MLCC capacitor outer electrode manufacturing implantation clamp

Abstract

This invention relates to a fixture for fabricating and inserting external electrodes of MLCC capacitors, belonging to the field of capacitor silver burning manufacturing technology. The invention includes symmetrically arranged epoxy resin plates; a hanging plate and a movable plate disposed between the two epoxy resin plates, wherein the movable plate is located inside the hanging plate, and the movable plate and the hanging plate are connected by an elastic element. The hanging plate and the two epoxy resin plates are detachably connected. The movable plate has several receiving holes, and the epoxy resin plates have corresponding pre-drilled holes that match the receiving holes. When clamping a capacitor, the movable plate is pushed along the hanging plate by an ejector fixture, causing the receiving holes and pre-drilled holes to be relatively misaligned. The overlapping area between the receiving holes and pre-drilled holes forms a clamping hole for clamping the capacitor. This invention solves the problem of the external electrodes undergoing different silver burning cycles in the original process, while avoiding damage to the capacitor due to compression and optimizing the termination and silver burning process flows.

Description

Technical Field

[0001] This invention relates to a fixture for fabricating and inserting external electrodes of MLCC capacitors, belonging to the field of capacitor silver burning manufacturing technology. Background Technology

[0002] In the traditional MLCC industry, the external electrode connection (manufacturing) process for large-size capacitors involves fixing one end of the capacitor with a thick plastic plate, leaving the other end exposed at a certain height and immersed in the electrode paste. After the electrode paste adheres to the end and sidewalls, a moist external electrode is obtained by separating the two ends.

[0003] After the moistened external electrode is dried at 150°C, it is initially shaped but has low strength. If the capacitor end is reversed at this point to make another external electrode, the end that has just been dried and shaped will be clamped by the thick plastic plate, and the above action will be repeated to make the other end. Because of its low end strength, it will be squeezed and damaged by the holes in the thick plastic plate, resulting in a decrease in yield. For example, Chinese invention patent application number CN202510635507.2 discloses a chip capacitor end-sealing production line based on a thick plastic plate. The thick plastic plate described is a carrier that fixes the chip capacitor by silicone clamping. Therefore, in order to successfully implant the chip capacitor into the hole of the thick plastic plate, an guide plate needs to be placed on the top of the thick plastic plate. First, the chip capacitor is implanted into the guide hole of the guide plate by vibration. Then, the chip capacitor located in the guide plate is pressed into the hole of the thick plastic plate by a bed of needles, thereby completing the implantation process of the chip capacitor in the thick plastic plate.

[0004] During the process of implanting surface mount capacitors into thick plastic plates, especially when one end of the surface mount capacitor that has just been dried and shaped is pressed into the hole of the thick plastic plate, the existing technology uses a plate hole design with a diameter slightly smaller than the length of the object to be held, which causes the surface mount capacitor to be subjected to compressive force, thus leading to damage to the surface mount capacitor.

[0005] To address this issue, a common industry practice is to unload the outer electrode from the silicone plate after fabricating one end, followed by low-temperature drying and high-temperature firing to enhance its strength. Then, the other end of the outer electrode is manually implanted and fabricated in reverse, undergoing another low-temperature drying and high-temperature silver firing process. This means that the high-temperature fired outer electrode, held in place by the thick silicone plate, will not suffer further compression damage. While this process, which involves fabricating the outer electrodes separately to avoid damage to the surface-mount capacitor, ultimately completes the dual-end outer electrodes of the capacitor, the first outer electrode undergoes two 800°C high-temperature silver firings, while the second only undergoes one. This difference in process poses safety risks to the performance, reliability, and lifespan of the outer electrodes. Furthermore, this process is cumbersome and inefficient.

[0006] Therefore, we have made improvements and proposed a fixture for fabricating and implanting the external electrode of an MLCC capacitor. Summary of the Invention

[0007] To address the problems existing in the prior art, this invention designs an implantation clamping fixture for the fabrication of external electrodes of MLCC capacitors, which solves the problem of the external electrodes at both ends undergoing different numbers of silver burning in the original process. At the same time, it avoids the problem of capacitors being crushed and damaged, and optimizes the process flow of termination and silver burning processes.

