A heat dissipation structure and electronic device

Abstract

This application provides a heat dissipation structure and an electronic device, relating to the field of heat dissipation technology, to solve the problem of severe localized overheating in electronic devices in related technologies. The heat dissipation structure includes a first cover plate, a second cover plate, and a liquid-absorbing structure. The first and second cover plates are interconnected to enclose a receiving cavity. The liquid-absorbing structure is located within the receiving cavity. The first cover plate includes a first sealing layer, a first material layer, and a second sealing layer; the first material layer is located between the first and second sealing layers; the first cover plate has multiple spaced-apart buffer grooves, and the positions of the buffer grooves in the first material layer include elastic deformation. This heat dissipation structure can be applied to electronic devices to improve the problem of severe localized overheating and can protect the screen.

Description

[0001] This application is a divisional application. The original application has the application number 202480012809.8 and the original application date is February 6, 2024. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and electronic device. Background Technology

[0003] Electronic devices such as mobile phones, tablets, and laptops generate heat during operation. If this heat is not dissipated in time and accumulates in localized areas within the device, it will cause the temperature of those areas to rise, affecting the device's performance and user experience. In severe cases, it can lead to malfunctions and damage. Therefore, a heat dissipation solution is urgently needed to address the heat dissipation problem of electronic devices. Summary of the Invention

[0004] The purpose of this application is to provide a heat dissipation structure and electronic device to solve the problem of severe local heat generation in electronic devices in related technologies.

[0005] To achieve the above objectives, the embodiments of this application provide the following solutions:

[0006] On one hand, a heat dissipation structure is provided, including a first cover plate, a second cover plate, and a liquid-absorbing structure. The first cover plate and the second cover plate are connected to each other to enclose a receiving cavity. The liquid-absorbing structure is located within the receiving cavity. The heat dissipation structure has a first region and a second region; the liquid-absorbing structure extends from the first region to the second region. The receiving cavity also has a vapor channel extending from the second region to the first region. The first cover plate includes a first sealing layer, a first material layer, and a second sealing layer; the first material layer is located between the first sealing layer and the second sealing layer; the first cover plate has a plurality of spaced-apart buffer grooves, and the positions of the buffer grooves in the first material layer include elastic deformation.

[0007] The heat dissipation structure provided in this application embodiment can dissipate heat from heat-generating devices in a timely manner, thus preventing electronic devices from experiencing severe localized overheating. This can mitigate the problems of performance degradation, shortened lifespan, and screen burn-out caused by overheating in localized areas, which can affect display quality. Furthermore, the first cover plate has multiple buffer grooves spaced apart, providing excellent cushioning and support. Since the first cover plate includes a first sealing layer, a first material layer, and a second sealing layer, with the first material layer sandwiched between them, and the positions of the buffer grooves in the first material layer exhibiting elastic deformation, the buffer grooves of the first cover plate have better stress absorption and release capabilities, further enhancing the first cover plate's ability to withstand pressure deformation and recover. For example, when the heat dissipation structure is applied to the aforementioned electronic device, such as when the heat dissipation structure is squeezed by the aforementioned screen, the first cover plate has a good buffering and supporting effect, and the buffer groove has a better stress absorption and release capability, making the first cover plate more flexible. Furthermore, since the first material layer bound by the first sealing layer and the second sealing layer will not have excessive rebound force, that is, the screen will not experience failure problems such as light and shadow, black spots, mold marks, bright spots, green lines, or cracks due to excessive rebound force of the first cover plate.

[0008] Furthermore, since the first material layer has a first sealing layer and a second sealing layer on opposite sides, it effectively seals and protects the first material layer, thereby improving the lifespan and reliability of the first cover plate. On the other hand, the more symmetrical structure allows for better flatness of the first cover plate. For example, the more symmetrical mechanical parameters of the material, such as the modulus, in the thickness direction of the first cover plate make it less prone to curling. Moreover, the unit weight of the first material layer can be less than that of the first sealing layer and less than that of the second sealing layer. Compared to a first cover plate of the same thickness without the first material layer, this reduces the overall weight of the first cover plate, achieving a lightweight design.

[0009] In some embodiments, the yield point strain of the first material layer is greater than the yield point strain of the first sealing layer and also greater than the yield point strain of the second sealing layer; the positions of the buffer grooves in the first and second sealing layers include plastic deformation. The plastic deformation of the first and second sealing layers can constrain the shape of the first material layer. In this case, the buffer groove can be manufactured by compression molding. This configuration also simplifies the process and reduces production costs.

[0010] In some embodiments, at least a portion of the top opening of the buffer groove faces the side of the first cover plate away from the second cover plate. This arrangement helps to improve the buffering and support effect of the first cover plate.

[0011] In some embodiments, the shape of any buffer groove includes any one of the following: circular, polygonal, straight, and wavy. Such a design allows the buffer groove to provide good cushioning protection.

[0012] In some embodiments, the first cover plate further includes: a first filler located in at least one buffer groove; the material of the first filler includes an organic polymer material. This arrangement helps to further enhance the buffering and protective capabilities of the first cover plate.

[0013] In some embodiments, the first cover plate further includes a second filler located in at least one buffer groove; the material of the second filler includes a phase change energy storage material. This arrangement is beneficial for further improving the thermal conductivity of the first cover plate.

[0014] In some embodiments, the ratio between the thickness of the first material layer and the total thickness of the first cover plate is greater than or equal to 20%. This configuration allows the first cover plate to achieve better weight reduction. Furthermore, when multiple protruding structures are formed on the first cover plate by molding, wrinkles or even breakage are less likely to occur.

[0015] In some embodiments, the thickness of the first material layer is greater than or equal to 5 μm. This configuration allows the first cover plate to achieve better weight reduction. Furthermore, when multiple protruding structures are formed on the first cover plate by molding, wrinkles or even breakage are less likely to occur.

[0016] In some embodiments, the thickness of the first sealing layer is equal to or substantially equal to the thickness of the second sealing layer. "Substantially equal" means that there can be a small deviation between them, such as the thickness difference being less than 5% of the thickness of the smaller one, or less than 10% of the thickness of the smaller one. In this example, it is also advantageous to make the mechanical parameters of the first cover plate symmetrical in the thickness direction, thereby making the first cover plate less prone to curling.

[0017] In some embodiments, the first sealing layer and the second sealing layer are made of the same material. This arrangement helps to make the mechanical parameters of the first cover plate symmetrical in the thickness direction, thereby making the first cover plate less prone to curling.

[0018] In some embodiments, the material of the first material layer includes an organic polymer material. Examples of organic polymer materials include polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyvinylidene chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), and polyamide (PA). In this example, the first material layer can possess better plasticity and higher elongation, thereby making the resulting first cover plate easier to form using stamping or hot pressing processes and less prone to cracking.

[0019] In some embodiments, at least one of the first and second sealing layers is made of at least one of a metal and a ceramic. The metal includes copper, such as pure copper or a copper alloy. In this example, the first and / or second sealing layers have relatively high structural strength and good sealing and toughness. This helps to improve the structural strength of the first cover plate and extend its service life.

[0020] In some embodiments, the second cover plate includes a third sealing layer and a second material layer; the second material layer is located on the side of the third sealing layer opposite to the first cover plate; the yield point strain of the second material layer is greater than the yield point strain of the third sealing layer.

[0021] In this embodiment, by including a second material layer in the second cover plate, and ensuring that the yield strain of the second material layer is greater than that of the third sealing layer, the structural strength of the second cover plate is improved. For example, when micropillars and / or support pillars are etched on the surface of the third sealing layer away from the second material layer, the thickness of the base material of the third sealing layer can be etched to less than or equal to 0.03 mm without wrinkling or cracking. Furthermore, the unit weight of the second material layer can be less than that of the third sealing layer, thus reducing the total weight of the second cover plate compared to a second cover plate of the same thickness without the second material layer, achieving a lightweight design.

[0022] In some embodiments, the ratio between the thickness of the second material layer and the total thickness of the second cover plate is greater than or equal to 50%. This configuration allows the second cover plate to achieve better weight reduction. Furthermore, it reduces the likelihood of wrinkles or even breakage when etching structures such as micropillars and / or support pillars onto the second cover plate, or when the second cover plate is bent repeatedly.

[0023] In some embodiments, the material of the second material layer includes organic polymer materials, such as polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyvinylidene chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), and polyamide (PA). In this example, the second material layer can possess good toughness, thereby making the constructed second cover less prone to wrinkling or even breakage.

[0024] In some embodiments, the material of the third sealing layer includes at least one of metal and ceramic. The metal includes copper, such as pure copper or a copper alloy. In this example, the third sealing layer has relatively high structural strength and good sealing and toughness. This helps to improve the structural strength of the second cover plate and extend its service life.

[0025] In some embodiments, the second sealing layer is closer to the third sealing layer than the first sealing layer; the material of the third sealing layer is the same as that of the second sealing layer. This arrangement facilitates welding and sealing between the third and second sealing layers, and also facilitates welding and fixing the first cover plate and the second cover plate.

