Spindle fault detection method

Abstract

The application discloses a main shaft fault detection method, which is used for fault detection through a main shaft fault detection device. The method comprises the following steps: collecting a plurality of voltage signals of an encoder of a main shaft to be detected, and generating a test curve according to the voltage signals; wherein the voltage signals comprise S-channel voltage signals, C-channel voltage signals and Z-channel voltage signals; determining output test data corresponding to the encoder according to the plurality of voltage signals; wherein the output test data comprises at least one of bias data, phase data, amplitude data and deviation data; and determining a fault detection result corresponding to the main shaft to be detected according to the output test data or the test curve. The method can directly detect the state of the main shaft through the encoder signals, does not need to disassemble the main shaft or rely on large professional instruments, is convenient for on-site rapid diagnosis of main shaft related faults, and reduces the difficulty and time cost of troubleshooting of the main shaft faults. The application can be widely applied in the field of industrial technology.

Description

Technical Field

[0001] This application relates to the field of industrial technology, and in particular to a spindle fault detection method. Background Technology

[0002] In industrial manufacturing, machine tools are often referred to as "mother machines." During operation, machine tools require the coordinated function of their systems, drives, spindles, and peripheral components. Abnormalities such as system alarms and poor machining results frequently occur. Because the machine tool system, drives, and spindles are closely interconnected, troubleshooting and maintenance when alarms or abnormalities occur can be complex. Causes of system alarms may include incorrect system parameters, abnormal wiring, signal interference, spindle malfunction, and encoder malfunction. Poor machining results may be caused by mismatched system parameters, excessive spindle vibration, poor spindle encoder accuracy, poor spindle signal, or spindle malfunction. To determine the cause of these abnormalities, technicians often need to troubleshoot step-by-step, frequently requiring disassembly of the spindle for inspection. Disassembly is difficult and can easily damage other components. The troubleshooting methods are complex, challenging, and time-consuming, resulting in significant downtime and disruption to production.

[0003] In related technologies, troubleshooting the aforementioned problems typically requires large, specialized equipment such as oscilloscopes and dynamic balancing machines for accurate diagnosis. However, these devices are often bulky, difficult to carry, and require independent power supplies, making them challenging to use on-site in factories. Furthermore, they require manual adjustment and measurement, making operation complex and inconvenient for maintenance and testing. Some technical solutions use instruments like multimeters for testing, which are portable but have limited testing capabilities and struggle to pinpoint the root cause of the problem. Especially in spindle accuracy inspection, multimeters are completely ineffective, rendering them highly impractical. When dealing with issues such as rusted or worn encoder discs, spindle malfunctions, and excessive spindle runout, current inspection methods require technicians to disassemble the spindle from the machine tool for concentricity and dynamic balancing tests. Simultaneously, the spindle needs to be disassembled, the encoder disc removed, and its appearance inspected using a magnifying glass to check for tooth profile compliance, rust, and wear. After these tests, the spindle must be reassembled for another round of concentricity and dynamic balancing before being reinserted into the machine tool. This process is complex, highly repetitive, time-consuming, and costly.

[0004] In summary, the problems with the relevant technologies urgently need to be addressed. Summary of the Invention

[0005] The purpose of this application is to at least partially solve one of the technical problems existing in the related art.

[0006] Therefore, one objective of the embodiments of this application is to provide a spindle fault detection method.

[0007] To achieve the above-mentioned technical objectives, the technical solutions adopted in the embodiments of this application include: On one hand, embodiments of this application provide a spindle fault detection method for fault detection using a spindle fault detection device, the method comprising: Multiple voltage signals from the encoder of the spindle under test are acquired, and a test curve is generated based on the voltage signals; wherein, the voltage signals include S-channel voltage signals, C-channel voltage signals, and Z-channel voltage signals; Based on the multiple voltage signals, the corresponding output test data of the encoder is determined; wherein, the output test data includes at least one of bias data, phase data, amplitude data, and deviation data; Based on the output test data or the test curve, determine the fault detection result corresponding to the spindle to be tested.

[0008] In addition, the spindle fault detection method according to the above embodiments of this application may also have the following additional technical features: Furthermore, in one embodiment of this application, determining the output test data corresponding to the encoder based on the multiple voltage signals includes: Continuously acquire multiple voltage data points on each voltage signal, and determine the maximum and minimum voltage values ​​among the multiple voltage data points; The initial bias data is determined based on the maximum voltage value and the minimum voltage value; Based on the initial bias data, the period and initial phase of the voltage signal are determined; The bias data and the amplitude data are determined based on the voltage data of each voltage signal over multiple cycles. The phase data and the deviation data are determined based on the voltage data of the voltage signals from different paths over multiple cycles.

[0009] Furthermore, in one embodiment of this application, determining the period of the voltage signal based on the initial bias data includes: The system detects a first time point when the voltage data on the voltage signal first changes from less than the initial bias data to greater than the initial bias data, and a second time point when the voltage data on the voltage signal changes from less than the initial bias data to greater than the initial bias data for the second time. The period of the voltage signal is determined based on the difference between the second time point and the first time point.

[0010] Furthermore, in one embodiment of this application, determining the fault detection result corresponding to the spindle under test based on the output test data or the test curve includes: The fault detection result corresponding to the spindle under test is determined by comparing the standard curve and the test curve. Based on the magnitude of the output test data, the fault detection result corresponding to the spindle to be tested is determined.

