A multi-stage nested thermostat control system, method and apparatus

Abstract

The application relates to the technical field of temperature control of super-precision equipment, in particular to a multi-stage nested constant-temperature control system and method and equipment; the multi-stage nested constant-temperature control system comprises a first-stage temperature control subsystem, a second-stage temperature control subsystem and a third-stage temperature control subsystem for constant-temperature regulation of a global environment; in the internal cavity of the first-stage temperature control subsystem: the second-stage temperature control subsystem and the third-stage temperature control subsystem with multi-layer heat insulation function constitute a constant-temperature cover, and a temperature control component in the second-stage temperature control subsystem serves as the top of the constant-temperature cover; the TEC component in the temperature control component is arranged in an array type and is uniformly distributed, and independent temperature control area division is carried out according to temperature control requirements; the second-stage temperature measurement components in the constant-temperature cover constitute a three-dimensional temperature measurement array, and each temperature measurement component is one-to-one corresponding to a matching independent temperature control area. The application has the advantages of remarkable high-precision temperature control effect, outstanding rapid response capability, strong anti-interference and adaptability and low cost.

Description

Technical Field

[0001] This invention relates to the field of temperature control technology for ultra-precision equipment, specifically to a multi-level nested constant temperature control system, method, and equipment. Background Technology

[0002] The application of ultra-precision equipment is becoming increasingly widespread. Equipment such as grating ruling machines, EUV lithography machines, and nanoscale measuring instruments have increasingly stringent requirements for the working environment. Even slight temperature fluctuations can cause thermal deformation of key components, which in turn seriously affects the operating accuracy of the equipment.

[0003] However, current temperature control technology is insufficient to meet the extremely high temperature stability requirements of these ultra-precision devices. Specifically, the following types of temperature control methods exist: 1) A single air conditioning system typically has a temperature control accuracy of only ±0.1℃, which is insufficient to meet the requirements of ultra-precision equipment for ±0.001℃ or even higher accuracy. Furthermore, when localized overheating occurs in ultra-precision equipment, a single air conditioning system cannot quickly and accurately adjust the local microenvironment temperature, resulting in uneven temperature distribution and affecting equipment accuracy.

[0004] 2) Introducing fan temperature control into ultra-precision equipment; however, for ultra-precision equipment, the introduction of fan temperature control will have drawbacks in terms of error. The periodic mechanical vibration generated by the fan operation will be transmitted to the key components of the equipment through the air or structure, resulting in processing / measurement errors in nanometer-level precision equipment; forced airflow will disrupt the stability of natural convection inside the enclosure, forming local eddies, causing temperature measurement deviations and exacerbating the temperature gradient; the electromagnetic noise generated by the fan motor will reduce the signal-to-noise ratio of the sensor, which is contrary to the stringent operating requirements of ultra-precision equipment.

[0005] 3) Traditional thermoelectric coolers, or TEC temperature control, often only focus on the local temperature of the equipment and do not effectively coordinate with the overall ambient temperature control. Once subjected to external thermal shocks, such as large fluctuations in the temperature of the air-conditioned area, the TEC cannot respond and adjust in time, which can easily cause local overcooling or overheating of the equipment and damage the normal operating environment of the equipment.

[0006] In summary, traditional temperature control methods have numerous shortcomings in terms of accuracy, response speed, and anti-interference capabilities, severely restricting the full performance of ultra-precision equipment and hindering further technological development in related fields. Furthermore, current solutions suffer from an inadequate layout of temperature measurement points, failing to comprehensively and promptly reflect temperature changes in critical components of the equipment, resulting in lag in temperature feedback. Moreover, the control algorithms employed are not optimized for the dynamic thermal characteristics of ultra-precision equipment; when faced with sudden temperature changes, the system's slow response speed prevents it from quickly adjusting the temperature back to the setpoint, impacting the equipment's continuous high-precision operation.

