Printing plate drying method, laminating oven, and printing plate drying apparatus

Abstract

The present application relates to a kind of printing plate drying method, laminated baking oven and printing plate drying equipment, the method is applied to laminated baking oven, the laminated baking oven includes: feeding area, baking area and discharging area, the baking area includes laminated baking frame, the laminated baking frame can be moved up and down in the baking area;The method includes: the printing plate to be dried passes through the feeding area, enters the baking area;The printing plate to be dried is stacked on the laminated baking frame;The printing plate to be dried moves up and down with the laminated baking frame in the baking area, until the length of stay in the baking area reaches drying length, become dried printing plate;The dried printing plate enters the discharging area from the baking area.The present application can reduce the planar area occupied by drying equipment, thereby reducing cost.

Description

Technical Field

[0001] This invention relates to the field of electronic processing, and more particularly to a method for drying printed circuit boards, a stacked baking oven, and equipment for drying printed circuit boards. Background Technology

[0002] PCB printing, also known as circuit board printing, is one of the core processes in the electronics industry for manufacturing printed circuit boards (PCBs). This technology uses screen printing to precisely transfer conductive ink onto an insulating substrate, forming the circuit patterns that interconnect electronic components. It is widely used in computers, communication equipment, home appliances, and military equipment.

[0003] Drying / baking is a crucial step in the PCB printing process, impacting the quality of the printed circuit board. Current technology typically employs flatbed conveyor baking, with baking time determined by the conveyor length. When a longer baking time is required, the conveyor occupies a larger space and consumes more energy. For example, considering a previous printing speed of 400 pcs / H and a conveyor speed of 2m / min, a 20-minute baking time requires a 40-meter conveyor, while a 40-minute baking time requires an 80-meter conveyor.

[0004] It is evident that existing printing plate drying methods are insufficient to meet the requirements. Summary of the Invention

[0005] In order to solve the above-mentioned technical problems, or at least partially solve the above-mentioned technical problems, the present invention provides a printing plate drying method, a stack baking oven, and a printing plate drying equipment.

[0006] In a first aspect, the present invention provides a method for drying a printed circuit board, the method being applied to a stacked baking oven, the stacked baking oven comprising: a loading zone, a baking zone, and a unloading zone, the baking zone comprising a stacked baking rack, the stacked baking rack being movable up and down within the baking zone; The method includes: The printing plate to be dried is passed through the feeding area and enters the baking area; The printed circuit boards to be dried are stacked on the stacked baking rack; The printing plate to be dried is moved up and down in the baking zone by the stacked baking rack until the dwell time in the baking zone reaches the drying time, and it becomes a dried printing plate. The dried printing plate is moved from the baking area into the unloading area.

[0007] Optionally, stacking the printed circuit boards to be dried on the stacking baking rack includes: The printing plates to be dried are placed one by one on the stacked baking rack in a preset order.

[0008] Optionally, the step of moving the dried printing plate from the baking zone into the unloading zone includes: The dried printing plates are removed one by one from the stacked baking rack in the preset order and enter the unloading area.

[0009] Optionally, a working cycle of printing plate drying includes multiple operation time periods and multiple movement time periods, where the start time of the current operation time period is the end time of the previous movement time period, and the end time of the current operation time period is the start time of the current movement time period. Wherein, the duration of one of the work cycles is equal to the drying time; During each of the aforementioned operation time periods, one of the printed circuit boards to be dried is placed on the stacked baking rack, while one of the dried printed circuit boards is removed from the stacked baking rack. During each of the aforementioned moving time periods, the stacked baking rack moves one step distance or two step distances.

[0010] Optionally, within the same operation time period, the printing plate to be dried placed on the stacked baking rack and the dried printing plate removed from the stacked baking rack are not the same printing plate.

[0011] Optionally, the step of moving the printing plate to be dried up and down within the baking zone along with the stacked baking rack includes: Within one work cycle, the stacked baking rack is moved upward from the initial position to the upper limit position, and then downward from the upper limit position back to the initial position. or Within one working cycle, the stacked baking rack is moved downward from the initial position to the lower limit position, and then moved upward from the lower limit position back to the initial position.

