A millimeter-wave active phased array

Abstract

This invention discloses a millimeter-wave active phased array, comprising a metal carrier plate, a first plastic outer cover, a first circuit board layer, and an antenna radiating layer. The first plastic outer cover serves as an antenna radome, enclosing a first receiving cavity with the metal carrier plate. The first plastic outer cover is integrally formed with a first plastic buckle and plastic rivets. The first circuit board layer includes a first PCB structure, a subarray feed combining network, an antenna feed layer, a power supply circuit, a control circuit, and a first radio frequency chip. The subarray feed combining network, the antenna feed layer, the power supply circuit, and the control circuit are integrated on the first PCB structure. The first radio frequency chip is located on the side of the first PCB structure facing the metal carrier plate. The antenna radiating layer includes a plastic bracket and a radiating patch, with the radiating patch located on the side of the plastic bracket facing the first plastic outer cover. The active phased array of this invention is simple to assemble and has low cost.

Description

Technical Field

[0001] This invention relates to the field of communication radar technology, and in particular to a millimeter-wave active phased array. Background Technology

[0002] With the continuous advancement of millimeter-wave technology in recent years, millimeter-wave active phased arrays have been widely applied in satellite communications, radar, telemetry and control, microwave remote sensing, and other fields. The traditional brick-and-tile architecture of millimeter-wave active phased arrays involves separating functional modules and interconnecting them via connectors. This approach is not conducive to high-density integration, low-profile design, and lightweight design. To improve integration, reduce profile, and lower weight, various chip-based and wafer-level packaging technologies (e.g., AIP, CMOS, SOC, 3D-SIP, etc.) have been used in the development of millimeter-wave active phased arrays. This has, to some extent, solved the integration and cost issues of millimeter-wave active phased arrays at the device level. Furthermore, the use of multilayer printed circuit board (PCB) integration technology, integrating antenna arrays, feed networks, wave control, and power supply onto a single multilayer PCB, eliminates most RF and low-frequency interconnects. This, to some extent, addresses the low integration of millimeter-wave active phased arrays at the component level, effectively reducing costs.

[0003] Currently, the cost of phased array systems remains high. Besides the high cost of the components themselves, while multilayer PCBs offer high integration, their material costs are relatively high, and they typically require multiple PCB laminations (≥3 times) or special processing techniques, resulting in high manufacturing costs. To address this issue, research has been conducted on low-cost phased array antennas. Patent CN117039433B proposes a phased array antenna that uses inexpensive PET and PVC materials and thermal bonding processes to replace the expensive high-frequency dielectric substrate and multilayer PCB lamination process. This allows the phased array antenna to achieve broadband and wide-angle scanning capabilities while significantly reducing its cost, thus partially solving the high manufacturing cost problem faced by existing phased array antennas. Patent CN120341558A, in addition to using some low-cost materials to replace part of the high-frequency dielectric substrate, proposes an integrated design and connection of the radiating patch and radome to form an integrated structure, achieving wave transmission, bandwidth broadening, and impedance matching. This reduces material and processing costs while comprehensively considering the performance of the antenna and radome.

[0004] However, the assembly of the entire phased array system remains quite complex. This is because several key components of millimeter-wave active phased arrays are not fully integrated. Core components such as radomes, multilayer PCBs, and structural parts are usually still designed separately and then assembled together using metal screws. To ensure installation reliability, a large number of screws are typically used. Furthermore, although some low-cost materials are used to replace some radiating patches, reducing the material and processing costs of multilayer PCB lamination, the multilayer PCB still integrates the antenna feed layer, common-end feed network, wave control, and power supply functions. Its design remains complex and typically requires three lamination processes, resulting in high processing costs.

[0005] In summary, the problems of complex assembly and high cost of millimeter-wave active phased arrays urgently need to be addressed. Summary of the Invention

[0006] Therefore, the present invention provides a millimeter-wave active phased array that is simple to assemble and has a low cost.

[0007] To address the aforementioned technical problems, this invention provides a millimeter-wave active phased array, comprising: A metal carrier plate has a first surface and a second surface facing away from each other in a first direction, the first direction being consistent with the thickness direction of the metal carrier plate; A first plastic cover is disposed on the first surface side of the metal carrier plate. The first plastic cover serves as an antenna cover, and its opening is connected to the edge of the metal carrier plate to enclose a first receiving cavity. The first plastic cover is integrally formed with a first plastic buckle and a plastic rivet. The first circuit board layer includes a first PCB structure, a subarray feed synthesis network, an antenna feed layer, a power supply circuit, a control circuit, and a first radio frequency chip. The first PCB structure is disposed within the first accommodating cavity and close to the metal carrier plate. The subarray feed synthesis network, the antenna feed layer, the power supply circuit, and the control circuit are integrated on the first PCB structure. The subarray feed synthesis network is used for synthesizing subarray-level radio frequency signals. The antenna feed layer is used for transmitting radio frequency signals. The power supply circuit is used for providing power. The control circuit is used for issuing control signals. The first radio frequency chip is disposed on the side of the first PCB structure facing the metal carrier plate, and the first radio frequency chip is connected to the metal carrier plate through a first thermal pad. The first radio frequency chip is used for signal transmission, reception, and modulation. The antenna radiating layer includes a plastic support and a radiating patch. The plastic support is disposed in the first receiving cavity and close to the first plastic cover. The radiating patch is disposed on the side of the plastic support facing the first plastic cover. The radiating patch is used to radiate and receive electromagnetic signals. The first plastic buckle is locked to the metal carrier plate, the plastic rivet is locked to the first PCB board structure and the plastic bracket, the subarray feed synthesis network, the first radio frequency chip, the antenna feed layer and the radiating patch transmit radio frequency signals in sequence, the power supply circuit is connected to the first radio frequency chip to transmit power, and the control circuit is connected to the first radio frequency chip to transmit control signals.