[0008] The technical solution adopted in this invention is an implantation clamping fixture for fabricating the external electrode of an MLCC capacitor, including an implantation assembly and an ejection fixture. The implantation assembly includes... Epoxy resin boards arranged symmetrically at the top and bottom; A mounting plate and a movable adhesive plate are disposed between two epoxy resin boards, wherein the movable adhesive plate is located inside the mounting plate and the movable adhesive plate is connected to the mounting plate by an elastic element, and the mounting plate is detachably connected to the two epoxy resin boards. The adhesive plate has several receiving holes, and the epoxy resin plate has corresponding reserved holes that match the receiving holes one by one. When it is necessary to clamp capacitors, the ejector tool pushes the movable plate along the hanging plate, causing the receiving hole and the reserved hole to be relatively misaligned. The overlapping area between the receiving hole and the reserved hole forms a clamping hole for clamping capacitors.

[0009] As a further embodiment of the present invention, a pair of inner sidewalls of the hanging plate are provided with a first hook, and a second hook is provided on the movable plate in the opposite bending direction to the first hook. The first hook and the second hook are spaced a certain distance apart and connected by an elastic element.

[0010] As a further embodiment of the present invention, one side of the hanging plate has a clearance notch, and the movable plate has a protrusion that matches the clearance notch, with the side where the clearance notch is located perpendicular to the side where the first hook is located.

[0011] As a further embodiment of the present invention, the inner wall of the receiving hole is perpendicular to the upper and lower surfaces of the adhesive plate; the inner wall of the reserved hole is perpendicular to the upper and lower surfaces of the epoxy resin plate.

[0012] As a further embodiment of the present invention, flexible silicone is adhered to the inner side of the receiving hole, and columnar protrusions are provided on the outer surface of the silicone.

[0013] As a further embodiment of the present invention, the implantation component includes two outer frames, with slots provided on the inner side of the outer frames, and a support piece for supporting the epoxy resin plate provided on the inner side of the slots.

[0014] As a further embodiment of the present invention, the ejection fixture includes a base plate, a platform disposed on the base plate, and an ejection mechanism. Each corner of the platform is provided with a right-angle limiting block for positioning the implanted component. An upper pressure cap is hinged to one side of the platform. The implanted component is clamped by fastening the platform and the upper pressure cap. The ejection mechanism includes a bracket, a wrench, a connector, and a push rod. The push rod is movably connected to the bracket. The wrench is connected to the push rod through the connector. Rotating the wrench controls the extension and retraction of the push rod to control the horizontal movement of the implanted component.

[0015] As a further embodiment of the present invention, a pair of sides of the platform are provided with pads for suspending the implanted component; the platform and the upper cover are magnetically fixed together, the upper cover includes an outer frame, an acrylic plate and a silicone strip, the acrylic plate is fixed inside the outer frame, the silicone strip is evenly distributed on the acrylic plate, and the upper surface of the outer frame is provided with a handle, when the platform and the upper cover are fastened together, the silicone strip contacts the platform.

[0016] As a further embodiment of the present invention, the base plate is provided with a bubble level, and each corner of the bottom surface of the base plate is provided with adjustable feet that cooperate with the bubble level for adjusting the levelness of the base plate.