[0026] In some embodiments, the second cover plate has a molded placement groove on the side near the first cover plate, and the liquid-absorbing structure is placed in the placement groove. Because in some examples, the second cover plate has a second material layer with better toughness, and the placement groove formed by molding on the side of the second cover plate near the first cover plate has a large area, the structural strength of the second cover plate is still high, and it is not easy to have wrinkles or even breakage.

[0027] In some embodiments, the third sealing layer has a groove on the side near the first cover plate. The groove includes a first groove portion and a second groove portion, with the first groove portion near the bottom wall of the groove relative to the second groove portion. The second cover plate also includes a plurality of columnar structures located in the first groove portion, which are connected to the bottom wall. The liquid-absorbing structure includes a liquid-absorbing core placed in the second groove portion; the plurality of columnar structures support the liquid-absorbing core. In this solution, because the second cover plate has a second material layer with better toughness, the groove in the third sealing layer can be formed by compression molding or by etching. Regardless of the method, the structural strength of the resulting second cover plate remains high. Furthermore, when the groove is formed by etching, the plurality of columnar structures within the groove can also be directly etched. When the groove is formed by compression molding, the plurality of columnar structures within the groove can be formed by dispensing adhesive. This arrangement helps to ensure that the second cover plate has sufficient structural strength.

[0028] In some embodiments, the second cover plate comprises at least two stacked metal layers. This configuration improves the structural strength of the second cover plate, thereby enhancing the reliability of the entire heat dissipation structure.

[0029] In some embodiments, the at least two metal layers include any one of copper-steel, copper-titanium, copper-steel-copper, copper-titanium-copper, copper-aluminum-copper, copper-magnesium-copper, and copper (magnesium-aluminum alloy)-copper. The selected composite material has high strength, which can significantly improve the overall mechanical performance of the heat dissipation structure, prevent deformation of the heat dissipation structure under pressure, and improve the manufacturing yield of the heat dissipation structure and the reliability of the entire machine.

[0030] On the other hand, another heat dissipation structure is provided, including a fourth sealing layer, a third material layer and a fifth sealing layer; along a first direction, the third material layer is located between the fourth sealing layer and the fifth sealing layer; the material of the third material layer includes at least one of graphite material and graphene material; the heat dissipation structure has a plurality of spaced buffer grooves; the positions of the buffer grooves in the third material layer include elastic deformation and / or plastic deformation.

[0031] In another heat dissipation structure provided in this application embodiment, since the material of the third material layer includes at least one of graphite and graphene, and the position corresponding to the buffer groove in the third material layer includes elastic deformation and / or plastic deformation, the heat dissipation structure has a good heat dissipation and temperature uniformity effect. In particular, heat accumulation is not likely to occur at the position corresponding to the buffer groove. In addition, since there are a fourth sealing layer and a fifth sealing layer on opposite sides of the third material layer, on the one hand, the third material layer can play a good sealing and protection role, making the third material layer less prone to collapse. This can not only play a good buffering and support role for the screen, preventing screen failures such as light shadows, black spots, mold marks, bright spots, green lines, and cracks, but also prevent the heat dissipation structure's temperature uniformity and heat dissipation capacity from weakening due to the collapse of the third material layer, thereby improving the lifespan of the heat dissipation structure and enhancing the reliability of the first cover plate. On the other hand, since a more symmetrical structure can be formed, the flatness of the first cover plate can be improved. For example, since the mechanical material parameters such as the modulus of the material in the thickness direction of the first cover plate are more symmetrical, the heat dissipation structure is less prone to curling. In addition, the third material layer is lighter, which also helps to reduce the overall weight of the heat dissipation structure and achieve lightweight design.

[0032] In some embodiments, the thermal conductivity of the third material layer is greater than or equal to 400 W / (m·K). This configuration results in a high thermal conductivity of the heat dissipation structure.

[0033] In some embodiments, at least one of the fourth and fifth sealing layers is made of copper. This configuration provides better sealing and protection for the third material layer and also offers higher heat dissipation efficiency.

[0034] In another aspect, an electronic device is provided, comprising: a screen and a heat-generating device; and a heat dissipation structure as described in any of the foregoing embodiments. The heat dissipation structure is located between the screen and the heat-generating device.

[0035] The electronic device provided in this application embodiment has a good heat dissipation effect because it has the heat dissipation structure in any of the foregoing embodiments, and is not prone to serious local heat generation problems. It can also protect the screen and achieve a lightweight design.

[0036] In some embodiments, the electronic device further includes an adhesive layer located between the heat dissipation structure and the screen. By providing the adhesive layer, the heat dissipation structure can be bonded and fixed to the screen. Furthermore, when the heat dissipation structure and the screen are bonded and fixed, the presence of buffer grooves on the heat dissipation structure can prevent the adhesive layer between the screen and the heat dissipation structure from detaching due to shear stress. Attached Figure Description

[0037] Figure 1This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0038] Figure 2 This is a schematic diagram of a heat dissipation structure provided in an embodiment of this application;

[0039] Figure 3 for Figure 2 A cross-sectional view of the heat dissipation structure along the AA direction;

[0040] Figure 4 The operating principle and gas-liquid phase working fluid flow diagram of the heat dissipation structure provided in the embodiments of this application are shown below.

[0041] Figure 5 A cross-sectional schematic diagram of an electronic device provided in an embodiment of this application;

[0042] Figure 6 A cross-sectional schematic diagram of an electronic device under screen deformation, provided as an embodiment of this application;

[0043] Figure 7 This is a schematic diagram of the structure of a first cover plate without a buffer groove, provided in an embodiment of this application.

[0044] Figure 8 A stress-strain curve diagram of a first sealing layer (or a second sealing layer) and a first material layer provided for embodiments of this application;

[0045] Figure 9 This is a schematic diagram of the structure of the fixture and the first cover plate for molding the buffer groove provided in the embodiments of this application;

[0046] Figure 10 This is a schematic diagram of the structure of a first cover plate provided in an embodiment of this application;

[0047] Figure 11 for Figure 10 A cross-sectional view of the first cover plate along the BB direction;

[0048] Figure 12 This is a schematic diagram of another first cover plate provided in an embodiment of this application;

[0049] Figure 13 This is a schematic diagram of the structure of another first cover plate provided in an embodiment of this application;

[0050] Figure 14 This is a schematic diagram of the structure of another first cover plate provided in an embodiment of this application;

[0051] Figure 15 This is a schematic diagram of the structure of a first cover plate cooperating with a screen, provided in an embodiment of this application;

[0052] Figure 16 This is a schematic diagram of a heat dissipation structure in one embodiment of this application;

[0053] Figure 17 This is a schematic diagram of another heat dissipation structure in an embodiment of this application;

[0054] Figure 18 This is a schematic diagram of another heat dissipation structure in an embodiment of this application;

[0055] Figure 19 This is a schematic diagram of another heat dissipation structure in an embodiment of this application;

[0056] Figure 20 This is a schematic diagram of another heat dissipation structure in an embodiment of this application;

[0057] Figure 21 This is a schematic diagram of a heat dissipation structure in conjunction with a screen and a heat-generating device, provided in an embodiment of this application.

[0058] Figure 22 A schematic diagram of a combination of a first cover plate and a second absorbent core provided in an embodiment of this application;

[0059] Figure 23 This is a schematic diagram of another heat dissipation structure provided in an embodiment of this application;

[0060] Figure 24 This is a schematic diagram of a heat dissipation structure and its cooperation with a screen, provided in an embodiment of this application. Detailed Implementation

[0061] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0062] In the following description, the terms "first," "second," etc., are used for descriptive convenience only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0063] In the embodiments of this application, unless otherwise expressly specified and limited, the term "electrical connection" can be a direct electrical connection or an indirect electrical connection through an intermediate medium.

[0064] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0065] In the embodiments of this application, "and / or" describes the relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following associated objects have an "or" relationship.

[0066] In the embodiments of this application, the directional indications used to explain the structure and movement of different components, such as up, down, left, right, front, and back, are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, these directional indications will also change accordingly.

[0067] This application provides an electronic device, which can be a mobile phone, tablet computer, laptop computer, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, watch, augmented reality (AR) glasses, AR headset, virtual reality (VR) glasses, or VR headset, etc. For example, the electronic device can be a portable electronic device. For example, the electronic device can be any electronic device with heat dissipation requirements.

[0068] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application. For ease of description, the width direction of the electronic device 1000 is defined as the X1 axis; the length direction of the electronic device 1000 is defined as the Y1 axis; and the thickness direction of the electronic device 1000 is defined as the Z1 axis. It can be understood that the coordinate system setting of the electronic device 1000 can be flexibly set according to specific actual needs.

[0069] exist Figure 1 In this embodiment, the electronic device 1000 is a mobile phone. Exemplarily, the electronic device 1000 may include a screen 1001, a back cover 1002, and a heating element 1003. It is understood that... Figure 1 and Figure 2 The electronic device 1000 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 and Figure 2 And the limitations of the figures below. For example, in some other examples, electronic device 1000 may not include screen 1001.