[0012] Optionally, the stacked baking rack includes N baking layers, each baking layer is used to place one of the printing plates, and one working cycle includes N moving time periods; Within one work cycle, moving the stacked baking rack upward from the initial position to the upper limit position, and then downward from the upper limit position back to the initial position includes: During the first moving time period, the stacked baking rack moves upward by one step distance; In the 2nd to the 3rd In each of the moving time periods, the stacked baking rack moves upward by two step distances; In the During a single moving time period, the stacked baking rack moves downward by one step distance; In the In each of the Nth to Nth moving time periods, the stacked baking rack moves downward by two step distances; Where N is an even number.

[0013] Optionally, one work cycle includes N operation time periods, and the preset order is that within the i-th operation time period from the 1st to the Nth operation time period, When i=1, the printing plate to be dried is placed on the first baking layer, and the dried printing plate is removed from the second baking layer; i=2……、 At the same time, place the printed circuit board to be dried on the 2i-2 baking layer, and simultaneously remove the dried printed circuit board from the 2i baking layer; i= At the same time, place the printed circuit board to be dried on the Nth baking layer, and simultaneously take the dried printed circuit board from the (N-1)th baking layer; i= , ...At times N-1 and N, place the printing plate to be dried in the... The baking layer, while from the first baking layer... Each baking layer is taken from the dried printing plate; Where N is an even number.

[0014] In a second aspect, a stacked baking oven is provided, which uses the method described in any of the preceding claims. The stacked baking oven includes a feeding area, a baking area, and a discharging area. The baking area includes a stacked baking rack, which is movable up and down within the baking area. The printed circuit boards are stacked on the stacked baking rack. The stacked baking oven also includes: The feeding unit is used to allow the printing plate to be dried to pass through the feeding area and enter the baking area; The feeding unit is also used to stack the printed boards to be dried on the stacked baking rack. A drive unit is used to move the printing plate to be dried up and down in the baking zone along with the stacked baking rack until the dwell time in the baking zone reaches the drying time, thus becoming a dried printing plate. The unloading unit is used to move the dried printed circuit board from the baking area into the unloading area.

[0015] Thirdly, a printing plate drying apparatus is provided, the apparatus employing the method described in any of the preceding claims, the printing plate drying apparatus comprising: a loading zone, a baking zone, and a unloading zone, the baking zone comprising a stacked baking rack, the stacked baking rack being movable vertically within the baking zone.

[0016] This invention provides a method for drying printed circuit boards, a stacked baking oven, and a printing board drying device. The method is applied to a stacked baking oven, which includes a loading area, a baking area, and a unloading area. The baking area includes a stacked baking rack that can move vertically within the baking area. The method includes: allowing the printed circuit boards to be dried to pass through the loading area and enter the baking area; stacking the printed circuit boards to be dried on the stacked baking rack; moving the printed circuit boards to be dried vertically within the baking area with the stacked baking rack until the required drying time is reached, thus becoming dried printed circuit boards; and moving the dried printed circuit boards from the baking area into the unloading area. Because the printed circuit boards to be dried in this embodiment are stacked and can move vertically within the baking area until the required drying time is reached, the method of this invention can meet the drying time requirements of the printed circuit boards and reduce the planar conveying length. Therefore, it can greatly reduce the volume of the drying equipment and the floor space occupied by the drying equipment, thereby reducing costs. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 The diagram shown illustrates the application environment of the printing plate drying method according to an embodiment of the present invention. Figure 2 The diagram shown illustrates the application environment of the printing plate drying method according to an embodiment of the present invention. Figure 3 The diagram shown is a schematic flowchart of a printing plate drying method according to an embodiment of the present invention. Figure 4 The diagram shown is a schematic representation of the stacked baking rack moving up and down within the baking zone according to an embodiment of the present invention. Figure 5 The diagram shown is a schematic of the stacked baking rack moving up and down within the baking zone according to an embodiment of the present invention. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Figure 1 , Figure 2 This is a diagram illustrating the application environment of a printing plate drying method in one embodiment. (Refer to...) Figure 1 and Figure 2 This printing plate drying method is applied to a stack baking oven. Figure 1 The image shown is a top view of a stacked baking oven. Figure 2 The image shown is a front view of a stacked baking oven. Figure 1 and Figure 2 As shown, the stacked baking oven includes a feeding area 110, a baking area 120, and a discharging area 130. The baking area 120 includes a stacked baking rack 121, which can move up and down within the baking area. Figure 3 The diagram shown is a schematic flow chart of a printing plate drying method according to an embodiment of the present invention. Figure 3 As shown, the method includes: Step 210: The printing plate to be dried is passed through the feeding area and enters the baking area; Step 220: The printed circuit boards to be dried are stacked on the stacked baking rack. Step 230: The printing plate to be dried is moved up and down in the baking zone along with the stacked baking rack until the time spent in the baking zone reaches the drying time, thus becoming a dried printing plate; Step 240: The dried printing plate is moved from the baking area to the unloading area.

