A wafer memory device

Abstract

This invention relates to the field of wafer memory device technology. The invention provides a wafer memory device comprising a memory cell with several stages within it; a transport device disposed within the memory cell, including a lifting assembly; a robotic arm mounted on the lifting assembly; a gripping assembly disposed at the end of the robotic arm for gripping memory cassettes or wafers, the gripping assembly including a mounting body disposed at the end of the robotic arm; gripping pins disposed on the mounting body for inserting into gripping holes in memory cassettes to grip them; and wafer forks disposed on the mounting body for extending into memory cassettes and retrieving wafers. The wafer memory device provided by this invention, through optimized gripping assembly structure, achieves space saving and stage expansion, solving the technical problem of large space occupation during gripping in related technologies.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of wafer memory device technology, and more specifically, to a wafer memory device. Background Technology

[0002] In semiconductor manufacturing processes, wafer memory devices are the core equipment for the orderly storage and transfer of wafers. They are mainly used to carry memory boxes and internal wafers, and work with handling equipment to complete the storage and retrieval of memory boxes and the picking and placing of wafers. They directly affect the operating efficiency of semiconductor production lines and the storage security of wafers.

[0003] Existing wafer memory devices typically include a memory cell, several stages within the memory cell, and a transport mechanism. The transport mechanism is a key component for material handling, requiring dual functions for both memory cell transport and wafer loading / unloading. Currently, the mainstream memory cell gripping method in the industry mostly employs a relatively movable clamping structure, where the clamps on both sides are driven to move closer together to hold the memory cell's side walls in place. However, this gripping method requires redundant space on both sides of the memory cell for the clamps to move, which limits the spacing between stages within the memory cell and restricts the number of stages that can be accommodated within the limited memory cell volume, thus limiting the number of memory cells that can be stored.

[0004] Meanwhile, semiconductor production lines contain memory cells of various sizes. Existing handling devices mostly use gripping components designed for single-size compatibility. Replacing memory cells of different sizes requires disassembling and replacing the corresponding gripping components, which is cumbersome and time-consuming, severely impacting the continuous operation efficiency of the production line. Furthermore, some gripping structures that adapt to multiple sizes are complex in design and occupy a large amount of space, further exacerbating the problem of limited space within the memory compartment.

[0005] Therefore, existing wafer memory devices still have room for improvement in terms of space utilization of the gripping method and multi-size adaptability. There is an urgent need for a technical solution that can optimize space occupation and adapt to multi-size memory cells. Summary of the Invention

[0006] To overcome the above-mentioned defects, embodiments of the present invention provide a wafer memory device that solves the technical problem of large space occupation by the gripping component during the gripping process in related technologies.

[0007] According to one aspect, at least one embodiment of the present invention provides a wafer memory device, comprising:

[0008] A storage compartment for storing wafers, the storage compartment having a plurality of platforms;

[0009] A transport device, disposed within the storage compartment, is used to transport the storage cassette to a stage or to remove wafers from the storage cassette. The transport device includes:

[0010] A lifting assembly is installed inside the storage compartment, and a robotic arm is connected to the lifting end of the lifting assembly;

[0011] A gripping component, disposed at the end of the robotic arm, is used to grip storage bins or wafers. The gripping component includes:

[0012] The mounting body is located at the end of the robotic arm;

[0013] A gripping pin is provided on the mounting body. The gripping pin is used to insert into the gripping hole of the storage box to grip the storage box.

[0014] A wafer fork is disposed on the mounting body, and the wafer fork is used to extend into the storage box and remove the wafer.

[0015] For example, at least one embodiment of this disclosure provides a wafer memory device,

[0016] The outer peripheral wall of the gripping post has an expansion locking sleeve, which can expand and lock the gripping post located in the gripping hole.