[0011] Furthermore, in one embodiment of this application, the method further includes: While the spindle under test is rotating continuously, first test data corresponding to the multiple voltage signals are determined; Based on the first test data, determine the fluctuation test data corresponding to the encoder; Based on the fluctuation test data, the fault detection result corresponding to the spindle to be tested is determined.

[0012] Further, in one embodiment of this application, determining the fluctuation test data corresponding to the encoder based on the first test data includes: Using the Z-channel voltage signal of the encoder as a reference, the number of rotations of the spindle to be detected and the signal period within each rotation are determined. Based on the first test data, calculate the amplitude data, bias data, and phase data corresponding to each signal period; Based on the changes in amplitude data, bias data, and phase data during the multiple-turn signal cycle, amplitude fluctuation data, bias fluctuation data, and phase fluctuation data are generated.

[0013] Furthermore, in one embodiment of this application, the spindle fault detection device includes: Housing, display screen, input interface, power module, and circuit board; The input interface is located on one side of the housing, the display screen is located on the surface of the housing, and the power module and the circuit board are located inside the housing. The input interface is used to receive the encoder signal from the spindle under test and transmit the encoder signal to the circuit board. The circuit board includes a microprocessor circuit, a power supply circuit, a sampling circuit, and a communication circuit. The input terminal of the power supply circuit is connected to the power module, and the output terminal of the power supply circuit is used to supply power to the display screen, the microprocessor circuit, the sampling circuit, and the communication circuit. The sampling circuit is connected to the input interface and the microprocessor circuit and is used to transmit the encoder signal to the microprocessor circuit for processing. The microprocessor circuit is connected to the communication circuit and the display screen. The display screen is used to display the detection result of the encoder signal of the spindle under test, and the detection result includes test data and test curves.

[0014] Furthermore, in one embodiment of this application, the power module includes a power interface and a rechargeable battery. The input terminal of the power interface is used to connect to an external power source, and the output terminal of the power interface is connected to the rechargeable battery and the power supply circuit.

[0015] Furthermore, in one embodiment of this application, the sampling circuit includes a two-to-one switching chip and a differential operation circuit; The input terminal of the two-to-one switch chip is used to receive the encoder signal, the output terminal of the two-to-one switch chip is connected to the input terminal of the differential operation circuit, and the output terminal of the differential operation circuit is connected to the microprocessor circuit.

[0016] Furthermore, in one embodiment of this application, the differential operation circuit includes a first signal input port, a second signal input port, a signal output port, a thirteenth resistor, a fourteenth resistor, a fifteenth resistor, a sixteenth resistor, a seventeenth resistor, an eighteenth resistor, a nineteenth resistor, a twentieth resistor, an IC chip, and a fourteenth capacitor; The first signal input port is connected to the first end of the sixteenth resistor and the first end of the thirteenth resistor. The second end of the thirteenth resistor is connected to the first end of the fourteenth resistor and the second pin of the IC chip. The second end of the fourteenth resistor is connected to the signal output port and the first pin of the IC chip. The second signal input port is connected to the second end of the sixteenth resistor and the first end of the fifteenth resistor. The second end of the fifteenth resistor is connected to the third pin of the IC chip and the first end of the seventeenth resistor. The fourth pin of the IC chip is grounded. The second end of the seventeenth resistor is connected to the seventh pin of the IC chip, the first end of the twentieth resistor, and the first end of the fourteenth capacitor. The second end of the twentieth resistor and the second end of the fourteenth capacitor are connected to the sixth pin of the IC chip. The eighth pin of the IC chip is connected to the power supply. The fifth pin of the IC chip is connected to the first end of the eighteenth resistor and the first end of the nineteenth resistor. The second end of the eighteenth resistor is connected to the power supply. The second end of the nineteenth resistor is grounded.

[0017] The advantages and beneficial effects of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application: This application discloses a spindle fault detection method for fault detection using a spindle fault detection device. The method includes: acquiring multiple voltage signals from the encoder of the spindle under test, and generating a test curve based on the voltage signals; wherein the voltage signals include S-channel voltage signals, C-channel voltage signals, and Z-channel voltage signals; determining the corresponding output test data of the encoder based on the multiple voltage signals; wherein the output test data includes at least one of bias data, phase data, amplitude data, and deviation data; and determining the fault detection result of the spindle under test based on the output test data or the test curve. This method can directly detect the spindle status through encoder signals without disassembling the spindle or relying on large professional instruments, facilitating rapid on-site diagnosis of spindle-related faults and reducing the difficulty and time cost of troubleshooting spindle faults. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the following description is provided with accompanying drawings of the relevant technical solutions in the embodiments of this application or the prior art. It should be understood that the accompanying drawings described below are only for the purpose of clearly illustrating some embodiments of the technical solutions in this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a spindle fault detection device provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a circuit board provided in an embodiment of this application; Figure 3 This is a schematic diagram of a power supply circuit provided in an embodiment of this application; Figure 4 This is a schematic diagram of a sampling circuit provided in an embodiment of this application; Figure 5 This is a flowchart illustrating a spindle fault detection method provided in an embodiment of this application. Figure 6 This is a schematic diagram of the user interface of a spindle fault detection device provided in the embodiments of this application; Figure 7 This is a schematic diagram of the user interface of another spindle fault detection device provided in the embodiments of this application. Detailed Implementation

