Grinding fluid supply system

Abstract

The present disclosure provides a polishing liquid supply system. The polishing liquid supply system comprises a controller, a first liquid supply subsystem and a second liquid supply subsystem; when the first liquid supply subsystem is in a liquid supply process, if it is needed to switch to the second liquid supply subsystem for liquid supply, the controller controls the second liquid supply subsystem to perform a filling backflow process in advance, so that the polishing liquid fills the liquid supply pipeline of the second liquid supply subsystem, and ensures that the polishing liquid can be continuously provided from the second liquid supply subsystem to the chemical mechanical polishing equipment after switching.

Description

Technical Field

[0001] This disclosure relates to the semiconductor field, and more particularly to a polishing slurry supply system. Background Technology

[0002] In semiconductor chemical mechanical polishing (CMP) processes, to ensure production continuity, the slurry supply system is typically configured with two independent supply subsystems, operating in a "one-in-use, one-out-of-use" mode. However, when switching from one supply subsystem to the other, the supply lines of the other subsystem (the standby system) are usually emptied or stagnant, containing air or residual slurry. If the standby system is used directly to start the supply, the air in the lines must first be purged and the system filled with slurry. This process can lead to supply delays, unstable flow rates, and even the introduction of air bubbles, resulting in uneven polishing or equipment malfunctions. Summary of the Invention

[0003] This disclosure provides a grinding fluid supply system.

[0004] According to one aspect of this disclosure, a polishing slurry supply system is provided, comprising: a controller, a first slurry supply subsystem, and a second slurry supply subsystem; the first slurry supply subsystem comprising: a first supply tank for mixing and storing the polishing slurry; a first supply pipeline for supplying the polishing slurry in the first supply tank to a chemical mechanical polishing (CMP) device; a first supply pump; a first filter for filtering the polishing slurry; and a first valve, wherein during the process of the first slurry supply subsystem supplying polishing slurry to the CMP device, the polishing slurry is supplied from the first supply tank, via the first supply pipeline, and through the first supply pump, the first filter, and the first valve to the CMP device. The second liquid supply subsystem includes: a second supply tank for mixing and storing the polishing slurry; a second supply pipeline for supplying the polishing slurry from the second supply tank to the chemical mechanical polishing (CMP) equipment; a second supply pump; a second filter for filtering the polishing slurry; and a second valve. During the process of the second liquid supply subsystem supplying polishing slurry to the CMP equipment, the polishing slurry flows from the second supply tank, through the second supply pipeline, and through the second supply pump, the second filter, and the second valve to the CMP equipment. The first liquid supply subsystem further includes: a third valve, located downstream of the first filter and in a pipeline different from the pipeline where the first valve is located. When the third valve is open, the polishing slurry can flow from the first supply tank through the first supply pump, the first filter, and the third valve back to the first supply tank, thereby realizing the filling and return process of the first liquid supply subsystem. The second liquid supply subsystem further includes a fourth valve, located downstream of the second filter, and in a pipeline different from the pipeline where the second valve is located. When the fourth valve is open, the polishing slurry can flow from the second supply tank through the second supply pump, the second filter, and the fourth valve back to the second supply tank, thereby realizing the filling and recirculation process of the second liquid supply subsystem. When the controller controls the first liquid supply subsystem to be in the liquid supply process, and a switch to the second liquid supply subsystem is required, the controller pre-controls the second liquid supply subsystem to perform the filling and recirculation process, ensuring that the polishing slurry fills the supply pipeline of the second liquid supply subsystem and that the polishing slurry can be continuously supplied from the second liquid supply subsystem to the chemical mechanical polishing equipment after the switch.

[0005] According to one technical solution, by pre-starting the filling and reflux process of the backup subsystem before switching the liquid supply subsystem, the backup pipeline can complete the filling and venting of the grinding fluid before switching, thereby achieving a continuous, stable, and bubble-free supply of grinding fluid at the moment of switching, avoiding flow fluctuations and process interruptions.

[0006] According to at least one embodiment of this disclosure, the first liquid supply subsystem further includes: a fifth valve disposed upstream of the first liquid supply pipeline; and a sixth valve disposed between the first liquid supply pump and the first filter. During the purging process of the first liquid supply subsystem, the third, fifth, and sixth valves are opened and the first valve is closed. Purge gas enters the first liquid supply pipeline via the fifth valve and blows the old liquid in the first liquid supply pipeline to the first supply tank via the third valve. The old liquid is then discharged via the first liquid supply pump and the sixth valve. The second liquid supply subsystem further includes: a seventh valve disposed upstream of the second liquid supply pipeline; and an eighth valve disposed between the second liquid supply pump and the second filter. During the purging process of the second liquid supply subsystem, the fourth, seventh, and eighth valves are opened and the second valve is closed. Purge gas enters the second liquid supply pipeline via the seventh valve and blows the old liquid in the second liquid supply pipeline to the second supply tank via the fourth valve. The old liquid is then discharged via the second liquid supply pump and the eighth valve. When the controller controls the first liquid supply subsystem to be in the liquid supply process, the controller can also control the second liquid supply subsystem to be in the purging process.

[0007] According to the technical solution of this embodiment, the backup subsystem can be actively cleaned and emptied without interrupting the main fluid supply process. This ensures that it provides high-purity, uncontaminated, and bubble-free fresh grinding fluid during subsequent switchovers, significantly improving fluid supply quality and process stability.

[0008] According to at least one embodiment of this disclosure, the first liquid supply subsystem further includes: a first deionized water supply pipeline for supplying deionized water to the first supply tank. When the first liquid supply subsystem is in a humidification process, deionized water is supplied to the first supply tank via the first deionized water supply pipeline to humidify the first supply tank. The second liquid supply subsystem further includes: a second deionized water supply pipeline for supplying deionized water to the second supply tank. When the second liquid supply subsystem is in a humidification process, deionized water is supplied to the second supply tank via the second deionized water supply pipeline to humidify the second supply tank. Wherein, when the controller controls the first liquid supply subsystem to be in a liquid supply process, the controller can also control the second liquid supply subsystem to be in a humidification process.

[0009] According to the technical solution of this embodiment, the internal stability of the tank can be maintained during long standby periods or liquid preparation intervals, ensuring the purity and reliability of subsequent liquid preparation and supply, and further improving the process robustness and maintenance efficiency of the entire grinding fluid supply system.

[0010] According to at least one embodiment of this disclosure, the first liquid supply subsystem further includes a ninth valve disposed between the sixth valve and the first filter. When the first liquid supply subsystem is in the draining process, the sixth valve is open and the ninth valve is closed, and the liquid in the first supply tank is discharged via the first liquid supply pump and the sixth valve. The second liquid supply subsystem further includes a tenth valve disposed between the eighth valve and the second filter. When the second liquid supply subsystem is in the draining process, the eighth valve is open and the tenth valve is closed, and the liquid in the second supply tank is discharged via the second liquid supply pump and the eighth valve. Wherein, when the controller controls the first liquid supply subsystem to be in the liquid supply process, the controller can also control the second liquid supply subsystem to be in the draining process.

