A press head apparatus and bonder
Patent Information
- Application Number
- CN202511965534.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-24
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2045-12-24
AI Technical Summary
然而,这类方法存在明显不足:首先,其属于离线、静态检测,无法在设备运行过程中对压头的实时平行度进行监测,难以发现因热变形、机械磨损或应力变化而在工艺中产生的平行度漂移;其次,外部检测通常工序繁琐、耗时较长,需中断生产,影响设备稼动率;再者,引入外部仪器也带来了额外的操作误差与校准成本
[0023]本发明提供的压头装置,通过将平行度检测单元集成于压头装置中,在压接工艺的准备阶段或间歇期,对第一压头和第二压头的相对平行度进行快速、动态测量,能够实时捕捉因温升、应力或机械磨损引起的平行度变化。平行度检测单元采用光学检测原理,利用光路的指向性和反射特性进行测量,通过分束器将光源的同一束检测光束同时分为两路,检测器同步接收两路反射光束进行比对,单次测量即可获得平行度结果,检测速度快,几乎不占用额外的工艺时间。且光路布局可设计为与压头运动空间互不干涉,使得平行度检测操作能够无缝嵌入至现有的压接工作循环中,并通过检测器获得实时平行度反馈。该压头装置通过实时、在线的平行度监控与反馈,能够确保每一次压接过程都在最佳的平行度条件下进行;避免了因平行度不佳导致的压力不均、接合缺陷等问题,显著提高了压接界面的均匀性和键合强度的一致性,从而使得最终产品良率和可靠性得到提升。
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Figure CN121568592B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a pressure head device and a bonding machine. Background Technology
[0002] Bonding machines are key pieces of equipment in the semiconductor packaging and microelectronics assembly fields, used to perform precision bonding processes between wafers and wafers, and between wafers and chips, and other microstructures. A typical structure includes an upper and lower bonding head positioned opposite each other. The upper bonding head is typically used to hold and hold the sample above (such as the upper wafer), while the lower bonding head carries the sample below (such as the lower wafer or substrate). During the process, the upper and lower bonding heads move in opposite directions until the two samples come into contact and achieve a strong bond under set temperature, pressure, and time.
[0003] The uniformity, bonding strength, and reliability of the crimp interface directly depend on the relative parallelism of the upper and lower indenters during the mold closing process. If the working surfaces of the two indenters are tilted or non-parallel, it will lead to uneven pressure distribution on the sample interface, resulting in a series of defects such as poor local bonding, interface voids, sample warping, or even cracking, which seriously affect device performance and yield.
[0004] To ensure crimping quality, existing technologies typically involve manually inspecting and adjusting the parallelism of the crimp head using external measuring instruments (such as high-precision levels, laser interferometers, or dedicated offline testing fixtures) during equipment assembly or periodic maintenance. However, these methods have significant drawbacks: First, they are offline, static inspections, unable to monitor the real-time parallelism of the crimp head during equipment operation, making it difficult to detect parallelism drift caused by thermal deformation, mechanical wear, or stress changes during the process; second, external inspections are usually cumbersome and time-consuming, requiring production interruptions and affecting equipment uptime; and third, introducing external instruments also introduces additional operational errors and calibration costs. Summary of the Invention
[0005] The purpose of this invention is to provide a pressure head device and a bonding machine to achieve online real-time detection of the parallelism of the pressure head, thereby improving the quality consistency of the bonding process and the utilization rate of the equipment.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] A pressure head device, comprising:
[0008] A first pressure head and a second pressure head are arranged opposite to each other, wherein the first pressure head is provided with a first reflective surface and the second pressure head is provided with a second reflective surface;
[0009] A parallelism detection unit includes a light source, a beam splitter, and a detector. The beam splitter is disposed in the optical path of the light source and is used to receive the same detection beam from the light source and split the detection beam into a first measurement beam and a second measurement beam. The first measurement beam points to the first reflecting surface, and the second measurement beam points to the second reflecting surface.
