A multi-layer flexible circuit board press system

Abstract

This invention proposes a multi-layer flexible circuit board lamination system, relating to the field of circuit board lamination technology. It includes a work cabinet with a working cavity. A fixing plate is installed inside the working cavity. A driving assembly is located above the fixing plate, and an upper base is located below the fixing plate, connected to the output end of the driving assembly. A heated upper lamination plate is installed at the lower end of the upper base. A lower base is installed at the bottom of the working cavity, and a heated lower lamination plate is installed on the lower base. A gas resistance interception assembly is installed at the lower end of the fixing plate. The heated lower lamination plate has stepped placement grooves. A micro-motion pressure unit array is installed below the heated upper lamination plate. This invention uses a micro-motion pressure unit array to replace the mechanical gradient structure. Each unit integrates a micro electric cylinder and a thin-film pressure sensor. Local pressure is adjusted in real time via a PLC, thereby achieving a transition from rigid gradient to adaptive pressure adjustment to meet the lamination requirements of multi-layer flexible circuit boards.

Description

Technical Field

[0001] This invention relates to the field of circuit board lamination technology, and more particularly to a multilayer flexible circuit board lamination system. Background Technology

[0002] As electronic devices continue to evolve towards thinner, lighter, and higher-density designs, multilayer flexible circuit boards (FPCBs) are increasingly widely used in smartphones, wearable devices, and automotive electronics due to their advantages such as flexibility, light weight, and high wiring density. However, with the increase in the number of layers (typically 4 to 8 layers), the lamination process of multilayer FPCBs faces more severe technical challenges than that of single-layer or double-layer boards.

[0003] In traditional lamination processes, equipment primarily employs two pressure application methods: one is planar lamination, where uniform pressure is applied to the circuit board via upper and lower heating plates; the other is a simpler zoned lamination method, using mechanical structures such as elastic pillars to achieve coarse pressure distribution. While planar lamination is structurally simple, it cannot adapt to the varying pressure requirements of different areas in multilayer flexible circuit boards. Because the central area of ​​a multilayer board typically has denser circuitry, it requires greater lamination force to ensure good interlayer bonding, while the edge areas require less pressure to prevent over-compression. Uniform pressure distribution often results in insufficient pressure in the central area, leading to weak interlayer bonding, or excessive pressure in the edge areas, causing material deformation due to compression.

[0004] Another improvement is to adopt a zoned pressure design, using elastic columns of varying hardness to achieve a gradient distribution of pressure. While this approach improves pressure distribution to some extent, it still has significant limitations. Once the pressure distribution of the elastic columns is determined, it is difficult to adjust, making it unsuitable for laminating multilayer boards with different numbers of layers and materials. Furthermore, the inherent characteristics of the mechanical structure limit the precision of pressure adjustment, making precise closed-loop control difficult to achieve.

[0005] Furthermore, in terms of thermal management, traditional laminating equipment typically employs simple heating and cooling methods. During the heating stage, the board is uniformly heated using heating plates, while the cooling stage often utilizes forced air cooling or natural cooling. This simple temperature control method is insufficient to meet the process requirements of multilayer board lamination. Due to the large number of layers and complex material types, different materials in multilayer boards have varying coefficients of thermal expansion. Rapid cooling can easily generate internal thermal stress, leading to warping, delamination, or microcracks in the board.

[0006] Therefore, as electronic products increasingly demand higher levels of precision and number of layers in multilayer flexible circuit boards, the shortcomings of existing lamination equipment in terms of pressure control accuracy and thermal management capabilities are becoming increasingly apparent. Especially when laminating multilayer boards of different specifications, traditional equipment lacks sufficient process adaptability and flexibility, making it difficult to improve production efficiency while ensuring lamination quality. Therefore, this invention proposes a multilayer flexible circuit board lamination system to address the problems existing in the prior art. Summary of the Invention

[0007] To address the aforementioned problems, the present invention aims to provide a multi-layer flexible circuit board lamination system. This system has the advantages of avoiding uneven pressure distribution, thermal deformation and wrinkling, and demolding damage during the lamination process of flexible circuit boards, and can solve the problems existing in the prior art.

