A pick-up pin device for a die bonder

Abstract

The present application aims to provide a kind of fixed crystal machine needle device, it includes needle seat, needle assembly and first rotating block, negative pressure airway is opened in needle seat, negative pressure airway is used to continue with vacuum generator communication, needle assembly includes needle, needle cap, top rod and needle driving part, needle cap is set on needle seat, needle cap is opened in needle cap and adsorption hole, top rod is slidably arranged in needle seat, the output shaft of needle driving part is connected with the bottom end of top rod, needle is set on the top end of top rod, first rotating block is rotationally arranged in needle seat, and top rod passes through first rotating block, first rotating block is opened in first airway, first rotating block is also opened in helical guide slot, the outside wall of top rod is provided with guide block, guide block is accommodated in helical guide slot. Thus, needle can ensure that adsorption hole is reliably opened or closed in the movement cycle of ejection and retraction, effectively guarantee the synchronism of negative pressure suction force and needle movement.

Description

Technical Field

[0001] This invention relates to the technical field of die bonders, and in particular to a die bonder ejector pin device. Background Technology

[0002] Die bonding machines are used to accurately fix chips, such as LED chips and semiconductor chips, onto substrates or supports. They are key equipment in electronic manufacturing processes such as LED manufacturing and semiconductor packaging. The ejector pins are used to eject the wafer from the blue film, which, in conjunction with a suction robotic arm, picks up the ejected wafer and transfers it to a fixed substrate or support. Because the wafers are small, the ejector pins' ability to pick up the wafer is the first crucial step in ensuring the successful completion of die bonding.

[0003] For example, Chinese patent document CN111863703A discloses a non-impact ejector pin device for a die bonder and its working method. It includes a base, ejector pins, an ejector pin drive mechanism, an ejector pin cap, and an ejector pin cap drive mechanism. The ejector pin cap is mounted on the top of the base and has a vacuum hole. The ejector pin cap drive mechanism is mounted on the bottom of the ejector pin cap and is used to control the movement of the ejector pin cap. The ejector pin is installed in the vacuum hole on the ejector pin cap. The ejector pin drive mechanism is mounted on the base, located at the bottom of the ejector pin, and is used to control the movement of the ejector pin. The vacuum hole on the ejector pin cap is also connected to a vacuum pressure source, which can adsorb the crystal film. Thus, in existing ejector pin devices, by controlling the switch of the vacuum pressure source, the vacuum hole of the ejector pin cap can create negative pressure suction, allowing the ejector pin cap to adsorb and fix the blue film. When the ejector pin lifts from the bottom of the blue film, the wafer can be smoothly ejected from the blue film, and the wafer can be successfully adsorbed by the die-gathering robotic arm.

[0004] However, the existing method of connecting the vacuum hole of the ejector cap to an external vacuum pressure source and controlling the switching of the vacuum pressure source through the die bonder control system has the following limitations: the current vacuum pressure source uses a vacuum solenoid valve to generate vacuum suction. Therefore, the vacuum solenoid valve needs to be switched on and off every time the ejector pushes out a wafer. Specifically, multiple wafers are arranged on a blue film to form a wafer disk. The current wafer supply methods are roughly divided into two types: one is that the ejector device is fixed in the horizontal direction, and the wafer disk is driven to move horizontally by the wafer disk driving device; the other is that the ejector device is driven to move horizontally to fix the wafer disk in place. In this way, the ejector device and the wafer disk driving device cooperate with each other so that the ejector can move one by one to the bottom of each wafer on the wafer disk. Before the ejector lifts from under the blue film, it is necessary to ensure that the vacuum hole of the ejector cap forms a vacuum suction to attract and fix the blue film, thereby ensuring that the ejector can stably push the designated wafer off the blue film. Therefore, it means that every time the ejector pin retracts, the vacuum solenoid valve needs to open and close synchronously to allow the ejector pin device and the wafer disk to move smoothly relative to each other.

[0005] As the ejection frequency of the ejector pins increases, the existing method of controlling the vacuum generator switch is no longer adequate. This is because the vacuum generator is connected to the ejector pin device through an air pipe. There is a time difference between the generation of the vacuum generator's action and the negative pressure in the vacuum hole of the ejector pin cap. When the die bonding speed of a conventional die bonder is relatively slow, the time difference of negative pressure transmission can be ignored. However, as the ejection speed of the ejector pins increases, the lag in generating negative pressure in the vacuum hole causes the blue film to not be fully adsorbed and fixed by the vacuum hole when the ejector pins penetrate it. This results in a slight vibration of the blue film when it is ejected by the ejector pins, and this vibration will further increase with the further increase of the ejector pin speed. The vibration of the blue film will seriously affect the accuracy of the wafer picking robot arm.

[0006] Therefore, in order to overcome the above-mentioned shortcomings, the die bonder ejector pin device of this application is proposed. Summary of the Invention

[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide a die bonder ejector device that can effectively improve the synchronization of vacuum hole negative pressure formation and ejector ejection.

[0008] The objective of this invention is achieved through the following technical solution: A die bonder ejector pin device, comprising: A ejector seat, wherein a negative pressure air passage is provided on the ejector seat, and the negative pressure air passage is used to continuously communicate with a vacuum generator; A ejector assembly includes an ejector pin, an ejector pin cap, an ejector rod, and an ejector pin drive. The ejector pin cap is disposed on the ejector pin seat and has a needle outlet hole and an adsorption hole. The ejector rod is slidably disposed on the ejector pin seat. The ejector pin drive is disposed on the ejector pin seat and its output shaft is connected to the bottom end of the ejector rod. The ejector pin is disposed on the top end of the ejector rod and is aligned with the needle outlet hole. The first rotating block is rotatably disposed within the ejector pin seat, and the ejector rod passes through the first rotating block. The first rotating block has a first air passage and a spiral guide groove. A guide block is disposed on the outer side wall of the ejector rod, and the guide block is adapted to be accommodated in the spiral guide groove. When the ejector pin drive is used to drive the ejector rod to rise, the guide block pushes against the inner wall of the spiral guide groove, causing the first spiral block to rotate along the first direction, thereby connecting the negative pressure air passage, the first air passage, and the adsorption hole in sequence, and then causing the ejector rod to drive the ejector pin to be ejected from the needle outlet hole.