[0070] Screen 1001 is used to display images, videos, etc. Screen 1001 can be a flexible display screen or a rigid display screen; for example, screen 1001 can be any one of organic light-emitting diode (OLED) display screen, active-matrix organic light-emitting diode or active-matrix organic light-emitting diode (AMOLED) display screen, mini organic light-emitting diode display screen, micro organic light-emitting diode display screen, quantum dot light-emitting diode (QLED) display screen, and liquid crystal display screen (LCD).

[0071] The back cover 1002 is used to protect the internal electronic components (such as the heat-generating device 1003) of the electronic device 1000. The back cover 1002 may include a back cover and a middle frame, with the middle frame fixed to the back cover. For example, the middle frame can be fixed to the back cover by adhesive. Alternatively, the middle frame and back cover can be integrally formed, i.e., the middle frame and back cover are a single structure. The screen 1001 can be connected to the middle frame. Components such as circuit boards and batteries can be housed within the space between the screen, middle frame, and back cover. The circuit board may include a flexible circuit board or a rigid circuit board. Power devices such as chips can be mounted on the circuit board.

[0072] For example, the heat-generating device 1003 can be a chip on a circuit board, such as a processing chip or a memory chip. Of course, in other embodiments, the heat-generating device 1003 can also be other power devices in the electronic device 1000. For example, any device that generates heat during the operation of the electronic device 1000 can be a heat-generating device 1003. Furthermore, the number of heat-generating devices 1003 in the electronic device 1000 can be one, two, or more. When there are two or more heat-generating devices 1003, at least some of the heat-generating devices 1003 can be of the same type; for example, there can be two processing chips, or two memory chips.

[0073] The inventors of this application have discovered that the presence of a heat-generating device 1003 in the electronic device 1000 leads to severe localized overheating. For example, in... Figure 1 In this embodiment, since the heat-generating device 1003 is located in the upper half of the electronic device 1000, there is a problem that the heat of the heat-generating device 1003 is difficult to dissipate from the upper half to the lower half in a timely manner. As a result, the performance of various devices in the upper half of the electronic device 1000 will decline, the lifespan will be shortened, and the part of the screen facing the heat-generating device will be easily burned, affecting the display effect.

[0074] Based on this, some embodiments of this application provide a heat dissipation structure 100. This heat dissipation structure 100 can be connected to the mid-frame. Please refer to... Figures 2 to 4 , Figure 2 This is a schematic diagram of the heat dissipation structure 100 provided in an embodiment of this application. Figure 3 for Figure 2 A cross-sectional view of the heat dissipation structure 100 along the AA direction. Figure 4 This diagram illustrates the operating principle and gas-liquid phase working fluid flow of the heat dissipation structure 100 provided in this embodiment. The heat dissipation structure 100 provided in this embodiment includes a first cover plate 10, a second cover plate 20, and a liquid absorption structure 30.

[0075] The first cover plate 10 and the second cover plate 20 are connected to form a receiving cavity 50. For example, the edge 41 of the first cover plate 10 and the edge 42 of the second cover plate 20 can be welded together (e.g., this may include...). Figure 3 The solder joints (T) can be welded using low-temperature welding processes such as brazing, cold welding, pressure welding, diffusion welding, ultrasonic welding, and electromagnetic pulse welding. The welding temperature is less than 320 degrees Celsius. Furthermore, welding can be performed without solder or with an additional solder layer.

[0076] For ease of description, the width direction of the heat dissipation structure 100 is defined as the X2 axis, which can be parallel to the aforementioned X1 axis; the length direction of the heat dissipation structure 100 is defined as the Y2 axis, which can be parallel to the aforementioned Y1 axis; and the thickness direction of the heat dissipation structure 100 is defined as the Z2 axis, which can be parallel to the aforementioned Z1 axis. It is understood that the coordinate system of the heat dissipation structure 100 can be flexibly set according to specific practical needs.

[0077] The heat dissipation structure 100 has a first region 01 and a second region 02. The first region 01 and the second region 02 can be arranged along the Y2 axis direction. It is understood that the first region 01 and the second region 02 can be adjacent (e.g., Figure 2 and Figure 3 As shown), they can also be non-adjacent (as shown). Figure 4 As shown, these are located at both ends of the heat dissipation structure along the Y2 axis.

[0078] The liquid-absorbing structure 30 is located within the receiving cavity 50. The liquid-absorbing structure can extend from the first region 01 to the second region 02. For example, there can be one or more liquid-absorbing structures 30; when there are multiple liquid-absorbing structures, they can be arranged in parallel at intervals, in which case each liquid-absorbing structure 30 can extend from the first region 01 to the second region 02. Furthermore, the receiving cavity 50 also has a vapor channel 51, which can extend from the second region 02 to the first region 01, thereby forming a circulation loop for the working fluid (e.g., pure water, propanol, alcohol, etc.).

[0079] For example, the liquid absorption structure 30 may include a liquid absorption core 31. The liquid absorption core 31 may be a mesh structure with dense through holes, such as a woven mesh, an etched mesh, or an organic material woven mesh. The copper mesh may be made by sintering copper powder, or it may be made by weaving copper wire. The liquid absorption core 31 may be a capillary structure.

[0080] As another example, the liquid absorption structure 30 may include a plurality of micropillars 32 disposed on the first cover plate 10 and / or the second cover plate 20. For example, in Figure 3 In one embodiment, a plurality of micropillars 32 are provided on the inner wall surface of the second cover plate 20. Among them, there are fine grooves 52 between the plurality of micropillars 32 (for example, the groove depth can be less than or equal to 0.1 mm, and the groove width can be less than or equal to 1 mm), that is, capillary structure.

[0081] For example, such as Figure 3 As shown, the liquid absorption structure 30 may simultaneously include a liquid absorption core 31 and multiple micropillars 32 located on the first cover plate 10 and / or the second cover plate 20, thereby forming a double-layer or triple-layer composite capillary structure. Figure 3 The illustration is based solely on a bilayer composite capillary structure comprising a suction core and multiple micropillars 32 located on the second cover plate 20.

[0082] Capillary structure refers to the phenomenon where, due to surface tension, the liquid surface of a liquid immersed in a capillary pore is concave. This concave surface exerts a pulling force on the liquid below, causing it to move upwards along the capillary wall. This is known as capillary action. A capillary structure can include multiple capillary pores or similar fine grooves. When a liquid working medium enters a capillary pore or fine groove, it flows to the other end of the capillary pore through capillary action, completing the transfer and return of the working medium.

[0083] For example, the heat dissipation structure 100 can be a vapor chamber (VC). A vapor chamber, also known as a heat spreader, is a vacuum cavity with a fine internal structure (capillary structure) and filled with a working fluid. The working principle of a vapor chamber is roughly the same as that of a heat pipe, specifically including four main steps: conduction, evaporation, convection, and condensation. The vapor chamber can be made of copper, and the working fluid inside can be pure water.

[0084] In some embodiments, a plurality of support posts 43 may be provided on the first cover plate 10 and / or the second cover plate 20. For example, in Figure 4 In this embodiment, a plurality of support columns 43 are provided on the inner wall surface of the first cover plate 10. The support columns 43 are used to prevent the heat dissipation structure 100 from collapsing. A steam channel 51 can be formed between the plurality of support columns. The depth of the steam channel 51 can be greater than 0.1 mm and the width can be greater than 1 mm.

[0085] For example, the center distance between two adjacent support columns 43 can be greater than 2mm, in which case the heat dissipation structure 100 is less likely to collapse.

[0086] For example, in the first cover plate 10 and the second cover plate 20, when one inner wall surface is provided with multiple support columns 43 and the other inner wall surface is provided with multiple micro columns 32, the multiple support columns 43 can be designed to be aligned with the multiple micro columns 32 (for example, one support column 43 is aligned with one micro column 32, or one support column 43 is aligned with two or more micro columns 32). This can make the heat dissipation structure 100 have higher structural strength, and the heat dissipation structure 100 is not easy to collapse and block the steam channel 51, thus it is not easy to fail and has higher reliability.

[0087] Based on this, for example, a liquid-absorbing core 31 can be provided between multiple support columns 43 and multiple micro columns 32. In this case, multiple support columns 43 can abut against the first surface of the liquid-absorbing core 31, and multiple micro columns 32 can abut against the second surface of the liquid-absorbing core 31, with the second surface opposite to the first surface.

[0088] It is understood that the above is only an example of the positions of the support column 43 and the micro column 32. In other embodiments of this application, the support column 43 may be set on the second cover plate 20 and the micro column 32 may be set on the first cover plate 10; or, the support column 43 may be set on both the first cover plate 10 and the second cover plate 20 at the same time; or the micro column 32 may be set on both the first cover plate 10 and the second cover plate 20 at the same time.

[0089] When the heat dissipation structure 100 provided in this application embodiment is applied to the electronic device 1000, the heat dissipation structure 100 can be located between the screen 1001 and the heat-generating device 1003. In this case, the first cover plate 10 can be close to the screen 1001 and the second cover plate 20 can be close to the heat-generating device 1003; alternatively, the second cover plate 20 can be close to the screen 1001 and the first cover plate 10 can be close to the heat-generating device 1003. This application does not impose any limitations on this.