[0008] Furthermore, the opening of the first plastic cover is provided with a first sealing groove, and the first surface of the metal carrier plate is provided with a first protruding ring, the first protruding ring being embedded in the first sealing groove and an adhesive being provided between the two.

[0009] Furthermore, the surface of the first plastic cover facing the radiating patch is provided with an air blind cavity, which is configured as a wide-angle matching layer that can improve the radiation performance of the antenna radiating layer.

[0010] Furthermore, the antenna radiating layer includes two layers of plastic supports and two layers of radiating patches. The two layers of plastic supports are a first plastic plate and a second plastic plate, respectively. The first plastic plate is disposed between the first plastic cover and the second plastic plate. The two layers of radiating patches are a first radiating patch and a second radiating patch, respectively. The first radiating patch is disposed on the first plastic plate, and the second radiating patch is disposed on the second plastic plate.

[0011] Furthermore, the first radiating patch includes a first film and a first metal pattern disposed on the first film, the first metal pattern being a circular pattern with four evenly distributed notches; the second radiating patch includes a second film and a second metal pattern disposed on the second film, the second metal pattern being a circular pattern; the first plastic plate has a first perforation hole facing the first metal pattern, and the second plastic plate has a second perforation hole facing the second metal pattern.

[0012] Furthermore, the first surface of the metal carrier plate is provided with a first positioning pin for positioning with the first circuit board layer and the antenna radiating layer.

[0013] Furthermore, the phased array also includes: The second plastic cover is disposed on the second surface side of the metal carrier plate. The opening of the second plastic cover is connected to the edge of the metal carrier plate to enclose the second receiving cavity. The second plastic cover is integrally formed with a second plastic buckle. The second circuit board layer includes a second PCB structure, a combining power supply network, and a second radio frequency chip. The second PCB structure is disposed within the second receiving cavity and close to the metal carrier plate. The second PCB structure is connected to the first PCB structure via a flexible connector. The combining power supply network is integrated on the second PCB structure. The second radio frequency chip is disposed on the side of the second PCB facing the metal carrier plate. The second radio frequency chip is connected to the metal carrier plate via a second thermal pad. The second radio frequency chip is used to realize signal transmission, reception, control, and amplification. The second plastic buckle is locked to the metal carrier plate, the plastic rivet passes through the metal carrier plate and is locked to the second PCB board structure, the combined power supply network, the second RF chip and the sub-array power supply network transmit RF signals in sequence, the power supply circuit is connected to the second RF chip to transmit power, and the control circuit is connected to the second RF chip to transmit control signals.

[0014] Furthermore, the opening of the second plastic cover is provided with a second sealing groove, and the second surface of the metal carrier plate is provided with a second protruding ring, the second protruding ring being embedded in the second sealing groove and an adhesive being provided between the two.

[0015] Furthermore, a metal shielding layer is provided on the surface of the second plastic outer cover facing the interior of the second receiving cavity.

[0016] Furthermore, the second surface of the metal carrier plate is provided with a second positioning pin for positioning with the second circuit board layer.

[0017] The technical solution of the present invention has the following advantages compared with the prior art: 1) The millimeter-wave active phased array of the present invention uses plastic as the material for the radome, plastic snap-fit ​​is used to connect the radome to the metal carrier plate, plastic rivet is used to connect the radome to the antenna radiating layer and the first circuit board layer, and plastic rivet is used to connect the antenna radiating layer and the antenna feed layer. The antenna radiating layer is separated from the antenna feed layer and the antenna radiating layer uses a plastic bracket. The active phased array is simple to assemble and has a low cost. 2) The millimeter-wave active phased array of the present invention achieves mutual positioning, sealing connection and mutual fixation of the first plastic outer cover and the metal carrier plate by setting the first sealing groove and the first convex ring; 3) The millimeter-wave active phased array of the present invention, by setting an air blind cavity on the inner surface of the first plastic outer cover, fully considers the influence of the radome on the antenna radiation performance, and uses the radome loading as a wide-angle matching layer to improve the antenna radiation performance; 4) The millimeter-wave active phased array of the present invention has an antenna radiating layer consisting of two layers of plastic plates and two layers of radiating patches, which has a simple structure and realizes the radiation of electromagnetic signals; 5) The structure of the first plastic plate, the second plastic plate, the first radiating patch, and the second radiating patch in the millimeter-wave active phased array of the present invention increases the bandwidth of the antenna radiating layer. 6) The millimeter-wave active phased array of the present invention has a first positioning pin on the first surface of the metal carrier plate, which facilitates the rapid and accurate assembly of the antenna radiating layer and the first circuit board layer, improves assembly efficiency and reduces production costs. 7) The millimeter-wave active phased array of the present invention integrates the combined feed network on the second PCB board structure, separates it from the first PCB board structure, reduces the number of laminations, effectively reduces the design risk of multilayer PCB boards, and reduces costs; 8) The millimeter-wave active phased array of the present invention achieves mutual positioning, sealing connection and mutual fixation of the second plastic cover and the metal carrier plate by setting the second sealing groove and the second convex ring; 9) The millimeter-wave active phased array of the present invention has a metal shielding layer on the inner wall of the second plastic outer cover, which can effectively shield electromagnetic signal leakage and crosstalk on the side near the combining feed network. 10) The millimeter-wave active phased array of the present invention has a second positioning pin on the second surface of the metal carrier plate, which facilitates the rapid and accurate assembly of the second circuit board layer, improves assembly efficiency, and reduces production costs. Attached Figure Description