[0011] According to the technical solution of this embodiment, the moisturizing liquid in the standby subsystem can be efficiently removed before switching. This prevents it from mixing with the newly prepared grinding fluid, which could lead to concentration deviations or contamination. This ensures the purity of the supplied fluid, improves the reliability of system switching, and reduces maintenance costs.

[0012] According to at least one embodiment of this disclosure, the first liquid supply subsystem further includes: a first deionized water supply pipeline for supplying deionized water to the first supply tank; and a first grinding stock supply pipeline for supplying grinding stock to the first supply tank. During the mixing process of the first liquid supply subsystem, deionized water is supplied to the first supply tank via the first deionized water supply pipeline, and grinding stock is supplied to the first supply tank via the first grinding stock supply pipeline. The first supply tank mixes the deionized water and the grinding stock to obtain the grinding liquid. The second liquid supply subsystem further includes: a second deionized water supply pipeline for supplying deionized water to the second supply tank; and a second grinding stock supply pipeline for supplying grinding stock to the second supply tank. During the mixing process of the second liquid supply subsystem, deionized water is supplied to the second supply tank via the second deionized water supply pipeline, and grinding stock is supplied to the second supply tank via the second grinding stock supply pipeline. The second supply tank mixes the deionized water and the grinding stock to obtain the grinding liquid. When the controller controls the first liquid supply subsystem to be in the liquid supply process, the controller can also control the second liquid supply subsystem to be in the mixing process.

[0013] According to the technical solution of this embodiment, it can be ensured that the standby supply tank has fresh grinding fluid that meets the process requirements when switching, which can significantly shorten the switching waiting time, improve the response speed and continuous operation capability of the liquid supply system, and avoid concentration deviation or production delay caused by temporary on-site liquid preparation.

[0014] According to at least one embodiment of this disclosure, the first liquid supply subsystem further includes: a first venting pipe for discharging the grinding fluid containing air bubbles from the first liquid supply pipe; an eleventh valve disposed upstream of the first venting pipe; and a first air bubble detection device disposed downstream of the first filter. When the first liquid supply subsystem is in the venting process, the eleventh valve is opened, and the grinding fluid containing air bubbles is discharged through the first venting pipe and the eleventh valve. The first air bubble detection device is used to detect whether air bubbles exist in the first liquid supply pipe, and when air bubbles are detected, sends a first venting reminder signal to the controller. The controller responds to the first venting reminder signal and controls the first liquid supply subsystem to be in the venting process. The second liquid supply subsystem further includes: a second venting pipe for discharging the grinding fluid containing air bubbles from the second liquid supply pipe; a twelfth valve located upstream of the second venting pipe; and a second bubble detection device located downstream of the second filter. When the second liquid supply subsystem is in the venting process, the twelfth valve opens, and the grinding fluid containing air bubbles is discharged through the second venting pipe and the twelfth valve. The second bubble detection device is used to detect whether air bubbles exist in the second liquid supply pipe, and if air bubbles are detected, it sends a second venting reminder signal to the controller. The controller responds to the second venting reminder signal and controls the second liquid supply subsystem to be in the venting process.

[0015] According to the technical solution of this embodiment, air bubbles can be actively and accurately eliminated in either the liquid supply or standby state, avoiding flow fluctuations or uneven polishing caused by air bubble accumulation. Simultaneously, it automates and intelligently performs the venting operation, eliminating the need for manual intervention and significantly improving liquid supply stability, process repeatability, and system operational reliability.

[0016] According to at least one embodiment of this disclosure, a titrator is further included for detecting liquid concentration data in the first or second liquid supply line. Specifically, when the controller controls the first liquid supply subsystem to be in the liquid supply process, the titrator is controlled to detect first liquid concentration data in the first liquid supply line and send the first liquid concentration data to the controller. The controller receives the first liquid concentration data and determines whether it is within an allowable concentration range. If the concentration exceeds the allowable range, the liquid supply process is switched from the first liquid supply subsystem to the second liquid supply subsystem. When the controller controls the second liquid supply subsystem to be in the liquid supply process, the titrator is controlled to detect second liquid concentration data in the second liquid supply line and send the second liquid concentration data to the controller. The controller receives the second liquid concentration data and determines whether it is within an allowable concentration range. If the concentration exceeds the allowable range, the liquid supply process is switched from the second liquid supply subsystem to the first liquid supply subsystem.

[0017] According to the technical solution of this embodiment, when the concentration exceeds the allowable concentration range, the operation of the current liquid supply subsystem can be stopped immediately and the system can be automatically switched to another liquid supply subsystem. This effectively avoids the deterioration of polishing performance or wafer damage caused by abnormal polishing slurry concentration.

[0018] According to at least one embodiment of this disclosure, a time monitoring device is further included, used to detect a first duration during which the first liquid supply subsystem is in the liquid supply process, or a second duration during which the second liquid supply subsystem is in the liquid supply process. The time monitoring device sends the first duration to the controller, which receives the first duration and determines whether it exceeds a duration threshold. If the duration threshold is exceeded, the liquid supply process is switched from the first liquid supply subsystem to the second liquid supply subsystem. The time monitoring device also sends the second duration to the controller, which receives the second duration and determines whether it exceeds a duration threshold. If the duration threshold is exceeded, the liquid supply process is switched from the second liquid supply subsystem to the first liquid supply subsystem.

[0019] According to the technical solution of this embodiment, when the operating time of any liquid supply subsystem exceeds a preset safety time limit, a switching action can be automatically triggered to stop the current liquid supply and start another subsystem. This effectively prevents the grinding fluid from settling, agglomerating, or degrading in chemical properties due to prolonged retention.

[0020] According to at least one embodiment of this disclosure, the first liquid supply subsystem further includes: a first liquid level measuring device, used to measure first liquid level data in the first supply tank and send the first liquid level data to the controller; the controller receives the first liquid level data and determines whether it is less than a liquid level threshold; if it is less than the liquid level threshold, the liquid supply process is switched from the first liquid supply subsystem to the second liquid supply subsystem. The second liquid supply subsystem further includes: a second liquid level measuring device, used to measure second liquid level data in the second supply tank and send the second liquid level data to the controller; the controller receives the second liquid level data and determines whether it is less than a liquid level threshold; if it is less than the liquid level threshold, the liquid supply process is switched from the second liquid supply subsystem to the first liquid supply subsystem.