[0090] For example, such as Figure 4 As shown, the heating element 1003 in the heat source area can be contacted by the second cover plate 20 located in the first region 01. When the heat generated by the heating element 1003 is conducted into the heat dissipation structure 200 through the second cover plate 20 in the first region 01, the liquid working fluid in the heat dissipation structure 100 near the heating element 1003 absorbs the heat and quickly vaporizes, carrying away a large amount of heat. Utilizing the latent heat of steam, when the steam in the heat dissipation structure 100 diffuses from the high-pressure area (such as the first region 01, which is a high-temperature area) to the low-pressure area (such as the second region 02, which is a low-temperature area) through the steam channel 51, the steam quickly condenses into a liquid and releases heat energy when it comes into contact with the cooler inner wall. The condensed liquid working fluid returns to the first region 01 through the capillary force of the liquid absorption structure (i.e., the capillary structure), thus completing one heat conduction cycle and forming a two-way circulation system where the working fluid vapor and liquid coexist.

[0091] Therefore, the heat dissipation structure 100 provided in this embodiment can dissipate the heat of the heat-generating device 1003 in a timely manner, for example, from... Figure 1 In the embodiment, the upper part of the electronic device 1000 (which is in contact with the part of the heat dissipation structure 100 located in the first region 01) dissipates heat to the lower part (which is in contact with the part of the heat dissipation structure 100 located in the second region 02) in a timely manner, thereby making the electronic device 1000 less prone to severe local overheating. This can improve the problems of performance degradation, shortened lifespan, and screen burn-out caused by local overheating, which affect the display effect of various devices in that region.

[0092] In other implementations, the aforementioned heat dissipation structure 100 can be replaced with graphite sheets and / or graphene films. Understandably, when both graphite sheets and graphene films are included, they can be stacked along the Z1 axis. Graphite sheets and graphene films have excellent thermal conductivity, allowing the heat from the heat-generating device 1003 to be effectively dissipated through the graphite sheets and / or graphene films.

[0093] See Figure 5 , Figure 5 This is a cross-sectional schematic diagram of an electronic device 1000 provided in an embodiment of this application. The electronic device 1000 includes a mid-frame 81, a back cover 82, a screen 1001, a battery 83, a chip 84, a motherboard 85, and a heat sink 86. The mid-frame 81 includes a frame 811 and a middle plate 812. One end of the frame 811 along the Z1 axis is connected to the screen 1001, and the other end is connected to the back cover 82. The middle plate 812 is fixed to the inner side of the frame. The chip 84, motherboard 85, and battery 83 are located between the middle plate 812 and the back cover 82. The chip 84 is located on the motherboard 85 and is in contact with the middle plate 812. The battery 83 and motherboard 85 are arranged along a predetermined direction (such as the Y1 axis). The heat sink 86 is located between the middle plate 812 and the screen 1001. The heat sink 86 can be connected to the mid-frame (e.g., by bonding, overlapping welding, screw fastening, etc.). For example, the heat sink 86 can be at least one of the aforementioned heat dissipation structure 100, graphite sheet, and graphene film. The heat from the chip 84 can be dissipated in the direction of the arrow.

[0094] See Figure 6 , Figure 6 This is a cross-sectional schematic diagram of an electronic device 1000 when the screen 1001 is deformed, as provided in an embodiment of this application. The inventors of this application, in conjunction with... Figure 5 and Figure 6 Further research revealed that without the heat sink 86, the large air gap between the screen and the middle plate makes the screen prone to deformation under external forces (such as compression), resulting in insufficient support and easy breakage. In some embodiments of this application, the heat sink 86 is provided, which can provide some buffering and support, mitigating the aforementioned problems to some extent. However, when graphite sheets and graphene films are used as the heat sink 86, their softness means they offer weak buffering and support capabilities during screen deformation and compression, still posing a significant risk of screen breakage. When the heat dissipation structure 100 is used as the heat sink 86, the outer shell (first cover plate and second cover plate) is made of a metal material with high elastic modulus, high hardness, and low elongation (such as copper, copper alloy, or stainless steel). This causes a large rebound force when the screen comes into contact with the outer shell of the heat dissipation structure due to external impact, making the screen prone to problems such as light and shadow effects, black spots, mold marks, bright spots, green lines, and cracking.

[0095] Based on this, please refer to Figure 7 , Figure 8 and Figure 9 , Figure 7 This is a schematic diagram of the structure of the first cover plate 10 without the buffer groove 70 provided in an embodiment of this application. Figure 8 This application provides a stress-strain curve diagram of a first sealing layer 11 (or a second sealing layer 13) and a first material layer 12, as shown in the embodiments of this application. Figure 9 This is a schematic diagram of the fixture and the first cover plate 10 for molding the buffer groove 70 provided in some embodiments of this application. In some embodiments of this application, the first cover plate 10 includes a first sealing layer 11, a first material layer 12, and a second sealing layer 13, with the first material layer 12 located between the first sealing layer 11 and the second sealing layer 13. The surface of the first cover plate 10 opposite to the second cover plate 20 has multiple buffer grooves 70, which are spaced apart. The position of the first material layer 12 corresponding to the buffer groove 70 includes elastic deformation. It is understood that the elastic deformation of the position of the first material layer 12 corresponding to the buffer groove 70 does not completely exclude the possibility of local plastic deformation. The elastic deformation here can be determined by whether the first material layer 12 rebounds after the first sealing layer 11 and the second sealing layer 13 are removed. The rebound here does not require the first material layer 12 to completely rebound to a planar state.

[0096] In some examples, the yield point strain of the first material layer 12 is greater than the yield point strain of the first sealing layer 11 and greater than the yield point strain of the second sealing layer 13. The locations of the buffer grooves in the first sealing layer 11 and the second sealing layer 13 include plastic deformation. The plastic deformation of the first sealing layer 11 and the second sealing layer 13 can constrain the shape of the first material layer 12. Strain can include surface strain ε = (area change / initial total area) * 100%, and yield point strain refers to the strain corresponding to the yield point location, i.e., as shown... Figure 8 The x-coordinate value corresponding to the yield point location is shown. This can also be understood as the boundary between elastic deformation and plastic deformation. In this case, the buffer groove 70 can be manufactured by compression molding. For example, as... Figure 9 As shown, the fixture includes an upper pressure plate 91 and a lower pressure plate 92. The upper pressure plate 91 includes a protrusion 911, and the lower pressure plate 92 includes a recess 921. When the upper pressure plate 91 and the lower pressure plate 92 approach each other, the protrusion 911 and the recess 921 cooperate with each other to mold a buffer groove 70 onto the first cover plate 10. For example, in the comparison... Figure 8It can be seen that after the protrusion 911 contacts the first cover plate 10, it can go through three stages. In stage A, the first cover plate 10 does not undergo significant deformation; in stage B, the first sealing layer 11, the first material layer 12, and the second sealing layer 13 in the first cover plate 10 all undergo elastic deformation; and in stage C, the first material layer 12 in the first cover plate 10 is still elastically deformed, while the first sealing layer 11 and the second sealing layer 13 undergo plastic deformation. Therefore, the deformation state of the first material layer 12 can be constrained by the first sealing layer 11 and the second sealing layer 13.

[0097] It should be noted that, Figure 9 The accompanying drawings are merely illustrative of the buffer groove formed by compression molding. Of course, in other embodiments, other processes can be used to form the buffer groove 70 (e.g., electroplating a first sealing layer 11 on one surface and a second sealing layer 13 on the other of the two opposing surfaces of the first material layer 12 that undergoes elastic deformation, thereby restricting the first material layer 12 from returning to its original state). Therefore, in some embodiments of this application, the formation method of the buffer groove 70 is not limited, as long as the position of the buffer groove 70 in the first material layer 12 includes elastic deformation, and the buffer groove 70 can absorb stress when the first cover plate 10 deforms. Furthermore, the shape and size of any two buffer grooves 70 can be the same or different.

[0098] In the heat dissipation structure 100 provided in this embodiment, the first cover plate 10 has multiple buffer grooves 70, which are spaced apart, giving the first cover plate 10 a better buffering and supporting effect. Furthermore, since the first cover plate 10 includes a first sealing layer 11, a first material layer 12, and a second sealing layer 13, with the first material layer 12 sandwiched between the first sealing layer 11 and the second sealing layer 13, and the position of the first material layer 12 corresponding to the buffer groove 70 includes elastic deformation, the buffer groove 70 of the first cover plate 10 has better stress absorption and release capabilities, thereby further improving the compressive deformation and recovery capabilities of the first cover plate 10. For example, when the heat dissipation structure 100 is applied to the aforementioned electronic device 1000, for instance, when the heat dissipation structure 100 is squeezed by the aforementioned screen 1001, the first cover plate 10 has a good buffering and supporting effect, and the buffer groove 70 has a better stress absorption and release capability, making the first cover plate 10 more flexible. Furthermore, since the first material layer 12, which is bound by the first sealing layer 11 and the second sealing layer 13, will not have an excessive rebound force, that is, the screen 1001 will not experience failure problems such as light and shadow, black spots, mold marks, bright spots, green lines, or cracks due to the excessive rebound force of the first cover plate 10.

