A groove type cleaning machine based on photovoltaic silicon wafer production

Abstract

The application discloses a groove type cleaning machine based on photovoltaic silicon wafer production and relates to the technical field of photovoltaic silicon wafer production. The groove type cleaning machine comprises a cleaning machine main body, a reciprocating screw rod sliding table is arranged on the inner side of the cleaning machine main body, a butt joint frame is connected to the sliding block of the reciprocating screw rod sliding table, a cleaning frame is arranged on the inner side of the cleaning machine main body, and the two ends of the cleaning frame are slidably connected with the butt joint frame. The cleaning frame is driven to reciprocate by starting the screw rod sliding table of the cleaning machine main body, the adjusting frame is driven to rotate by the cooperation between the transmission rod and the gear during the reciprocating of the cleaning frame, the wave-shaped rod is driven to rotate by the rotation of the adjusting frame, the wave-shaped rod pushes the stacked silicon wafers to shake left and right, so that the impurities at the bonding position of the silicon wafers are separated from the silicon wafers and enter the cleaning liquid, and the position of the wave-shaped rod is adjusted by rotating the adjusting screw rod, so that the silicon wafers of different sizes can be pushed to shake, and the cleaning effect of the silicon wafers is improved.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic silicon wafer production technology, specifically a tank-type cleaning machine based on photovoltaic silicon wafer production. Background Technology

[0002] Photovoltaic silicon wafers refer to thin films or sheet-like substrates made of high-purity silicon material. They are a direct downstream product of polycrystalline silicon and are mainly used in photovoltaic cells. The basic structure of a crystalline silicon solar cell is a semiconductor PN junction, where an interface is formed between P-type and N-type silicon wafers, allowing electrons and holes to separate and generate current. Photovoltaic silicon wafers are mainly divided into monocrystalline silicon wafers and polycrystalline silicon wafers according to their crystal structure. Monocrystalline silicon wafers are prepared by the Czochralski method, consisting of a single crystal with ordered atomic arrangement, and have a higher cost. A tank cleaning machine is required during the production of silicon wafers.

[0003] Existing tank cleaning machines require stacking silicon wafers in a cleaning frame before placing the frame in the cleaning tank. The high-frequency mechanical vibration of the machine then cleans the wafers. During this process, because multiple wafers are stacked together, impurities at the wafer bonding points are difficult to separate from the wafers due to vibration, resulting in poor cleaning at the wafer bonding points.

[0004] To address the aforementioned issues, innovative design based on existing methods is urgently needed. Summary of the Invention

[0005] The purpose of this invention is to provide a tank-type cleaning machine based on photovoltaic silicon wafer production, in order to solve the problem that the tank-type cleaning machine in the background technology has a poor cleaning effect at the silicon wafer bonding area because multiple silicon wafers are stacked together and impurities at the bonding area are difficult to be separated from the silicon wafers due to vibration. The technical solution of this invention provides a solution that is significantly different from the existing technology, which is too simplistic.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a tank-type cleaning machine for photovoltaic silicon wafer production, comprising a cleaning machine body, a reciprocating screw slide table installed on the inner side of the cleaning machine body, and a docking frame connected to the slider of the reciprocating screw slide table; a cleaning frame provided on the inner side of the cleaning machine body, with both ends of the cleaning frame slidably connected to the docking frame; a docking block connected to the inner side of the cleaning machine body; a transmission rod slidably connected to the cleaning frame body, and the transmission rod slidably connected to the docking block; a rotating rod rotatably connected to the cleaning frame body; a gear sleeve sleeved on the rotating rod, and the gear meshing with the transmission rod; a transmission sleeve slidably connected to the outer side of the rotating rod; an adjusting frame connected to the bottom of the transmission sleeve; an adjusting screw rotatably connected to the adjusting frame; a connecting block threadedly connected to the adjusting screw; and a wave-shaped rod connected to the bottom of the connecting block.

[0007] A vibration assembly is disposed above the adjustment frame, and a limiting assembly is disposed inside the transmission rod.

[0008] Preferably, the vibration assembly has a fixed plate connected to the inner side of the cleaning frame, and the fixed plate is slidably connected to the transmission sleeve. A wave-shaped sleeve is connected to the bottom of the fixed plate, and a sliding plate is sleeved on the outer side of the wave-shaped sleeve. A conical ring is connected to the bottom of the sliding plate, and the conical ring is slidably connected to the wave-shaped sleeve. A transmission wheel is connected to the top of the adjustment frame, and the transmission wheel is in contact with the bottom of the conical ring. An adjustment plate is threadedly connected to the adjustment screw, and the adjustment plate is in contact with the conical ring and slidably connected to the adjustment frame.

