A device for processing circuit pads on thick copper PCB boards

Abstract

This invention discloses a circuit pad processing device for thick copper PCB boards, relating to the field of printed circuit technology. The device includes a stretching mechanism and a main electroplating tank. The stretching mechanism is symmetrically distributed on both sides of the main electroplating tank and is movably connected to the main electroplating tank via a support hinge. The main electroplating tank contains a placement rack and a partition, which divides the interior of the main electroplating tank into at least two independent processing chambers. A power end is connected to the top of the placement rack, and the output end of the power end is connected to a clamping component via a transmission rod. The clamping component is used to fix the thick copper PCB board. A first extension mechanism, a second extension mechanism, a third extension mechanism, and a fourth extension mechanism are sequentially connected to the outer wall of the main electroplating tank. Each extension mechanism is used to expand the processing range and functional adaptability of the main electroplating tank.

Description

Technical Field

[0001] This invention relates to the field of printed circuit technology, specifically to a device for processing circuit pads on thick copper PCB boards. Background Technology

[0002] Thick copper PCB is a special type of PCB that uses a special process to increase the thickness of the copper foil or the area of ​​the copper layer on the basis of traditional printed circuit boards (PCBs) to enhance current carrying capacity, heat dissipation performance and structural stability. It is essentially a "functionally enhanced version" of PCB. The core difference is that the copper layer thickness is much greater than that of ordinary PCBs. It mainly serves high-power, high-current electronic equipment scenarios.

[0003] In the processing of PCB thick copper board circuit pads, unstable support structure of the device can cause shaking during processing, resulting in pad accuracy deviation and affecting product qualification rate. A single processing chamber cannot process multiple workpieces simultaneously, extending the processing cycle and reducing production efficiency. Devices with fixed processing range and single function cannot meet the processing needs of pads of different depths, thicknesses and sizes, limiting the expansion of processing scenarios. Therefore, PCB thick copper board circuit pad processing device must have high stability, high adaptability and strong functional expandability.

[0004] Existing technologies address the aforementioned issues primarily by increasing processing stations, improving clamping structures, and adding simple extension components. However, the support structures often employ a single linkage design, resulting in insufficient stability during tension and a tendency to sway, affecting pad accuracy. Furthermore, the main slot angle and position adjustment lack flexibility. The processing chambers are poorly partitioned, leading to mutual interference when multiple workpieces are processed simultaneously. The height adjustment of the placement rack lacks a reliable locking mechanism, making it difficult to accurately adapt to pad processing of different depths. Clamping components are mostly rigid designs, easily damaging the copper plate surface and offering inconvenient tightness adjustment. They also have limited adaptability to copper plates of different thicknesses. External extension mechanisms are functionally limited, often only enabling expansion in a single direction, and lack precise control and stable locking structures, making it difficult to meet the processing needs of copper plates of different sizes. This hinders the high-quality development of PCB thick copper plate circuit pad processing.

[0005] Therefore, we propose a circuit pad processing device for thick copper PCB boards to solve the problems mentioned above. Summary of the Invention

[0006] The purpose of this invention is to provide a circuit pad processing device for thick copper PCB boards. It addresses the problems of poor adaptability, insufficient stability, and limited processing range of existing processing devices by enhancing the stability of the mechanism and adding an expandable mechanism, thereby achieving high-precision and high-efficiency pad processing for thick copper boards of different specifications.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a circuit pad processing device for thick copper PCB boards, comprising a stretching mechanism and a main electroplating tank, wherein the stretching mechanism is symmetrically distributed on both sides of the main electroplating tank, and the stretching mechanism and the main electroplating tank are movably connected by a support hinge. The main electroplating tank is equipped with a placement rack and a partition. The partition divides the main electroplating tank into at least two independent processing chambers. The top of the placement rack is connected to a power end. The output end of the power end is connected to a clamping component through a transmission link. The clamping component is used to fix the thick copper PCB. The outer wall of the main electroplating tank is also connected in sequence to a first extension mechanism, a second extension mechanism, a third extension mechanism, and a fourth extension mechanism. Each extension mechanism is used to expand the processing range and functional adaptability of the main electroplating tank.

[0008] Preferably, the stretching mechanism includes a frame, an upper horizontal bar, cross links, and vertical bars. The frame is a rectangular frame structure. The upper horizontal bar is horizontally fixed to the inner side of the top of the frame, and the vertical bars are vertically distributed on both sides of the frame. There are two sets of cross links. The middle of each set of cross links is movably connected through a link hinge point. The top of the cross link is hinged to the upper horizontal bar, and the bottom is hinged to the side wall of the vertical bar. A side fixing member is provided on the outer side of the bottom of the vertical bar. The side fixing member is used to fix the stretching mechanism to the external worktable. The middle of the vertical bar is rotatably connected to the support hinge member through a support connecting shaft. The end of the support hinge member away from the vertical bar is fixed to the outer wall of the main electroplating tank.

