Glass assembly and method of manufacturing the same, vehicle

Abstract

The application provides a glass assembly, a preparation method thereof and a vehicle. The glass assembly comprises a glass body and a transparent heating film. The glass body has an information collection window. The transparent heating film covers at least part of the information collection window. The transparent heating film comprises a conductive mesh layer. The conductive mesh layer has a plurality of holes arranged in a non-periodic manner. The glass assembly, the preparation method thereof and the vehicle provided by the application are beneficial to the combination of the sensor function and the defrosting and defogging function.

Description

Technical Field

[0001] This application relates to the field of vehicle technology, specifically to a transparent glass component, its preparation method, and a vehicle. Background Technology

[0002] With the development of vehicle technology, the visual perception accuracy of systems such as autonomous driving is receiving increasing attention. Therefore, the defrosting and defogging of the information acquisition windows on vehicle windows needs further optimization. In related technologies, vehicle windows utilize heating methods such as silver paste, enameled wire, and tungsten filament to achieve defrosting and defogging of the information acquisition windows. However, when silver paste, enameled wire, and tungsten filament are placed on the information acquisition window, they can easily obstruct the view and affect the information acquisition function. Conversely, when these materials are placed around the information acquisition window, the defrosting and defogging function decreases. Summary of the Invention

[0003] This application provides a glass component that combines information acquisition and glass defrosting / defogging functions, its manufacturing method, and a vehicle.

[0004] In a first aspect, this application provides a glass assembly, including a glass body and a transparent heating film, wherein the glass body has an information acquisition window and the transparent heating film covers at least a portion of the information acquisition window;

[0005] The transparent heating includes a conductive mesh layer having a plurality of holes arranged in a non-periodic pattern.

[0006] In one possible implementation, the conductive mesh layer includes a first sub-conductive mesh layer, a second sub-conductive mesh layer, and a third sub-conductive mesh layer stacked sequentially, wherein the refractive index of the first sub-conductive mesh layer is different from that of the second sub-conductive mesh layer, and the refractive index of the third sub-conductive mesh layer is different from that of the second sub-conductive mesh layer.

[0007] In one possible implementation, the glass assembly further includes a substrate, through which the transparent heating film is supported on the glass body.

[0008] In one possible implementation, the glass assembly further includes a first busbar and a second busbar, wherein the first busbar, the transparent heating film, and the second busbar are connected in series.

[0009] Under low voltage power, the first busbar and the second busbar are arranged along the height direction of the information acquisition window, and the first busbar and the second busbar have a first loop length along the height direction of the information acquisition window, the first loop length being less than the bottom edge length of the information acquisition window;

[0010] Under high voltage, the first busbar and the second busbar are arranged along the side length of the information acquisition window, and the first busbar and the second busbar have a second loop length along the side length of the information acquisition window, the second loop length being greater than the bottom edge length of the information acquisition window.

[0011] In one possible implementation, under low voltage energization, the surface resistance of the transparent heating film is in the range of 0.5Ω / sq to 20Ω / sq; or, under high voltage energization, the surface resistance of the transparent heating film is in the range of 10Ω / sq to 40Ω / sq.

[0012] In one possible implementation, the second loop length includes a first sub-loop length and a second sub-loop length, the first sub-loop length being the minimum loop length of the second loop length, and the second sub-loop length being the maximum loop length of the second loop length. The bottom edge of the information acquisition window includes a first bottom edge and a second bottom edge, the length of the second bottom edge being greater than the length of the first bottom edge, and the difference between the second sub-loop length and the first sub-loop length being less than or equal to the difference between the length of the second bottom edge and the length of the first bottom edge.

[0013] In one possible implementation, the glass assembly further includes a shielding layer disposed around the information acquisition window, the shielding layer covering at least a portion of the first busbar and / or at least a portion of the second busbar.

[0014] In one possible implementation, the glass body includes an outer glass plate, an intermediate connecting layer, and an inner glass plate stacked sequentially, the intermediate connecting layer connecting the outer glass plate and the inner glass plate, and the transparent heating film disposed between the outer glass plate and the inner glass plate.

[0015] In one possible implementation, the material of the first sub-conductive mesh layer includes elemental platinum, gold, chromium, nickel, copper, titanium, or alloys, or oxides; and / or, the material of the second sub-conductive mesh layer includes elemental silver, or alloys; and / or, the material of the third sub-conductive mesh layer includes elemental platinum, gold, chromium, nickel, copper, titanium, or alloys, or oxides.

[0016] In one possible implementation, the transparent heating film further includes a transparent conductive layer disposed on the side of the third sub-conductive mesh layer opposite to the first sub-conductive mesh layer; the material of the transparent conductive layer includes one or more of indium tin oxide, aluminum-doped zinc oxide, and tin-doped zinc oxide; and / or, the refractive index of the transparent conductive layer is different from the refractive index of the third sub-conductive mesh layer; and / or, the transparent conductive layer fills at least a portion of the holes.

[0017] In one possible implementation, the transparent heating film further includes a transparent optical layer disposed on the side of the first sub-conductive mesh layer opposite to the third sub-conductive mesh layer; the material of the transparent optical layer includes one or more of oxides, fluorides, silicon nitrides, and zinc sulfides; and / or, the refractive index of the transparent optical layer is different from the refractive index of the first sub-conductive mesh layer; and / or, the adhesion of the transparent optical layer is greater than the adhesion of the first sub-conductive mesh layer.

[0018] In one possible implementation, the transparent heating film further includes a transparent connecting layer disposed between the transparent optical layer and the first sub-conductive mesh layer; the material of the transparent connecting layer includes one or more of zinc oxide, aluminum-doped zinc oxide, tin-doped zinc oxide, gallium-doped zinc oxide, indium-doped zinc oxide, and indium-gallium-doped zinc oxide; and / or, the refractive index of the transparent connecting layer is different from the refractive index of the transparent optical layer; and / or, the adhesion of the transparent connecting layer is greater than the adhesion of the transparent optical layer.

[0019] In one possible implementation, the visible light transmittance of the transparent heating film is greater than or equal to 85%; and / or, the sheet resistance of the transparent heating film is less than or equal to 40 Ω / sq; and / or, the transparent heating film is used to make the target halo less than or equal to 60%; and / or, the haze value of the transparent heating film is less than or equal to 2%.

[0020] In one possible implementation, the thickness of the transparent heating film is less than or equal to 200 nm; and / or, the pore size is in the range of 100 nm to 600 nm; and / or, the pore density is in the range of 20% to 60%; and / or, the surface roughness of the transparent heating film is less than or equal to 5 nm; and / or, the haze value of the transparent heating film is less than or equal to 2%.

[0021] In one possible implementation, the thickness of the second sub-conductive mesh layer is in the range of 5 nm to 50 nm.

[0022] Secondly, this application also provides a method for preparing a glass assembly, comprising:

[0023] A glass body is provided, and the glass body has an information acquisition window;

[0024] A transparent heating film is provided, wherein the transparent heating film includes a conductive mesh layer having a plurality of holes arranged in a non-periodic manner;

[0025] The information acquisition window is at least partially covered by a transparent heating film to form the glass assembly.

[0026] In one possible implementation, the following is included before providing the transparent heating film:

[0027] A mask plate with microspheres arranged in a non-periodic pattern is provided;

[0028] A magnetron sputtering process is used to deposit a film on the mask to sequentially obtain the first sub-conductive mesh layer, the second sub-conductive mesh layer, and the third sub-conductive mesh layer;

[0029] Remove the mask.

[0030] In one possible implementation, after removing the mask, the process further includes:

[0031] A transparent conductive layer is deposited on the surface of the third sub-conductive mesh layer on the side opposite to the second sub-conductive mesh layer; and / or, prior to providing the mask having microspheres arranged in a non-periodic pattern, a transparent optical layer is deposited; and / or a transparent bonding layer is deposited.

[0032] Fourthly, this application also provides a vehicle, including a body assembly, sensors, and the glass assembly described in the first aspect, wherein the glass assembly is connected to the body assembly.

[0033] The glass assembly provided in this application includes a glass body and a transparent heating film. The glass body has an information acquisition window, and the transparent heating film covers at least a portion of the information acquisition window. The transparent heating film includes a conductive mesh layer with multiple holes arranged in a non-periodic manner. The multiple holes arranged in a non-periodic manner can disrupt the phase consistency of light waves, thereby suppressing diffraction halos and reducing interference with information acquisition. Furthermore, the multiple holes arranged in a non-periodic manner also increase the difference between the spacing of the conductive mesh layer and the pixel spacing of sensors such as cameras, which can reduce the situation where the two superimpose to produce interference fringes, further reducing interference with information acquisition. Attached Figure Description

[0034] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below.

