Communication module chip package welding device and method thereof

Abstract

This invention discloses a communication module chip packaging and welding apparatus and method, belonging to the field of chip packaging technology. It includes a chip pre-processing device for communication module chip welding, comprising a chip conveying pin detection module, a solder pre-coating module, and a solder coating and leveling module. A processing support cover is mounted on the conveyor frame. The solder pre-coating module and the solder coating and leveling module are both mounted on the processing support cover, which is equipped with an upper frame. This invention pre-processes the chip packaging through a combination of solder pre-coating, heating and leveling, and solder coating processes. During the leveling process, gas is expelled, and residual gas is adsorbed by the solder packaging film. The temperature-controlled solder head melts and precisely levels the pre-coated spherical solder, ensuring the thickness and uniformity of the solder on the surface of the heat dissipation pads, avoiding insufficient welding or local non-contact issues, thereby ensuring excellent heat dissipation, electrical grounding, and mechanical fixing effects.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a communication module chip packaging and welding apparatus and method. Background Technology

[0002] In QFP chip packaging, in addition to the pins at the four corners, the chip also has a heat dissipation pad on its bottom. This pad efficiently transfers heat from the chip to the circuit board, solving the heat dissipation problem. It also provides excellent electrical grounding and enhances the chip's mechanical fixation. However, current packaging processes often involve placing solder paste on the bottom of the heat dissipation pad before heating, making it difficult to control the flow and uniformity of the solder paste. Furthermore, oxides on the pads and chip substrate may generate gas at high temperatures. For a large pad, this gas becomes trapped in the molten solder paste, unable to escape smoothly, thus forming voids. The bottom of the heat dissipation pad often has voids or lacks contact with solder paste due to the manufacturing process. These voids and insufficient soldering severely weaken its heat dissipation and mechanical performance, and may even affect electrical connections. Therefore, this paper proposes a communication module chip packaging and soldering device and method. Summary of the Invention

[0003] The purpose of this invention is to solve the problems existing in the prior art, and to propose a communication module chip packaging and welding device and method.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A communication module chip packaging and welding apparatus includes a chip pre-processing device for welding communication module chips. The chip pre-processing device consists of a chip conveying pin detection module, a solder pre-coating module, and a solder film coating and leveling module. A processing support cover is provided on the conveying frame. The solder pre-coating module and the solder film coating and leveling module are both provided on the processing support cover. An upper frame is provided on the processing support cover. The chip conveying pin detection module includes a chip conveyor belt mounted on a conveyor frame, chip positioning seats for positioning and conveying pins are evenly arranged on the chip conveyor belt, and detection components for detecting chip pins are arranged on the chip positioning seats. The tin coating and leveling module includes a processing port on the processing support cover, a film layer flattening and winding device at the processing port, a film pressing component on the upper frame for pressing the film layer to contact the tin, and a tin removal and leveling component on the upper frame for cutting and collecting the film layer. The tin pre-coating module includes a tin feeder mounted on a processing support cover. The tin feeder is mounted on an upper frame, and its bottom tin conveying nozzle extends downward through the processing port to apply a quantitative amount of tin to the heat dissipation pads of the chip located in the chip positioning seat.

[0005] As a preferred embodiment, the chip positioning base consists of two opposing half-bases. The bottom of each half-base is connected to the surface of the chip conveyor belt via a connecting layer. The chip positioning base has a positioning port for chip insertion, and a roller is provided at the bottom of the positioning port to reduce friction with the chip.

[0006] As a preferred embodiment, the detection component includes pin contacts disposed on the side wall above the positioning port, the pin contacts consisting of end contacts disposed on the inner walls of the two sets of half-seat bodies and side contacts disposed on one set of half-seat bodies.

[0007] As a preferred embodiment, the film layer laying and winding device includes a residual material winding and collecting cylinder, an adjusting roller, and a film exiting roller, all mounted on a processing support cover. The film exiting roller is wound with a tin-filled encapsulating film, which is sequentially wound around the adjusting roller and connected to the residual material winding and collecting cylinder.