[0009] Optionally, the first rotating block is further provided with a vertical guide groove communicating with the spiral guide groove. The die bonder ejector pin device also includes a second rotating block, a locking pin, a locking elastic element, and a reset elastic element. The second rotating block is rotatably disposed within the ejector pin seat, and the second rotating block is coaxially located on the side of the first rotating block near the ejector pin cap, so that the ejector rod passes through the second rotating block. A locking guide groove is provided on the inner sidewall of the second rotating block, and the groove width of the locking guide groove is greater than the groove width of the vertical guide groove. The locking pin passes radially through the second rotating block, and the locking elastic element... The locking elastic element abuts against the locking post and the second rotating block respectively. The locking elastic element is used to push the locking post, so that one end of the locking post passes through the locking guide groove and extends into the vertical guide groove, thereby causing the first rotating block to drive the second rotating block to rotate synchronously. The second rotating block has a second air passage. When the locking guide groove is aligned with the vertical guide groove, the second air passage is connected to the first air passage. The reset elastic element abuts against the ejector seat and the second rotating block respectively. The reset elastic element is used to push the second rotating block to have a tendency to rotate along the second direction.

[0010] Optionally, a first sealing element is provided at one end of the first air passage near the negative pressure air passage. When the first rotating block rotates to cause the first air passage to be misaligned with the negative pressure air passage, the inner sidewall of the ejector seat pushes against the first sealing element, thereby causing the first sealing element to seal the first air passage.

[0011] Optionally, the first sealing element includes an air guide cylinder, a plug rod, and a sealing elastic element. The air guide cylinder is disposed in the first air passage, and the plug rod is coaxially inserted into the air guide cylinder. A plug is provided on one end of the plug rod near the negative pressure air passage. The sealing elastic element abuts against the plug rod and the air guide cylinder respectively. The sealing elastic element is used to push the plug rod so that the plug tends to move away from the first air passage.

[0012] Optionally, a first ball bearing is rotatably provided on the end of the plug away from the plug rod.

[0013] Optionally, a positioning ring is coaxially disposed between the first rotating block and the second rotating block, and a plurality of second balls are rotatably disposed on the positioning ring, each of the second balls rolling into contact with the first rotating block and the second rotating block respectively.

[0014] Optionally, an inner sealing ring and an outer sealing ring are coaxially disposed on the side of the second rotating block away from the first rotating block, the opening of the second air passage is located between the inner sealing ring and the outer sealing ring, and the inner sealing ring is sleeved with the push rod, and the outer sealing ring is in close contact with the push pin seat.

[0015] Optionally, the ejector seat is further provided with a baffle, and an inner elastic element and an outer elastic element are provided on the side of the baffle near the second rotating block. The inner elastic element abuts against the inner sealing ring, and the outer elastic element abuts against the outer sealing ring.

[0016] Optionally, the ejector pin assembly further includes a clamping seat, which includes a first seat body and a locking cap. The first seat body is disposed at the top end of the ejector rod. The top of the first seat body has two intersecting slots to form four first clamping blocks. The ejector pin is disposed between the four first clamping blocks. The locking cap is screwed to each of the first clamping blocks so that the four first clamping blocks together clamp the ejector pin.

[0017] Optionally, multiple ejector pins are provided, and the clamping seat further includes a second seat body. The second seat body includes four second clamping blocks. The second seat body is inserted from the bottom end of the first seat body, so that the four first clamping blocks and the four second clamping blocks are distributed alternately in sequence, thereby allowing any two adjacent first clamping blocks to clamp an ejector pin with one of the second clamping blocks.

[0018] Compared with the prior art, the present invention has at least the following advantages: The die bonder ejector pin device of the present invention includes an ejector pin seat, an ejector pin assembly, and a first rotating block. The ejector pin seat has a negative pressure air passage for continuous communication with a vacuum generator. The ejector pin assembly includes an ejector pin, an ejector pin cap, an ejector rod, and an ejector pin drive. The ejector pin cap is disposed on the ejector pin seat and has an outlet pin hole and an adsorption hole. The ejector rod is slidably disposed on the ejector pin seat. The ejector pin drive is disposed on the ejector pin seat, and the output shaft of the ejector pin drive is connected to the bottom end of the ejector rod. The ejector pin is disposed at the top end of the ejector rod, and the ejector pin and the outlet pin are connected... With the holes aligned, the first rotating block is rotatably mounted within the ejector pin seat, and the ejector rod passes through the first rotating block. The first rotating block has a first air passage and a spiral guide groove. A guide block is mounted on the outer wall of the ejector rod, fitting snugly within the spiral guide groove. When the ejector pin drive unit moves the ejector rod upward, the guide block pushes against the inner wall of the spiral guide groove, causing the first rotating block to rotate in a first direction. This sequentially connects the negative pressure air passage, the first air passage, and the suction hole, allowing the ejector rod to eject the ejector pin from the ejector pin hole. Thus, during one ejection and retraction cycle of the ejector pin, the suction hole can reliably open or close within the ejector pin's movement cycle, effectively ensuring the synchronization of the negative pressure suction and the ejector pin's movement. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the die bonder ejector pin device according to one embodiment of the present invention; Figure 2 for Figure 1 The diagram shows an exploded view of the die bonder's ejector pin assembly. Figure 3 for Figure 1 A cross-sectional schematic diagram of a portion of the die bonder's ejector pin assembly shown; Figure 4 This is a schematic diagram of the structure of the first rotating block according to an embodiment of the present invention; Figure 5 for Figure 1 The diagram shows the movement cycle of the ejector pins in the die bonder ejector pin device. Figure 6 This is a schematic diagram of the ejector seat according to one embodiment of the present invention; Figure 7 for Figure 1 A schematic diagram of the motion cycle of another embodiment of the die bonder ejector pin device shown; Figure 8 This is a cross-sectional schematic diagram of the second rotating block according to an embodiment of the present invention; Figure 9 This is a schematic diagram of the structure of the first sealing element according to an embodiment of the present invention; Figure 10 for Figure 9 The exploded structural diagram of the first seal shown; Figure 11 This is a schematic diagram of the structure of a clamp according to one embodiment of the present invention; Figure 12 for Figure 11 The diagram shows the exploded structure of the clamp.