[0017] For example, at least one embodiment of this disclosure provides a wafer memory device,

[0018] The outer peripheral wall of the gripping insertion post is provided with an annular groove, and the expansion lock is sleeved in the annular groove;

[0019] The gripping insert has an inflation channel, and the inner wall of the annular groove has an air hole that communicates with the inflation channel and the expansion locking sleeve.

[0020] A pneumatic component is disposed within the mounting body and communicates with the inflation channel. The pneumatic component is capable of inflating the expansion locking sleeve to expand or drawing air to contract the expansion locking sleeve.

[0021] For example, at least one embodiment of this disclosure provides a wafer memory device,

[0022] The four gripping pins are arranged circumferentially and are used to be inserted into the four gripping holes on the storage box one by one.

[0023] For example, at least one embodiment of this disclosure provides a wafer memory device,

[0024] The gripping pin is slidably disposed on the mounting body along its axial direction. The gripping pin has a non-gripping state that is slidably retracted into the mounting body and a gripping state that is slidably extended out of the mounting body.

[0025] The gripping pins are of several kinds, and every four gripping pins form a group of gripping pins. Different groups of gripping pins are used to grip storage boxes of different sizes. When one group of gripping pins is used to grip storage boxes, all the gripping pins in the group are in the gripping state, while the gripping pins in other groups are in the non-gripping state.

[0026] For example, a wafer memory device provided in at least one embodiment of this disclosure further includes:

[0027] A telescopic drive component is disposed within the mounting body. The telescopic drive component is connected to the gripping pin and is used to drive the gripping pin to slide axially.

[0028] For example, at least one embodiment of this disclosure provides a wafer memory device,

[0029] The number of gripping pins is one, and the cross-sectional shape of the gripping pin and the gripping hole is the same, both being polygonal prisms.

[0030] For example, a wafer memory device provided in at least one embodiment of this disclosure further includes:

[0031] The wafer fork is rotatably mounted on the top of the mounting body. When the wafer fork is rotated to a horizontal position and is located on the same side as the gripping post, it is in the fork-taking and use state. When the wafer fork is rotated to a vertical position, it is in the avoidance and idle state.

[0032] For example, at least one embodiment of this disclosure provides a wafer memory device,

[0033] The wafer toothed fork is divided into a first section and a last section, which are hinged together.

[0034] When the wafer fork is in the avoidance idle state, the end of the wafer fork is tilted to one side to avoid the gripping pin. When the wafer fork is in the fork picking use state, the first and last sections of the wafer fork are parallel.

[0035] For example, at least one embodiment of this disclosure provides a wafer memory device,

[0036] When the wafer fork is in the avoidance idle state, the angle between the end section and the beginning section of the wafer fork is greater than 90°.

[0037] The beneficial effects of the embodiments of the present invention are as follows:

[0038] In this invention, the storage compartment's platforms are distributed circumferentially, and in conjunction with a centrally located transport device, the orderly storage and retrieval of storage boxes are achieved. The lifting components of the transport device, in conjunction with a robotic arm, can cover all platforms within the storage compartment, ensuring the feasibility of accessing storage boxes and wafers at each location.

[0039] The gripping component uses gripping pins inserted into gripping holes in the storage box to achieve gripping. Compared with the relative movement of clamping plates in existing technologies, it eliminates the need to reserve space on both sides of the storage box for the clamping plates to move, significantly reducing the space occupied by the surrounding area during gripping. As a result, the spacing between the platforms within the storage compartment can be reduced accordingly, allowing more platforms to be set within the same storage compartment volume, thereby increasing the storage capacity of the storage box. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are merely some exemplary embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the exemplary embodiments of the present invention and these drawings without any creative effort.