[0008] To achieve the objectives of this invention, the invention is implemented through the following technical solution: a multilayer flexible circuit board lamination system, comprising a work cabinet, a work chamber on the work cabinet, a fixing plate installed on the inner side of the work chamber, a driving assembly above the fixing plate, an upper base below the fixing plate, the upper base being connected to the output end of the driving assembly, a heated upper lamination plate installed at the lower end of the upper base, a lower base installed at the bottom of the work chamber, a heated lower lamination plate installed on the lower base, a gas resistance interception assembly installed at the lower end of the fixing plate, a stepped placement groove provided on the heated lower lamination plate, and a micro-motion pressure unit array installed below the heated upper lamination plate;

[0009] The micro-motion pressure unit array consists of several groups of pressure units, which are arranged in a rectangular array of M rows × N columns. Each pressure unit consists of a pressure sleeve and a pressure head. A micro electric cylinder is installed inside the pressure sleeve. The output end of the micro electric cylinder passes through the pressure sleeve and is connected to the pressure head. The pressure head has a built-in thin-film pressure sensor.

[0010] A further improvement is made in that: the gas resistance interception component includes a fixed column, which is evenly arranged in several groups, and the lower end of the fixed column passes through the heating upper plate. An air cavity is provided on the inner side of the fixed column, and a micro exhaust hole array is provided on the lower end of the fixed column. An air guide groove is provided on the inner side of the fixed plate, and the air guide groove is connected to the air cavity in the fixed column. Two sets of air guide grooves are symmetrically arranged, and an air supply hose is installed at the input end of the air guide groove. The input end of the air supply hose is connected to the output end of an external air pump.

[0011] A further improvement is that: the lower end of the heating upper plate is provided with a trapezoidal threaded hole, and the number and position of the trapezoidal threaded holes correspond to the pressure sleeve; a connecting body is installed on the upper end of the pressure sleeve, and a trapezoidal external thread is provided on the outer side of the connecting body; the trapezoidal external thread is adapted to the trapezoidal threaded hole; and a hexagonal adjusting ring is installed on the outer side of the connecting body.

[0012] A further improvement is that both the upper heating plate and the lower heating plate include a fixing layer, a heat insulation layer, an electric heating layer, a rigid load-bearing layer, and an installation layer that are stacked sequentially. The installation layer of the upper heating plate is used to install the pressure sleeve, and the installation layer of the lower heating plate is used to create stepped placement grooves.

[0013] A further improvement is made in that: the work cabinet is provided with two sets of symmetrically arranged cooling chambers, the inner side of the cooling chambers is equipped with baffles, and there are several sets of baffles. There are extrusion plates between the baffles and the side wall of the work cabinet, and there are two sets of extrusion plates symmetrically arranged. The ends of the two sets of extrusion plates are connected to the baffles and the side wall of the work cabinet at corresponding positions respectively through electric linear actuators. Rubber clamping wheels are installed on the extrusion plates, and there are several sets of rubber clamping wheels evenly arranged.

[0014] A further improvement is that exhaust fans are installed on the upper end and side walls of the work cabinet, and there are several sets of exhaust fans. The position of the exhaust fans corresponds to the cooling chamber, and the wind speed of the exhaust fans is adjustable.

[0015] A further improvement is that the drive assembly includes an electric hydraulic cylinder, which is fixedly connected to the work cabinet via a bracket. The telescopic end of the electric hydraulic cylinder passes through the fixed plate and is fixedly connected to the upper base. A vertical guide slide is provided on the inner side of the working chamber, and the two ends of the vertical guide slide are respectively connected to the work cabinet and the lower base. The vertical guide slide passes through the upper base.

[0016] Further improvements include: the heating lower plate is provided with micro-adsorption holes, and several groups of micro-adsorption holes are evenly arranged; the inner side of the work cabinet is provided with an equipment cavity, and a vacuum pump is installed inside the equipment cavity; the inner side of the lower base is provided with an opening and a vacuum adsorption hood is installed; the upper end of the vacuum adsorption hood is connected to the heating lower plate, and the lower end of the vacuum adsorption hood is connected to the input end of the vacuum pump through a pipe.

[0017] A further improvement is that an embedded stainless steel electric heating tube array is installed inside the electric heating layer, and the embedded stainless steel electric heating tube array is distributed in a serpentine pattern.

