Transient modeling method for SiC MOSFET (Metal Oxide Semiconductor Field Effect Transistor) switch in wide temperature range
CN121543529APending Publication Date: 2026-02-17SHENYANG AIRCRAFT DESIGN INST AVIATION IND CORP OF CHINA
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Patent Information
- Application Number
- CN202511578168.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-31
- Publication Date
- 2026-02-17
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Figure CN121543529A_ABST
Abstract
The invention belongs to the field of switch design, and particularly relates to a transient modeling method for a SiC MOSFET switch in a wide temperature range, which comprises the following steps of: determining temperature-related device parameters of the SiC MOSFET switch, and determining a relationship between each device parameter and the temperature; the method comprises the steps of determining the composition of parasitic capacitance, generating a fitting curve through a mathematical fitting mode, determining the relation between the parasitic capacitance and drain-source voltage, carrying out segmentation processing on a SiC MOSFET switch according to the switch between the parasitic capacitance and the drain-source voltage, and carrying out modeling at different stages. Through temperature parameter accurate characterization, stray capacitance dynamic combined modeling, multi-stage transient subdivision and engineering friendly design, the precision bottleneck of a traditional SiC MOSFET model in a wide temperature range and high dynamic scene is broken through, and a key technical support is provided for efficient design and reliable operation of a power electronic converter and industrial popularization of SiC devices; the influence of temperature on model parameters is considered, and the applicability of the model is improved.
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