[0035] Figure 1 A front structural schematic diagram of a glass assembly provided for an embodiment of this application;

[0036] Figure 2 Another front view of the glass assembly provided in an embodiment of this application;

[0037] Figure 3 A front view of a transparent heating film in a glass assembly provided in an embodiment of this application;

[0038] Figure 4A side view of the transparent heating film provided in the embodiments of this application;

[0039] Figure 5 An enlarged schematic diagram of the information acquisition window in the glass assembly provided for the embodiments of this application;

[0040] Figure 6 A side view of a glass assembly provided for an embodiment of this application;

[0041] Figure 7 Another side view of the glass assembly provided in the embodiments of this application;

[0042] Figure 8 for Figure 4 The diagram shown is a side view of the transparent heating film when it also includes a transparent conductive layer.

[0043] Figure 9 for Figure 8 The diagram shown is a side view of the transparent heating film when it also includes a transparent optical layer.

[0044] Figure 10 for Figure 9 The diagram shows the side structure of the transparent heating film when it also includes a transparent connecting layer;

[0045] Figure 11 A schematic diagram showing the halo produced when a transparent heating film is applied to a glass assembly;

[0046] Figure 12 A schematic flowchart illustrating the method for preparing a glass assembly according to an embodiment of this application;

[0047] Figure 13 for Figure 12 The process diagram shown is a flowchart of the method for preparing the transparent heating film, including steps S10, S20 and S30.

[0048] Figure 14 for Figure 13 The method for preparing the transparent heating film shown includes a flowchart of step S40.

[0049] Figure 15 for Figure 13 The process diagram shown is a flowchart of the method for preparing the transparent heating film, including steps S50 and S60.

[0050] Explanation of reference numerals in the attached figures:

[0051] Transparent heating film 100; conductive mesh layer 10; first sub-conductive mesh layer 101; second sub-conductive mesh layer 102; third sub-conductive mesh layer 103; hole 104; transparent conductive layer 20; transparent optical layer 30; transparent connecting layer 40; glass assembly 200; glass body 201; information acquisition window 210; first busbar 501; second busbar 502; shielding layer 60; outer glass plate 211; intermediate connecting layer 212; inner glass plate 213; Detailed Implementation

[0052] The technical solutions provided in this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the embodiments described in this application are only a portion of the embodiments, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments described in this application without creative effort are within the protection scope of this application.

[0053] In this application, the terms "implementation" and "example" mean that a particular feature, structure, or characteristic described may be included in at least one implementation of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same implementation, nor is it a mutually exclusive, independent, or alternative implementation. Those skilled in the art will explicitly and implicitly understand that the implementations described in this application can be combined with other implementations.

[0054] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish different objects, not to describe a particular order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, an assembly or device that includes one or more components is not limited to the one or more components listed, but may optionally also include one or more components not listed but inherent to the exemplified product, or one or more components that it should have based on the described function.

[0055] In related technologies, metal mesh heating films are typically composed of extremely fine metal wires arranged in a regular grid pattern (e.g., parallel lines or a checkered pattern). This structure is similar to a "grating" in optics. When light from the headlights of an oncoming vehicle (or any high-brightness light source) passes through the metal mesh, the periodic structure of the mesh interferes with the spatial frequency of the pixel array in the camera sensor (e.g., the Bayer filter arrangement of a CMOS or CCD). The pixel array of the camera itself is also regularly arranged (e.g., the periodic distribution of RGB pixels). When the spacing of the metal mesh is close to or an integer multiple of the pixel spacing of the camera, the two superimpose to produce low-frequency wavy interference fringes, i.e., Murray fringes. Murray interference can severely interfere with the camera's image resolution, resulting in false fringes or wavy patterns in the image, affecting target detection (e.g., the recognition of oncoming vehicles, pedestrians, or traffic signs).

[0056] The silver nanowire heating film consists of randomly distributed nanoscale silver wires forming a conductive network within a transparent substrate. Unlike metal mesh, the arrangement of the silver nanowires is disordered, thus avoiding periodic interference. However, when strong light (such as oncoming headlights) shines on the silver nanowire film, the light is scattered and diffracted on the surface of the silver wires. Due to the extremely small diameter of the silver nanowires (typically tens of nanometers), close to the wavelength of visible light (400-700 nm), this induces significant Mie scattering. The scattered light forms a diffused halo or glare around the light source during camera imaging. Furthermore, the conductivity of the silver nanowires may cause polarization interference in some light rays, further exacerbating the halo phenomenon. The halo reduces the contrast of the camera image, resulting in loss of detail in dark areas, while glare around strong light can obscure key objects (such as the outline of oncoming vehicles or traffic lights).

[0057] Therefore, this application provides a transparent heating film with "surface" contact, which can reduce Murray stripes and Mie scattering phenomena compared to heating films with "line-to-line intersection" or "point contact" of metal mesh or silver nanowires, thereby facilitating high-precision information acquisition.

[0058] Please refer to Figures 1 to 3 , Figure 1 A front view of the glass assembly 200 provided in this application embodiment is shown in the schematic diagram. Figure 2 This is a schematic diagram of another front structure of the glass assembly 200 provided in an embodiment of this application. Figure 3This is a front view of a transparent heating film 100 in a glass assembly 200 provided in this application embodiment. The glass assembly 200 includes a glass body 201 and a transparent heating film 100. The glass body 201 has an information acquisition window 210, and the transparent heating film 100 covers at least a portion of the information acquisition window 210. The transparent heating film 100 includes a conductive mesh layer 10. The conductive mesh layer 10 has a plurality of holes 104 arranged non-periodically.

[0059] When classified by the mechanical properties of the glass, the glass body 201 can be tempered glass or ordinary glass; when classified by the number of layers, the glass body 201 can be single-layer glass, laminated glass, or multi-layer glass. When classified by the optical properties of the glass, the glass body 201 can be high-transparency glass, medium-transparency glass, low-transparency glass, fully transparent glass, or semi-transparent glass.

[0060] The information acquisition window 210 corresponds to the sensor's field of view on the glass body 201, meaning the sensor acquires information through the information acquisition window 210. Sensors include, but are not limited to, cameras for Advanced Driving Assistance Systems (ADAS) or LiDAR, etc. This application does not impose specific limitations on the size, shape, or number of information acquisition windows 210 on the glass body 201.

[0061] The transparent heating film 100 is used to defrost and defog the information acquisition window 210. In one possible embodiment, the transparent heating film 100 can cover the entire information acquisition window 210. In another possible embodiment, the transparent heating film 100 can cover a portion of the information acquisition window 210. Since the transparent heating film 100 covers at least a portion of the information acquisition window 210, it can directly heat the information acquisition window 210, thus ensuring the defrosting and defogging function of the information acquisition window 210. Furthermore, the transparent heating film 100 has high transparency, thus minimizing its impact on the sensor's information acquisition.

[0062] The multiple holes 104 arranged non-periodically may be holes 104 of different shapes in the conductive mesh layer 10, and / or holes 104 of different sizes in the conductive mesh layer 10, and / or the spacing between the holes 104 in the conductive mesh layer 10 is uneven.

[0063] Because the pixel arrays of sensors such as cameras are arranged periodically, when the spacing of the holes 104 in the conductive mesh layer 10 is close to or an integer multiple of the pixel spacing of the camera, the superposition of the two will produce low-frequency wavy interference fringes, i.e., Murray fringes. Murray fringes can severely interfere with the camera's image resolution, resulting in false lines or ripples in the captured image, affecting the vehicle's visual perception, detection, and recognition. In other words, the conductive mesh layer 10, with its multiple holes 104 arranged non-periodically, can reduce Murray fringes, decrease interference with camera imaging, and improve the accuracy of the vehicle's visual perception, detection, and recognition.

[0064] The glass assembly 200 provided in this application includes a glass body 201 and a transparent heating film 100. The glass body 201 has an information acquisition window 210, and the transparent heating film 100 covers at least a portion of the information acquisition window 210. The transparent heating film 100 includes a conductive mesh layer 10, which has a plurality of holes 104 arranged in a non-periodic manner. The plurality of holes 104 arranged in a non-periodic manner can disrupt the phase consistency of light waves, thereby suppressing diffraction halos and reducing interference with sensor functions. Furthermore, the plurality of holes 104 arranged in a non-periodic manner also increases the difference between the spacing of the conductive mesh layer 10 and the pixel spacing of the visual sensor, which can reduce the situation where the two superimpose to produce interference fringes, further reducing interference with sensor functions.

[0065] like Figure 4 As shown, Figure 4 This is a side view of a transparent heating film 100 provided in an embodiment of this application. In one possible embodiment, the conductive mesh layer 10 includes a first sub-conductive mesh layer 101, a second sub-conductive mesh layer 102, and a third sub-conductive mesh layer 103 stacked sequentially. The refractive index of the first sub-conductive mesh layer 101 is different from that of the second sub-conductive mesh layer 102. The refractive index of the third sub-conductive mesh layer 103 is different from that of the second sub-conductive mesh layer 102.