[0009] Preferably, the stretching mechanism further includes two inclined support rods, the middle of which are movably connected by a cross hinge point. The top of the inclined support rod is hinged to the bottom of the upper horizontal bar, and the bottom is hinged to the middle side wall of the vertical bar. The inclined support rods and the cross connecting rods are distributed in parallel, and the length of the inclined support rods is the same as the length of the cross connecting rods. This is used to enhance the structural stability of the stretching mechanism during the stretching process and avoid deviations in pad processing accuracy due to mechanism shaking during PCB thick copper plate processing.

[0010] Preferably, the clamping component includes two sets of symmetrically arranged arc-shaped jaws. An elastic rubber pad is attached to the inner side of the arc-shaped jaws. The surface of the elastic rubber pad is provided with anti-slip texture to avoid damaging the surface of the copper plate when fixing the thick copper plate of the PCB, and to prevent the copper plate from shifting during processing. The power end is a servo motor. The output end of the servo motor is fixed to the transmission link through a coupling. The end of the transmission link away from the power end is connected to the jaw drive shaft of the clamping component. The opening and closing and tightness adjustment of the clamping component can be realized by the forward and reverse rotation of the servo motor to adapt to thick copper plates of different thicknesses of PCB.

[0011] Preferably, the first extension mechanism includes a first extension plate and connecting buckles. The first extension plate is a rectangular metal plate, one side of which is rotatably connected to the side wall of the main electroplating tank via a hinge, enabling horizontal flipping. Two connecting buckles are provided, respectively fixed at both ends of the first extension plate away from the hinge. The main electroplating tank has matching slots corresponding to the positions of the connecting buckles. When the first extension plate is flipped to be perpendicular to the side wall of the main electroplating tank, the connecting buckles can engage and be fixed with the slots. At this time, the first extension plate forms an extended worktable surface for placing tools or auxiliary materials required for solder pad processing.

[0012] Preferably, the second extension mechanism includes a second extension plate, a snap-fit ​​seat, a pull rod, and a limiting connecting seat. One side of the second extension plate is slidably connected to the outer wall of the main electroplating tank. The main electroplating tank has a groove corresponding to the position of the second extension plate. The second extension plate can slide horizontally along the groove to achieve lateral expansion of the processing range. The snap-fit ​​seat is fixed to the end of the second extension plate away from the main electroplating tank. The pull rod passes through the snap-fit ​​seat and is slidably connected to the snap-fit ​​seat. The bottom end of the pull rod has a snap-fit ​​block. The limiting connecting seat is fixed to the outer wall of the main electroplating tank. The limiting connecting seat has a snap-fit ​​hole and a limiting slot. The snap-fit ​​hole is used to accommodate the snap-fit ​​block at the bottom end of the pull rod. The limiting slot is adapted to the snap-fit ​​block. When the second extension plate slides to the designated position, the pull rod is pulled down to make the snap-fit ​​block snap into the limiting slot, thereby locking the position of the second extension plate.

[0013] Preferably, the third extension mechanism includes a third extension plate, a first control button, a rotating sleeve, a hook, a first electric telescopic rod, and a mounting rod. The mounting rod is vertically fixed to the outer wall of the main electroplating tank. The rotating sleeve is sleeved on the outside of the mounting rod and rotatably connected to it. One side of the third extension plate is fixed to the outer wall of the rotating sleeve and can rotate horizontally with the rotating sleeve. The fixed end of the first electric telescopic rod is hinged to the outer wall of the main electroplating tank, and the output end is hinged to the bottom of the third extension plate for driving the lifting and angle adjustment of the third extension plate. The hook is fixed to the side of the third extension plate away from the rotating sleeve. The main electroplating tank has a matching hanging ring at the position corresponding to the hook. When the third extension plate rotates to a horizontal position, the hook can engage with the hanging ring to enhance the load-bearing stability of the third extension plate. The first control button is located on the top of the third extension plate and is electrically connected to the first electric telescopic rod for controlling the extension and retraction of the first electric telescopic rod.