[0010] Wherein, the first reflecting surface can reflect the first measuring beam in reverse along the original path, and the second reflecting surface can reflect the second measuring beam in reverse along the original path;
[0011] The detector is configured to simultaneously receive and compare a first reflected beam reflected in reverse by the first reflecting surface and a second reflected beam reflected in reverse by the second reflecting surface, and determine the relative parallelism of the first pressure head and the second pressure head based on the difference in the optical path states of the first reflected beam and the second reflected beam.
[0012] As an alternative to the pressure head device, the light source and the detector are integrated into a collimator, and the detection beam is a collimated beam.
[0013] As an alternative to the pressure head device, the detector is a visual sensor or a quadrant detector.
[0014] As an optional solution for the pressure head device, the beam splitter can be a beam splitter mirror, a polarizing beam splitter prism, or an optical fiber splitter and combiner.
[0015] As an alternative to the pressure head device, the first pressure head and the second pressure head are arranged opposite each other along a first direction, and the light source is arranged along a second direction perpendicular to the first direction.
[0016] As an optional embodiment of the pressure head device, the first reflective surface is a first reflective mirror fixed to the first pressure head, and the second reflective surface is a second reflective mirror fixed to the second pressure head.
[0017] As an alternative to the pressure head device, the beam splitter is fixed to the surface of the first pressure head away from the second pressure head, and the first reflector is located on the side of the beam splitter away from the light source.
[0018] As an alternative to the pressure head device, the second reflector is embedded and flush with the surface of the second pressure head facing the first pressure head.
[0019] As an optional embodiment of the pressure head device, the first pressure head is provided with a light-transmitting channel, and the second measuring beam passes through the light-transmitting channel to reach the second reflecting surface.
[0020] As an optional embodiment of the pressure head device, the light-transmitting channel is a through hole that passes through the first pressure head.
[0021] A bonding machine includes a pressure head device as described in any of the above embodiments, and a leveling mechanism for adjusting the posture of the first pressure head and / or the second pressure head.
[0022] The beneficial effects of this invention are:
[0023] The indenter device provided by this invention integrates a parallelism detection unit into the indenter device. During the preparation stage or interval of the crimping process, it rapidly and dynamically measures the relative parallelism of the first and second indenters, capturing in real time changes in parallelism caused by temperature rise, stress, or mechanical wear. The parallelism detection unit employs optical detection principles, utilizing the directional and reflective characteristics of the optical path for measurement. A beam splitter simultaneously divides the same detection beam from the light source into two paths, and the detector synchronously receives and compares the two reflected beams. A single measurement yields the parallelism result, resulting in high detection speed with almost no additional process time. Furthermore, the optical path layout can be designed to be independent of the indenter movement space, allowing the parallelism detection operation to be seamlessly integrated into the existing crimping work cycle, and real-time parallelism feedback is obtained through the detector. This indenter device, through real-time, online parallelism monitoring and feedback, ensures that each crimping process is performed under optimal parallelism conditions; it avoids problems such as uneven pressure and bonding defects caused by poor parallelism, significantly improving the uniformity of the crimped interface and the consistency of bonding strength, thereby enhancing the yield and reliability of the final product.
[0024] The bonding machine provided by this invention integrates the aforementioned pressure head device with online, real-time parallelism detection function with a leveling mechanism, constructing a complete "detection-feedback-execution" closed-loop control system. This not only achieves automated real-time monitoring of pressure head parallelism, but more importantly, it can instantly drive the leveling mechanism to perform dynamic compensation and correction based on the monitoring results. Thus, with minimal or no human intervention, the parallelism accuracy required for the bonding process is guaranteed automatically throughout the entire process; significantly improving the bonding machine's intelligence level, process stability, and product yield consistency. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the pressure head device provided in an embodiment of the present invention.