[0066] Understandably, the second sub-conductive mesh layer 102 is located between the first sub-conductive mesh layer 101 and the third sub-conductive mesh layer 103. All three sub-conductive mesh layers 101, 102, and 103 are conductive. The conductive mesh layer 10, as the core conductive layer of the transparent heating film 100, generates the main heating effect when defrosting and defogging the information acquisition window. In one possible embodiment, the second sub-conductive mesh layer 102, as the core conductive layer of the conductive mesh layer 10, generates the main heating effect when defrosting and defogging the information acquisition window. In this embodiment, the conductivity of the second sub-conductive mesh layer 102 may be superior to that of the first sub-conductive mesh layer 101, and also superior to that of the third sub-conductive mesh layer 103. The conductivity of the first sub-conductive mesh layer 101 and the third sub-conductive mesh layer 103 may be the same or different. Optionally, the material of the first sub-conductive mesh layer 101 includes a metal material or an alloy material; the material of the second sub-conductive mesh layer 102 includes a metal material or an alloy material; and the material of the third sub-conductive mesh layer 103 includes a metal material or an alloy material.

[0067] The refractive index of the first sub-conductive mesh layer 101 differs from that of the second sub-conductive mesh layer 102, which can be either a greater refractive index than that of the second sub-conductive mesh layer 102, or a lesser refractive index than that of the second sub-conductive mesh layer 102. Similarly, the refractive index of the third sub-conductive mesh layer 103 differs from that of the second sub-conductive mesh layer 102, which can be either a greater refractive index than that of the second sub-conductive mesh layer 102, or a lesser refractive index than that of the second sub-conductive mesh layer 102. The refractive index of the third sub-conductive mesh layer 103 can be the same as or different from that of the first sub-conductive mesh layer 101.

[0068] In one possible embodiment, the refractive index of the first sub-conductive mesh layer 101 and the refractive index of the third sub-conductive mesh layer 103 can be the same, and the refractive index of the second sub-conductive mesh layer 102 can be slightly less than the refractive index of the first sub-conductive mesh layer 101. In another possible embodiment, the refractive indices of the first sub-conductive mesh layer 101, the second sub-conductive mesh layer 102, and the third sub-conductive mesh layer 103 can increase sequentially. In yet another possible embodiment, the refractive indices of the first sub-conductive mesh layer 101, the second sub-conductive mesh layer 102, and the third sub-conductive mesh layer 103 can decrease sequentially. In still other possible embodiments, the refractive index of the first sub-conductive mesh layer 101 and the third sub-conductive mesh layer 103 can be the same, and the refractive index of the second sub-conductive mesh layer 102 can be slightly greater than the refractive index of the first sub-conductive mesh layer 101.

[0069] In one possible embodiment, the first sub-conductive mesh layer 101 includes a first conductive body and a plurality of first sub-holes penetrating the first conductive body. The second sub-conductive mesh layer 102 includes a second conductive body and a plurality of second sub-holes penetrating the second conductive body. The third sub-conductive mesh layer 103 includes a third conductive body and a plurality of third sub-holes penetrating the third conductive body. The first, second, and third sub-holes form the plurality of holes 104. Optionally, the plurality of first sub-holes may be arranged aperiodically, and / or, the plurality of second sub-holes may be arranged aperiodically, and / or, the plurality of third sub-holes may be arranged aperiodically. The first, second, and third sub-holes can ensure good light transmittance of the conductive mesh layer 10.

[0070] The first, second, and third sub-holes at the same thickness position in the conductive mesh layer 10 can be completely or partially connected. The sizes of the first, second, and third sub-holes at the same thickness position in the conductive mesh layer 10 can be the same or similar. The shapes of the first, second, and third sub-holes at the same thickness position in the conductive mesh layer 10 can be the same or similar.

[0071] Optionally, the first sub-conductive mesh layer 101, the second sub-conductive mesh layer 102, and the third sub-conductive mesh layer 103 can all be nanoscale mesh layers. Understandably, the conductive wire diameters of the first sub-conductive mesh layer 101, the second sub-conductive mesh layer 102, and the third sub-conductive mesh layer 103 all reach the nanoscale. Nanoscale mesh layers have high light transmittance, allowing light to pass through easily without being blocked or scattered.

[0072] By making the conductive mesh layer 10 include a first sub-conductive mesh layer 101, a second sub-conductive mesh layer 102, and a third sub-conductive mesh layer 103 stacked sequentially, the refractive index of the first sub-conductive mesh layer 101 is different from that of the second sub-conductive mesh layer 102, and the refractive index of the third sub-conductive mesh layer 103 is different from that of the second sub-conductive mesh layer 102. This can reduce the scattering of light in the conductive mesh layer 10, reduce the loss of transparency caused by heat dissipation. When applied to glass components, it is beneficial to arrange the transparent heating film 100 in the information acquisition window, ensure the defrosting and defogging function of the information acquisition window, and reduce the scattering of light in the conductive mesh layer 10. It can also reduce the halo or glare caused by scattering and reduce the interference with the sensor function.

[0073] In one possible implementation, the glass assembly 200 further includes a substrate, through which the transparent heating film 100 is supported on the glass body 201.

[0074] The substrate can be a rigid substrate or a flexible substrate. When the substrate is rigid, it includes, but is not limited to, a glass substrate. When the substrate is flexible, the material includes, but is not limited to, PET and PC. The thickness of the substrate can be in the range of 0.05mm to 1.2mm. The visible light transmittance of the substrate can be greater than or equal to 90%. The temperature resistance of the substrate can be in the range of -40℃ to 120℃. The substrate is used to support the transparent heating film 100 and can improve the impact resistance of the glass assembly 200.

[0075] Of course, in other possible embodiments, part of the glass body 201 can be directly used as a substrate, that is, the transparent heating film 100 can be directly formed on the surface of the glass body 201.

[0076] Please refer to Figure 1 and Figure 2In one possible implementation, the glass assembly 200 further includes a first busbar 501 and a second busbar 502, wherein the first busbar 501, the transparent heating film 100, and the second busbar 502 are connected in series. Under low-voltage energization, the first busbar 501 and the second busbar 502 are arranged along the height direction of the information acquisition window 210, and there is a first loop length between them along the height direction of the information acquisition window 210, the first loop length being less than the bottom edge length of the information acquisition window 210. Under high-voltage energization, the first busbar 501 and the second busbar 502 are arranged along the side length direction of the information acquisition window 210, and there is a second loop length between them along the side length direction of the information acquisition window 210, the second loop length being greater than the bottom edge length of the information acquisition window 210.

[0077] In this configuration, one end of the first busbar 501 is electrically connected to the transparent heating film 100, and the other end is used to electrically connect to the positive terminal of an external power supply. One end of the second busbar 502 is electrically connected to the transparent heating film 100, and the other end is used to electrically connect to the negative terminal of an external power supply. In one possible embodiment, the voltage applied under low-voltage conditions can be in the range of 12V to 16V, and the voltage applied under high-voltage conditions can be in the range of 36V to 48V. The loop length can be understood as the distance spanning the transparent heating film 100 between the first busbar 501 and the second busbar 502.

[0078] In one possible embodiment, the information acquisition window 210 is approximately trapezoidal in shape. The height direction of the information acquisition window 210 is the direction in which the upper and lower base edges of the information acquisition window 210 face each other. The side length direction of the information acquisition window 210 is the extension direction of either the upper or lower base edge. The length of the first loop can be referenced to c1 in the attached drawing, the length of the second loop can be referenced to c2 in the attached drawing, the length of the upper base edge of the information acquisition window 210 can be referenced to a in the attached drawing, and the length of the lower base edge of the information acquisition window 210 can be referenced to b in the attached drawing. It is understood that c1 is less than b, and c2 is greater than a. Preferably, c1 is less than a, and c2 is greater than b.

[0079] Of course, in other possible embodiments, when the shape of the information acquisition window 210 is approximately square, the length of the first loop can be equal to the side length of the information acquisition window 210, i.e., a=b=c1, and the length of the second loop can be equal to the side length of the information acquisition window 210, i.e., a=b=c2.

[0080] Under low-voltage power, by making the length of the first circuit shorter than the bottom edge length of the information acquisition window 210, the circuit length between the first busbar 501 and the second busbar 502 can be shortened as much as possible, even to the minimum. This increases the power density of the transparent heating film 100, thereby improving the heating, defrosting, and defogging effects of the transparent heating film 100 on the information acquisition window 210. Under high-voltage power, by making the length of the second circuit longer than the bottom edge length of the information acquisition window 210, the circuit length between the first busbar 501 and the second busbar 502 can be extended as much as possible, even to the maximum. This avoids localized hot spots caused by high-voltage power, resulting in more uniform heating of the information acquisition window 210 by the transparent heating film 100.