[0017] This invention discloses a fixture for fabricating and embedding the external electrode of an MLCC capacitor. Its advantages, compared to existing technologies, are that it breaks away from the traditional method of using a fixed-size thick plastic plate with holes that rely on sidewall compression to generate clamping force. Instead, it uses an ejector mechanism to control the movement of a movable plastic plate to form the clamping hole, allowing for contactless implantation of the capacitor. This avoids electrode damage caused by compression and improves yield. The size of the clamping hole in the implantation plate can be controlled by the ejector mechanism to accommodate capacitors of different sizes. By using the implantation steps of this invention for external electrode fabrication, compared to the traditional method using a thick plastic plate, one implantation step and one high-temperature silver-burning step are reduced, improving work efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the ejection tooling structure; Figure 2 This is a schematic diagram showing the upper pressure cap and platform in the open state. Figure 3 A schematic diagram showing the ejection fixture and the implantation plate working together to clamp and fix the capacitor. Figure 4 for Figure 3 Front view diagram; Figure 5This is a schematic diagram of the acrylic sheet and silicone strip structure; Figure 6 This is a schematic diagram of the platform structure; Figure 7 This is a schematic diagram of the pad block structure; Figure 8 This is a schematic diagram of the base plate structure; Figure 9 This is a schematic diagram of the push rod structure; Figure 10 This is a schematic diagram of the upper pressure cap structure; Figure 11 This is a schematic diagram of the external frame structure; Figure 12 This is a schematic diagram of an epoxy resin board structure. Figure 13 This is a schematic diagram of the hanging panel structure; Figure 14 This is a schematic diagram of the adhesive plate structure; Figure 15 A schematic diagram of a structure where the mounting plate and the adhesive plate are placed on an epoxy resin board (without elastic components); Figure 16 A schematic diagram of the structure where the hanging plate, adhesive plate, and epoxy resin plate are placed on the outer frame (without elastic components); Figure 17 This is a schematic diagram of the implanted plate in a clamped state (without elastic elements). Figure 18 This is a magnified schematic diagram of a partial cross-section of the implanted plate.

[0020] As shown in the figure: 1. Outer frame; 2. Epoxy resin board; 3. Hanging plate; 4. Adhesive plate; 5. Groove; 6. Bearing plate; 7. Accommodation hole; 8. Reserved hole; 9. First hook; 10. Second hook; 11. Clearance notch; 12. Protruding tongue; 13. Through hole; 14. Observation hole; 15. Screw hole; 16. Clamping hole; 17. Silicone layer; 18. Elastic element; 19. Capacitor; 20. Base plate; 21. Platform; 22. Limiting block; 23. Upper pressure cover; 24. Bracket; 25. Wrench; 26. Connector; 27. Push rod; 28. Outer frame; 29. ​​Acrylic board; 30. Silicone strip; 31. Handle; 32. Bubble level; 33. Adjustable feet; 34. Pad; 35. Magnetic buckle; 36. Cylinder; 37. Rod; 38. Push block. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] To further understand the invention, the technical solution will be further described below in conjunction with specific embodiments.

[0023] Example 1: As Figures 1-18 As shown, this embodiment provides an implantation clamping fixture for fabricating the external electrode of an MLCC capacitor, including an implantation assembly and an ejection fixture. The implantation assembly includes an epoxy resin plate 2, a hanging plate 3, and a movable adhesive plate 4. The epoxy resin plates 2 are symmetrically arranged vertically, and the hanging plate 3 and the movable adhesive plate 4 are located between the two epoxy resin plates 2. The movable adhesive plate 4 is located inside the hanging plate 3, and the movable adhesive plate 4 and the hanging plate 3 are connected by an elastic element 18. The hanging plate 3 and the epoxy resin plate 2 are both provided with screw holes 15 on all four sides. The epoxy resin plate 2 is connected and fixed by bolts and screw holes 15. The epoxy resin plate 4 has several receiving holes 7 arranged in an array. The epoxy resin plate 2 has pre-drilled holes 8 corresponding to each of the receiving holes 7. Each receiving hole 7 on the epoxy resin plate 4 has a precisely corresponding pre-drilled hole 8 on the epoxy resin plate 2. This correspondence ensures that when the holes are aligned, the capacitor 19 can pass freely; when misaligned, a clamping hole 16 is formed to hold the capacitor 19. Both the pre-drilled hole 8 and the receiving holes 7 are through holes, with the pre-drilled hole 8 being slightly larger than the size of the capacitor to be clamped. The epoxy resin plate 2 has a flame retardant rating of FR4 to avoid scratches from contact with the ceramic surface and to ensure it does not age during long-term use at 150℃.

