Warpage-resistant cpu socket based on stress-buffering fluorosilicone rubber layer

Abstract

This invention discloses an anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer. It includes an insulating base and a plurality of terminals mounted on the insulating base. A fluorosilicone rubber layer is fixed to the bottom surface of the insulating base. The insulating base contacts the PCB board through the fluorosilicone rubber layer. After the insulating base and PCB board are fixedly connected, the fluorosilicone rubber layer is compressed and deformed to form a gapless, close fit with the PCB board. This results in a smoother fit between the bottom surface of the CPU socket and the PCB board, preventing poor soldering or contact between the terminals and the PCB board, ensuring conductivity quality. Furthermore, it largely prevents warping of the CPU socket after soldering, thus preventing the CPU socket from detaching from the PCB board later. It also prevents the terminals from separating from the PCB board after elastic contact due to warping, ensuring product quality.

Description

Technical Field

[0001] This invention relates to the field of CPU socket technology, and specifically to an anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer. Background Technology

[0002] The Central Processing Unit (CPU) is the core of a computer system for computation and control, and is the final execution unit for information processing and program execution. Since its inception, the CPU has made tremendous progress in logical structure, operating efficiency, and functional extension.

[0003] In practical applications, CPU chips are typically mounted on the motherboard via a CPU socket to establish electrical conductivity. Chinese invention patent application CN112397921A discloses a CPU socket connector, which includes an insulating body and a plurality of conductive terminals disposed on the insulating body. The conductive terminals include a plurality of first terminals with a first spacing and a plurality of second terminals with a second spacing. The first and second spacings are different, and by employing at least two different spacing arrangements, the layout of the conductive terminals becomes more rational and balanced. In actual assembly, the insulating body is mounted on a PCB board, and the conductive terminals are all soldered and fixed to the PCB board, establishing electrical conductivity.

[0004] However, the aforementioned CPU socket connector has some shortcomings: the insulating body is basically inelastic, and when the lower end face of the CPU socket connector comes into contact with the PCB board, there is a high probability that a large gap will appear due to insufficient flatness between the two, which may lead to warping of the CPU socket connector in the later stage, resulting in poor soldering or solder joint detachment between the CPU socket connector and the PCB board, affecting product quality.

[0005] In view of the above, the inventors propose the following technical solution. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide an anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer.

[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: an anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer includes an insulating base for assembly with a PCB board and a plurality of terminals mounted on the insulating base for connecting the PCB board and the CPU chip. The bottom surface of the insulating base is also fixed with a fluorosilicone rubber layer. The insulating base contacts the PCB board through the fluorosilicone rubber layer. After the insulating base is fixedly connected to the PCB board, the fluorosilicone rubber layer is squeezed and deformed to form a close and gapless contact with the PCB board.

[0008] Furthermore, in the above technical solution, the fluorosilicone rubber layer is fixedly connected to the fluorosilicone rubber layer through a hot pressing process, an ultrasonic process, a secondary bonding process, a two-color injection molding process, or a secondary injection molding process.

[0009] Furthermore, in the above technical solution, the insulating base is integrally molded using LCP material, and the fluorosilicone rubber layer is fixed to the lower end of the insulating base through a secondary injection molding process to form an inseparable whole; wherein, the bottom surface of the already formed insulating base is subjected to instantaneous plasma treatment to increase the surface energy and the chemical bonding ability between the insulating base and the fluorosilicone rubber.

[0010] Furthermore, in the above technical solution, when using a mold for secondary injection molding of the fluorosilicone rubber layer, the mold containing the insulating base is locally and precisely cooled so that the temperature of the area where the mold contacts the insulating base is maintained at 120-140℃, while the cavity area in contact with the fluorosilicone rubber material is heated to 150-185℃ to form the fluorosilicone rubber layer on the bottom surface of the insulating base. The fluorosilicone rubber material also contains a silane coupling agent.