[0081] In one possible implementation, under low voltage energization, the sheet resistance of the transparent heating film 100 is in the range of 0.5 Ω / sq to 20 Ω / sq; or, under high voltage energization, the sheet resistance of the transparent heating film 100 is in the range of 10 Ω / sq to 40 Ω / sq.

[0082] Preferably, under low voltage energization, the sheet resistance of the transparent heating film 100 is in the range of 1Ω / sq to 10Ω / sq. Under high voltage energization, the sheet resistance of the transparent heating film 100 is in the range of 20Ω / sq to 30Ω / sq.

[0083] Under low voltage, the voltage across the transparent heating film 100 is increased by reducing its surface resistance, thus improving the heating effect on the information acquisition window 210. Under high voltage, the voltage across the transparent heating film 100 is decreased by increasing its surface resistance, which facilitates more uniform heating of the information acquisition window 210.

[0084] Please refer to Figures 5 to 7 In one possible implementation, the glass assembly 200 further includes a shielding layer 60. The shielding layer 60 is disposed around the information acquisition window 210, and the shielding layer 60 covers at least a portion of the first busbar 501 and / or at least a portion of the second busbar 502.

[0085] The shielding layer 60 can be a ceramic ink layer or a UV ink layer. The shielding layer 60 is used to enhance the appearance of the glass assembly 200, shield certain components of the glass assembly 200, and improve the local adhesion of the glass assembly 200. The visible light transmittance of the shielding layer 60 can be less than or equal to 5%. Preferably, the visible light transmittance of the shielding layer 60 can be less than or equal to 1.5%.

[0086] In one possible embodiment, considering the positional tolerance of the shielding layer 60, the positional tolerance of the first busbar 501 and the second busbar 502, the length of the first sub-circuit can be greater than or equal to a+2mm, and the length of the second sub-circuit can be greater than or equal to b+2mm.

[0087] In one possible embodiment, the shielding layer 60 may be disposed around the information acquisition window 210 and cover all of the first busbar 501 and all of the second busbar 502. Of course, in other possible embodiments, the shielding layer 60 may cover part of the first busbar 501 and / or part of the second busbar 502.

[0088] like Figure 5 As shown, in one possible implementation, the second loop length includes a first sub-loop length and a second sub-loop length, where the first sub-loop length is the minimum loop length of the second loop length, and the second sub-loop length is the maximum loop length of the second loop length. The bottom edge of the information acquisition window 210 includes a first bottom edge and a second bottom edge, where the length of the second bottom edge is greater than the length of the first bottom edge. The difference between the second sub-loop length and the first sub-loop length is less than or equal to the difference between the length of the second bottom edge and the length of the first bottom edge.

[0089] In this embodiment, the length of the first sub-circuit can be referred to as c21 in the attached drawing, the length of the second sub-circuit can be referred to as c22 in the attached drawing, the length of the first bottom edge can be referred to as a in the attached drawing, and the length of the second bottom edge can be referred to as b in the attached drawing. The length of the first sub-circuit can be understood as the distance across the first bottom edge between the first busbar 501 and the second busbar 502. The length of the second sub-circuit can be understood as the distance across the second bottom edge between the first busbar 501 and the second busbar 502. By making the difference between the length of the second sub-circuit and the length of the first sub-circuit less than or equal to the difference between the length of the second bottom edge and the length of the first bottom edge, the length difference between the length of the second sub-circuit and the length of the first sub-circuit can be minimized as much as possible, making it easier to cover the first busbar 501 and the second busbar 502 with the shielding layer 60, making them invisible.

[0090] Please refer to Figure 6 and Figure 7 In one possible implementation, the glass body 201 includes an outer glass plate 211, an intermediate connecting layer 212 and an inner glass plate 213 stacked sequentially, the intermediate connecting layer 212 connecting the outer glass plate 211 and the inner glass plate 213, and the transparent heating film 100 disposed between the outer glass plate 211 and the inner glass plate 213.

[0091] The outer glass panel 211 has a first surface facing the exterior of the vehicle and a second surface facing the interior of the vehicle. The outer glass panel 211 undergoes a high-temperature bending process at at least 500°C. The thickness of the outer glass panel 211 is typically 1.6-5.0 mm, such as 1.6 mm, 1.8 mm, 2.1 mm, 2.6 mm, 3.2 mm, 3.5 mm, 4.0 mm, 4.5 mm, and 5.0 mm. The outer glass panel 211 can be white glass with a visible light transmittance of 85%–93%, ordinary green glass with a visible light transmittance of 73%–88%, or solar green glass with a visible light transmittance of 70%–85.5%. When integrating sensors, a thickness of 1.8 mm or 2.1 mm is preferred for the outer glass panel 211, and white glass or ordinary green glass is preferred for the material.

[0092] An intermediate connecting layer 212 is sandwiched between the outer glass panel 211 and the inner glass panel 213, used to bond the second and third surfaces. The intermediate connecting layer 212 is used to bond and fix the outer glass panel 211 and the inner glass panel 213 together. The intermediate connecting layer 212 can be a thermoplastic intermediate layer, such as polycarbonate (PC), polyvinyl chloride (PVC), polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), polyacrylate (PA), polymethyl methacrylate (PMMA), polyurethane (PUR), ionomer film (SGP), etc. The intermediate connecting layer 212 can also be selected to have a local tinting function, for example, setting at least one tinted area at the top of the windshield as a shadow strip to reduce sunlight interference to the eyes, or setting a tinted area at the bottom of the windshield to provide a shielding effect. It can also be composed of two or three layers of films with tinted bottom or top and transparent middle visible areas of the windshield. The intermediate connecting layer 212 may also contain an infrared absorber to provide heat and light absorption. The intermediate connecting layer 212 may also contain at least two layers, one of which has a higher plasticizer content to provide sound insulation, or one of which is wedge-shaped to provide a head-up display function, etc.

[0093] The inner glass panel 213 has a third surface facing the exterior of the vehicle and a fourth surface facing the interior of the vehicle, and is formed by bending at a high temperature of at least 500°C. The thickness of the inner glass panel 213 is typically 1.6-5.0 mm, such as 1.6 mm, 1.8 mm, 2.1 mm, 2.6 mm, 3.2 mm, 3.5 mm, 4.0 mm, 4.5 mm, and 5.0 mm. The inner glass panel 213 can be white glass with a visible light transmittance of 85%–93%, ordinary green glass with a visible light transmittance of 73%–88%, or solar green glass with a visible light transmittance of 70%–85.5%. When integrating a camera onto the glass, a thickness of 1.8 mm or 2.1 mm is preferred for the inner glass panel 213, and white glass or ordinary green glass is preferred for the material.

[0094] The transparent heating film 100 can be disposed on the surface of the outer glass plate 211 facing the inner glass plate 213, or on the surface of the inner glass plate 213 facing the outer glass plate 211, or on the surface of the intermediate connecting layer 212 facing the outer glass plate 211, or on the surface of the intermediate connecting layer 212 facing the inner glass plate 213. Of course, in other possible embodiments, the transparent heating film 100 can also be disposed on the surface of the inner glass plate 213 facing away from the intermediate connecting layer 212.

[0095] like Figure 4 As shown, in one possible implementation, the material of the first sub-conductive mesh layer 101 includes elemental platinum, gold, chromium, nickel, copper, titanium, or alloys, or oxides; and / or, the material of the second sub-conductive mesh layer 102 includes elemental silver, or alloys; and / or, the material of the third sub-conductive mesh layer 103 includes elemental platinum, gold, chromium, nickel, copper, titanium, or alloys, or oxides.

[0096] In one possible embodiment, the material of the first sub-conductive mesh layer 101 and the material of the third sub-conductive mesh layer 103 can be the same. The first sub-conductive mesh layer 101 and the third sub-conductive mesh layer 103 can protect the second sub-conductive mesh layer 102, prevent the silver material of the second sub-conductive mesh layer 102 from undergoing a chemical reaction that would affect its conductivity, and also ensure the overall mechanical properties of the conductive mesh layer 10.

[0097] In one possible embodiment, the proportion of metallic silver in the material of the second sub-conductive mesh layer 102 can be greater than or equal to 90%, and more preferably, the proportion of metallic silver can be greater than or equal to 95%. It is understood that the main material of the second sub-conductive mesh layer 102 is metallic silver.

[0098] In embodiments where the material of the second sub-conductive mesh layer 102 includes a silver alloy, 0.49% to 2.1% palladium or copper may be doped into the material of the second sub-conductive mesh layer 102 to improve the oxidation resistance of the second sub-conductive mesh layer 102.

