An automatic wafer disk locking transport device for a wafer dicing machine

Abstract

This invention relates to the field of wafer dicing technology, specifically to an automatic locking wafer disk transport device for a wafer dicing machine. The device includes a track and a base slidably mounted on the track along the Y-axis. The base has a supporting frustum. A locking ring is located on the outer periphery of the supporting frustum at the top of the base. Multiple locking seats are located along the circumferential direction on the locking ring. A trigger ring is movably mounted on the bottom of the locking ring on the base. A trigger block is located at the bottom of the locking seat on the trigger ring. The locking seat has a drive groove. A drive rod is movably mounted on the locking seat. A drive pin is movably mounted on the drive rod. The drive pin is movably mounted in the drive groove. A top rod is movably mounted on the end of the drive rod near the supporting frustum. This invention achieves multi-directional synchronous centering through multiple evenly distributed locking seats and top rods along the circumference, utilizing the orderly sliding of the drive pin along the drive groove. This eliminates positional deviations caused by manual placement and ensures subsequent dicing accuracy.

Description

Technical Field

[0001] This invention relates to the field of wafer dicing technology, and more specifically to an automatic wafer disk locking and transport device for a wafer dicing machine. Background Technology

[0002] In the semiconductor manufacturing industry, wafer dicing is a crucial step in dividing a wafer with completed circuitry into individual chip units. Currently, the transportation and positioning process of wafer disks in wafer dicing equipment is complex and has many shortcomings. Existing equipment typically relies on multiple separation mechanisms to complete the positioning process of the wafer disk from its initial placement to its final dicing position.

[0003] In the initial stage, wafer disks often need to be manually placed into their approximate position on the equipment. This step relies heavily on the operator's experience and skill, making it difficult to guarantee positioning accuracy and resulting in low efficiency. After coarse positioning, mechanical grippers clamp the wafer disks for subsequent precise transport and positioning. However, due to uneven force distribution during clamping, the mechanical grippers are prone to causing the wafer disks to shift during transport. Especially for large wafer disks, the edges may experience slight deformation under the clamping force of the grippers. This deformation can be amplified during subsequent cutting, affecting cutting accuracy. Summary of the Invention

[0004] The purpose of this invention is to address the aforementioned shortcomings in the prior art by providing an automatic locking wafer disk transport device for a wafer dicing machine.

[0005] The objective of this invention is achieved through the following technical solution: an automatic locking wafer disk transport device for a wafer dicing machine, comprising a track and a base slidably disposed on the track along the Y-axis; a supporting frustum for placing the wafer disk is provided at the center of the top of the base; a locking ring is provided on the outer periphery of the supporting frustum on the top of the base; multiple locking seats are provided on the locking ring along the circumferential direction; a trigger ring is provided on the bottom of the locking ring of the base; a trigger block is provided on the bottom of the locking seat of the trigger ring;

[0006] The locking seat is provided with a drive groove; the locking seat is movably provided with a drive rod; the drive rod is movably provided with a drive pin; the drive pin is movably provided in the drive groove; the end of the drive rod near the supporting frustum is movably provided with a top rod.

[0007] The present invention is further configured such that the locking seat is slidably provided with a sliding seat along the diametrical direction; the sliding seat is movably provided with a driving seat; and the driving rod is slidably provided on the driving seat along the diametrical direction.

[0008] The invention is further configured such that the sliding seat is provided with a straight groove along the lifting direction; the locking seat is provided with an inclined groove; the driving seat is provided with a guide pin; and the guide pin is movably disposed between the straight groove and the inclined groove.

[0009] The present invention is further configured such that the driving groove includes a first inclined groove; the bottom of the first inclined groove is provided with a vertical groove in the direction close to the center of the locking ring; the bottom of the vertical groove is provided with a second inclined groove in the direction away from the center of the locking ring; a reset inclined groove is provided between the bottom of the second inclined groove and the top of the first inclined groove.

[0010] The depth of the top of the first inclined groove is greater than the depth of the top of the reset inclined groove; the depth of the bottom of the first inclined groove, the depth of the vertical groove, and the depth of the second inclined groove are the same; the depth of the bottom of the reset inclined groove is greater than the depth of the second inclined groove.