[0011] Furthermore, in the above technical solution, the bottom surface of the insulating base is also formed with a plurality of blind holes, and the fluorosilicone rubber layer is partially integrated into the blind holes and forms a connecting post connected to the blind holes. The connecting post and the blind holes are combined to form an interlocking structure.

[0012] Furthermore, in the above technical solution, the periphery of the lower end face of the fluorosilicone rubber layer is a stress concentration area, and this area is formed with a plurality of spaced and downwardly protruding bumps. These bumps contact the PCB board and are squeezed and deformed, and some of the bumps are orthogonally projected onto the connecting posts.

[0013] Furthermore, in the above technical solution, the terminal includes a main body fixed in an insulating base, a first elastic arm and a second elastic arm integrally formed on the upper end of the main body and spaced apart and curved, a first connecting arm integrally connected to the upper ends of the first elastic arm and the second elastic arm, a first arc-shaped contact portion bent and formed on the upper end of the first connecting arm and raised upward, a third elastic arm and a fourth elastic arm integrally formed on the lower end of the main body and spaced apart and curved, a second connecting arm integrally connected to the lower ends of the third elastic arm and the fourth elastic arm, and a second arc-shaped contact portion bent and formed on the upper end of the second connecting arm and raised downward. The first arc-shaped contact portion and the second arc-shaped contact portion extend out of the upper end surface of the insulating base and the lower end surface of the fluorosilicone rubber layer, respectively, to contact the contacts of the CPU chip and the contacts of the PCB board, so that the CPU chip and the PCB board are connected.

[0014] Furthermore, in the above technical solution, the terminal includes a main body fixed in an insulating base, a first elastic arm and a second elastic arm integrally formed on the upper end of the main body and spaced apart and curved, a first connecting arm integrally connected to the upper ends of the first elastic arm and the second elastic arm, a first arc-shaped contact portion bent and formed on the upper end of the first connecting arm and raised upward, a solder foot integrally formed on the lower end of the main body, and a solder ball disposed on the lower end of the solder foot. The first arc-shaped contact portion extends into the mounting groove on the upper end surface of the insulating base and contacts the contacts of the CPU chip installed in the mounting groove. The solder ball protrudes out of the lower end surface of the fluorosilicone rubber layer to contact and weld to the pads of the PCB board, so that the CPU chip and the PCB board are electrically connected.

[0015] Furthermore, in the above technical solution, an upper support frame and a lower support frame are fixedly installed on the upper and lower end faces of the PCB board by screws or rivets. The upper and lower support frames are in contact with the upper and lower end faces of the PCB board by upper and lower washers, respectively. The insulating base is installed in the mounting position of the upper support frame. The upper support frame is provided with several support springs and several guide rods. The heat sink is sleeved on the guide rods through its guide holes, and the middle part of the lower end face of the heat sink is in contact with the upper end face of the CPU chip. The outer periphery of the lower end face of the heat sink is in contact with the support springs. The heat sink and the upper support frame are fastened by adjusting screws, and the support springs are compressed to form elastic support for the heat sink, so as to adjust the flatness of the middle part of the lower end face of the heat sink in contact with the CPU chip. The CPU chip is pressed down by the heat sink to form a stable connection with the terminal.

[0016] Furthermore, in the above technical solution, the lower end of the insulating base is also formed with several positioning posts, and the fluorosilicone rubber layer also wraps the outer surface of the positioning posts to form a wrapping post layer. Several limiting ribs are also formed on the outside of the wrapping post layer. The PCB board is provided with positioning holes, and the positioning posts and the wrapping post layer wrapped around them are embedded in the positioning holes.