[0099] The thickness of the first sub-conductive mesh layer 101 can be in the range of 5nm to 50nm, the thickness of the second sub-conductive mesh layer 102 can be in the range of 5nm to 50nm, and the thickness of the third sub-conductive mesh layer 103 can be in the range of 5nm to 50nm. The thicknesses of the first sub-conductive mesh layer 101, the second sub-conductive mesh layer 102, and the third sub-conductive mesh layer 103 can be the same or different.

[0100] This embodiment ensures good conductivity of the conductive mesh layer 10 by using elemental silver or an alloy as the material for the second sub-conductive mesh layer 102. By using elemental platinum, gold, chromium, nickel, copper, titanium, or an alloy or oxide as the material for the first sub-conductive mesh layer 101, and elemental platinum, gold, chromium, nickel, copper, titanium, or an alloy or oxide as the material for the third sub-conductive mesh layer 103, the mechanical properties and oxidation resistance of the conductive mesh layer 10 can be improved while ensuring good conductivity.

[0101] like Figure 8 As shown, in one possible embodiment, the transparent heating film 100 further includes a transparent conductive layer 20 disposed on the side of the third sub-conductive mesh layer 103 opposite to the first sub-conductive mesh layer 101. The material of the transparent conductive layer 20 includes one or more of indium tin oxide, aluminum-doped zinc oxide, and tin-doped zinc oxide; and / or, the refractive index of the transparent conductive layer 20 is different from the refractive index of the third sub-conductive mesh layer 103; and / or, at least a portion of the transparent conductive layer 20 fills at least a portion of the holes 104.

[0102] Understandably, the transparent heating film 100 includes a first sub-conductive mesh layer 101, a second sub-conductive mesh layer 102, a third sub-conductive mesh layer 103, and a transparent conductive layer 20, which are sequentially stacked. The transparent conductive layer 20 has light transmittance and conductivity. In one possible embodiment, the light transmittance of the transparent conductive layer 20 may be better than that of the conductive mesh layer 10. In one possible embodiment, the conductivity of the transparent conductive layer 20 may be lower than that of the second sub-conductive mesh layer 102, and lower than that of the first sub-conductive mesh layer 101 and the third sub-conductive mesh layer 103. In another possible embodiment, the conductivity of the transparent conductive layer 20 may be lower than that of the second sub-conductive mesh layer 102, and higher than that of the first sub-conductive mesh layer 101 and the third sub-conductive mesh layer 103. The transparent heating film 100 may include one or more transparent conductive layers 20. In this embodiment, the transparent conductive layer 20 and the conductive mesh layer 10 can form a three-dimensional conductive channel, which is beneficial to improving the conductivity of the transparent heating film 100.

[0103] In one possible embodiment, the transparent conductive layer 20 is made of one or more of indium tin oxide, aluminum-doped zinc oxide, and tin-doped zinc oxide. Optionally, the transparent conductive layer 20 is made of one of indium tin oxide, aluminum-doped zinc oxide, and tin-doped zinc oxide; or, the transparent conductive layer 20 is made of any two of indium tin oxide, aluminum-doped zinc oxide, and tin-doped zinc oxide; or, the transparent conductive layer 20 is made of indium tin oxide, aluminum-doped zinc oxide, and tin-doped zinc oxide. By making the transparent conductive layer 20 made of one or more of indium tin oxide, aluminum-doped zinc oxide, and tin-doped zinc oxide, good light transmittance of the transparent conductive layer 20 can be ensured. Optionally, the visible light transmittance of the transparent conductive layer 20 is greater than or equal to 85%, more preferably, the visible light transmittance of the transparent conductive layer 20 is greater than or equal to 90%. In this embodiment, the transparent heating film 100 formed by the transparent conductive layer 20 and the conductive mesh layer 10 has broad spectral performance and high light transmittance.

[0104] In one possible embodiment, the refractive index of the transparent conductive layer 20 is different from the refractive index of the third sub-conductive mesh layer 103. Optionally, the refractive index of the transparent conductive layer 20 is greater than the refractive index of the third sub-conductive mesh layer 103, or the refractive index of the transparent conductive layer 20 is less than the refractive index of the third sub-conductive mesh layer 103. By making the refractive index of the transparent conductive layer 20 different from the refractive index of the third sub-conductive mesh layer 103, light reflection at the interface between the transparent conductive layer 20 and the third sub-conductive mesh layer 103 can be reduced, thereby increasing the light transmittance of the transparent heating film 100.

[0105] In one possible embodiment, the transparent conductive layer 20 fills at least a portion of the holes 104. Optionally, the transparent conductive layer 20 fills all of the first sub-holes, all of the second sub-holes, and all of the third sub-holes; or, the transparent conductive layer 20 fills a portion of the first sub-holes, a portion of the second sub-holes, and a portion of the third sub-holes. By filling at least a portion of the holes 104 with the transparent conductive layer 20, microscopic defects in the conductive mesh layer 10 can be reduced, facilitating the formation of a continuous conductive mesh. This results in a more uniform current density distribution in the transparent heating film 100, thereby optimizing the conductivity of the transparent heating film 100.

[0106] like Figure 9 As shown, in one possible embodiment, the transparent heating film 100 further includes a transparent optical layer 30 disposed on the side of the first sub-conductive mesh layer 101 opposite to the third sub-conductive mesh layer 103. The material of the transparent optical layer 30 includes one or more of oxides, fluorides, silicon nitrides, and zinc sulfide; and / or, the refractive index of the transparent optical layer 30 is different from the refractive index of the first sub-conductive mesh layer 101; and / or, the adhesion of the transparent optical layer 30 is greater than the adhesion of the first sub-conductive mesh layer 101.

[0107] Understandably, the transparent heating film 100 includes a transparent optical layer 30, a first sub-conductive mesh layer 101, a second sub-conductive mesh layer 102, and a third sub-conductive mesh layer 103, which are sequentially stacked. This embodiment can also be combined with the above-described embodiment where the transparent heating film 100 includes a transparent conductive layer 20, that is, the transparent heating film 100 includes a transparent optical layer 30, a first sub-conductive mesh layer 101, a second sub-conductive mesh layer 102, a third sub-conductive mesh layer 103, and a transparent conductive layer 20, which are sequentially stacked. The transparent optical layer 30 is light-transmitting. In one possible embodiment, the light transmittance of the transparent optical layer 30 may be better than that of the conductive mesh layer 10. In another possible embodiment, the light transmittance of the transparent optical layer 30 may be equal to or better than that of the transparent conductive layer 20. In one possible embodiment, the transparent optical layer 30 may also be conductive. The conductivity of the transparent optical layer 30 may be weaker than that of the conductive mesh layer 10, and may also be weaker than that of the transparent conductive layer 20. The transparent heating film 100 may include one or more transparent optical layers 30. The design of the transparent optical layer 30 in this embodiment is beneficial to improving the optical and mechanical properties of the transparent heating film 100.

[0108] In one possible embodiment, the transparent optical layer 30 is made of one or more of oxides, fluorides, silicon nitrides, and zinc sulfide. Optionally, the transparent optical layer 30 may be made of one of oxides, fluorides, silicon nitrides, and zinc sulfide; or, it may be made of any two of oxides, fluorides, silicon nitrides, and zinc sulfide; or, it may be made of any three of oxides, fluorides, silicon nitrides, and zinc sulfide; or, it may be made of oxides, fluorides, silicon nitrides, and zinc sulfide. Oxides include, but are not limited to, silicon dioxide, titanium dioxide, aluminum oxide, and indium tin oxide. Fluorides include, but are not limited to, magnesium fluoride, calcium fluoride, and lanthanum fluoride. Titanium dioxide can be used to improve the refractive index matching effect of the transparent optical layer 30, thereby facilitating the adjustment of the refractive index gradient of the transparent heating film 100. Furthermore, when it is necessary to increase the adhesion of the transparent optical layer 30, the material of the transparent optical layer 30 may include a certain amount of zirconium dioxide.

[0109] In one possible embodiment, the refractive index of the transparent optical layer 30 is different from the refractive index of the first sub-conductive mesh layer 101. Optionally, the refractive index of the transparent optical layer 30 is greater than the refractive index of the first sub-conductive mesh layer 101, or the refractive index of the transparent optical layer 30 is less than the refractive index of the first sub-conductive mesh layer 101. By making the refractive index of the transparent optical layer 30 different from the refractive index of the first sub-conductive mesh layer 101, light reflection at the interface between the transparent optical layer 30 and the first sub-conductive mesh layer 101 can be reduced, i.e., Nefertory reflection can be reduced, thereby increasing the light transmittance of the transparent heating film 100.

