高密度盲埋孔PCB激光钻孔方法、装置及设备
By using a high-density blind buried via PCB laser drilling method that combines 355nm ultraviolet laser and X-ray detection, problems such as hole diameter accuracy, hole wall quality, and depth control have been solved, achieving high-precision, high-quality, and high-efficiency laser drilling, thereby improving PCB yield and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN LIDIA ELECTRONICS CO LTD
- Filing Date
- 2025-12-01
- Publication Date
- 2026-07-17
AI Technical Summary
Existing laser drilling technology suffers from problems such as insufficient hole diameter accuracy, poor hole wall quality, inaccurate depth control, interlayer alignment difficulties, and low hole bottom flatness when processing high-density blind and buried via PCBs. This results in low yield, high cost, and an inability to meet the requirements of high-frequency signal transmission.
A 355nm ultraviolet laser is used for cold ablation drilling. Combined with an X-ray detection module and DOE optics, precise matching of laser parameters and real-time monitoring are achieved. High-pressure nitrogen and ultrasonic cleaning are used to solve the residue problem, and a closed-loop feedback mechanism is established to optimize processing parameters.
It achieves 50μm aperture accuracy control within ±3μm, hole roundness >95%, hole wall roughness Ra <0.5μm, depth deviation control within ±2%, hole void rate reduced to below 1%, yield increased to 98%, cost reduced by 8%-15%, and meets the requirements of high frequency signal transmission.
Smart Images
Figure CN121551874B_ABST