[0017] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: The present invention adds a layer of fluorosilicone rubber to the bottom surface of the insulating base. The fluorosilicone rubber layer has good elasticity. When the CPU socket is assembled with the PCB board, it is installed by the fluorosilicone rubber layer adhering to the PCB board. After the insulating base is fixed on the PCB board, the fluorosilicone rubber layer will be squeezed and deformed to form a gapless contact with the PCB board, so that the bottom surface of the CPU socket and the PCB board are more flat. There will be no phenomenon of poor soldering or poor contact between the terminals in the CPU socket and the PCB board, ensuring the conductivity quality. After soldering, the CPU socket will basically not warp later, resulting in the phenomenon of the CPU socket and the solder joints of the CPU socket separating. Or, there will be no limitation that the terminals in the CPU socket and the PCB board will separate due to the warping of the CPU socket later after elastic contact, thus ensuring product quality. Attached Figure Description

[0018] Figure 1 This is an assembly structure diagram of the present invention; Figure 2 This is an assembly structure diagram from another perspective of the present invention; Figure 3 This is an exploded perspective view of the present invention; Figure 4 This is an assembly diagram of the insulating base and the CPU chip in this invention; Figure 5 This is a perspective view of the present invention; Figure 6 This is a perspective view of the invention from another angle; Figure 7 This is a partial sectional view of the present invention; Figure 8 This is a three-dimensional view (partial) of the fluorosilicone rubber layer in this invention; Figure 9 This is a perspective view (partial) of the fluorosilicone rubber layer in this invention from another angle. Figure 10 This is a perspective view of the terminal in this invention; Figure 11 This is a perspective view of the terminal in this invention from another angle; Figure 12 This is a perspective view of another structure of the present invention; Figure 13 This is a perspective view of the terminal in another structure of the present invention. Detailed Implementation

[0019] The present invention will be further described below with reference to specific embodiments and accompanying drawings.

[0020] See Figure 1-13As shown, this is an anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer. It's worth noting that to avoid overly dense lines, in... Figure 3 , Figure 5 , Figure 6 , Figure 8 , Figure 9 , Figure 12 The drawings only show some of the terminals. In the actual product, the insulating base 1 is provided with a plurality of terminals 2 arranged in an array. The number and position of the terminals 2 correspond one-to-one with the contacts of the CPU chip.

[0021] This invention relates to an anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer, comprising an insulating base 1 for assembly with a PCB board 4 and a plurality of terminals 2 mounted on the insulating base 1 for conducting the connection between the PCB board 4 and the CPU chip 5. In practical use, the insulating base 1 is mounted on the PCB board 4, and the terminals 2 within the insulating base 1 are connected to the PCB board 4; then the CPU chip 5 is mounted on the insulating base 1, and the terminals 2 are connected to the CPU chip 5, thereby achieving the connection between the CPU chip 5 and the PCB board 4. This is a conventional CPU socket structure and usage method.

[0022] To improve the anti-warping capability of the CPU socket, the present invention makes the following improvements: a layer of fluorosilicone rubber 3 is also fixed on the bottom surface of the insulating base 1. The insulating base 1 contacts the PCB board 4 through the fluorosilicone rubber layer 3. After the insulating base 1 and the PCB board 4 are fixedly connected, the fluorosilicone rubber layer 3 is squeezed and deformed to form a close and gapless contact with the PCB board 4.

[0023] In other words, the present invention adds a layer of fluorosilicone rubber 3 to the bottom surface of the insulating base 1. The fluorosilicone rubber layer 3 has good elasticity. When the CPU socket is assembled with the PCB board 4, it is installed by the fluorosilicone rubber layer 3 adhering to the PCB board 4. After the insulating base 1 is fixed on the PCB board 4, the fluorosilicone rubber layer 3 will be squeezed and deformed to form a gapless contact with the PCB board 4. This makes the bottom surface of the CPU socket and the PCB board 4 more flat, and there will be no phenomenon of poor soldering or poor contact between the terminals in the CPU socket and the PCB board, which ensures the conductivity quality. Moreover, after soldering, it will basically not cause the CPU socket to warp later and the solder joints of the CPU socket to detach from the PCB board. Or, it will not cause the terminals in the CPU socket to separate from the PCB board due to warping of the CPU socket after elastic contact with the PCB board, thus ensuring product quality.