[0009] Preferably, the limiting component has a docking protrusion connected to the inner side of the docking block, a limiting rod is slidably connected to the inner side of the transmission rod, a rotating plate is rotatably connected to the upper inner side of the transmission rod, and the rotating plate is in contact with the top of the limiting rod, a limiting block is slidably connected to the upper inner side of the transmission rod, and the limiting block is slidably connected to the cleaning frame, a square groove is opened on one side of the limiting block, and the other end of the rotating plate that is in contact with the limiting rod is located in the square groove of the limiting block.

[0010] Preferably, a first spring is connected to the bottom of the rotating rod, and the other end of the first spring is connected to the adjustment frame. A first guide rod is connected above the adjustment frame, and the first guide rod passes through the hole formed in the center of the first spring and is slidably connected to the rotating rod.

[0011] Preferably, the inner side of the transmission sleeve is provided with a limiting protrusion, and the limiting protrusion is slidably connected to the rotating rod.

[0012] Preferably, the adjusting screw consists of three screw sections, with opposite threads at both ends, and both ends of the screw are threadedly connected to adjusting plates.

[0013] Preferably, the top of the adjustment plate is sloping, and a ball bearing is installed on the sloping surface, with the ball bearing fitting against the sloping surface of the conical ring.

[0014] Preferably, a second spring is connected above the sliding plate, and the other end of the second spring is connected to the fixed plate. The elastic coefficient of the second spring is greater than that of the first spring. A second guide rod is also connected above the sliding plate, and the second guide rod passes through the central hole of the second spring and is slidably connected to the fixed plate.

[0015] Preferably, a torsion spring is connected to the pivot point where the rotating plate connects to the transmission rod, and the other end of the torsion spring is connected to the inner wall of the transmission rod.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. By starting the main body of the cleaning machine, the lead screw slide table drives the cleaning frame to swing back and forth. During the swinging process, the transmission rod and gear cooperate to make the adjustment frame rotate. The rotation of the adjustment frame drives the wave rod to rotate. The rotation of the wave rod pushes the stacked silicon wafers to sway left and right, thereby separating the impurities at the silicon wafer bonding area from the silicon wafers and letting them enter the cleaning solution. By rotating the adjustment lead screw to adjust the position of the wave rod, silicon wafers of different sizes can be pushed to swing, thereby improving the cleaning effect of silicon wafers.

[0018] 2. The rotation of the adjustment frame drives the transmission wheel to rotate. The rotation of the transmission wheel is affected by the wave sleeve and moves vertically. The vertical movement of the transmission wheel drives the wave rod to move vertically back and forth as a whole. This causes the wave rod to make a small vertical movement during the horizontal reciprocating motion. The vertical movement of the wave rod increases the spacing between silicon wafers, thereby further improving the cleaning effect of the silicon wafers. In addition, the rotation of the adjustment screw will drive the adjustment plate to adjust the amplitude of the vertical movement of the wave rod, making it easier for staff to clean silicon wafers of different sizes.

[0019] 3. By setting a limit block, the transmission rod can be limited and fixed, preventing the wave rod from shaking during the movement of the cleaning frame. When the cleaning frame is placed inside the main body of the cleaning machine, the limit block will be separated from the cleaning frame due to the interaction between the limit rod and the rotating plate, thereby quickly releasing the fixation of the transmission rod and making it easier for the staff to start the main body of the cleaning machine to clean the silicon wafer. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the main structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the internal structure of the main body of the cleaning machine of the present invention;

[0022] Figure 3 This is a schematic diagram of the inner structure of the adjustment frame of the present invention;

[0023] Figure 4 For the present invention Figure 3 Enlarged structural diagram at point A;

[0024] Figure 5 This is a schematic diagram of the side structure of the adjustment frame of the present invention;

[0025] Figure 6 This is a schematic diagram of the inner structure of the sliding sleeve of the present invention;

[0026] Figure 7 This is a schematic diagram of the bottom structure of the sliding sleeve of the present invention;

[0027] Figure 8 This is a schematic diagram of the inner structure of the transmission rod of the present invention;

[0028] Figure 9 For the present invention Figure 8 Enlarged structural diagram at point B;

[0029] Figure 10 For the present invention Figure 8 A magnified structural diagram at point C.