[0021] According to the technical solution of this embodiment, a switching action can be triggered in advance when the liquid level in any liquid supply subsystem is lower than a preset threshold, smoothly transferring the liquid supply task to another subsystem with sufficient liquid volume. This not only avoids the risks of pump dry running, air bubble intake, or liquid supply interruption caused by emptying the liquid supply tank.

[0022] According to at least one embodiment of this disclosure, the first liquid volume measuring device and the second liquid volume measuring device employ a weighing sensor or a liquid level sensor.

[0023] According to the technical solution of this embodiment, by using a weighing sensor as a liquid level measuring device, the overall mass change of the supply tank can be directly monitored, thereby accurately reflecting the actual quantity of the grinding fluid. The measurement results are unaffected by factors such as changes in liquid density, surface foam, liquid residue on the tank wall, or temperature drift. Using a liquid level sensor as the liquid level measuring device offers advantages such as compact structure and fast response, making it suitable for space-constrained scenarios. Attached Figure Description

[0024] The accompanying drawings illustrate exemplary embodiments of the present disclosure and, together with the description thereof, serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0025] Figure 1 This is a schematic diagram of a grinding fluid supply system according to one embodiment of the present disclosure. Detailed Implementation

[0026] The present disclosure will now be described in further detail with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are for illustrative purposes only and are not intended to limit the scope of the disclosure. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present disclosure are shown in the accompanying drawings.

[0027] It should be noted that, where there is no conflict, the embodiments and features described in this disclosure can be combined with each other. The technical solutions of this disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0028] Unless otherwise stated, the exemplary implementations / embodiments shown are to be understood as providing exemplary features of various details that provide ways in which the technical concepts of this disclosure can be implemented in practice. Therefore, unless otherwise stated, the features of various implementations / embodiments may be additionally combined, separated, interchanged and / or rearranged without departing from the technical concepts of this disclosure.

[0029] In existing technologies, grinding slurry supply systems typically employ two independent supply subsystems in a "one-in-use, one-out-of-charge" configuration. Since most systems do not pre-fill the backup pipeline during switchover, relying on natural air venting and filling during the initial flow of the slurry supply results in slow response and is prone to process fluctuations. While some systems attempt to fill the pipeline through reflux circulation, the lack of coordinated control with the main supply process prevents precise pre-filling of the pipeline before switchover, hindering truly seamless switching.

[0030] To address this, the present disclosure proposes the following technical solution, which provides a polishing slurry supply system, including a controller, a first slurry supply subsystem, and a second slurry supply subsystem. Each slurry supply subsystem is equipped with an independent supply tank, a supply pump, a filter, a supply valve, and a return valve located downstream of the filter. During the operation of the main slurry supply subsystem, the controller pre-starts the filling and return process of the backup slurry supply subsystem, thereby pre-filling the entire slurry supply pipeline and purging air, preparing for subsequent switching. This disclosure enables seamless switching between two slurry supply subsystems without interrupting the supply of slurry to the chemical mechanical polishing equipment. Because the backup pipeline is filled with polishing slurry before switching, it effectively avoids flow fluctuations, supply delays, or air bubble introduction caused by empty or air-containing pipelines during switching. This significantly improves supply stability and process consistency, while reducing manual intervention and increasing automation and production efficiency.

[0031] This disclosure applies to chemical mechanical polishing processes in semiconductor manufacturing where stringent requirements for the continuity and stability of the liquid supply are present.

[0032] This disclosure provides a grinding slurry supply system, such as Figure 1 As shown, it includes a first liquid supply subsystem 100, a second liquid supply subsystem 200, and a controller 300.

[0033] The first liquid supply subsystem 100 includes: a first supply tank 110, a first supply pipeline 130, a first supply pump 120, a first filter 140 for filtering the polishing slurry, and a first valve 151. The first supply tank 110 is used for mixing and storing the polishing slurry. The first supply pipeline 130 is used to supply the polishing slurry in the first supply tank 110 to the chemical mechanical polishing apparatus 400. During the process of supplying polishing slurry from the first supply subsystem 100 to the chemical mechanical polishing apparatus 400, the polishing slurry is supplied from the first supply tank 110, via the first supply pipeline 130, and through the first supply pump 120, the first filter 140, and the first valve 151 to the chemical mechanical polishing apparatus 400.

[0034] The second liquid supply subsystem 200 includes: a second supply tank 210, a second supply pipeline 230, a second supply pump 220, a second filter 240 for filtering the polishing slurry, and a second valve 251. The second supply tank 210 is used for mixing and storing the polishing slurry. The second supply pipeline 230 is used to supply the polishing slurry in the second supply tank 210 to the chemical mechanical polishing equipment 400. During the process of the second liquid supply subsystem 200 supplying polishing slurry to the chemical mechanical polishing equipment 400, the polishing slurry flows from the second supply tank 210, through the second supply pipeline 230, and through the second supply pump 220, the second filter 240, and the second valve 251 to the chemical mechanical polishing equipment 400.

[0035] The first liquid supply subsystem 100 also includes a third valve 152. The third valve 152 is located downstream of the first filter 140 and in a different pipeline than the pipeline where the first valve 151 is located. When the third valve 152 is open, the grinding fluid can flow from the first supply tank 110 through the first supply pump 120, the first filter 140, and the third valve 152 before flowing back to the first supply tank 110, thereby realizing the filling and return process of the first liquid supply subsystem 100.

[0036] The second liquid supply subsystem 200 also includes a fourth valve 252. The fourth valve 252 is located downstream of the second filter 240 and in a different pipeline than the one containing the second valve 251. When the fourth valve 252 is open, the grinding fluid can flow from the second supply tank 210 through the second supply pump 220, the second filter 240, and the fourth valve 252 before returning to the second supply tank 210, thus realizing the filling and return process of the second liquid supply subsystem 200.

[0037] The controller 300 can be a control device with a PLC controller or similar equipment, integrating various signal interfaces to achieve fully automated control of the entire process of liquid supply, switching, evacuation, aging, and flow. It can also have data storage capabilities to record key parameters and set up a fault alarm mechanism, such as alarms for abnormal liquid levels, which are then pushed to the user terminal. The controller 300 is not shown in the figure, and existing technologies can be used for aspects related to the controller 300; these are not explicitly limited in this document. The controller 300 can be used to control various valves in the first liquid supply subsystem 100 and the second liquid supply subsystem 200, and can also receive detection signals from the first liquid supply subsystem 100 and the second liquid supply subsystem 200 for control purposes. Of course, those skilled in the art should understand that the controller 300 can also be used to control other valves in the grinding fluid supply system.