[0021] Explanation of reference numerals in the attached figures: 10. Die bonder ejector pin assembly; 100. Ejector pin seat; 200. Ejector pin assembly; 310. First rotating block; 110. Negative pressure air passage; 210. Ejector pin; 220. Ejector pin cap; 230. Ejector rod; 240. Ejector pin drive component; 221. Pin outlet hole; 222. Adsorption hole; 311. First air passage; 312. Spiral guide groove; 251. Guide block; 120. Cavity; 241. Motor; 242. Cam; 313. Vertical guide groove; 320. Second rotating block; 330. Locking post; 340. Locking elastic element; 350. Reset elastic element; 321. Locking guide groove; 322. Second air passage; 360. Extension block; 121. Groove; 261. Linear shaft 262. Guide block; 2621. Guide slide hole; 2622. Guide groove; 252. Guide protrusion; 271. First sealing ring; 272. Second sealing ring; 273. Inner sealing ring; 274. Outer sealing ring; 275. Baffle; 276. Inner elastic element; 277. Outer elastic element; 280. First sealing element; 281. Air guide tube; 282. Plug rod; 283. Sealing elastic element; 284. Plug; 285. First ball; 291. Positioning ring; 292. Second ball; 2100. Clamping seat; 2110. First seat body; 2120. Lock cap; 2111. First clamping block; 2130. Second seat body; 2131. Second clamping block. Detailed Implementation

[0022] To facilitate understanding of the present invention, a more comprehensive description will be given below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the invention.

[0023] like Figures 1 to 4As shown, a die bonder ejector pin device 10 includes an ejector pin seat 100, an ejector pin assembly 200, and a first rotating block 310. The ejector pin seat 100 has a negative pressure air passage 110 for continuous communication with a vacuum generator. The ejector pin assembly 200 includes an ejector pin 210, an ejector pin cap 220, an ejector rod 230, and an ejector pin drive 240. The ejector pin cap 220 is disposed on the ejector pin seat 100 and has an outlet pin hole 221 and an adsorption hole 222. The ejector rod 230 is slidably disposed on the ejector pin seat 100. The ejector pin drive 240 is disposed on the ejector pin seat 100, and its output shaft is connected to the bottom end of the ejector rod 230. The ejector pin 210 is disposed at the top end of the ejector rod 230. Aligned with the needle outlet 221, the first rotating block 310 is rotatably disposed within the ejector pin seat 100, and the ejector rod 230 passes through the first rotating block 310. The first rotating block 310 has a first air passage 311 and a spiral guide groove 312. A guide block 251 is disposed on the outer side wall of the ejector rod 230. The guide block 251 is adapted to be accommodated in the spiral guide groove 312. When the ejector pin drive member 240 drives the ejector rod 230 to rise, the guide block 251 pushes against the inner side wall of the spiral guide groove 312, causing the first rotating block 310 to rotate along the first direction, thereby connecting the negative pressure air passage 110, the first air passage 311, and the adsorption hole 222 in sequence, and thus causing the ejector rod 230 to drive the ejector pin 210 to be ejected from the needle outlet 221.

[0024] It should be noted that a cavity 120 is formed vertically within the ejector seat 100. A negative pressure air passage 110, extending into the cavity 120, is formed on the outer wall of the ejector seat 100. The outer end of the negative pressure air passage 110 is continuously connected to an external vacuum generator via an air pipe connector. An ejector cap 220 is mounted on the top of the ejector seat 100. For example, the ejector seat 100 has external threads, and the inner wall of the ejector cap 220 has internal threads. The internal and external threads are screwed together, allowing the ejector cap 220 to be fixedly attached to the top of the ejector seat 100. In one embodiment, a sealing ring is installed between the ejector cap 220 and the ejector seat 100 to ensure a sealed installation. The ejector cap 220 has a needle outlet hole 221 and a suction hole 222, both of which communicate with the cavity 120. The push rod 230 is slidably installed in the cavity 120 along the vertical direction. That is, the push rod 230 can only slide up and down relative to the ejector seat 100, and cannot rotate relative to the ejector seat 100. The ejector drive 240 is installed at the bottom of the ejector seat 100, and the ejector drive 240 is used to drive the push rod 230 to move up and down in the vertical direction. In one embodiment, the ejector drive 240 includes a motor 241 and a cam 242 driven by the motor 241. The motor 241 drives the cam 242 to rotate continuously in one direction, so that the outer peripheral wall of the cam 242 abuts against the bottom end of the push rod 230, so that the motor drives the push rod 230 to slide up and down periodically. The ejector pin 210 is installed on the top end of the push rod 230, and the ejector pin 210 is aligned with the needle outlet 221. In this way, when the push rod 230 rises, it can drive the ejector pin 210 to pass through the needle outlet 221. The first rotating block 310 is rotatably mounted on the inner wall of the cavity 120. For example, a ball bearing is fitted on the outer wall of the first rotating block 310, and the ball bearing is adapted to be installed on the inner wall of the cavity 120. In this way, the first rotating block 310 can rotate stably relative to the ejector pin seat 100. The ejector rod 230 passes through the first rotating block 310 coaxially. The first rotating block 310 has a first air passage 311, and a spiral guide groove 312 is formed on the inner wall of the first rotating block 310. A guide block 251 is integrally formed on the outer wall of the ejector rod 230, and the guide block 251 is adapted to be slidably installed with the spiral guide groove 312. Thus, when the ejector rod 230 is in the lowest position, the first air passage 311 is not connected to the negative pressure air passage 110, so the suction hole 222 will not form a negative pressure suction force, and the ejector pin 210 is also located inside the ejector pin cap 220 and is not ejected from the needle outlet hole 221.When the push rod 230 rises, the guide block 251 pushes against the inner wall of the spiral guide groove 312, causing the first rotating block 310 to rotate relative to the ejector pin seat 100. This allows the first air passage 311 to connect with the negative pressure air passage 110, thereby creating a negative pressure suction force in the adsorption hole 222 to fix the blue film. Then, the push rod 230 continues to rise, causing the guide block 251 to slide out of the spiral guide groove 312. The first rotating block 310 remains stationary, keeping the first air passage 311 connected to the negative pressure air passage 110. Finally, the push rod 230 drives the ejector pin 210 to pass through the ejector pin hole 221 to lift the wafer on the blue film. When the push rod 230 reaches its highest position and begins to fall, the push pin 210 retracts from the needle outlet 221, and then the guide block 251 re-enters the spiral guide groove 312, causing the first spiral block 310 to rotate in the opposite direction to reset. This causes the first air passage 311 to misalign with the negative pressure air passage 110, thereby eliminating the negative pressure suction of the adsorption hole 222. In this way, within one cycle of the push pin 210's extension and retraction, the adsorption hole 222 can reliably open or close within the cycle of the push pin 210's movement, effectively ensuring the synchronization of the negative pressure suction and the movement of the push pin 210.