[0022] In the method of this embodiment of the invention, the printing plates to be dried are fed through the loading area and enter the baking area; the printing plates to be dried are stacked on the stacked baking rack; the printing plates to be dried are moved up and down in the baking area with the stacked baking rack until the dwell time in the baking area reaches the drying time, thus becoming dried printing plates; the dried printing plates are then moved from the baking area into the unloading area. Because the printing plates to be dried in this embodiment of the invention are stacked and can move up and down in the baking area until the dwell time reaches the drying time, the method of this invention can meet the drying time requirements of the printing plates and reduce the planar conveying length. Therefore, it can greatly reduce the volume of the drying equipment and the planar area occupied by the drying equipment, thereby reducing costs.

[0023] In this embodiment of the invention, step 220, which involves stacking the printing plates to be dried on the stacking baking rack, includes: The printing plates to be dried are placed one by one on the stacked baking rack in a preset order.

[0024] In this embodiment of the invention, step 220, which involves moving the dried printing plate from the baking zone into the unloading zone, includes: The dried printing plates are removed one by one from the stacked baking rack in the preset order and enter the unloading area.

[0025] In this embodiment of the invention, a working cycle of printing plate drying includes multiple operation time periods and multiple movement time periods. The start time of the current operation time period is the end time of the previous movement time period, and the end time of the current operation time period is the start time of the current movement time period. Wherein, the duration of one of the work cycles is equal to the drying time; During each of the aforementioned operation time periods, one of the printed circuit boards to be dried is placed on the stacked baking rack, while one of the dried printed circuit boards is removed from the stacked baking rack. During each of the aforementioned moving time periods, the stacked baking rack moves one step distance or two step distances.

[0026] In this embodiment of the invention, a work cycle begins with an operation period, followed by a movement period, which alternates. A work cycle ends with a movement period. The duration each printed circuit board spends in the baking area constitutes one work cycle.

[0027] In this embodiment of the invention, within the same operation time period, the printing plate to be dried placed on the stacked baking rack and the dried printing plate removed from the stacked baking rack are not the same printing plate.

[0028] In this embodiment of the invention, the step of moving the printing plate to be dried up and down within the baking zone along with the stacked baking rack includes: Within one work cycle, the stacked baking rack is moved upward from the initial position to the upper limit position, and then downward from the upper limit position back to the initial position. or Within one working cycle, the stacked baking rack is moved downward from the initial position to the lower limit position, and then moved upward from the lower limit position back to the initial position.

[0029] The position shown at 410 is the initial position. Figure 4In the embodiment shown, the stacked baking rack first moves upward from the initial position to the upper limit position 420, and then moves downward to the initial position 410.

[0030] In other embodiments of the present invention, the initial position, upper limit position, and lower limit position can also be set as needed. For example, if the stacked baking rack first moves downward from the initial position to the lower limit position, then the initial position can be... Figure 4 The value is 410, and the lower limit is... Figure 4 420 in the middle.