[0018] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the millimeter-wave active phased array disclosed in Embodiment 1 of the present invention; Figure 2 This is a partially enlarged view of the millimeter-wave active phased array disclosed in Embodiment 1 of the present invention; Figure 3 This is a schematic diagram of the first plastic outer cover disclosed in Embodiment 1 of the present invention; Figure 4 This is a schematic diagram of the first plastic plate disclosed in Embodiment 1 of the present invention; Figure 5 This is a schematic diagram of the second plastic plate disclosed in Embodiment 1 of the present invention; Figure 6 This is a schematic diagram of the first radiating patch disclosed in Embodiment 1 of the present invention; Figure 7 This is a schematic diagram of the second radiating patch disclosed in Embodiment 1 of the present invention; Figure 8 This is a schematic diagram of the antenna feed layer disclosed in Embodiment 1 of the present invention; Figure 9 This is a schematic diagram of the control circuit disclosed in Embodiment 1 of the present invention; Figure 10 This is a schematic diagram of the power supply circuit disclosed in Embodiment 1 of the present invention; Figure 11 This is a schematic diagram of the subarray feeding synthesis network disclosed in Embodiment 1 of the present invention; Figure 12 This is a schematic diagram of the combined feeder network disclosed in Embodiment 1 of the present invention; Figure 13 This is a schematic diagram of the second plastic outer cover disclosed in Embodiment 1 of the present invention; Figure 14 This is a schematic diagram of the 8×8 local subarray simulation model disclosed in Embodiment 1 of the present invention; Figure 15 This is the simulated scanning pattern of the 8×8 local subarray F0, Phi=0deg disclosed in Embodiment 1 of the present invention; Figure 16 This is the simulated scanning pattern of the 8×8 local subarray F0, Phi=90deg disclosed in Embodiment 1 of the present invention; Figure 17 This is a schematic diagram of the millimeter-wave active phased array disclosed in Embodiment 2 of the present invention; Figure 18 This is a partially enlarged view of the millimeter-wave active phased array disclosed in Embodiment 2 of the present invention; Figure 19 This is a partially enlarged view of the millimeter-wave active phased array disclosed in Embodiment 3 of the present invention; Wherein, 1. Metal carrier plate; 11. First protruding ring; 12. First adhesive layer; 13. First positioning pin; 14. Second protruding ring; 15. Second adhesive layer; 16. Second positioning pin; 2. First plastic outer cover; 21. First plastic buckle; 22. Plastic rivet; 23. Air blind cavity; 3. First circuit board layer; 31. First PCB board structure; 32. First radio frequency chip; 33. First thermal pad; 4. Antenna radiating layer; 41. First plastic plate; 411. First perforation; 42. Second plastic plate; 421. Second perforation; 43. First radiating patch; 431. First diaphragm; 432. First metal pattern; 44. Second radiating patch; 441. Second diaphragm; 442. Second metal pattern; 5. Second plastic outer cover; 51. Second plastic buckle; 6. Second circuit board layer; 61. Second PCB board structure; 62. Second radio frequency chip; 63. Flexible connector; 64. Second thermal pad. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0021] Example 1: See Figures 1 to 16 As shown, this invention discloses an embodiment of a millimeter-wave active phased array.

[0022] Millimeter-wave active phased arrays include: The metal carrier plate 1 has a first surface and a second surface facing away from each other in a first direction, wherein the first direction is consistent with the thickness direction of the metal carrier plate 1. The first plastic cover 2 is disposed on the first surface side of the metal carrier plate 1. The first plastic cover 2 serves as an antenna cover, and its opening is connected to the edge of the metal carrier plate 1 to enclose the first receiving cavity. The first plastic cover 2 is integrally formed with a first plastic buckle 21 and a plastic rivet 22. The first circuit board layer 3 includes a first PCB board structure 31, a subarray feed synthesis network, an antenna feed layer, a power supply circuit, a control circuit, and a first radio frequency chip 32. The first PCB board structure 31 is disposed in the first accommodating cavity and close to the metal carrier plate 1. The subarray feed synthesis network, the antenna feed layer, the power supply circuit, and the control circuit are integrated on the first PCB board structure 31. The subarray feed synthesis network is used for synthesizing subarray-level radio frequency signals. The antenna feed layer is used for transmitting radio frequency signals. The power supply circuit is used for providing power. The control circuit is used for issuing control signals. The first radio frequency chip 32 is disposed on the side of the first PCB board structure 31 facing the metal carrier plate 1. The first radio frequency chip 32 is connected to the metal carrier plate 1 through a first thermal pad 33. The first radio frequency chip 32 is used for signal transmission, reception, and modulation. The antenna radiating layer 4 includes a plastic support and a radiating patch. The plastic support is disposed in the first receiving cavity and close to the first plastic outer cover 2. The radiating patch is disposed on the side of the plastic support facing the first plastic outer cover 2. The radiating patch is used to radiate and receive electromagnetic signals. The first plastic buckle 21 is locked to the metal carrier plate 1, the plastic rivet 22 is locked to the first PCB board structure 31 and the plastic bracket, the subarray feed synthesis network, the first radio frequency chip 32, the antenna feed layer and the radiating patch transmit radio frequency signals in sequence, the power supply circuit is connected to the first radio frequency chip 32 to transmit power, and the control circuit is connected to the first radio frequency chip 32 to transmit control signals.