[0024] In one specific embodiment of this invention, the inner walls of the hanging plate 3 are respectively provided with two first hooks 9, and the movable plate 4 is provided with four second hooks 10 that cooperate with the first hooks 9. The first hooks 9 and the second hooks 10 are spaced apart by a certain distance and connected by an elastic element 18. In this embodiment, the elastic element 18 is a tension spring, with its two ends hanging on the first hooks 9 and the second hooks 10 respectively. The distance between the first hooks 9 and the second hooks 10 is designed to provide space for the extension and contraction of the tension spring. The thickness of the hanging plate 3 is 1.5mm, and it is made of SUS304 material. The thickness of the movable plate 4 is slightly thinner than that of the hanging plate 3 to avoid contact friction. In this embodiment, the thickness is designed to be 1.45mm. The epoxy resin plate 2 is provided with an observation hole 14, through which the positional relationship and status of the first hooks 9, the second hooks 10 and the tension spring can be seen at any time.

[0025] In one specific embodiment of this invention, the hanging plate 3 has a clearance notch 11 on one side, and the movable plate 4 has a protrusion 12 that matches the clearance notch 11. The side where the clearance notch 11 is located is perpendicular to the side where the first hook 9 is located. To ensure that the capacitor 19 to be clamped is in a 90° perpendicular position when in contact with the edge, the inner wall of the receiving hole 7 is perpendicular to the upper and lower surfaces of the movable plate 4; the inner wall of the reserved hole 8 is perpendicular to the upper and lower surfaces of the epoxy resin plate 2. The perpendicularity of the inner walls of the holes ensures the perpendicularity of the clamped capacitor 19. On this basis, a flexible silicone layer 17 with a thickness of 1mm is pasted on the inner side of the receiving hole 7. The outer surface of the silicone layer 17 has two spaced columnar protrusions with a radius of 0.2mm (not shown in the figure), which are designed to better accommodate the thickness differences between the capacitors 19 when compression occurs. To ensure the adhesion is strong, the adhesive plate 4 has a through hole 13 adjacent to each receiving hole 7. A flexible silicone pillar is also provided in the through hole 13, and the flexible silicone pillar is bonded to the flexible silicone layer 17.

[0026] When it is necessary to clamp the capacitor 19, the ejector tool pushes the movable plate 4 to move along the hanging plate 3. At this time, the elastic element 18 is stretched, causing the receiving hole 7 and the reserved hole 8 to be relatively misaligned. The overlapping area between the receiving hole 7 and the reserved hole 8 forms the clamping hole 16 for clamping the capacitor 19. Specifically, the ejector tool extends into the clearance notch 11 and, while contacting the protrusion 12, pushes the protrusion 12 inward, causing the movable plate 4 to move horizontally away from the clearance notch 11. When the movable plate 4 moves to contact the inner wall of the hanging plate 3, the receiving hole 7 and the reserved hole 8 are misaligned to form a clamping hole 16 for clamping the capacitor 19. At this time, the diameter of the clamping hole 16 reaches its maximum size. After the capacitor 19 is placed into the clamping hole 16, the control of the movable plate 4 is released, so that the clamping hole 16 clamps the middle of the capacitor 19 without contacting the outer electrode of the capacitor 19. At this time, the elastic element 18 is stretched, and both ends of the capacitor 19 are exposed outside the epoxy resin plate 2. When clamping the capacitor 19, specifically, one side of the capacitor 19 contacts the flexible silicone layer 17 and columnar protrusion of the movable plate 4, and the other side contacts one side wall of the reserved hole 8 of the upper and lower hanging plates 3. The contact surface between the accommodating hole 7 and the capacitor 19, which forms a clamping force by compression, is designed with silicone coating. The deformation of the flexible silicone coating accommodates the thickness tolerance and processing error of the capacitor 19 in the same area, thereby achieving a balanced clamping force for each independent capacitor in the area, which is effective.

[0027] Example 2: Figures 1-18 As shown, based on Embodiment 1, the implantation component also includes two outer frames 1, each outer frame 1 having two slots 5 on its inner side, and a support piece 6 for supporting the epoxy resin board 2 on the inner side of the slots 5.