[0020] The present application will be further described below with reference to the accompanying drawings and specific embodiments. The described embodiments should not be considered as limitations on the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0021] In the following description, references are made to “some embodiments,” which describe a subset of all possible embodiments. However, it is understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0023] In industrial manufacturing, machine tools are often referred to as "mother machines." During operation, machine tools require the coordinated function of their systems, drives, spindles, and peripheral components. Abnormalities such as system alarms and poor machining results frequently occur. Because the machine tool system, drives, and spindles are closely interconnected, troubleshooting and maintenance when alarms or abnormalities occur can be complex. Causes of system alarms may include incorrect system parameters, abnormal wiring, signal interference, spindle malfunction, and encoder malfunction. Poor machining results may be caused by mismatched system parameters, excessive spindle vibration, poor spindle encoder accuracy, poor spindle signal, or spindle malfunction. To determine the cause of these abnormalities, technicians often need to troubleshoot step-by-step, frequently requiring disassembly of the spindle for inspection. Disassembly is difficult and can easily damage other components. The troubleshooting methods are complex, challenging, and time-consuming, resulting in significant downtime and disruption to production.

[0024] In related technologies, troubleshooting the aforementioned problems typically requires large, specialized equipment such as oscilloscopes and dynamic balancing machines for accurate diagnosis. However, these devices are often bulky, difficult to carry, and require independent power supplies, making them challenging to use on-site in factories. Furthermore, they require manual adjustment and measurement, making operation complex and inconvenient for maintenance and testing. Some technical solutions use instruments like multimeters for testing, which are portable but have limited testing capabilities and struggle to pinpoint the root cause of the problem. Especially in spindle accuracy inspection, multimeters are completely ineffective, rendering them highly impractical. When dealing with issues such as rusted or worn encoder discs, spindle malfunctions, and excessive spindle runout, current inspection methods require technicians to disassemble the spindle from the machine tool for concentricity and dynamic balancing tests. Simultaneously, the spindle needs to be disassembled, the encoder disc removed, and its appearance inspected using a magnifying glass to check for tooth profile compliance, rust, and wear. After these tests, the spindle must be reassembled for another round of concentricity and dynamic balancing before being reinserted into the machine tool. This process is complex, highly repetitive, time-consuming, and costly.

[0025] In view of this, this application provides a spindle fault detection device, including a housing, a display screen, an input interface, a power module, and a circuit board. The input interface is used to receive the encoder signal from the spindle under test and transmit it to the circuit board. The circuit board integrates a microprocessor circuit, a power supply circuit, a sampling circuit, and a communication circuit. The power supply circuit distributes the power from the power module to each component. The sampling circuit sends the encoder signal to the microprocessor circuit for analysis and processing. The microprocessor circuit transmits the processing results to the display screen via the communication circuit for display. The detection results include test data and test curves. This device can directly detect the spindle status through the encoder signal without disassembling the spindle or relying on large professional instruments, facilitating rapid on-site diagnosis of spindle-related faults and reducing the difficulty and time cost of troubleshooting spindle faults.

[0026] This application also provides a spindle fault detection method based on the aforementioned spindle fault detection device. The spindle fault detection device described in this application will be explained and illustrated below.

[0027] Reference Figure 1 In this embodiment of the application, the spindle fault detection device mainly includes: 1. Housing; 2. Display screen; 3. Input interface; 4. Power module and circuit board; The input interface is located on one side of the housing, the display screen is located on the surface of the housing, and the power module and the circuit board are located inside the housing. The input interface is used to receive the encoder signal from the spindle under test and transmit the encoder signal to the circuit board. The circuit board includes a microprocessor circuit, a power supply circuit, a sampling circuit, and a communication circuit. The input terminal of the power supply circuit is connected to the power module, and the output terminal of the power supply circuit is used to supply power to the display screen, the microprocessor circuit, the sampling circuit, and the communication circuit. The sampling circuit is connected to the input interface and the microprocessor circuit and is used to transmit the encoder signal to the microprocessor circuit for processing. The microprocessor circuit is connected to the communication circuit and the display screen. The display screen is used to display the detection result of the encoder signal of the spindle under test, and the detection result includes test data and test curves.

[0028] In this application embodiment, a spindle fault detection device is provided, such as... Figure 1As shown, the overall design can be configured as a test box, including components such as a housing, display screen, input interface, power module, and circuit board. The housing serves as the external structure, housing and protecting the internal components, ensuring durability and ease of portability and use in the field. The display screen, located on the surface of the housing, acts as the human-machine interface, visually displaying the test results processed by the microprocessor circuitry. These results may include specific test data (such as waveform frequency and amplitude) and dynamic test curves (such as encoder signal waveforms), but are not limited to these. The input interface, located on one side of the housing, is the critical signal input channel for the testing equipment. It can be specifically used to connect the encoder signal line of the spindle under test (for example, directly connecting to the corresponding female connector of the encoder), thereby introducing the encoder signal into the equipment for analysis. The power module, built into the housing, provides operating power to the entire device. It is typically powered by a battery or an external adapter to meet the needs of portable field use.

