 to descend and contact the wafer pair. The suction nozzle 2281 and the wafer pair are connected by negative pressure adsorption. Then, the lifting drive 2282 drives the suction nozzle 2281 to rise, thereby realizing the spatial separation of the wafer pair and the chuck.

[0121] Specifically, the lifting drive component 2282 can be a linear power element such as a cylinder, electric cylinder, or linear push rod.

[0122] As an improvement to the lifting mechanism 228, this embodiment further includes a mounting plate 2283. Multiple suction nozzles 2281 are provided and installed below the mounting plate 2283. A tension sensor 2284 is provided between the output of the lifting drive 2282 and the mounting plate 2283. The tension sensor 2284 allows for precise control of the lifting force of the lifting mechanism 228 on the wafer pair, effectively preventing fragmentation caused by excessive tension.

[0123] Furthermore, the chuck separation device in this embodiment is additionally equipped with an optical alignment mechanism 229. The optical alignment mechanism 229 includes an optical transceiver 2291 and a reflector 2292. The optical transceiver 2291 is mounted on the crossbeam 2221 with its end facing vertically downwards. The reflector 2292 is mounted on the support platform 221 and is arranged horizontally, with the reflector 2292 located directly below the optical transceiver 2291. The reflector 2292 and the optical transceiver 2291 are used to cooperate with the alignment hole 900 of the chuck to achieve optical alignment. In use, the optical transmitter emits light. If the optical transceiver 2291 can receive the reflected light from the reflector 2292, it means that the light has passed through the alignment hole 900 of the chuck, thus indicating that the positional accuracy of the chuck meets the requirements. If the optical transceiver 2291 does not receive the reflected light from the reflector 2292, it means that the chuck is blocking the light, and the light has not passed through the alignment hole 900 of the chuck, indicating that the position of the chuck has a large error.

[0124] It should be noted that, in addition to the optical alignment mechanism 229, the horizontal position accuracy of the chuck can also be judged by the suction part 22327 on the aforementioned cooling plate 2232: if the negative pressure at the suction part 22327 can reach the preset value, it means that the suction nozzle 2281 can make close contact with the chuck, and the horizontality meets the requirements; if the negative pressure at the suction part 22327 fails to reach the preset value, it means that the suction nozzle 2281 is not in close contact with the chuck, and the chuck has a tilt error. The vacuum degree of the suction part 22327 and the optical alignment mechanism 229 work together to effectively ensure the positional accuracy of the chuck.

[0125] The working principle of the cooling station separation device 22 in this embodiment is as follows:

[0126] 1) The chuck handling robot 31 removes the chuck with the bonded wafer pair from the bonding cavity and places it on the cooling plate 2232 of this device, and then the chuck handling robot 31 retracts.

[0127] 2) The chuck is positioned and adsorbed onto the cooling plate 2232 by the adsorption part 22327 and the positioning pin 22326;

[0128] 3) Under the circulating cooling effect of the cooling plate 2232, the chuck temperature drops rapidly until the temperature measuring mechanism 224 detects that the chuck temperature has dropped below ℃;

[0129] 4) The lifting mechanism 228 is activated, and the lifting drive component 2282 drives the suction nozzle 2281 to descend to the top surface of the contact wafer pair. The suction nozzle 2281 adsorbs the wafer pair through negative pressure.

[0130] 5) The drive mechanism 225 starts, outputting lifting and rotational motions, causing the chuck's preload lever to disengage from the wafer pair and release the preload state;

[0131] 6) When the positive pressure separation mechanism 226 is activated, a slightly positive pressure gas is blown between the wafer edge and the chuck through the adsorption channel 600 of the chuck to achieve separation between the wafer edge and the chuck.

[0132] 7) The air separation mechanism 227 is activated, and a large flow of gas is blown between the wafer pair and the chuck through the air blowing head 2272 to break the van der Waals force between the wafer pair and the chuck, thereby realizing the separation of the wafer pair body from the chuck.

[0133] 8) The lifting drive 2282 lifts the wafer pair through the suction nozzle 2281 to achieve safe separation of the wafer pair from the chuck.