[0024] The fluorosilicone rubber layer 3 is fixedly connected to the fluorosilicone rubber layer 3 by hot pressing, ultrasonic process, secondary bonding process, two-color injection molding process, or secondary injection molding process.

[0025] In this embodiment, the fluorosilicone rubber layer 3 is fixedly molded to the lower end of the insulating base 1 through a secondary injection molding process. Specifically, the insulating base 1 is integrally molded from LCP material, and the fluorosilicone rubber layer 3 is fixedly molded to the lower end of the insulating base 1 through a secondary injection molding process to form an inseparable whole, which has good bonding force, stable structure and is not easy to crack or separate.

[0026] In this process, the bottom surface of the already formed insulating base 1 is subjected to instantaneous plasma treatment (treatment time less than 1 second) to increase the surface energy and chemical bonding ability between the insulating base 1 and the fluorosilicone rubber, thereby improving the structural stability of the two and forming a whole that is not easy to crack or separate.

[0027] When using a mold for secondary injection molding of the fluorosilicone rubber layer 3, the mold containing the insulating base 1 is locally and precisely cooled to keep the temperature of the area where the mold contacts the insulating base 1 at 120-140℃, while the cavity area in contact with the fluorosilicone rubber material is heated to 150-185℃ to form the fluorosilicone rubber layer 3 on the bottom surface of the insulating base 1. This temperature field design ensures that the fluorosilicone rubber material can be fully vulcanized, while avoiding changes in crystallinity or deformation of the insulating base 1 made of LCP material due to excessive heating, thus ensuring the dimensional accuracy and reliability of the product.

[0028] The fluorosilicone rubber material also contains a silane coupling agent. The silane coupling agent is crucial to the success of the composite material; without it, the bonding between the LCP material and the fluorosilicone rubber is poor, and they are prone to delamination. With the addition of the silane coupling agent, one end of the molecule can bond with the fluorosilicone rubber, while the other end can form a physicochemical adsorption with the solder resist layer of the PCB board, moderately improving interfacial adhesion and preventing micro-slippage during thermal cycling, while simultaneously maintaining vertical buffering capacity.

[0029] In this embodiment, the fluorosilicone rubber material comprises 70%~85% fluorosilicone rubber, 3%~6% silane coupling agent, and 10%~20% thermally conductive and insulating filler. Specifically, the formulation is: 80% fluorosilicone rubber, 5% silane coupling agent, and 15% thermally conductive and insulating filler, wherein the thermally conductive and insulating filler is boron nitride or aluminum oxide, and the percentages are by mass. In other words, the fluorosilicone rubber layer 3 contains thermally conductive and insulating filler, thus possessing both insulating and thermally conductive capabilities. The function of the fluorosilicone rubber layer 3 is not only to buffer stress and improve the CPU's anti-warping ability, but also to construct an auxiliary channel for heat diffusion from the CPU socket to the PCB board, reducing local thermal gradients and fundamentally reducing the thermal stress that causes warping. The fluorosilicone rubber layer 3 added as a stress buffer layer in this invention is also endowed with synergistic thermal management functions. This "two-in-one" design solves two problems of different natures (mechanical stress and thermal stress), producing a synergistic effect and achieving unexpected technical results.

[0030] In terms of structure, in order to improve the bonding ability between the fluorosilicone rubber layer 3 and the insulating base 1 and prevent the two from cracking and separating, the following improvements are made: the bottom surface of the insulating base 1 is also formed with a plurality of blind holes 11, the fluorosilicone rubber layer 3 is partially integrated into the blind holes 11 and forms a connecting post 31 connected to the blind holes 11. The connecting post 31 and the blind holes 11 are combined to form an interlocking structure, which greatly enhances the interfacial bonding force between the fluorosilicone rubber layer 3 and the insulating base 1, prevents interlayer peeling, and improves product quality and service life.

