Spacecraft thermal test thermal response automatic test method and system

Abstract

The application provides a spacecraft thermal test thermal response automatic testing method and system, the method comprises the following steps: S1: obtaining preset configuration information and performing resistance interpretation test on the current power output loop; S2: applying an initial test current to the power output loop passed the test, and obtaining the temperature of all measuring points at a fixed time; S3: judging whether the temperature change of the measuring point meets the response condition, if yes, judging the matching of the power output loop and the measuring point meeting the response condition, and performing the test on the next power output loop, if not, returning to step S2 and increasing the test current in steps until the measuring point meeting the matching condition is found. The application has high safety in the test process, the power output loop is preliminarily determined to have no abnormal configuration, and then the temperature measuring point and the power output loop are gradually confirmed in the step-by-step power-on mode, so that the problems such as the burning of the heating sheet or the abnormal temperature of the product caused by the too large current applied by the power output loop for too long time are avoided.

Description

Technical Field

[0001] This invention relates to the field of spacecraft vacuum thermal testing, and more specifically, to an automatic testing method and system for the thermal response of spacecraft thermal tests. Background Technology

[0002] Spacecraft undergo vacuum thermal testing at each stage of design, performance qualification, and acceptance to assess the consistency and reliability of component performance with design specifications. The testing primarily involves applying a specified external heat flow to the test product to simulate its on-orbit operating environment and monitoring temperature changes. External heat flow simulation methods include heating elements, heating cages, infrared quartz lamps, and heating rods, which are connected to a power supply to form a power output circuit. One or more power output circuits are used to heat the test product. Thermocouples, resistance temperature detectors (RTDs), and thermistors are used to measure the temperature of various individual areas of the spacecraft product in real time. Before thermal testing, a thermal response test must be performed to verify the correctness and matching accuracy of the power output circuit and temperature measurement points. This ensures that the external heat flow power is correctly applied to the designated locations during the test, preventing errors in heat flow or overcurrent burnout of heating elements due to design flaws, incorrect welding of heating / temperature measurement cables, or software configuration errors, which could affect the success or failure of the test. Meanwhile, during traditional manual thermal response testing, it is necessary to power up the power output circuit one by one and visually search for the point with the greatest temperature rise from hundreds of temperature measurement points. This not only results in extremely low testing efficiency, but also makes it very easy to make mistakes such as incorrect temperature point judgment, excessive current application, and excessive power-up time, which can affect the progress of the test or even its success or failure.

[0003] In summary, a testing method and system are needed to automate the thermal response testing of spacecraft before thermal testing, while ensuring product safety.

[0004] Patent document CN112213137B discloses a non-contact measurement method for heat flow on the surface of a spacecraft based on vacuum thermal testing, which can accurately measure the heat flow reaching the surface of the spacecraft without contact with the surface of the spacecraft; however, the technical method used in this invention is completely different from that in this patent document. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide an automatic testing method and system for the thermal response of spacecraft thermal tests.

[0006] An automatic test method for thermal response of a spacecraft according to the present invention includes: Step S1: Obtain the preset configuration information and perform resistance value determination test on the current power output circuit; Step S2: Apply a test current to the power output circuit that has passed the test, and periodically obtain the temperature of all measuring points; Step S3: Determine if there is a measurement point that meets the response condition. If yes, determine if the power output circuit matches the response temperature measurement point and perform the test on the next power output circuit. If no, return to step S2 and gradually increase the test current until a temperature measurement point meets the response condition.

[0007] Preferably, the configuration information includes the matching requirements of the power output device and temperature measuring point, and the design resistance value R of the power output circuit. S The power output circuit can apply a maximum current I. MAX The expected temperature rise at the correct measuring point after applying current, i.e., the response condition T. S The ratio of the stepped boost current to the maximum applicable current (n) and the longest power-on time (t) for each power output circuit. MAX .

[0008] Preferably, step S1 includes: Apply a resistance test current I to the current power output circuit. R0 Read the voltage U of the power output device R and current value I R The actual resistance R of the current power output circuit is calculated and compared with the designed resistance R of the power output circuit. S The comparison is performed to determine whether the readability test is passed.

[0009] Preferably, the resistance test current is 0.1A and I. MAX The smaller value in *1 / 2, the standard for passing the resistance reading test is 0.9*R. S ≤R≤1.1*R S .