[0029] In this embodiment, the circuit board is the core component of the spindle fault detection device. It is located inside the housing and integrates multiple functional circuits. Please refer to... Figure 2 , Figure 2 This illustration shows a schematic diagram of a circuit board provided in an embodiment of this application. It may include a microprocessor circuit, a power supply circuit, a sampling circuit, and a communication circuit. The microprocessor circuit is responsible for receiving signals and performing core calculations and analysis; it is the computing and processing center of the device. The sampling circuit is connected to the input interface and is responsible for receiving and initially conditioning the encoder signals before transmitting them to the microprocessor circuit. The power supply circuit is connected to the power module, which converts, stabilizes, and distributes its output voltage to various components such as the display screen, microprocessor circuit, and sampling circuit to provide overall power to the device. The communication circuit can be used to connect to an external terminal via communication interface 5 for data transmission, converting detection results into report outputs. The components on the circuit board work together to achieve convenient and rapid acquisition and analysis of the spindle encoder signals.

[0030] In some embodiments, the spindle fault detection device may also include other components, such as Figure 1 The switch 6 shown can be used to control the start and stop of the equipment. Of course, those skilled in the art can flexibly adjust the component settings of the spindle fault detection equipment according to specific needs, and this application does not impose any limitations on this.

[0031] It is understood that the spindle fault detection device provided in this application embodiment includes a housing, a display screen, an input interface, a power module, and a circuit board. The input interface is used to receive the encoder signal from the spindle under test and transmit it to the circuit board. The circuit board integrates a microprocessor circuit, a power supply circuit, a sampling circuit, and a communication circuit. The power supply circuit distributes the power from the power module to each component. The sampling circuit sends the encoder signal to the microprocessor circuit for analysis and processing. The microprocessor circuit transmits the processing results to the display screen via the communication circuit for display. The detection results include test data and test curves. This device can directly detect the spindle status through the encoder signal without disassembling the spindle or relying on large professional instruments, facilitating rapid on-site diagnosis of spindle-related faults and reducing the difficulty and time cost of troubleshooting spindle faults.

[0032] Specifically, in some embodiments, the power module includes a power interface 4 and a rechargeable battery. The input end of the power interface is used to connect to an external power source, and the output end of the power interface is connected to the rechargeable battery and the power supply circuit.

[0033] In this embodiment, the power module can be designed as a flexible power supply solution, comprising both a power interface and a rechargeable battery. The input end of the power interface connects to an external power adapter to introduce external power. The output end of the power interface has a dual function: firstly, it connects directly to the power supply circuit, providing the device with the necessary operating power; secondly, it connects to the rechargeable battery, simultaneously charging the built-in rechargeable battery when an external power source is connected. This design allows the device to operate for extended periods in locations with a fixed power supply, while also enabling portable mobile use via battery energy storage, effectively meeting the power supply needs of various working conditions in a factory setting and enhancing the device's practicality and convenience.

[0034] Specifically, in some embodiments, the power supply circuit includes a power supply protection circuit, a battery charging and discharging circuit, an automatic power switching circuit, and a power conversion circuit.

[0035] In this embodiment, the power supply circuit may include a power supply protection circuit, a battery charging and discharging circuit, an automatic power switching circuit, and a power conversion circuit. For example, please refer to... Figure 3 , Figure 3 A schematic diagram of a power supply circuit provided in an embodiment of this application is shown. For example... Figure 3As shown in this embodiment, the power supply circuit can form an overvoltage and undervoltage protection circuit using a Zener diode Z1 and switching transistors Q1 and Q2. When the voltage is normal, the Zener diode Z1 is off, Q1 and Q2 conduct normally, and the output is normal. When the voltage is too high, the Zener diode conducts, Q1 is off, and the output is disconnected. When the voltage is too low, Q2 is off, providing a stable voltage to the battery charging and discharging circuit. The battery and external power supply are automatically selected by transistor Q3. When there is an external power supply VCC_IN, Q3 is off, and the external power supply is used. When the external power supply VCC_IN is off, Q3 conducts, and the battery supplies power. D2 and D4 are used to isolate the external power supply and the battery, preventing the battery from supplying power to the external power supply or the external power supply from directly supplying power to the battery. Switch KEY is used to turn the circuit on and off. Chip U2 limits the output of the subsequent circuit through a voltage divider using resistors R10 and R12 to prevent the battery from being over-discharged. The power conversion circuit converts the power supply to the standard power required internally.

[0036] Specifically, in some embodiments, the sampling circuit includes a two-to-one switching chip and a differential operation circuit; The input terminal of the two-to-one switch chip is used to receive the encoder signal, the output terminal of the two-to-one switch chip is connected to the input terminal of the differential operation circuit, and the output terminal of the differential operation circuit is connected to the microprocessor circuit.

[0037] Please refer to Figure 4 , Figure 4 A schematic diagram of a sampling circuit provided in an embodiment of this application is shown, such as... Figure 4 As shown, the sampling circuit may include a two-to-one switch chip and a differential operation circuit, wherein the differential operation circuit includes a first signal input port, a second signal input port, a signal output port, a thirteenth resistor, a fourteenth resistor, a fifteenth resistor, a sixteenth resistor, a seventeenth resistor, an eighteenth resistor, a nineteenth resistor, a twentieth resistor, an IC chip, and a fourteenth capacitor. The first signal input port is connected to the first end of the sixteenth resistor and the first end of the thirteenth resistor. The second end of the thirteenth resistor is connected to the first end of the fourteenth resistor and the second pin of the IC chip. The second end of the fourteenth resistor is connected to the signal output port and the first pin of the IC chip. The second signal input port is connected to the second end of the sixteenth resistor and the first end of the fifteenth resistor. The second end of the fifteenth resistor is connected to the third pin of the IC chip and the first end of the seventeenth resistor. The fourth pin of the IC chip is grounded. The second end of the seventeenth resistor is connected to the seventh pin of the IC chip, the first end of the twentieth resistor, and the first end of the fourteenth capacitor. The second end of the twentieth resistor and the second end of the fourteenth capacitor are connected to the sixth pin of the IC chip. The eighth pin of the IC chip is connected to the power supply. The fifth pin of the IC chip is connected to the first end of the eighteenth resistor and the first end of the nineteenth resistor. The second end of the eighteenth resistor is connected to the power supply. The second end of the nineteenth resistor is grounded.