[0038] Based on the above-described structure of the polishing slurry supply system, the slurry supply process and the filling and reflux process of the first slurry supply subsystem 100 and the second slurry supply subsystem 200 can be realized. During the operation of the polishing slurry supply system, when the controller 300 controls the first slurry supply subsystem 100 to be in the slurry supply process, if it is necessary to switch to the second slurry supply subsystem 200 for slurry supply, the controller 300 controls the second slurry supply subsystem 200 to perform the filling and reflux process in advance, so that the polishing slurry fills the supply pipeline of the second slurry supply subsystem 200, and ensures that the polishing slurry can be continuously supplied from the second slurry supply subsystem 200 to the chemical mechanical polishing equipment 400 after the switch.

[0039] In the above-mentioned grinding fluid supply system, by pre-starting the filling and reflux process of the backup subsystem before switching the fluid supply subsystem, the backup pipeline can complete the filling and venting of grinding fluid before switching, thereby achieving a continuous, stable, and bubble-free supply of grinding fluid at the moment of switching, avoiding flow fluctuations and process interruptions.

[0040] In one possible implementation, the first liquid supply subsystem 100 further includes a fifth valve 153 and a sixth valve 154. The fifth valve 153 is located upstream of the first liquid supply line 130. The sixth valve 154 is located between the first liquid supply pump 120 and the first filter 140. Exemplarily, the fifth valve 153 is located between the first liquid supply pump 120 and the first filter 140. The sixth valve 154 is located between the first liquid supply pump 120 and the fifth valve 153.

[0041] When the first liquid supply subsystem 100 is in the purging process, the third valve 152, the fifth valve 153, and the sixth valve 154 are open, and the first valve 151 is closed. Purge gas enters the first liquid supply line 130 via the fifth valve 153 and blows the old liquid in the first liquid supply line 130 to the first supply tank 110 via the third valve 152. The old liquid is then discharged via the first liquid supply pump 120 and the sixth valve 154. For example, nitrogen gas can be used as the purging gas.

[0042] The second liquid supply subsystem 200 further includes a seventh valve 253 and an eighth valve 254. The seventh valve 253 is located upstream of the second liquid supply line 230. The eighth valve 254 is located between the second liquid supply pump 220 and the second filter 240. Exemplarily, the seventh valve 253 is located between the second liquid supply pump 220 and the second filter 240. The eighth valve 254 is located between the second liquid supply pump 220 and the seventh valve 253.

[0043] When the second liquid supply subsystem 200 is in the purging process, the fourth valve 252, the seventh valve 253, and the eighth valve 254 are opened, and the second valve 251 is closed. The purging gas enters the second liquid supply line 230 through the seventh valve 253 and blows the old liquid in the second liquid supply line 230 to the second supply tank 210 through the fourth valve 252. Then the old liquid is discharged through the second liquid supply pump 220 and the eighth valve 254.

[0044] When the controller 300 controls the first liquid supply subsystem 100 to be in the liquid supply process, the controller 300 can also control the second liquid supply subsystem 200 to be in the purging process.

[0045] Based on the above-described structure of the polishing slurry supply system, the purging process of the first slurry supply subsystem 100 and the second slurry supply subsystem 200 can be realized. During the operation of the polishing slurry supply system, when the controller 300 controls the first slurry supply subsystem 100 to be in the slurry supply process, the controller 300 can also control the second slurry supply subsystem 200 to be in the purging process.

[0046] In the aforementioned grinding slurry supply system, while the first slurry supply subsystem 100 is supplying slurry normally, the controller 300 can control the second slurry supply subsystem 200 to independently perform a purging process. This allows the purging gas to blow the old slurry in the second slurry supply pipeline 230 back to the second supply tank 210 and discharge it through the second slurry supply pump 220 and the eighth valve 254. This effectively removes residual aged grinding slurry from the pipeline. This allows for proactive cleaning and purging of the standby subsystem without interrupting the main slurry supply process. It ensures that the standby subsystem provides high-purity, uncontaminated, and bubble-free fresh grinding slurry during subsequent switchovers, significantly improving slurry supply quality and process stability.

[0047] In one possible implementation, the first liquid supply subsystem 100 further includes a first deionized water supply line 160. The first deionized water supply line 160 is used to supply deionized water to the first supply tank 110. When the first liquid supply subsystem 100 is in a humidification process, deionized water is supplied to the first supply tank 110 via the first deionized water supply line 160 to humidify the first supply tank 110.

[0048] The second liquid supply subsystem 200 further includes a second deionized water supply line 260. The second deionized water supply line 260 is used to supply deionized water to the second supply tank 210. When the second liquid supply subsystem 200 is in the humidification process, deionized water is supplied to the second supply tank 210 via the second deionized water supply line 260 to humidify the second supply tank 210.

[0049] Based on the above-described structure of the polishing slurry supply system, the moisturizing process of the first slurry supply subsystem 100 and the second slurry supply subsystem 200 can be realized. During the operation of the polishing slurry supply system, when the controller 300 controls the first slurry supply subsystem 100 to be in the slurry supply process, the controller 300 can control the second slurry supply subsystem 200 to be in the moisturizing process.

[0050] In the aforementioned grinding slurry supply system, while the first supply subsystem 100 is supplying slurry normally, the controller 300 can control the second supply subsystem 200 to enter a moisturizing process, providing wet protection to the inner wall of the supply tank and residual pipelines. This maintains the wetness of the inner wall of the tank and pipeline interfaces, preventing particle adhesion or material performance degradation caused by drying. It effectively maintains the cleanliness and material compatibility of the standby subsystem. This ensures stability inside the tank during long system standby or dispensing intervals, guaranteeing the purity and reliability of subsequent dispensing and supply, further improving the process robustness and maintenance efficiency of the entire grinding slurry supply system.

[0051] In one possible implementation, the first liquid supply subsystem 100 further includes a ninth valve 155. The ninth valve 155 is disposed between the sixth valve 154 and the first filter 140. When the first liquid supply subsystem 100 is in the draining process, the sixth valve 154 is open and the ninth valve 155 is closed, and the liquid in the first supply tank 110 is discharged via the first supply pump 120 and the sixth valve 154.

[0052] The second liquid supply subsystem 200 also includes a tenth valve 255. The tenth valve 255 is disposed between the eighth valve 254 and the second filter 240. When the second liquid supply subsystem 200 is in the draining process, the eighth valve 254 is open and the tenth valve 255 is closed, and the liquid in the second supply tank 210 is discharged through the second liquid supply pump 220 and the eighth valve 254.

[0053] Based on the above-described structure of the polishing slurry supply system, the drainage process of the first slurry supply subsystem 100 and the second slurry supply subsystem 200 can be realized. During the operation of the polishing slurry supply system, when the controller 300 controls the first slurry supply subsystem 100 to be in the slurry supply process, the controller 300 can control the second slurry supply subsystem 200 to be in the slurry drainage process.

