低温热固化型树脂组合物
By forming a protective layer on the metal electrode using a low-temperature thermosetting resin composition, the problems of oxide film formation and organic film cracking are solved, achieving the effects of inhibiting oxidation reaction and improving flexibility at low temperatures.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI WINSCENE TECH CO LTD
- Filing Date
- 2025-11-12
- Publication Date
- 2026-07-17
AI Technical Summary
In the prior art, the formation of an oxide film on a flexible substrate by a metal electrode leads to increased resistance and damage. Furthermore, existing organic films are prone to cracking when cured at low temperatures, failing to effectively suppress oxidation reactions and improve flexibility.
A low-temperature thermosetting resin composition comprising epoxy acrylate resin, thermosetting agent, curing accelerator and solvent is used to form a protective layer covering the metal electrode by curing at a lower temperature, thereby inhibiting oxidation reaction and improving flexibility.
After curing at low temperatures, the resin composition can effectively inhibit the oxidation of metal electrodes, improve moisture resistance and chemical resistance, while maintaining flexibility and preventing the formation of organic film cracks.
Smart Images
Figure CN121471487B_ABST