[0007] Therefore, those skilled in the art urgently need to develop an ultra-precision equipment temperature control system that can achieve high temperature control accuracy, fast response, and strong anti-interference. Summary of the Invention

[0008] Therefore, the technical problem to be solved by the present invention is to overcome the defects existing in the prior art, thereby providing a multi-level nested constant temperature control system and method.

[0009] A multi-level nested constant temperature control system includes: a primary temperature control subsystem, a secondary temperature control subsystem, and a tertiary temperature control subsystem for global environmental constant temperature regulation; Inside the cavity of the primary temperature control subsystem: the secondary temperature control subsystem using the TEC precision cooling compensation system and the tertiary temperature control subsystem with multi-layer heat insulation function constitute a constant temperature cover, with the temperature control component in the secondary temperature control subsystem serving as the top of the constant temperature cover; Among them, the TEC components in the temperature control assembly adopt an array-style uniform layout and are divided into independent temperature control zones according to temperature control requirements; Inside the constant temperature hood, multiple temperature measuring components of the secondary temperature control subsystem form a three-dimensional temperature measuring array, and each temperature measuring component corresponds one-to-one with a corresponding independent temperature control area.

[0010] Preferably, the primary temperature control subsystem adopts a design with uniform air intake at the top and uniform air outlet at the bottom, specifically as follows: At the top of the primary temperature control subsystem: from top to bottom, an air inlet layer, a microporous structure, and a polymer material layer are arranged sequentially. At the bottom of the primary temperature control subsystem: from top to bottom, a polymer material layer, a microporous structure, and an air outlet layer are arranged.

[0011] Preferably, the secondary temperature control subsystem includes: a TEC component, a graphite thermal pad, a water-cooled plate, a finned heat sink, a thermally conductive insulation layer, a shielding layer, and a temperature measuring component disposed in the cavity of the thermostatic cover; The water-cooled plate, graphite thermal pad, TEC component, graphite thermal pad, shielding layer, thermally conductive insulation layer and finned heat sink are arranged from top to bottom to form a multi-layer composite structure as the top of the constant temperature cover.

[0012] Preferably, the three-level temperature control subsystem includes a constant temperature cover with an opening at the top, consisting of a nano-aerogel insulation layer, an electromagnetic shielding layer, and a heat reflective layer arranged sequentially from the outside to the inside.

[0013] Preferably, the height of the shielding layer is adapted to the height of the top of the electromagnetic shielding layer to form a closed shield.

[0014] Preferably, the hot end of the TEC module is located on the top surface; the cold end of the TEC module is located on the bottom surface.

[0015] Preferably, the primary temperature control subsystem also includes a distributed temperature measurement component; Inside the internal cavity of the primary temperature control subsystem: several distributed temperature measurement components are evenly arranged in the circumferential and central areas at the same horizontal height as the ultra-precision equipment set inside the constant temperature hood.

[0016] A multi-level nested constant temperature control method, implemented using a multi-level nested constant temperature control system, includes: S. Obtain the temperature fluctuation of the internal cavity of the primary temperature control subsystem and determine whether it exceeds the preset temperature fluctuation value; S. If the result of step S is yes, the secondary temperature control subsystem will start automatically and execute the preset compensation mode; otherwise, no operation will be performed. Among them, the preset compensation mode predicts the power adjustment of the TEC component based on the temperature change rate of the cavity inside the primary temperature control subsystem and performs pre-adjustment in advance: starting the TEC component for pre-cooling or current reverse pre-heating.

[0017] A computer device includes a memory and a processor, the memory storing a computer program that, when executed by the processor, implements a multi-level nested constant temperature control method.