[0026] In the picture:
[0027] 100. Detection beam; 101. First measurement beam; 102. Second measurement beam;
[0028] 201. First reflected beam; 202. Second reflected beam;
[0029] 300. Leveling mechanism;
[0030] 401. First connecting rod; 402. Second connecting rod;
[0031] 501, First Sample; 502, Second Sample;
[0032] 1. First pressure head; 11. Light transmission channel;
[0033] 2. Second pressure head;
[0034] 3. Collimator;
[0035] 4. Beam splitter;
[0036] 5. First reflecting mirror;
[0037] 6. Second reflecting mirror. Detailed Implementation
[0038] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.
[0039] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.
[0040] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.
[0041] Unless otherwise expressly specified and limited, "above" or "below" a second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of a second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of a second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0042] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0043] like Figure 1 As shown, this embodiment provides a pressing head device, including a first pressing head 1 and a second pressing head 2 arranged opposite to each other. The first pressing head 1 is used to adsorb a first sample 501, and the second pressing head 2 is used to adsorb a second sample 502. In the pressing process, the first pressing head 1 and the second pressing head 2 move in opposite directions, so that the first sample 501 and the second sample 502 come into contact and achieve a firm bond under a set temperature, pressure, and time. The uniformity, bonding strength, and reliability of the pressing interface of the first sample 501 and the second sample 502 directly depend on the relative parallelism of the first pressing head 1 and the second pressing head 2 during the mold closing process. If the pressing surfaces of the first pressing head 1 and the second pressing head 2 are tilted or non-parallel, it will lead to uneven pressure distribution on the pressing interface of the first sample 501 and the second sample 502, which will cause a series of defects such as poor local bonding, interface voids, sample warping, or even cracking, seriously affecting device performance and yield.
[0044] To address the aforementioned technical problems, this embodiment provides a pressing head device that integrates a parallelism detection unit. This parallelism detection unit can operate online in real time without interfering with the pressing process. It can quickly and automatically detect the relative parallelism of the first pressing head 1 and the second pressing head 2 during the pressing preparation stage and even during the pressing process, thereby improving the stability and consistency of the pressing process.
[0045] The pressure head device provided in this embodiment has a first pressure head 1 with a first reflective surface and a second pressure head 2 with a second reflective surface. The parallelism detection unit includes a light source, a beam splitter, and a detector. The beam splitter is disposed in the optical path of the light source and is used to receive the same detection beam 100 from the light source and split the detection beam 100 into a first measurement beam 101 and a second measurement beam 102. The first measurement beam 101 points towards the first reflective surface, and the second measurement beam 102 points towards the second reflective surface. The first reflective surface can reflect the first measurement beam 101 in the reverse direction along its original path, and the second reflective surface can reflect the second measurement beam 102 in the reverse direction along its original path. The detector is configured to simultaneously receive and compare the first reflected beam 201 reflected in the reverse direction by the first reflective surface and the second reflected beam 202 reflected in the reverse direction by the second reflective surface, and determine the relative parallelism of the first pressure head 1 and the second pressure head 2 based on the difference in the optical path states of the first reflected beam 201 and the second reflected beam 202.
[0046] This parallelism detection unit employs optical detection principles, utilizing the directional and reflective characteristics of the optical path for measurement. A beam splitter simultaneously divides the same detection beam 100 from the light source into two paths, and the detector synchronously receives and compares the two reflected beams. Parallelism results can be obtained in a single measurement, resulting in high detection speed and virtually no additional processing time. Furthermore, the optical path layout can be designed to be independent of the indenter's movement space, allowing parallelism detection to be seamlessly integrated into existing crimping work cycles, with real-time parallelism feedback obtained through the detector. This indenter device, through real-time, online parallelism monitoring and feedback, ensures that each crimping process is performed under optimal parallelism conditions; it avoids problems such as uneven pressure and bonding defects caused by poor parallelism, significantly improving the uniformity of the crimped interface and the consistency of bonding strength, thereby enhancing the final product yield and reliability.