[0054] In the aforementioned grinding slurry supply system, while the first supply subsystem 100 is supplying slurry normally, the controller 300 can control the second supply subsystem 200 to independently execute the drainage process. This allows the deionized water for moisturizing in the second supply tank 210 to be directly discharged via the second supply pump 220 and the eighth valve 254, without flowing through the filter. This efficiently removes the moisturizing liquid from the standby subsystem before switching, preventing it from mixing with the newly prepared grinding slurry and causing concentration deviations or contamination. This ensures the purity of the supplied slurry, improves system switching reliability, and reduces maintenance costs.

[0055] In one possible implementation, the first liquid supply subsystem 100 further includes a first grinding slurry supply line 170. The first grinding slurry supply line 170 is used to supply grinding slurry (obtained by diluting a high-concentration grinding slurry with deionized water) to the first supply tank 110. During the mixing process in the first liquid supply subsystem 100, deionized water is supplied to the first supply tank 110 via the first deionized water supply line 160, and the grinding slurry is supplied to the first supply tank 110 via the first grinding slurry supply line 170. The first supply tank 110 mixes the deionized water and the grinding slurry to obtain the grinding slurry.

[0056] The second liquid supply subsystem 200 further includes a second grinding solution supply line 270. The second grinding solution supply line 270 is used to supply grinding solution to the second supply tank 210. During the mixing process of the second liquid supply subsystem 200, deionized water is supplied to the second supply tank 210 via the second deionized water supply line 260, and grinding solution is supplied to the second supply tank 210 via the second grinding solution supply line 270. The second supply tank 210 mixes the deionized water and the grinding solution to obtain a grinding solution.

[0057] Based on the above-described structure of the polishing slurry supply system, the mixing process of the first slurry supply subsystem 100 and the second slurry supply subsystem 200 can be realized. During the operation of the polishing slurry supply system, when the controller 300 controls the first slurry supply subsystem 100 to be in the slurry supply process, the controller 300 can also control the second slurry supply subsystem 200 to be in the mixing process.

[0058] In the aforementioned polishing slurry supply system, while the first slurry supply subsystem 100 continuously supplies slurry to the chemical mechanical polishing equipment 400, the controller 300 can control the second slurry supply subsystem 200 to independently execute the mixing process. This allows the preparation of polishing slurry for the backup subsystem to be completed in advance without interrupting the current slurry supply. This ensures that the backup supply tank (i.e., the second supply tank 210) contains fresh polishing slurry that meets the process requirements during the switchover, significantly shortening the switchover waiting time, improving the response speed and continuous operation capability of the slurry supply system, and avoiding concentration deviations or production delays caused by on-site temporary slurry preparation.

[0059] In one possible implementation, the first liquid supply subsystem 100 further includes a first venting pipe 180, an eleventh valve 156, and a first bubble detection device 190. The first venting pipe 180 is used to discharge the grinding fluid containing bubbles from the first liquid supply pipe 130. The eleventh valve 156 is located upstream of the first venting pipe 180. The first bubble detection device 190 is located downstream of the first filter 140 and is used to detect the presence of bubbles in the first liquid supply pipe 130. Upon detecting the presence of bubbles, it sends a first venting reminder signal to the controller 300. In response to the first venting reminder signal, the controller 300 controls the first liquid supply subsystem 100 to enter the venting process. During the venting process, the eleventh valve 156 is opened, allowing bubbles to be discharged via the first venting pipe 180 and the eleventh valve 156.

[0060] The second liquid supply subsystem 200 further includes a second venting pipe 280, a twelfth valve 256, and a second bubble detection device 290. The second venting pipe 280 is used to discharge grinding fluid containing bubbles from the second liquid supply pipe 230. The twelfth valve 256 is located upstream of the second venting pipe 280. The second bubble detection device 290 is located downstream of the second filter 240 and is used to detect the presence of bubbles in the second liquid supply pipe 230. Upon detecting the presence of bubbles, it sends a second venting alert signal to the controller 300. In response to the second venting alert signal, the controller 300 controls the second liquid supply subsystem 200 to enter the venting process. During the venting process, the twelfth valve 256 opens, allowing bubbles to be discharged via the second venting pipe 280 and the twelfth valve 256.

[0061] In addition, such as Figure 1As shown, the first liquid supply subsystem 100 may further include a thirteenth valve 157, which is located in the pipeline between the first valve 151 and the first supply tank 110. The purpose of the thirteenth valve 157 is to ensure that, when the chemical mechanical polishing equipment 400 does not require polishing fluid, the first liquid supply pump 120, the ninth valve 155, the first valve 151, and the thirteenth valve 157 are all open, allowing the polishing fluid to flow from and return to the first supply tank 110, thus maintaining the circulation of the polishing fluid. When polishing fluid is needed, closing the thirteenth valve 157 directly supplies the polishing fluid to the chemical mechanical polishing equipment 400. The first liquid supply subsystem 100 may further include a fourteenth valve 257, which is located in the pipeline between the second valve 251 and the second supply tank 210. The purpose of the fourteenth valve 257 is the same as that of the thirteenth valve 157, and will not be repeated here.

[0062] In the aforementioned polishing slurry supply system, the presence of air bubbles in the supply pipeline is monitored in real time during the slurry flow. Upon detection of air bubbles, the controller 300 automatically triggers the venting process of the corresponding subsystem, allowing the air-bearing slurry to be promptly discharged through the venting pipeline. This proactively and precisely eliminates air bubbles during both supply and standby states, preventing flow fluctuations or uneven polishing caused by bubble accumulation. Simultaneously, it automates and intelligently performs the venting operation, eliminating the need for manual intervention and significantly improving supply stability, process repeatability, and system operational reliability.

[0063] As one possible implementation, the grinding slurry supply system also includes a titrator 500. The titrator 500 is used to detect the liquid concentration data in the first supply line 130 or the second supply line 230. A valve 501 may be provided with the titrator 500. When the valve 501 is open, the grinding slurry can flow to the titrator 500 for detection.

[0064] During the operation of the grinding slurry supply system, when the controller 300 controls the first slurry supply subsystem 100 to be in the slurry supply process, the controller titrator 500 detects the first liquid concentration data in the first slurry supply line 130 and sends the first liquid concentration data to the controller 300. The controller 300 receives the first liquid concentration data and determines whether it is within the allowable concentration range. If it exceeds the allowable concentration range, the slurry supply process is switched from the first slurry supply subsystem 100 to the second slurry supply subsystem 200. The allowable concentration range can be set according to business needs and is not limited here.