[0028] The epoxy resin board 2 is placed inside the outer frame 1. In this embodiment, the bearing plate 6 has two shapes: triangular and semi-circular. The two epoxy resin boards 2 are symmetrical about the outer frame 1, that is, the two protruding tongues 12 face opposite directions. The protruding tongues 12 are close to the edge to facilitate the ejection of the tooling to control the movement of the adhesive plate 4. Each side and corner of the epoxy resin board 2 is exposed outside the hanging plate 3. Specifically, each side of the hanging plate 3 has a U-shaped groove, and each corner of the hanging plate 3 has a bend. The epoxy resin board 2 is rectangular in shape, so the overlapping part is exposed outside the hanging plate 3.

[0029] Two outer frames 1 are fixed together by bolts, thus forming an outer shell. A pair of epoxy resin boards 2 form an intermediate layer, and a hanging plate 3 and a sliding plate 4 form a sandwich structure, which clamps and fixes the inner panels. The outer frames 1 are made of SUS304 material to ensure the overall structural strength and prevent deformation.

[0030] It should also be noted that those skilled in the art can also set two pairs of outer frames 1 to form the outer shell, two pairs of epoxy resin boards 2 to form the middle layer, and a hanging board 3 and a glued board 4 to form the interlayer, forming a sandwich structure (2+1+2). The specific setting depends on the size of the capacitor 19.

[0031] Example 3: As Figures 1-18 As shown, based on Embodiment 1 or 2, and as a specific implementation of this embodiment, the ejection fixture includes a base plate 20, a platform 21 disposed on the base plate 20, and an ejection mechanism. The center of a pair of sidewalls of both the base plate 20 and the platform 21 is concave. The platform 21 is made of stainless steel with a surface flatness of less than 20 μm. Right-angle limiting blocks 22 are fixed to the four corners of the platform 21 by screws, forming a positioning area slightly larger than the implanted component.

[0032] A top cover 23 is hinged to one side of platform 21. Platform 21 is equipped with a magnetic snap 35. The platform 21 and the top cover 23 are fastened together to clamp the implant plate, and the platform 21 and the top cover 23 are magnetically fixed together. The top cover 23 includes an outer frame 28, an acrylic plate 29, and silicone strips 30. The acrylic plate 29 is fixed inside the outer frame 28, and the silicone strips 30 are evenly distributed on the acrylic plate 29. The outer frame 28 is convex in shape, and a handle 31 is provided on the upper surface of the outer frame 28. When platform 21 and top cover 23 are fastened together, the silicone strips 30 contact the upper end face of capacitor 19 to prevent the capacitor from shifting upwards when clamped. A bubble level 32 is provided on the base plate 20. Each corner of the bottom surface of the base plate 20 is provided with adjustable feet 33 that cooperate with the bubble level 32. The adjustable feet 33 are commercially available products, so their structure will not be described in detail. By adjusting the length of the feet, the base plate 20 can be placed horizontally.

[0033] The ejection mechanism is used to control the horizontal movement of the adhesive plate 4. The ejection mechanism is arranged opposite to each other on both sides of the platform 21. As a specific embodiment of this invention, the ejection mechanism includes a bracket 24, a wrench 25, a connector 26, and a push rod 27. The push rod 27 is movably connected to the bracket 24. The wrench 25 is connected to the push rod 27 through the connector 26. The extension and retraction of the push rod 27 is controlled by rotating the wrench 25. The push rod 27 specifically includes a cylinder 36, a rod 37, and a push block 38. The two ends of the rod 37 are respectively connected to the cylinder 36 and the push block 38. The cylinder 36 is detachably connected to the connector 26.

[0034] In use, the implanted component is placed on platform 21. The pusher 38 in pusher 27 pushes the protrusion 12 of the movable plate 4, causing the movable plate 4 to move horizontally away from the clearance notch 11. The receiving hole 7 and the reserved hole 8 are misaligned to form a clamping hole 16. Driven by pusher 27, the movable plate 4 contacts the inner wall of hanging plate 3. The diameter of clamping hole 16 is large enough to accommodate capacitor 19. Then, the capacitor is placed into clamping hole 16. It automatically centers by relying on the vertical inner walls of receiving hole 7 and reserved hole 8. The two ends of capacitor 19 are exposed. When the movable plate 4 is released, elastic element 18 pulls back, clamping hole 16 shrinks to hold the middle of the capacitor. Flexible silicone layer 17 is compatible with thickness tolerances to achieve balanced clamping force. The stroke of pusher 27 is adjustable, thereby adjusting the size of clamping hole 16 to adapt to different sizes of capacitor 19, enhancing the flexibility of the equipment.