[0008] As a preferred embodiment, the pressing assembly includes an extrusion pusher mounted on an upper frame, and a temperature-controlled solder head is provided at the bottom of the extrusion pusher. The bottom of the temperature-controlled solder head has a soldering port adapted to the heat dissipation pad of the chip.

[0009] As a preferred embodiment, the desoldering and leveling assembly includes a leveling push rod disposed on the upper frame, and the bottom of the leveling push rod is provided with a cutting head for cutting the film layer and excess solder.

[0010] A method for packaging and soldering a communication module chip includes the following steps: S1. Chip flip positioning and conveying: The chip is placed with the bottom facing up. When the chip positioning seat moves to the end of the chip conveyor belt, the chip is horizontally inserted into the positioning hole on the chip positioning seat by the transfer workpiece, and the chip is conveyed one by one by the chip conveyor belt. S2, chip pre-coating: The chip is transported to the solder pre-coating module by the chip conveyor belt and paused. The solder feeding machine set on the processing support cover applies solder to the heat dissipation pads at the bottom of the chip, so that the solder solidifies in a spherical shape on the surface of the heat dissipation pads. S3, Chip Solder Coating: The chip is transported to the film layer flattening and winding device so that the solder encapsulation film is directly above the chip; then, when it moves synchronously to the pressing assembly, the temperature-controlled pressing head is driven to move down by the extrusion push rod to melt the solidified solder and press it flat on the surface of the heat dissipation pad, while the solder encapsulation film is adsorbed onto the heat dissipation pad. S4. Chip flattening and encapsulation: The chip is transported to the desoldering and flattening component. The cutting head is moved down by the flattening push rod to remove the excess solder and solder encapsulation film from the chip's heat dissipation pad. The excess solder is removed from the chip along with the film layer, and finally a solder encapsulation film is formed on the surface of the heat dissipation pad coated with solder. S5. Chip Pin Detection: With the chip inverted and mounted in the positioning port, the relative displacement between the chip and the chip conveyor belt is used to make the pin contacts on the positioning port contact the four-sided leads of the chip, thus completing the pin detection test.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention pre-treats chip packaging by combining tin pre-coating, heating and flattening, and tin layer coating processes. During the flattening process, gas is discharged, and residual gas is adsorbed by the tin encapsulation film. This fundamentally solves the problem of voids under the heat dissipation pad caused by the inability of gas to escape in traditional processes. The temperature-controlled tin pressing head can melt and precisely flatten the pre-coated spherical tin, ensuring the thickness and uniformity of the tin on the surface of the heat dissipation pad, avoiding problems such as insufficient soldering or local non-contact, thereby ensuring excellent heat dissipation, electrical grounding, and mechanical fixing effects.

[0012] 2. This invention utilizes the relative displacement of the chip and the chip positioning base during the cutting process to automatically complete the contact between the four sides of the chip pins and the contacts. This enables synchronous and non-destructive testing of the electrical connectivity of the pins during the packaging process, eliminating the need for additional dedicated testing stations or complex flip-and-shift positioning. This simplifies the process and improves overall production efficiency. Attached Figure Description

[0013] Figure 1 This is a schematic flowchart of a communication module chip packaging and welding method proposed in this invention; Figure 2 This is a schematic diagram of the main structure of a communication module chip packaging and welding device proposed in this invention; Figure 3 This is a schematic diagram of the chip delivery pin detection module in a communication module chip packaging and welding device proposed in this invention; Figure 4 This is a schematic diagram of the solder coating and leveling module and the solder pre-coating module in a communication module chip packaging and welding device proposed in this invention. Figure 5 This is a schematic diagram of the installation relationship structure of the upper frame in a communication module chip packaging and welding device proposed in this invention; Figure 6 This is a schematic diagram of the film layer laying and winding device and the processing support cover in a communication module chip packaging and welding apparatus proposed in this invention; Figure 7This is a schematic diagram of the film layer laying and winding device in a communication module chip packaging and welding apparatus proposed in this invention; Figure 8 This is a schematic diagram of the chip positioning seat in a communication module chip packaging and welding device proposed in this invention; Figure 9 This is a schematic cross-sectional view of the chip positioning seat in a communication module chip packaging and welding device proposed in this invention.

