A kind of starboard high-power component power output connector interconnection structure and starboard high-power component

Abstract

The application provides a kind of power output connector interconnection structure of spaceborne high-power assembly and spaceborne high-power assembly.The disclosed structure includes: cabinet, power output connector, circuit board, metal band.Cabinet is metal material, including side wall and bottom plate;Power output connector includes inner conductor and outer conductor with carrier, outer conductor is installed on side wall, inner conductor extends from side wall hole;The upper surface of circuit board is etched with microstrip line, and the microstrip line is used for transmitting radio frequency signal;Metal band middle part is interconnected with power output connector inner conductor, and the two tail ends of metal band are sunken and interconnected with the two sides of microstrip line on the circuit board, forming a circuit path.The power output connector interconnection method of the application reduces the maximum electric field strength of the interconnection point position and changes the direction, solves the problem that traditional interconnection mode is prone to local low-pressure discharge, improves the low-pressure discharge threshold, and has the advantages of high reliability, easy repair, etc.

Description

Technical Field

[0001] This invention relates to the field of high-power component assembly technology for satellite payloads, and particularly to a method for interconnecting power output connectors of spaceborne high-power components. Background Technology

[0002] In recent years, as communication satellites have developed towards wider bandwidth, higher power, and higher integration, the internal power capacity of microwave components has increased significantly. High-power solid-state amplifier circuits are the most critical weak link in supporting high power (typically above 10W). Influenced by the space environment, free electrons, and the gaseous environment of planetary surfaces, they are highly susceptible to micro-discharges and low-pressure discharges. During satellite operation in orbit, as high-power microwave components operate, the internal temperature of the power components gradually rises. Materials such as dielectric substrates and adhesives slowly release gas under the influence of space irradiation and the high temperature caused by high power, generating localized low-pressure environments during in-orbit operation. This can lead to low-pressure discharges, causing signal reflection and power reduction, or even catastrophic hard failures, directly resulting in in-orbit satellite failure that cannot be repaired on-orbit. This severely impacts the lifespan and reliability of spacecraft and restricts further increases in product power capacity.

[0003] In spaceborne high-power solid-state amplifier circuits, the interconnection junctions are weak points and risk points for electrical breakdown or discharge, and these locations are also critical points limiting power capacity. Currently, most spaceborne high-power solid-state amplifier interconnection junctions adopt an "O"-shaped metal strip soldering structure. Simulation results show that this structure generates a strong electric field pointing towards the circuit board on both sides of the bonding point between the metal strip and the microstrip line, making it highly susceptible to low-pressure discharge problems. Summary of the Invention

[0004] To address the deficiencies or shortcomings of existing technologies, this invention provides an interconnection structure for a power output connector of a spaceborne high-power component. The spaceborne high-power component includes a housing and a circuit board. The circuit board is installed inside the housing and has a microstrip line on it. The power output connector includes an outer conductor and an inner conductor carrying a dielectric material that are interconnected. The power output connector is installed on the side wall of the housing, and the inner conductor passes through the side wall and is located inside the housing, while being located above the microstrip line and having a distance between it and the microstrip line. The outer conductor carrying the dielectric material is located on the side wall of the housing.

[0005] The interconnection structure of the present invention is characterized by the inner conductor and the microstrip line being connected by a metal strip, with the middle part of the metal strip along its length direction being connected to the inner conductor as a middle connection point. At the same time, the length direction of the metal strip is perpendicular to the axis of the inner conductor, and the two ends of the metal strip are sunk and connected to the microstrip line as end connection points, forming a circuit path. Furthermore, the metal strip between the middle connection point and the end connection point is sunk in an arc shape.

[0006] Alternatively, the length direction of the microstrip line is perpendicular to the length direction of the metal strip, and the two connection points of the metal strip and the microstrip line are respectively located at both ends of a width direction of the microstrip line.

[0007] Alternatively, the metal strip is a gold strip or a copper strip.

[0008] Alternatively, the inner conductor and the microstrip line are connected by multiple metal strips, and the multiple metal strips are sequentially distributed along the axial direction of the inner conductor, with a distance left between adjacent metal strips.