[0035] Example 3: Figures 1-18 As shown, the implanted component is placed within the area of ​​the right-angle limiting block 22 on the platform 21 and suspended by the pad block 34. At this time, the push rod 27 is aligned with the protrusion 12 of the adhesive moving plate 4. Pulling the lever 25 causes the push rod 27 to extend into the clearance notch 11 and contact the tongue 12, pushing the tongue 12 inward. This causes the movable plate 4 to move horizontally away from the clearance notch 11. When the movable plate 4 moves to contact the inner wall of the hanging plate 3, the diameter of the clamping hole 16 reaches its maximum size. After the capacitor 19 is placed into the clamping hole 16, the capacitor 19 falls onto the platform 21 by its own weight, achieving automatic leveling. Pulling the lever 25 in the opposite direction resets the push rod 27, releasing the control of the movable plate 4. Under the action of the tension spring, the movable plate 4 moves closer to the clearance notch 11. The other side of the movable plate 4 separates from the hanging plate 3, so that the clamping hole 16 clamps the middle of the capacitor 19 without contacting the outer electrode of the capacitor 19. Both ends of the capacitor 19 are exposed on the epoxy resin plate 2. Then, grasp handle 31 and snap the upper pressure cover 23 onto platform 21. Platform 21 and upper pressure cover 23 are fixed together by magnetic attraction. Silicone strip 30 presses against the upper surface of the capacitor to prevent displacement. After clamping, the lower end of the capacitor protrudes to a specified length for subsequent operations. When the implantation plate is not clamped, elastic element 18 maintains its original length.

[0036] This invention uses an ejector mechanism to push the adhesive plate 4, thereby controlling the expansion or contraction of the clamping hole 16. This differs fundamentally from traditional methods that use thick adhesive plates to fix the size of the circular hole, relying on the expansion of the silicone in the capacitor 19 to generate a shrinking clamping force to secure the workpiece. The freely opening and closing design of the clamping hole 16 in this invention avoids contact and compression between the traditional thick adhesive plate and the semi-finished external electrode. The design of the platform 21 and the pad ensures consistent exposure of the lower end of the capacitor 19, addressing the issue of poor flatness of the capacitor 19 during manual implantation. Through the design of the implantation plate thickness, this invention ensures that only the middle area of ​​the capacitor 19 is clamped, thus exposing sufficient margin at both ends of the external electrode to be manufactured, preventing damage to the capacitor 19 and improving the yield rate.

[0037] The specific steps for using the implanted capacitor 19 and fabricating the external electrode according to the present invention are as follows: Step 1: The ejector tool pushes the adhesive plate 4 to move, so that the receiving hole 7 on the adhesive plate 4 is relatively misaligned with the reserved hole 8 on the epoxy resin plate 2, forming a clamping hole 16 for clamping the capacitor 19. Step 2: Place the capacitor 19 into the clamping hole 16, with both ends of the capacitor 19 exposed; release the control of the movable plate 4, and use the rebound force of the elastic element 18 to cause the clamping hole 16 to contract, clamping the middle part of the capacitor 19. Step 3: Fabricate the external electrode at one end of capacitor 19, and dry it at a low temperature (150°C) after fabrication. Step 4: Turn the implanted component over and place it back on the ejector fixture to fabricate the external electrode at the other end of capacitor 19. After fabrication, dry it at low temperature (150°C). Step 5: After both external electrodes are completed, remove the capacitor and perform a high-temperature silver burning process on the entire capacitor 19.