[0014] Preferably, the fourth extension mechanism includes a fourth extension plate, a second control button, and a second electric telescopic rod. The fourth extension plate is a nested telescopic structure, including an outer plate and an inner plate. The inner plate is fitted inside the outer plate and slidably connected to it. The length can be adjusted by pulling the inner plate. The fixed end of the second electric telescopic rod is fixed to the outer wall of the main electroplating tank, and the output end is fixed to the side wall of the outer plate of the fourth extension plate. It is used to drive the overall extension and retraction of the fourth extension plate. The second control button is located on the top of the outer plate of the fourth extension plate and is electrically connected to the second electric telescopic rod. It is used to control the extension and retraction of the second electric telescopic rod. The top of the inner plate of the fourth extension plate is provided with scale lines to assist the operator in accurately controlling the extension length and adapting to the pad processing requirements of PCB thick copper plates of different sizes.

[0015] Preferably, the main electroplating tank also includes a main tank frame and a fixing frame. The main tank frame is made of stainless steel and has an anti-corrosion coating on its inner wall. The anti-corrosion coating is made of polytetrafluoroethylene and is used to prevent the electroplating solution from corroding the main tank frame and extend the service life of the equipment.

[0016] Preferably, the fixing frame is fixed inside the main tank frame, and the placement frame is sleeved on the outside of the fixing frame and slidably connected to the fixing frame. The side wall of the fixing frame is provided with positioning holes, and the placement frame is provided with positioning pins at the positions corresponding to the positioning holes. When the placement frame slides to a specified height, the positioning pins are inserted to lock the height of the placement frame, which can adapt to the processing requirements of pads of different depths.

[0017] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention constructs a highly efficient and adaptable PCB thick copper plate circuit pad processing system through the collaborative construction of a main electroplating tank and multiple functional mechanisms. The stretching mechanism uses a rectangular frame as its basic framework, with the upper horizontal and vertical bars forming a stable support structure. Two sets of cross links, in conjunction with the central link hinge point, enable flexible extension and retraction. Coupled with parallel and uniformly long diagonal support rods, the double-link structure enhances stability during the stretching process, preventing pad accuracy deviations caused by mechanism wobbling during processing. Side fixing parts stabilize the stretching mechanism on the external worktable. Simultaneously, the rotational cooperation between the bracket connecting shaft and the bracket hinge enables the main electroplating tank to achieve... The angle adjustment and position adaptation of the plating tank body are achieved. The main electroplating tank body is divided into at least two independent processing chambers by partitions to meet the needs of simultaneous processing of multiple workpieces. The height of the placement rack is adjusted by the fixed frame. The positioning hole and positioning pin can lock the placement rack to the specified height to adapt to the processing of pads of different depths. The power end adopts a servo motor, which drives the clamping components to move through the transmission linkage. The elastic rubber pads and anti-slip texture on the inner side of the two sets of arc-shaped jaws can not only avoid damaging the surface of the thick copper plate of the PCB, but also prevent processing displacement. The forward and reverse rotation of the servo motor can also flexibly adjust the clamping tightness to adapt to the body of different thicknesses.

[0018] 2. The four sets of extension mechanisms connected sequentially to the outside of the main electroplating tank of the equipment of this invention expand the processing range and functional adaptability from multiple dimensions. The first extension plate is rotatably connected to the main tank through a hinge. When flipped to a vertical state, it can be fixed to the slot through a connecting buckle to form an extended work surface for placing tools. The second extension plate slides horizontally along the slide groove to achieve lateral expansion. Pulling down the pull rod causes the locking block to engage with the limiting slot of the limiting connecting seat, thereby locking the extension position. The third extension plate rotates around the mounting rod with the rotating sleeve. The first electric telescopic rod drives its lifting and angle adjustment. In the horizontal state, the hook and the hanging ring engage to enhance the load-bearing stability. The first control button can conveniently control the telescopic rod's movement. The fourth extension plate adopts a telescopic structure with an outer plate and an inner plate nested. The second electric telescopic rod drives the overall extension and retraction. The scale line on the top of the inner plate assists in precise control of the extension length, adapting to the processing needs of copper plates of different sizes. Attached Figure Description

[0019] Figure 1 This is a perspective view of the main structure of a PCB thick copper board circuit pad processing device according to the present invention. Figure 2 This is a three-dimensional exploded view of the stretching mechanism in a PCB thick copper plate circuit pad processing device of the present invention. Figure 3 This is a schematic diagram of the clamping component structure in a PCB thick copper board circuit pad processing device of the present invention; Figure 4 This is a schematic diagram of the first extension mechanism in the flipped state of a PCB thick copper board circuit pad processing device according to the present invention. Figure 5 This is a schematic diagram of the sliding lock of the second extension mechanism in a PCB thick copper plate circuit pad processing device of the present invention. Figure 6 This is a schematic diagram of the rotation adjustment of the third extension mechanism in a PCB thick copper board circuit pad processing device of the present invention. Figure 7 This is a schematic diagram of the telescopic structure of the fourth extension mechanism in a PCB thick copper board circuit pad processing device of the present invention. Figure 8 This is a schematic diagram of the internal structure of the main electroplating tank in a PCB thick copper plate circuit pad processing device of the present invention.