[0047] In one embodiment, the light source and detector are integrated into the collimator 3, and the detection beam 100 is a collimated beam. The collimator 3 itself is a high-precision optical measuring instrument, and the collimated beam it emits has excellent directional consistency and low divergence, providing a stable and highly straight spatial reference axis for the parallelism detection unit. The collimated beam has concentrated energy and strong directionality, and is not easily diverged during transmission, enabling it to effectively reach distant or small-sized reflecting surfaces and carry stronger energy back. This improves the signal-to-noise ratio, allowing the detector to operate stably under complex industrial ambient light backgrounds. Integrating the light source and detector into the collimator 3 constitutes a self-collimating optical path. The positional movement of the reflected light point is precisely proportional to the angular deflection of the reflecting surface. This highly integrated design replaces the complex assembly and adjustment of discrete light sources, lens groups, and detectors with a single standard component, greatly simplifying the structure, improving reliability, and reducing assembly difficulty and the stringent precision requirements for mechanical mounting bases.
[0048] Of course, in other embodiments, a semiconductor laser is used as the light source, which, together with a collimating lens, generates a collimated beam. The detector uses a separate two-dimensional position-sensitive detector.
[0049] In one embodiment, the detector is a visual sensor or a quadrant detector.
[0050] For example, the detector is a vision sensor, which is a CCD camera. When the reflected light spots from the first reflected beam 201 from the first reflecting surface and the second reflected beam 202 from the second reflecting surface are imaged onto the photosensitive target surface, the light intensity distribution of each light spot will excite the corresponding pixels in the corresponding area to generate corresponding charge signals. By reading the signals of all pixels, the system reconstructs a digital image. Subsequently, image processing algorithms (such as centroid method, edge detection, template matching, etc.) are used to identify and locate the light spots in the image, and accurately calculate the position (X1, Y1) and (X2, Y2) of each light spot in the two-dimensional coordinate system. The relative relationship between the positions of the two light spots directly maps the relative angular deviation between the first pressure head 1 and the second pressure head 2. When the positions of the two light spots coincide, it indicates that the first pressure head 1 and the second pressure head 2 are relatively parallel.
[0051] Of course, in other embodiments, the detector can also be a quadrant detector. The reflected light spots of the first reflected beam 201 and the second reflected beam 202 illuminate the surface of the quadrant detector. When the positions of the two light spots coincide and are located in the center, the light energy received by the four quadrants is equal.
[0052] In one embodiment, the beam splitter is a beam splitter mirror 4, a polarizing beam splitter prism, or an optical fiber splitter and combiner.
[0053] For example, the beam splitter is a beam splitter 4. The beam splitter 4 uses an optical thin film on a specific substrate to achieve the reflection and transmission of the incident light beam in a predetermined ratio. The predetermined ratio is the ratio of reflection to transmission of the beam splitter 4, which is 50:50, but can also be 30:70 or 70:30. The beam splitter 4 is the most common beam splitting element, with clear reflection and transmission light path directions, and is relatively easy to assemble and adjust.
[0054] In other embodiments, the beam splitter can also be a polarizing beam splitter prism, which splits light based on polarization characteristics. It is typically composed of two right-angled prisms cemented together, with a polarizing beam splitting film coated on the inclined surface, capable of almost completely reflecting S-polarized light and transmitting P-polarized light. Alternatively, the beam splitter can also be an optical fiber splitter and combiner, which uses optical fiber couplers to split the input light from one optical fiber into multiple optical fibers, or conversely, to combine multiple beams.
[0055] In one embodiment, the first pressure head 1 and the second pressure head 2 are arranged opposite each other along a first direction, and the light source is arranged along a second direction perpendicular to the first direction. The parallelism deviation between the first pressure head 1 and the second pressure head 2 is caused by angular rotation around an axis perpendicular to the first direction. Setting the light source perpendicular to the first direction means that the propagation direction of the detection beam 100 is orthogonal to the relative motion direction of the first pressure head 1 and the second pressure head 2. This makes the change in the incident angle of the beam on the reflecting surface directly and uniquely caused by the tilt angle of the pressure head (i.e., the parallelism deviation), and independent of the relative displacement of the pressure head in the mold closing direction. The detection beam 100 intervenes from the side perpendicular to the mold closing motion, perfectly avoiding the stroke space of the pressure head's relative reciprocating motion in the first direction.