[0011] The first inclined groove has a driving inclined surface in the middle; the reset inclined groove has a reset inclined surface in the middle.

[0012] The present invention is further configured such that the top rod includes a centering rod portion arranged along the lifting direction and a pressing portion disposed at the top of the centering rod portion; a driving spring is provided between the centering rod portion and the driving rod.

[0013] The present invention is further configured such that the sliding seat is provided with a first abutting inclined surface; the trigger block is provided with a second abutting inclined surface that cooperates with the first abutting inclined surface; and a sliding spring is provided between the end of the sliding seat away from the center of the locking ring and the locking ring.

[0014] The top surface of the track is provided with a trigger groove and a trigger ramp along the Y-axis; the bottom of the trigger ring is provided with a slider; the slider is slidably disposed on the trigger groove, the trigger ramp and the top surface of the track.

[0015] The present invention is further configured such that the base is movably provided with a lifting seat; the supporting truncated cone is located on top of the lifting seat.

[0016] The invention is further configured such that a lifting spring is provided between the bottom of the lifting seat and the base; a wedge-shaped rod is provided on the lifting seat to extend and slide along the X-axis; a first lifting inclined surface is provided at one end of the wedge-shaped rod; a second lifting inclined surface is provided on the lifting seat to cooperate with the first lifting inclined surface; and a third lifting inclined surface is provided on the track to cooperate with the other end of the wedge-shaped rod.

[0017] The present invention is further configured such that a vacuum adsorber is provided at the center of the supporting frustum.

[0018] The invention is further configured such that the track is equipped with a motor and a conveyor belt arranged along the Y-axis; the output end of the motor is connected to the conveyor belt; and the base is located on top of the conveyor belt.

[0019] The beneficial effects of this invention are as follows: This invention achieves multi-directional synchronous centering by using multiple locking seats and top rods evenly distributed around the circumference and by utilizing the orderly sliding of the driving pin along the driving groove. The centering rod first approaches the side of the wafer disk radially and simultaneously calibrates the center from multiple points around the circumference, completely eliminating the positional deviation of manual placement. After centering is completed, the centering rod automatically disengages from the side of the wafer disk, and the wafer is axially pressed only by the top clamping part, avoiding wafer disk edge deformation caused by side clamping force, and ensuring the subsequent cutting accuracy from the source. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the present invention in conjunction with a wafer disk;

[0021] Figure 2 yes Figure 1 A magnified view of part A in the middle;

[0022] Figure 3 This is a schematic diagram of the structure of the present invention at the material loading station;

[0023] Figure 4 This is a cross-sectional view of the present invention at the material loading station;

[0024] Figure 5 yes Figure 4 A magnified view of part B in the middle;

[0025] Figure 6 This is a schematic diagram of the structure of the locking seat, sliding seat, driving seat, driving rod, and top rod of the present invention.

[0026] Figure 7 This is a schematic diagram of the structure of the sliding seat, driving seat, driving rod and top rod of the present invention;

[0027] The components include: 1. Track; 11. Trigger groove; 12. Trigger inclined surface; 13. Third lifting inclined surface; 14. Motor; 15. Conveyor belt; 2. Base; 3. Support frustum; 31. Vacuum suction unit; 32. Wafer disk; 4. Locking ring; 41. Locking seat; 42. Angled groove; 5. Trigger ring; 51. Trigger block; 52. Second abutment inclined surface; 6. Drive rod; 61. Drive pin; 62. Centering rod; 63. Pressure... 64. Tightening part; 7. Drive spring; 85. Sliding seat; 71. First abutting inclined surface; 72. Sliding spring; 73. Straight groove; 74. Drive seat; 75. Guide pin; 81. First inclined groove; 82. Vertical groove; 83. Second inclined groove; 84. Reset inclined groove; 85. Drive inclined surface; 86. Reset inclined surface; 9. Lifting seat; 91. Lifting spring; 92. Wedge rod; 93. First lifting inclined surface; 94. Second lifting inclined surface. Detailed Implementation

[0028] The present invention will be further described in conjunction with the following embodiments.