[0014] In the diagram: 1. Conveyor frame; 2. Processing support cover; 3. Upper frame; 4. Processing port; 5. Chip conveyor belt; 6. Chip positioning seat; 7. Solder feeding machine; 8. Positioning port; 9. End contact; 10. Side contact; 11. Residual material winding and collecting cylinder; 12. Adjusting roller; 13. Film exit roller; 14. Solder encapsulation film; 15. Extrusion push rod; 16. Temperature-controlled solder pressing head; 17. Flattening push rod; 18. Cutting head. Detailed Implementation

[0015] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0016] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0017] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0018] Example, refer to Figures 1 to 9A communication module chip packaging and welding apparatus includes a chip pre-processing device for welding communication module chips. The chip pre-processing device consists of a chip conveying pin detection module, a solder pre-coating module, and a solder film coating and leveling module. A processing support cover 2 is provided on the conveying frame 1. The solder pre-coating module and the solder film coating and leveling module are both provided on the processing support cover 2. An upper frame 3 is provided on the processing support cover 2. The chip delivery pin detection module includes a chip conveyor belt 5 mounted on a conveyor frame 1. Chip positioning seats 6 for positioning and delivering pins are evenly arranged on the chip conveyor belt 5. Further, the chip positioning seat 6 is composed of two opposing half-seats with a gap between them to allow for mutual rotation. The bottom of the half-seats is connected to the surface of the chip conveyor belt 5 through a connecting layer. The chip positioning seat 6 has a positioning port 8 for chip insertion. The bottom of the positioning port 8 is provided with rollers to reduce friction with the chip, thereby facilitating the movement of the chip within the positioning port 8.

[0019] It should be noted that when the chip positioning seat 6 moves to the end of the chip conveyor belt 5, one half of the two seats is in a horizontal state and the other is in a vertical state. When the two half seats separate, the chip can be inserted and removed.

[0020] The chip positioning base 6 is equipped with a detection component for detecting chip pins. The detection component includes pin contacts located on the upper side wall of the positioning port 8. A resistance testing device is connected to the pin contacts to detect whether the resistance of the contacts changes, thereby obtaining the detection of the integrity of the chip pins. The pin contacts consist of end contacts 9 disposed on the inner wall of the two sets of half-base bodies and side contacts 10 disposed on one set of half-base bodies. The side contacts 10 are disposed on both sides of the chip movement and can realize the detection of the chip pins.

[0021] The tin coating and leveling module includes a processing port 4 on the processing support cover 2. A film layer flattening and winding device is provided at the processing port 4. Further, the film layer flattening and winding device includes a residual material winding and collecting cylinder 11, an adjusting roller 12 and a film exiting roller 13 provided on the processing support cover 2. A tin material encapsulation film 14 is wound on the film exiting roller 13 and is connected to the adjusting roller 12 and the residual material winding and collecting cylinder 11 in sequence.

[0022] The upper frame 3 is equipped with a film pressing assembly for pressing the film layer into contact with the solder. Further, the film pressing assembly includes a pressing push rod 15 set on the upper frame 3. Both the pressing push rod 15 and the flattening push rod 17 are electric push rods, which are existing technologies and will not be described in detail here. The bottom of the pressing push rod 15 is equipped with a temperature-controlled solder pressing head 16. The bottom of the temperature-controlled solder pressing head 16 has a solder pressing port adapted to the heat dissipation pad of the chip.

[0023] The upper frame 3 is equipped with a desoldering and leveling component for cutting and collecting the film layer. Further, the desoldering and leveling component includes a leveling push rod 17 provided on the upper frame 3, and a cutting head 18 for cutting the film layer and excess solder is provided at the bottom of the leveling push rod 17.