[0020] In the diagram: 100, tensioning mechanism; 101, frame; 102, upper crossbar; 103, cross link; 104, link hinge point; 105, vertical bar; 106, bracket hinge; 107, bracket connecting shaft; 108, diagonal support rod; 109, support rod cross hinge point; 110, side fixing component; 200, main electroplating tank; 201, main tank frame; 202, placement rack; 203, power end; 204, transmission link; 205, clamping component; 206, fixing frame; 207, partition; 300, first extension mechanism; 301. First extension plate; 302, connecting buckle; 400, second extension mechanism; 401, second extension plate; 402, snap-fit ​​seat; 403, pull rod; 404, limit connecting seat; 405, snap-fit ​​hole; 406, limit slot; 500, third extension mechanism; 501, third extension plate; 502, first control button; 503, rotating sleeve; 504, hook; 505, first electric telescopic rod; 506, mounting rod; 600, fourth extension mechanism; 601, fourth extension plate; 602, second control button; 603, second electric telescopic rod. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] This invention addresses the problems of poor adaptability, insufficient stability, and limited processing range of existing PCB thick copper plate circuit pad processing devices. Traditional equipment has a simple support structure, few processing chambers, and weak expansion capabilities, making it difficult to meet diverse processing needs. This invention was developed to address the problems of the prior art by setting up multiple sets of collaborative mechanisms, including a tensioning mechanism 100 for enhanced stability, a multi-chamber main electroplating tank 200, and a multi-dimensional extension mechanism, to achieve high-precision and high-efficiency processing.

[0023] Example 1, please refer to 1 and Figures 3-8 As shown, the present invention provides a technical solution: a circuit pad processing device for thick copper PCB boards, including a stretching mechanism 100 and a main electroplating tank 200. The stretching mechanism 100 is symmetrically distributed on both sides of the main electroplating tank 200. The main electroplating tank 200 is provided with a placement rack 202, a partition 207 and a fixing rack 206 inside. The outer wall is connected to a first extension mechanism 300, a second extension mechanism 400, a third extension mechanism 500 and a fourth extension mechanism 600, which are used to realize processing fixation, stable support and range expansion.