[0110] In one possible embodiment, the adhesion of the transparent optical layer 30 is greater than that of the first sub-conductive mesh layer 101. In this embodiment, the proportion of materials with adhesion-enhancing properties in the transparent optical layer 30 can be greater than the proportion of materials with adhesion-enhancing properties in the first sub-conductive mesh layer 101. The materials used to enhance adhesion include, but are not limited to, zirconium dioxide. In this embodiment, when the transparent heating film 100 is applied to a glass assembly, the transparent optical layer 30 can improve the adhesion between the conductive mesh layer 10 and the glass body 201.

[0111] like Figure 10As shown, in one possible embodiment, the transparent heating film 100 further includes a transparent connecting layer 40 disposed between the transparent optical layer 30 and the first sub-conductive mesh layer 101. The material of the transparent connecting layer 40 includes one or more of zinc oxide, aluminum-doped zinc oxide, tin-doped zinc oxide, gallium-doped zinc oxide, indium-doped zinc oxide, and indium-gallium-doped zinc oxide; and / or, the refractive index of the transparent connecting layer 40 is different from the refractive index of the transparent optical layer 30; and / or, the adhesion of the transparent connecting layer 40 is greater than the adhesion of the transparent optical layer 30.

[0112] Understandably, the transparent heating film 100 includes a transparent optical layer 30, a transparent connecting layer 40, a first sub-conductive mesh layer 101, a second sub-conductive mesh layer 102, and a third sub-conductive mesh layer 103, which are sequentially stacked. This embodiment can also be combined with the above-described embodiment where the transparent heating film 100 includes a transparent conductive layer 20, i.e., the transparent heating film 100 includes a transparent optical layer 30, a transparent connecting layer 40, a first sub-conductive mesh layer 101, a second sub-conductive mesh layer 102, a third sub-conductive mesh layer 103, and a transparent conductive layer 20, which are sequentially stacked. The transparent connecting layer 40 has light transmittance and connectivity. Optionally, the light transmittance of the transparent connecting layer 40 can be equal to the light transmittance of the transparent optical layer 30, or the light transmittance of the transparent connecting layer 40 can be lower than the light transmittance of the transparent optical layer 30, or the light transmittance of the transparent connecting layer 40 can be higher than the light transmittance of the transparent optical layer 30. The adhesion performance of the transparent connecting layer 40 is better than that of the transparent optical layer 30. In one possible embodiment, the transparent connecting layer 40 may also be conductive. The conductivity of the transparent connecting layer 40 may be weaker than that of the conductive mesh layer 10, and may also be weaker than that of the transparent conductive layer 20. The transparent heating film 100 may include one or more transparent connecting layers 40.

[0113] In one possible embodiment, the transparent connecting layer 40 is made of one or more of zinc oxide, aluminum-doped zinc oxide, tin-doped zinc oxide, gallium-doped zinc oxide, indium-doped zinc oxide, and indium-gallium-doped zinc oxide. Optionally, the transparent connecting layer 40 is made of one of zinc oxide, aluminum-doped zinc oxide, tin-doped zinc oxide, gallium-doped zinc oxide, indium-doped zinc oxide, and indium-gallium-doped zinc oxide; or, the transparent connecting layer 40 is made of at least two of zinc oxide, aluminum-doped zinc oxide, tin-doped zinc oxide, gallium-doped zinc oxide, indium-doped zinc oxide, and indium-gallium-doped zinc oxide. The material of the transparent connecting layer 40 in this embodiment ensures good light transmittance and connectivity.

[0114] In one possible embodiment, the refractive index of the transparent connecting layer 40 is different from that of the transparent optical layer 30. Optionally, the refractive index of the transparent connecting layer 40 is greater than that of the transparent optical layer 30, or the refractive index of the transparent connecting layer 40 is less than that of the transparent optical layer 30. By making the refractive index of the transparent connecting layer 40 different from that of the transparent optical layer 30, light reflection at the interface between the transparent connecting layer 40 and the transparent optical layer 30 can be reduced, thereby increasing the light transmittance of the transparent heating film 100. Furthermore, in this embodiment, the refractive index of the transparent connecting layer 40 may also be different from that of the first sub-conductive mesh layer 101. A different refractive index between the transparent connecting layer 40 and the first sub-conductive mesh layer 101 can reduce light reflection at the interface between the transparent connecting layer 40 and the first sub-conductive mesh layer 101, thereby increasing the light transmittance of the transparent heating film 100.

[0115] In one possible embodiment, the adhesion force of the transparent connecting layer 40 is greater than that of the transparent optical layer 30. In this embodiment, the proportion of materials with adhesion-enhancing properties in the transparent connecting layer 40 can be greater than the proportion of materials with adhesion-enhancing properties in the transparent optical layer 30. The materials used to enhance adhesion performance include, but are not limited to, zirconium dioxide. The design of the transparent connecting layer 40 in this embodiment is beneficial for improving the connection force between the transparent optical layer 30 and the conductive mesh layer 10.

[0116] In one possible implementation, the visible light transmittance of the transparent heating film 100 is greater than or equal to 85%; and / or, the sheet resistance of the transparent heating film 100 is less than or equal to 40 Ω / sq; and / or, the transparent heating film 100 is used to make the rate of change of halo less than or equal to 60%; and / or, the haze value of the transparent heating film 100 is less than or equal to 2%.

[0117] In one possible embodiment, the visible light transmittance of the transparent heating film 100 is greater than or equal to 85%. Preferably, the visible light transmittance of the transparent heating film 100 is greater than or equal to 86%; or, the visible light transmittance of the transparent heating film 100 is greater than or equal to 87%; greater than or equal to 88%; greater than or equal to 89%; or greater than or equal to 90%. By ensuring that the visible light transmittance of the transparent heating film 100 is greater than or equal to 85%, when the transparent heating film 100 is applied to a glass assembly, it can directly cover the information acquisition window, thereby ensuring the defrosting and defogging effect on the information acquisition window without causing serious interference to the sensor function.

[0118] In one possible embodiment, the sheet resistance of the transparent heating film 100 is less than or equal to 40 Ω / sq. Preferably, the sheet resistance of the transparent heating film 100 is less than or equal to 30 Ω / sq; or, the sheet resistance of the transparent heating film 100 is less than or equal to 20 Ω / sq; or, the sheet resistance of the transparent heating film 100 is less than or equal to 18 Ω / sq; or, the sheet resistance of the transparent heating film 100 is less than or equal to 15 Ω / sq; or, the sheet resistance of the transparent heating film 100 is less than or equal to 14 Ω / sq; or, the sheet resistance of the transparent heating film 100 is less than or equal to 12 Ω / sq; or, the sheet resistance of the transparent heating film 100 is less than or equal to 10 Ω / sq; or, the sheet resistance of the transparent heating film 100 is less than or equal to 5 Ω / sq. By ensuring that the surface resistivity of the transparent heating film 100 is less than or equal to 20 Ω / sq, it is beneficial for the transparent heating film 100 to continuously defrost and defog the information acquisition window under extreme weather conditions, and it can achieve more efficient heating under low voltage power supply. Furthermore, in this application, the transparent heating film 100 and the information acquisition window are in surface contact. By ensuring that the surface resistivity of the transparent heating film 100 is less than or equal to 20 Ω / sq, the uniformity of heating of the information acquisition window by the transparent heating film can be guaranteed, avoiding localized overheating of the information acquisition window or visual obstruction.

[0119] like Figure 11 As shown, in one possible embodiment, the transparent heating film 100 is used to make the rate of change of the halo less than or equal to 60%. The rate of change of the halo is the rate of change of the halo generated when light passes through the information acquisition window with the transparent heating film 100 included in the glass assembly compared to the rate of change of the halo generated when light passes through the information acquisition window without the transparent heating film 100 included in the glass assembly. Specifically, the rate of change of the halo can be calculated using (d2-d1) / d1. Here, d2 is the maximum diameter of the halo generated when light passes through the information acquisition window with the transparent heating film 100 included in the glass assembly (refer to...). Figure 11 (As shown in the middle right figure), d1 is the maximum diameter of the halo produced when light passes through the information acquisition window without the transparent heating film 100 on the glass assembly (refer to...). Figure 11 (As shown in the middle left figure). Optionally, the transparent heating film 100 is used to make the rate of change of the halo less than or equal to 50%; or, the transparent heating film 100 is used to make the rate of change of the halo less than or equal to 40%; or, the transparent heating film 100 is used to make the rate of change of the halo less than or equal to 30%; or, the transparent heating film 100 is used to make the rate of change of the halo less than or equal to 20%. The design of the transparent heating film 100 in this embodiment will not cause an excessive halo, which can reduce interference with the sensor function.

[0120] In one possible embodiment, the haze value of the transparent heating film 100 is less than or equal to 2%. Preferably, the haze value of the transparent heating film 100 is less than or equal to 1.8%; or, the haze value of the transparent heating film 100 is less than or equal to 1.5%; or, the haze value of the transparent heating film 100 is less than or equal to 1.2%; or, the haze value of the transparent heating film 100 is less than or equal to 1%. By making the haze value of the transparent heating film 100 less than or equal to 2%, it is beneficial to improve the light transmittance of the glass assembly 200.