[0065] When the controller 300 controls the second liquid supply subsystem 200 to be in the liquid supply process, the controller titrator 500 detects the second liquid concentration data in the second liquid supply pipeline 230 and sends the second liquid concentration data to the controller 300. The controller 300 receives the second liquid concentration data and determines whether it is within the allowable concentration range. If it exceeds the allowable concentration range, the liquid supply process is switched from the second liquid supply subsystem 200 to the first liquid supply subsystem 100.

[0066] In the aforementioned polishing slurry supply system, the controller 300 can immediately stop the operation of the current slurry supply subsystem and automatically switch to another slurry supply subsystem when the concentration exceeds the allowable range. This effectively avoids polishing performance degradation or wafer damage caused by abnormal polishing slurry concentration (such as dilution, aging, or incorrect proportioning). This enables online closed-loop monitoring and emergency switching of polishing slurry quality without relying on manual sampling, significantly improving the stability of the CMP process, product yield, and system safety.

[0067] As another possible implementation, the grinding fluid supply system also includes a time monitoring device. The time monitoring device is used to detect a first duration during which the first fluid supply subsystem 100 is in the fluid supply process, or a second duration during which the second fluid supply subsystem 200 is in the fluid supply process.

[0068] The time monitoring device sends the first duration to the controller 300. The controller 300 receives the first duration and determines whether it exceeds the duration threshold. If the duration threshold is exceeded, the liquid supply process is switched from the first liquid supply subsystem 100 to the second liquid supply subsystem 200. The duration threshold can be set according to business needs (e.g., 48 hours), and is not restricted here.

[0069] The time monitoring device sends the second duration to the controller 300. The controller 300 receives the second duration and determines whether it exceeds the duration threshold. If the duration threshold is exceeded, the liquid supply process is switched from the second liquid supply subsystem 200 to the first liquid supply subsystem 100.

[0070] In the aforementioned grinding slurry supply system, a time monitoring device tracks the continuous supply time of each slurry supply subsystem in real time. If any slurry supply subsystem exceeds a preset safety time limit (e.g., 48 hours), a switching action is automatically triggered, stopping the current supply and activating another subsystem. This effectively prevents sedimentation, agglomeration, or chemical performance degradation of the grinding slurry due to prolonged retention.

[0071] It should be noted that both the titrator 500 and the time monitoring device are used to determine the timing of switching between the liquid supply subsystems. They can be used independently or in conjunction. When used simultaneously, the controller 300 makes a dual-criteria decision based on both concentration data and the duration of liquid supply. In this dual-criteria decision, the current liquid supply subsystem continues to operate only when the liquid concentration data is within the allowable concentration range and the duration does not exceed the duration threshold. If either condition is not met (i.e., abnormal concentration or time exceeding the limit), the switching process is immediately triggered, and the other liquid supply subsystem is activated. This dual-insurance mechanism avoids both "premature switching" (e.g., the new solution still performs well) and "lagging risks" (e.g., failure to respond promptly to sudden concentration changes) caused by relying solely on time. It also overcomes the timeliness degradation problem that may be overlooked when relying solely on concentration detection. This achieves more accurate, reliable, and forward-looking intelligent liquid supply management.

[0072] In one possible implementation, the first liquid supply subsystem 100 further includes a first liquid level measuring device. The first liquid level measuring device measures the liquid level in the first supply tank 110 and sends the first liquid level data to the controller 300. The controller 300 receives the first liquid level data and determines whether it is less than a liquid level threshold. If it is less than the liquid level threshold, the liquid supply process is switched from the first liquid supply subsystem 100 to the second liquid supply subsystem 200.

[0073] The second liquid supply subsystem 200 further includes a second liquid level measuring device. The second liquid level measuring device measures the liquid level in the second supply tank 210 and sends the second liquid level data to the controller 300. The controller 300 receives the second liquid level data and determines whether it is less than a liquid level threshold. If it is less than the liquid level threshold, the liquid supply process is switched from the second liquid supply subsystem 200 to the first liquid supply subsystem 100.

[0074] In the aforementioned grinding slurry supply system, a switching action can be triggered in advance when the liquid level in any supply subsystem falls below a preset threshold, smoothly transferring the supply task to another subsystem with sufficient liquid. This not only avoids the risks of pump dry running, air bubble intake, or supply interruption caused by emptying the supply tank, but also, in conjunction with time monitoring and concentration detection mechanisms, achieves intelligent scheduling throughout the entire process of "low liquid level warning - advance preparation - seamless switching," significantly improving the continuity of system liquid supply, equipment safety, and operational efficiency.

[0075] In one example, the first liquid level measuring device uses a first weighing sensor 510. The second liquid level measuring device uses a second weighing sensor 520. The first weighing sensor 510 is located below the first supply tank 110 and is used to measure the weight of the liquid stored in the first supply tank 110 in real time. The second weighing sensor 520 is located below the second supply tank 210 and is used to measure the weight of the liquid stored in the second supply tank 210 in real time. At this time, the first liquid level data, the second liquid level data, and the liquid level threshold are all represented by weight. The size of the liquid level threshold can be set according to business needs (e.g., set to 0.5 kg), and is not limited here. By using weighing sensors as liquid level measuring devices, the overall mass change of the supply tank can be directly monitored, thereby accurately reflecting the actual quantity of the grinding fluid. The measurement results are not affected by factors such as changes in liquid density, surface foam, liquid adhering to the tank wall, or temperature drift.

[0076] In another example, the first liquid level measuring device uses a first liquid level sensor 610. The second liquid level measuring device uses a second liquid level sensor 620. The first liquid level sensor 610 is disposed on the inner wall of the first supply tank 110 and is used to measure the liquid level stored in the first supply tank 110 in real time. The second liquid level sensor 620 is disposed on the inner wall of the second supply tank 210 and is used to measure the liquid level stored in the second supply tank 210 in real time. In this case, the first liquid level data, the second liquid level data, and the liquid level threshold are all represented by the liquid level. By using a liquid level sensor as the liquid level measuring device, it has the advantages of compact structure and fast response, and is suitable for space-constrained scenarios. For example, the first liquid level sensor 610 may include a high liquid level sensor 611, which can be used to measure the high liquid level threshold. For example, when supplying grinding fluid to the first supply tank 110, the first liquid level sensor 610 can be used to monitor whether the grinding fluid has reached the maximum liquid level. The first liquid level sensor 610 may also include a mixing demand sensor 612. When the mixing demand sensor 612 detects that the liquid level in the first supply tank 110 has reached the required mixing level, it can determine whether to start the second supply tank 210 based on the signal from the sensor. The first liquid level sensor 610 may also include a tank-switching sensor 613. When the tank-switching sensor 613 detects that the liquid level in the first supply tank 110 has reached the tank-switching level, it will switch to the second supply tank 210 to supply grinding fluid to the machine. Similarly, the second liquid level sensor 620 also includes a high liquid level sensor 621, a mixing demand sensor 622, and a tank-switching sensor 623. Its functions are the same as those of the corresponding sensors in the first liquid level sensor 610, and will not be described again here.