[0038] In this embodiment, a subtraction circuit composed of an integrated operational amplifier IC chip U1 can be used to receive differential signals. Its signal input terminals can be connected to two-to-one switch chips U2 and U3. When 1W_EN is low, S+ and S- are input; when 1W_EN is high, S+ and S- are input through a resistor divider, used to select different input voltages. Then, after passing through the differential operation circuit, one end of the circuit is raised through the eighteenth resistor R18 and the nineteenth resistor R19, thereby obtaining a single-ended voltage that the microprocessor circuit can process, which is then placed in three channels. Figure 4 The sampling circuit shown can obtain three output signals, S, C, and Z, which can be received by the microprocessor circuit.

[0039] In this embodiment, the microprocessor circuit can be used for program processing, transforming and processing the received three signals to obtain the spindle's test data and test curves. This information is then transmitted to the display screen for display, thereby realizing the output curve test function and fluctuation test function.

[0040] Reference Figure 5 , Figure 5 This is a flowchart illustrating a spindle fault detection method provided in an embodiment of this application, which includes, but is not limited to: Step 110: Acquire multiple voltage signals from the encoder of the spindle to be tested, and generate a test curve based on the voltage signals; wherein, the voltage signals include S-channel voltage signals, C-channel voltage signals, and Z-channel voltage signals; Step 120: Determine the output test data corresponding to the encoder based on the multi-channel voltage signals; wherein the output test data includes at least one of bias data, phase data, amplitude data, and deviation data; Step 130: Determine the fault detection result corresponding to the spindle to be tested based on the output test data or the test curve.

[0041] In this embodiment of the application, a spindle fault detection method is also provided, which can perform fault detection based on the aforementioned spindle fault detection equipment. Specifically, in step 110, multiple voltage signals output by the encoder of the spindle to be tested can be acquired. These signals typically include S-channel (sine / A-phase), C-channel (cosine / B-phase), and Z-channel (zero-position reference) signals, and an intuitive test curve is generated based on these raw voltage signals.

[0042] Subsequently, in step 120, the acquired multi-channel voltage signals are analyzed in depth to calculate key output test data for evaluating encoder performance. This data may include one or more of the following: bias data reflecting the DC component of the signal, phase data verifying the synchronicity between sine and cosine signals, amplitude data characterizing signal strength, and deviation data measuring signal waveform distortion. In step 130, the quantized output test data calculated in step 120 is combined with the visualized test curve generated in step 110, and compared with standard values ​​or ideal conditions to comprehensively judge and determine the specific fault detection result of the spindle under test, such as whether there is encoder damage, signal interference, poor installation concentricity, or encoder disk contamination. This method, through a signal acquisition-data analysis-comprehensive diagnosis process, achieves rapid and accurate diagnosis of the spindle status, locating faults without disassembly.

[0043] For example, please refer to Figure 6 , Figure 6 This illustration shows a user interface diagram of a spindle fault detection device provided in an embodiment of this application, such as... Figure 6 As shown in this embodiment, the display screen of the spindle fault detection device can display a relevant user interface, the upper part of which displays the measurement results of the key parameters of the encoder. These values ​​are the direct basis for diagnosing faults and may include: S-bias / amplitude and C-bias / amplitude, which correspond to the bias data and amplitude data of the S-channel (sine) and C-channel (cosine) signals, respectively, and are used to determine whether the signal strength is normal and whether there is attenuation. Figure 6 In the middle section, the P phase is displayed as 90 degrees, indicating that the phase difference between the S and C signals is normal. The Z offset / size / width corresponds to the characteristic parameters of the Z-channel (zero position) signal. The lower part can visually present the above parameters as waveform curves: the red waveform represents the S-channel signal, the green waveform represents the C-channel signal, and the blue waveform represents the Z-channel signal.

[0044] Specifically, in some embodiments, determining the output test data corresponding to the encoder based on the multiple voltage signals includes: Continuously acquire multiple voltage data points on each voltage signal, and determine the maximum and minimum voltage values ​​among the multiple voltage data points; The initial bias data is determined based on the maximum voltage value and the minimum voltage value; Based on the initial bias data, the period and initial phase of the voltage signal are determined; The bias data and the amplitude data are determined based on the voltage data of each voltage signal over multiple cycles. The phase data and the deviation data are determined based on the voltage data of the voltage signals from different paths over multiple cycles.

