一种镍基焊膏、金刚石工具及其制备方法

By using nickel-based solder paste containing silane thermosetting resin and hydrophobic film-forming resin, the problem of fixing diamond particles in small-diameter diamond drilling tools has been solved, achieving stable fixing of diamond particles during the brazing process and improving the machining accuracy and service life of the tools.

CN121402890BActive Publication Date: 2026-07-17ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
Filing Date
2025-12-10
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Small-diameter diamond drilling tools have difficulty fixing diamond particles during the brazing process, resulting in uneven distribution and serious loss, which affects processing accuracy and service life.

Method used

A nickel-based solder paste containing silane thermosetting resin and hydrophobic film-forming resin is used, along with a solvent of a specific composition. Diamond particles are fixed through a pre-curing process and decomposed during high-temperature brazing to ensure the welding strength of the diamond particles in the brazing layer.

Benefits of technology

This method achieves stable fixation of diamond particles during the brazing process, improves tool processing accuracy and service life, and ensures welding strength and yield.

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Abstract

本发明公开了一种镍基焊膏、金刚石工具及其制备方法,所述镍基焊膏按质量百分比包括75‑85wt%的镍基焊粉和15‑25wt%的助焊剂;所述助焊剂按质量百分比包括5‑15wt%的硅烷类热固性树脂、10‑25wt%的疏水成膜树脂和余量的混合溶剂。本发明利用镍基焊膏中助焊剂成分选择,能够起到在高温烧结前对金刚石颗粒临时固定的效果,并适用于各种形状的焊接面,高温易分解,不会有残渣残留于钎焊层,保证金刚石颗粒在钎焊层的焊接强度和整体使用寿命。
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