[0018] The technical solution of this invention has the following advantages: The high-precision air conditioning system of the primary temperature control subsystem regulates the overall ambient temperature, while the microporous structure and polymer material layer assist in optimizing airflow, providing a stable basic temperature environment for the equipment. Then, the thermoelectric cooler (TEC) of the secondary temperature control subsystem regulates the temperature inside the enclosure. The TEC transfers cooling energy to the finned aluminum plate through a high thermal conductivity interface material, creating micro-convection within the enclosure to precisely regulate the temperature and prevent heat accumulation caused by frictional heat and low-power heat-generating units. Finally, the three-layer insulation enclosure of the tertiary temperature control subsystem blocks heat transfer between the inside and outside, reducing the impact of high-power heat-generating units and the external environment on the internal structure, and blocking electromagnetic interference to the ultra-precision equipment. This method achieves ultra-high precision temperature control of ±0.001℃ for ultra-precision equipment through high-precision temperature sensors and a multi-level linkage control strategy. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall system layout of the present invention; Figure 2 This is an exploded view of the components of the secondary and tertiary temperature control subsystems of the present invention; Figure 3 This is a schematic diagram showing the positional relationship between the cold end and the hot end of the TEC component of the present invention; Figure 4 This is a schematic diagram showing the correspondence between the independent temperature control areas of the temperature measuring component inside the constant temperature cover and the top TEC component of the present invention.

[0021] Explanation of reference numerals in the attached figures: 1-Primary temperature control subsystem; 4-Air inlet layer; 5-Air outlet layer; 6-Microporous structure; 7-Polymer material layer; 8-High-power heating unit; 9-Distributed temperature measurement component; 2-Secondary temperature control subsystem; 10-TEC component; 11-Graphite thermal pad; 12-Water-cooled plate; 13-Finned heat sink; 14-Thermal conductive insulation layer; 15-Shielding layer; 16-Temperature measuring component; 17-Cold end; 18-Hot end; 3-Three-level temperature control subsystem; 19-Nano aerogel insulation layer; 20-Electromagnetic shielding layer; 21-Heat reflective layer; 22 - First independent temperature control zone; 23 - Second independent temperature control zone; 24 - Third independent temperature control zone; 25 - Fourth independent temperature control zone; 26 - Fifth independent temperature control zone; 27 - Sixth independent temperature control zone; 28 - Seventh independent temperature control zone; 22-1 - First platinum resistance resistor; 23-1 - Second platinum resistance resistor; 24-1 - Third platinum resistance resistor; 25-1 - Fourth platinum resistance resistor; 25-2 - Fourth second platinum resistance resistor; 26-1 - Fifth platinum resistance resistor; 27-1 - Sixth platinum resistance resistor; 28-1 - Seventh platinum resistance resistor. Detailed Implementation

[0022] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0025] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0026] Example 1 like Figure 1-4 As shown, a multi-level nested constant temperature control system includes: a primary temperature control subsystem 1, a secondary temperature control subsystem 2, and a tertiary temperature control subsystem 3 for global environmental constant temperature regulation. In the internal cavity of the primary temperature control subsystem 1: the secondary temperature control subsystem 2, which adopts the TEC precision cooling compensation system, and the tertiary temperature control subsystem 3, which has multi-layer heat insulation function, constitute a constant temperature cover, and the temperature control component in the secondary temperature control subsystem 2 serves as the top of the constant temperature cover; Among them, the TEC component 10 in the temperature control component adopts an array-style uniform layout and is divided into independent temperature control areas according to temperature control requirements. Specifically, it is divided according to the location of the components with heat generation capabilities in actual applications, so as to improve the accuracy of temperature control and adapt to the temperature changes generated by the frictional heat of the guide rail and the operation of the piezoelectric ceramic.

[0027] Inside the constant temperature cover, the temperature measuring components 16 of the secondary temperature control subsystem 2 form a three-dimensional temperature measuring array, and each temperature measuring component 16 corresponds to a corresponding independent temperature control area.

[0028] Specifically: In this embodiment, the primary temperature control subsystem 1 adopts a design with uniform air intake at the top and uniform air outlet at the bottom, specifically: Inside the top of the primary temperature control subsystem 1: from top to bottom, an air inlet layer 4, a microporous structure 6, and a polymer material layer 7 are arranged sequentially. Inside the first-level temperature control subsystem 1 at the bottom: from top to bottom, a polymer material layer 7, a microporous structure 6, and an air outlet layer 5 are arranged. This arrangement has good air permeability and heat insulation performance, ensuring uniform air supply.