[0121] In one possible implementation, the thickness of the transparent heating film 100 is less than or equal to 200 nm; and / or, the pore size of the holes 104 is in the range of 100 nm to 600 nm; and / or, the pore density of the holes 104 is in the range of 20% to 60%; and / or, the surface roughness of the transparent heating film 100 is less than or equal to 5 nm; and / or, the haze value of the transparent heating film 100 is less than or equal to 2%.

[0122] Preferably, the thickness of the transparent heating film 100 is less than or equal to 190 nm; or, the thickness of the transparent heating film 100 is less than or equal to 180 nm; or, the thickness of the transparent heating film 100 is less than or equal to 170 nm; or, the thickness of the transparent heating film 100 is less than or equal to 160 nm. By making the thickness of the transparent heating film 100 less than or equal to 200 nm, good light transmittance of the transparent heating film 100 can be guaranteed.

[0123] Preferably, the aperture of the hole 104 is in the range of 200nm to 600nm; or, the aperture of the hole 104 is in the range of 100nm to 500nm; or, the aperture of the hole 104 is in the range of 200nm to 500nm; or, the aperture of the hole 104 is in the range of 300nm to 400nm. In the embodiments of this application, the aperture of the hole 104 includes the aperture of the first sub-hole, the aperture of the second sub-hole, and the aperture of the third sub-hole. By making the aperture of the hole 104 in the range of 100nm to 600nm, the high transparency and high conductivity of the transparent heating film 100 can be balanced with the effect of multiple non-periodicly arranged holes 104 disrupting the phase consistency of light waves.

[0124] Preferably, the pore density of the holes 104 is in the range of 20% to 50%; or, the pore density of the holes 104 is in the range of 30% to 60%; or, the pore density of the holes 104 is in the range of 30% to 50%; or, the pore density of the holes 104 is in the range of 30% to 40%. By keeping the pore density of the holes 104 in the range of 20% to 60%, it is beneficial to improve the uniformity of the current density distribution in the conductive mesh layer 10, and to reduce the effect of multiple non-periodicly arranged holes 104 disrupting the phase consistency of light waves.

[0125] Preferably, the surface roughness of the transparent heating film 100 is less than or equal to 4 nm; or, the surface roughness of the transparent heating film 100 is less than or equal to 3 nm; or, the surface roughness of the transparent heating film 100 is less than or equal to 2 nm; or, the surface roughness of the transparent heating film 100 is less than or equal to 1 nm. By making the surface roughness of the transparent heating film 100 less than or equal to 5 nm, the scattering of light on the surface of the transparent heating film 100 can be reduced, and the light transmittance of the transparent heating film 100 can be guaranteed.

[0126] Preferably, the haze value of the transparent heating film 100 is less than or equal to 1.5%; or, the haze value of the transparent heating film 100 is less than or equal to 1%; or, the haze value of the transparent heating film 100 is less than or equal to 0.5%. By making the haze value of the transparent heating film 100 less than or equal to 2%, when the transparent heating film 100 is applied to the glass assembly, the high transparency of the glass assembly can be guaranteed, and it is beneficial to improve the effect of the sensor in collecting information through the information acquisition window.

[0127] In one possible implementation, the thickness of the second sub-conductive mesh layer 102 is in the range of 5 nm to 50 nm.

[0128] Preferably, the thickness of the second sub-conductive mesh layer 102 is in the range of 5nm to 45nm; or, the thickness of the second sub-conductive mesh layer 102 is in the range of 10nm to 50nm; or, the thickness of the second sub-conductive mesh layer 102 is in the range of 10nm to 40nm; or, the thickness of the second sub-conductive mesh layer 102 is in the range of 20nm to 40nm. By making the thickness of the second sub-conductive mesh layer 102 in the range of 5nm to 50nm, the conductivity of the core conductive layer in the conductive mesh layer 10 can be guaranteed.

[0129] like Figure 12 As shown, Figure 12 This is a schematic flowchart illustrating a method for preparing a glass component 200 according to an embodiment of this application. The method for preparing the glass component 200 is used to prepare the glass component 200 described in any of the above embodiments. The method for preparing the glass component 200 includes, but is not limited to, the following steps S1, S2, and S3.

[0130] S1: Provide a glass body 201, and the glass body 201 has an information acquisition window 210.

[0131] S2: Provide a transparent heating film 100, wherein the transparent heating film 100 includes a conductive mesh layer 10, the conductive mesh layer 10 having a plurality of holes 104 arranged in a non-periodic manner.

[0132] S3: Cover at least a portion of the information acquisition window 210 with the transparent heating film 100 to prepare the glass assembly 200.

[0133] In one possible embodiment, providing a glass body 201 may include providing an outer glass plate 211, an intermediate connecting layer 212, and an inner glass plate 213. Providing a transparent heating film 100, and the transparent heating film 100 including a conductive mesh layer 10, may include providing a first sub-conductive mesh layer 101, a second sub-conductive mesh layer 102, and a third sub-conductive mesh layer 103. Further, it may also include providing at least one of a transparent conductive layer 20, a transparent optical layer 30, and a transparent connecting layer 40.

[0134] Optionally, covering at least a portion of the information acquisition window 210 with the transparent heating film 100 may be achieved by placing the transparent heating film 100 between the outer glass plate 211 and the inner glass plate 213, thereby covering at least a portion of the information acquisition window 210; or, the transparent heating film 100 may be placed on the side of the inner glass plate 213 opposite to the outer glass plate 211, thereby covering at least a portion of the information acquisition window 210.

[0135] like Figure 13 As shown, in one possible implementation, before providing the transparent heating film 100, the preparation method of the glass assembly 200 may include, but is not limited to, the following steps S10, S20 and S30.

[0136] S10: Provides a mask plate with microspheres arranged in a non-periodic pattern.

[0137] S20: A magnetron sputtering process is used to deposit a film on the mask to sequentially obtain the first sub-conductive mesh layer 101, the second sub-conductive mesh layer 102, and the third sub-conductive mesh layer 103.

[0138] S30: Remove the mask plate.

[0139] Optionally, the non-periodic arrangement of microspheres in step S10 can be monodisperse SiO2 microspheres or polystyrene microspheres. The coverage of the microspheres can be in the range of 20% to 50%. Preferably, the coverage of the microspheres can be in the range of 35% ± 5%.

[0140] Step S20 includes magnetron sputtering a first sub-conductive mesh layer 101 material on a mask to obtain the first sub-conductive mesh layer 101; magnetron sputtering a second sub-conductive mesh layer 102 material on the mask to obtain the second sub-conductive mesh layer 102 on the surface of the first sub-conductive mesh layer 101; and magnetron sputtering a third sub-conductive mesh layer 103 material on the mask to obtain the third sub-conductive mesh layer 103 on the surface of the second sub-conductive mesh layer 102 facing away from the first sub-conductive mesh layer 101. The magnetron sputtering process used for coating results in strong adhesion between the first sub-conductive mesh layer 101, the second sub-conductive mesh layer 102, and the third sub-conductive mesh layer 103, and the resulting film is more uniform.

[0141] In one possible embodiment, step S20 may involve depositing a film on the mask using a magnetron sputtering process to sequentially obtain the first sub-conductive mesh layer 101, the second sub-conductive mesh layer 102, and the third sub-conductive mesh layer 103 on the surface of the transparent optical layer 30.

[0142] In another possible embodiment, step S20 may involve depositing a film on the mask using a magnetron sputtering process to sequentially obtain the first sub-conductive mesh layer 101, the second sub-conductive mesh layer 102, and the third sub-conductive mesh layer 103 on the surface of the transparent connecting layer 40 facing away from the transparent optical layer 30.

[0143] The mask plate can be removed manually or by using mechanical equipment in step S30.

[0144] In one possible implementation, such as Figure 14 As shown, after step S30, the method for preparing the transparent heating film 100 further includes the following step S40.

[0145] S40: A transparent conductive layer 20 is deposited on the surface of the third sub-conductive mesh layer 103 on the side opposite to the second sub-conductive mesh layer 102.

[0146] The process for depositing the transparent conductive layer 20 includes, but is not limited to, magnetron sputtering. Magnetron sputtering can ensure the uniformity of the deposited transparent conductive layer 20.

[0147] In one possible implementation, such as Figure 15 As shown, prior to step S10, the method for preparing the transparent heating film 100 further includes the following steps S50 and / or S60.

[0148] S50: Deposit transparent optical layer 30.

[0149] S60: Deposited transparent bonding layer 40.