[0009] Alternatively, the inner conductor and the microstrip line are connected by 1, 2 or 3 metal strips.

[0010] Alternatively, the distance L1 between the metal strip and the edge of the circuit board in the axial direction of the inner conductor is 0.1 - 5 mm.

[0011] Alternatively, the horizontal distance P between the middle connection point and the end connection point of the metal strip is the inner conductor radius + 1.1 - 2.5 mm.

[0012] Alternatively, the dimension L2 of the end connection point in the length direction of the metal strip is 0.2 - 1.5 mm.

[0013] The present invention also provides a method for interconnecting the power output joints of a spaceborne high-power component. The method uses the above interconnecting structure to interconnect the spaceborne high-power component and the power output joint, and includes the following steps: Step 1, assemble the circuit board, the power output joint and the casing to form an assembled component; Step 2, clean the inner conductor, the microstrip line and the metal strip, and dry them; Step 3, use a parallel gap resistance welder to weld the metal strip. Place the metal strip on the inner conductor, with the length direction of the metal strip perpendicular to the axial direction of the inner conductor, and press-weld the middle part of the length direction of the metal strip to the upper surface of the inner conductor to form a middle connection point; Step 4, press down the two ends of the metal strip to form the metal strip into a "ji" shape, and respectively press-weld the two ends of the metal strip to the microstrip line to form end connection points, and make the metal strip between the end connection points and the middle connection point concave to form an arc.

[0014] The method for interconnecting the power output joints of the spaceborne high-power component of the present invention can reduce the maximum field strength of the power output joint interconnecting structure to 1 / 3 of the maximum field strength of the original structure, and the electric field direction no longer points to the substrate. Compared with the original interconnecting method, the low-pressure discharge threshold is increased by 188%, solving the problem that the radio frequency output interconnecting structure of the spaceborne high-power solid-state amplifier product is prone to local low-pressure discharge.

[0015] In the interconnection method of the present invention, the interconnection structure between the metal strip and the microstrip line is changed from the traditional single-point structure to a double-point structure, which improves the stability and reliability of the connection, reduces electrical faults caused by poor connection, and improves the repairability, allowing the interconnection point to be repaired without removing the power output connector. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the interconnection structure of the power output connector of the spaceborne high-power component of the present invention.

[0017] Figure 2 for Figure 1 Side view.

[0018] Figure 3 for Figure 1 Top view.

[0019] Figure 4 This is a partially enlarged schematic diagram of the interconnection structure of the present invention.

[0020] Figure 5 This is a top view of a structure using two gold strip interconnects.

[0021] Figure 6 This is a schematic diagram of the interconnection structure in the comparative example.

[0022] Figure 7 This is a test diagram of the electrical performance of a single gold strip interconnected using the interconnection method of the present invention.

[0023] Figure 8 This is a comparison chart of measured discharge threshold data between the single gold strip interconnection method of the present invention and the traditional interconnection structure (the original structure is the comparative interconnection structure; the Z-shaped structure is the interconnection structure of Example 1).

[0024] The reference numerals in the attached diagram are as follows: 1-House, 11-House sidewall, 12-House base, 2-Output power connector, 21-Outer conductor with dielectric, 22-Inner conductor, 3-Circuit board, 31-Microstrip line. Detailed Implementation

[0025] Unless otherwise specified, the scientific and technical terms used in this article are intended for understanding by those skilled in the art.

[0026] The interconnection structure of the power output connector for the spaceborne high-power component of the present invention, such as Figure 1-4As shown, the circuit includes a housing 1, a power output connector 2, a circuit board 3, and a metal strip 4. The housing 1 includes a side wall 11 and a bottom plate 12. The power output connector 2 includes an outer conductor 21 with a dielectric material and an inner conductor 22. The outer conductor 21 with the dielectric material is mounted on the side wall 11, and the inner conductor 22 extends from the opening of the outer conductor 21 with the dielectric material and is located inside the housing. A microstrip line 31 is etched on the upper surface of the circuit board 3, and the inner conductor is located approximately 50µm-500µm above the microstrip line. The metal strip 4 is interconnected with the inner conductor 22 of the power output connector 2 in the middle, and the two ends of the metal strip 4 are recessed and interconnected with the two sides of the microstrip line 31 on the circuit board 3 to form a circuit path. In the specific circuit, the number of metal strips is determined according to the output power of the circuit. The size of the metal strips and the distance between adjacent metal strips are determined according to the operating power, electric field strength, and electrical performance parameters of the circuit. The reasonable range of the size of the metal strips in this invention is 250µm*25µm to 1000µm*25µm. The spacing between the metal strips is approximately 10µm to 200µm.