[0041] Figure 1 This is a schematic diagram of the structure of a wafer memory device in one embodiment of the present invention;

[0042] Figure 2 for Figure 1 A schematic diagram of the main view structure in the embodiment;

[0043] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure of AA;

[0044] Figure 4 for Figure 2 Schematic diagram of the cross-sectional structure of BB;

[0045] Figure 5 This is a schematic diagram of a conveying device in the prior art;

[0046] Figure 6 for Figure 1 A schematic diagram of the conveying device structure in the embodiment;

[0047] Figure 7 for Figure 1 A schematic diagram of the main structure of the conveying device in the embodiment;

[0048] Figure 8 for Figure 7 Schematic diagram of the CC section structure;

[0049] Figure 9 for Figure 1 A schematic diagram of the cross-sectional structure of the gripping insertion post in the embodiment;

[0050] Figure 10 for Figure 1 A schematic diagram of the storage box in the embodiment;

[0051] Figure 11 for Figure 1 A schematic diagram of the transport device in another embodiment;

[0052] Figure 12 for Figure 11 A magnified schematic diagram of the middle D section;

[0053] Figure 13 for Figure 11 A schematic diagram of the storage box in the embodiment;

[0054] Figure 14 for Figure 1 A schematic diagram of the structure when the wafer tooth fork is in the avoidance idle state in the embodiment;

[0055] In the diagram: 1-Storage compartment, 2-Transfer device, 21-Lifting assembly, 210-Arc-shaped guide groove, 22-Robotic arm, 23-Grip assembly, 231-Mounting body, 232-Grip pin, 233-Wafer tooth fork, 234-Expansion locking sleeve, 235-Annular groove, 236-Inflation channel, 237-Pneumatic component, 238-Telescopic drive component, 239-Air hole, 31-First section, 32-Later section, 91-Storage box, 92-Platform, 94-Grip pin. Detailed Implementation

[0056] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it.

[0057] To keep the drawings concise, each drawing only schematically shows the parts relevant to the invention; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one," and "several" includes "two" and "more than two."

[0058] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0059] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0060] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0061] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0062] like Figures 1-14 As shown, this illustrates a wafer memory device according to an embodiment of the present invention, including a memory cell 1 and a transport device 2. The memory cell 1 has a plurality of platforms 92 spaced apart along both the vertical and horizontal directions for supporting memory cartridges 91; the memory cartridges 91 are provided with gripping holes 94, which are located on both sides of the end face of the memory cartridges 91 (e.g., ...). Figure 10 (As shown).

[0063] The handling device 2 is located at the center of the storage compartment 1 and includes a lifting assembly 21, a robotic arm 22, and a gripping assembly 23. The lifting assembly 21 is fixed to the bottom of the storage compartment 1 and extends vertically. One end of the robotic arm 22 is connected to the lifting assembly 21 and can move vertically under the drive of the lifting assembly 21 to align with the platform 92 at different heights. The other end of the robotic arm 22 can extend and retract horizontally to move closer to or away from the platform 92.

[0064] The gripping assembly 23 is located at the end of the robotic arm 22 away from the lifting assembly 21, and includes a mounting body 231, gripping pins 232, and wafer forks 233. The mounting body 231 is connected to the end of the robotic arm 22, and its working surface faces the platform 92. The gripping pins 232 are located on the working surface of the mounting body 231, and their number corresponds to the number of gripping holes 94 on the storage box 91 (optionally, there is only one gripping pin 232, which can be adapted to storage boxes 91 of different sizes, as long as the storage box 91 has one gripping hole 94). Their position is adapted to the gripping holes 94, and they can be inserted into the gripping holes 94 under the drive of the robotic arm 22 to move the storage box 91. The wafer forks 233 are located on the top of the mounting body 231, and their extended ends can extend into the interior of the storage box 91 to lift and remove the wafers inside the storage box 91.