[0029] Furthermore, the primary temperature control subsystem 1 also includes a distributed temperature measurement component 9; Inside the cavity of the primary temperature control subsystem 1: several distributed temperature measurement components 9 are evenly arranged in the circumferential and central areas at the same horizontal height as the ultra-precision equipment set in the constant temperature cover, for collecting ambient temperature data.

[0030] It should be noted that in practical applications, the operation of ultra-precision equipment also requires the configuration of a high-power heating unit 8; in practical applications, the high-power heating unit 8 is placed in the internal cavity of the primary temperature control subsystem 1; In addition, in practical applications, the air inlet layer 4 and the air outlet layer 5 are specifically the air intake and air supply layer of the air conditioning unit, which can control the overall ambient temperature, humidity and cleanliness of the primary temperature control subsystem 1 within a preset range. Furthermore, in practical applications, the airflow path of the air conditioning unit is as follows: the external ambient air enters the air conditioning unit after filtration, and after being cooled or heated, humidified or dehumidified, it is delivered to the air inlet layer 4, microporous structure 6 and polymer material layer 7 above the overall equipment area through the air supply duct. The air outlet layer 5 has a built-in honeycomb flow equalization structure to make the airflow evenly cover the entire internal cavity area of ​​the primary temperature control subsystem 1. The return air is collected by the ground return air grid and then flows back to the air conditioning unit through the return air duct, forming a closed-loop airflow path of: air intake-treatment-supply-return air. The secondary temperature control subsystem 2 includes: TEC component 10, graphite thermal pad 11, water cooling plate 12, finned heat sink 13, thermally conductive insulation layer 14, shielding layer 15, and temperature measuring component 16 disposed in the cavity of the constant temperature cover; The water-cooled plate 12, graphite thermal pad 11, TEC component 10, graphite thermal pad 11, shielding layer 15, thermally conductive insulating layer 14, and finned heat sink 13 are arranged sequentially from top to bottom to form a multi-layer composite structure as the top of the constant temperature cover. In practical applications, the high-performance graphite thermal pad 11 is selected due to its high thermal conductivity, which reduces the thermal resistance between the cold end 17 and hot end 18 of the TEC component 10 and the finned heat sink 13. The water-cooled plate 12 is a microchannel water-cooled plate, which removes heat through continuously flowing coolant to maintain efficient cooling. The finned structure of the finned heat sink 13 increases the heat dissipation area and improves heat dissipation efficiency. The thermally conductive insulating layer 14 is a polyimide film, preventing electrical conduction between the shielding layer 15 and the finned heat sink 13. The height of the shielding layer 15 is matched with the top height of the electromagnetic shielding layer 20, forming a closed shield. Specifically, the shielding layer 15 is made of permalloy or copper foil, and together with the electromagnetic shielding layer 20 in the multi-layer thermal insulation barrier of the three-level temperature control subsystem 3, it forms a closed shield to block the propagation path of electromagnetic signals through the top surface. Regarding the layout of temperature sensing component 16: Temperature sensing component 16 employs a three-dimensional temperature sensing array to comprehensively collect temperature data within the constant temperature enclosure, forming a point-to-area temperature control network. Specifically, the array of TEC components 10 is divided into 7 independent temperature control zones according to actual temperature control requirements, such as Figure 4 These are the first independent temperature control zone 22, the second independent temperature control zone 23, the third independent temperature control zone 24, the fourth independent temperature control zone 25, the fifth independent temperature control zone 26, the sixth independent temperature control zone 27, and the seventh independent temperature control zone 28. Each zone is equipped with a dedicated high-precision thin-film platinum resistance thermometer as a temperature measuring component 16, forming a basic temperature control matching relationship of one measurement per zone.