[0023] In the above text, the metal carrier plate 1 is a metal plate that needs to have good structural strength and good thermal conductivity. It is connected to the first plastic cover 2 and in contact with the first radio frequency chip 32.

[0024] The first plastic cover 2 is made of a wave-transparent plastic material, such as PPS, PVC, or PTFE. The first plastic buckle 21 cooperates with the slot on the metal carrier plate 1 to lock the metal carrier plate 1 and the first plastic cover 2 together, forming a sealed first receiving cavity. The first plastic buckle 21 can be set as a cantilever elastic buckle, which locks itself to the slot on the metal carrier plate 1 through elastic deformation. The plastic rivet 22 passes through the through holes on the antenna radiating layer 4 and the first circuit board layer 3 to lock the first plastic cover 2, the antenna radiating layer 4, and the first circuit board layer 3 together. The plastic rivet 22 is initially cylindrical, which can be either a cylinder or a prism. The length of the plastic rivet 22 is designed according to the hot riveting fixing length. The head of the plastic rivet 22 is connected to the first plastic cover 2. After the tail of the plastic rivet 22 passes through multiple parts to be riveted, the tail of the plastic rivet 22 is expanded by the hot riveting process to form a limit and lock.

[0025] In the first circuit board layer 3, the first PCB board structure 31 is a multi-layer PCB board laminated together, integrating the aforementioned power supply circuit, control circuit, subarray feed synthesis network, and antenna feed layer. The subarray feed synthesis network is used for subarray-level RF signal synthesis, and the antenna feed layer is used to transmit the electromagnetic signals received by the radiating patch to the surface-mounted first RF chip 32. The power supply circuit and control circuit are used to control the operating state of the first RF chip 32. The first RF chip 32 is surface-mounted onto the first PCB board structure 31. The first RF chip 32 mainly includes RF core functional devices, control and drive devices, power management devices, and auxiliary and connection devices. The RF core functional devices are the foundation for the antenna board to realize phase control functions, responsible for RF signal amplification, transmission, reception, and filtering. The control and drive devices are responsible for generating precise control signals to drive the RF devices to achieve precise phase and amplitude adjustment, and are the execution center of the phase control logic. The power management devices are responsible for providing clean and stable voltage to ensure reliable system operation. The auxiliary and connection devices are responsible for ensuring the connection between the antenna board and the external system, clock synchronization, and signal integrity.

[0026] In antenna radiating layer 4, a plastic support serves as the load-bearing structure for the radiating patch. The material of the plastic support can be PVC, PTFE, or PPS, etc. The plastic support can be a completely solid structure or partially perforated, and the perforation pattern can be circular, rectangular, rhomboid, or other symmetrical shapes. The number of layers of plastic support and radiating patch is closely related to the antenna standing wave bandwidth and gain drop within the beam scanning range. The specific number of layers is determined by the design. The plastic support and radiating patch can be separable discrete components or integral components bonded together.

[0027] Specifically, the metal carrier plate 1 can support the first plastic cover 2, the first circuit board layer 3 and the antenna radiating layer 4, ensuring the structural strength of the phased array. The metal carrier plate 1 can conduct away the heat generated by the first radio frequency chip 32 during operation in a timely manner, achieving efficient heat dissipation of the phased array.

[0028] The first plastic cover 2 uses low-cost plastic material, reducing the material cost of the antenna cover. The first plastic cover 2 is connected to the metal carrier plate 1 by the first plastic clip 21 and to the first circuit board layer 3 and the antenna radiating layer 4 by the plastic rivets 22. Compared with the bolt and screw connection method, the cost is lower and the assembly efficiency is higher.

[0029] The first circuit board layer 3 includes a power supply circuit, a control circuit, a subarray feed synthesis network, and an antenna feed layer. This structure allows the number of pressing operations of the first PCB board structure 31 to be controlled to no more than 2 times, effectively reducing the production cost of the first circuit board layer 3.

[0030] The antenna radiating layer 4 uses a plastic support instead of the traditional high-frequency dielectric substrate, which reduces costs.

[0031] By using the above technical solution, the material of the radome is set to plastic, the connection method between the radome and the metal carrier plate is set to plastic snap-fit, the connection method between the radome and the antenna radiating layer and the first circuit board layer is set to plastic rivet, the antenna radiating layer is separated from the antenna feed layer and the antenna radiating layer adopts a plastic bracket, the assembly of the active phased array is simple and the cost is low.

[0032] In this embodiment, the opening of the first plastic cover 2 is provided with a first sealing groove (not shown in the figure), and the first surface of the metal carrier plate 1 is provided with a first protruding ring 11. The first protruding ring 11 is embedded in the first sealing groove and an adhesive is provided between the two.

[0033] In the above text, the first sealing groove is an annular groove that extends along the opening of the first plastic cover 2, and the first protruding ring 11 is an annular protrusion that extends along the edge of the metal carrier plate 1. The opening of the first plastic cover 2 abuts against the edge of the first surface of the metal carrier plate 1. The first sealing groove and the first protruding ring 11 are adapted to each other. When the first plastic cover 2 is fastened to the first surface of the metal carrier plate 1, the first protruding ring 11 is embedded in the first sealing groove. The adhesive can firmly bond the metal carrier plate 1 and the first plastic cover 2 together.

[0034] Specifically, the first sealing groove and the first convex ring 11 are interlocked, achieving initial positioning of the metal carrier plate 1 and the first plastic cover 2 during assembly. After the adhesive between the first sealing groove and the first convex ring 11 is cured, a first adhesive layer 12 is formed, which not only seals the gap between the metal carrier plate 1 and the first plastic cover 2, but also improves the connection reliability between the metal carrier plate 1 and the first plastic cover 2.