[0056] In one embodiment, the first reflecting surface is a first reflecting mirror 5 fixed to the first pressure head 1, and the second reflecting surface is a second reflecting mirror 6 fixed to the second pressure head 2. As independent optical elements, the reflectors' substrates and surface coatings can be optimally selected and precision-machined specifically for high reflectivity and high environmental tolerance to ensure high quality and high signal-to-noise ratio of the returned beam. Furthermore, they can be replaced individually and quickly without disassembling or replacing the entire pressure head, reducing maintenance costs and shortening downtime.
[0057] Furthermore, both the first reflector 5 and the second reflector 6 are high-precision planar reflectors with a silver-plated surface to ensure high quality and high signal-to-noise ratio of the returned beam.
[0058] Of course, in other embodiments, the first reflective surface may also be a first reflective plane formed on the surface of the first pressure head 1; the second reflective surface may also be a second reflective plane formed on the surface of the second pressure head 2.
[0059] In one embodiment, the beam splitter is fixed to the surface of the first pressure head 1 facing away from the second pressure head 2, and the first reflector 5 is located on the side of the beam splitter facing away from the light source. Specifically, the collimator 3 is fixed to the outer side of the first pressure head 1 and the second pressure head 2 along the second direction by a frame, the beam splitter 4 is fixed to the edge position of the surface of the first pressure head 1 facing away from the second pressure head 2, and the first reflector 5 is arranged perpendicular to the first pressure head 1.
[0060] By rigidly fixing the beam splitter 4 to the edge of the surface of the first pressure head 1, the tilt angle of the beam splitter 4 always changes synchronously with the attitude of the first pressure head 1, thus constructing an adaptive optical path system. When the first pressure head 1 tilts, the beam splitter 4 deflects at the same angle, thereby compensating in real time for the change in the original incident light path caused by the tilt of the first pressure head 1. This ensures that after the light beam emitted from the collimator 3 is reflected by the beam splitter 4, the first measurement beam 101 can continuously and stably illuminate the first reflecting mirror 5, and the second measurement beam 102 can continuously and stably illuminate the second reflecting mirror 6.
[0061] In one embodiment, the first pressure head 1 is provided with a light-transmitting channel 11, through which the second measuring beam 102 passes to the second reflecting surface. Since the first pressure head 1 is a solid component, and the detection beam 100 is incident from a second direction perpendicular to the first direction, it must penetrate the first pressure head 1 to reach the second reflecting mirror 6 of the second pressure head 2. The light-transmitting channel 11 allows the second measuring beam 102 to continuously pass through the first pressure head 1 in its working position without affecting the structural strength and function of the pressure head. This means that during the pressing process or leveling process, the parallelism detection unit can continuously monitor the relative parallelism of the first pressure head 1 and the second pressure head 2 without moving the pressure head or interrupting the pressing process. This non-contact, penetrating measurement method perfectly meets the needs of online real-time detection.
[0062] Specifically, the light-transmitting channel 11 is a through hole that passes through the first pressure head 1. Using a small-diameter through hole can minimize the weakening of the structural rigidity and strength of the first pressure head 1 while ensuring the passage of the second measurement beam 102. Applying a black matte finish to the inner wall of the through hole or designing it as an aperture structure can effectively suppress internal stray reflections and improve the signal-to-noise ratio.