[0031] Among them, the fourth independent temperature control zone 25 is the core temperature control area, which adopts a two-high-precision platinum resistance thermometer monitoring scheme, while the other independent temperature control zones all use a single high-precision platinum resistance thermometer monitoring. like Figure 4 The fourth platinum resistance thermometer, 25-1, is positioned in the center of the thermostatic enclosure to collect the ambient reference temperature, providing a reference for overall temperature control. The fourth platinum resistance thermometer, 25-2, is tightly attached to the periphery of the etched probe using high thermal conductivity adhesive, accurately monitoring real-time temperature changes in the core area of ​​frictional heat, ensuring the accuracy of temperature sensing at the core heating point. Six additional platinum resistance thermometers of the same specifications are evenly distributed within the thermostatic enclosure: the first platinum resistance thermometer, 22-1; the second, 23-1; the third, 24-1; the fifth, 26-1; the sixth, 27-1; and the seventh, 28-1, correspond to the surrounding space of their respective monitoring locations. All platinum resistance thermometers are positioned on a horizontal plane flush with the etched probe, used to capture real-time ambient temperature fluctuations in non-core areas within the thermostatic enclosure. Together with the two platinum resistance thermometers in the core area, they form an 8-point three-dimensional temperature measurement array. All signals from the thin-film platinum resistance thermometers are connected to the high-speed acquisition module of the three-level temperature control subsystem via shielded cables. This module can capture minute temperature fluctuations at the ±0.0005℃ level in real time, providing data for precise control. It should be noted that in practical applications, ultra-precision equipment is generally placed at the center of the temperature control device.

[0032] In the TEC component 10, the hot end 18 is located on the top surface and transfers heat to the primary temperature control subsystem 1.

[0033] The cold end 17 of the TEC component 10 is located on the bottom surface and transfers cold energy into the thermostatic enclosure. The three-level temperature control subsystem 3 includes a nano-aerogel insulation layer 19, an electromagnetic shielding layer 20, and a heat reflection layer 21 arranged sequentially from the outside to the inside, forming a constant temperature cover with an opening at the top, which can effectively block the exchange of heat between the inside and outside.

[0034] Specifically, to provide a concrete example of the solution in this embodiment, a thermostatic hood with a cuboid structure will be used as an example, such as... Figure 4 The three-level temperature control subsystem 3 includes heat insulation covers on four circumferential sides and the bottom, and adopts a multi-layer composite heat insulation structure to form an independent temperature zone for the equipment. The nano-aerogel insulation layer 19 significantly suppresses air convection and infrared radiation heat transfer through its nano-scale porous structure, effectively blocking the heat generated by the high-power heating unit 8, reducing the impact on the ambient temperature of the internal ultra-precision equipment, effectively blocking the heat exchange between the primary temperature control area and the microenvironment inside the enclosure, and its lightweight characteristics avoid increasing the overall load on the equipment. The electromagnetic shielding layer 20, in conjunction with conductive sealing treatment, constructs a complete electromagnetic shielding cavity to prevent external electromagnetic fields from interfering with the electronic control system and measurement accuracy of the equipment. The heat reflective layer 21 is an aluminum-plated thin film that reflects more than 95% of infrared radiation back into the cover, reducing heat radiation loss to the middle and outer layers, thereby reducing the cooling load of the TEC component 10.

[0035] Summarize: Excellent temperature uniformity. The three-dimensional temperature measurement array of the secondary temperature control subsystem 2 comprehensively collects temperature data inside the constant temperature chamber. Based on this data, the entire system can monitor the temperature distribution inside the constant temperature chamber in real time. Once a region with a large temperature gradient is detected, the power of the corresponding TEC component 10 in the TEC component 10 array will be dynamically adjusted. Excellent temperature uniformity avoids stress deformation of the equipment due to local temperature differences, ensuring that all parts of the ultra-precision equipment operate in a uniform temperature environment, thereby improving the overall performance and service life of the equipment. The cost advantage is significant. Compared with traditional constant temperature systems, this embodiment achieves high-performance temperature control while offering a significant cost advantage. It adopts a hierarchical architecture, fully leveraging the advantages of different temperature control technologies, avoiding over-reliance on expensive single technologies, and reducing equipment costs.