[0024] In some embodiments, such as Figures 3-8 As shown, the partition 207 divides the interior of the main electroplating tank 200 into at least two independent processing chambers. The top of the placement rack 202 is connected to the power end 203. The output end of the power end 203 is connected to the clamping component 205 through the transmission link 204. The clamping component 205 is used to fix the thick copper plate of the PCB. The stretching mechanism 100 includes a frame 101, an upper horizontal bar 102, cross links 103, and vertical bars 105. The frame 101 is a rectangular frame structure. The upper horizontal bar 102 is horizontally fixed to the inner side of the top of the frame 101, and the vertical bars 105 are vertically distributed on both sides of the frame 101. There are two sets of cross links 103. The middle part of each set of cross links 103 is movably connected through a link hinge point 104. The top of the cross link 103 is hinged to the upper horizontal bar 102, and the bottom end is hinged to the side wall of the vertical bar 105. A side fixing member 110 is provided on the outer side of the bottom of the vertical bar 105. The side fixing member 110 is used to fix the stretching mechanism 100 to the external worktable. The middle part of the vertical bar 105 is rotatably connected to the support hinge member 106 through the support connecting shaft 107. The end of the support hinge member 106 away from the vertical bar 105 is fixed to the outer wall of the main electroplating tank 200. The stretching mechanism 100 also includes two inclined support rods 108. The middle parts of the two inclined support rods 108 are movably connected through the cross hinge point 109. The top end of the inclined support rod 108 is hinged to the bottom of the upper horizontal bar 102, and the bottom end is hinged to the middle side wall of the vertical bar 105. The inclined support rods 108 and the cross connecting rods 103 are distributed in parallel, and the length of the inclined support rods 108 is the same as the length of the cross connecting rods 103. This is used to enhance the structural stability of the stretching mechanism 100 during the stretching process and avoid deviations in the pad processing accuracy caused by the mechanism shaking during the processing of thick copper PCB boards. (The cross connecting rods 103 and the inclined support rods 108 together constitute a statically indeterminate structure. When the main electroplating tank 200 is subjected to lateral forces from the flow of electroplating liquid or equipment vibration, this structure can disperse and offset stress through multiple paths, significantly reducing the deformation amplitude of the tank, thereby reducing the error in the position of the pad processing.) The first extension mechanism 300 includes a first extension plate 301 and a connecting buckle 302. The first extension plate 301 is a rectangular metal plate, one side of which is rotatably connected to the side wall of the main electroplating tank 200 via a hinge, allowing it to be flipped horizontally. There are two connecting buckles 302, which are respectively fixed at both ends of the first extension plate 301 away from the hinge. The main electroplating tank 200 has a matching slot at the position of the connecting buckle 302. When the first extension plate 301 is flipped to be perpendicular to the side wall of the main electroplating tank 200, the connecting buckle 302 can be engaged and fixed with the slot. At this time, the first extension plate 301 forms an extended work surface for placing tools or auxiliary materials required for solder pad processing. The second extension mechanism 400 includes a second extension plate 401, a locking seat 402, a pull rod 403, and a limiting connecting seat 404. One side of the second extension plate 401 is slidably connected to the outer wall of the main electroplating tank 200. The main electroplating tank 200 has a groove corresponding to the position of the second extension plate 401, and the second extension plate 401 can slide horizontally along the groove to achieve lateral expansion of the processing range. The locking seat 402 is fixed to the end of the second extension plate 401 away from the main electroplating tank 200, and the pull rod 403 passes through the locking seat. 402 is slidably connected to the locking seat 402, and the bottom end of the pull rod 403 is provided with a locking block; the limiting connecting seat 404 is fixed to the outer wall of the main electroplating tank 200, and the limiting connecting seat 404 is provided with a locking hole 405 and a limiting slot 406. The locking hole 405 is used to accommodate the locking block at the bottom end of the pull rod 403, and the limiting slot 406 is adapted to the locking block. When the second extension plate 401 slides to the designated position, pull down the pull rod 403 to make the locking block engage with the limiting slot 406, thereby locking the position of the second extension plate 401. The third extension mechanism 500 includes a third extension plate 501, a first control button 502, a rotating sleeve 503, a hook 504, a first electric telescopic rod 505, and a mounting rod 506. The mounting rod 506 is vertically fixed to the outer wall of the main electroplating tank 200. The rotating sleeve 503 is sleeved on the outside of the mounting rod 506 and rotatably connected to the mounting rod 506. One side of the third extension plate 501 is fixed to the outer wall of the rotating sleeve 503 and can rotate horizontally with the rotating sleeve 503. The fixed end of the first electric telescopic rod 505 is hinged to the outer wall of the main electroplating tank 200, and the output end is connected to the third extension plate 501. The bottom of the extension plate 501 is hinged to drive the lifting and angle adjustment of the third extension plate 501. The hook 504 is fixed on the side of the third extension plate 501 away from the rotating sleeve 503. The main electroplating tank 200 is provided with a matching hanging ring at the position corresponding to the hook 504. When the third extension plate 501 is rotated to the horizontal position, the hook 504 can engage with the hanging ring to enhance the load-bearing stability of the third extension plate 501. The first control button 502 is located on the top of the third extension plate 501 and is electrically connected to the first electric telescopic rod 505 to control the extension and retraction of the first electric telescopic rod 505. The fourth extension mechanism 600 includes a fourth extension plate 601, a second control button 602, and a second electric telescopic rod 603. The fourth extension plate 601 is a nested telescopic structure, including an outer plate and an inner plate. The inner plate is fitted inside the outer plate and slidably connected to the outer plate. The length can be adjusted by pulling the inner plate. The fixed end of the second electric telescopic rod 603 is fixed to the outer wall of the main electroplating tank 200, and the output end is fixed to the side wall of the outer plate of the fourth extension plate 601. It is used to drive the overall extension and retraction of the fourth extension plate 601. The second control button 602 is located on the top of the outer plate of the fourth extension plate 601 and is electrically connected to the second electric telescopic rod 603. It is used to control the extension and retraction of the second electric telescopic rod 603. The top of the inner plate of the fourth extension plate 601 is provided with scale lines to assist operators in accurately controlling the extension length and adapting to the pad processing requirements of PCB thick copper plates of different sizes.