[0031] In this embodiment of the invention, the stacked baking rack includes N baking layers, each baking layer is used to place one of the printing plates, and one working cycle includes N moving time periods; Within one work cycle, moving the stacked baking rack upward from the initial position to the upper limit position, and then downward from the upper limit position back to the initial position includes: During the first moving time period, the stacked baking rack moves upward by one step distance; In the 2nd to the 3rd In each of the moving time periods, the stacked baking rack moves upward by two step distances; In the During a single moving time period, the stacked baking rack moves downward by one step distance; In the In each of the Nth to Nth moving time periods, the stacked baking rack moves downward by two step distances; Where N is an even number.

[0032] In this embodiment of the invention, a work cycle includes N operation time periods, and the preset order is that within the i-th operation time period from the 1st to the Nth operation time period, When i=1, the printing plate to be dried is placed on the first baking layer, and the dried printing plate is removed from the second baking layer; i=2……、 At the same time, place the printed circuit board to be dried on the 2i-2 baking layer, and simultaneously remove the dried printed circuit board from the 2i baking layer; i= At the same time, place the printed circuit board to be dried on the Nth baking layer, and simultaneously take the dried printed circuit board from the (N-1)th baking layer; i= , ...At times N-1 and N, place the printing plate to be dried in the... The baking layer, while from the first baking layer... Each baking layer is taken from the dried printing plate; Where N is an even number.

[0033] In this embodiment of the invention, by using the above-mentioned moving step distance and the preset order of picking up and placing, it is possible to pick up one printing plate and place one printing plate at the same time during each operation period when the baking rack moves in the baking area, and the different picking and placing positions will not interfere with each other, and the duration of each printing plate in the baking area meets the baking time.

[0034] Figure 5 The diagram shown is a schematic representation of the stacked baking rack moving up and down within the baking zone according to an embodiment of the present invention. Figure 5 The example shown has 40 baking layers, which can hold 40 printing plates.

[0035] Figure 5 In the table, t1, t2, t3...t40 represent the number of the operation time period.

[0036] like Figure 5 As shown in (a), at the initial position, during the first operation time period, the printing plate is placed on the first baking layer, the printing plate is taken from the second baking layer, and then moved by one step distance during the first movement time period. During the second operation time period, the printing plate is placed on the second baking layer, and the printing plate is taken from the fourth baking layer. Then, during the second movement time period, it is moved upward by two step distances. During the third operation time period, the printing plate is placed on the fourth baking layer, and the printing plate is taken from the sixth baking layer. Then, during the third movement time period, it is moved upward by two step distances. ... like Figure 5 As shown in (b), during the 19th operation time period, the printing plate is placed on the 36th baking layer, the printing plate is taken from the 38th baking layer, and then moved upward by two step distances during the 19th movement time period. During the 20th operation time period, the printing plate is placed on the 38th baking layer, the printing plate is taken out from the 40th baking layer, and then moved upward by two step distances during the 19th movement time period. During the 21st operation time period, the printing plate is placed on the 40th baking layer, the printing plate is taken from the 39th baking layer, and then moved down one step distance during the 21st movement time period. During the 22nd operation time period, the printed board is placed on the 39th baking layer, and the printed board is taken from the 37th baking layer. Then, during the 22nd movement time period, it is moved down two step distances.

[0037] ... like Figure 5As shown in (c), during the 39th operation time period, the printing plate is placed on the 5th baking layer, the printing plate is taken from the 3rd baking layer, and then moved down two step distances during the 39th movement time period. During the 40th operation time period, the printing plate is placed on the 3rd baking layer, the printing plate is taken from the 1st baking layer, and then moved down two step distances during the 40th movement time period. The above process will be repeated in the next work cycle.

[0038] In this embodiment of the invention, by using the above-mentioned moving step distance and the preset order of picking up and placing, it is possible to pick up one printing plate and place one printing plate at the same time during each operation period when the baking rack moves in the baking area, and the different picking and placing positions will not interfere with each other, and the duration of each printing plate in the baking area meets the baking time.