[0077] In one possible implementation, when switching the liquid supply process from the first liquid supply subsystem 100 to the second liquid supply subsystem 200, the second liquid supply subsystem 200 is controlled to perform the liquid supply process, while the first liquid supply subsystem 100 is controlled to stop the liquid supply process and perform a liquid supply preparation process. Conversely, when switching the liquid supply process from the second liquid supply subsystem 200 to the first liquid supply subsystem 100, the first liquid supply subsystem 100 is controlled to perform the liquid supply process, while the second liquid supply subsystem 200 is controlled to stop the liquid supply process and perform a liquid supply preparation process. Exemplarily, during the liquid supply preparation process, a purging process, a moisturizing process, a draining process, a mixing process, and a filling and recirculation process can be performed sequentially.

[0078] In one possible implementation, when the controller 300 controls the first liquid supply subsystem 100 to be in the liquid supply process, the controller 300 first controls the second liquid supply subsystem 200 to sequentially execute a purging process, a moisturizing process, a draining process, a mixing process, and a filling and reflux process. The purging process begins when the first liquid supply subsystem 100 switches to the liquid supply process, and the execution time of the purging process needs to be preset. After the purging process is completed, the moisturizing process is executed. The execution time of the moisturizing process also needs to be preset. During the moisturizing process, the first supply tank 110 is filled with deionized water for moisturizing and awaits the draining process execution command. The start time of the draining process is determined by the liquid level in the first supply tank 110. When the liquid level measured by the first liquid level measuring device is less than the second liquid level threshold (e.g., 5 kg, used to trigger the draining process), the controller 300 controls the second liquid supply subsystem 200 to start the draining process. The execution time of the draining process needs to be preset. After the draining process is completed, the mixing process is executed. During the mixing process, deionized water and grinding stock solution are stirred and mixed in the second supply tank 210 to obtain grinding slurry. The end time of the mixing process can be determined by the liquid level in the second supply tank 210. When the liquid level measured by the second liquid level measuring device is less than the third liquid level threshold, the controller 300 controls the second liquid supply subsystem 200 to stop the mixing process. After the mixing process stops, a filling and reflux process is performed.

[0079] As a further implementation, after the mixing process stops, a second drainage process (i.e., a second drainage process) can be performed to empty the deionized water inside the second supply pump 220. The execution time of this second drainage process also needs to be preset and is usually a short time to avoid draining the mixture from the second supply tank 210. After the second drainage process is completed, a filling and reflux process is performed. By adding a short second drainage process after the mixing process, the residual deionized water in the second supply pump and the pipeline before the pump can be accurately drained, preventing it from mixing into the subsequent supply process and causing local dilution or concentration fluctuations in the grinding slurry. Because the drainage process is time-controlled and only drains the liquid remaining in the pump chamber, it effectively prevents the prepared grinding slurry from being mistakenly drained. This ensures the accuracy and batch consistency of the grinding slurry composition and improves the reliability of preparation before system switchover.

[0080] In the description of this specification, the references to terms such as "one embodiment / mode," "some embodiments / modes," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment / mode or example is included in at least one embodiment / mode or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment / mode or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments / modes or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments / modes or examples described in this specification, as well as the features of different embodiments / modes or examples.

[0081] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0082] Those skilled in the art should understand that the above embodiments are merely for illustrating the present disclosure and are not intended to limit the scope of the disclosure. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present disclosure.

Claims

1. A grinding fluid supply system, characterized in that, include: Controller, first liquid supply subsystem, and second liquid supply subsystem; The first liquid supply subsystem includes: a first supply tank for mixing and storing the polishing slurry; a first supply pipeline for supplying the polishing slurry from the first supply tank to the chemical mechanical polishing equipment; a first supply pump; a first filter for filtering the polishing slurry; and a first valve. During the process of supplying polishing slurry to the chemical mechanical polishing equipment by the first liquid supply subsystem, the polishing slurry is supplied from the first supply tank, via the first supply pipeline, and through the first supply pump, the first filter, and the first valve to the chemical mechanical polishing equipment. The second liquid supply subsystem includes: a second supply tank for mixing and storing the polishing slurry; a second supply pipeline for supplying the polishing slurry from the second supply tank to the chemical mechanical polishing equipment; a second supply pump; a second filter for filtering the polishing slurry; and a second valve. During the process of the second liquid supply subsystem supplying polishing slurry to the chemical mechanical polishing equipment, the polishing slurry is supplied from the second supply tank, via the second supply pipeline, and through the second supply pump, the second filter, and the second valve to the chemical mechanical polishing equipment. The first liquid supply subsystem further includes: a third valve, located downstream of the first filter, and located in a pipeline different from the pipeline where the first valve is located. When the third valve is open, the grinding fluid can flow from the first supply tank through the first supply pump, the first filter, and the third valve, and then back to the first supply tank, thereby realizing the filling and return process of the first liquid supply subsystem. The second liquid supply subsystem further includes a fourth valve, located downstream of the second filter, and located in a pipeline different from the pipeline where the second valve is located. When the fourth valve is open, the grinding fluid can flow from the second supply tank through the second supply pump, the second filter, and the fourth valve, and then back to the second supply tank, thereby realizing the filling and return process of the second liquid supply subsystem. When the controller controls the first liquid supply subsystem to be in the liquid supply process, if it is necessary to switch to the second liquid supply subsystem for liquid supply, the controller controls the second liquid supply subsystem to perform a filling and reflux process in advance, so that the polishing slurry fills the liquid supply pipeline of the second liquid supply subsystem, and ensures that the polishing slurry can be continuously supplied from the second liquid supply subsystem to the chemical mechanical polishing equipment after the switch.

2. The grinding slurry supply system as described in claim 1, characterized in that, The first liquid supply subsystem further includes: a fifth valve located upstream of the first liquid supply pipeline; and a sixth valve located between the first liquid supply pump and the first filter. During the purging process of the first liquid supply subsystem, the third, fifth, and sixth valves are opened and the first valve is closed. Purging gas enters the first liquid supply pipeline via the fifth valve and blows the old liquid in the first liquid supply pipeline to the first supply tank via the third valve. The old liquid is then discharged via the first liquid supply pump and the sixth valve. The second liquid supply subsystem further includes: a seventh valve, located upstream of the second liquid supply pipeline; and an eighth valve, located between the second liquid supply pump and the second filter. During the purging process of the second liquid supply subsystem, the fourth, seventh, and eighth valves are opened, and the second valve is closed. Purging gas enters the second liquid supply pipeline via the seventh valve and blows the old liquid in the second liquid supply pipeline to the second supply tank via the fourth valve. The old liquid is then discharged via the second liquid supply pump and the eighth valve. When the controller controls the first liquid supply subsystem to be in the liquid supply process, the controller can also control the second liquid supply subsystem to be in the purging process.