[0035] Through the above technical solution, by setting the first sealing groove and the first convex ring, the mutual positioning, sealing connection and mutual fixation of the first plastic cover and the metal carrier plate are realized.

[0036] In this embodiment, the surface of the first plastic outer cover 2 facing the radiation patch is provided with an air blind cavity 23, and the air blind cavity 23 is configured as a wide-angle matching layer that can improve the radiation performance of the radiation patch.

[0037] In the above description, the first plastic outer cover 2 has an inner surface facing the interior of the first receiving cavity, and the air blind cavity 23 is a groove on the inner surface of the first plastic outer cover 2, which can be circular, rhomboid, rectangular, etc. The inner surface of the first plastic outer cover 2 is densely covered with the aforementioned air blind cavities 23.

[0038] Specifically, the aforementioned air-blind cavity 23 mainly serves as the wide-angle matching layer of the antenna. The wide-angle matching layer is used to optimize the impedance matching and standing wave ratio structure of the phased array antenna during large-angle scanning, so as to increase the antenna's operating bandwidth and improve its wide-angle radiation performance.

[0039] The above technical solution, by setting an air blind cavity on the inner surface of the first plastic outer cover, fully considers the influence of the radome on the antenna radiation performance, and uses the radome loading as a wide-angle matching layer to improve the antenna radiation performance.

[0040] In this embodiment, the antenna radiating layer 4 includes two layers of plastic supports and two layers of radiating patches. The two plastic supports are a first plastic plate 41 and a second plastic plate 42, respectively. The first plastic plate 41 is disposed between the first plastic cover 2 and the second plastic plate 42. The two radiating patches are a first radiating patch 43 and a second radiating patch 44, respectively. The first radiating patch 43 is disposed on the first plastic plate 41, and the second radiating patch 44 is disposed on the second plastic plate 42.

[0041] In the above text, the thickness directions of the first plastic plate 41 and the second plastic plate 42 are both consistent with the first direction, and the thickness directions of the first radiating patch 43 and the second radiating patch 44 are both consistent with the first direction. The first radiating patch 43 is disposed between the first plastic plate 41 and the first plastic cover 2, and the second radiating patch 44 is disposed between the first plastic plate 41 and the second plastic plate 42.

[0042] Specifically, the first radiating patch 43, the first plastic plate 41, the second radiating patch 44, and the second plastic plate 42 are stacked in sequence and locked together by the aforementioned plastic rivets 22.

[0043] The above technical solution sets the antenna radiating layer to include two layers of plastic plates and two layers of radiating patches, which is simple in structure and realizes the radiation of electromagnetic signals.

[0044] In this embodiment, the first radiating patch 43 includes a first diaphragm 431 and a first metal pattern 432 disposed on the first diaphragm 431, wherein the first metal pattern 432 is a circular pattern with four evenly distributed notches; the second radiating patch 44 includes a second diaphragm 441 and a second metal pattern 442 disposed on the second diaphragm 441, wherein the second metal pattern 442 is a circular pattern; the first plastic plate 41 is provided with a first perforation 411 facing the first metal pattern 432, and the second plastic plate 42 is provided with a second perforation 421 facing the second metal pattern 442.

[0045] In the above text, the first film 431 and the second film 441 can be PET films, the first metal pattern 432 can be sprayed onto the first film 431, and the second metal pattern 442 can be sprayed onto the second film 441.

[0046] Specifically, the metal patch pattern of the second radiating patch 44 is circular, used to couple electromagnetic energy from the antenna feed layer and radiate it out. The metal pattern of the first radiating patch 43 is a circle with four symmetrical notches, expanding the operating bandwidth, and is also used to couple electromagnetic energy from the antenna feed layer and radiate it out. The second plastic plate 42 is located between the antenna feed layer and the second radiating patch 44, used to support the second radiating patch 44 and form a coupling cavity. The position of the second plastic plate 42 opposite to the second radiating patch 44 has a circular hollow pattern, used to reduce the Q value of the antenna and increase the antenna operating bandwidth. The first plastic plate 41 is located between the second radiating patch 44 and the first radiating patch 43, and its function is similar to that of the second plastic plate 42.

[0047] Through the above technical solution, the structure of the first plastic plate, the second plastic plate, the first radiating patch, and the second radiating patch increases the bandwidth of the antenna radiating layer.

[0048] In this embodiment, the first surface of the metal carrier plate 1 is provided with a first positioning pin 13 for positioning with the first circuit board layer 3 and the antenna radiation layer 4.

[0049] In the above description, the first positioning pin 13 is a columnar structure extending along the first direction, specifically a cylinder or a prism. The free end of the first positioning pin 13 away from the metal carrier plate 1 can be set as a cone shape to facilitate the guidance of the antenna radiating layer 4 and the first circuit board layer 3 during the assembly process of the metal carrier plate 1 with the antenna radiating layer 4 and the first circuit board layer 3. Both the first circuit board layer 3 and the antenna radiating layer 4 are provided with positioning holes that are adapted to the first positioning pin 13.

[0050] Specifically, when the antenna radiating layer 4 and the first circuit board layer 3 are assembled onto the metal carrier plate 1, they can be aligned with the positioning holes on the antenna radiating layer 4 and the first circuit board layer 3 by the first positioning pin 13, which facilitates the rapid assembly of the antenna radiating layer 4 and the first circuit board layer 3 with the metal carrier plate 1.