[0099] Furthermore, since the first material layer 12 has a first sealing layer 11 and a second sealing layer 13 on opposite sides, it can effectively seal and protect the first material layer 12, thereby improving the lifespan and reliability of the first cover plate 10. On the other hand, the more symmetrical structure allows for better flatness of the first cover plate 10. For example, the more symmetrical mechanical material parameters, such as the modulus of the material in the thickness direction of the first cover plate 10, make it less prone to curling. Moreover, the unit weight of the first material layer 12 can be less than the unit weight of the first sealing layer 11 and less than the unit mass of the second sealing layer 13. Compared to a first cover plate 10 of the same thickness without the first material layer 12, this reduces the overall weight of the first cover plate 10, achieving a lightweight design.

[0100] In some embodiments, the shape of any buffer groove 70 includes any one of circular, polygonal, straight, and wavy shapes. Here, the shape of the buffer groove 70 can be understood as the orthographic projection shape of the buffer groove 70 on the X2-Y2 plane. See also Figures 10-13 , Figure 10 This is a schematic diagram of the structure of a first cover plate 10 provided in an embodiment of this application. Figure 11 for Figure 10 A cross-sectional view of the first cover plate 10 along the BB direction. Figure 12 This is a schematic diagram of another first cover plate provided in an embodiment of this application. Figure 13 This is a schematic diagram of another first cover plate 10 provided in an embodiment of this application. Figure 10 and Figure 11 The shape of the buffer groove 70 is illustrated as a circle. Figure 12 The diagram illustrates the shape of the buffer groove 70 as a hexagon. Figure 13 The shape of the buffer groove 70 is illustrated as a straight bar. The wavy bar can be formed by adding waves along the Y2 axis and / or Z2 axis based on the straight bar.

[0101] For example, refer to Figure 11 Furthermore, a fillet R1 can be provided at the bottom of the buffer groove 70, and a fillet R2 can be provided at the top. This design reduces the likelihood of breakage at the location where the buffer groove 70 is located when the first cover plate 10 bends. This is only an example of... Figure 11 Taking the circular shape of the buffer groove 70 as an example, for... Figure 12 , Figure 13 In some embodiments, the structure may also have a similar shape to the fillet R1 and fillet R2 described above.

[0102] In addition, Figures 10-13In the embodiments described, all buffer grooves 70 in the first cover plate 10 are illustrated with the example of having the same shape and size. However, this application does not limit this. For example, buffer grooves 70 with different shapes and sizes can also be present on the same first cover plate 10 at the same time.

[0103] In some embodiments, at least a portion of the buffer groove 70 (e.g., one, two, or more buffer grooves 70) has its top opening facing the side of the first cover plate 10 away from the second cover plate 20. For example, in Figure 10 , Figure 12 , Figure 13 In this embodiment, the top opening of the buffer groove 70 faces the direction indicated by the Z2 axis. This arrangement can fully utilize the buffering effect of the buffer groove 70. For example, a second cover plate 20 can be provided to contact the screen 1001, with the first cover plate 10 located on the side of the second cover plate 20 away from the screen 1001. This helps to improve the screen imprinting problem caused by the buffer groove 70.

[0104] In other embodiments, at least some of the buffer grooves 70 (e.g., one, two, or more buffer grooves 70) have their top openings facing the side of the first cover plate 10 closer to the second cover plate 20. For example, the top openings of the buffer grooves 70 may face the direction indicated by the -Z2 axis. This arrangement can prevent screen molding problems while the first cover plate 10 is in contact with the screen 1001.

[0105] See Figure 14 , Figure 14 This is a schematic diagram of another first cover plate 10 provided in an embodiment of this application.

[0106] In some embodiments, the first cover plate 10 further includes a first filler 44 located in at least one buffer groove 70. The material of the first filler 44 includes an organic polymer material. This arrangement is beneficial for further enhancing the buffering and protective capacity of the first cover plate 10. The organic polymer material includes at least one of polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyvinylidene chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), and polyamide (PA).

[0107] In some embodiments, the first cover plate 10 further includes a second filler 45 located in at least one buffer tank 70. The material of the second filler 45 includes a phase change energy storage material. This arrangement helps to further improve the thermal conductivity of the first cover plate 10. The phase change energy storage material refers to a material that changes to different states (e.g., liquid and gas, liquid and solid, solid and gas) at different temperatures. In this case, a sealing layer can also be provided to confine the phase change energy storage material within the buffer tank 70.

[0108] Understandably, Figure 14 The illustration takes as an example that a portion of the buffer slots 70 of the first cover plate 10 are filled with a first filler 44 and another portion of the buffer slots 70 are filled with a second filler 45. However, in other embodiments, the first filler 44 may be filled in all the buffer slots 70, or the second filler 45 may be filled in all the buffer slots 70; or, the first filler 44 and the second filler 45 may be filled in the same buffer slot 70 at the same time.

[0109] In some embodiments, see Figure 15 , Figure 15This is a schematic diagram illustrating the structure of a first cover plate 10 cooperating with a screen 1001, as provided in an embodiment of this application. The electronic device 1000 may further include an adhesive layer 14, located between the heat dissipation structure 100 and the screen 1001. Exemplarily, the adhesive layer 14 may be located on the side of the first cover plate 10 opposite to the second cover plate 20 (i.e., as shown in the diagram). Figure 15 (As shown), or located on the side of the second cover plate 20 away from the first cover plate 10 (not shown). By providing the adhesive layer 14, the first cover plate 10 (or the second cover plate 20) can be bonded and fixed to the screen 1001. In addition, when the adhesive layer 14 is located on the side of the first cover plate 10 away from the second cover plate 20, since the first cover plate 10 has a buffer groove 70, the buffer groove 70 can also be used to prevent the adhesive layer 14 between the screen 1001 and the first cover plate 10 from delamination due to shear stress. At the same time, when a phase change energy storage material is provided in the buffer groove 70, the adhesive layer 14 may also be equivalent to the aforementioned sealing layer, confining the phase change energy storage material within the buffer groove 70.

[0110] In some embodiments, see Figure 9 , Figure 14 and Figure 15 A plurality of protruding structures 71 are also provided on the first cover plate 10, wherein any one of the protruding structures 71 protrudes towards the second cover plate 20. The protruding structure 71 here can serve as the aforementioned support column 43, or as the aforementioned micro-column 32, or as a structure with other uses. This application does not limit the specific size and use of the protruding structure 71. For example, the protruding structure 71 can be formed by molding (such as stamping, hot pressing, or other forming processes) and protrudes towards the second cover plate 20 (such as the -Z2 axis direction). For example, this protruding structure 71 can be made by… Figure 9 The fixture in this embodiment is formed by compression molding. In this case, the protruding structure 71 can be formed together with the buffer groove 70, which simplifies the process and reduces costs.

[0111] Furthermore, it should be noted that when the second sealing layer 13 is closer to the second cover plate than the first sealing layer 11, if it is necessary to etch the support column 43 on the surface of the first cover plate 10 near the second cover plate 20 and form a sufficient steam channel height, the second sealing layer 13 needs to have a sufficient thickness, for example, greater than 0.15 mm. This would significantly increase the weight of the first cover plate 10. However, for the first cover plate 10 provided in some embodiments of this application, the buffer groove 70 and the protruding structure 71 (such as the support column 43 or micro-columns 32) can be formed by forming processes such as stamping or hot pressing, making the first cover plate 10 lighter and reducing production costs.

[0112] For example, the material of the first sealing layer 11 may include metal or ceramic. The metal may be pure copper, copper alloy, etc. In this example, the first sealing layer 11 has relatively high structural strength and good sealing and toughness. This helps to improve the structural strength of the first cover plate 10 and extend its service life.

[0113] For example, the material of the second sealing layer 13 may include metal or ceramic. The metal may be pure copper, copper alloy, etc. In this example, the second sealing layer 13 has relatively high structural strength and good sealing and toughness. This helps to improve the structural strength of the first cover plate 10 and extend its service life.

[0114] For example, the first sealing layer 11 and the second sealing layer 13 are made of the same material. This arrangement helps to make the mechanical parameters of the first cover plate 10 symmetrical in the thickness direction (Z2 axis), so that the first cover plate 10 is less likely to curl.

[0115] For example, the thickness of the first sealing layer 11 is equal to or substantially equal to the thickness of the second sealing layer 13. Here, "substantially equal" means that there may be a small deviation between the two, such as the thickness difference being less than 5% of the thickness of the smaller one, or the thickness difference being less than 10% of the thickness of the smaller one.

[0116] In this example, it is also beneficial to make the mechanical parameters of the first cover plate 10 symmetrical in the thickness direction (Z2 axis), so that the first cover plate 10 is less likely to curl.