[0065] During operation, when the storage box 91 needs to be moved to the platform 92, the lifting assembly 21 (which can be a hydraulic cylinder, electric cylinder, or a sliding block with a guide rail) drives the robotic arm 22 to move to the same height as the storage box 91 to be grasped. The robotic arm 22 extends, bringing the mounting body 231 closer to the storage box 91 until the gripping pin 232 is inserted into the gripping hole 94 of the storage box 91. The robotic arm 22 retracts and moves to the height of the target platform 92 under the action of the lifting assembly 21. The robotic arm 22 extends again, placing the storage box 91 on the platform 92, and the gripping pin 232 is pulled out from the gripping hole 94, completing the transport of the storage box 91. When it is necessary to remove the wafer, the robotic arm 22 moves the mounting body 231 to the target storage box 91, the wafer fork 233 extends into the storage box 91 and supports the wafer, and the robotic arm 22 retracts to remove the wafer.

[0066] In this embodiment, the platforms 92 of the storage compartment 1 are distributed circumferentially, and together with the conveying device 2 located at the center, the storage boxes 91 are stored and retrieved in an orderly manner. The lifting component 21 of the conveying device 2 works in conjunction with the robotic arm 22 to cover all platforms 92 in the storage compartment 1, ensuring the feasibility of accessing the storage boxes 91 and wafers at each location.

[0067] The gripping component 23 uses gripping pins 232 inserted into the gripping holes 94 of the storage box 91 to achieve gripping. Compared with the relative movement clamping method in the prior art, it is not necessary to reserve clamping plates on both sides of the storage box 91 (see reference). Figure 5 As shown, this is an existing handling device whose gripping component is clamping type. To ensure extension and retraction during use, it requires a significant amount of lateral space. The reduced space required for movement significantly decreases the space occupied by the gripping component during the gripping process. Therefore, the spacing between the platforms 92 within the storage compartment 1 can be correspondingly reduced, allowing for more platforms 92 to be installed within the same storage compartment 1 volume, thereby increasing the storage capacity of the storage boxes 91.

[0068] As a further embodiment, refer to Figure 8 and Figure 9 As shown, an expansion locking sleeve 234 is fitted onto the outer peripheral wall of the gripping pin 232. The expansion locking sleeve 234 covers part of the outer peripheral wall of the gripping pin 232, and its material has elastic deformation capability. When the gripping pin 232 is inserted into the gripping hole 94 of the storage box 91, the expansion locking sleeve 234 can expand under external drive, so that its outer peripheral wall fits tightly against the inner wall of the gripping hole 94, thereby locking the gripping pin 232 in the gripping hole 94; when it is necessary to remove the gripping pin 232, the expansion locking sleeve 234 returns to its original shape, disengages from the inner wall of the gripping hole 94, and releases the lock.

[0069] In this embodiment, the expansion locking sleeve 234 creates a locking engagement between the gripping pin 232 and the gripping hole 94, avoiding the risk of the storage box 91 falling off during gripping due to friction alone, thus improving the stability of the handling process. Compared to the existing structure that uses mechanical latches for locking, the expansion locking sleeve 234 eliminates the need for complex structures such as protrusions or grooves in the gripping pin 232 or the gripping hole 94, and does not increase the radial dimension of the gripping assembly 23, thereby maintaining the space-saving advantage of the pin-type gripping and ensuring that more platforms 92 can still be installed in the storage compartment 1. At the same time, the elastic contact of the expansion locking sleeve 234 can buffer vibrations during handling, reducing the impact on the storage box 91 and the internal wafers.

[0070] Preferably, refer to Figure 9 As shown, an annular groove 235 is formed on the outer peripheral wall of the gripping post 232. The annular groove 235 extends circumferentially along the gripping post 232, and its depth is less than the radius of the gripping post 232. The expansion locking sleeve 234 is fitted inside the annular groove 235, and its outer surface in the unexpanded state does not extend beyond the outer peripheral wall of the gripping post 232. An inflation channel 236 is formed axially inside the gripping post 232. Several air holes 239 are provided on the bottom wall of the annular groove 235, and the air holes 239 communicate with the inflation channel 236. The pneumatic component 237 is disposed in the mounting body 231, and its output end is connected to the end of the inflation channel 236 away from the gripping post 232 through a pipeline. When the pneumatic component 237 inflates the inflation channel 236, the gas enters the gap between the annular groove 235 and the expansion locking sleeve 234 through the air hole 239, causing the expansion locking sleeve 234 to expand outward; when the pneumatic component 237 draws in air, the expansion locking sleeve 234 contracts under its own elasticity, and the gas in the gap is discharged through the air hole 239 and the inflation channel 236.