[0031] Furthermore, in some embodiments, the lower end face of the fluorosilicone rubber layer 3 is flat and is in contact with the PCB board 4. In other embodiments, the lower end face of the fluorosilicone rubber layer 3 is a simple flat surface with a non-uniform pattern design. Specifically, the lower end face of the fluorosilicone rubber layer 3 has a stress concentration area around it (especially at the diagonal), and this area is formed with a plurality of spaced and downwardly protruding bumps 32. These bumps 32 contact the PCB board 4 and are squeezed and deformed. Because the area of ​​the bumps 32 is small, they are easily deformed. Even if a gap is formed between the lower end face of the fluorosilicone rubber layer 3 and the surface of the PCB board 4, the easily deformable bumps 32 will make initial contact. After the CPU socket is fixed to the PCB board 4, the bumps 32 are easily squeezed and deformed after contact with the PCB board 4. This makes it easier to form a gapless bond after the lower end face of the fluorosilicone rubber layer 3 is bonded to the surface of the PCB board 4. In addition, a raised bump 32 was added. Since the raised bump 32 contacts the PCB board 4 first, it can better remove the air between the lower end face of the fluorosilicone rubber layer 3 and the surface of the PCB board 4, avoiding air residue that could cause bulging or other defects that are prone to warping.

[0032] The lower end face of the fluorosilicone rubber layer 3 also has a raised bump at its center, which can provide support. Furthermore, after the lower end face of the fluorosilicone rubber layer 3 is bonded to the surface of the PCB board 4, it is easier to form a gapless bond.

[0033] The non-stress-concentrated areas on the lower end face of the fluorosilicone rubber layer 3 do not form convex bumps, which reduces the difficulty of mold design and the cost of mold opening.

[0034] Some of the protrusions 32 are orthogonally projected onto the connecting post 31, and the connecting post 31 can improve the support capacity of the protrusions 32.

[0035] In some embodiments, the terminal 2 is electrically connected to the CPU chip 5 and the PCB board 4 by means of elastic pressing.

[0036] Specifically, combined Figure 7-9As shown, the terminal 2 includes a main body 21 that is inserted and fixed in the insulating base 1, a first elastic arm 22 and a second elastic arm 23 integrally formed on the upper end of the main body 21 and spaced apart and curved, a first connecting arm 24 integrally connected to the upper ends of the first elastic arm 22 and the second elastic arm 23, a first arc-shaped contact portion 25 bent and formed on the upper end of the first connecting arm 24 and raised upward, a third elastic arm 26 and a fourth elastic arm 27 integrally formed on the lower end of the main body 21 and spaced apart and curved, a second connecting arm 28 integrally connected to the lower ends of the third elastic arm 26 and the fourth elastic arm 27, and a second arc-shaped contact portion 29 bent and formed on the upper end of the second connecting arm 28 and raised downward. The first arc-shaped contact portion 25 and the second arc-shaped contact portion 29 extend out of the upper end surface of the insulating base 1 and the lower end surface of the fluorosilicone rubber layer 3, respectively, to contact the contacts of the CPU chip 5 and the PCB board 4, so that the CPU chip 5 and the PCB board 4 are connected. The lower end face of the fluorosilicone rubber layer 3 is provided with a window for the second arc-shaped contact part 29 to extend out.

[0037] The first arc-shaped contact portion 25 is elastically supported by two elastic arms (i.e., the first elastic arm 22 and the second elastic arm 23), which have a large elastic capacity. The first elastic arm 22 and the second elastic arm 23 are symmetrically distributed between the center line connecting the first connecting arm 24 and the main body 21, which can provide stable and correct elastic support for the first arc-shaped contact portion 25. As a result, the contact between the first arc-shaped contact portion 25 and the CPU chip 5 will form a smoother elastic connection and will not cause defects such as flipping. Similarly, the second arc-shaped contact portion 29 is elastically supported by two elastic arms (i.e., the third elastic arm 26 and the fourth elastic arm 27), which have a large elastic capacity. The third elastic arm 26 and the fourth elastic arm 27 are symmetrically distributed between the center line connecting the second connecting arm 28 and the main body 21, which can provide stable and correct elastic support for the second arc-shaped contact portion 29. As a result, the contact between the second arc-shaped contact portion 29 and the PCB board will form a smoother elastic connection and will not cause defects such as flipping.

