A polishing wheel

Abstract

The present application relates to the field of polishing equipment, specifically to a polishing wheel, comprising: a buffer layer, arranged on the periphery of the carrier; a conductive layer, wound on the outer surface of the buffer layer, for providing conductivity and support; a first fixing structure, formed on the surface of the conductive layer in a predetermined area; and an abrasive layer, fixed on the surface of the first fixing structure. The design of the metal wire winding the second elastic body and the first elastic body provides a certain strength to the whole ring-shaped cross-section, and the second elastic body supports the whole ring-shaped cross-section, so that the rigidity of the polishing wheel in each direction is more uniform and stable, which is beneficial to the accurate control in the polishing process and improves the processing stability. In addition, the metal wire after winding provides a solid base for the electroplating structure, avoids problems such as sinking and depression, and ensures the abrasive bonding strength and working life.

Description

Technical Field

[0001] This invention relates to the field of polishing equipment technology, and in particular to a polishing wheel. Background Technology

[0002] The automated polishing of complex curved surface parts (such as aero-engine blades and mold cavities) requires high precision and operates in extremely limited space, making it a significant technical challenge in the field of machining. Current polishing tools often use low-strength materials like resin to fix abrasive particles onto a paper or cloth base. This type of tool is prone to abrasive detachment under stress, resulting in poor tool precision retention and short service life. Furthermore, traditional polishing tools are difficult to shape into complex curved surface structures, often requiring high-end equipment with 5-6 axes of linkage to complete the polishing process, further increasing processing costs and technical barriers.

[0003] In existing technologies, various technical solutions have been adopted to address the aforementioned problems. For example, patent number CN202311216190.6 describes an equal-rigidity elastic polishing device and its manufacturing method. This method utilizes electroplating to firmly attach abrasive particles to a small-sized disc-shaped or other shaped nickel platform on the surface of a flexible substrate such as rubber. The large-area connection ensures stability between the metal platform and the rubber substrate, thereby improving the abrasive's fixing strength and enhancing the precision retention and service life of the polishing tool. This structure involves molding a flexible electroplated abrasive belt into a shell, forming a curved structure, and then bonding it to the elastic substrate. However, this structure requires the abrasive portion to be assembled in two interlocking halves, resulting in noticeable gaps after assembly. Furthermore, the hardness of the adhesive changes with the polishing wheel's operation, affecting the accuracy of the polishing removal amount. For example, a welded seamless metal mesh polishing wheel with patent number CN202420526464.5 uses metal mesh as the base and electroplats abrasive onto the mesh to avoid seams, thus extending the wheel's lifespan. However, the metal mesh has limited overall support and inconsistent stiffness at different angles. During polishing, this can lead to depressions and uneven surface contact, affecting polishing accuracy and even causing a loss of polishing ability. Therefore, improving the overall accuracy and lifespan of polishing wheels is a problem that those skilled in the art need to consider. Summary of the Invention

[0004] The purpose of this invention is to provide a polishing wheel that forms an integral covering structure by winding metal wires and connects abrasives through multiple electroplating processes, in order to solve the problems of short service life and inconsistent support strength that affect polishing accuracy in existing polishing wheels.

[0005] The technical solution of the present invention is: a polishing wheel, comprising: A buffer layer is disposed around the periphery of the carrier. A conductive layer, wrapped around the outer surface of the buffer layer, serves to provide conductivity and support; A first fixing structure is formed in a predetermined area on the surface of the conductive layer; The abrasive layer is fixed to the surface of the first fixed structure.

[0006] Preferably, the conductive layer covers the outer surface of the buffer layer and its cross-section forms a ring.

[0007] Preferably, the buffer layer is composed of at least two layers of elastic composite material, including a first elastomer and a second elastomer wrapped around the periphery of the first elastomer; The conductive layer is connected to the outer surface of the second elastomer.

[0008] Preferably, the first elastomer and the second elastomer are made of the same material.

[0009] Preferably, the conductive layer is formed by continuously winding metal wires in a spiral shape, and after winding, adjacent layers are bonded together to form a compressed state.

[0010] Preferably, the inner wall of the conductive layer forms a cylindrical structure; the outer surface has a curved structure.

[0011] Preferably, the first fixing mechanism is a metal platform formed by electroplating on the surface of the conductive layer, and the metal platform is continuously distributed.

[0012] Preferably, the winding method of the metal wire includes axial parallel winding and 45° oblique winding.

[0013] Preferably, the abrasive layer is attached to the metal platform by electroplating.