[0029] Depend on Figures 1 to 7 As can be seen, the automatic locking wafer disk transport device of the wafer dicing machine described in this embodiment includes a track 1 and a base 2 that slides along the Y-axis direction on the track 1; a supporting frustum 3 for placing the wafer disk 32 is provided at the center of the top of the base 2; a locking ring 4 is provided on the outer periphery of the supporting frustum 3 on the top of the base 2; a plurality of locking seats 41 are provided along the circumferential direction of the locking ring 4; a trigger ring 5 is provided on the bottom of the locking ring 4 of the base 2; a trigger block 51 is provided on the bottom of the locking seat 41 of the trigger ring 5;

[0030] The locking seat 41 is provided with a drive groove; the locking seat 41 is movably provided with a drive rod 6; the drive rod 6 is movably provided with a drive pin 61; wherein a telescopic spring is provided between the drive pin 61 and the drive rod 6; the drive pin 61 is movably provided in the drive groove; the end of the drive rod 6 near the supporting frustum 3 is provided with a push rod.

[0031] Specifically, in this embodiment, the automatic locking wafer disk transport device of the wafer dicing machine first moves the base 2 to the loading station, at which point the push rod is positioned away from the supporting frustum 3. Then, the wafer disk 32 is placed on top of the supporting frustum 3. Next, the base 2 is driven to move towards the dicing station. During the movement, the trigger ring 5 drives the drive pin 61 of the drive rod 6 to move in the drive groove through the trigger block 51, thereby causing the push rod to gradually move towards the supporting frustum 3. Multiple push rods arranged along the circumferential direction simultaneously move towards the supporting frustum 3, thereby centering the wafer disk 32. After the wafer disk 32 is centered, the push rod presses the wafer disk 32 tightly, thus ensuring the stability of wafer dicing.

[0032] This embodiment describes an automatic wafer disk locking and transport device for a wafer dicing machine. The locking seat 41 is slidably provided with a sliding seat 7 along the diametrical direction; the sliding seat 7 is movably provided with a driving seat 74; and the driving rod 6 is slidably provided on the driving seat 74 along the diametrical direction. In this embodiment, the sliding seat 7 is provided with a straight groove 73 along the lifting direction; the locking seat 41 is provided with an inclined groove 42; the driving seat 74 is provided with a guide pin 75; and the guide pin 75 is movably disposed between the straight groove 73 and the inclined groove 42. This embodiment describes an automatic wafer disk locking transport device for a wafer dicing machine. The drive groove includes a first inclined groove 81; a vertical groove 82 is provided at the bottom of the first inclined groove 81 towards the center of the locking ring 4; a second inclined groove 83 is provided at the bottom of the vertical groove 82 towards the distance from the center of the locking ring 4; a reset inclined groove 84 is provided between the bottom of the second inclined groove 83 and the top of the first inclined groove 81; the depth of the top of the first inclined groove 81 is greater than the depth of the top of the reset inclined groove 84; the depths of the bottom of the first inclined groove 81, the vertical groove 82, and the second inclined groove 83 are the same; the depth of the bottom of the reset inclined groove 84 is greater than the depth of the second inclined groove 83; a drive inclined surface 85 is provided in the middle of the first inclined groove 81; and a reset inclined surface 86 is provided in the middle of the reset inclined groove 84. This embodiment describes an automatic wafer disk locking transport device for a wafer dicing machine. The top rod includes a centering rod portion 62 arranged along the lifting direction and a pressing portion 63 located at the top of the centering rod portion 62. A driving spring 64 is provided between the centering rod portion 62 and the driving rod 6. In this embodiment, the sliding seat 7 has a first abutting inclined surface 71; the trigger block 51 has a second abutting inclined surface 52 that cooperates with the first abutting inclined surface 71; a sliding spring 72 is provided between the end of the sliding seat 7 away from the center of the locking ring 4 and the locking ring 4; the top surface of the track 1 has a trigger groove 11 and a trigger inclined surface 12 along the Y-axis direction; a slider is provided at the bottom of the trigger ring 5; the slider is slidably disposed on the trigger groove 11, the trigger inclined surface 12, and the top surface of the track 1.