[0010] Preferably, step S2 includes: Apply an initial test current I0 to the current power output circuit, periodically acquire the temperature of all measuring points, and calculate the change in real-time temperature ΔT compared to when the initial test current was applied.

[0011] Preferably, step S3 includes the following sub-steps: Step S3.1: Within each temperature sampling period, find the measurement point with the maximum temperature rise. If the maximum temperature rise ΔT MAX ≥T S Then proceed to step S3.3 for further judgment. If ΔT MAX ≤T S Then proceed to the next temperature sampling cycle for another assessment; Step S3.2: When ΔT MAX ≤T S The continuous power-on time t has exceeded the longest power-on time t of the power output circuit. MAXThen, the test current I is increased in steps, and the single increase current ΔI = n*I MAX ; Step S3.3: If the measuring point corresponding to the power output circuit is consistent with the measuring point with the maximum temperature rise, the thermal response test is deemed qualified, and the power output circuit status is set to completed, and the next power output circuit test is performed. If the measuring point corresponding to the power output circuit is not completely consistent with the measuring point of maximum temperature rise, it is determined whether the temperature rise is caused by the residual heat of the completed power output circuit causing the corresponding measuring point to continue to rise. If the measuring point of maximum temperature rise does not correspond to the completed power output circuit, the current output power circuit is determined to be unqualified. If the measuring point of maximum temperature rise corresponds to the completed power output circuit, steps S2-S3 are repeated until it can be determined to be qualified or unqualified, and then the next power output circuit test begins.

[0012] Preferably, each power output circuit corresponds to one or more temperature measurement points; the test is deemed qualified only when the measurement points with the highest temperature rise are completely consistent with the measurement points corresponding to the test power output circuit.

[0013] Preferably, the test of the next circuit begins after the current output of the current power output circuit is stopped.

[0014] An automatic thermal response testing system for spacecraft thermal testing according to the present invention includes: A power output device used to apply a test current to the power output circuit; Temperature data acquisition device, used to collect temperature data at various temperature measuring points; The testing software is used to perform the following operations: Obtain the preset configuration information and perform resistance value determination test on the current power output circuit; For the power output circuit that passes the resistance test, control the power output device to apply a test current and obtain the temperature of all measuring points from the temperature data acquisition device; Determine whether the power output circuit and the measuring point temperature meet the matching conditions. If not, control the power output device to increase the test current in steps and reacquire the measuring point temperature until the matching conditions are met. If yes, control the power output device to stop the current circuit output and start the test process of the next power output circuit.

[0015] Preferably, the configuration information includes the matching requirements of the power output device and temperature measuring point, and the design resistance value R of the power output circuit. S The power output circuit can apply a maximum current I. MAX The expected temperature rise T at the correct measuring point after applying current. S The ratio of the stepped boost current to the maximum applicable current (n) and the longest power-on time (t) for each power output circuit.MAX .

[0016] Preferably, the process of preventing the interpretation test includes: Apply a resistance test current I to the current power output circuit. R0 Read the voltage U of the power output device R and current value I R The actual resistance R of the current power output circuit is calculated and compared with the designed resistance R of the power output circuit. S The comparison is performed to determine whether the readability test is passed.

[0017] Preferably, the resistance test current is 0.1A and I. MAX The smaller value in *1 / 2, the standard for passing the resistance reading test is 0.9*R. S ≤R≤1.1*R S .

[0018] Preferably, an initial test current I0 is applied to the current power output circuit, the temperature of all measuring points is acquired periodically, and the change in real-time temperature ΔT compared to when the initial test current was applied is calculated.

[0019] Preferably, within each temperature sampling period, the measuring point with the maximum temperature rise is found, and if the maximum temperature rise ΔT MAX ≥T S Then proceed to step S3.3 for further judgment. If ΔT MAX ≤T S Then proceed to the next temperature sampling cycle for another assessment; When ΔT MAX ≤T S The continuous power-on time t has exceeded the longest power-on time t of the power output circuit. MAX Then, the test current I is increased in steps, and the single increase current ΔI = n*I MAX ; If the measuring point corresponding to the power output circuit is the same as the measuring point with the maximum temperature rise, the thermal response test is deemed to be qualified, and the power output circuit status is set to completed, and the next power output circuit test is performed. If the measuring point corresponding to the power output circuit is not completely consistent with the measuring point of maximum temperature rise, it is determined whether the temperature rise is caused by the residual heat of the completed power output circuit causing the corresponding measuring point to continue to rise. If the measuring point of maximum temperature rise does not correspond to the completed power output circuit, the current output power circuit is determined to be unqualified. If the measuring point of maximum temperature rise corresponds to the completed power output circuit, steps S2-S3 are repeated until it can be determined to be qualified or unqualified, and then the next power output circuit test begins.