[0038] The upper and lower support frames 61 and 62 are fixedly mounted on the upper and lower end faces of the PCB board 4 by screws or rivets. The upper support frame 61 and the lower support frame 62 are in contact with the upper and lower end faces of the PCB board 4 by upper shims 611 and lower shims 621, respectively. The insulating base 1 is installed in the mounting position 612 of the upper support frame 61. The upper support frame 61 is provided with a plurality of support springs 63 and a plurality of guide rods 64. The heat sink 7 is sleeved on the guide rods 64 through its guide holes 71. The middle part of the lower end face of the heat sink 7 is in contact with the upper end face of the CPU chip 5. The outer periphery of the lower end face of the heat sink 7 is in contact with the support springs 63. The heat sink 7 and the upper support frame 61 are fastened by adjusting screws 72. The support springs 63 are compressed to form elastic support for the heat sink 7, so as to adjust the flatness of the middle part of the lower end face of the heat sink 7 in contact with the CPU chip 5. The CPU chip 5 is pressed down by the heat sink 7 to form a stable connection with the terminal 2.

[0039] In some embodiments, the terminal 2 and the CPU chip 5 are electrically connected by elastic pressing, while the terminal 2 and the PCB board 4 are electrically connected by welding.

[0040] Specifically, combined Figure 12-13 As shown, the terminal 2 includes a main body 21 inserted and fixed in the insulating base 1, a first elastic arm 22 and a second elastic arm 23 integrally formed on the upper end of the main body 21 and spaced apart and curved, a first connecting arm 24 integrally connected to the upper ends of the first elastic arm 22 and the second elastic arm 23, a first arc-shaped contact portion 25 bent and raised on the upper end of the first connecting arm 24, a solder foot 20 integrally formed on the lower end of the main body 21, and a solder ball 201 disposed on the lower end of the solder foot 20. The first arc-shaped contact portion 25 extends into the mounting groove 12 on the upper end surface of the insulating base 1 and contacts the contacts of the CPU chip 5 installed in the mounting groove 12. The solder ball 201 protrudes from the lower end surface of the fluorosilicone rubber layer 3 to contact and solder to the pads of the PCB board 4, so that the CPU chip 5 and the PCB board 4 are electrically connected. The lower end surface of the fluorosilicone rubber layer 3 is provided with a window for the solder ball 201 to protrude. The first arc-shaped contact portion 25 is elastically supported by two elastic arms (i.e., the first elastic arm 22 and the second elastic arm 23), which has a large elastic capacity. The first elastic arm 22 and the second elastic arm 23 are symmetrically distributed between the center line connecting the first connecting arm 24 and the main body portion 21. This provides stable and correct elastic support for the first arc-shaped contact portion 25, so that the contact between the first arc-shaped contact portion 25 and the CPU chip 5 can form a more stable elastic connection in the later stage, and there will be no adverse phenomena such as flipping.

[0041] The solder pad 20 is also stamped with a spherical groove (not shown in the figure). The lower end of the solder ball 201 contacts and is fixedly connected to the edge of the opening of the spherical groove. The contact is circular, which increases the contact area and makes the solder ball 201 more stably installed on the solder pad 20. At this time, there is a gap between the solder ball 201 and the spherical groove. When the CPU socket contacts and is fixedly soldered to the pads on the PCB board later, the solder ball 201 is partially integrated into the spherical groove, thereby increasing the soldering area between the solder ball 201 and the solder pad 20, and making the solder pad 20 and the pad on the PCB board form a more stable connection. To ensure a more stable connection, a groove can be provided on the other side of the board opposite to the spherical groove of the solder foot 20. Since the size of the solder ball 201 is larger than that of the solder foot 20, the solder ball 201 will cover the other side of the board opposite to the spherical groove of the solder foot 20 after it melts and enters the groove. When the solder ball 201 cools and solidifies, some solder will solidify in the groove to form a locking structure, which can ensure a more stable connection between the solder foot 20 and the pad on the PCB board.