[0025] It should be noted that the first direction and the second direction mentioned in this application refer to the rotation direction when viewed from the top of the ejector cap 220, which is clockwise or counterclockwise. That is, when the first direction is clockwise, the second direction is counterclockwise, and vice versa. The rotation direction of the first rotating block 310 is different depending on the spiral direction of the spiral guide groove 312 of the first rotating block 310 during the ascent of the ejector rod 230. Therefore, for ease of describing the design principle of this application, this application uses an embodiment with the first direction being clockwise and the second direction being counterclockwise for illustration. Specifically, when the ejector rod 230 rises, the guide block 251 pushes against the spiral guide groove 312, causing the first rotating block 310 to rotate clockwise; when the ejector rod 230 descends, the guide block 251 pushes against the spiral guide groove 312, causing the first rotating block 310 to rotate counterclockwise.

[0026] like Figure 5As shown, the working principle of the above scheme is as follows: the movement cycle of the ejector pin 210 is also the movement cycle of the ejector rod 230. When the ejector rod 230 rises from the lowest point A to the highest point B, that is, the rising phase, and then falls from the highest point B to the lowest point A, that is, the falling phase, this is one movement cycle of the ejector rod 230 (ejector pin 210). During the rising phase, the ejector rod 230 slides on the spiral guide groove 312 through the guide block 251, first connecting the first air channel 311 with the negative pressure air channel 110 so that the adsorption hole 222 forms a negative pressure suction to adsorb and fix the blue film, that is, point C1. Then, the ejector pin 210 passes through the needle hole 221 to lift the wafer, that is, point D1. When the ejector pin 210 is at the highest point B, the lifted wafer is simultaneously taken away by the adsorption robot arm, and the ejector rod 230 begins the falling phase. During the descent of the push rod 230, the push pin 210 first retracts from the outlet hole 221, i.e., point D2, and then slides in the opposite direction along the spiral guide groove 312 via the guide block 251, causing the first air passage 311 to be misaligned and closed with the negative pressure air passage 110, and the negative pressure suction of the adsorption hole 222 disappears, releasing the blue film, i.e., point C2. At this time, the push pin device and the blue film can move relative to each other so that the push pin 210 is aligned with the next wafer to be lifted. In this way, the above solution can ensure that the blue film adsorption and fixing action (C1-B-C2 segment) can always be maintained within one movement cycle of the push rod 230 (push pin 210). Compared with the prior art, which detects the position of the push rod 230 by a sensor and then controls the vacuum generator to shut down by the control system, it is more stable and reliable. In particular, when the lifting and lowering cycle of the push pin 210 is shorter, it can always ensure that the adsorption hole 222 forms negative pressure or closes within a reliable time.

[0027] like Figure 4 As shown, in one embodiment, the first rotating block 310 is also provided with a vertical guide groove 313 that communicates with the spiral guide groove 312.

[0028] It should be noted that the vertical guide groove 313 is located at the upper end of the spiral guide groove 312. When the guide block 251 is located inside the spiral guide groove 312, as the guide block 251 slides vertically stably, it pushes against the inner wall of the spiral guide groove 312, thereby causing the first rotating block 310 to rotate. When the guide block 251 is located inside the vertical guide groove 313, the first rotating block 310 no longer rotates, allowing the first air passage 311 to be stably connected to the negative pressure air passage 110.

[0029] like Figure 2 , Figure 3 , Figure 6As shown, in one embodiment, the die bonder ejector pin device 10 further includes a second rotating block 320, a locking pin 330, a locking elastic element 340, and a reset elastic element 350. The second rotating block 320 is rotatably disposed within the ejector pin seat 100, and the second rotating block 320 is coaxially located on the side of the first rotating block 310 near the ejector pin cap 220, so that the ejector rod 230 passes through the second rotating block 320. A locking guide groove 321 is provided on the inner side wall of the second rotating block 320, and the groove width of the locking guide groove 321 is greater than the groove width of the vertical guide groove 313. The locking pin 330 is radially inserted into the second rotating block 320, and the locking elastic element 340 is respectively connected to the locking pin 330. The first rotating block 310 and the second rotating block 320 abut against each other. The locking elastic member 340 is used to push the locking post 330, so that one end of the locking post 330 passes through the locking guide groove 321 and extends into the vertical guide groove 313, thereby causing the first rotating block 310 to drive the second rotating block 320 to rotate synchronously. The second rotating block 320 is provided with a second air passage 322. When the locking guide groove 321 is aligned with the vertical guide groove 313, the second air passage 322 is connected to the first air passage 311. The reset elastic member 350 abuts against the ejector seat 100 and the second rotating block 320 respectively. The reset elastic member 350 is used to push the second rotating block 320 to have a tendency to rotate along the second direction.