[0071] In this embodiment, the annular groove 235 provides installation space for the expansion locking sleeve 234, preventing it from protruding from the outer peripheral wall of the gripping post 232 in its unexpanded state, and ensuring that the gripping post 232 can be smoothly inserted into the gripping hole 94. The cooperation between the inflation channel 236 and the air hole 239 enables pneumatic control of the expansion locking sleeve 234. Compared with the mechanically driven locking structure, it has a faster response speed and no mechanical contact wear during the control process, extending the service life of the components. The pneumatic component 237 (which can be a miniature bidirectional oil-free pneumatic pump, etc.) is integrated into the mounting body 231, without occupying additional space in the storage compartment 1, maintaining the compactness of the device. At the same time, by adjusting the inflation pressure of the pneumatic component 237, the expansion degree of the expansion locking sleeve 234 can be controlled to adapt to gripping holes 94 with different inner wall roughness, ensuring the stability of the locking force.

[0072] Preferably, refer to Figure 6 As shown, four gripping pins 232 are arranged circumferentially along the working surface of the mounting body 231. The axes of the four gripping pins 232 are on the same horizontal plane and are distributed in a rectangular pattern. Four gripping holes 94 are provided on the storage box 91 at positions corresponding to the four gripping pins 232, and the distribution of the four gripping holes 94 is completely consistent with that of the four gripping pins 232. When gripping the storage box 91, the four gripping pins 232 are simultaneously inserted into the corresponding gripping holes 94, and the expansion locking sleeve 234 expands simultaneously to achieve locking.

[0073] In this embodiment, the rectangular distribution of the four gripping posts 232 ensures that the supporting force on the storage box 91 is evenly distributed around its perimeter, providing comprehensive circumferential restraint on the storage box 91 and preventing it from rotating around the post axis during handling, thus improving posture stability. The gravity of the storage box 91 is transferred to each gripping post 232, reducing localized stress on the robotic arm 22, decreasing wear and tear on the robotic arm 22, and extending its service life. Furthermore, the rectangular distribution is compatible with the structural designs of most rectangular or square storage boxes, requiring no special modifications to the storage box 91, resulting in greater compatibility. Moreover, the number of four posts, while ensuring stability, does not excessively increase the structural complexity of the gripping assembly 23.

[0074] Preferably, refer to Figure 7As shown, the working surface of the mounting body 231 has several sets of guide holes, with four guide holes in each set, arranged in a rectangular pattern. The gripping pins 232 slide through the guide holes, forming a clearance fit, and can slide along the axial direction of the guide holes. The sliding stroke of the gripping pins 232 covers both the non-gripping state (completely retracted into the guide hole) and the gripping state (partially extended out of the guide hole). There are several sets of gripping pins 232, with four pins in each set. The square distribution size of the guide holes in different sets varies, adapting to various common sizes of storage boxes 91. When a storage box 91 of a certain size needs to be gripped, the corresponding set of gripping pins 232 slides along the guide hole to the extended state, while the other two sets of gripping pins 232 remain retracted, their end faces not exceeding the working surface of the mounting body 231.

[0075] In this embodiment, the arrangement of multiple sets of gripping posts 232 allows the same gripping component 23 to adapt to storage boxes 91 of various sizes without the need to disassemble and replace the gripping parts. This solves the problem of cumbersome and time-consuming multi-size adaptation operations in existing devices, and improves the continuous operation efficiency of the production line. The sliding and retractable design of the gripping posts 232 ensures that the posts do not protrude from the working surface when not in operation, avoiding interference with the gripping process of storage boxes 91 of other sizes. At the same time, it does not increase the radial dimension of the gripping component 23, maintaining the advantage of space saving.

