Circuit module

By setting power supply circuits and functional units on the first die in the high-frequency communication module, and connecting the second die using power wiring and control circuits, the problem of increasing die circuit size is solved, circuit size is suppressed and signal lines are reduced, thereby improving the compatibility and testing efficiency of the communication module.

CN121433474APending Publication Date: 2026-01-30MURATA MFG CO LTD
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Patent Information

Application Number
CN202511037242.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-07-29
Filing Date
2025-07-28
Publication Date
2026-01-30

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Abstract

A circuit module is provided. A power supply circuit and a first functional portion are formed on the first die. A first slave circuit formed on a first die sets information specifying a power mode of a first functional unit to a first power mode setting register. A second functional portion and a second slave circuit are formed on the second die. A second sub-slave circuit formed on the first die sets information specifying the power mode of the second functional unit to a second power mode setting sub-register. A first power supply wiring for supplying power from the power supply circuit to the first functional part is formed on the first die. The second power supply wiring connects the first die and the second die and supplies power from the power supply circuit to the second functional part. The power modes of the first function unit and the second function unit include an active mode and a low power mode, and the power supply control circuit operates the power supply circuit when at least one of the first power mode setting register and the second power mode setting sub-register is set to the active mode.
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Citation Information

Patent Citations

  • Circuits, devices, and methods for monitoring a serial bus

    US20160242057A1