[0042] The lower end of the insulating base 1 is also formed with several positioning posts 14. The fluorosilicone rubber layer 3 also wraps around the outer surface of the positioning posts to form a wrapping post layer (not shown in the figure). Several limiting ribs are also formed on the outside of the wrapping post layer. The PCB board 4 is provided with positioning holes 41. The positioning posts and the wrapping post layer 33 wrapped around them are embedded in the positioning holes 41, so that the insulating base 1 is stably installed on the PCB board 4, which facilitates subsequent soldering and fixing. Among them, when the positioning posts and the wrapping post layer wrapped around them are embedded in the positioning holes 41, the wrapping post layer has good elasticity, so it can play a good tensioning role, making its assembly structure more stable.

[0043] In summary, this invention adds a layer of fluorosilicone rubber 3 to the bottom surface of the insulating base 1. This fluorosilicone rubber layer 3 has good elasticity. When the CPU socket is assembled with the PCB board 4, it is installed by the fluorosilicone rubber layer 3 adhering to the PCB board 4. After the insulating base 1 is fixed on the PCB board 4, the fluorosilicone rubber layer 3 will be squeezed and deformed to form a gapless contact with the PCB board 4. This results in a smoother fit between the bottom surface of the CPU socket and the PCB board 4, preventing the occurrence of poor soldering or contact between the terminals in the CPU socket and the PCB board, ensuring conductivity quality. Furthermore, after soldering, it will not cause the CPU socket to warp later, resulting in the CPU socket detaching from the PCB board solder joints. Alternatively, it will not prevent the terminals in the CPU socket from separating from the PCB board after elastic contact due to warping of the CPU socket later, thus ensuring product quality.

[0044] Of course, the above description is only a specific embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent changes or modifications made to the structure, features and principles described in the claims of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A stress-relief fluorosilicone rubber layer-based anti-warping CPU socket, comprising an insulating base (1) for mounting to a PCB board (4) and a plurality of terminals (2) mounted on the insulating base (1) for conducting the PCB board (4) and the CPU chip (5), characterized in that: The bottom surface of the insulating base (1) is also fixed with a layer of fluorosilicone rubber (3). The insulating base (1) contacts the PCB board (4) through the fluorosilicone rubber layer (3). After the insulating base (1) and the PCB board (4) are fixedly connected, the fluorosilicone rubber layer (3) is squeezed and deformed to form a close and gapless contact with the PCB board (4). The insulating base (1) is integrally formed using LCP material. The fluorosilicone rubber layer (3) is fixedly formed at the lower end of the insulating base (1) through a secondary injection molding process to form an inseparable whole. The bottom surface of the already formed insulating base (1) is subjected to instantaneous plasma treatment to increase surface energy and improve the chemical bonding ability between the insulating base (1) and the fluorosilicone rubber. The bottom surface of the insulating base (1) is also formed with a plurality of blind holes (11). The fluorosilicone rubber layer (3) is partially integrated into the blind holes (11) and forms a connecting post (31) connected to the blind holes (11). The connecting post (31) is combined with the blind holes (11) to form an interlocking structure. The lower end face of the fluorosilicone rubber layer (3) is a stress concentration area, and a plurality of convex bumps (32) are formed in this area. The convex bumps (32) are in contact with the PCB board (4) and are squeezed and deformed. Some of the convex bumps (32) are orthogonally projected to the connecting post (31).

2. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to claim 1, characterized in that: When using a mold to perform secondary injection molding of the fluorosilicone rubber layer (3), the mold containing the insulating base (1) is locally and precisely cooled so that the temperature of the area where the mold contacts the insulating base (1) is kept at 120-140°C, while the temperature of the cavity area in contact with the fluorosilicone rubber material is raised to 150-185°C so as to form the fluorosilicone rubber layer (3) on the bottom surface of the insulating base (1). The fluorosilicone rubber material also contains a silane coupling agent.

3. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to any one of claims 1-2, characterized in that: The terminal (2) includes a main body (21) inserted and fixed in an insulating base (1), a first elastic arm (22) and a second elastic arm (23) integrally formed on the upper end of the main body (21) and spaced apart and curved, a first connecting arm (24) integrally connected to the upper ends of the first elastic arm (22) and the second elastic arm (23), a first arc-shaped contact portion (25) bent and formed on the upper end of the first connecting arm (24) and raised upward, and a third elastic arm (26) integrally formed on the lower end of the main body (21) and spaced apart and curved. The fourth elastic arm (27), the second connecting arm (28) integrally connected to the lower end of the third elastic arm (26) and the fourth elastic arm (27), and the second arc-shaped contact part (29) bent and formed on the upper end of the second connecting arm (28) and raised downward, the first arc-shaped contact part (25) and the second arc-shaped contact part (29) extend out of the upper end surface of the insulating base (1) and the lower end surface of the fluorosilicone rubber layer (3) respectively, so as to contact the contacts of the CPU chip (5) and the contacts of the PCB board (4) respectively, so that the CPU chip (5) and the PCB board (4) are connected.

4. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to any one of claims 1-2, characterized in that: The terminal (2) includes a main body (21) inserted and fixed in the insulating base (1), a first elastic arm (22) and a second elastic arm (23) integrally formed on the upper end of the main body (21) and spaced apart and curved, a first connecting arm (24) integrally connected to the upper end of the first elastic arm (22) and the second elastic arm (23), a first arc-shaped contact part (25) bent and formed on the upper end of the first connecting arm (24) and raised upward, a solder foot (20) integrally formed on the lower end of the main body (21), and a solder ball (201) disposed on the lower end of the solder foot (20). The first arc-shaped contact part (25) extends into the mounting groove (12) on the upper end surface of the insulating base (1) and contacts the contacts of the CPU chip (5) installed in the mounting groove (12). The solder ball (201) protrudes out of the lower end surface of the fluorosilicone rubber layer (3) to contact and weld to the pads of the PCB board (4), so that the CPU chip (5) and the PCB board (4) are connected.

5. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to any one of claims 1-2, characterized in that: The upper and lower support frames (61 and 62) are fixedly installed on the upper and lower end faces of the PCB board (4) by screws or rivets. The upper support frame (61) and the lower support frame (62) are in contact with the upper and lower end faces of the PCB board (4) by upper gaskets (611) and lower gaskets (621), respectively. The insulating base (1) is installed in the mounting position (612) of the upper support frame (61). The upper support frame (61) is provided with a number of support springs (63) and a number of guide rods (64). The heat sink (7) is sleeved on the guide rod through its guide hole (71). The heat sink (7) is placed on the rod (64), and the middle part of the lower end face of the heat sink (7) contacts the upper end face of the CPU chip (5). The outer periphery of the lower end face of the heat sink (7) contacts the support spring (63). The heat sink (7) is fastened to the upper support frame (61) by adjusting screws (72). The support spring (63) is compressed to form elastic support for the heat sink (7) to adjust the flatness of the middle part of the lower end face of the heat sink (7) in contact with the CPU chip (5). The CPU chip (5) is pressed down by the heat sink (7) to form a stable connection with the terminal (2).

6. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to any one of claims 1-2, characterized in that: The lower end of the insulating base (1) is also formed with a number of positioning posts (14), and the fluorosilicone rubber layer (3) also wraps the outer surface of the positioning posts to form a wrapping post layer. The wrapping post layer is also formed with a number of limiting ribs. The PCB board (4) is provided with a positioning hole (41), and the positioning post and the wrapping post layer wrapped around it are embedded in the positioning hole (41).

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