[0025] When using, such as Figures 3-8As shown, the device is first fixed to the external worktable by the side fixing part 110 at the bottom of the vertical rod 105 in the stretching mechanism 100 to prevent displacement during processing. If the operating angle needs to be adjusted, the main electroplating tank 200 can be rotated to a convenient processing position by means of the rotational cooperation between the bracket connecting shaft 107 in the middle of the vertical rod 105 and the bracket hinge 106. At this time, the frame 101, the upper horizontal bar 102 and the vertical rod 105 of the stretching mechanism 100 form a stable support frame, and the two sets of cross connecting rods 103 and parallel distribution The inclined support rod 108 further enhances the structural rigidity. If tools or auxiliary materials need to be placed during processing, the first extension plate 301 of the first extension mechanism 300 can be flipped so that it rotates around the hinge to be perpendicular to the side wall of the main electroplating tank 200. It is then fixed by engaging with the slot through the connecting buckle 302 to form an extended worktable. If the copper plate being processed is large and the lateral processing range needs to be expanded, the second extension plate 401 of the second extension mechanism 400 can be pulled along the slide groove on the outer wall of the main electroplating tank 200 and slid to the designated position before being lowered. Pull the lever 403 so that the locking block at the bottom of the lever 403 passes through the locking hole 405 of the limiting connecting seat 404 and locks into the limiting slot 406, thereby locking the position of the second extension plate 401 and providing support for the processing of the copper plate edge. If additional processing equipment needs to be placed or the support height needs to be adjusted, press the first control button 502 of the third extension mechanism 500 to start the first electric telescopic rod 505. The first electric telescopic rod 505 drives the third extension plate 501 to rotate around the mounting rod 506 with the rotating sleeve 503. Adjust the lifting height in time. When the third extension plate 501 is rotated to the horizontal position, the hook 504 on its side engages with the hanging ring on the outer wall of the main electroplating tank 200 to enhance the load-bearing stability. If it is necessary to precisely control the extension length to adapt to a specific size copper plate, operate the second control button 602 of the fourth extension mechanism 600, push the outer plate of the fourth extension plate 601 to slide through the second electric telescopic rod 603, and at the same time pull out the inner plate. Adjust to the required length with reference to the scale line on the top of the inner plate to ensure that the processing range completely covers the copper plate to be processed area.

[0026] In some embodiments, such as Figure 8 As shown, the clamping component 205 includes two sets of symmetrically arranged arc-shaped jaws. An elastic rubber pad is attached to the inner side of the arc-shaped jaws. The surface of the elastic rubber pad is provided with anti-slip texture to avoid damaging the surface of the copper plate when fixing the thick copper plate of the PCB, and to prevent the copper plate from shifting during processing. The power end 203 is a servo motor. The output end of the servo motor is fixed to the transmission link 204 through a coupling. The end of the transmission link 204 away from the power end 203 is connected to the jaw drive shaft of the clamping component 205. The opening and closing and tightness adjustment of the clamping component 205 can be realized by the forward and reverse rotation of the servo motor to adapt to thick copper plates of different thicknesses of PCB. The main electroplating tank 200 also includes a main tank frame 201 and a fixing frame 206. The main tank frame 201 is made of stainless steel and has an anti-corrosion coating on its inner wall. The anti-corrosion coating is made of polytetrafluoroethylene and is used to prevent the electroplating solution from corroding the main tank frame 201 and extend the service life of the equipment. The fixing frame 206 is fixed inside the main tank frame 201. The placement frame 202 is sleeved on the outside of the fixing frame 206 and slidably connected to the fixing frame 206. The side wall of the fixing frame 206 is provided with positioning holes. The placement frame 202 is provided with positioning pins at the positions corresponding to the positioning holes. When the placement frame 202 slides to the specified height, the positioning pin is inserted to lock the height of the placement frame 202, which can adapt to the processing requirements of pads of different depths.

[0027] When using, such as Figure 8 As shown, since the main tank frame 201 is made of stainless steel and has a polytetrafluoroethylene anti-corrosion coating on its inner wall, electroplating solution suitable for pad processing can be directly injected into the tank without additional anti-corrosion treatment. According to the depth requirements of the pads to be processed, hold the placement frame 202 and slide it up and down along the outside of the fixing frame 206, observing the relative height between the processing position and the surface of the electroplating solution, until the placement frame 202 slides to a height that allows the copper plate to be processed area to be completely immersed in the electroplating solution and meets the specified depth of the pads. Then, the PCB thick copper plate is fixed. The servo motor 203, which serves as the power end, is started. The output end of the servo motor drives the transmission link 204 to rotate in the forward direction through the coupling. Then, the transmission link 204 transmits power to the jaw drive shaft of the clamping component 205, causing the two sets of symmetrically arranged arc-shaped jaws to rotate. The PCB thick copper plate to be processed is placed stably on the placement rack 202, ensuring that the pad area of ​​the copper plate to be processed is aligned with the processing station. Then, the servo motor is controlled to rotate in reverse, driving the jaw drive shaft through the transmission link 204, causing the arc-shaped jaws to close slowly. At this time, the elastic rubber pad attached to the inside of the jaws directly contacts the surface of the copper plate. The softness of the elastic rubber pad can avoid damage to the surface of the copper plate caused by the rigid compression of the jaws. At the same time, the anti-slip texture on its surface can increase the friction with the copper plate, preventing the copper plate from shifting due to the flow of electroplating solution or slight vibration of the equipment during processing. During processing, the servo motor maintains a stable output, so that the clamping component 205 maintains a stable clamping force. With the height-locked placement rack 202, the copper plate is always kept in the preset processing position.