[0036] Example 2 A multi-level nested constant temperature control method, implemented using a multi-level nested constant temperature control system as described in Example 1, includes: S1. Obtain the temperature fluctuation of the internal cavity of the primary temperature control subsystem 1, and determine whether it exceeds the preset temperature fluctuation value; S2. If the result of step S1 is yes, the secondary temperature control subsystem 2 will start automatically and execute the preset compensation mode; otherwise, no operation will be performed. Among them, the preset compensation mode predicts the power adjustment of the TEC component 10 based on the temperature change rate of the internal cavity of the primary temperature control subsystem 1, and performs pre-adjustment in advance: starting the TEC component 10 for pre-cooling or current reverse pre-heating.

[0037] Furthermore, in practical applications, the control of the TEC components can be further refined by combining the fuzzy PID feedback algorithm with microsecond-level fine adjustment of the PWM current according to the actual required precision. Ultimately, with the synergy of enhanced convection and low thermal resistance heat transfer path, the stable control effect of ±0.001℃ inside the constant temperature enclosure is even better.

[0038] Summarize: This embodiment demonstrates remarkable high-precision temperature control. Through a unique three-level temperature control architecture, it achieves the extremely high temperature control accuracy required for ultra-precision equipment. The primary temperature control subsystem 1, serving as the basic environmental protection, utilizes high-precision variable frequency air conditioning units and airflow stabilization components to control the ambient temperature fluctuations in the area where the ultra-precision equipment is located within ±0.01℃ of the set value. The secondary and tertiary temperature control subsystems 2 and 3 further refine the local temperature control for the ultra-precision equipment. The thermostatic enclosure employs a special three-layer composite structure, effectively reducing heat transfer and electromagnetic interference. The three-dimensional temperature measurement array within the thermostatic enclosure comprehensively and accurately monitors temperature changes. Combined with the array-type TEC component 10, it achieves dynamic power adjustment and, using a fuzzy PID feedback algorithm, finely adjusts the PWM current at the microsecond level. Ultimately, through the synergy of enhanced convection and low thermal resistance heat transfer paths, stable control within the thermostatic enclosure of ±0.001℃ is achieved. This fully meets the stringent temperature stability requirements of ultra-precision equipment, significantly reducing thermal deformation caused by temperature fluctuations and ensuring high-precision equipment operation. It exhibits outstanding rapid response capabilities. When the secondary temperature control subsystem 2 detects a local temperature change within the thermostatic enclosure, the TEC component 10 can quickly adjust the cooling power. Compared to traditional temperature control solutions, the response speed is significantly reduced for localized thermal disturbances, ensuring that the ultra-precision equipment can quickly recover to a stable state during sudden temperature changes and guaranteeing continuous and stable operation of the equipment under complex working conditions. Strong anti-interference and adaptability. In this embodiment, the temperature control method adopts a multi-level linkage control strategy. The distributed temperature and humidity sensors of the first-level temperature control subsystem 1 monitor the ambient temperature and humidity in real time. When the external ambient temperature fluctuation causes the internal cavity temperature fluctuation of the first-level temperature control subsystem 1 to exceed the preset temperature fluctuation value, the second-level temperature control subsystem 2 will quickly start the preset compensation mode and adjust the power in advance through the TEC component 10 to effectively resist external temperature shocks and ensure a stable temperature environment for the equipment under various complex conditions. Example 3 A computer device includes a memory and a processor. The memory stores a computer program, which, when executed by the processor, implements the method of Embodiment 2.