[0045] In this embodiment, when calculating key output test data from the original voltage signal, each signal (S-channel, C-channel, Z-channel) can be continuously sampled to obtain multiple voltage points. The maximum and minimum values ​​are then identified, and the initial bias of the signal, i.e., the DC component, is calculated accordingly. Subsequently, this initial bias data is used to determine the signal's periodic characteristics and starting phase point. Based on this, statistical analysis is further performed on the voltage data of each signal over multiple consecutive periods, thereby accurately calculating the bias data used to evaluate signal stability and the amplitude data reflecting signal strength. Furthermore, by comparing and analyzing the data of the S-channel and C-channel signals over multiple periods, phase data to verify their synchronization and deviation data to measure the difference between the signal waveform and the ideal sine wave can be calculated. This embodiment, with its progressive calculation process from single-channel signal analysis to multi-channel signal comparison, achieves a comprehensive and quantitative evaluation of the encoder signal quality.

[0046] Specifically, in some embodiments, determining the period of the voltage signal based on the initial bias data includes: The system detects a first time point when the voltage data on the voltage signal first changes from less than the initial bias data to greater than the initial bias data, and a second time point when the voltage data on the voltage signal changes from less than the initial bias data to greater than the initial bias data for the second time. The period of the voltage signal is determined based on the difference between the second time point and the first time point.

[0047] This application provides a practical method for accurately calculating the period by detecting the zero-crossing point of a signal. The principle is as follows: the initial bias data can be considered as the "central axis" or zero-level reference line of the signal waveform. When determining the period, the numerical change of the voltage signal can be monitored in real time. When the signal voltage first jumps from below the initial bias data to above the initial bias data, the moment of crossing the "central axis" is recorded, i.e., the first time point. Subsequently, monitoring continues, and after the signal completes a full oscillation and crosses the "central axis" upwards again, the second time point is recorded. These two time points mark the start of one sine wave cycle and the start of the next cycle, respectively. Therefore, the time difference between them is the duration of a complete cycle of the voltage signal. In this application, the period is defined by identifying the intersection point of the signal and the reference line. The calculation is simple and direct, and can effectively and accurately determine the frequency characteristics of the signal.

[0048] In this embodiment of the application, when determining the fault detection result corresponding to the spindle to be tested based on the output test data or test curve, it can be determined by comparing the standard curve and the test curve, or by determining the magnitude of the output test data.

[0049] Specifically, in some embodiments, the method further includes: While the spindle under test is rotating continuously, first test data corresponding to the multiple voltage signals are determined; Based on the first test data, determine the fluctuation test data corresponding to the encoder; Based on the fluctuation test data, the fault detection result corresponding to the spindle to be tested is determined.

[0050] Specifically, in some embodiments, determining the fluctuation test data corresponding to the encoder based on the first test data includes: Using the Z-channel voltage signal of the encoder as a reference, the number of rotations of the spindle to be detected and the signal period within each rotation are determined. Based on the first test data, calculate the amplitude data, bias data, and phase data corresponding to each signal period; Based on the changes in amplitude data, bias data, and phase data during the multiple-turn signal cycle, amplitude fluctuation data, bias fluctuation data, and phase fluctuation data are generated.

[0051] In this embodiment, the measurement is not limited to a single measurement of the spindle in a stable state; the spindle under test can also be continuously operated while rotating continuously. During this period, the device can continuously acquire multiple voltage signals and calculate a series of continuous first test data (e.g., continuous bias, amplitude, phase, and other data sequences). Subsequently, the method analyzes the fluctuation test data of these key parameters during spindle operation based on this series of dynamically changing first test data (e.g., calculating their standard deviation, the difference between the maximum and minimum values, etc.). The fluctuation test data obtained here is also important because it reveals the stability of the spindle's performance under dynamic working conditions. A high-performance spindle should have stable encoder signal parameters with minimal fluctuations; however, if there are potential faults such as bearing wear, loose encoder disk installation, or poor dynamic balance, even if the static measurement parameters are normal, large parameter fluctuations will be observed during continuous rotation. Therefore, by analyzing the fluctuation test data, it is possible to diagnose more hidden fault types that only appear during dynamic operation, thereby obtaining more comprehensive fault detection results.

[0052] The spindle fault detection method of this application will be introduced and explained below with specific application examples: In this embodiment of the application, when performing fault detection on the spindle, output test function detection and fluctuation test function detection can be performed. The output test function interface is shown in the attached figure. Figure 6 As shown. The top part is the test data, and the bottom part is the test curve. The specific implementation method is as follows: By continuously acquiring the voltage of three signals (S, C, and Z), whenever 500 data points (based on the number of signal cycles and sampling cycles) are detected, the maximum and minimum values ​​of these 500 data points are calculated. The center value of the maximum and minimum values ​​is taken to obtain the initial bias data. After obtaining the initial bias data, the data is compared with the initial bias data one by one from the beginning. When the data passes through a period of being greater than the initial bias, then a period of being less than the initial bias, and then a period of being greater than the initial bias again, it indicates that a data acquisition cycle has been completed, thus obtaining the cycle data and the cycle start phase. By comparing the S and C signals, phase data can be obtained. When the period is greater than 2, the S bias data and C bias data can be obtained from the maximum and minimum values. By integrating the data from these periods, the S amplitude data and C amplitude data can be obtained. By comparing different signals, the deviation data can be obtained. The collected voltage data is plotted as a curve and displayed on the screen. By comparing with a standard curve, it can be determined whether the output waveform is clean and whether there is interference in the signal. When noise is present, it indicates that the alarm is caused by interference, and interference factors such as shielding and grounding can be directly checked. When the amplitude of any one channel is detected to be 0 or only half of the other signals, it indicates that there is a wiring error in that channel, and the alarm is caused by the wiring error. The wiring of that channel can be directly checked. When the bias data, deviation data are abnormal or there is no output signal, it indicates that the encoder is abnormal, and the alarm is caused by the encoder. The encoder performance can be directly checked.