[0027] In this specific embodiment of the invention, the casing is made of metal, including but not limited to aluminum alloy, Kovar, Invar, copper, and silicon-aluminum alloy, etc., and the surface treatment methods include but are not limited to conductive oxidation, gold plating, and silver plating. The inner conductor 22 of the output power connector 2 is made of metal and plated with nickel-gold; the power output connector 2 includes but is not limited to TNC, SC, and SMA. The upper surface of the circuit board 3 is etched with microstrip lines 31, which are used to transmit radio frequency signals. The material of the circuit board 3 includes but is not limited to ceramic and composite dielectric substrates, and the material of the microstrip lines 31 is copper and plated with nickel-gold; the lower surface of the circuit board 3 is metallized, and the surface plating includes but is not limited to gold and tin-lead.

[0028] In the specific solution, the installation method of the power output connector on the side wall of the housing includes, but is not limited to, screw installation and soldering. The soldering material includes, but is not limited to, indium silver, lead tin, gold tin, and tin-silver-copper solder.

[0029] The circuit board can be mounted on the chassis base plate in ways including but not limited to lead-tin soldering, screw mounting, and adhesive bonding. The solder used for soldering includes but is not limited to indium silver, lead-tin, gold-tin, and tin-silver-copper. The adhesive used for bonding is generally conductive adhesive.

[0030] The parameter settings of the parallel gap pressure welding machine in the relevant process method of this invention are determined according to the type of output power connector, the type of circuit board material, and the size of the microstrip line. The pressure weld points have uniform indentations, a smooth and clean surface, and no lifting at the edges.

[0031] The present invention will be described in detail below, and its features and advantages will become clearer and more distinct with these descriptions. The specific term "exemplary" in this article means "serving as an example, an embodiment, or illustrative". Any embodiment described as "exemplary" here does not necessarily have to be construed as superior or better than other embodiments. Although various aspects of the embodiments are shown in the drawings, the drawings do not have to be drawn to scale unless otherwise specified.

[0032] Embodiment 1: The method for interconnecting the power output joints of the spaceborne high-power components in this embodiment includes the following steps: S1. Preparation of the assembly. The casing is made of aluminum alloy plated with silver, the power output joint selects the RF coaxial connector SMA, the circuit board selects Rogers 4003, the microstrip line on the circuit board is plated with nickel-gold, the gold layer thickness is ≥2.5um, and the lower surface of the circuit board is plated with lead-tin. First, solder the printed board to the bottom plate of the casing using lead-tin, and then install the RF coaxial connector SMA to the side wall of the casing using screws. In this embodiment, the distance between the inner conductor on the RF coaxial connector SMA and the microstrip line above and below is 260 um.

[0033] S2. Use scissors to cut a suitable length of gold tape, and the gold tape selects a specification of 250×12.5um.

[0034] S3. Scrub the inner conductor of the power output joint, the microstrip line, and the gold tape clean with non-woven fabric soaked in anhydrous ethanol, and dry for 5 minutes.

[0035] S4. Place the assembly on the workbench of the parallel gap welding machine, adjust the focal length and eyepiece of the microscope to make the welding part of the metal tape clearly visible, and set the parameters of the parallel gap welding machine.

[0036] S5. Use tweezers to place the gold tape on the inner conductor of the output joint. The length direction of the gold tape is perpendicular to the axial direction of the inner conductor. The distance L1 between the single gold tape and the edge of the printed board is 2.5mm. Press-weld the middle part of the gold tape to the upper surface of the inner conductor. For the double gold tapes, first press-weld the gold tape close to the inner side of the casing wall, and then press-weld the outer gold tape. The requirements for the press-welded solder joints are that the indentation is uniform, the surface is flat, smooth, and there is no warping.