[0020] Preferably, each power output circuit corresponds to one or more temperature measurement points; the test is deemed qualified only when the measurement points with the highest temperature rise are completely consistent with the measurement points corresponding to the test power output circuit.

[0021] Preferably, the test of the next circuit begins after the current output of the current power output circuit is stopped.

[0022] Compared with the prior art, the present invention has the following beneficial effects: 1. The method provided by this invention utilizes an automatic testing system to automatically check the correspondence between the external heat flow power output circuit and the product temperature measurement point through processes such as determining the resistance value of the power output circuit, obtaining the maximum temperature response point after power output, and comparing the consistency between the response point and control requirements. Furthermore, it ensures product safety during the testing process by using current limiting and stepped current increase methods, thereby guaranteeing the normal implementation of subsequent spacecraft thermal tests.

[0023] 2. This invention solves the problems of inefficiency, high risk of misoperation, and easy over-power in traditional thermal response testing modes, which involve manually adjusting each power output circuit. This improves the overall safety of spacecraft thermal testing.

[0024] 3. The testing process of this invention has a high degree of safety. First, it is preliminarily determined that the power output circuit itself is configured without any abnormalities. Then, the matching between the temperature measuring point and the power output circuit is gradually confirmed through a stepped power-on mode, which eliminates problems such as the heating element burning out or the product temperature being abnormal due to excessive current applied to the power output circuit for too long.

[0025] 4. This invention only requires the operator to import the test configuration and the test will start automatically. No other operations are required after the entire test process, and the degree of automation is high. Attached Figure Description

[0026] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the testing method of the present invention.

[0027] Figure 2 This is a schematic diagram of the test system of the present invention.

[0028] Figure 3 This is a schematic diagram of the configuration file showing the correspondence between temperature measuring points and power output circuits in an embodiment of the present invention.

[0029] Figure 4 This is a schematic diagram of the thermal response parameter configuration file in an embodiment of the present invention. Detailed Implementation

[0030] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0031] like Figure 2 As shown, an automatic testing system for thermal response of spacecraft thermal tests includes: A power output device used to apply a test current to the power output circuit; Temperature data acquisition device, used to collect temperature data at various temperature measuring points; The testing software is used to perform the following operations: Obtain the preset configuration information and perform resistance value determination test on the current power output circuit; For the power output circuit that passes the resistance test, control the power output device to apply a test current and obtain the temperature of all measuring points from the temperature data acquisition device; Determine if there is a measurement point that meets the response condition. If so, determine if the power output circuit matches the response temperature measurement point, stop the power output, and proceed to test the next power output circuit. If not, increase the test current in steps until a temperature measurement point meets the response condition.

[0032] Example 1 An automatic testing system for thermal response of spacecraft thermal tests is disclosed. The testing system includes a power output device, a temperature data acquisition device, and testing software.

[0033] The power output device is used to apply external heat flow to each heating zone of the test product, and the temperature data acquisition device is used to collect the temperature of characteristic points of the test product. The test software needs to read the configuration file to obtain the matching requirements of the power output device and temperature measurement points in the test, the design resistance value RS of the power output circuit, and the maximum current I that the power output circuit can apply. MAX The expected temperature rise T at the correct measuring point after applying current. S The ratio of the stepped boost current to the maximum applicable current (n), and the longest power-on time (t) for each power output circuit. MAX Information such as; The test method is embedded within the test software.