[0134] The chuck cooling station separation device 22 provided in this embodiment, through the cooperation of the cooling mechanism 223 and the temperature measuring mechanism 224, can reduce the temperature of the chuck to below 60°C. The driving mechanism 225 can actuate the chuck's pre-pressure lever to release the pre-pressure state on the wafer pair. The positive pressure separation mechanism 226, in conjunction with the chuck's adsorption channel 600, can blow in slightly positive pressure gas to achieve separation of the wafer pair edge from the chuck. The air blowing separation mechanism 227 can blow a large flow of gas between the wafer pair and the chuck to break the van der Waals forces between them. The lifting mechanism 228 can lift the wafer pair to achieve final separation. This device, through the combined effects of cooling, releasing pressure, edge separation, breaking van der Waals forces, and lifting separation, can achieve safe separation of the wafer pair from the wafer chuck.

[0135] In addition, the loading chamber 1, alignment chamber 2, and transport chamber 3 are all equipped with an air purification device 51, an ionization device 52, and a ventilation structure. The air purification device 51 is located at the top of the corresponding chamber, the ionization device 52 is located below the corresponding air purification device 51, and the ventilation structure is located at the bottom of the corresponding chamber. In use, the air purification device 51, the ionization device 52, and the ventilation structure work together to ensure that the purification level inside the corresponding chamber is within Class 100, thereby meeting the cleanliness requirements for wafer processing.

[0136] In addition, the feeding chamber 1 is also equipped with an operating device 14. The operating device 14 includes a connecting frame 141 connected to the outer wall of the feeding chamber 1 on the side away from the alignment chamber 2. An input component 142 and a display component 143 are installed on the connecting frame 141. The input component 142 is used to input control commands, and the display component 143 is used to display process parameters and equipment status. In use, the control program and process parameters are input through the input component 142. The process parameters and equipment status are displayed on the display component 143 in real time, and the entire equipment operates fully automatically according to the preset process.

[0137] The overall workflow of the split-type fully automated temporary wafer bonding machine in this embodiment is as follows:

[0138] S1. Place the cartridge into the loading platform 11 of the feeding chamber 1 by means of a VGA trolley, overhead crane or manual operation;

[0139] S2. The chuck handling robot 31 takes a chuck from the chuck storage rack 21 and places it on the top plate 2362 of the alignment device 23;

[0140] S3. The wafer handling robot 13 takes a lower wafer from the cassette; after taking the lower wafer, it is placed on the pre-alignment device 12 for wafer pre-calibration; after the pre-calibration is completed, the wafer handling robot 13 takes the lower wafer and places it on the chuck of the alignment device 23.

[0141] S4. The XYZ three-axis platform 234 of the alignment device 23 rises and the edge condition of the lower wafer is identified by the vision mechanism 232; after the identification is completed, the XYZ three-axis platform 234 of the alignment device 23 descends to the position for loading the upper wafer;

[0142] S5. The wafer handling robot 13 takes an upper wafer from another cartridge. After taking the upper wafer, it places it on the pre-alignment device 12 for wafer pre-calibration. After the pre-calibration is completed, the wafer handling robot 13 takes the upper wafer, rotates it 180°, and then the adsorption platform 233 of the alignment device 23 adsorbs and picks up the upper wafer. Then the alignment of the upper and lower wafers and the pre-pressing fixation are completed.

[0143] S6. The chuck handling robot 31 removes the chuck and wafer pair from the alignment device 23 and places them into the idle bonding device 41; bonding is performed according to the set process; after bonding is completed, the chuck handling robot 31 removes the bonded wafer pair and chuck from the bonding device 41 and places them into the cooling station separation device 22 for rapid cooling; when the chuck temperature drops to the preset temperature, the wafer and chuck are separated.

[0144] S7. The wafer handling robot 13 takes away the separated wafer pairs and delivers them to the designated cartridges;

[0145] S8. The chuck handling robot 31 removes the empty chuck from the cooling station separation device 22 and puts it back on the chuck storage rack 21;

[0146] S9. The fully automated wafer bonding process is complete.