[0018] A further improvement is that a PT temperature sensor array is installed inside the cooling chamber.

[0019] The beneficial effects of this invention are as follows:

[0020] This invention uses a micro-motion pressure unit array to replace the mechanical gradient structure. The array consists of uniformly distributed pressure units, each of which integrates a micro electric cylinder and a thin-film pressure sensor. The local pressure is adjusted in real time by a PLC, thereby achieving a transition from rigid gradient to adaptive pressure adjustment to meet the requirements of multilayer flexible circuit board lamination and ensure the lamination effect.

[0021] Secondly, by installing a PT100 temperature sensor array in the cooling chamber to monitor the temperature gradient, and linking the electric linear actuator and the adjustable-speed exhaust fan, the press-fitted flexible circuit board can be cooled in a gradient cooling manner, reducing internal thermal stress and ensuring the pressing effect.

[0022] Finally, the present invention utilizes the gas resistance generated by airflow to help the flexible circuit board detach from the heated upper plate. Compared with the traditional manual or hardware detachment method, it is more stable and uniform, and less likely to cause deformation or damage to the flexible circuit board after pressing, thus avoiding scratches or damage caused by hard contact. Attached Figure Description

[0023] Figure 1 This is a bottom view schematic diagram of the pressure head distribution of the present invention.

[0024] Figure 2 This is a top view schematic diagram of the stepped placement groove of the present invention.

[0025] Figure 3 This is a front view schematic diagram of the heating upper plate structure of the present invention.

[0026] Figure 4 This is a front view schematic diagram of the pressure unit structure of the present invention.

[0027] Figure 5 This is a front view structural diagram of the present invention.

[0028] Figure 6 This is a front view schematic diagram of the stepped placement groove structure of the present invention.

[0029] Figure 7 This is a top view schematic diagram of the air guide groove distribution structure of the present invention.

[0030] Figure 8 This is a bottom view schematic diagram of the fixed column distribution of the present invention.

[0031] Figure 9 This is a top view schematic diagram of the distribution of the two sets of extrusion plates in this invention.

[0032] Figure 10 This is a front view schematic diagram of the present invention.

[0033] The components include: 1. Work cabinet; 2. Work chamber; 3. Fixing plate; 4. Upper base; 5. Heated upper plate; 6. Lower base; 7. Heated lower plate; 8. Stepped placement groove; 801. Central area; 802. Edge area; 803. Sloping wall transition area; 9. Pressure sleeve; 10. Pressure head; 11. Miniature electric cylinder; 12. Fixing column; 13. Air guide groove; 14. Air supply hose; 15. Trapezoidal threaded hole; 16. Connector; 17. Trapezoidal external thread. 18. Hexagonal adjusting ring; 19. Fixing layer; 20. Heat insulation layer; 21. Electric heating layer; 22. Rigid load-bearing layer; 23. Mounting layer; 24. Cooling chamber; 25. Baffle; 26. Extrusion plate; 27. Electric linear actuator; 28. Rubber clamping wheel; 29. ​​Exhaust fan; 30. Electric hydraulic cylinder; 31. Vertical guide slide bar; 32. Micro-adsorption hole; 33. Equipment cavity; 34. Vacuum pump; 35. Vacuum adsorption hood; 36. PLC controller. Detailed Implementation

[0034] To enhance understanding of the present invention, the present invention will be further described in detail below with reference to embodiments. These embodiments are only used to explain the present invention and do not constitute a limitation on the scope of protection of the present invention.

[0035] Therefore, according to Figures 1-10 As shown, this embodiment proposes a multilayer flexible circuit board lamination system, including a work cabinet 1, on which a working cavity 2 is provided. In this embodiment, both the front and rear ends of the working cavity 2 are connected to the outside, and a fixing plate 3 is installed on the inner side of the working cavity 2. The fixing plate 3 is horizontally arranged, and both ends of it are fixedly connected to the work cabinet 1.