[0039] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A multi-level nested constant temperature control system, characterized in that, include: The system consists of a primary temperature control subsystem (1), a secondary temperature control subsystem (2), and a tertiary temperature control subsystem (3) for global environmental constant temperature control. In the internal cavity of the primary temperature control subsystem (1): the secondary temperature control subsystem (2) using the TEC precision cooling compensation system and the tertiary temperature control subsystem (3) with multi-layer heat insulation function constitute a constant temperature cover, and the temperature control component in the secondary temperature control subsystem (2) serves as the top of the constant temperature cover; Among them, the TEC component (10) in the temperature control component adopts an array-type uniform layout and is divided into independent temperature control areas according to temperature control requirements; In the internal cavity of the thermostatic cover, multiple temperature measuring components (16) of the secondary temperature control subsystem (2) form a three-dimensional temperature measuring array, and each temperature measuring component (16) corresponds to a corresponding independent temperature control area.

2. The multi-level nested constant temperature control system according to claim 1, characterized in that, The primary temperature control subsystem (1) adopts a top-uniform air intake and bottom-uniform air outlet design, specifically as follows: Inside the top of the primary temperature control subsystem (1): from top to bottom, an air inlet layer (4), a microporous structure (6), and a polymer material layer (7) are arranged sequentially. Inside the first-level temperature control subsystem (1) at the bottom: from top to bottom, a polymer material layer (7), a microporous structure (6), and an air outlet layer (5) are arranged sequentially.

3. The multi-level nested constant temperature control system according to claim 1, characterized in that, The secondary temperature control subsystem (2) includes: TEC component (10), graphite thermal pad (11), water cooling plate (12), finned heat sink (13), thermally conductive insulation layer (14), shielding layer (15), and temperature measuring component (16) disposed in the cavity of the constant temperature cover. Water-cooled plate (12), graphite thermal pad (11), TEC component (10), graphite thermal pad (11), shielding layer (15), thermally conductive insulating layer (14) and finned heat sink (13) are arranged from top to bottom to form a multi-layer composite structure as the top of the constant temperature cover.

4. The multi-level nested constant temperature control system according to claim 3, characterized in that, The three-level temperature control subsystem (3) includes a constant temperature cover with an opening at the top, consisting of a nano-aerogel insulation layer (19), an electromagnetic shielding layer (20), and a heat reflection layer (21) arranged sequentially from the outside to the inside.

5. A multi-level nested constant temperature control system according to claim 4, characterized in that, The height of the shielding layer (15) is matched with the top height of the electromagnetic shielding layer (20) to form a closed shield.

6. A multi-level nested constant temperature control system according to claim 3, characterized in that, The hot end (18) of the TEC component (10) is located on the top surface; the cold end (17) of the TEC component (10) is located on the bottom surface.

7. A multi-level nested constant temperature control system according to claim 2, characterized in that, The primary temperature control subsystem (1) also includes a distributed temperature measurement component (9); In the internal cavity of the primary temperature control subsystem (1): several distributed temperature measurement components (9) are evenly arranged in the circumferential and central areas at the same horizontal height as the ultra-precision equipment set in the constant temperature cover.

8. A multi-level nested constant temperature control method, characterized in that, The multi-level nested constant temperature control system according to any one of claims 1-7 is implemented, comprising: S1. Obtain the temperature fluctuation of the internal cavity of the primary temperature control subsystem (1) and determine whether it exceeds the preset temperature fluctuation value; S2. If the result of step S1 is yes, the secondary temperature control subsystem (2) will start automatically and execute the preset compensation mode; otherwise, no operation will be performed. Among them, the preset compensation mode is: predict the power adjustment of the TEC component (10) based on the temperature change rate of the cavity inside the primary temperature control subsystem (1) and pre-adjust in advance: start the TEC component (10) for pre-cooling or current reverse pre-heating.

9. A computer device, characterized in that, The computer device includes a memory and a processor. The memory stores a computer program, which, when executed by the processor, implements the multi-level nested constant temperature control method as described in claim 8.

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