Claims

1. A split-type fully automatic temporary wafer bonding machine, characterized in that: The device includes a loading cavity (1), an alignment cavity (2), a transport cavity (3), and a bonding cavity (4) arranged sequentially in the left-right direction. The loading cavity (1) has at least two loading platforms (11) on the side away from the alignment cavity (2). The loading platforms (11) are used to install wafer cassettes. The loading cavity (1) is also equipped with a pre-alignment device (12) and a wafer transport robot (13). The alignment cavity (2) is equipped with a chuck storage rack (21), a cooling station separation device (22), and an alignment device (23) distributed in the front-back direction. The transport cavity (3) is equipped with a chuck transport robot (31). The bonding cavity (4) is equipped with multiple bonding devices (41) distributed in the front-back direction. The wafer handling robot (13) is used to transfer wafers between the wafer cassette and the pre-alignment device (12), between the pre-alignment device (12) and the alignment device (23), and between the cooling station separation device (22) and the wafer cassette. The chuck handling robot (31) is used to transfer the chuck between the chuck storage rack (21) and the alignment device (23), between the alignment device (23) and the bonding device (41), and between the bonding device (41) and the cooling station separation device (22); The alignment device (23) includes a frame (231), a vision mechanism (232), an adsorption platform (233), an XYZ three-axis platform (234), a rotary platform (235), and an adjustment platform (236); the frame (231) includes a base (2311) and a first gantry (2312), the first gantry (2312) being fixed to the base (2311); the vision mechanism (232) is installed above the crossbeam (2221) of the first gantry (2312); the adsorption platform (233) is fixed below the crossbeam (2221) of the first gantry (2312), the lower surface of the adsorption platform (233) is used for vacuum adsorption of wafers, and the adsorption platform (233) is provided with a notch (2331) for visual alignment; the XYZ three-axis platform (234) is installed on the base (2311) and located on the first gantry (2312). The inner side of 312); the rotating platform (235) is mounted on the XYZ three-axis platform (234) and the rotation axis is arranged along the Z direction; the adjusting platform (236) includes a base plate (2361), a top plate (2362) and a leveling component (2363), the base plate (2361) is fixed on the rotating platform (235), and the leveling component (2363) is connected between the base plate (2361) and the top plate (2362) and Multiple sets are distributed circumferentially. The top plate (2362) is used to absorb the chuck. The top plate (2362) is also provided with a negative pressure connection assembly (2364) for docking with the negative pressure channel of the chuck. The bottom plate (2361) is also provided with a first drive assembly (2365) for moving the chuck partition and a second drive assembly (2366) for moving the chuck preload rod. The second drive assembly (2366) is arranged corresponding to the notch (2331).

2. The split-type fully automatic temporary wafer bonding machine according to claim 1, characterized in that, The wafer handling robot (13) includes: The first mounting plate (131) is connected to the inner wall of the feeding cavity (1); The first front and rear drive pairs (132) are fixed to the first mounting plate (131); Mounting bracket (133) is connected to the output of the first front and rear drive pair (132); The first lifting drive unit (134) has its fixed part connected to the mounting bracket (133); The drive linkage (135) is connected at one end to the output of the first lifting drive pair (134); The first rotary drive pair (136) has its fixed part connected to the other end of the drive link (135), and the rotation axis of the first rotary drive pair (136) is arranged horizontally. A wafer handling finger (137) is connected to the output of the first rotary drive pair (136).

3. The split-type fully automatic temporary wafer bonding machine according to claim 1, characterized in that, The chuck handling robot (31) includes: The second mounting plate (311) is connected to the bottom wall of the transport cavity (3); The second front and rear drive pairs (312) are fixed to the second mounting plate (311); A multi-joint robotic arm (313) has its bottom end connected to the output of the second front and rear drive pair (312); An end effector (314) is attached to the top of the multi-joint robotic arm (313), the end effector (314) being a chuck handling finger for picking up and placing chucks.