[0024] When the chip is cut by the cutting head 18 moving down driven by the flat push rod 17, the chip conveyor belt 5 is moved. At this time, the chip is blocked by the cutting head 18 and cannot move. This causes the chip to move from the front end of the positioning port 8 to the rear end of the positioning port 8 (the front and rear are relative to the moving direction of the chip conveyor belt 5, the side with the same moving direction is the front end, and the side with the opposite moving direction is the rear end). At this time, the chip will move from one half of the base to the other half of the base, thus ensuring that the chip is inserted into the front half of the base when the chip is loaded, and removed from the rear half of the base when the chip is unloaded.

[0025] The solder pre-coating module includes a solder feeder 7 mounted on the processing support cover 2. The solder feeder 7 is existing technology and will not be described in detail here. The solder feeder 7 is mounted on the upper frame 3, and its bottom solder delivery nozzle extends downward through the processing port 4. It is used to quantitatively coat the heat dissipation pads of the chip located in the chip positioning seat 6 with solder. Quantitative pre-coating of solder: The solder feeder 7 performs quantitative coating, avoiding the waste or insufficient amount of solder that may be caused by traditional printing or smearing methods.

[0026] A method for packaging and soldering a communication module chip includes the following steps: Chip flip positioning and conveying: The chip is placed with the bottom facing up. When the chip positioning seat 6 moves to the end of the chip conveyor belt 5, the chip is horizontally inserted into the positioning port 8 on the chip positioning seat 6 by using the transfer workpiece, and the chips are conveyed one by one by the chip conveyor belt 5. Chip pre-coating: The chip is transported to the solder pre-coating module by the chip conveyor belt 5 and paused. The solder feeder 7 set on the processing support cover 2 applies solder to the heat dissipation pad at the bottom of the chip, so that the solder solidifies in a spherical shape on the surface of the heat dissipation pad, achieving the effect of quantitatively feeding the solder. Chip solder coating: The chip is transported to the film layer flattening and winding device so that the solder encapsulation film 14 is located directly above the chip; then, when it moves synchronously to the pressing assembly, the temperature-controlled solder pressing head 16 is driven to move down by the extrusion push rod 15 to melt the solidified solder and press it flat on the surface of the heat dissipation pad, while the solder encapsulation film 14 is adsorbed onto the heat dissipation pad. Chip flattening film encapsulation: The chip is transported to the desoldering flattening component. The flattening push rod 17 drives the cutting head 18 to move down, removing excess solder and solder encapsulation film 14 from the chip heat sink pad. The excess solder is removed from the chip along with the film layer, and finally the solder encapsulation film 14 is formed on the surface of the heat sink pad coated with solder. Chip pin detection: When the chip is inverted and mounted in the positioning port 8, when the chip is cut by the cutting head 18 driven by the flat push rod 17, the chip conveyor belt 5 is controlled to move. At this time, the chip is blocked by the cutting head 18 and cannot move. This will cause the chip to move from the front end of the positioning port 8 to the rear end of the positioning port 8. At this time, the chip will move from one half of the base to the other half of the base. This setting can satisfy the contact between the two ends of the chip and the end contacts 9. By using the relative displacement between the chip and the chip conveyor belt 5, the pin contacts on the positioning port 8 are made to contact the four-sided leads of the chip, thus completing the pin detection test. This invention effectively solves the core pain points (voids, uneven solder) in QFP chip thermal pad packaging through a series of innovative mechanical structures, temperature-controlled pressing and coating processes, and integrates online detection functions, which have significant beneficial effects on improving packaging quality, reliability and production efficiency.