[0037] S6. Use tweezers to press down on both sides of the gold tape to form the metal tape into a "J" shape, and press-weld the two ends of both sides of the gold tape to the microstrip line respectively. The requirements for the solder joints are that the indentation is uniform, the surface is flat, smooth, and there is no warping at the corners. The length L2 of the gold tape lap-welded to the microstrip line is 0.2mm and make both sides of the gold tape slightly concave to form an arc. The half-span length P of the gold tape interconnection is 2.1mm.

[0038] S7. Use tweezers to remove the tail tape of the press-welded joint on the microstrip line.

[0039] After the above steps S1-S7, the single gold strip interconnection method for the power output connector of a spaceborne high-power component, as described in this invention, can be obtained. Figure 4 As shown, the method of interconnecting two gold strips, as follows: Figure 5 As shown.

[0040] Example 2: This embodiment differs from Embodiment 1 in that, see Figure 5 As shown, two gold strips are used for interconnection; the gold strip near the housing wall is 2.5mm away from the edge of the printed circuit board, and the gold strip near the outer side is 4mm away from the housing wall.

[0041] Comparative example: The difference between this comparative example and Example 1 is that the interconnect structure uses O-ring gold strips for connection, specifically including the following steps: S1. Assembly Component Preparation. The chassis is made of silver-plated aluminum alloy. The power output connector uses an SMA RF coaxial connector. The circuit board uses Rogers 4003. The microstrip lines on the circuit board are nickel-gold plated with a gold layer thickness of ≥2.5um. The lower surface of the circuit board is plated with lead-tin. The printed circuit board is soldered to the chassis base plate using lead-tin.

[0042] S2. Use scissors to cut the gold strip to the appropriate length. The gold strip should be 250×12.5um in size.

[0043] S3. Wipe the inner conductor, microstrip line, and gold strip of the power output connector clean with anhydrous ethanol non-woven cloth, and let it air dry for 5 minutes.

[0044] S4. Place the assembly on the worktable of the parallel gap welding machine, adjust the focus and eyepiece of the microscope to make the metal strip welding area clearly visible, and set the parameters of the parallel gap welding machine.

[0045] S5. Using tweezers, place the gold strip onto the microstrip line bonding position on the circuit board. The length of the gold strip should be perpendicular to the axial direction of the connector's inner conductor, and the distance between the gold strip and the edge of the printed circuit board should be 2.5mm. Bond the middle part of the gold strip to the microstrip line bonding position. The bonding joint should have a uniform indentation, a flat and smooth surface, and no lifting.

[0046] S6. Remove the assembly from the worktable of the parallel gap welding machine and use screws to install the RF coaxial connector SMA to the side wall of the housing. The distance between the inner conductor on the RF coaxial connector SMA and the microstrip line is 260 μm.

[0047] S7. Place the assembly on the worktable of the parallel gap welding machine, adjust the focus and eyepiece of the microscope to make the metal strip welding area clearly visible, and set the parameters of the parallel gap welding machine.

[0048] S8. Use tweezers to pick up one end of the gold strip edge, flip it into an arc shape, and press solder it onto the inner conductor. Use the same operation to press solder the other end of the gold strip to the same position. Note that the curvature of the gold strip on both sides should be consistent and there should be no bends. The press solder joint should have a uniform indentation, a flat and smooth surface, and no lifting at the edges.

[0049] S9. Use tweezers to remove the tail of the solder joint on the inner conductor of the connector to obtain a sample of the O-shaped conventional gold strip solder structure, such as... Figure 6 As shown.