[0036] A drive assembly is located above the fixed plate 3, and an upper base 4 is located below the fixed plate 3. The upper base 4 is connected to the output end of the drive assembly. The drive assembly includes an electric hydraulic cylinder 30, which is fixedly connected to the work cabinet 1 via a bracket. The telescopic end of the electric hydraulic cylinder 30 passes through the fixed plate 3 and is fixedly connected to the upper base 4. A vertical guide slide rod 31 is located inside the working cavity 2, and both ends of the vertical guide slide rod 31 are connected to the work cabinet 1 and the lower base 6, respectively. The vertical guide slide rod 31 passes through the upper base 4. The vertical guide slide rod 31 is used to guide the vertical movement of the upper base, ensuring that it moves accurately up and down in a straight line during the pressing process.

[0037] A heated upper plate 5 is installed at the lower end of the upper base 4 and is fixed with bolts. A lower base 6 is installed at the bottom of the working chamber 2 and is fixedly connected to the work cabinet 1. A heated lower plate 7 is installed on the lower base 6 and is fixed with bolts.

[0038] In this embodiment, both the upper heating plate 5 and the lower heating plate 7 include a fixing layer 19, a heat insulation layer 20, an electric heating layer 21, a rigid load-bearing layer 22, and an installation layer 23, which are stacked sequentially. The fixing layer 19 provides a stable support connection; the heat insulation layer 20 corresponds to the ceramic fiber board, reducing heat loss; the electric heating layer 21 houses an embedded stainless steel electric heating tube array, which is arranged in a serpentine pattern to ensure heating uniformity and minimize temperature differences. Simultaneously, the electric heating tubes in the array are heated by current and directly transfer heat to the heating plate. The serpentine design reduces heat concentration and avoids localized overheating; the rigid load-bearing layer 22 ensures that the electric heating layer 21 does not deform during the pressing process, thus protecting the embedded stainless steel electric heating tube array inside. The remaining differences are:

[0039] The mounting layer 23 of the heated upper plate 5 is used to install the pressure sleeve 9, and the mounting layer 23 of the heated lower plate 7 is used to create a stepped placement groove 8.

[0040] The heating lower plate 7 is provided with a stepped placement groove 8. For the stepped placement groove 8, the depth of the central area 801 is less than the depth of the edge area 802, and there is a sloping transition area 803 between the central area 801 and the edge area 802. Specifically, in this embodiment, the depth of the central area 801 is 0.05mm, which is used to limit the displacement of fine lines, and the depth of the edge area 802 is 0.15mm, which accommodates the thermal expansion of the cover film. Thermal expansion usually causes the material to expand during heating, so the deeper edge area helps to provide space for the film to expand and prevent deformation due to insufficient space. The sloping transition area 803 adopts a 15° tilt angle design. The transition angle of the sloping wall reduces the abrupt transition of thermal expansion, thereby ensuring the smoothness of the flexible circuit board during pressing and thus minimizing the occurrence of creases in the flexible circuit board.

[0041] During the pressing process, the operator manually places the flexible circuit board material to be pressed into the stepped placement groove 8. At this time, the edge of the flexible circuit board falls into the edge area 802, and then the upper pressure plate is pressed.

[0042] A micro-motion pressure unit array is installed below the heating upper plate 5, and the position of the micro-motion pressure unit array corresponds to the stepped placement groove 8;

[0043] The micro-motion pressure unit array consists of several groups of pressure units, which are arranged in a rectangular array of M rows × N columns. Each pressure unit consists of a pressure sleeve 9 and a pressure head 10. A micro electric cylinder 11 is installed inside the pressure sleeve 9. The output end of the micro electric cylinder 11 passes through the pressure sleeve 9 and is connected to the pressure head 10. The pressure head 10 has a built-in thin-film pressure sensor.

[0044] Specifically, the pressure sleeve 9 of each pressure unit is made of high-strength aluminum alloy, and the internally integrated miniature electric cylinder has a diameter of 8mm, a maximum output force of 100N, and a repeatability accuracy of ±0.01mm. The thin-film pressure sensor in the pressure head 10 adopts the Wheatstone bridge principle and can detect pressure changes at the 0.1N level in real time.

[0045] During operation, the PLC controller 36 scans data from all pressure sensors at a frequency of 100Hz. When it detects that the pressure in a certain area deviates from the set value, it immediately adjusts the output force of the corresponding miniature electric cylinder. For example, when laminating a 6-layer flexible circuit board, the central area, due to its higher circuit density, requires a pressure of 80N, while the edge areas only need 20N. This dynamic pressure adjustment capability ensures that each area of ​​the multilayer board receives the most suitable lamination force, effectively avoiding the problem of poor interlayer bonding caused by uneven pressure in traditional equipment.