4. The split-type fully automatic temporary wafer bonding machine according to claim 1, characterized in that, The pre-alignment device (12) includes: A support frame (121) is fixed inside the feeding cavity (1); Z-axis drive pair (122), the fixed part of which is connected to the support frame (121); Mounting disk (123) is connected to the output of the Z-axis drive pair (122), and the mounting disk (123) is provided with a plurality of support blocks (124) for supporting the edge of the wafer. The Z-axis rotary joint has its fixed part connected to the support frame (121); Clamping blocks (125) are provided in multiple and are all mounted on the output part of the Z-axis rotary joint. The multiple clamping blocks (125) are located around the mounting disk (123) and are driven to move radially along the mounting disk (123) so as to clamp the wafer from the side. A positioning sensor (126) is attached to the support frame (121) and is used to detect the circumferential angle of the wafer.

5. The split-type fully automatic temporary wafer bonding machine according to claim 1, characterized in that, The chuck storage rack (21) includes: A fixed platform (211) is attached to the bottom wall of the alignment cavity (2); A mounting bracket (212) is connected to the mounting platform (211); The support plate (213) has multiple layers and is connected to the fixed frame (212). Each layer of support plate (213) is arranged horizontally, and the support plate (213) at the top layer is equipped with a toggle structure (214) for toggling the chuck spacer.

6. The split-type fully automatic temporary wafer bonding machine according to claim 1, characterized in that, The bonding device (41) includes a vacuum bonding chamber (411), the vacuum bonding chamber (411) is provided with a slide valve (412), the vacuum bonding chamber (411) is connected to a vacuum pumping assembly (413), the vacuum bonding chamber (411) is provided with an upper pressure head and a lower pressure head, the upper pressure head is connected to a pressurizing assembly (414), and both the upper pressure head and the lower pressure head are provided with a heating plate and a cooling plate (2232).

7. The split-type fully automatic temporary wafer bonding machine according to claim 1, characterized in that, The cooling station separation device (22) includes: Support platform (221); The second gantry (222) is mounted on the support platform (221); Cooling mechanism (223) includes a support member (2231) disposed on the support platform (221), and a horizontally arranged cooling plate (2232) is mounted on the support member (2231). The cooling plate (2232) is used to position the inner plate (100) of the adsorption chuck. Temperature measuring mechanism (224) is mounted on the support platform (221) and is used to detect the temperature of the outer ring frame (200) of the chuck; A drive mechanism (225) is mounted on the support platform (221) and is used to actuate the preload rod of the chuck; A positive pressure separation mechanism (226) is mounted on the support platform (221) and is used to engage the adsorption channel (600) of the chuck when the chuck is positioned and adsorbed onto the cooling plate (2232). An air-blowing separation mechanism (227) is mounted on the column (2222) of the second gantry (222) and is used to blow air between the chuck and the wafer pair; The lifting mechanism (228) includes a suction nozzle (2281) and a lifting drive (2282). The fixed part of the lifting drive (2282) is provided on the crossbeam (2221) of the second gantry (222) and the output part extends outward below the crossbeam (2221) of the second gantry (222). The suction nozzle (2281) is installed on the output part of the lifting drive (2282) and is located above the cooling plate (2232).

8. The split-type fully automatic temporary wafer bonding machine according to any one of claims 1 to 7, characterized in that, The feeding chamber (1), alignment chamber (2) and conveying chamber (3) are each equipped with an air purification device (51), an ion wind device (52) and a ventilation structure. The air purification device (51) is located at the top of the corresponding chamber, the ion wind device (52) is located below the corresponding air purification device (51), and the ventilation structure is located at the bottom of the corresponding chamber.

9. The split-type fully automatic temporary wafer bonding machine according to any one of claims 1 to 7, characterized in that, The feeding chamber (1) is also provided with an operating device (14). The operating device (14) includes a connecting frame (141) connected to the outer wall of the feeding chamber (1) away from the alignment chamber (2). An input component (142) and a display component (143) are installed on the connecting frame (141). The input component (142) is used to input control commands, and the display component (143) is used to display process parameters and equipment status.

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