[0033] Specifically, in this embodiment, the automatic locking wafer disk transport device of the wafer dicing machine first moves the base 2 to the loading station. At this time, under the action of the sliding spring 72, the sliding seat 7 is in a position close to the center, and the slider is in the trigger groove 11. In addition, the drive pin 61 is at the top of the first inclined groove 81, so that the push rod is in a position away from the supporting frustum 3.

[0034] Then the wafer disk 32 is placed on top of the supporting frustum 3;

[0035] Next, the drive base 2 moves towards the cutting station. As the slider passes the triggering inclined surface 12, the slider gradually moves upward. With the cooperation of the first abutting inclined surface 71 and the second abutting inclined surface 52, the sliding seat 7 gradually moves away from the center. With the cooperation of the straight groove 73 and the inclined groove 42, the guide pin 75 and the drive pin 61 move away from the center while descending. The drive pin 61 of the drive rod 6 moves downward along the first inclined groove 81, thereby driving the top rod to gradually move towards the supporting frustum 3. The centering rods 62 of the multiple top rods arranged in the circumferential direction gradually move towards the supporting frustum 3, thereby centering the wafer disk 32. When the drive pin 61 moves to the bottom of the first inclined groove 81, the wafer disk 32 completes the centering process.

[0036] Next, the drive pin 61 moves downward along the vertical groove 82, causing the push rod to move downward. Then, the drive pin 61 moves downward along the second inclined groove 83, causing the centering rod part 62 to gradually move away from the wafer disk 32 while the clamping part 63 continues to descend until the slider crosses the trigger inclined surface 12 and reaches the top surface of the track 1. At this time, the drive pin 61 moves to the bottom of the reset inclined groove 84, and the centering rod part 62 separates from the side of the wafer disk 32. The clamping part 63 clamps the top of the wafer disk 32.

[0037] Then the base 2 moves to the cutting station. Since the centering rod 62 separates from the side of the wafer disk 32, the clamping part 63 clamps the top of the wafer disk 32, which can reduce the impact of the top rod on the wafer disk 32.

[0038] After the cutting is completed, the base 2 moves back to the upper material station. When it passes the trigger ramp 12 again, the sliding spring 72 resets, pushing the trigger ring 5 to move downward. The sliding seat 7 moves towards the center, thereby causing the drive seat 74 to move upward. The drive pin 61 moves upward along the reset ramp 84 until the drive pin 61 moves to the top of the first ramp 81, completing the overall reset.

[0039] In this embodiment, multiple locking seats 41 and top rods are evenly distributed around the circumference. The driving pin 61 slides orderly along the driving groove to achieve synchronous centering in multiple directions. The centering rod 62 first approaches the side of the wafer disk 32 radially and calibrates the center from multiple points around the circumference simultaneously, completely eliminating the positional deviation of manual placement. After centering is completed, the centering rod 62 automatically disengages from the side of the wafer disk 32. The wafer is axially pressed only by the top clamping part 63 to avoid edge deformation of the wafer disk 32 caused by the side clamping force, thus ensuring the subsequent cutting accuracy from the source.

[0040] This embodiment describes an automatic wafer disk locking transport device for a wafer dicing machine. The base 2 is movably equipped with a lifting seat 9; a supporting frustum 3 is located on top of the lifting seat 9. In this embodiment, a lifting spring 91 is provided between the bottom of the lifting seat 9 and the base 2; a wedge-shaped rod 92 is provided on the lifting seat 9 to slide and extend along the X-axis; one end of the wedge-shaped rod 92 has a first lifting inclined surface 93; the lifting seat 9 has a second lifting inclined surface 94 that cooperates with the first lifting inclined surface 93; and the track 1 has a third lifting inclined surface 13 that cooperates with the other end of the wedge-shaped rod 92.

[0041] Specifically, when the base 2 is at the loading station, under the action of the lifting spring 91, the lifting seat 9 drives the supporting platform 3 to rise, which makes it easier to place the wafer disk 32 in the supporting platform 3; when the base 2 moves to the cutting station, the wedge rod 92 passes through the third lifting ramp 13, and the third lifting ramp 13 pushes the wedge rod 92 to move inward, thereby driving the lifting seat 9 to move the supporting platform 3 downward under the cooperation of the first lifting ramp 93 and the second lifting ramp 94.