[0046] Thus, at the start of the pressing process, the electric hydraulic cylinder 30 smoothly pushes the upper base 4 downward at a speed of 0.5 mm / s. During the movement, the vertical guide slide 31 ensures that the heated upper plate 5 remains horizontal at all times, with a parallelism error not exceeding 0.02 mm. When the pressure head 10 is about to contact the plate surface, the miniature electric cylinder 1 starts working, and each pressure unit independently executes the pre-pressing program to establish stable contact with the plate surface with an initial pressure of 5 N.

[0047] The lower end of the heating upper plate 5 is provided with trapezoidal threaded holes 15 (aluminum alloy), and the number and position of the trapezoidal threaded holes 15 correspond to those of the pressure sleeve 9. A connector 16 is installed on the upper end of the pressure sleeve 9, and the outer side of the connector 16 is provided with trapezoidal external threads 17, which are adapted to the trapezoidal threaded holes 15. A hexagonal adjusting ring 18 is installed on the outer side of the connector 16. Furthermore, the threaded connection facilitates the installation and disassembly of the pressure sleeve 9.

[0048] A gas resistance interception assembly is installed at the lower end of the fixing plate 3. This assembly includes fixing posts 12, which are evenly arranged in several groups and distributed among several pressure sleeves 9. The lower ends of the fixing posts 12 pass through the heating upper plate 5. It should be noted that during the pressing process, the lower end face of the fixing posts 12 does not directly contact the surface of the flexible circuit board (i.e., there is a fixed distance between the lower end face of the fixing posts 12 and the flexible circuit board being pressed). Furthermore, because the heating upper plate 5 contains an embedded stainless steel electric heating tube array, the layout of the fixing posts 12 needs to avoid the embedded stainless steel electric heating tube array.

[0049] An air cavity is provided on the inner side of the fixing post 12, and a micro exhaust hole array is provided at the lower end of the fixing post 12. An air guide groove 13 is provided on the inner side of the fixing plate 3, and the air guide groove 13 is connected to the air cavity in the fixing post 12. Two sets of air guide grooves 13 are symmetrically arranged, and an air supply hose 14 is installed at the input end of the air guide groove 13. The input end of the air supply hose 14 is connected to the output end of an external air pump (with adjustable air flow and pressure). The micro exhaust hole array of the fixing post 12 consists of several sets of radial nozzles. The axis of the several sets of radial nozzles forms a 30° angle with the horizontal plane. In this embodiment, each set of fixing posts 12 is provided with six sets of radial nozzles, which helps the airflow to diffuse evenly and increases the resistance of the gas to the circuit board, promotes the smooth desorption of the circuit board, and avoids the concentration and unevenness of the airflow.

[0050] In this embodiment, several sets of fixing posts 12 are evenly divided into two groups, each connected to one of the two sets of air guide channels 13. This effectively balances the airflow distribution, avoids uneven gas distribution in a single set of air guide channels, and ensures that each fixing post 12 receives a uniform gas supply. Correspondingly, two sets of external air pumps are also provided, each connected to one of the two sets of air guide channels 13. In this way, the gas can be sprayed out more evenly, improving the desorption efficiency. After the pressing is completed, the heated upper plate 5 moves upward. However, the flexible circuit board after pressing may adhere to the heated upper plate 5. Therefore, while the heated upper plate 5 moves upward, the external air pump is started. At this time, gas is sprayed from the lower end of the fixing post 12. The gas generates resistance against the flexible circuit board, thereby avoiding hard contact for detachment.

[0051] The work cabinet 1 has two sets of symmetrically arranged cooling chambers 24. Baffles 25 are installed on the inner side of each cooling chamber 24, and several sets of baffles 25 are provided. Extrusion plates 26 are provided between the baffles 25 and the side wall of the work cabinet 1, and two sets of extrusion plates 26 are symmetrically arranged. In this embodiment, there are a total of four sets of baffles 25 and a total of sixteen sets of corresponding extrusion plates 26.