[0063] Specifically, the aperture of the through-hole at the beam splitter 4 is smaller than the effective optical area of the beam splitter 4 used to receive the incident detection beam 100. The effective optical area of the beam splitter 4 is the core area coated with a precision optical thin film, and its edges are usually relatively fragile or have transition zones. A aperture smaller than this area means that the edge of the working area of the beam splitter 4 is blocked by the pressure head body; this effectively prevents stray light, dust, or contaminants that may enter from extreme angles from directly falling onto the edge of the working area of the beam splitter 4, reducing the risk of edge coating damage or contamination, and helping to maintain the long-term optical performance stability of the beam splitter 4.
[0064] Of course, in other embodiments, the light-transmitting channel 11 may also be a light-guiding component disposed within the first pressure head 1.
[0065] In one embodiment, the second reflector 6 is embedded and flush with the surface of the second pressure head 2 facing the first pressure head 1. The upper surface of the second pressure head 2 is the key process plane for performing the pressing function. Embedding the second reflector 6 and making its mirror surface strictly flush with this process surface means that the reflection reference plane for optical measurement and the process reference plane for physical pressing are completely coincident in three-dimensional space. This design fundamentally eliminates systematic errors such as assembly errors, thermal deformation differences, or inconsistent mechanical deformation that may be introduced due to the separation of the measurement reference plane and the working reference plane. At the same time, the flush embedded design eliminates the physical encroachment of the second reflector 6 on the working space of the second pressure head 2. During the pressing process, the first pressure head 1 can move unimpeded to a position that is infinitely close to or even in contact with the surface of the second pressure head 2 without interfering with the second reflector 6.
[0066] The working principle of the pressure head device provided in this embodiment is as follows: The collimator 3 emits a detection beam 100. After passing through the beam splitter 4, the detection beam 100 is split into a first measurement beam 101 and a second measurement beam 102. The first measurement beam 101 passes through the beam splitter 4 and reaches the first reflecting mirror 5. The second measurement beam 102 passes through the light transmission channel 11 and reaches the second reflecting mirror 6. The first reflected beam 201 reflected in the reverse direction by the first reflecting mirror 5 and the second reflected beam 202 reflected in the reverse direction by the second reflecting mirror 6 both return to the collimator 3. The first reflected beam 201 provides feedback on the plane angle of the first pressure head 1, and the second reflected beam 202 provides feedback on the plane angle of the second pressure head 2. The CCD camera inside the collimator 3 receives the first reflected beam 201 and the second reflected beam 202, images them, and forms a crosshair spot. By observing the two crosshair spots received by the CCD camera inside the collimator 3, the relative positional relationship between the first pressure head 1 and the second pressure head 2 is obtained. When the two crosshair spots coincide, it indicates that the first pressure head 1 and the second pressure head 2 are relatively parallel.
[0067] This embodiment also provides a bonding machine, including the above-mentioned pressure head device, and a leveling mechanism 300 for adjusting the posture of the first pressure head 1 and / or the second pressure head 2.
[0068] In one embodiment, the first pressure head 1 is connected to the first connecting rod 401, and the second pressure head 2 is connected to the second connecting rod 402. A leveling mechanism 300 is disposed between the first pressure head 1 and the first connecting rod 401 to adjust the posture of the first pressure head 1 relative to the first connecting rod 401. During parallelism detection, the operator or control unit drives the leveling mechanism 300 to change the levelness of the first pressure head 1 based on the relative positions of the two crosshair spots within the collimator 3, and observes the changes in the spot positions in real time. When the two crosshair spots completely overlap on the image plane, it indicates that the first pressure head 1 and the second pressure head 2 have reached an ideal state of relative parallelism.
[0069] It is understood that the position of the leveling mechanism 300 is not fixed. In an alternative embodiment, the leveling mechanism 300 can be positioned between the second pressure head 2 and the second connecting rod 402, and parallelism with the first pressure head 1 can be achieved by adjusting the posture of the second pressure head 2; alternatively, independent leveling mechanisms 300 can be provided at the first pressure head 1 and the second pressure head 2 respectively, and the parallelism can be adjusted finely and quickly by coordinating the postures of the two.