[0051] By using the above technical solution, a first positioning pin is set on the first surface of the metal carrier plate, which facilitates the rapid and accurate assembly of the antenna radiating layer and the first circuit board layer, improves assembly efficiency, and reduces production costs.

[0052] In this embodiment, the phased array further includes: The second plastic cover 5 is disposed on the second surface side of the metal carrier plate 1. The opening of the second plastic cover 5 is connected to the edge of the metal carrier plate 1 to enclose the second receiving cavity. The second plastic cover 5 is integrally formed with a second plastic buckle 51. The second circuit board layer 6 includes a second PCB structure 61 and a second radio frequency chip 62. The second PCB structure 61 is disposed in the second receiving cavity and close to the metal carrier plate 1. The second PCB structure 61 is connected to the first PCB structure 31 through an elastic connector 63. The combined power supply network is integrated on the second PCB structure 61. The combined power supply network is used to realize the combining and power splitting of radio frequency signals. The second radio frequency chip 62 is disposed on the side of the second PCB structure 61 facing the metal carrier plate 1. The second radio frequency chip 62 is connected to the metal carrier plate 1 through a second thermal pad 64. The second radio frequency chip 62 realizes signal transmission, reception, control and amplification. The second plastic buckle 51 is locked to the metal carrier plate 1, the plastic rivet 22 passes through the metal carrier plate 1 and is locked to the second PCB board structure 61, the combined power supply network, the second RF chip 62 and the sub-array power supply combined network transmit RF signals in sequence, the power supply circuit is connected to the second RF chip 62 to transmit power, and the control circuit is connected to the second RF chip 62 to transmit control signals.

[0053] In the above text, the second plastic cover 5 is made of plastic material, such as PPS, PVC, or PTFE. The second plastic buckle 51 cooperates with the slot on the metal carrier plate 1 to lock the metal carrier plate 1 and the second plastic cover 5 together, forming a sealed second receiving cavity. The second plastic buckle 51 can be set as a cantilever elastic buckle, which locks itself to the slot on the metal carrier plate 1 through elastic deformation.

[0054] In the second circuit board layer 6, the second PCB board structure 61 is a multilayer PCB board or a single-layer PCB board laminated together, with the number of laminations controlled to be no more than once. The second PCB board structure 61 integrates the aforementioned power combining network. The power combining network can be a 4-layer PCB board with a common terminal power combining network. The second RF chip 62 is mounted on the second PCB board structure 61 using a surface mount technology.

[0055] Specifically, the combined power supply network is integrated onto the second PCB structure 61, separated from the first PCB structure 31. This reduces the number of laminations between the first and second PCB structures 31, effectively lowering PCB manufacturing costs. A flexible connector 63 (button connector) is used for RF connection between the first and second PCB structures 31, thus separating the common-terminal combined power supply network design. This reduces the design complexity of multi-layer PCBs, lowers design risks, and reduces the number of laminations (≤2) and costs. Electromagnetic shielding is provided between the first and second PCB structures 31 by a metal carrier 1, increasing isolation between them and avoiding common PCB board issues like inter-board RF signal self-oscillation and crosstalk, effectively reducing the design risks of multi-layer PCBs.

[0056] The above technical solution integrates the combined power supply network onto the second PCB board structure, separating it from the first PCB board structure. This reduces the number of lamination cycles, effectively lowers the design risk of multilayer PCB boards, and reduces costs.

[0057] In this embodiment, the opening of the second plastic cover 5 is provided with a second sealing groove (not shown in the figure), and the second surface of the metal carrier plate 1 is provided with a second protruding ring 14. The second protruding ring 14 is embedded in the second sealing groove and an adhesive is provided between the two.

[0058] In the above text, the second sealing groove is an annular groove that extends along the opening of the second plastic cover 5, and the second protruding ring 14 is an annular protrusion that extends along the edge of the metal carrier plate 1. The opening of the second plastic cover 5 abuts against the edge of the second surface of the metal carrier plate 1. The second sealing groove and the second protruding ring 14 are adapted to each other. When the second plastic cover 5 is fastened to the second surface of the metal carrier plate 1, the second protruding ring 14 is embedded in the second sealing groove. The adhesive can firmly bond the metal carrier plate 1 and the second plastic cover 5 together.

[0059] Specifically, the second sealing groove and the second convex ring 14 are interlocked, achieving initial positioning of the metal carrier plate 1 and the second plastic cover 5 during assembly. After the adhesive between the second sealing groove and the second convex ring 14 is cured, a second adhesive layer 15 is formed, which not only seals the gap between the metal carrier plate 1 and the second plastic cover 5, but also improves the reliability of the connection between the metal carrier plate 1 and the second plastic cover 5.

[0060] The above technical solution achieves mutual positioning, sealing connection, and mutual fixation of the second plastic cover and the metal carrier plate by setting the second sealing groove and the second convex ring.

[0061] In this embodiment, a metal shielding layer (not shown in the figure) is provided on the surface of the second plastic outer cover 5 facing the inside of the second receiving cavity.

[0062] In the above text, the metal shielding layer is a metal layer, mainly used to prevent electromagnetic interference and radio frequency interference, and to ensure the stability and security of signal transmission. Specifically, the metal shielding layer can be formed by spraying.

[0063] Specifically, a metal shielding layer is provided on the inner wall of the second plastic cover 5 to prevent the phased array signal from being emitted outward through the second plastic cover 5.

[0064] The above technical solution involves setting a metal shielding layer on the inner wall of the second plastic outer cover, which can effectively shield electromagnetic signals on the combined power supply network near the side of the combined power supply network.