[0052] The ends of two sets of extrusion plates 26 (two sets of extrusion plates 26 form a pair) are connected to the corresponding baffles 25 and the side wall of the work cabinet 1 via electric linear actuators 27. Rubber clamping wheels 28 are installed on the extrusion plates 26, and several sets of rubber clamping wheels 28 are evenly distributed. Simultaneously, exhaust fans 29 are installed on the upper end and side wall of the work cabinet 1, and several sets of exhaust fans 29 are provided, with the positions of the exhaust fans 29 corresponding to the cooling chamber 24. For example... Figure 5 and Figure 9 As shown, after the flexible circuit board is pressed, the operator takes it out and then inserts it vertically between the two sets of extrusion plates 26. Then, under the action of the electric linear actuator 27, it is clamped. Then the exhaust fan 29 is started. The upper one is for air intake and the lower one is for air exhaust. In this way, a cooling effect is achieved through the flow of air.

[0053] Furthermore, a PT temperature sensor array, consisting of three sets of PT temperature sensors, is installed inside the cooling chamber 24 to monitor the temperature within the cooling chamber 24. Correspondingly, the PLC controller 36 automatically adjusts the speed of the exhaust fan according to a preset cooling curve. Specifically, as shown below:

[0054] Phase 1 (0-5 minutes): Fan speed 20%, temperature drops from 180℃ to 100℃.

[0055] Phase 2 (5-15 minutes): Fan speed 50%, temperature drops from 100℃ to 50℃.

[0056] Phase 3 (15-25 minutes): Fan speed 80%, temperature drops from 50℃ to 25℃.

[0057] This gradual cooling strategy effectively releases the internal thermal stress of multilayer boards, preventing warping and delamination.

[0058] The lower heating plate 7 is equipped with micro-adsorption holes 32 (the micro-adsorption holes 32 are through-hole designs, which also need to avoid the internal embedded stainless steel electric heating tube array), and several groups of micro-adsorption holes 32 are evenly distributed. The inner side of the work cabinet 1 has an equipment cavity 33, and a vacuum pump 34 is installed inside the equipment cavity 33. The inner side of the lower base 6 has an opening and a vacuum adsorption cover 35 is installed. The upper end of the vacuum adsorption cover 35 is connected to the lower heating plate 7, and the lower end of the vacuum adsorption cover 35 is connected to the input end of the vacuum pump 34 through a pipe. Specifically, a two-position three-way solenoid valve is installed on the pipe, and the normally open end of the solenoid valve is connected to the atmosphere. During operation, the vacuum pump 34 provides continuous negative pressure through its effective suction function, helping to firmly adsorb the flexible circuit board onto the lower heating plate 7, preventing it from shifting during the pressing process. After pressing is completed, the solenoid valve is activated to release pressure, causing the adsorption force of the lower heating plate 7 to reach zero.

[0059] This device is equipped with a PLC controller 36, which is used to control all electronic components of the device. For example, the pressing time is 5 minutes. After pressing is completed, the PLC controller 36 controls the solenoid valve to start and release pressure, while the vacuum pump 34 is turned off.

[0060] Accordingly, temperature sensors are integrated into the lower heating plate 7 and the upper heating plate 5 and electrically connected to the PLC controller 36, thereby enabling corresponding operations to be performed by collecting temperature data.