[0034] like Figure 1 As shown, the test method is performed according to the following procedure: Step 1: The test software reads the configuration file to obtain the matching requirements of each power output device and temperature measuring point in the test, as well as the design resistance value R of the power output circuit. S The power output circuit can apply a maximum current I. MAXThe expected temperature rise T at the correct measuring point after applying current. S The ratio of the stepped boost current to the maximum applicable current (n), and the longest power-on time (t) for each power output circuit. MAX Information such as; Step 2: The test software controls the first power output circuit to apply a resistance test current I. R0 Read the voltage U of the power output device R Current value I R The actual resistance R of the output power circuit can be calculated, and then the actual resistance R is compared with the designed resistance R of the power output circuit. S To determine whether the resistance value reading test has been passed; In step 2, the resistance test current is taken as 0.1A and I. MAX The smaller of *1 / 2, the standard for passing the resistance reading test is 0.9*R. S ≤R≤1.1*R S ; Step 3: If the resistance value reading test fails, it can be determined that the power output circuit configuration is abnormal, and the next power output circuit test is performed; if the resistance value reading test passes, continue to perform the test according to steps 4-7. Step 4: The test software controls the first power output circuit to apply an initial test current I0, periodically acquires the temperature of all measuring points, and calculates the change in real-time temperature ΔT compared to when the initial test current was applied. In step 4, the initial test current I0 is typically set to I. MAX *1 / 2; Step 5: Within each temperature sampling period, find the measurement point with the maximum temperature rise. If the maximum temperature rise ΔT MAX ≥T S Then proceed to step 7 for further judgment. If ΔT MAX ≤T S Then proceed to the next temperature sampling cycle for another assessment; Step 6, when the duration is ΔT MAX ≤T S Furthermore, the energizing time t for a certain test current has exceeded the maximum energizing time t of the power output circuit. MAX Then, the test current I needs to be increased in steps from the initial test current, where the single increase current ΔI = n*I MAX ; Step 7: If the measuring point corresponding to the power output circuit in the test requirements is consistent with the measuring point with the maximum temperature rise, the thermal response test is deemed qualified, and the power output circuit status is set to completed. Then, proceed with the next power output circuit test according to steps 1-7. If the measuring point corresponding to the power output circuit in the test requirements is not completely consistent with the measuring point with the maximum temperature rise, it is necessary to determine whether the temperature rise is caused by the residual heat of the completed power output circuit, which leads to the continued rise of the corresponding measuring point. If the measuring point with the maximum temperature rise does not correspond to the completed power output circuit, the current output power circuit is deemed unqualified. If the measuring point with the maximum temperature rise corresponds to the completed power output circuit, repeat steps 4-7 until it can be determined as qualified or unqualified, and then start the next power output circuit test. Step 8: Before starting the next circuit test, the current output of the current power output circuit should be stopped. Each power output circuit can correspond to one or more temperature measurement points. Accordingly, in step 7 of the test method, the measurement points with the highest temperature rise must be completely consistent with the corresponding measurement points of the test power output circuit in order to be considered as qualified.

[0035] In one embodiment, the test system software should provide a test monitoring interface that fully displays the test process, test parameters, and test results. In one embodiment, the test system software should provide an automatic output stop function when the temperature exceeds the limit to prevent abnormalities such as excessively high product temperature caused by mismatch between the power output circuit and the actual design during the test. In one embodiment, the test system software should have a test record saving function to save the test process and data to a history file or database.

[0036] Example 2 like Figure 1 As shown, the thermal response configuration for the test was completed in advance according to the test requirements, including the correspondence between each power output device and temperature measuring point in the test, and the design resistance value R of the power output circuit. S The power output circuit can apply a maximum current I. MAX The expected temperature rise T at the correct measuring point after applying current. S The ratio of the stepped boost current to the maximum applicable current (n), and the longest power-on time (t) for each power output circuit. MAX Information such as power output devices and temperature measuring points should correspond to those used in actual tests; for example... Figure 3 and Figure 4 The diagram shows the configuration of the power output circuit and the measurement points, as well as the configuration of the thermal response parameters.