[0065] In this embodiment, the second surface of the metal carrier plate 1 is provided with a second positioning pin 16 for positioning with the second circuit board layer 6.

[0066] In the above description, the second positioning pin 16 is a columnar structure extending along the first direction, specifically a cylinder or a prism. The free end of the second positioning pin 16 away from the metal carrier plate 1 can be set as a cone to facilitate guiding the second circuit board layer 6 during the assembly process of the metal carrier plate 1 and the second circuit board layer 6. The second circuit board layer 6 is provided with positioning holes that are adapted to the second positioning pin 16.

[0067] Specifically, when the second circuit board layer 6 is assembled onto the metal carrier plate 1, it can be aligned with the positioning holes on the second circuit board layer 6 through the second positioning pin 16, which facilitates the rapid assembly of the second circuit board layer 6 and the metal carrier plate 1.

[0068] By using the above technical solution, a second positioning pin is set on the second surface of the metal carrier plate, which facilitates the rapid and accurate assembly of the second circuit board layer, improves assembly efficiency, and reduces production costs.

[0069] The assembly process of the phased array described above is as follows: ① Place the first surface of the metal carrier plate 1 facing upwards; ② Assemble the positioning holes of the first circuit board layer 3 (on which the first RF chip 32 is attached) and the antenna radiating layer 4 onto the first positioning pin 13 of the metal carrier plate 1; ③ Inject adhesive into the first sealing groove of the first plastic cover 2; ④ Pass the plastic rivets 22 on the first plastic cover 2 through the through holes of the antenna radiating layer 4, the first circuit board layer 3, and the metal carrier plate 1, and press the first plastic cover 2 firmly so that the first plastic clips 21 on the first plastic cover 2 are engaged into the slots on the metal carrier plate 1, thus completing the installation of the metal carrier plate 1, the first plastic cover 2, the first circuit board layer 3, and the antenna radiating layer 4; ⑤ Place the second surface of the metal carrier plate 1 facing upwards... ⑥ Pass the elastic connector 63 through the through hole on the metal carrier plate 1, so that the elastic connector 63 contacts the first circuit board layer 3; ⑦ Assemble the positioning hole of the second circuit board layer 6 on which the second RF chip 62 is attached onto the second positioning pin 16 of the metal carrier plate 1, and fit the through hole onto the plastic rivet 22, with the tail of the plastic rivet 22 protruding from the second circuit board layer 6; ⑧ Use a hot riveting process to expand the tail of the plastic rivet 22 and rivet it to the second circuit board layer 6; ⑦ Inject adhesive into the second sealing groove of the second plastic cover 5; ⑧ Press the second plastic cover 5 firmly so that the second plastic buckle 51 on the second plastic cover 5 is snapped into the slot on the metal carrier plate 1, completing the installation of the metal carrier plate 1 and the second plastic cover 5, and completing all assembly work.

[0070] This invention employs an integrated structural and functional design. In designing the radome, radiating patch, metal carrier plate, combining feed network, and plastic carrier plate, in addition to considering the functionality of each component, ease of installation is also taken into account. It utilizes a completely screwless assembly method, employing hot-riveting rivets on the radome to secure the radome, radiating patch, metal carrier plate, and combining feed network. The millimeter-wave active phased array assembly is achieved using clips and adhesive within waterproof grooves.

[0071] The radome used in this invention serves as both a wave-transmitting and protective cover for the antenna, as well as a broadband matching structure for the antenna. The radome and the antenna are designed as an integrated unit. The antenna design fully considers the impact of the radome on the antenna radiation performance and performs joint simulation. The radome is used as a wide-angle matching layer to improve the antenna radiation performance.

[0072] To reduce the design complexity and manufacturing cost of multilayer PCBs, this invention separates the radiating patch design, replaces the microwave dielectric substrate with PET and a plastic support, and separates the common-terminal combining feed network of the multilayer PCBs. A small number of button connectors are used for RF connections between the multilayer PCBs and the combining feed network, reducing the number of PCB laminations (≤2) to lower costs. By separating the combining feed network onto a single PCB board requiring only one lamination, and by using a metal carrier for electromagnetic shielding between the multilayer PCBs and the combining feed network, isolation between the common-terminal combining feed network and the multilayer PCBs is increased. This avoids common inter-board RF signal self-oscillation and crosstalk problems in multilayer PCB designs, effectively reducing the design risks of multilayer PCBs.

[0073] The radiating patch and radome of this invention are designed using inexpensive plastic materials, which reduces material costs.

[0074] This invention applies the above methods to the design of the millimeter-wave active phased array, taking into account multiple aspects such as materials, functions, and assembly, to reduce the design cost of the millimeter-wave active phased array while optimizing antenna performance and simplifying the installation steps.

[0075] Figure 14 This is a partial 8×8 radome and integrated antenna design array model of a millimeter-wave active phased array in a certain Ku band in this embodiment. Figure 15 and 16 The simulation results show the radiation pattern for the subarray at frequency F0, rotation angle Phi = 0°, and a 90° scan pattern. It can be seen that at frequency F0, the normal gain of this local 8×8 conformal antenna array is 22.24 dBi, and the gain within the ±65° scan range is ≥16.58 dBi. This gain takes into account the influence of the radome and exhibits good radiation performance.

[0076] Example 2: See Figure 17 and 18 As shown, this is the second embodiment of the active phased array disclosed in this invention.