[0053] The fluctuation test function interface is shown in the attached image. Figure 7 As shown. The top part is the test data, and the bottom part is the test curve. The specific implementation method is as follows: By continuously acquiring data during spindle rotation, whenever a Z-signal is detected, data such as S-amplitude, C-amplitude, S-bias, C-bias, phase, amplitude deviation, and bias deviation are collected. When the Z-signal is acquired again, it indicates that the spindle has rotated one revolution. The number of cycles in one revolution is confirmed using the above method, and the amplitude and bias data for each cycle are calculated. Using the amplitude data of each cycle as the ordinate, an amplitude fluctuation curve is obtained. The maximum deviation value is taken to obtain the amplitude fluctuation data. Data for another revolution is acquired in this way, and the bias data for each cycle in the two revolutions is compared. Using this data as the ordinate, an offset fluctuation curve is obtained, and the maximum deviation value is taken to obtain the offset fluctuation data. Comparing the number of cycles in two revolutions yields the offset fluctuation data. Comparing data from multiple revolutions yields the phase fluctuation curve, and the maximum phase fluctuation value is taken to obtain the phase fluctuation data. By observing different fluctuation curves and data, system fault points can be indirectly identified. If the deviation fluctuation is abnormal, it indicates that the number of cycles in the two revolutions is not equal, meaning the zero-position signal is not aligned. The system settings should be checked directly. When the signal offset fluctuation is abnormal, it is usually due to abnormal encoder tooth profile, causing distortion of the encoder output signal and resulting in abnormal output signal offset fluctuation. Problems such as missing, rusted, or damaged encoder teeth should be checked directly. When the signal amplitude fluctuation is abnormal, it is usually due to spindle runout, large offset, or misalignment, leading to abnormal encoder output signal amplitude and thus abnormal signal amplitude fluctuation. Problems such as shaft wobble and spindle concentricity should be checked directly. When the phase fluctuation is abnormal, it is usually due to abnormal encoder accuracy or excessive operating vibration, causing deviations in the data for each cycle. Problems such as encoder accuracy and spindle vibration should be checked directly.

[0054] It is understood that the spindle fault detection method provided in this application embodiment has at least the following advantages compared to currently available solutions: 1. This application can quickly and accurately locate spindle interference problems, wiring problems, and encoder malfunctions through output testing, enabling rapid troubleshooting of drive alarm issues and significantly reducing troubleshooting time and machine downtime for on-site testing personnel. 2. This application can accurately measure abnormalities such as abnormal parameter settings, spindle encoder disc malfunctions, encoder accuracy issues, large spindle runout, and excessive vibration through fluctuation testing, indirectly enabling rapid identification of the causes of machining defects. This avoids spindle disassembly and reduces damage to other components caused by spindle disassembly and disassembly, thereby lowering maintenance costs. 3. Compared with the oscilloscopes, multimeters, dynamic balancing machines and other tools currently used for troubleshooting, this application is characterized by its small size, simple operation, and high accuracy. It can help the field quickly find drive alarms and machining defects, better meet the application needs of the factory, and solve assembly and maintenance problems.

[0055] In some alternative embodiments, the functions / operations mentioned in the block diagrams may not occur in the order shown in the operation diagrams. For example, depending on the functions / operations involved, two consecutively shown blocks may actually be executed substantially simultaneously, or the blocks may sometimes be executed in reverse order. Furthermore, the embodiments presented and described in the flowcharts of this application are provided by way of example to provide a more comprehensive understanding of the technology. The disclosed methods are not limited to the operations and logic flows presented herein. Alternative embodiments are contemplated in which the order of various operations is changed and sub-operations described as part of a larger operation are executed independently.

[0056] Furthermore, although this application is described in the context of functional modules, it should be understood that, unless otherwise stated to the contrary, one or more of the functions and / or features may be integrated into a single physical device and / or software module, or one or more functions and / or features may be implemented in a separate physical device or software module. It is also understood that a detailed discussion of the actual implementation of each module is unnecessary for understanding this application. Rather, given the properties, functions, and internal relationships of the various functional modules in the apparatus disclosed herein, the actual implementation of the module will be understood within the scope of conventional technology for an engineer. Therefore, those skilled in the art can implement the application set forth in the claims using ordinary techniques without excessive experimentation. It is also understood that the specific concepts disclosed are merely illustrative and not intended to limit the scope of this application, which is determined by the full scope of the appended claims and their equivalents.

[0057] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0058] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-including system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device.

[0059] More specific examples (a non-exhaustive list) of computer-readable media include: electrical connections (electronic devices) having one or more wires, portable computer disk drives (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Furthermore, computer-readable media can even be paper or other suitable media on which programs can be printed, because programs can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in computer memory.