[0061] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the present invention without departing from its framework and scope of application, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multilayer flexible circuit board lamination system, comprising a work cabinet (1), a work cavity (2) on the work cabinet (1), and a fixing plate (3) installed on the inner side of the work cavity (2), a driving assembly above the fixing plate (3), an upper base (4) below the fixing plate (3), and the upper base (4) being connected to the output end of the driving assembly, a heating upper lamination plate (5) installed at the lower end of the upper base (4), a lower base (6) installed at the bottom of the work cavity (2), and a heating lower lamination plate (7) installed on the lower base (6), characterized in that: A gas resistance interception component is installed at the lower end of the fixed plate (3), a stepped placement groove (8) is provided on the heating lower plate (7), and a micro-motion pressure unit array is installed below the heating upper plate (5). The micro-motion pressure unit array consists of several groups of pressure units, which are arranged in a rectangular array of M rows × N columns. Each pressure unit consists of a pressure sleeve (9) and a pressure head (10). A miniature electric cylinder (11) is installed inside the pressure sleeve (9). The output end of the miniature electric cylinder (11) passes through the pressure sleeve (9) and is connected to the pressure head (10). The pressure head (10) has a built-in thin-film pressure sensor. The gas resistance interception component includes a fixed column (12). Several groups of fixed columns (12) are evenly arranged, and the lower end of the fixed column (12) passes through the heating upper plate (5). An air cavity is provided on the inner side of the fixed column (12), and a micro exhaust hole array is provided at the lower end of the fixed column (12). An air guide groove (13) is provided on the inner side of the fixed plate (3), and the air guide groove (13) is connected to the air cavity in the fixed column (12). Two sets of air guide grooves (13) are symmetrically arranged, and an air supply hose (14) is installed at the input end of the air guide groove (13). The input end of the air supply hose (14) is connected to the output end of an external air pump. A trapezoidal threaded hole (15) is opened at the lower end of the heating upper plate (5), and the number and position of the trapezoidal threaded holes (15) correspond to the pressure sleeve (9). A connector (16) is installed at the upper end of the pressure sleeve (9), and the connector... The outer side of the body (16) is provided with a trapezoidal external thread (17), which is adapted to the trapezoidal thread hole (15). A hexagonal adjusting ring (18) is installed on the outer side of the connecting body (16). The work cabinet (1) is provided with two sets of symmetrically arranged cooling chambers (24). A baffle (25) is installed on the inner side of the cooling chamber (24), and the baffle (25) is provided in several sets. An extrusion plate (26) is provided between the baffle (25) and the side wall of the work cabinet (1), and two sets of extrusion plates (26) are symmetrically arranged. The ends of the two sets of extrusion plates (26) are respectively connected to the baffle (25) and the work cabinet at the corresponding positions by electric linear actuators (27). (1) Side wall connection, the extrusion plate (26) is equipped with rubber clamping wheels (28), and the rubber clamping wheels (28) are evenly arranged in several groups. The heating lower plate (7) is provided with micro-adsorption holes (32), and the micro-adsorption holes (32) are evenly arranged in several groups. The inner side of the work cabinet (1) is provided with an equipment cavity (33). The inner side of the equipment cavity (33) is equipped with a vacuum pump (34). The inner side of the lower base (6) is provided with an opening and a vacuum adsorption cover (35) is installed. The upper end of the vacuum adsorption cover (35) is connected to the heating lower plate (7), and the lower end of the vacuum adsorption cover (35) is connected to the input end of the vacuum pump (34) through a pipe.

2. The multilayer flexible circuit board lamination system according to claim 1, characterized in that: The upper heating plate (5) and the lower heating plate (7) each include a fixed layer (19), a heat insulation layer (20), an electric heating layer (21), a rigid load-bearing layer (22), and an installation layer (23) stacked in sequence. The installation layer (23) of the upper heating plate (5) is used to install the pressure sleeve (9), and the installation layer (23) of the lower heating plate (7) is used to open a stepped placement groove (8).

3. The multilayer flexible circuit board lamination system according to claim 1, characterized in that: The work cabinet (1) is equipped with exhaust fans (29) on its upper end and side wall, and there are several sets of exhaust fans (29). The position of the exhaust fans (29) corresponds to the cooling chamber (24), and the wind speed of the exhaust fans (29) is adjustable.

4. The multilayer flexible circuit board lamination system according to claim 1, characterized in that: The drive assembly includes an electric hydraulic cylinder (30), which is fixedly connected to the work cabinet (1) via a bracket. The telescopic end of the electric hydraulic cylinder (30) passes through the fixed plate (3) and is fixedly connected to the upper base (4). The inner side of the working cavity (2) is provided with a vertical guide slide rod (31), and the two ends of the vertical guide slide rod (31) are respectively connected to the work cabinet (1) and the lower base (6). The vertical guide slide rod (31) passes through the upper base (4).

5. The multilayer flexible circuit board lamination system according to claim 2, characterized in that: An embedded stainless steel electric heating tube array is installed in the electric heating layer (21), and the embedded stainless steel electric heating tube array is distributed in a serpentine pattern.

6. The multilayer flexible circuit board lamination system according to claim 1, characterized in that: A PT100 temperature sensor array is installed inside the cooling chamber (24).

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