[0117] For example, the thermal conductivity of the first material layer 12 is greater than or equal to 400 W / (m·k). For instance, the thermal conductivity of the first material layer 12 can be 400 W / (m·k), 500 W / (m·k), 600 W / (m·k), 800 W / (m·k), etc. This configuration results in high thermal conductivity for the first cover plate 10.

[0118] In some embodiments, the material of the first material layer 12 may include organic polymer materials, such as polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyvinylidene chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc.

[0119] In this example, the first material layer 12 can have better plasticity and higher elongation, so that the first cover plate 10 formed therefrom is easy to be formed by stamping or hot pressing.

[0120] It is worth noting that the inventors of this application have discovered that if the first cover plate 10 is directly constructed consisting only of the first material layer 12, and the material of the first material layer 12 includes organic polymer materials, although weight can be reduced, organic polymer materials are composed of organic macromolecules and have large pores. Therefore, the first cover plate 10 made directly of organic polymer materials cannot guarantee long-term airtightness and will result in vapor leakage. In addition, organic polymer materials are in direct contact with the working fluid (e.g., water) inside the receiving cavity 50, which can easily cause a chemical reaction to produce non-condensable gases. These non-condensable gases may accumulate in the cold area of ​​the receiving cavity 50, reducing its heat dissipation performance. In this embodiment, the first material layer 12 is sandwiched between the first sealing layer 11 and the second sealing layer 13. On the one hand, this effectively reduces the total weight of the first cover plate 10, achieving a lightweight design; on the other hand, it also provides a good seal and protection for the first material layer 12, thereby improving the lifespan and reliability of the first cover plate 10.

[0121] Furthermore, in some examples, the material of the first material layer 12 in the first cover plate 10 is an organic polymer material (e.g., PI), while the materials of the first sealing layer 11 and the second sealing layer 13 are both metals (e.g., copper). Organic polymer materials have a lower elastic modulus and a higher elongation, exhibiting good toughness, but their structural strength is weak after plastic deformation, making them prone to deformation. Metals have a higher elastic modulus and a lower elongation, maintaining high structural strength after plastic deformation, and possessing high hardness and resistance to deformation. In this embodiment, a plastic molding process (including cold pressing or hot pressing) can be used to form a first cover plate 10 comprising a buffer groove 70 and a protruding structure 71 from the composite material of the first sealing layer 11, the first material layer 12, and the second sealing layer 13. This first cover plate 10 combines the advantages of the high elongation and good toughness of organic polymer materials with the high strength of metals, providing excellent buffering protection for the screen 1001.

[0122] For example, the ratio between the thickness (dimension along the Z2 axis) of the first material layer 12 and the total thickness (dimension along the Z2 axis) of the first cover plate 10 is greater than or equal to 20%. This configuration allows the first cover plate 10 to achieve better weight reduction. Furthermore, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 by molding, wrinkles or even breakage are less likely to occur.

[0123] For example, the ratio between the thickness (dimension along the Z2 axis) of the first material layer 12 and the total thickness (dimension along the Z2 axis) of the first cover plate 10 is greater than or equal to 24%. This configuration makes the weight reduction benefits of the first cover plate 10 more significant. Furthermore, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 by molding, wrinkles or even breakage are less likely to occur.

[0124] For example, the ratio between the thickness (dimension along the Z2 axis) of the first material layer 12 and the total thickness (dimension along the Z2 axis) of the first cover plate 10 is greater than or equal to 33%. This configuration makes the weight reduction benefits of the first cover plate 10 more significant. Furthermore, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 by molding, wrinkles or even breakage are less likely to occur.

[0125] For example, the thickness (dimension along the Z2 axis) of the first material layer 12 is greater than or equal to 5 μm. This configuration allows the first cover plate 10 to achieve better weight reduction. Furthermore, when multiple protruding structures 71 are formed on the first cover plate 10 by molding, wrinkles or even breakage are less likely to occur.

[0126] For example, the thickness of the first material layer 12 is greater than or equal to 15 μm. This configuration makes the weight reduction benefits of the first cover plate 10 more significant. Furthermore, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 by molding, wrinkles or even breakage are less likely to occur.

[0127] It should be noted that existing three-layer composite flexible copper clad laminates (FCCLs) include a middle substrate (such as PI) and copper layers on both sides, with the copper layer thickness not exceeding 0.05 mm. In some examples, the buffer groove 70 and protruding structure 71 can be directly formed by molding existing three-layer composite flexible copper clad laminates to form the first cover plate 10, without the need for customized raw materials of special thickness specifications. This is more conducive to reducing raw material costs, thereby providing a low-cost, easily mass-producible, and lightweight first cover plate 10. For example, in the three-layer composite flexible copper clad laminate, the thickness of the top and bottom copper layers can be 12 μm, and the thickness of the middle layer can be 25 μm.

[0128] Table 1 shows the density values ​​of several raw materials used in the embodiments of this application for making the first cover plate (or the second cover plate).

[0129] Table 1

[0130] copper alloy C5191 8960 Stainless steel 316L 7874 Titanium alloy TA1 4506 Polyimide (PI) - 1880 FCCL (two or three layers) PI percentage is greater than or equal to 30% 3000～6000

[0131] As shown in Table 1, when the first cover plate 10 is formed by using a three-layer composite flexible copper clad laminate (FCCL), the average density of the first cover plate 10 is smaller (i.e., 3000-6000), thus making it easier to achieve a lightweight design.

[0132] The second cover plate 20 provided in some embodiments of this application will now be described.

[0133] Please see Figure 16 and Figure 17 , Figure 16 This is a schematic diagram of a heat dissipation structure according to an embodiment of this application. Figure 17 This is a schematic diagram of another heat dissipation structure in an embodiment of this application. Wherein, Figure 16 and Figure 17 The difference lies in the structure of the second cover plate. In some embodiments, the second cover plate 20 includes a third sealing layer 21 and a second material layer 22; the second material layer 22 is located on the side of the third sealing layer 21 away from the first cover plate 10; the yield point strain of the second material layer 22 is greater than the yield point strain of the third sealing layer 21.

[0134] In this embodiment, by setting the yield point strain of the second material layer 22 to be greater than that of the third sealing layer 21, the structural strength of the second cover plate 20 is improved, making it less prone to cracking. For example, when micropillars 32 and / or support pillars 43 are etched on the surface of the third sealing layer 21 facing away from the second material layer 22, the thickness of the base material of the third sealing layer 21 can be etched to be less than or equal to 0.03 mm without wrinkling or cracking. Furthermore, the unit weight of the second material layer 22 can be less than the unit weight of the third sealing layer 21. Thus, compared to a second cover plate of the same thickness without the second material layer 22, the total weight of the second cover plate 20 can be reduced, achieving a lightweight design.

[0135] For example, in some embodiments of the heat dissipation structure 100 provided in this application, the design thickness of the first cover plate 10 can be no less than 0.03 mm, the design thickness of the liquid absorber 31 can be no less than 0.14 mm, and the design thickness of the second cover plate 20 can be no less than 0.03 mm. In this case, the total thickness of the heat dissipation structure 100 can be 0.2 mm or more, which is very thin. In some examples, the design thickness of the first cover plate 10 is 0.05 mm, the design thickness of the liquid absorber 31 is 0.15 mm, and the design thickness of the second cover plate 20 is 0.05 mm. In this case, the total thickness of the heat dissipation structure is 0.25 mm. In this example, the thickness of the heat dissipation structure 100 is relatively thin, resulting in significant weight reduction benefits. It is understood that in... Figure 16 and Figure 17 In this embodiment, since the liquid-absorbing core 31 is located inside the second cover plate 20, the actual thickness of the second cover plate 20 is the design thickness of the second cover plate plus the design thickness of the liquid-absorbing core 31. The total thickness of the heat dissipation structure 100 is the actual thickness of the second cover plate 20 plus the design thickness of the first cover plate 10. Here, each "thickness" refers to its respective dimension along the Z2 axis.

[0136] For example, the material of the third sealing layer 21 may include metal or ceramic. The metal may be pure copper, copper alloy, etc. In this example, the third sealing layer 21 has relatively high structural strength and good sealing and toughness. This helps to improve the structural strength of the second cover plate 20 and extend its service life.

[0137] For example, the second sealing layer 13 is closer to the third sealing layer 21 than the first sealing layer 11; the material of the third sealing layer 21 is the same as the material of the second sealing layer 13. This arrangement facilitates the welding and sealing of the third sealing layer 21 and the second sealing layer 13, which also facilitates the welding and fixing of the first cover plate 10 and the second cover plate 20.

[0138] For example, the material of the second material layer 22 includes organic polymer materials, such as polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyvinylidene chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc.

[0139] In this example, the second material layer 22 can be made to have good toughness, so that the structure of the second cover plate 20 is strong and is not prone to wrinkles or even breakage.

[0140] For example, the ratio between the thickness (dimension along the Z2 axis) of the second material layer 22 and the total thickness (dimension along the Z2 axis) of the second cover plate 20 is greater than or equal to 50%. This configuration allows the second cover plate 20 to achieve better weight reduction. Furthermore, when etching structures such as micropillars 32 and / or support pillars 43 on the second cover plate 20, wrinkles or even breakage are less likely to occur.