[0076] Preferably, refer to Figure 8 As shown, the mounting body 231 contains a telescopic drive component 238, which is correspondingly configured with each group of gripping pins 232. Its output end is connected to the end of the three gripping pins 232 in that group furthest from the gripping end. The telescopic drive component 238 can drive the corresponding gripping pin 232 to slide along the guide hole, switching the group of gripping pins 232 between a gripping state and a non-gripping state. When it is necessary to switch to a different size of the storage box 91, the telescopic drive component 238 of the corresponding group is activated, while the telescopic drive components 238 of other groups are reset.

[0077] In this embodiment, the telescopic drive component 238 enables the switching of the gripping pins 232's state without manual operation, improving the device's automation level and response speed. Each group of gripping pins 232 corresponds to an independent telescopic drive component 238, ensuring the independence and accuracy of each group's pin movements and avoiding interference between different groups of pins. The telescopic drive component 238 is integrated into the mounting body 231, without occupying additional space in the storage compartment 1, maintaining the device's compactness.

[0078] As alternative implementation methods, such as Figures 11-13As shown, there is one gripping pin 232, with a square (polygonal prism) cross-section. The axis of the gripping pin 232 is perpendicular to the working surface of the mounting body 231. The storage box 91 has a gripping hole 94, with a square cross-section adapted to the gripping pin 232. The axis of the gripping hole 94 is offset from the center of gravity of the storage box 91. During gripping, the gripping pin 232 is inserted into the gripping hole 94. The hexagonal structure restricts the storage box 91 from rotating around the pin axis. Simultaneously, the offset of the center of gravity causes the storage box 91 to exert a torsional force on the gripping pin 232. Under the action of this force, the friction between the gripping pin 232 and the gripping hole 94 is increased, preventing the storage box 91 from falling off and improving stability.

[0079] In this embodiment, the structure of a single polygonal prism-shaped gripping post 232 significantly simplifies the gripping assembly 23, reduces the number of components and installation space, and further improves the space utilization of the storage compartment 1. The square cross-sectional structure effectively restricts the rotation of the storage box 91, eliminating the need for additional anti-rotation structures. The off-center design of the gripping socket 94 causes the storage box 91 to exert a circumferential force on the gripping post 232 after gripping, thereby increasing friction, preventing the storage box 91 from falling off, and improving stability. At the same time, the design of a single gripping post 232 reduces the requirements for modifying the structure of the storage box 91, requiring only one adapter socket, resulting in greater compatibility and applicability to storage boxes 91 of different sizes (only requiring one gripping socket 94).

[0080] Preferably, when only one size of storage box 91 needs to be moved, such as Figure 11 and Figure 12 As shown, there are two gripping pins 232, one of which is a polygonal prism and the other is cylindrical (which also adapts to the storage box 91 with a corresponding number and shape of gripping pins 94, see reference). Figure 13Furthermore, the working surface of the mounting body 231 has an arc-shaped guide groove 210 centered on a polygonal prism-shaped gripping post 232. The cylindrical gripping post 232 is slidably disposed within the arc-shaped guide groove 210 along the circumferential direction. The polygonal prism-shaped gripping post 232 is rotatably disposed on the working surface of the mounting body 231 by a torsion spring, and has a natural state and a loaded state. That is, when no storage box 91 is gripped, it is in the natural state. When the storage box 91 is gripped, the polygonal prism-shaped gripping post 232 is driven by the gravity of the storage box 91. 32. Rotate a certain angle, that is, until the cylindrical gripping pin 232 slides to the end of the arc-shaped guide groove 210. At this time, under the action of the torsion spring, the polygonal prism-shaped gripping pin 232 always applies a force to the corresponding gripping hole 94, thereby increasing the friction, preventing the storage box 91 from falling off, and improving the overall stability. After the storage box 91 is removed, the gripping pin 232 rotates and returns from the load state to the natural state, waiting for the next gripping. At the same time, the cylindrical gripping pin 232 also slides back to the starting end (refer to...). Figure 12 As shown, the upper end of the arc-shaped guide groove 210 is the starting end, and the lower end is the ending end.