[0070] The leveling mechanism 300 can employ a servo motor or a stepper motor, which drives a high-precision ball screw or wedge mechanism via a reducer to move the pressure head support point. The control unit calculates and outputs drive signals to each servo motor or stepper motor based on the spot position deviation, achieving automatic leveling. In other embodiments, the leveling mechanism 300 includes a connection structure where a ball head and a spherical crown engage. One end of the ball head is connected to the first connecting rod 401, and the other end is connected to the first pressure head 1. A servo motor or stepper motor drives the first pressure head 1, and leveling is achieved through the relative rotation of the ball head and the spherical crown.
[0071] The bonding machine provided in this embodiment integrates the aforementioned pressure head device with online, real-time parallelism detection function with the leveling mechanism 300, constructing a complete "detection-feedback-execution" closed-loop control system. This not only achieves automated real-time monitoring of pressure head parallelism, but more importantly, it can instantly drive the leveling mechanism 300 to perform dynamic compensation and correction based on the monitoring results. Thus, with no or minimal human intervention, the parallelism accuracy required for the bonding process is guaranteed automatically throughout the entire process; significantly improving the intelligence level, process stability, and product yield consistency of the bonding machine.
[0072] The above description is only a preferred embodiment of the present invention. For those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of the present invention. The content of this specification should not be construed as a limitation of the present invention.
Claims
1. A pressure head device, characterized in that, include: A first pressure head (1) and a second pressure head (2) are arranged opposite to each other along a first direction. The first pressure head (1) is provided with a first reflective surface, and the second pressure head (2) is provided with a second reflective surface. The parallelism detection unit includes a light source, a beam splitter, and a detector. The beam splitter is disposed in the optical path of the light source and is used to receive the same detection beam (100) from the light source and split the detection beam (100) into a first measurement beam (101) and a second measurement beam (102). The first measurement beam (101) points to the first reflecting surface, and the second measurement beam (102) points to the second reflecting surface. The light source is disposed along a second direction perpendicular to the first direction. The first reflective surface can reflect the first measuring beam (101) in reverse along the original path. The first pressure head (1) is provided with a light-transmitting channel (11). The second measuring beam (102) passes through the light-transmitting channel (11) and reaches the second reflective surface. The second reflective surface can reflect the second measuring beam (102) in reverse along the original path. The detector is configured to simultaneously receive and compare the first reflected beam (201) reflected in reverse by the first reflecting surface and the second reflected beam (202) reflected in reverse by the second reflecting surface, and determine the relative parallelism of the first pressure head (1) and the second pressure head (2) based on the difference in the optical path states of the first reflected beam (201) and the second reflected beam (202).
2. The pressure head device according to claim 1, characterized in that, The light source and the detector are integrated in the collimator (3), and the detection beam (100) is a collimated beam.
3. The pressure head device according to claim 2, characterized in that, The detector is a visual sensor or a quadrant detector.
4. The pressure head device according to claim 1 or 2, characterized in that, The beam splitter is a beam splitter (4), a polarizing beam splitter prism, or an optical fiber splitter and combiner.
5. The pressure head device according to claim 1 or 2, characterized in that, The first reflective surface is a first reflective mirror (5) fixed on the first pressure head (1), and the second reflective surface is a second reflective mirror (6) fixed on the second pressure head (2).
6. The pressure head device according to claim 5, characterized in that, The beam splitter is fixed to the surface of the first pressure head (1) away from the second pressure head (2), and the first reflector (5) is located on the side of the beam splitter away from the light source.
7. The pressure head device according to claim 5, characterized in that, The second reflector (6) is embedded and flush with the surface of the second pressure head (2) facing the first pressure head (1).
8. The pressure head device according to claim 7, characterized in that, The light-transmitting channel (11) is a through hole that passes through the first pressure head (1).
9. A bonding machine, characterized in that, It includes the pressure head device as described in any one of claims 1-8, and a leveling mechanism (300) for adjusting the posture of the first pressure head (1) and / or the second pressure head (2).
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