[0141] In some examples, such as Figure 16 As shown, the second cover plate 20 has a placement groove 72 formed by molding on the side near the first cover plate 10, and the liquid-absorbing core 31 is placed in the placement groove 72. At this time, the micropillars 32 may not be provided on the second cover plate 20.

[0142] In this example, because the second cover plate 20 has a second material layer 22 with better toughness, and the placement groove 72 formed by molding on the side of the second cover plate 20 close to the first cover plate 10 has a large area, the structural strength of the second cover plate 20 is still high, and it is not easy to have wrinkles or even breakage.

[0143] It should be noted that existing two-layer composite flexible copper clad laminates (FCCLs) include a substrate (such as PI) and a copper layer on one side of the substrate, with a copper layer thickness not exceeding 0.05 mm. In some examples, the existing two-layer composite flexible copper clad laminate can be directly used to form the placement groove 72 through molding, thereby forming the second cover plate 20, without the need for custom-made raw materials of special thickness specifications. This is more conducive to reducing raw material costs, thus providing a low-cost, easily mass-producible, and lightweight second cover plate 20.

[0144] As can be seen from Table 2 above, when the second cover plate 20 is formed by using a two-layer composite flexible copper clad laminate (FCCL), the average density of the second cover plate 20 is smaller (e.g., 3000-6000), thus making it easier to achieve a lightweight design.

[0145] In other examples, such as Figure 17 As shown, the third sealing layer 21 has a groove 74 on the side near the first cover plate 10. The groove 74 includes a first groove portion 741 and a second groove portion 742, with the first groove portion 741 being closer to the bottom wall of the groove 74 than the second groove portion 742. The second cover plate 20 also includes a plurality of columnar structures 73 located in the first groove portion 741, which are connected to the bottom wall. The liquid-absorbing core 31 is placed in the second groove portion 742, and the plurality of columnar structures 73 support the liquid-absorbing core 31.

[0146] For example, the columnar structure 73 here can be the aforementioned support column 43 or micro-column 32.

[0147] For example, the columnar structure 73 can be manufactured by processes such as stamping, hot pressing, etching or electroplating.

[0148] In this design, because the second cover plate 20 has a second material layer 22 with better toughness, the groove 74 located in the third sealing layer 21 can be formed by molding or etching. Regardless of the method, the structural strength of the resulting second cover plate 20 remains high. Furthermore, when the groove 74 is formed by etching, the multiple columnar structures 73 within the groove 74 can also be directly etched. When the groove 74 is formed by molding, the multiple columnar structures 73 within the groove 74 can be formed by dispensing adhesive. This arrangement helps ensure that the second cover plate 20 has sufficient structural strength.

[0149] In other embodiments, please refer to Figure 18 , Figure 18This is a schematic diagram of another heat dissipation structure 100 in the embodiments of this application. The second cover plate 20 in the heat dissipation structure 100 is made of metal material such as pure copper or copper alloy by etching. At this time, its base thickness can be greater than 0.03mm. With this setting, it is not easy to wrinkle, crack or deform.

[0150] Based on this, for example, such as Figure 18 As shown, a groove 74 including a first groove 741 and a second groove 742 can also be provided on the second cover plate 20, and multiple columnar structures 73 and liquid-absorbing cores 31 can be provided in the groove 74. For specific configuration methods, please refer to the foregoing content, which will not be repeated here.

[0151] In some other embodiments, the second cover plate 20 may be configured in the same way as the first cover plate 10, which will not be described again here. Figure 19 As shown, Figure 19 This is a schematic diagram of another heat dissipation structure 100 in the embodiments of this application.

[0152] In some other embodiments, please refer to Figure 20 , Figure 20 This is a schematic diagram of another heat dissipation structure 100 in this application embodiment. The material of the second cover plate 20 of the heat dissipation structure 100 can be a double / triple metal composite material (such as the first metal layer 201, the second metal layer 202, and the third metal layer 203), such as copper-steel, copper-titanium, copper-steel-copper, copper-titanium-copper, copper-aluminum-copper, copper-magnesium-copper, copper (magnesium-aluminum alloy)-copper, etc. The composite material has high strength, which can greatly improve the overall mechanical performance of the heat dissipation structure 100, prevent the heat dissipation structure 100 from deforming when squeezed, and improve the manufacturing yield and overall reliability of the heat dissipation structure 100. In addition, it is worth noting that the double / triple metal composite material provided in this application embodiment is more suitable for the low-temperature process (such as 300-400 degrees Celsius) used in the first cover plate 10, that is, after the second cover plate 20 is formed, the second cover plate 20 is not easy to soften and can have higher structural strength.

[0153] Based on this, for example, multiple columnar structures 73 can be pressed onto the second cover plate 20 by forming processes such as stamping or hot pressing. At this time, the columnar structures 73 are equivalent to support columns 43, and steam channels are formed between the multiple columnar structures 73. The columnar structures 73 can make the heat dissipation structure 100 have higher structural strength, so that the heat dissipation structure 100 is not easy to collapse and block the steam channels, thus it is not easy to fail and has higher reliability.

[0154] The first cover plate 10, the second cover plate 20 and the liquid absorption core 31 (hereinafter referred to as the first liquid absorption core) were introduced above. The second liquid absorption core and the third liquid absorption core will be introduced below.

[0155] In some embodiments, see Figure 21 and Figure 22 , Figure 21 This is a schematic diagram illustrating the structure of a heat dissipation structure 100 in conjunction with a screen 1001 and a heat-generating device 1003, as provided in an embodiment of this application. Figure 22 This is a schematic diagram illustrating the combination of a first cover plate 10 and a second absorbent core 33 according to an embodiment of this application. The adhesive layer 14 can be located on the side of the second cover plate 20 opposite to the first cover plate 10, i.e., the adhesive layer 14 is bonded between the second cover plate 20 and the screen 1001. The second cover plate 20 contains micropillars 32 and a first absorbent core (i.e., absorbent core 31). In addition, a second absorbent core 33 is also provided within the vapor channel 51 between the second cover plate 20 and the first cover plate 10. One surface of the second absorbent core 33 contacts the first cover plate 10, and the other surface contacts the first absorbent core. The orthographic projection of the heating device 1003 in the X2-Y2 plane at least partially overlaps with the orthographic projection of the second absorbent core 33 in the X2-Y2 plane; for example, the orthographic projection of the heating device 1003 in the X2-Y2 plane can be located within the orthographic projection of the second absorbent core 33 in the X2-Y2 plane. This configuration allows the heat from the heating element 1003 to be directly transferred through the first cover plate 10 to the second absorbent core 33, and then from the second absorbent core 33 to the first absorbent core. Compared to the heat being transferred through the vapor channel 51 to the first absorbent core, this configuration results in lower thermal resistance and better temperature uniformity.

[0156] refer to Figure 22 It can be seen that the second absorbent core 33 can expose the support post 43 on the first cover plate 10. That is, the second absorbent core 33 can have a through hole in the Z2 direction, which is used to pass through the support post 43.

[0157] In some embodiments, see Figure 23 , Figure 23 This is a schematic diagram of another heat dissipation structure 100 provided in an embodiment of this application. Figure 23 and Figure 19 The difference lies in replacing the serially arranged first suction core with a parallel arranged third suction core 34. The aforementioned first suction core can be considered a serial capillary scheme. Figure 23 In one embodiment, a plurality of third liquid-absorbing cores 34 may be provided, wherein the two opposing surfaces of each third liquid-absorbing core 34 along the Z2 axis direction are in contact with the first cover plate 10 and the second cover plate 20 respectively, and the plurality of third liquid-absorbing cores may be arranged at intervals along the X2 direction.

[0158] The materials and structures of the second absorbent core 33 and the third absorbent core 34 mentioned above can be the same as those of the absorbent core 31 mentioned above, and will not be repeated here.

[0159] This application embodiment also provides a method for preparing a heat dissipation structure 100, specifically: S1, selecting a suitable cover plate material; S2, performing stamping, cutting, etching, and other processes on the cover plate material to form the first cover plate 10 and the second cover plate 20 as described above; S3, welding and fixing the liquid-absorbing core 31 to the second cover plate 20 (exemplarily, the welding temperature is less than 300 degrees); S4, welding or bonding a conduit (not shown) between the first cover plate 10 and the second cover plate 20, and welding and fixing the edges of the first cover plate 10 and the second cover plate 20 (exemplarily, it can be welding and fixing the edges of the second sealing layer 13 and the third sealing layer 21 as described above). S5. Check for leakage between the first cover plate 10 and the second cover plate 20 after welding; S6. Change the hydrophobic surface of the liquid-absorbing core 31 and the micro-pillar 32 to a hydrophilic surface through a reduction reaction (such as a high-temperature reduction reaction, for example, around 300 degrees Celsius), for example, change its material from copper oxide to copper, so that it has capillary water absorption force; S7. Inject the working fluid into the containment cavity through the conduit and evacuate the vacuum; S8. Cut the conduit and seal it to form a sealed containment cavity; S9. Perform an aging test, such as placing it in a high-temperature chamber for a predetermined time; S10. Perform a sealing test on the heat dissipation structure (such as helium detection); S11. Perform other performance tests, such as testing the thermal conductivity of the heat dissipation structure.