[0081] As another embodiment, refer to Figure 13 As shown, one end of the wafer fork 233 is rotatably connected to the top of the mounting body 231 via a hinge structure. The rotation axis of the hinge structure is horizontal and perpendicular to the working surface of the mounting body 231. When the wafer fork 233 rotates around the rotation axis to a horizontal state, and its extension direction is consistent with the protruding direction of the gripping pin 232, it is in the fork-taking use state. At this time, the wafer fork 233 can extend into the storage box 91 to lift the wafer. When the wafer fork 233 rotates around the rotation axis to a vertical state, and its extension direction is consistent with the height direction of the mounting body 231, it is in the avoidance idle state.

[0082] In this embodiment, the rotating design of the wafer fork 233 allows it to switch to an idle, clearance-free state when not in use. This avoids the interference problem that traditional fixed forks cause when handling the storage box 91 or the platform 92, ensuring smooth handling of the storage box 91. The switching between horizontal and vertical states is achieved simply by rotating around an axis, resulting in a simple structure and convenient operation, eliminating the need for complex drive mechanisms. In the clearance-free state, the wafer fork 233 is vertically positioned, without increasing the radial dimension of the gripping component 23, maintaining the space-saving advantage of the device and allowing more platforms 92 to be installed within the storage compartment 1.

[0083] Preferably, refer to Figure 14As shown, the wafer fork 233 includes a first section 31 and a last section 32. One end of the first section 31 is connected to a hinge structure on the top of the mounting body 231, and the other end of the first section 31 is hinged to one end of the last section via a hinge structure (not shown in the figure). The rotation axis of the hinge structure is parallel to the rotation axis of the hinge structure. When the wafer fork 233 is in the fork-taking use state, the first section 31 and the last section 32 are unfolded to the same straight line via the hinge structure, and the two are parallel to each other. When the wafer fork 233 is in the clearance idle state, the last section rotates around the hinge structure to the side away from the gripping post 232, so that the first section and the last section are folded.

[0084] In this embodiment, the hinged design of the first and last sections allows the wafer fork 233 to be further folded when idle, significantly reducing its length after folding compared to a one-piece fork, thus minimizing space occupation and the risk of interference with other components within the storage compartment 1. In the fork-and-go state, the first and last sections unfold into a straight line, ensuring sufficient length to support the wafer and meet the wafer retrieval requirements of storage boxes 91 at different depths. The hinge structure does not affect the load-bearing capacity of the wafer fork 233, maintaining structural stability while supporting the wafer and preventing it from slipping.

[0085] Preferably, when the wafer fork 233 is in the idle state, the end section rotates around the hinge structure until the angle between it and the first section is greater than 90 degrees. At this time, the end section tilts towards the back of the mounting body 231, forming a gap with the side of the mounting body 231. When the wafer fork 233 is switched to the picking-up state, the end section rotates in the opposite direction around the hinge structure until it is parallel to the first section, and the two together form a horizontal lifting surface.

[0086] In this embodiment, the angle between the end segment and the first segment is greater than 90 degrees, causing the end segment of the wafer fork 233 to tilt towards the back of the mounting body 231 in the idle state of avoiding obstacles. When the wafer fork 233 rotates and switches from the idle state of avoiding obstacles to the picking-up and use state, as the first segment reaches the horizontal position first, the end segment will also rotate to the horizontal state under its own gravity (that is, the angle between the end segment and the first segment is greater than 90 degrees, which can realize that the end segment can automatically rotate to the horizontal state under the action of gravity without the need for other structures, thus reducing complexity).