[0037] The specific steps are as follows: Step S1: The test software controls the first power output circuit to apply a resistance test current of 0.1A, reads the power output device voltage of 1.47V and the current value of 0.10A, calculates the actual resistance value of the output power output circuit to be 14.7Ω, compares it with the designed resistance value of 14.1Ω, and finds it to be within the range of [0.9*14.1, 1.1*14.1], and passes the resistance value interpretation test. Step S2: If the measured resistance value exceeds the range of [0.9*14.1, 1.1*14.1], the resistance value interpretation test is not passed, and it can be determined that the power output circuit configuration is abnormal. Then, the next power output circuit test is performed. Step S3: The test software controls the first power output circuit to apply an initial test current of 0.25A (i.e., half of the maximum applicable current: 0.5*1 / 2). Step S4: Timely acquire the temperature of all measuring points and calculate the change in real-time temperature compared to when the initial test current was applied. Assuming that the temperature of measuring point 1 increases by 0.7℃, measuring point 2 increases by 0.6℃, and the changes of the remaining measuring points are between -0.2℃ and 0.2℃, then the two measuring points with the largest temperature increases are both greater than 0.5℃, and it can be determined that there is a response at the measuring points. Step S5: If no measuring point rises more than 0.5℃ within 120s, increase the output current by 0.2 * 0.5 = 0.1A. Step S6: Temperature measurement point 1 rises by 0.7℃ and measurement point 2 rises by 0.6℃. If these two measurement points 1 and 2 correspond to the power output circuit in the test requirements, the thermal response test is deemed qualified. The state of power output circuit 1 is set to completed, the power output of circuit 1 is stopped, and the test of power output circuit 2 begins. If the two measuring points with the largest temperature rise are not measuring point 1 and measuring point 2, and no other circuits were powered before this power-on, it can be directly considered that the correspondence is incorrect and the thermal response is abnormal; if the measuring point with the temperature rise corresponds to the power circuit that has just completed heating, it can be considered that the residual heat of the power output circuit tested in the previous test caused the measuring point to continue to rise in temperature, and the test can be carried out again in the next temperature detection cycle. This invention utilizes resistance testing to first determine the correctness of the power output circuit itself, and then gradually confirms the matching between the temperature measuring point and the power output circuit through a stepped power-on response test. This invention can automatically complete the entire process of spacecraft thermal response testing, and also eliminates problems such as heating element burnout or abnormal product temperature caused by excessive current applied to the power output circuit for too long.

[0038] This invention also provides an automatic testing method for the thermal response of spacecraft thermal tests, comprising: Step S1: Obtain the preset configuration information and perform resistance value determination test on the current power output circuit; Step S2: Apply a test current to the power output circuit that has passed the test, and periodically obtain the temperature of all measuring points; Step S3: Determine if there is a measurement point that meets the response condition. If yes, determine if the power output circuit matches the response temperature measurement point and perform the test on the next power output circuit. If no, return to step S2 and gradually increase the test current until a temperature measurement point meets the response condition.

[0039] Those skilled in the art will understand that, besides implementing the system and its various devices, modules, and units provided by this invention in the form of purely computer-readable program code, the same functions can be achieved entirely through logical programming of the method steps, making the system and its various devices, modules, and units of this invention function in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers. Therefore, the system and its various devices, modules, and units provided by this invention can be considered as a hardware component, and the devices, modules, and units included therein for implementing various functions can also be considered as structures within the hardware component; alternatively, the devices, modules, and units for implementing various functions can be considered as both software modules implementing the method and structures within the hardware component.

[0040] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. An automatic testing method for the thermal response of a spacecraft, characterized in that, include: Step S1: Obtain the preset configuration information and perform resistance value determination test on the current power output circuit; Step S2: Apply a test current to the power output circuit that has passed the test, and periodically obtain the temperature of all measuring points; Step S3: Determine if there is a measurement point that meets the response condition. If yes, determine if the power output circuit matches the response temperature measurement point and perform the test on the next power output circuit. If no, return to step S2 and gradually increase the test current until a temperature measurement point meets the response condition. The configuration information includes the matching requirements of the power output device and temperature measurement point, and the design resistance value R of the power output circuit. S The power output circuit can apply a maximum current I. MAX The expected temperature rise at the correct measuring point after applying current, i.e., the response condition T. S The ratio of the stepped boost current to the maximum applicable current (n) and the longest power-on time (t) for each power output circuit. MAX ; Step S1 includes: Apply a resistance test current I to the current power output circuit. R0 Read the voltage U of the power output device R and current value I R The actual resistance R of the current power output circuit is calculated and compared with the designed resistance R of the power output circuit. S Compare the values ​​to determine if the resistance reading test is passed. Step S3 includes the following sub-steps: Step S3.1: Within each temperature sampling period, find the measurement point with the maximum temperature rise. If the maximum temperature rise ΔT MAX ≥T S Then proceed to step S3.3 for further judgment. If ΔT MAX ≤T S Then proceed to the next temperature sampling cycle for another assessment; Step S3.2: When ΔT MAX ≤T S The continuous power-on time t has exceeded the longest power-on time t of the power output circuit. MAX Then, the test current I is increased in steps, and the single increase current ΔI = n*I MAX ; Step S3.3: If the measuring point corresponding to the power output circuit is consistent with the measuring point with the maximum temperature rise, the thermal response test is deemed qualified, and the power output circuit status is set to completed, and the next power output circuit test is performed. If the measuring point corresponding to the power output circuit is not completely consistent with the measuring point of maximum temperature rise, it is determined whether the temperature rise is caused by the residual heat of the completed power output circuit causing the corresponding measuring point to continue to rise. If the measuring point of maximum temperature rise does not correspond to the completed power output circuit, the current output power circuit is determined to be unqualified. If the measuring point of maximum temperature rise corresponds to the completed power output circuit, steps S2-S3 are repeated until it can be determined to be qualified or unqualified, and then the next power output circuit test begins.