[0030] It should be noted that the second rotating block 320 is rotatably mounted within the cavity 120 of the ejector seat 100. For example, the second rotating block 320, like the first rotating block 310, can also be mounted with a ball bearing fitted on its outer wall, allowing the ball bearing to fit into the inner wall of the cavity 120, thus enabling the second rotating block 320 to rotate stably relative to the ejector seat 100. Moreover, the second rotating block 320 is located on the side of the first rotating block 310 closest to the ejector cap 220, and the second rotating block 320 and the first rotating block 310 are coaxially mounted, allowing the ejector rod 230 to pass through the second rotating block 320 as well. The reset elastic member 350 abuts against both the second rotating block 320 and the ejector seat 100, causing the reset elastic member 350 to push the second rotating block 320 with a tendency to rotate in the second direction, that is, the second rotating block 320 is pushed by the reset elastic member 350 to have a tendency to rotate in the counterclockwise direction. The vertical guide groove 313 of the first rotating block 310 extends through the second rotating block 320. The second rotating block 320 has a radially arranged locking sliding hole, which communicates with the locking guide groove 321. The locking pin 330 slides through the locking sliding hole. The reset elastic element 350 abuts against both the locking pin 330 and the second rotating block 320, causing the reset elastic element 350 to push against the locking pin 330, allowing part of the locking pin 330 to protrude through the locking guide groove 321. When the locking guide groove 321 aligns with the vertical guide groove 313, the locking pin 330 extends into the vertical guide groove 313, thereby locking the second rotating block 320 and the first rotating block 310 together and rotating synchronously. When the locking guide groove 321 and the vertical guide groove 313 are not aligned, the locking pin 330 abuts against the outer wall of the first rotating block 310. In this case, the second rotating block 320 and the first rotating block 310 can rotate relative to each other. Thus, under the elastic thrust of the reset elastic element 350, the locking pin 330 always tends to protrude out of the locking guide groove 321. Only when the first rotating block 310 rotates to align the vertical guide groove 313 with the locking pin 330, and at this time the vertical guide groove 313 is also aligned with the locking guide groove 321, will the locking pin 330 extend into the vertical guide groove 313. At this time, when the first rotating block 310 rotates, it will simultaneously drive the second rotating block 320 to rotate. The second rotating block 320 has a second air passage 322. When the locking pin 330 protrudes out of the locking guide groove 321 to extend into the vertical guide groove 313, the second air passage 322 will remain connected with the first air passage 311. When the second air passage 322, the first air passage 311, and the negative pressure air passage 110 are connected in sequence, the negative pressure outside the negative pressure air passage 110 will act on the adsorption hole 222.

[0031] In one embodiment, the locking pin 330 and the reset elastic member 350 are inserted into the locking slide hole one after the other, and then the locking slide hole is blocked with a plug cap so that the reset elastic member 350 holds the plug cap, thus allowing the locking pin 330 and the reset elastic member 350 to be installed.

[0032] like Figure 7As shown, the working principle of the above embodiment will be explained below. When the push rod 230 is at the lowest point A, the second rotating block 320 is held in its extreme position by the reset elastic member 350, tending to rotate counterclockwise; at the same time, the locking pin 330 is pushed out of the locking guide groove 321 by the locking elastic member 340 and inserted into the vertical guide groove 313; at the same time, the second air passage 322 remains connected to the first air passage 311; at the same time, the first air passage 311 is misaligned with the negative pressure air passage 110. When the push pin drive member 240 drives the push rod 230 to rise, the guide block 251 pushes the spiral guide groove 312, causing the first rotating block 310 to rotate clockwise. Since the second rotating block 320 is locked together with the first rotating block 310 by the locking pin 330, the second rotating block 320 will rotate clockwise synchronously with the first rotating block 310. When the first air passage 311 connects with the negative pressure air passage 110, that is, when point C1 is reached, the negative pressure air passage 110, the first air passage 311, and the second air passage 322 are connected in sequence, so that the adsorption hole 222 forms a negative pressure suction to adsorb and fix the blue film. When point C1 is reached, the guide block 251 enters the vertical guide groove 313 from the spiral guide groove 312, and the first spiral block 310 stops rotating. Therefore, the negative pressure air passage 110, the first air passage 311, and the second air passage 322 remain stably connected. When the push rod 230 continues to rise and reaches point D1, the push pin 210 begins to pass through the pin outlet 221 to lift the wafer. When the guide block 251 slides along the vertical guide groove 313 and enters the locking guide groove 321, it reaches point E1. When the guide block 251 continues to slide along the vertical guide groove 313 and the locking guide groove 321 until it pushes the locking pin 330 to exit from the vertical guide groove 313, this is point F1. At this time, since the locking pin 330 no longer locks the vertical guide groove 313, and the groove width of the locking guide groove 321 is greater than that of the vertical guide groove 313, the second rotating block 320 is pushed by the reset elastic member 350 and rotates in the counterclockwise direction, so that the locking pin 330 abuts against the outer wall of the first rotating block 310. However, since the guide block 251 passes through the vertical guide groove 313 and the locking guide groove 321, the second rotating block 320 is still locked and almost stationary with the first rotating block 310. That is, the second air passage 322 is still connected with the first air passage 311, so the adsorption hole 222 still maintains negative pressure and forms suction.Then, the push rod 230 continues to rise until it reaches the highest point B. Then, the push rod 230 (push pin 210) begins to descend. First, the guide block 251 passes through the locking post 330 to reach point F2, and then reaches point E2. At this time, as the guide block 251 exits from the locking guide groove 321, since the locking post 330 no longer extends into the vertical guide groove 313, the second rotating block 320 is pushed by the reset elastic member 350 and reset counterclockwise to the limit position. Therefore, the second air channel 322 is misaligned with the first air channel 311 and closes. The suction hole 222 no longer forms a negative pressure suction force. When the push pin 210 retracts from the needle outlet 221 into point D2, since the blue film is no longer adsorbed and fixed, the push pin 210 also retracts into the push pin cap 220. Therefore, the push pin device and the wafer disk can be activated and transferred to each other, so that the push pin 210 is aligned with the next wafer, preparing for the next lifting cycle of the push pin 210 in advance. As the push rod 230 continues to descend to the lowest point A, the guide block 251 re-enters the spiral guide groove 312, causing the first spiral block 310 to rotate counterclockwise. The first air passage 311 and the negative pressure air passage 110 are misaligned. When the push rod 230 descends to the lowest point A, since the second spiral block 320 has already rotated counterclockwise to its limit position at point F2, the second spiral block 320 is essentially different. As the first spiral block 310 rotates counterclockwise, the vertical guide groove 313 eventually aligns with the locking guide groove 321 again. The locking pin 330 is then pushed by the locking elastic element 340, passing through the locking guide groove 321 again and entering the vertical guide groove 313. The second spiral block 320 and the first spiral block 310 are then locked together. In the next upward cycle of the push rod 230, the first spiral block 310 can again drive the second spiral block 320 to rotate clockwise synchronously.