[0014] A method for preparing a polishing wheel includes the following steps: S1. Preparation of the buffer layer: forming an elastic matrix structure; S2. Construction of the conductive layer: Forming a conductive functional layer on the surface of the substrate; S3. Zoning: Forming electroplatable and non-electroplated areas on the surface of the conductive layer; S4. First fixed structure forming: A metal support structure is formed in the electroplating area by an electroplating process; S5. Abrasive layer fixing and forming: The abrasive material is bonded to the first fixing structure by electroplating.

[0015] Compared with the prior art, the advantages of the present invention are: (1) The design of the metal wire winding the second elastic body and the combination with the first elastic body, the metal wire is wound to form a ring shape as a whole, and the cross section forms a ring shape itself with a certain strength. It is then supported by the second elastic body, so that the stiffness of the polishing wheel in all directions is more uniform and stable, which is conducive to precise control in the polishing process and improves the processing stability. In addition, the wound metal wire provides a solid base for the electroplated structure, avoiding problems such as sinking and depression, and ensuring the bonding strength and service life of the abrasive.

[0016] (2) By electroplating, not only are surface gaps avoided, but the tightly connected metal wires are also connected in one step, which further improves the support strength of the conductive layer and thus improves the overall stability of the abrasive layer. (3) The inner wall of the conductive layer is cylindrical, which makes it easier to set the curvature specifications of the abrasive layer during manufacturing and ensures the uniformity of the support strength of the conductive layer. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of this invention, the accompanying drawings used in the description will be briefly introduced. Obviously, the drawings in the description are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort. The present invention will be further described below in conjunction with the accompanying drawings and embodiments: Figure 1 This is a schematic diagram of the structure of the polishing wheel described in this invention; Figure 2 This is a cross-sectional view of the polishing wheel described in this invention. Figure 3 This is an enlarged structural schematic diagram of the abrasive layer described in this invention; Figure 4 This is a schematic diagram of the polishing wheel forming process described in this invention.

[0018] Wherein: buffer layer 1, first elastomer 11, second elastomer 12, conductive layer 2, first fixing structure 3, abrasive layer 4, non-electroplated area 5. Detailed Implementation

[0019] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more, unless otherwise expressly defined.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0024] like Figures 1-4 As shown, this invention is a polishing wheel for grinding complex curved surface parts. This polishing wheel is characterized by its small size and high polishing precision requirements. Specifically: A polishing wheel has an overall annular structure, comprising an inner ring to an outer ring, a carrier (not shown in the figure), a buffer layer, a conductive layer, a first fixing mechanism, and an abrasive layer.

[0025] The carrier is made of metal and has a centrally located connecting hole that connects to the drive shaft. The rotation of the drive shaft drives the rotation of the polishing wheel to achieve polishing. The outer ring of the carrier can be a circular groove, and the inner ring of the first elastic body of the buffer layer can be directly embedded in the groove. The two can be fixedly connected by adhesive or by axially positioned pins or screws.

[0026] The buffer layer 1 is composed of at least two layers of elastic composite material, including a first elastomer 11 and a second elastomer 12 surrounding the first elastomer 11. In this embodiment, the first elastomer 11 and the second elastomer 12 are made of the same material, which can both be rubber, so that they can be tightly connected as a whole through vulcanization. Compared with traditional adhesive bonding methods, the connection is more stable. Figure 2 As shown, in the cross-section of the polishing wheel in the radial direction, the second elastic body 12 protrudes from the first elastic body 11 on both sides, so that the second elastic body 12 can have more polishing angles after connecting to the abrasive.

[0027] The conductive layer is attached to the outer surface of the second elastomer 12 and covers at least the area of ​​the second elastomer 12 that is not connected to the first elastomer 11. The conductive layer 2 is made of metal to support the abrasive layer, conduct electricity, and perform surface electroplating.

[0028] In this embodiment, the conductive layer 2 is formed by continuously winding metal wire in a spiral shape around the surface of the second elastomer 12. After winding, adjacent layers adhere to each other to form a compressed state. The cross-section of the metal wire can be circular, square, or other shapes. The metal wire can be wound onto the surface of the second elastomer 12 during the molding of the second elastomer 12, and vulcanized after winding to ensure a tight bond between the metal wire and the second elastomer 12. After connection, the inner wall of the conductive layer 2 forms a cylindrical structure; the outer surface is a curved structure. The winding method of the metal wire can be axial parallel winding, 45° oblique winding, or other forms of winding according to actual production needs.

[0029] After the metal wire is wound, the strength of the ring structure is enhanced, and the second elastic body 12 further supports the wound structure, giving the abrasive layer high hardness and enabling effective contact with the metal surface during polishing. In addition, the winding arrangement of the elastic body and the metal wire gives the overall structure a certain degree of elasticity, which can prevent the abrasive layer from making hard contact with the metal surface and causing surface damage.