[0042] This embodiment describes an automatic wafer disk locking transport device for a wafer dicing machine, wherein a vacuum suction device 31 is provided at the center of the supporting frustum 3. This configuration enables the wafer disk 32 to be clamped after centering.

[0043] The automatic locking wafer disk transport device of the wafer dicing machine described in this embodiment includes a track 1 equipped with a motor 14 and a conveyor belt 15 arranged along the Y-axis; the output end of the motor 14 is connected to the conveyor belt 15; and the base 2 is located on top of the conveyor belt 15.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. An automatic locking wafer disk transport device for a wafer dicing machine, characterized in that: The system includes a track and a base that slides along the Y-axis on the track; a supporting frustum for placing a wafer disk is provided at the center of the top of the base; a locking ring is provided on the outer periphery of the supporting frustum on the top of the base; multiple locking seats are provided on the locking ring along the circumferential direction; a trigger ring is provided on the bottom of the locking ring of the base; a trigger block is provided on the bottom of the locking seat of the trigger ring. The locking seat is provided with a drive groove; the locking seat is movably provided with a drive rod; the drive rod is movably provided with a drive pin; the drive pin is movably provided in the drive groove; the end of the drive rod near the supporting frustum is movably provided with a top rod. The locking seat is slidably provided with a sliding seat along the diameter direction; the sliding seat is movably provided with a driving seat; the driving rod is slidably provided on the driving seat along the diameter direction; The sliding seat is provided with a straight groove along the lifting direction; the locking seat is provided with an inclined groove; the driving seat is provided with a guide pin; the guide pin is movably disposed in the straight groove and the inclined groove; The drive groove includes a first inclined groove; the bottom of the first inclined groove is provided with a vertical groove in the direction close to the center of the locking ring; the bottom of the vertical groove is provided with a second inclined groove in the direction away from the center of the locking ring; a reset inclined groove is provided between the bottom of the second inclined groove and the top of the first inclined groove. The depth of the top of the first inclined groove is greater than the depth of the top of the reset inclined groove; the depth of the bottom of the first inclined groove, the depth of the vertical groove, and the depth of the second inclined groove are the same; the depth of the bottom of the reset inclined groove is greater than the depth of the second inclined groove. The first inclined groove has a driving inclined surface in the middle; the reset inclined groove has a reset inclined surface in the middle. The top rod includes a centering rod portion arranged along the lifting direction and a pressing portion located at the top of the centering rod portion; a driving spring is provided between the centering rod portion and the driving rod. The sliding seat is provided with a first abutting inclined surface; the trigger block is provided with a second abutting inclined surface that cooperates with the first abutting inclined surface; a sliding spring is provided between the end of the sliding seat away from the center of the locking ring and the locking ring; The top surface of the track is provided with a trigger groove and a trigger ramp along the Y-axis; the bottom of the trigger ring is provided with a slider; the slider is slidably disposed on the trigger groove, the trigger ramp and the top surface of the track.

2. The automatic locking wafer disk transport device for a wafer dicing machine according to claim 1, characterized in that: The base is equipped with a lifting seat that can be raised and lowered; the supporting truncated cone is located on top of the lifting seat.

3. The automatic locking wafer disk transport device for a wafer dicing machine according to claim 2, characterized in that: A lifting spring is provided between the bottom of the lifting seat and the base; a wedge-shaped rod is provided on the lifting seat to slide and extend along the X-axis; a first lifting inclined surface is provided at one end of the wedge-shaped rod; a second lifting inclined surface is provided on the lifting seat to cooperate with the first lifting inclined surface; and a third lifting inclined surface is provided on the track to cooperate with the other end of the wedge-shaped rod.

4. The automatic locking wafer disk transport device for a wafer dicing machine according to claim 1, characterized in that: A vacuum adsorber is provided at the center of the supporting frustum.

5. The automatic locking wafer disk transport device for a wafer dicing machine according to claim 1, characterized in that: The track is equipped with a motor and a conveyor belt arranged along the Y-axis; the output end of the motor is connected to the conveyor belt; the base is located on top of the conveyor belt.

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