[0033] Thus, the die bonder pin device 10 of the above-mentioned scheme can further compress the time for forming negative pressure. Moreover, by cutting off the negative pressure suction in advance, after the pin 210 retracts into the pin cap 220, the pin device and the wafer disk can begin to change positions relative to each other. Compared with the previous embodiment, it can more effectively reduce the adsorption time of the blue film and improve the wafer pick-up efficiency.

[0034] like Figure 8As shown, it should be noted that the width of the locking guide groove 321 is greater than the width of the vertical guide groove 313, which is the key to realizing the above function. In this way, it can be ensured that when the guide block 251 slides along the vertical guide groove 313, the guide block 251 can accurately slide into the locking guide groove 321. On the other hand, when the guide block 251 pushes against the locking post 330, since the diameter of the guide block 251 is adapted to the vertical guide groove 313, the diameter of the guide block 251 is smaller than the groove width of the locking guide groove 321. Therefore, it can be ensured that after the second rotating block 320 rotates counterclockwise by a small angle, the guide block 251 abuts against the other inner wall of the locking guide groove 321. At the same time, the misalignment distance of the second rotating block 320 can ensure that the locking post 330 is abutted against the outer wall of the first rotating block 310. After the guide block 251 reaches point E2, the second rotating block 320 is no longer locked by the guide block 251 and the locking post 330, so it can be stably rotated counterclockwise to reset.

[0035] like Figure 6 As shown, in one embodiment, an extension block 360 is provided on the outer wall of the second rotating block 320, and a groove 121 is formed on the inner wall of the cavity 120. The extension block 360 extends into the groove 121, and a reset elastic member 350 is located in the groove 121, such that the reset elastic member 350 abuts against the extension block 360 and the inner wall of the groove 121 respectively, causing the reset elastic member 350 to push against the extension block 360, thereby causing the second rotating block 320 to have a tendency to rotate counterclockwise. In one embodiment, two extension blocks 360 are provided, and the two extension blocks 360 are respectively located on the opposite outer walls of the second rotating block 320. Each extension block 360 is provided with a reset elastic member 350 for pushing, so that the second rotating block 320 can be subjected to a stable pushing force.

[0036] like Figure 2 and Figure 3 As shown, in one embodiment, a linear bearing 261 is provided on the inner wall of the cavity 120 at the upper position of the push rod 230, and a guide block 262 is provided at the lower position of the push rod 230. The guide block 262 has a guide sliding hole 2621, and a guide groove 2622 is provided on the inner walls of the opposing sides of the guide sliding hole 2621. An integrally formed guide protrusion 252 is provided on the outer walls of the push rod 230 at the positions of the guide grooves 2622. The push rod 230 fits through the guide sliding hole 2621, and the two guide protrusions 252 fit through the two guide grooves 2622. Thus, the guide grooves 2622 limit and guide the guide protrusions 252, ensuring that the push rod 230 stably slides up and down relative to the ejector seat 100 without rotating. In one embodiment, the linear bearing 261 has a hollow structure along the axial direction, which ensures that the second air passage 322 is connected to the adsorption hole 222.

[0037] like Figure 2 , Figure 3 As shown, a first sealing ring 271 is respectively provided between the first rotating block 310 and the cavity 120, and on the upper and lower sides of the negative pressure air passage 110. The first sealing rings 271 are in close contact with the inner sidewalls of the first rotating block 310 and the cavity 120. Further, in one embodiment, two second sealing rings 272 are also provided between the first rotating block 310 and the second rotating block 320, so that the second air passage 322 is located between the two second sealing rings 272. Further, in one embodiment, an inner sealing ring 273 and an outer sealing ring 274 are coaxially provided on the side of the second rotating block 320 away from the first rotating block 310. The opening of the second air passage 322 is located between the inner sealing ring 273 and the outer sealing ring 274. The inner sealing ring 273 is sleeved with the push rod 230, and the outer sealing ring 274 is in close contact with the push pin seat 100. Specifically, the outer sealing ring 274 is in close contact with the inner sidewall of the cavity 120. For example, the first sealing ring 271, the second sealing ring 272, the inner sealing ring 273, and the outer sealing ring 274 can use existing aramid fabric-reinforced sealing rings, ceramic sealing rings, or PTFE-reinforced carbon fiber sealing rings, as long as they have both sealing and wear-resistant properties.

[0038] like Figure 2 , Figure 3 As shown, in one embodiment, a baffle 275 is also provided inside the ejector seat 100. An inner elastic element 276 and an outer elastic element 277 are provided on the side of the baffle 275 near the second rotating block 320. The inner elastic element 276 abuts against the inner sealing ring 273, and the outer elastic element 277 abuts against the outer sealing ring 274.

[0039] Thus, by pushing the inner sealing ring 273 and the outer sealing ring 274 respectively by the inner elastic element 276 and the outer elastic element 277, good airtightness is ensured between the second rotating block 320 and the inner wall of the cavity 120, so that the negative pressure air passage 110 can form a stable negative pressure suction force in the adsorption hole 222 through the first air passage 311 and the second air passage 322.