2. The automatic test method for thermal response of spacecraft thermal testing according to claim 1, characterized in that, The resistance test current is set to 0.1A and I. MAX The smaller value in *1 / 2, the standard for passing the resistance reading test is 0.9*R. S ≤R≤1.1*R S .

3. The automatic test method for thermal response of spacecraft thermal testing according to claim 1, characterized in that, Step S2 includes: Apply an initial test current I0 to the current power output circuit, periodically acquire the temperature of all measuring points, and calculate the change in real-time temperature ΔT compared to when the initial test current was applied.

4. The automatic test method for thermal response of spacecraft thermal testing according to claim 1, characterized in that, Each power output circuit corresponds to one or more temperature measurement points; the test is deemed qualified only when the measurement points with the highest temperature rise are completely consistent with the measurement points corresponding to the test power output circuit.

5. The automatic test method for thermal response of spacecraft thermal testing according to claim 1, characterized in that, After stopping the current output of the current power output circuit, begin testing the next circuit.

6. An automatic testing system for thermal response of spacecraft thermal testing, characterized in that, include: A power output device used to apply a test current to the power output circuit; Temperature data acquisition device, used to collect temperature data at various temperature measuring points; The testing software is used to perform the following operations: Obtain the preset configuration information and perform resistance value determination test on the current power output circuit; The configuration information includes the matching requirements of the power output device and temperature measurement point, and the design resistance value R of the power output circuit. S The power output circuit can apply a maximum current I. MAX The expected temperature rise at the correct measuring point after applying current, i.e., the response condition T. S The ratio of the stepped boost current to the maximum applicable current (n) and the longest power-on time (t) for each power output circuit. MAX ; Apply a resistance test current I to the current power output circuit. R0 Read the voltage U of the power output device R and current value I R The actual resistance R of the current power output circuit is calculated and compared with the designed resistance R of the power output circuit. S Compare the values ​​to determine if the resistance reading test is passed. For the power output circuit that passes the resistance test, control the power output device to apply a test current and obtain the temperature of all measuring points from the temperature data acquisition device; Determine whether the power output circuit and the measuring point temperature meet the matching conditions. If not, control the power output device to increase the test current in a stepwise manner and reacquire the measuring point temperature until the matching conditions are met. If yes, control the power output device to stop the current circuit output and start the test process of the next power output circuit. Within each temperature sampling period, find the measurement point with the maximum temperature rise. If the maximum temperature rise is ΔT... MAX ≥T S but Determine whether the measuring point corresponding to the power output circuit is consistent with the measuring point of maximum temperature rise; if ΔT MAX ≤T S Then proceed to the next temperature sampling cycle for another assessment; When ΔT MAX ≤T S The continuous power-on time t has exceeded the longest power-on time t of the power output circuit. MAX Then, the test current I is increased in steps, and the single increase current ΔI = n*I MAX ; If the measuring point corresponding to the power output circuit is the same as the measuring point with the maximum temperature rise, the thermal response test is deemed to be qualified, and the power output circuit status is set to completed, and the next power output circuit test is performed. If the measuring point corresponding to the power output circuit does not completely coincide with the measuring point of maximum temperature rise, determine whether the temperature rise is caused by residual heat from the completed power output circuit leading to a continued temperature increase at the corresponding measuring point. If the measuring point of maximum temperature rise does not correspond to a completed power output circuit, determine that the current output power circuit is unqualified. If the measuring point of maximum temperature rise corresponds to a completed power output circuit, repeat the following steps until a pass or fail determination can be made, then begin testing the next power output circuit: For the power output circuit that passes the resistance test, control the power output device to apply a test current and obtain the temperature of all measuring points from the temperature data acquisition device; Determine whether the power output circuit and the measuring point temperature meet the matching conditions. If not, control the power output device to increase the test current in steps and reacquire the measuring point temperature until the matching conditions are met. If yes, control the power output device to stop the current circuit output and start the test process of the next power output circuit.

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