[0160] For example, the glass transition temperature Td of the first material layer 12 and the second material layer 22 is ≥320 degrees. With this configuration, the first material layer 12 and the second material layer 22 can maintain good physical properties during the fabrication of the first cover plate 10 and the second cover plate 20.

[0161] This application also provides another heat dissipation structure 100. See [link / reference] Figure 24 , Figure 24 This is a schematic diagram of another heat dissipation structure 100 provided in this application embodiment cooperating with a screen 1001. The heat dissipation structure 100 includes a fourth sealing layer 101, a third material layer 102, and a fifth sealing layer 103; along a first direction (Z2 axis direction), the third material layer 102 is located between the fourth sealing layer 101 and the fifth sealing layer 103; the material of the third material layer 102 includes at least one of graphite and graphene; the heat dissipation structure 100 has multiple spaced buffer grooves 70; the positions of the buffer grooves 70 in the third material layer 102 include elastic deformation and / or plastic deformation.

[0162] In another heat dissipation structure provided in this application embodiment, since the material of the third material layer 102 includes at least one of graphite material and graphene material, and the position of the third material layer 102 corresponding to the buffer groove 70 includes elastic deformation and / or plastic deformation, the heat dissipation structure 100 has a good heat dissipation and temperature uniformity effect. In particular, the position of the heat dissipation structure 100 corresponding to the buffer groove 70 is not prone to heat accumulation. Furthermore, since the third material layer 102 has a fourth sealing layer 101 and a fifth sealing layer 103 on opposite sides, it effectively seals and protects the third material layer 102, preventing it from collapsing. This provides excellent cushioning and support for the screen 1001, preventing issues such as light and shadow, black spots, mold marks, bright spots, green lines, and cracking. It also reduces the likelihood of weakened heat dissipation capacity due to the collapse of the third material layer 102, thus improving the lifespan and reliability of the heat dissipation structure 100. On the other hand, the more symmetrical structure allows for better planarity of the heat dissipation structure 100. For example, the more symmetrical mechanical parameters, such as the modulus of the material in the thickness direction, make the heat dissipation structure 100 less prone to curling. Additionally, the lighter weight of the third material layer 102 helps reduce the overall weight of the heat dissipation structure 100, achieving a lightweight design.

[0163] In some embodiments, the thermal conductivity of the third material layer 102 is greater than or equal to 400 W / (m·K). This configuration results in high thermal conductivity of the heat dissipation structure 100.

[0164] In some embodiments, at least one of the fourth sealing layer 101 and the fifth sealing layer 103 is made of copper. This configuration provides better sealing and protection for the third material layer 102 and also offers higher heat dissipation efficiency.

[0165] Continue reading Figure 24 An adhesive layer 14 can also be added between the heat dissipation structure 100 and the screen 1001. By setting the adhesive layer 14, the heat dissipation structure 100 can be bonded and fixed to the screen 1001. In addition, when the heat dissipation structure 100 and the screen 1001 are bonded and fixed, since the heat dissipation structure 100 has a buffer groove 70, the buffer groove 70 can also be used to prevent the adhesive layer between the screen and the heat dissipation structure 100 from delamination due to shear stress.

[0166] also, Figure 24 The configuration of the buffer groove 70 in the heat dissipation structure 100 of the embodiment can be found in the description of the buffer groove 70 on the first cover plate 10, and will not be repeated here. Furthermore, the buffer groove 70 here can also be filled with the aforementioned first filler 44 and / or second filler 45.

[0167] In summary, the heat dissipation structure provided in this application embodiment has at least the following advantages:

[0168] First, since the first cover plate 10 is provided with a buffer groove 70, the position of the first material layer 12 corresponding to the buffer groove 70 includes elastic deformation. The buffer groove 70 can absorb stress, making the first cover plate 10 more flexible and without excessive rebound force. That is, the screen 1001 will not have failure problems such as light and shadow, black spots, mold marks, bright spots, green lines, or cracks due to excessive rebound force.

[0169] Second, since the material of the third material layer 102 includes at least one of graphite and graphene, and the position of the third material layer 102 corresponding to the buffer groove 70 includes elastic deformation and / or plastic deformation, the resulting heat dissipation structure 100 has a good heat dissipation and temperature uniformity effect. In particular, heat accumulation is not likely to occur at the position of the heat dissipation structure 100 corresponding to the buffer groove 70. It can also protect the screen and achieve lightweighting.

[0170] Third, by setting the first filler 44 and / or the second filler 45 in the buffer groove, it is beneficial to further improve the thermal conductivity and buffer protection of the first cover plate 10.

[0171] Fourth, when the first cover plate 10 includes the first material layer 12, the average density of the first cover plate 10 is low, which is beneficial to reducing the weight of the first cover plate 10. When the second cover plate 20 includes the second material layer 22, the average density of the second cover plate 20 is low, which is beneficial to reducing the weight of the second cover plate 20.

[0172] Fifth, the first cover plate 10 can be directly molded using a three-layer composite flexible copper clad laminate (FCCL), and the second cover plate 20 can be directly molded using a two-layer composite flexible copper clad laminate (FCCL). This reduces the cost of raw materials and makes it easier to mass-produce.

[0173] VI. The heat dissipation structure shell made of copper alloy, stainless steel, and titanium alloy has a maximum manufacturing temperature of approximately 800°C (annealing and sintering). However, the heat dissipation structure 100 in this embodiment, which includes a first material layer 12 and / or a second material layer 22, has a maximum manufacturing temperature of approximately 300°C. This can protect the copper layer and other metal layer materials, ensuring good yield strength and fracture strength, and making the heat dissipation structure 100 less prone to wrinkling, deformation, or cracking after being squeezed or impacted.

[0174] 7. Since the first cover plate 10 in the heat dissipation structure 100 may include an insulating first material layer 12 (such as PI) and the second cover plate 20 may include an insulating second material layer 22 (such as PI), the heat dissipation structure 100 can be fully or partially insulated towards the middle frame side, thus avoiding the problem of radiated spurious emission (RSE) of the heat dissipation structure 100.

[0175] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation structure, characterized in that, The device includes a first cover plate, a second cover plate, and a liquid-absorbing structure. The first cover plate and the second cover plate are connected to each other to enclose a receiving cavity. The liquid-absorbing structure is located inside the receiving cavity. The liquid-absorbing structure includes a liquid-absorbing core with through holes. A plurality of micropillars are provided on the inner wall surface of the second cover plate, and a groove is provided between two adjacent micropillars. The groove width is less than or equal to 1 mm, and the groove depth is less than or equal to 0.1 mm. The receiving cavity includes a vapor channel located between the first cover plate and the second cover plate. The receiving cavity also includes a second liquid-absorbing core. One side surface of the second liquid-absorbing core is in contact with the liquid-absorbing core, and the other side surface of the second liquid-absorbing core is in contact with the first cover plate. The projected area of ​​the second liquid-absorbing core on the first cover plate is smaller than the projected area of ​​the liquid-absorbing core on the first cover plate.

2. The heat dissipation structure according to claim 1, characterized in that, The liquid-absorbing core includes a woven mesh or an etched mesh.

3. The heat dissipation structure according to claim 1, characterized in that, The liquid-absorbing core includes copper mesh, stainless steel mesh, or woven mesh made of organic materials.

4. The heat dissipation structure according to claim 1, characterized in that, When multiple micropillars are provided on the inner wall surfaces of both the first cover plate and the second cover plate, the liquid-absorbing core is disposed between the multiple micropillars of the first cover plate and the multiple micropillars of the second cover plate.

5. The heat dissipation structure according to claim 1, characterized in that, The thickness of the first cover plate or the second cover plate is not less than 0.03 mm.

6. The heat dissipation structure according to claim 1, characterized in that, The thickness of the liquid-absorbing core is not less than 0.14 mm.

7. The heat dissipation structure according to claim 1, characterized in that, The micropillars are manufactured using stamping, hot pressing, etching, or electroplating processes.

8. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure includes multiple liquid absorption structures, which are arranged in parallel and spaced apart.

9. The heat dissipation structure according to claim 1, characterized in that, The liquid-absorbing core and the microcolumn form a double- or triple-layer capillary structure, within which the working fluid flows.

10. The heat dissipation structure according to claim 1, characterized in that, The second cover plate is provided with a groove, and the plurality of micropillars and the liquid-absorbing core are disposed in the groove.

11. An electronic device, characterized in that, include: Screen and heat-generating components; And, the heat dissipation structure as described in any one of claims 1-10 is located between the screen and the heat-generating device.

12. The electronic device according to claim 11, characterized in that, include: An adhesive layer is located between the heat dissipation structure and the screen.

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