[0040] like Figure 3 As shown, in one embodiment, a first sealing element 280 is provided on one end of the first air passage 311 near the negative pressure air passage 110. When the first rotating block 310 rotates to make the first air passage 311 misaligned with the negative pressure air passage 110, the inner sidewall of the ejector seat 100 pushes against the first sealing element 280, thereby making the first sealing element 280 seal the first air passage 311.

[0041] It should be noted that the first rotating block 310 is rotatably mounted in the cavity 120 via a ball bearing. Therefore, there will inevitably be a gap between the outer peripheral wall of the first rotating block 310 and the cavity 120. When the first rotating block 310 rotates, causing the first air passage 311 to misalign with the negative pressure air passage 110, in order to prevent negative pressure from being transmitted through the gap (the vertical direction is sealed by the first sealing ring 271 to form a closed space), a first sealing element 280 is installed at the end of the first air passage 311 near the negative pressure air passage 110. When the first rotating block 310 rotates, the first sealing element 280 can reliably seal the first air passage 311.

[0042] like Figure 3 , Figure 9 , Figure 10 As shown, in one embodiment, the first sealing member 280 includes an air guide cylinder 281, a plug rod 282, and a sealing elastic member 283. The air guide cylinder 281 is disposed in the first air passage 311, and the plug rod 282 is coaxially inserted into the air guide cylinder 281. A plug 284 is provided on one end of the plug rod 282 near the negative pressure air passage 110. The sealing elastic member 283 abuts against the plug rod 282 and the air guide cylinder 281 respectively. The sealing elastic member 283 is used to push the plug rod 282 so that the plug 284 tends to move away from the first air passage 311.

[0043] It should be noted that the air guide tube 281 is screwed into the first air passage 311. The end of the air guide tube 281 near the negative pressure air passage 110 has an inverted conical surface. Correspondingly, the end of the plug 284 near the plug rod 282 has an inverted conical surface. Thus, when the first rotating block 310 rotates, the inner wall of the cavity 120 presses against the plug 284, thereby blocking the air guide tube 281 and preventing the first air passage 311 from connecting with the negative pressure air passage 110.

[0044] like Figure 3 , Figure 9 , Figure 10 As shown, in one embodiment, a first ball bearing 285 is rotatably disposed on the end of the plug 284 away from the plug rod 282.

[0045] It should be noted that, in order to reduce the friction between the plug 284 and the inner wall of the cavity 120, a first ball bearing 285 is rotatably installed at the end of the plug 284, so that the first ball bearing 285 rolls against the inner wall of the cavity 120.

[0046] In one embodiment, a second sealing element is provided on the end of the second air passage 322 near the first rotating block 310, and the structure of the second sealing element is identical to that of the first sealing element. Thus, when the second rotating block 320 rotates relative to the first rotating block 310, causing the second air passage 322 to misalign with the first air passage 311, the second sealing element can stably seal the second air passage 322. Since the structure of the second sealing element is identical to that of the first sealing element 280, it will not be described further here.

[0047] like Figure 2 , Figure 3 As shown, in one embodiment, a positioning ring 291 is coaxially disposed between the first rotating block 310 and the second rotating block 320. A plurality of second balls 292 are rotatably disposed on the positioning ring 291, and each second ball 292 rolls into contact with the first rotating block 310 and the second rotating block 320 respectively.

[0048] It should be noted that, in order to avoid frictional contact between the first rotating block 310 and the second rotating block 320, and to reduce the frictional force between them, a positioning ring 291 is coaxially mounted between the first rotating block 310 and the second rotating block 320. Multiple second rolling balls 292 are rotatably mounted at equal intervals on the positioning ring 291, so that each second rolling ball 292 rolls against both the first rotating block 310 and the second rotating block 320. In one embodiment, annular grooves for receiving the second rolling balls 292 are provided at corresponding positions on the first rotating block 310 and the second rotating block 320, so that each second rolling ball 292 on the positioning ring 291 rolls within the annular grooves. This ensures that each second rolling ball 292 rolls stably between the first rotating block 310 and the second rotating block 320.

[0049] like Figure 11 , Figure 12 As shown, in one embodiment, the ejector pin assembly 200 further includes a clamping seat 2100. The clamping seat 2100 includes a first seat body 2110 and a locking cap 2120. The first seat body 2110 is disposed at the top end of the ejector rod 230. The top of the first seat body 2110 has two intersecting slots so that the top of the first seat body 2110 forms four first clamping blocks 2111. The ejector pin 210 is disposed between the four first clamping blocks 2111. The locking cap 2120 is screwed to each of the first clamping blocks 2111 so that the four first clamping blocks 2111 together clamp the ejector pin 210.

[0050] It should be noted that the bottom end of the first seat 2110 is fixedly installed on the top end of the push rod 230. For example, the first seat 2110 is fixedly installed on the push rod 230 by a nut. When the push pin 210 is placed vertically on the four first clamping blocks 2111 and the locking cap 2120 is screwed to the four first clamping blocks 2111, the four first clamping blocks 2111 together clamp and fix the push pin 210.

[0051] like Figure 11 , Figure 12 As shown, in one embodiment, multiple ejector pins 210 are provided, and the clamping base 2100 also includes a second base 2130. The second base 2130 includes four second clamping blocks 2131. The second base 2130 is inserted from the bottom end of the first base 2110, so that the four first clamping blocks 2111 and the four second clamping blocks 2131 are distributed alternately in sequence, so that any two adjacent first clamping blocks 2111 clamp an ejector pin 210 with one of the second clamping blocks 2131.

[0052] It should be noted that when multiple ejector pins 210 need to be fixed simultaneously to lift a large chip, the second base 2130 can be inserted from the bottom end of the first base 2110, so that the first clamping blocks 2111 and the second clamping blocks 2131 are staggered. In this way, in addition to the four first clamping blocks 2111 stably clamping one ejector pin 210, any two adjacent first clamping blocks 2111 and one of the second clamping blocks 2131 can clamp and fix one ejector pin 210. When the locking cap 2120 is screwed and fixed to each of the first clamping blocks 2111 and the second clamping blocks 2131, each ejector pin 210 is reliably clamped and fixed.