[0050] Vector calorimetry was used to measure the standing wave ratio and difference loss of the sample fabricated with the metal strip interconnect structure of Example 1 at frequencies below 2 GHz. The measurement results are shown in […]. Figure 7 The data shows that the prototype of the novel metal strip interconnect structure meets the requirements of conventional products at frequencies of 2 GHz and below. (See the prototype structure in Example 1 for details.) Figure 1 Samples were prepared using a conventional gold strip soldering structure as a comparison (see sample structure). Figure 6 Low-pressure discharge tests were conducted using a non-radiative testing method with a non-transparent vacuum chamber to determine the low-pressure discharge threshold. The results are shown in [Figure number missing]. Figure 8 (The original structure is a traditional gold strip soldering structure, while the Z-shaped structure is the novel metal strip interconnect structure of this invention.) The data shows that the discharge threshold of the new interconnect structure at its lowest point is increased from 100W to 288W compared to the original structure, representing an efficiency improvement of 188%. This indicates that the new interconnect method can effectively solve the low-pressure discharge problem of high-power spaceborne products.

[0051] The above embodiments are preferred implementation methods of the present invention, but the implementation methods of the present invention are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.

[0052] The contents not described in detail in this specification are common knowledge to those skilled in the art.

Claims

1. A power output connector interconnection structure for a spaceborne high-power component, the spaceborne high-power component comprising a housing (1) and a circuit board (3), the circuit board being installed inside the housing, and a microstrip line (31) being provided on the circuit board; the power output connector comprising an outer conductor (21) and an inner conductor (22) carrying a dielectric material interconnected with each other; the power output connector being installed on the side wall of the housing, and the inner conductor passing through the side wall and located inside the housing, while being located above the microstrip line and having a distance between it and the microstrip line, the outer conductor carrying the dielectric material being located on the side wall of the housing, characterized in that, The inner conductor and the microstrip line are connected by a metal strip (4), and the middle part of the metal strip (4) in the length direction is connected to the inner conductor (22) as the middle connection point. At the same time, the length direction of the metal strip is perpendicular to the axis of the inner conductor. The two ends of the metal strip (4) are sunk and connected to the microstrip line (31) as the end connection points to form a circuit path. The metal strip between the middle connection point and the end connection point is sunk in an arc shape. The length direction of the microstrip line is perpendicular to the length direction of the metal strip. The two end connection points of the metal strip and the microstrip line are located at the two ends of a width direction of the microstrip line. The distance L1 between the metal strip (4) and the edge of the circuit board (3) in the axial direction of the inner conductor is 0.1~5mm; The horizontal distance P between the middle connection point and the end connection point of the metal strip (4) is the radius of the inner conductor (22) + 1.1~2.5mm; The dimension L2 of the end connection point along the length of the metal strip is 0.2~1.5mm.

2. The interconnection structure of the power output connector for spaceborne high-power components according to claim 1, characterized in that, The metal strip is a gold strip or a copper strip.

3. The interconnection structure of the power output connector of the spaceborne high-power component according to claim 1, characterized in that, The inner conductor and the microstrip line are connected by multiple metal strips (4), and the multiple metal strips are distributed sequentially along the axial direction of the inner conductor, with a distance between adjacent metal strips.

4. The interconnection structure of the power output connector for spaceborne high-power components according to claim 1, characterized in that, The inner conductor and the microstrip line are connected by 1, 2 or 3 metal strips (4).

5. A method for interconnecting power output connectors of spaceborne high-power components, characterized in that, The interconnection of spaceborne high-power components and power output connectors using the interconnection structure described in any one of claims 1 to 4 includes the following steps: Step 1: Assemble the circuit board (3), power output connector (2) and housing (1) to form an assembly; Step 2: Clean and dry the inner conductor (22), microstrip line (31), and metal strip (4); Step 3: Use a parallel gap welding machine to weld the metal strip. Place the metal strip (4) on the inner conductor (22). The length direction of the metal strip (4) is perpendicular to the axial direction of the inner conductor (22). Weld the middle part of the length direction of the metal strip (4) to the upper surface of the inner conductor (22) to form a middle connection point. Step 4: Press down on both ends of the metal strip (4) and weld both ends of the metal strip (4) to the microstrip line (31) to form end connection points, and make the metal strip (4) between the end connection points and the middle connection points concave to form an arc shape.

6. A spaceborne high-power component employing the interconnection structure described in any one of claims 1 to 4.

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