[0039] This invention also discloses a stacked baking oven, which includes a feeding area, a baking area and a discharging area. The baking area includes a stacked baking rack, which can move up and down within the baking area. The printed circuit boards are stacked on the stacked baking rack. The stacked baking oven also includes: The feeding unit is used to allow the printing plate to be dried to pass through the feeding area and enter the baking area; The feeding unit is also used to stack the printed boards to be dried on the stacked baking rack. A drive unit is used to move the printing plate to be dried up and down in the baking zone along with the stacked baking rack until the dwell time in the baking zone reaches the drying time, thus becoming a dried printing plate. The unloading unit is used to move the dried printed circuit board from the baking area into the unloading area.

[0040] In this embodiment of the invention, the feeding unit is further used for: The printing plates to be dried are placed one by one on the stacked baking rack in a preset order.

[0041] In this embodiment of the invention, the feeding unit is further used for: The dried printing plates are removed one by one from the stacked baking rack in the preset order and enter the unloading area.

[0042] In this embodiment of the invention, a working cycle of printing plate drying includes multiple operation time periods and multiple movement time periods. The start time of the current operation time period is the end time of the previous movement time period, and the end time of the current operation time period is the start time of the current movement time period. Wherein, the duration of one of the work cycles is equal to the drying time; During each of the aforementioned operation time periods, one of the printed circuit boards to be dried is placed on the stacked baking rack, while one of the dried printed circuit boards is removed from the stacked baking rack. During each of the aforementioned moving time periods, the stacked baking rack moves one step distance or two step distances.

[0043] In this embodiment of the invention, within the same operation time period, the printing plate to be dried placed on the stacked baking rack and the dried printing plate removed from the stacked baking rack are not the same printing plate.

[0044] In this embodiment of the invention, the driving unit is further configured to: Within one work cycle, the stacked baking rack is moved upward from the initial position to the upper limit position, and then downward from the upper limit position back to the initial position. or Within one working cycle, the stacked baking rack is moved downward from the initial position to the lower limit position, and then moved upward from the lower limit position back to the initial position.

[0045] In this embodiment of the invention, the stacked baking rack includes N baking layers, each baking layer is used to place one of the printing plates, and one working cycle includes N moving time periods; During one of the aforementioned work cycles, the drive unit is also used for: During the first moving time period, the stacked baking rack is moved upward by one step distance; In the 2nd to the 3rd For each of the moving time intervals, the stacked baking rack is moved upward by two step lengths. In the The stacked baking rack is moved downwards by one step distance over a certain period of time. In the For each of the Nth to Nth moving time periods, the stacked baking rack is moved downward by two step distances. Where N is an even number.

[0046] In this embodiment of the invention, a work cycle includes N operation time periods, and the preset order is that within the i-th operation time period from the 1st to the Nth operation time period, When i=1, the printing plate to be dried is placed on the first baking layer, and the dried printing plate is removed from the second baking layer; i=2……、 At the same time, place the printed circuit board to be dried on the 2i-2 baking layer, and simultaneously remove the dried printed circuit board from the 2i baking layer; i= At the same time, place the printed circuit board to be dried on the Nth baking layer, and simultaneously take the dried printed circuit board from the (N-1)th baking layer; i= , ...At times N-1 and N, place the printing plate to be dried in the... The baking layer, while from the first baking layer... Each baking layer is taken from the dried printing plate; Where N is an even number.

[0047] In this embodiment of the invention, the drying time requirement of the printed circuit board can be met, and the planar conveying length can be reduced. Therefore, the volume of the drying equipment can be greatly reduced, the planar area occupied by the drying equipment can be reduced, and thus the cost can be reduced.