[0053] In one embodiment, the locking elastic element 340, the reset elastic element 350, the inner elastic element 276, the outer elastic element 277, and the sealing elastic element 283 are all springs.

[0054] The above-described embodiments are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention patent. Unless otherwise specifically defined, the installation / fixing / setting mentioned in this invention can be understood as including, but not limited to, locking and fixing with screws / bolts, welding, or bonding with adhesives, wherein the adhesives used can be commercially available finished products. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A pick-up pin device of a die bonder, characterized by, include: A ejector seat, wherein a negative pressure air passage is provided on the ejector seat, and the negative pressure air passage is used to continuously communicate with a vacuum generator; A ejector assembly includes an ejector pin, an ejector pin cap, an ejector rod, and an ejector pin drive. The ejector pin cap is disposed on the ejector pin seat and has a needle outlet hole and an adsorption hole. The ejector rod is slidably disposed on the ejector pin seat. The ejector pin drive is disposed on the ejector pin seat and its output shaft is connected to the bottom end of the ejector rod. The ejector pin is disposed on the top end of the ejector rod and is aligned with the needle outlet hole. The first rotating block is rotatably disposed in the ejector pin seat, and the ejector rod passes through the first rotating block. The first rotating block has a first air passage and a spiral guide groove. A guide block is disposed on the outer side wall of the ejector rod. The guide block is adapted to be accommodated in the spiral guide groove. The first rotating block also has a vertical guide groove that communicates with the spiral guide groove. The die bonder ejector pin device further includes a second rotating block, a locking pin, a locking elastic element, and a reset elastic element. The second rotating block is rotatably disposed within the ejector pin seat, and the second rotating block is coaxially located on the side of the first rotating block near the ejector pin cap, so that the ejector rod passes through the second rotating block. A locking guide groove is formed on the inner side wall of the second rotating block, and the groove width of the locking guide groove is greater than the groove width of the vertical guide groove. The locking pin passes radially through the second rotating block. The locking elastic element abuts against the locking pin and the second rotating block respectively. The locking elastic element is used to push the locking pin, so that one end of the locking pin passes through the locking guide groove and extends into the vertical guide groove, thereby causing the first rotating block to drive the second rotating block to rotate synchronously. A second air passage is formed on the second rotating block. The reset elastic element abuts against the ejector pin seat and the second rotating block respectively. The reset elastic element is used to push the second rotating block with a tendency to rotate along a second direction. When the ejector pin drive is used to drive the ejector rod to rise, the guide block pushes against the inner wall of the spiral guide groove, causing the first rotating block to rotate along the first direction. This allows the negative pressure air passage, the first air passage, and the adsorption hole to be connected in sequence. When the positioning guide groove is aligned with the vertical guide groove, one end of the locking pin passes through the positioning guide groove and extends into the vertical guide groove. This causes the first rotating block to drive the second rotating block to rotate synchronously, and the second air passage is connected to the first air passage. This allows the negative pressure air passage, the first air passage, the second air passage, and the adsorption hole to be connected in sequence, so that the negative pressure outside the negative pressure air passage can act on the adsorption hole.

2. The die bonder ejector pin device according to claim 1, characterized in that, A first sealing element is provided at one end of the first air passage near the negative pressure air passage. When the first rotating block rotates to cause the first air passage to be misaligned with the negative pressure air passage, the inner sidewall of the ejector seat pushes against the first sealing element, thereby sealing the first air passage.

3. The die bonder ejector pin device according to claim 2, characterized in that, The first sealing element includes an air guide cylinder, a plug rod, and a sealing elastic element. The air guide cylinder is disposed in the first air passage, and the plug rod is coaxially inserted into the air guide cylinder. A plug is provided on one end of the plug rod near the negative pressure air passage. The sealing elastic element abuts against the plug rod and the air guide cylinder respectively. The sealing elastic element is used to push the plug rod so that the plug tends to move away from the first air passage.

4. The die bonder ejector pin device according to claim 3, characterized in that, A first ball bearing is rotatably mounted on the end of the plug away from the plug rod.

5. The die bonder ejector pin device according to claim 1, characterized in that, A positioning ring is coaxially disposed between the first rotating block and the second rotating block. A plurality of second balls are rotatably disposed on the positioning ring, and each second ball rolls into contact with the first rotating block and the second rotating block respectively.

6. The die bonder ejector pin device according to claim 1, characterized in that, An inner sealing ring and an outer sealing ring are coaxially arranged on the side of the second rotating block away from the first rotating block. The opening of the second air passage is located between the inner sealing ring and the outer sealing ring. The inner sealing ring is sleeved with the push rod, and the outer sealing ring is in close contact with the push pin seat.

7. The die bonder ejector pin device according to claim 6, characterized in that, The ejector pin seat is also provided with a baffle, and an inner elastic element and an outer elastic element are provided on the side of the baffle near the second rotating block. The inner elastic element abuts against the inner sealing ring, and the outer elastic element abuts against the outer sealing ring.

8. The die bonder ejector pin device according to claim 1, characterized in that, The ejector pin assembly also includes a clamping seat, which includes a first seat body and a locking cap. The first seat body is disposed at the top end of the ejector rod. The top of the first seat body has two intersecting slots to form four first clamping blocks. The ejector pin is disposed between the four first clamping blocks. The locking cap is screwed to each of the first clamping blocks so that the four first clamping blocks together clamp the ejector pin.

9. The die bonder ejector pin device according to claim 8, characterized in that, The ejector pins are provided in multiple ways, and the clamping seat also includes a second seat body. The second seat body includes four second clamping blocks. The second seat body is inserted into the bottom end of the first seat body, so that the four first clamping blocks and the four second clamping blocks are distributed alternately in sequence, so that any two adjacent first clamping blocks and one of the second clamping blocks clamp an ejector pin.

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