[0060] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0061] In the foregoing description of this specification, the references to terms such as "one embodiment," "another embodiment," or "some embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0062] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

[0063] The foregoing has provided a detailed description of the preferred embodiments of this application. However, this application is not limited to these embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this application. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application. In the description of this specification, the references to terms such as "one embodiment," "another embodiment," or "some embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0064] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A spindle fault detection method, characterized in that, The method for detecting faults using a spindle fault detection device includes: Multiple voltage signals from the encoder of the spindle under test are acquired, and a test curve is generated based on the voltage signals; wherein, the voltage signals include S-channel voltage signals, C-channel voltage signals, and Z-channel voltage signals; Based on the multiple voltage signals, the corresponding output test data of the encoder is determined; wherein, the output test data includes at least one of bias data, phase data, amplitude data, and deviation data; Based on the output test data or the test curve, determine the fault detection result corresponding to the spindle to be tested; The step of determining the output test data corresponding to the encoder based on the multiple voltage signals includes: Continuously acquire multiple voltage data points on each voltage signal, and determine the maximum and minimum voltage values ​​among the multiple voltage data points; The initial bias data is determined based on the maximum voltage value and the minimum voltage value; Based on the initial bias data, the period and initial phase of the voltage signal are determined; The bias data and the amplitude data are determined based on the voltage data of each voltage signal over multiple cycles. The phase data and the deviation data are determined based on the voltage data of the voltage signals from different paths over multiple cycles; Determining the period of the voltage signal based on the initial bias data includes: The system detects a first time point when the voltage data on the voltage signal first changes from less than the initial bias data to greater than the initial bias data, and a second time point when the voltage data on the voltage signal changes from less than the initial bias data to greater than the initial bias data for the second time. The period of the voltage signal is determined based on the difference between the second time point and the first time point; Determining the fault detection result corresponding to the spindle under test based on the output test data or the test curve includes: The fault detection result corresponding to the spindle under test is determined by comparing the standard curve and the test curve. Based on the magnitude of the output test data, the fault detection result corresponding to the spindle to be tested is determined.

2. The spindle fault detection method according to claim 1, characterized in that, The method further includes: While the spindle under test is rotating continuously, first test data corresponding to the multiple voltage signals are determined; Based on the first test data, determine the fluctuation test data corresponding to the encoder; Based on the fluctuation test data, the fault detection result corresponding to the spindle to be tested is determined.

3. The spindle fault detection method according to claim 2, characterized in that, The step of determining the fluctuation test data corresponding to the encoder based on the first test data includes: Using the Z-channel voltage signal of the encoder as a reference, the number of rotations of the spindle to be detected and the signal period within each rotation are determined. Based on the first test data, calculate the amplitude data, bias data, and phase data corresponding to each signal period; Based on the changes in amplitude data, bias data, and phase data during the multiple-turn signal cycle, amplitude fluctuation data, bias fluctuation data, and phase fluctuation data are generated.

4. The spindle fault detection method according to claim 1, characterized in that, The spindle fault detection device includes: Housing, display screen, input interface, power module, and circuit board; The input interface is located on one side of the housing, the display screen is located on the surface of the housing, and the power module and the circuit board are located inside the housing. The input interface is used to receive the encoder signal from the spindle under test and transmit the encoder signal to the circuit board. The circuit board includes a microprocessor circuit, a power supply circuit, a sampling circuit, and a communication circuit. The input terminal of the power supply circuit is connected to the power module, and the output terminal of the power supply circuit is used to supply power to the display screen, the microprocessor circuit, the sampling circuit, and the communication circuit. The sampling circuit is connected to the input interface and the microprocessor circuit and is used to transmit the encoder signal to the microprocessor circuit for processing. The microprocessor circuit is connected to the communication circuit and the display screen. The display screen is used to display the detection result of the encoder signal of the spindle under test, and the detection result includes test data and test curves.

5. The spindle fault detection method according to claim 4, characterized in that, The power module includes a power interface and a rechargeable battery. The input end of the power interface is used to connect to an external power source, and the output end of the power interface is connected to the rechargeable battery and the power supply circuit.

6. The spindle fault detection method according to claim 4, characterized in that, The sampling circuit includes a two-to-one switching chip and a differential operation circuit; The input terminal of the two-to-one switch chip is used to receive the encoder signal, the output terminal of the two-to-one switch chip is connected to the input terminal of the differential operation circuit, and the output terminal of the differential operation circuit is connected to the microprocessor circuit.

7. The spindle fault detection method according to claim 6, characterized in that, The differential operation circuit includes a first signal input port, a second signal input port, a signal output port, a thirteenth resistor, a fourteenth resistor, a fifteenth resistor, a sixteenth resistor, a seventeenth resistor, an eighteenth resistor, a nineteenth resistor, a twentieth resistor, an IC chip, and a fourteenth capacitor; The first signal input port is connected to the first end of the sixteenth resistor and the first end of the thirteenth resistor. The second end of the thirteenth resistor is connected to the first end of the fourteenth resistor and the second pin of the IC chip. The second end of the fourteenth resistor is connected to the signal output port and the first pin of the IC chip. The second signal input port is connected to the second end of the sixteenth resistor and the first end of the fifteenth resistor. The second end of the fifteenth resistor is connected to the third pin of the IC chip and the first end of the seventeenth resistor. The fourth pin of the IC chip is grounded. The second end of the seventeenth resistor is connected to the seventh pin of the IC chip, the first end of the twentieth resistor, and the first end of the fourteenth capacitor. The second end of the twentieth resistor and the second end of the fourteenth capacitor are connected to the sixth pin of the IC chip. The eighth pin of the IC chip is connected to the power supply. The fifth pin of the IC chip is connected to the first end of the eighteenth resistor and the first end of the nineteenth resistor. The second end of the eighteenth resistor is connected to the power supply. The second end of the nineteenth resistor is grounded.

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