3. The grinding slurry supply system as described in claim 1, characterized in that, The first liquid supply subsystem further includes: a first deionized water supply pipeline for supplying deionized water to the first supply tank. When the first liquid supply subsystem is in a humidification process, deionized water is supplied to the first supply tank via the first deionized water supply pipeline to humidify the first supply tank. The second liquid supply subsystem further includes: a second deionized water supply pipeline for supplying deionized water to the second supply tank. During the humidification process of the second liquid supply subsystem, deionized water is supplied to the second supply tank via the second deionized water supply pipeline to humidify the second supply tank. When the controller controls the first liquid supply subsystem to be in the liquid supply process, the controller can also control the second liquid supply subsystem to be in the moisturizing process.

4. The grinding slurry supply system as described in claim 2, characterized in that, The first liquid supply subsystem further includes a ninth valve, disposed between the sixth valve and the first filter. When the first liquid supply subsystem is in the draining process, the sixth valve opens and the ninth valve closes, and the liquid in the first supply tank is discharged via the first supply pump and the sixth valve. The second liquid supply subsystem further includes a tenth valve, disposed between the eighth valve and the second filter. When the second liquid supply subsystem is in the draining process, the eighth valve opens and the tenth valve closes, and the liquid in the second supply tank is discharged via the second liquid supply pump and the eighth valve. When the controller controls the first liquid supply subsystem to be in the liquid supply process, the controller can also control the second liquid supply subsystem to be in the liquid discharge process.

5. The grinding slurry supply system as described in claim 1, characterized in that, The first liquid supply subsystem further includes: a first deionized water supply pipeline for supplying deionized water to the first supply tank; and a first grinding solution supply pipeline for supplying grinding solution to the first supply tank. During the mixing process of the first liquid supply subsystem, deionized water is supplied to the first supply tank via the first deionized water supply pipeline, and grinding solution is supplied to the first supply tank via the first grinding solution supply pipeline. The first supply tank mixes the deionized water and the grinding solution to obtain the grinding fluid. The second liquid supply subsystem further includes: a second deionized water supply pipeline for supplying deionized water to the second supply tank; and a second grinding solution supply pipeline for supplying grinding solution to the second supply tank. During the mixing process of the second liquid supply subsystem, deionized water is supplied to the second supply tank via the second deionized water supply pipeline, and grinding solution is supplied to the second supply tank via the second grinding solution supply pipeline. The second supply tank mixes the deionized water and the grinding solution to obtain the grinding fluid. When the controller controls the first liquid supply subsystem to be in the liquid supply process, the controller can also control the second liquid supply subsystem to be in the mixing process.

6. The polishing slurry supply system as described in claim 1, characterized in that, The first liquid supply subsystem further includes: a first venting pipe for discharging grinding fluid containing air bubbles from the first liquid supply pipe; an eleventh valve located upstream of the first venting pipe; and a first bubble detection device located downstream of the first filter. When the first liquid supply subsystem is in the venting process, the eleventh valve opens, and the grinding fluid containing air bubbles is discharged through the first venting pipe and the eleventh valve. The first bubble detection device is used to detect whether air bubbles exist in the first liquid supply pipe, and if air bubbles are detected, it sends a first venting reminder signal to the controller. The controller, in response to the first venting reminder signal, controls the first liquid supply subsystem to enter the venting process. The second liquid supply subsystem further includes: a second venting pipe for discharging the grinding fluid containing air bubbles from the second liquid supply pipe; a twelfth valve located upstream of the second venting pipe; and a second bubble detection device located downstream of the second filter. When the second liquid supply subsystem is in the venting process, the twelfth valve opens, and the grinding fluid containing air bubbles is discharged through the second venting pipe and the twelfth valve. The second bubble detection device is used to detect whether air bubbles exist in the second liquid supply pipe, and if air bubbles are detected, it sends a second venting reminder signal to the controller. The controller responds to the second venting reminder signal and controls the second liquid supply subsystem to be in the venting process.

7. The grinding slurry supply system as described in claim 1, characterized in that, It also includes a titrator for detecting the liquid concentration data in the first or second liquid supply line. Specifically, when the controller controls the first liquid supply subsystem to be in the liquid supply process, it controls the titrator to detect the first liquid concentration data in the first liquid supply pipeline and sends the first liquid concentration data to the controller. The controller receives the first liquid concentration data and determines whether it is within the allowable concentration range. If it exceeds the allowable concentration range, the liquid supply process is switched from the first liquid supply subsystem to the second liquid supply subsystem. When the controller controls the second liquid supply subsystem to be in the liquid supply process, it controls the titrator to detect the second liquid concentration data in the second liquid supply pipeline and sends the second liquid concentration data to the controller. The controller receives the second liquid concentration data and determines whether it is within the allowable concentration range. If it exceeds the allowable concentration range, the liquid supply process is switched from the second liquid supply subsystem to the first liquid supply subsystem.

8. The polishing slurry supply system as described in claim 1, characterized in that, It also includes a time monitoring device for detecting a first duration during which the first liquid supply subsystem is in the liquid supply process, or a second duration during which the second liquid supply subsystem is in the liquid supply process. The time monitoring device sends the first duration to the controller. The controller receives the first duration and determines whether it exceeds a duration threshold. If the duration threshold is exceeded, the liquid supply process is switched from the first liquid supply subsystem to the second liquid supply subsystem. The time monitoring device sends the second duration to the controller. The controller receives the second duration and determines whether it exceeds the duration threshold. If the duration threshold is exceeded, the liquid supply process is switched from the second liquid supply subsystem to the first liquid supply subsystem.

9. The polishing slurry supply system as described in claim 1, characterized in that, The first liquid supply subsystem further includes: a first liquid level measuring device, used to measure the first liquid level data in the first supply tank and send the first liquid level data to the controller. The controller receives the first liquid level data and determines whether it is less than a liquid level threshold. If it is less than the liquid level threshold, the liquid supply process is switched from the first liquid supply subsystem to the second liquid supply subsystem. The second liquid supply subsystem further includes: a second liquid level measuring device, used to measure the second liquid level data in the second supply tank and send the second liquid level data to the controller. The controller receives the second liquid level data and determines whether it is less than the liquid level threshold. If it is less than the liquid level threshold, the liquid supply process is switched from the second liquid supply subsystem to the first liquid supply subsystem.

10. The grinding slurry supply system as described in claim 9, characterized in that, in, The first liquid level measuring device and the second liquid level measuring device employ a weighing sensor and / or a liquid level sensor.

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