[0077] The rest is the same as in Embodiment 1, except that the second plastic outer cover and the second circuit half-layer are not included. After the plastic rivet 22 passes through the through holes on the antenna radiating layer 4 and the first circuit board layer 3, the tail end of the plastic rivet 22 is extended and riveted to the first circuit board layer 3 by a hot riveting process. Example 3: See Figure 19 As shown, this is the third embodiment of the active phased array disclosed in this invention.

[0078] The rest is the same as in Embodiment 1, except that the first plastic outer cover and the antenna radiating layer are a whole and cannot be separated.

[0079] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A millimeter-wave active phased array, characterized in that, include: A metal carrier plate has a first surface and a second surface facing away from each other in a first direction, the first direction being consistent with the thickness direction of the metal carrier plate; A first plastic cover is disposed on the first surface side of the metal carrier plate. The first plastic cover serves as an antenna cover, and its opening is connected to the edge of the metal carrier plate to enclose a first receiving cavity. The first plastic cover is integrally formed with a first plastic buckle and a plastic rivet. The first circuit board layer includes a first PCB structure, a subarray feed synthesis network, an antenna feed layer, a power supply circuit, a control circuit, and a first radio frequency chip. The first PCB structure is disposed within the first accommodating cavity and close to the metal carrier plate. The subarray feed synthesis network, the antenna feed layer, the power supply circuit, and the control circuit are integrated on the first PCB structure. The subarray feed synthesis network is used for synthesizing subarray-level radio frequency signals. The antenna feed layer is used for transmitting radio frequency signals. The power supply circuit is used for providing power. The control circuit is used for issuing control signals. The first radio frequency chip is disposed on the side of the first PCB structure facing the metal carrier plate, and the first radio frequency chip is connected to the metal carrier plate through a first thermal pad. The first radio frequency chip is used for signal transmission, reception, and modulation. The antenna radiating layer includes a plastic support and a radiating patch. The plastic support is disposed in the first receiving cavity and close to the first plastic cover. The radiating patch is disposed on the side of the plastic support facing the first plastic cover. The radiating patch is used to radiate and receive electromagnetic signals. The first plastic buckle is locked to the metal carrier plate, the plastic rivet is locked to the first PCB board structure and the plastic bracket, the subarray feed synthesis network, the first radio frequency chip, the antenna feed layer and the radiating patch transmit radio frequency signals in sequence, the power supply circuit is connected to the first radio frequency chip to transmit power, and the control circuit is connected to the first radio frequency chip to transmit control signals. The antenna radiating layer includes two layers of plastic supports and two layers of radiating patches. The two plastic supports are a first plastic plate and a second plastic plate, respectively. The first plastic plate is disposed between the first plastic cover and the second plastic plate. The two radiating patches are a first radiating patch and a second radiating patch, respectively. The first radiating patch is disposed on the first plastic plate, and the second radiating patch is disposed on the second plastic plate. The first radiating patch includes a first film and a first metal pattern disposed on the first film, the first metal pattern being a circular pattern with four evenly distributed notches; the second radiating patch includes a second film and a second metal pattern disposed on the second film, the second metal pattern being a circular pattern; the first plastic plate has a first perforation hole facing the first metal pattern, and the second plastic plate has a second perforation hole facing the second metal pattern.

2. The millimeter-wave active phased array according to claim 1, characterized in that, The opening of the first plastic cover is provided with a first sealing groove, and the first surface of the metal carrier plate is provided with a first protruding ring. The first protruding ring is embedded in the first sealing groove and an adhesive is provided between the two.

3. The millimeter-wave active phased array according to claim 1, characterized in that, The surface of the first plastic cover facing the radiating patch has an air blind cavity, which is configured as a wide-angle matching layer to improve the radiation performance of the antenna radiating layer.

4. The millimeter-wave active phased array according to claim 1, characterized in that, The first surface of the metal carrier plate is provided with a first positioning pin for positioning with the first circuit board layer and the antenna radiating layer.

5. The millimeter-wave active phased array according to claim 1, characterized in that, The phased array also includes: The second plastic cover is disposed on the second surface side of the metal carrier plate. The opening of the second plastic cover is connected to the edge of the metal carrier plate to enclose the second receiving cavity. The second plastic cover is integrally formed with a second plastic buckle. The second circuit board layer includes a second PCB structure, a combining power supply network, and a second radio frequency chip. The second PCB structure is disposed within the second receiving cavity and close to the metal carrier plate. The second PCB structure is connected to the first PCB structure via a flexible connector. The combining power supply network is integrated on the second PCB structure. The second radio frequency chip is disposed on the side of the second PCB structure facing the metal carrier plate. The second radio frequency chip is connected to the metal carrier plate via a second thermal pad. The second radio frequency chip is used to realize signal transmission, reception, control, and amplification. The second plastic buckle is locked to the metal carrier plate, the plastic rivet passes through the metal carrier plate and is locked to the second PCB board structure, the combined power supply network, the second RF chip and the sub-array power supply network transmit RF signals in sequence, the power supply circuit is connected to the second RF chip to transmit power, and the control circuit is connected to the second RF chip to transmit control signals.

6. The millimeter-wave active phased array according to claim 5, characterized in that, The second plastic cover has a second sealing groove at its opening, and the second surface of the metal carrier plate has a second protruding ring. The second protruding ring is embedded in the second sealing groove and an adhesive is provided between them.

7. The millimeter-wave active phased array according to claim 5, characterized in that, The second plastic cover has a metal shielding layer on its surface facing the inside of the second receiving cavity.

8. The millimeter-wave active phased array according to claim 5, characterized in that, The second surface of the metal carrier plate is provided with a second positioning pin for positioning with the second circuit board layer.

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