[0038] The above-mentioned low-temperature drying and high-temperature silvering processes are well-known to those skilled in the art, and therefore will not be described in detail here. By using the implantation steps of this invention to fabricate the external electrode, compared with the traditional implantation method using thick plastic plates, one implantation step and one high-temperature silvering step are reduced, improving work efficiency. Moreover, the free-opening and closing design of the clamping hole 16 of this invention avoids contact and compression between the traditional thick plastic plate and the semi-finished external electrode, preventing damage to the capacitor 19 and improving the yield rate.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A fixture for fabricating and embedding the external electrode of an MLCC capacitor, characterized in that, The device includes an implantation component and an ejection fixture, wherein the implantation component includes: Epoxy resin boards arranged symmetrically on the top and bottom (2); A hanging plate (3) and a movable plate (4) are provided between two epoxy resin boards (2), wherein the movable plate (4) is located inside the hanging plate (3), and the movable plate (4) and the hanging plate (3) are connected by an elastic element (18). The hanging plate (3) is detachably connected to the two epoxy resin boards (2). A pair of inner sidewalls of the hanging plate (3) are provided with a first hook (9), and the movable plate (4) is provided with a second hook (10) with the opposite bending direction to the first hook (9). The first hook (9) and the second hook (10) are spaced a certain distance apart and connected by an elastic element (18). One side of the hanging plate (3) has a clearance notch (11), and the movable plate (4) has a protrusion (12) that matches the clearance notch (11). The side where the clearance notch (11) is located is perpendicular to the side where the first hook (9) is located. The adhesive plate (4) has several receiving holes (7), and the epoxy resin plate (2) has corresponding reserved holes (8) that match the receiving holes (7). When it is necessary to clamp the capacitor (19), the ejector tool pushes the adhesive plate (4) to move along the hanging plate (3), so that the receiving hole (7) and the reserved hole (8) are relatively misaligned, and the overlapping area between the receiving hole (7) and the reserved hole (8) forms a clamping hole (16) for clamping the capacitor (19).

2. The MLCC capacitor external electrode fabrication and implantation clamping fixture according to claim 1, characterized in that, The inner wall of the receiving hole (7) is perpendicular to the upper and lower surfaces of the adhesive plate (4); the inner wall of the reserved hole (8) is perpendicular to the upper and lower surfaces of the epoxy resin plate (2).

3. The MLCC capacitor external electrode fabrication and implantation clamping fixture according to claim 2, characterized in that, Flexible silicone is pasted on the inside of the receiving hole (7), and columnar protrusions are provided on the outer surface of the silicone.

4. The MLCC capacitor external electrode fabrication and implantation clamping fixture according to any one of claims 1 to 3, characterized in that, The implantation component includes two outer frames (1), with slots (5) on the inner side of the outer frames (1) and a support plate (6) for supporting the epoxy resin plate (2) on the inner side of the slots (5).

5. The MLCC capacitor external electrode fabrication and implantation clamping fixture according to any one of claims 1 to 3, characterized in that, The ejection fixture includes a base plate (20), a platform (21) set on the base plate (20), and an ejection mechanism. Each corner of the platform (21) is provided with a right-angle limiting block (22) for positioning the implanted component. An upper pressure cover (23) is hinged to one side of the platform (21). The implanted component is clamped by fastening the platform (21) and the upper pressure cover (23). The ejection mechanism includes a bracket (24), a wrench (25), a connector (26), and a push rod (27). The push rod (27) is movably connected to the bracket (24). The wrench (25) is connected to the push rod (27) through the connector (26). The push rod (27) is extended and retracted by rotating the wrench (25) to control the horizontal movement of the implanted component.

6. The MLCC capacitor external electrode fabrication and implantation clamping fixture according to claim 5, characterized in that, The platform (21) has pads (34) on a pair of sides for suspending the implanted component; the platform (21) is magnetically fixed to the upper cover (23), the upper cover (23) includes an outer frame (28), an acrylic plate (29) and a silicone strip (30), the acrylic plate (29) is fixed inside the outer frame (28), the silicone strip (30) is evenly distributed on the acrylic plate (29), the upper surface of the outer frame (28) is provided with a handle (31), when the platform (21) and the upper cover (23) are fastened together, the silicone strip (30) contacts the platform (21).

7. The MLCC capacitor external electrode fabrication and implantation clamping fixture according to claim 5, characterized in that, A bubble level (32) is provided on the base plate (20), and adjustable feet (33) are provided at each corner of the bottom surface of the base plate (20) to cooperate with the bubble level (32) for adjusting the levelness of the base plate (20).

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