[0150] The process for depositing the transparent optical layer 30 includes, but is not limited to, magnetron sputtering. Magnetron sputtering ensures the uniformity of the deposited transparent optical layer 30. The process for depositing the transparent bonding layer 40 includes, but is not limited to, magnetron sputtering. Magnetron sputtering ensures the uniformity of the deposited transparent optical layer 30.

[0151] Furthermore, this application also provides a vehicle. The vehicle can be a sedan, bus, truck, tractor, special transport vehicle, or special-purpose vehicle, etc. In this embodiment, a sedan is used as an example. The vehicle includes a body assembly and the glass assembly 200 described in any of the above embodiments. The body assembly includes, but is not limited to, the body body, wheels, chassis, engine, etc. The glass assembly 200 is connected to the body assembly. The sensor collects information through the information acquisition window 210.

[0152] The glass assembly 200 is connected to the body assembly via methods including, but not limited to, welding, bonding, snap-fit ​​connections, and bolt connections. The sensor is fixed inside the vehicle.

[0153] The features mentioned above in the specification, claims, and drawings can be combined in any way as long as they are meaningful within the scope of this application. The advantages and features described for the transparent heating film 100 are applicable in a corresponding manner to the method of preparing the transparent heating film 100, the glass assembly 200, and the vehicle.

[0154] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application, and such improvements and refinements are also considered to be within the protection scope of this application.

Claims

1. A glass assembly, characterized in that, It includes a glass body and a transparent heating film, wherein the glass body has an information acquisition window and the transparent heating film covers at least a portion of the information acquisition window; The transparent heating film includes a conductive mesh layer with multiple holes arranged in a non-periodic manner. These non-periodic holes are used to disrupt the phase consistency of light waves and suppress halos. The non-periodic holes are also used to increase the difference between the spacing of the conductive mesh layer and the pixel spacing of the sensor, thereby reducing the interference fringes generated by the superposition of the spacing of the conductive mesh layer and the pixel spacing of the sensor.

2. The glass assembly according to claim 1, characterized in that, The conductive mesh layer includes a first sub-conductive mesh layer, a second sub-conductive mesh layer, and a third sub-conductive mesh layer stacked sequentially. The refractive index of the first sub-conductive mesh layer is different from that of the second sub-conductive mesh layer, and the refractive index of the third sub-conductive mesh layer is different from that of the second sub-conductive mesh layer.

3. The glass assembly according to claim 1, characterized in that, The glass assembly also includes a substrate, through which the transparent heating film is supported on the glass body.

4. The glass assembly according to claim 1, characterized in that, The glass assembly further includes a first busbar and a second busbar, wherein the first busbar, the transparent heating film, and the second busbar are connected in series. Under low-voltage power, the first busbar and the second busbar are arranged along the height direction of the information acquisition window, and there is a first loop length between the first busbar and the second busbar along the height direction of the information acquisition window, the first loop length being less than the bottom edge length of the information acquisition window; or, Under high voltage, the first busbar and the second busbar are arranged along the side length of the information acquisition window, and the first busbar and the second busbar have a second loop length along the side length of the information acquisition window, the second loop length being greater than the bottom edge length of the information acquisition window.

5. The glass assembly according to claim 4, characterized in that, Under low voltage, the surface resistance of the transparent heating film is in the range of 0.5Ω / sq to 20Ω / sq; or, Under high voltage, the surface resistance of the transparent heating film is in the range of 10Ω / sq to 40Ω / sq.

6. The glass assembly according to claim 4, characterized in that, The second loop length includes a first sub-loop length and a second sub-loop length. The first sub-loop length is the minimum loop length of the second loop length, and the second sub-loop length is the maximum loop length of the second loop length. The bottom edge of the information acquisition window includes a first bottom edge and a second bottom edge. The length of the second bottom edge is greater than the length of the first bottom edge. The difference between the second sub-loop length and the first sub-loop length is less than or equal to the difference between the length of the second bottom edge and the length of the first bottom edge.

7. The glass assembly according to claim 4, characterized in that, The glass assembly further includes a shielding layer disposed around the information acquisition window, the shielding layer covering at least a portion of the first busbar and / or covering at least a portion of the second busbar.

8. The glass assembly according to claim 1, characterized in that, The glass body includes an outer glass plate, an intermediate connecting layer, and an inner glass plate stacked sequentially. The intermediate connecting layer connects the outer glass plate and the inner glass plate, and the transparent heating film is disposed between the outer glass plate and the inner glass plate.

9. The glass assembly according to claim 2, characterized in that, The material of the first sub-conductive mesh layer includes elemental platinum, gold, chromium, nickel, copper, titanium, or alloys, or oxides. And / or, The material of the second sub-conductive mesh layer includes elemental silver or an alloy; And / or, The material of the third sub-conductive mesh layer includes elemental platinum, gold, chromium, nickel, copper, and titanium, or alloys or oxides.

10. The glass assembly according to claim 2, characterized in that, The transparent heating film also includes a transparent conductive layer disposed on the side of the third sub-conductive mesh layer opposite to the first sub-conductive mesh layer; The material of the transparent conductive layer includes one or more of indium tin oxide, aluminum-doped zinc oxide, and tin-doped zinc oxide. And / or, The refractive index of the transparent conductive layer is different from that of the third sub-conductive mesh layer; And / or, The transparent conductive layer fills at least a portion of the pores.

11. The glass assembly according to claim 10, characterized in that, The transparent heating film also includes a transparent optical layer disposed on the side of the first sub-conductive mesh layer opposite to the third sub-conductive mesh layer; The material of the transparent optical layer includes one or more of oxides, fluorides, silicon nitrides, and zinc sulfide; And / or, The refractive index of the transparent optical layer is different from that of the first sub-conductive mesh layer; And / or, The adhesion force of the transparent optical layer is greater than that of the first sub-conductive mesh layer.

12. The glass assembly according to claim 11, characterized in that, The transparent heating film further includes a transparent connecting layer disposed between the transparent optical layer and the first sub-conductive mesh layer; The material of the transparent bonding layer includes one or more of zinc oxide, aluminum-doped zinc oxide, tin-doped zinc oxide, gallium-doped zinc oxide, indium-doped zinc oxide, and indium-gallium-doped zinc oxide. And / or, The refractive index of the transparent connecting layer is different from that of the transparent optical layer; And / or, The adhesion force of the transparent bonding layer is greater than that of the transparent optical layer.

13. The glass assembly according to any one of claims 1-12, characterized in that, The visible light transmittance of the transparent heating film is greater than or equal to 85%; And / or, The sheet resistance of the transparent heating film is less than or equal to 40Ω / sq; And / or, The transparent heating film is used to ensure that the rate of change of the halo is less than or equal to 60%; And / or, The haze value of the transparent heating film is less than or equal to 2%.

14. The glass assembly according to any one of claims 1-12, characterized in that, The thickness of the transparent heating film is less than or equal to 200 nm; And / or, The aperture of the hole is in the range of 100nm to 600nm; And / or, The pore density of the holes is in the range of 20% to 60%; And / or, The surface roughness of the transparent heating film is less than or equal to 5 nm.

15. The glass assembly according to claim 2, characterized in that, The thickness of the second sub-conductive mesh layer is in the range of 5nm to 50nm.

16. A method for preparing a glass component, characterized in that, include: A glass body is provided, and the glass body has an information acquisition window; A transparent heating film is provided, and the transparent heating film includes a conductive mesh layer having a plurality of holes arranged in an aperiodic manner. The plurality of holes arranged in an aperiodic manner are used to disrupt the phase consistency of light waves and suppress halos. The plurality of holes arranged in an aperiodic manner are also used to increase the difference between the spacing of the conductive mesh layer and the pixel spacing of the sensor, thereby reducing the interference fringes generated by the superposition of the spacing of the conductive mesh layer and the pixel spacing of the sensor. The information acquisition window is at least partially covered by a transparent heating film to form the glass assembly.

17. The method for preparing a glass assembly according to claim 16, characterized in that, Prior to providing the transparent heating film, the following is also included: A mask plate with microspheres arranged in a non-periodic pattern is provided; A magnetron sputtering process is used to deposit a film on the mask to sequentially obtain a first sub-conductive mesh layer, a second sub-conductive mesh layer, and a third sub-conductive mesh layer; Remove the mask.

18. The method for preparing a glass assembly according to claim 17, characterized in that, After removing the mask, the process further includes: A transparent conductive layer is deposited on the surface of the third sub-conductive mesh layer on the side opposite to the second sub-conductive mesh layer; And / or, Prior to providing the mask plate having microspheres arranged in a non-periodic pattern, the method further includes: Deposit a transparent optical layer; And / or, Deposit a transparent bonding layer.

19. A vehicle, characterized in that, It includes a body assembly, a sensor, and a glass assembly according to any one of claims 1 to 15, wherein the glass assembly is connected to the body assembly, and the sensor collects information through the information acquisition window.

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