[0030] The first fixing structure 3 is a metal platform formed by electroplating in a predetermined area on the surface of the conductive layer 2, and the metal platforms are continuously or intermittently distributed. In this embodiment, a resist material is coated on the non-electroplated area of ​​the wound metal wire, so that the metal platform is formed in the electroplated area after electroplating.

[0031] The abrasive layer 4 is fixed to the surface of the first fixing structure 3. In this embodiment, electroplating is performed again on the first fixing structure 3 to solidify the superhard abrasive onto the metal platform to form the abrasive layer 4.

[0032] like Figure 4 As shown, in this embodiment, the specific steps for forming the polishing wheel are as follows: 1. The carrier and the first elastic body 11 are formed together. That is, the rubber first elastic body 11 can be directly combined with the metal carrier body through injection molding or flat vulcanization. 2. The metal wire is wound and connected to the second elastic body 12. That is, after the rubber second elastic body 12 is formed, the metal wire is wound around it with continuous precision. After winding, vulcanization is performed to make the metal wire and the second elastic body 12 tightly bonded. After vulcanization, some rubber may overflow the gaps between the metal wires. Therefore, the surface needs to be cleaned after vulcanization to expose the complete surface of the metal wire. 3. The wound second elastic body 12 and the first elastic body 11 are connected. That is, the second elastic body 12 covers the outer periphery of the first elastic body 11 and is bonded to the first elastic body 11 through vulcanization. 4. The first fixing structure 3 is formed by electroplating. A temporary, washable covering material is applied to the predetermined electroplating area on the surface of the wound metal wire, while an electroplating material is applied to the non-electroplated area 5. The temporary covering material is then removed from the electroplating area, followed by electroplating to form a metal platform in the predetermined electroplating area. The metal platform is then ground and polished to ensure surface smoothness. 5. The abrasive layer 4 is then bonded via electroplating. During electroplating, superhard abrasive is bonded to the surface of the metal platform.

[0033] The connection between the metal wire and the second elastic body 12 can be achieved by first forming the second elastic body 12 into a ring shape and then winding it; or by first forming the second elastic body 12 into a long strip shape, winding it, and then wrapping it around the outer ring of the first elastic body 11, and then fixing the end of the second elastic body 12 to the first elastic body 11 by vulcanization.

[0034] The above embodiments are merely illustrative of the technical concept and features of the present invention, intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and should not be construed as limiting the scope of protection of the present invention. It will be apparent to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of the present invention is defined by the appended claims rather than the foregoing description, and thus all changes falling within the meaning and scope of the equivalents of the claims are intended to be included within the present invention.

Claims

1. A polishing wheel, characterized in that: A buffer layer is disposed around the periphery of the carrier; the buffer layer is composed of at least two layers of elastic composite material, including a first elastomer and a second elastomer wrapped around the periphery of the first elastomer; a conductive layer is connected to the outer surface of the second elastomer. A conductive layer is wound around the outer surface of the buffer layer. The conductive layer is formed by continuously winding metal wires in a spiral shape. After winding, adjacent layers are bonded together to form a compressed state, which is used to provide conductivity and support. A first fixing structure is formed in a predetermined area on the surface of the conductive layer; The abrasive layer is fixed to the surface of the first fixed structure.

2. A polishing wheel according to claim 1, characterized in that: The conductive layer covers the outer surface of the buffer layer and its cross-section forms a ring.

3. A polishing wheel according to claim 1, characterized in that: The first elastomer and the second elastomer are made of the same material.

4. A polishing wheel according to claim 1, characterized in that: The inner wall of the conductive layer forms a cylindrical structure; the outer surface is a curved structure.

5. A polishing wheel according to claim 1, characterized in that: The first fixing structure is a metal platform formed by electroplating on the surface of the conductive layer, and the metal platform is continuously distributed.

6. A polishing wheel according to claim 1, characterized in that: The winding methods of the metal wire include axial parallel winding and 45° oblique winding.

7. A polishing wheel according to claim 5, characterized in that: The abrasive layer is attached to the metal platform by electroplating.

8. The method for preparing a polishing wheel according to any one of claims 1-7, characterized in that, Includes the following steps: ‌ S1. Preparation of the buffer layer: forming an elastic matrix structure; S2. Construction of the conductive layer: Forming a conductive functional layer on the surface of the substrate; S3. Zoning: Forming electroplatable and non-electroplated areas on the surface of the conductive layer; S4. First fixed structure forming: A metal support structure is formed in the electroplating area by an electroplating process; S5. Abrasive layer fixing and forming: The abrasive material is bonded to the first fixing structure by electroplating.

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