[0028] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A device for processing circuit pads on a thick copper PCB, characterized in that: It includes a stretching mechanism (100) and a main electroplating tank (200). The stretching mechanism (100) is symmetrically distributed on both sides of the main electroplating tank (200), and the stretching mechanism (100) and the main electroplating tank (200) are movably connected by a bracket hinge (106). The main electroplating tank (200) is provided with a placement rack (202) and a partition (207) inside. The partition (207) divides the interior of the main electroplating tank (200) into at least two independent processing chambers. The top of the placement rack (202) is connected to a power end (203). The output end of the power end (203) is connected to a clamping component (205) through a transmission link (204). The clamping component (205) is used to fix the thick copper plate of the PCB. The outer wall of the main electroplating tank (200) is also connected in sequence with a first extension mechanism (300), a second extension mechanism (400), a third extension mechanism (500) and a fourth extension mechanism (600). Each extension mechanism is used to expand the processing range and functional adaptability of the main electroplating tank (200). The tensioning mechanism (100) includes a frame (101), an upper horizontal bar (102), cross links (103), and vertical bars (105). The frame (101) is a rectangular frame structure. The upper horizontal bar (102) is horizontally fixed to the inner side of the top of the frame (101), and the vertical bars (105) are vertically distributed on both sides of the frame (101). The cross links (103) are provided in two sets, and the middle of each set of cross links (103) is movably connected through a link hinge point (104). The top of the 03) is hinged to the upper horizontal bar (102), and the bottom is hinged to the side wall of the vertical bar (105). The bottom outer side of the vertical bar (105) is provided with a side fixing member (110). The side fixing member (110) is used to fix the tensioning mechanism (100) on the external worktable. The middle part of the vertical bar (105) is rotatably connected to the bracket hinge member (106) through the bracket connecting shaft (107). The end of the bracket hinge member (106) away from the vertical bar (105) is fixed to the outer wall of the main electroplating tank (200). The clamping component (205) includes two sets of symmetrically arranged arc-shaped jaws. An elastic rubber pad is attached to the inner side of the arc-shaped jaws. The surface of the elastic rubber pad is provided with anti-slip texture to avoid damaging the surface of the copper plate when fixing the thick copper plate of the PCB, and to prevent the copper plate from shifting during processing. The power end (203) is a servo motor. The output end of the servo motor is fixed to the transmission link (204) through a coupling. The end of the transmission link (204) away from the power end (203) is connected to the jaw drive shaft of the clamping component (205). The opening and closing and tightness adjustment of the clamping component (205) can be realized by the forward and reverse rotation of the servo motor to adapt to thick copper plates of different thicknesses of PCB.

2. The PCB thick copper plate circuit pad processing device according to claim 1, characterized in that: The stretching mechanism (100) also includes two inclined support rods (108). The middle parts of the two inclined support rods (108) are movably connected through the cross hinge point (109). The top of the inclined support rod (108) is hinged to the bottom of the upper horizontal bar (102), and the bottom is hinged to the middle side wall of the vertical bar (105). The inclined support rods (108) and the cross connecting rods (103) are distributed in parallel, and the length of the inclined support rods (108) is the same as the length of the cross connecting rods (103). This is used to enhance the structural stability of the stretching mechanism (100) during the stretching process and avoid deviations in the pad processing accuracy caused by the shaking of the mechanism during the processing of thick copper plates for PCBs.

3. The PCB thick copper plate circuit pad processing device according to claim 1, characterized in that: The first extension mechanism (300) includes a first extension plate (301) and a connecting buckle (302). The first extension plate (301) is a rectangular metal plate, one side of which is rotatably connected to the side wall of the main electroplating tank (200) via a hinge, which can achieve horizontal flipping. There are two connecting buckles (302), which are respectively fixed at both ends of the first extension plate (301) away from the hinge. The main electroplating tank (200) is provided with a matching slot corresponding to the position of the connecting buckle (302). When the first extension plate (301) is flipped to be perpendicular to the side wall of the main electroplating tank (200), the connecting buckle (302) can be engaged and fixed with the slot. At this time, the first extension plate (301) forms an extended work surface for placing tools or auxiliary materials required for solder pad processing.