[0027] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A communication module chip packaging and welding apparatus, comprising a chip preprocessing device for welding communication module chips, characterized in that, The chip preprocessing device consists of a chip conveying pin detection module, a solder pre-coating module and a solder film coating and leveling module set on a conveyor frame (1). A processing support cover (2) is set on the conveyor frame (1). The solder pre-coating module and the solder film coating and leveling module are both set on the processing support cover (2). An upper frame (3) is set on the processing support cover (2). The chip conveying pin detection module includes a chip conveyor belt (5) set on a conveyor frame (1), chip positioning seats (6) for positioning and conveying pins are evenly arranged on the chip conveyor belt (5), and detection components for detecting chip pins are arranged on the chip positioning seats (6). The tin coating and leveling module includes a processing port (4) opened on the processing support cover (2), a film layer flattening and winding device is provided at the processing port (4), a film pressing component is provided on the upper frame (3) for pressing the film layer to contact the tin material, and a tin removal and leveling component is provided on the upper frame (3) for cutting and collecting the film layer. The tin pre-coating module includes a tin feeder (7) set on the processing support cover (2). The tin feeder (7) is set on the upper frame (3), and its bottom tin conveying gun extends downward through the processing port (4) to quantitatively coat the chip heat dissipation pads in the chip positioning seat (6). The chip positioning base (6) consists of two opposing half-bases. The bottom of the half-bases is connected to the surface of the chip conveyor belt (5) through a connecting layer. The chip positioning base (6) has a positioning port (8) for chip insertion. The bottom of the positioning port (8) is provided with a roller to reduce friction with the chip. The detection component includes pin contacts located on the upper side wall of the positioning port (8). The pin contacts consist of end contacts (9) located on the inner wall of the two sets of half-seat bodies and side contacts (10) located on one set of half-seat bodies. The film layer flat winding device includes a residual material winding and collecting cylinder (11), an adjusting roller (12), and a film exiting roller (13) set on the processing support cover (2). The film exiting roller (13) is wound with a tin encapsulation film (14), which is connected to the residual material winding and collecting cylinder (11) in sequence by the adjusting roller (12). The pressing assembly includes a pressing push rod (15) disposed on the upper frame (3), and a temperature-controlled solder head (16) is provided at the bottom of the pressing push rod (15). The temperature-controlled solder head (16) has a soldering port at the bottom that is adapted to the heat dissipation pad of the chip. The desoldering and leveling assembly includes a leveling push rod (17) mounted on the upper frame (3), and the bottom of the leveling push rod (17) is provided with a cutting head (18) for cutting the film layer and excess solder.

2. The packaging and welding method proposed in the communication module chip packaging and welding apparatus according to claim 1, characterized in that, Includes the following steps: S1, Chip flip positioning and conveying: Place the chip with the bottom facing up. When the chip positioning seat (6) moves to the end of the chip conveyor belt (5), use the transfer workpiece to insert the chip horizontally into the positioning port (8) on the chip positioning seat (6), and realize the chip one by one conveying through the chip conveyor belt (5). S2, chip pre-coating: The chip is transported to the solder pre-coating module by the chip conveyor belt (5) and paused. The solder feeding machine (7) set on the processing support cover (2) applies solder to the heat dissipation pad at the bottom of the chip, so that the solder solidifies in a spherical shape on the surface of the heat dissipation pad. S3, chip solder coating: The chip is transported to the film layer flattening and winding device so that the solder encapsulation film (14) is located directly above the chip; then, when moving synchronously to the pressing assembly, the temperature-controlled solder pressing head (16) is driven to move down by the extrusion push rod (15) to melt the solidified solder and press it flat on the surface of the heat dissipation pad, while the solder encapsulation film (14) is adsorbed onto the heat dissipation pad; S4, Chip flattening film encapsulation: The chip is transported to the desoldering flattening component, and the cutting head (18) is driven down by the flattening push rod (17) to remove the excess solder and solder encapsulation film (14) at the chip heat sink pad, so that the excess solder is removed from the chip along with the film layer, and finally the solder encapsulation film (14) is formed on the surface of the heat sink pad coated with solder. S5. Chip pin detection: When the chip is installed upside down in the positioning port (8), when the chip is cut by the cutting head (18) driven by the flat push rod (17), the chip conveyor belt (5) is controlled to move. The chip is blocked by the cutting head (18) and cannot move synchronously with the chip conveyor belt (5). The chip moves from the front end of the positioning port (8) to the rear end of the positioning port (8), and moves from one half of the base to the other half of the base. The two ends of the chip contact the end contacts (9). The relative displacement between the chip and the chip conveyor belt (5) makes the pin contacts on the positioning port (8) contact the four-sided leads of the chip, thus completing the pin detection test.

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