[0048] Figure 3 This is a schematic flowchart of a printing plate drying method in one embodiment. It should be understood that, although... Figure 3 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 3 At least some of the steps in the process may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0049] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided by this invention can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0050] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0051] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for drying a printing plate, characterized in that, The method is applied to a stacked baking oven, which includes a feeding area, a baking area, and a discharging area. The baking area includes a stacked baking rack, which can move up and down within the baking area. The stacked baking rack includes N baking layers, and each baking layer is used to place one of the printed circuit boards. The method includes: The printing plate to be dried is passed through the feeding area and enters the baking area; The printed circuit boards to be dried are stacked on the stacked baking rack; The step of stacking the printed circuit boards to be dried on the stacked baking rack includes: placing the printed circuit boards to be dried one by one on the stacked baking rack in a preset order; The printing plate to be dried is moved up and down in the baking zone by the stacked baking rack until the dwell time in the baking zone reaches the drying time, and it becomes a dried printing plate. The dried printing plate is moved from the baking area into the unloading area; One working cycle of the printing plate drying includes N operation time periods and N movement time periods. The start time of the current operation time period is the end time of the previous movement time period, and the end time of the current operation time period is the start time of the current movement time period. Wherein, the duration of one working cycle is equal to the drying time; in each operation time period, one of the printed circuit boards to be dried is placed on the stacked baking rack, and at the same time, one of the dried printed circuit boards is removed from the stacked baking rack; in each movement time period, the stacked baking rack moves one step distance or two step distances. The step of moving the printed circuit board to be dried up and down in the baking zone with the stacked baking rack includes: moving the stacked baking rack from the initial position to the upper limit position and then from the upper limit position to the initial position within one working cycle; The step of moving the stacked baking rack from the initial position upward to the upper limit position and then from the upper limit position downward back to the initial position within one work cycle includes: During the first moving time period, the stacked baking rack moves upward by one step distance; during the second to the third... In each of the moving time intervals, the stacked baking rack moves upward by two step distances; in the first... During a certain moving time period, the stacked baking rack moves downwards by one step distance; in the first... In each of the first to Nth moving time periods, the stacked baking rack moves downward by two step distances; where N is an even number; The preset sequence is as follows: during the i-th operation time period from the 1st to the Nth operation time period, when i=1, the printing plate to be dried is placed on the 1st baking layer, and the dried printing plate is removed from the 2nd baking layer; when i=2, ..., ... At the same time, place the printed circuit board to be dried on the 2i-2 baking layer, and simultaneously remove the dried printed circuit board from the 2i baking layer; i = At the same time, place the printed circuit board to be dried on the Nth baking layer, and simultaneously remove the dried printed circuit board from the (N-1)th baking layer; i = , ...At times N-1 and N, place the printing plate to be dried in the... The baking layer, while from the first baking layer... Each baking layer is taken from a dried printed circuit board; where N is an even number.

2. The method according to claim 1, characterized in that, The step of moving the dried printing plate from the baking zone into the unloading zone includes: The dried printing plates are removed one by one from the stacked baking rack in the preset order and enter the unloading area.

3. The method according to claim 1, characterized in that, During the same operation period, the printing plate to be dried placed on the stacked baking rack and the dried printing plate removed from the stacked baking rack are not the same printing plate.

4. The method according to claim 1, characterized in that, The method of moving the printed circuit board to be dried up and down within the baking zone along with the stacked baking rack further includes: Within one working cycle, the stacked baking rack is moved downward from the initial position to the lower limit position, and then moved upward from the lower limit position back to the initial position.

5. A stacked baking oven, characterized in that, Using the method as described in any one of claims 1 to 4, the stacked baking oven includes: a feeding area, a baking area, and a discharging area, the baking area including a stacked baking rack, the stacked baking rack being movable up and down within the baking area, and the printed circuit boards being stacked on the stacked baking rack; The stacked baking oven also includes: The feeding unit is used to allow the printing plate to be dried to pass through the feeding area and enter the baking area; The feeding unit is also used to stack the printed boards to be dried on the stacked baking rack. A drive unit is used to move the printing plate to be dried up and down in the baking zone along with the stacked baking rack until the dwell time in the baking zone reaches the drying time, thus becoming a dried printing plate. The unloading unit is used to move the dried printed circuit board from the baking area into the unloading area.

6. A printing plate drying device, characterized in that, The device uses the method described in any one of claims 1 to 4, and the printing plate drying device includes: a feeding area, a baking area, and a discharging area, wherein the baking area includes a stacked baking rack that can move up and down within the baking area.

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