4. The PCB thick copper plate circuit pad processing device according to claim 1, characterized in that: The second extension mechanism (400) includes a second extension plate (401), a snap-fit ​​seat (402), a pull rod (403), and a limiting connecting seat (404). One side of the second extension plate (401) is slidably connected to the outer wall of the main electroplating tank (200). The main electroplating tank (200) has a groove corresponding to the position of the second extension plate (401). The second extension plate (401) can slide horizontally along the groove to achieve lateral expansion of the processing range. The snap-fit ​​seat (402) is fixed to the end of the second extension plate (401) away from the main electroplating tank (200). The pull rod (403) passes through the snap-fit ​​seat. The base (402) is slidably connected to the snap-fit ​​base (402), and the bottom end of the pull rod (403) is provided with a snap-fit ​​block; the limiting connection base (404) is fixed to the outer wall of the main electroplating tank (200), and the limiting connection base (404) is provided with a snap-fit ​​hole (405) and a limiting slot (406). The snap-fit ​​hole (405) is used to accommodate the snap-fit ​​block at the bottom end of the pull rod (403), and the limiting slot (406) is adapted to the snap-fit ​​block. When the second extension plate (401) slides to the designated position, the pull rod (403) is pulled down to make the snap-fit ​​block snap into the limiting slot (406), thereby locking the position of the second extension plate (401).

5. The PCB thick copper plate circuit pad processing device according to claim 1, characterized in that: The third extension mechanism (500) includes a third extension plate (501), a first control button (502), a rotating sleeve (503), a hook (504), a first electric telescopic rod (505), and a mounting rod (506). The mounting rod (506) is vertically fixed to the outer wall of the main electroplating tank (200). The rotating sleeve (503) is sleeved on the outside of the mounting rod (506) and rotatably connected to the mounting rod (506). One side of the third extension plate (501) is fixed to the outer wall of the rotating sleeve (503) and can rotate horizontally with the rotating sleeve (503). The fixed end of the first electric telescopic rod (505) is hinged to the outer wall of the main electroplating tank (200) and outputs... The end is hinged to the bottom of the third extension plate (501) and is used to drive the lifting and angle adjustment of the third extension plate (501). The hook (504) is fixed on the side of the third extension plate (501) away from the rotating sleeve (503). The main electroplating tank (200) is provided with a matching hanging ring at the position corresponding to the hook (504). When the third extension plate (501) is rotated to the horizontal position, the hook (504) can engage with the hanging ring to enhance the load-bearing stability of the third extension plate (501). The first control button (502) is set on the top of the third extension plate (501) and is electrically connected to the first electric telescopic rod (505) to control the extension and retraction of the first electric telescopic rod (505).

6. The PCB thick copper plate circuit pad processing device according to claim 1, characterized in that: The fourth extension mechanism (600) includes a fourth extension plate (601), a second control button (602), and a second electric telescopic rod (603). The fourth extension plate (601) is a nested telescopic structure, including an outer plate and an inner plate. The inner plate is fitted inside the outer plate and slidably connected to the outer plate. The length can be adjusted by pulling the inner plate. The fixed end of the second electric telescopic rod (603) is fixed to the outer wall of the main electroplating tank (200), and the output end is fixed to the side wall of the outer plate of the fourth extension plate (601). It is used to drive the overall extension and retraction of the fourth extension plate (601). The second control button (602) is located on the top of the outer plate of the fourth extension plate (601) and is electrically connected to the second electric telescopic rod (603). It is used to control the extension and retraction of the second electric telescopic rod (603). The top of the inner plate of the fourth extension plate (601) is provided with scale lines to assist operators in accurately controlling the extension length and adapting to the pad processing requirements of PCB thick copper plates of different sizes.

7. The PCB thick copper plate circuit pad processing device according to claim 1, characterized in that: The main electroplating tank (200) also includes a main tank frame (201) and a fixing frame (206). The main tank frame (201) is made of stainless steel and has an anti-corrosion coating on its inner wall. The anti-corrosion coating is made of polytetrafluoroethylene and is used to prevent the electroplating solution from corroding the main tank frame (201) and extend the service life of the equipment.

8. The PCB thick copper plate circuit pad processing device according to claim 7, characterized in that: The fixing frame (206) is fixed inside the main tank frame (201). The placement frame (202) is sleeved on the outside of the fixing frame (206) and slidably connected to the fixing frame (206). The side wall of the fixing frame (206) is provided with positioning holes. The placement frame (202) is provided with positioning pins at the positions corresponding to the positioning holes. When the placement frame (202) slides to the specified height, the positioning pin is inserted to lock the height of the placement frame (202), which is suitable for the processing requirements of pads of different depths.

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