[0087] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A wafer memory device, characterized in that, include: Storage compartment (1) for storing wafers, wherein the storage compartment (1) has a plurality of stages (92). A transport device (2) is disposed within the storage compartment (1). The transport device (2) is used to transport the storage box (91) to the stage (92) or to remove the wafer from the storage box (91). The transport device (2) includes: A lifting assembly (21) is installed inside the storage compartment (1), and a robotic arm (22) is connected to the lifting end of the lifting assembly (21). A gripping component (23) is disposed at the end of the robotic arm (22). The gripping component (23) is used to grip a storage box (91) or a wafer. The gripping component (23) includes: The mounting body (231) is located at the end of the robotic arm (22); A gripping pin (232) is disposed on the mounting body (231). The gripping pin (232) is used to insert into the gripping hole (94) of the storage box (91) to grip the storage box (91). A wafer tooth fork (233) is disposed on the mounting body (231) and is used to extend into the storage box (91) and remove the wafer.

2. A wafer memory device according to claim 1, characterized in that, The gripping post (232) has an expansion locking sleeve (234) on its outer peripheral wall, which can expand and lock the gripping post (232) located in the gripping hole (94).

3. A wafer memory device according to claim 2, characterized in that, The outer peripheral wall of the gripping insert (232) is provided with an annular groove (235), and the expansion locking sleeve (234) is provided in the annular groove (235); The gripping insert (232) has an inflation channel (236), and the inner wall of the annular groove (235) has an air hole (239) that communicates with the inflation channel (236) and the expansion locking sleeve (234). A pneumatic component (237) is disposed within the mounting body (231) and communicates with the inflation channel (236). The pneumatic component (237) can inflate the expansion locking sleeve (234) or draw air to contract the expansion locking sleeve (234).

4. A wafer memory device according to claim 2, characterized in that, The gripping pins (232) are arranged in four circumferences, which are used to connect one-to-one with the four gripping holes (94) on the storage box (91).

5. A wafer memory device according to claim 2, characterized in that, The gripping pin (232) is slidably disposed on the mounting body (231) along its axial direction. The gripping pin (232) has a non-gripping state that is slidably retracted into the mounting body (231) and a gripping state that is slidably extended out of the mounting body (231). There are several gripping pins (232), and every four gripping pins (232) form a group of gripping pins. Different groups of gripping pins are used to grip storage boxes (91) of different sizes. When one group of gripping pins is used to grip storage boxes (91), all gripping pins (232) in the group are in the gripping state, and all gripping pins (232) in other groups are in the non-gripping state.

6. A wafer memory device according to claim 5, characterized in that, Also includes: A telescopic drive (238) is disposed within the mounting body (231). The telescopic drive (238) is connected to the gripping post (232) and is used to drive the gripping post (232) to slide axially.

7. A wafer memory device according to claim 1, characterized in that, The number of gripping pins (232) is one, and the cross-sectional shape of the gripping pin (232) and the gripping hole (94) is the same, both being polygonal prisms.

8. A wafer memory device according to claim 1, characterized in that, Also includes: The wafer fork (233) is rotatably mounted on the top of the mounting body (231). When the wafer fork (233) is rotated to a horizontal position and located on the same side as the gripping post (232), it is in the fork-taking and use state. When the wafer fork (233) is rotated to a vertical position, it is in the avoidance and idle state.

9. A wafer memory device according to claim 8, characterized in that, The wafer tooth fork (233) is divided into a first section (31) and a last section (32), which are hinged together; When the wafer tooth fork (233) is in the avoidance idle state, the end of the wafer tooth fork (233) is tilted to one side to avoid the gripping post (232). When the wafer tooth fork (233) is in the fork-taking use state, the first section (31) and the last section (32) of the wafer tooth fork (233) are parallel.

10. A wafer memory device according to claim 8, characterized in that, When the wafer tooth fork (233) is in the avoidance idle state, the angle between the end segment and the beginning segment of the wafer tooth fork (233) is greater than 90°.

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