An integrated heat spreader and method of processing the same

By designing an integrated heat sink and employing a layered layout of liquid inlet structure, intermediate partition, and liquid return structure, the problem of uneven cooling fluid distribution in split-type heat sinks is solved, achieving uniform distribution and stable return of cooling fluid, thereby improving the server's heat dissipation efficiency and the long-term stability of the equipment.

CN121560139BActive Publication Date: 2026-07-14HEBEI GUANTAI ELECTRONICS TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HEBEI GUANTAI ELECTRONICS TECH
Filing Date
2025-11-21
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

The uneven distribution of cooling fluid and the flow competition effect of existing liquid-distributed heat sinks result in uneven distribution of cooling fluid in the server, which cannot effectively ensure stable heat dissipation of server components.

Method used

An integrated radiator is designed, which adopts a bottom-up stacked liquid inlet structure, intermediate partition layer and liquid return structure. Through the symmetrical layout of the diversion channel and the liquid return channel, combined with the connection of the brazing layer, an integrated structure is formed to ensure uniform distribution and stable return of cooling fluid.

Benefits of technology

It achieves uniform distribution of cooling fluid in the server, reduces flow resistance differences, improves heat dissipation efficiency, reduces space occupation, and adapts to high-flow cooling requirements, ensuring the long-term stability and heat dissipation effect of the equipment.

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Abstract

The application discloses an integrated heat sink and a processing method thereof, and relates to the technical field of heat dissipation. The heat sink comprises a liquid inlet structure, an intermediate separation layer and a liquid return structure which are sequentially stacked from bottom to top and are connected with each other. The intermediate separation layer is used for isolating the liquid inlet structure and the liquid return structure. The liquid inlet structure is provided with a liquid inlet and a liquid inlet storage cavity which is communicated with the liquid inlet. The liquid inlet storage cavity is connected with a plurality of shunt flow channels. The shunt flow channels are used for conveying cooling fluid in the liquid inlet storage cavity to both sides of the integrated heat sink. The liquid return structure is provided with liquid return flow channels which are equal in number to the shunt flow channels. The shunt flow channels and the liquid return flow channels are respectively communicated with an external heat dissipation loop. The free ends of the liquid return flow channels are communicated with a liquid return storage cavity. The liquid return storage cavity is used for storing the cooling fluid conveyed by the liquid return flow channels. The shunt uniformity is improved, and the stable distribution of the cooling fluid is guaranteed.
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