[0030] In the diagram: 1. Cleaning machine body; 2. Docking frame; 3. Cleaning frame; 4. Docking block; 5. Transmission rod; 6. Rotating rod; 7. Gear; 8. Transmission sleeve; 9. Adjusting frame; 10. Adjusting screw; 11. Connecting block; 12. Waveform rod; 13. Vibration assembly; 131. Fixing plate; 132. Waveform sleeve; 133. Sliding plate; 134. Conical ring; 135. Transmission wheel; 136. Adjusting plate; 14. Limiting assembly; 141. Docking protrusion; 142. Limiting rod; 143. Rotating plate; 144. Limiting block. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Please see Figures 1-10 This invention provides a technical solution: a tank-type cleaning machine for photovoltaic silicon wafer production, comprising a cleaning machine body 1, a reciprocating screw slide table installed inside the cleaning machine body 1, and a docking frame 2 connected to the slider of the reciprocating screw slide table; a cleaning frame 3 provided inside the cleaning machine body 1, with both ends of the cleaning frame 3 slidably connected to the docking frame 2; a docking block 4 connected inside the cleaning machine body 1; a transmission rod 5 slidably connected to the cleaning frame 3, and the transmission rod 5 slidably connected to the docking block 4; a rotating rod 6 rotatably connected to the cleaning frame 3, with a gear 7 sleeved on the rotating rod 6, and the gear 7 meshing with the transmission rod 5; a transmission sleeve 8 slidably connected to the outside of the rotating rod 6, and an adjustment mechanism connected to the bottom of the transmission sleeve 8. The section frame 9 is rotatably connected to the adjusting screw 10, which is threadedly connected to the connecting block 11. The bottom of the connecting block 11 is connected to the wave rod 12. By starting the screw slide of the main body 1 of the cleaning machine, the cleaning frame 3 is driven to swing back and forth. During the swinging process of the cleaning frame 3, the transmission rod 5 and the gear 7 cooperate to make the adjusting frame 9 rotate. The rotation of the adjusting frame 9 drives the wave rod 12 to rotate. The rotation of the wave rod 12 pushes the stacked silicon wafers to swing left and right, thereby separating the impurities at the silicon wafer bonding point from the silicon wafers and entering the cleaning liquid. By rotating the adjusting screw 10 to adjust the position of the wave rod 12, silicon wafers of different sizes can be pushed to swing, thereby improving the cleaning effect of silicon wafers.

[0033] Vibration component 13 is located above adjustment frame 9, and limiting component 14 is located inside transmission rod 5.

[0034] In one embodiment of the present invention, the vibration assembly 13 has a fixed plate 131 connected to the inner side of the cleaning frame 3, and the fixed plate 131 is slidably connected to the transmission sleeve 8. A wave-shaped sleeve 132 is connected to the bottom of the fixed plate 131, and a sliding plate 133 is sleeved on the outer side of the wave-shaped sleeve 132. A conical ring 134 is connected to the bottom of the sliding plate 133, and the conical ring 134 is slidably connected to the wave-shaped sleeve 132. A transmission wheel 135 is connected above the adjusting frame 9, and the transmission wheel 135 is in contact with the bottom of the conical ring 134. An adjusting screw 10 is threadedly connected to an adjusting plate 136, and the adjusting plate 136 is in contact with the conical ring 134. The section plate 136 is slidably connected to the adjustment frame 9. The rotation of the adjustment frame 9 drives the transmission wheel 135 to rotate. The rotation of the transmission wheel 135 is affected by the wave sleeve 132 to make vertical movement. The vertical movement of the transmission wheel 135 drives the wave rod 12 to reciprocate vertically as a whole. This causes the wave rod 12 to make a small vertical movement during the horizontal reciprocating movement. The vertical movement of the wave rod 12 increases the spacing between silicon wafers, thereby further improving the cleaning effect of the silicon wafers. In addition, the rotation of the adjustment screw 10 will drive the adjustment plate 136 to move and adjust the amplitude of the vertical movement of the wave rod 12, making it easier for staff to clean silicon wafers of different sizes.

[0035] In one embodiment of the present invention, the limiting component 14 has a docking protrusion 141 connected to the inner side of the docking block 4. A limiting rod 142 is slidably connected to the inner side of the transmission rod 5. A rotating plate 143 is rotatably connected to the upper inner side of the transmission rod 5, and the rotating plate 143 is in contact with the top end of the limiting rod 142. A limiting block 144 is slidably connected to the upper inner side of the transmission rod 5, and the limiting block 144 is slidably connected to the cleaning frame 3. A square groove is provided on one side of the limiting block 144, and the other end of the rotating plate 143 that is in contact with the limiting rod 142 is located in the square groove of the limiting block 144. By setting the limiting block 144, the transmission rod 5 can be limited and fixed, preventing the cleaning frame 3 from moving. During operation, the wave rod 12 may shake. When the cleaning frame 3 is placed inside the main body 1 of the cleaning machine, the limiting block 144 will separate from the cleaning frame 3 due to the interaction between the limiting rod 142 and the rotating plate 143. This will quickly release the fixing of the transmission rod 5, making it easier for the staff to start the main body 1 of the cleaning machine to clean the silicon wafer. The main function of the limiting block 144 is to limit the wave rod 12 when the cleaning frame 3 is not placed inside the main body 1 of the cleaning machine, so as to prevent the wave rod 12 from shaking during the conveying process. When the cleaning frame 3 is placed in the main body 1 of the cleaning machine, the limiting of the wave rod 12 is released, and the wave rod 12 can shake during the silicon wafer cleaning process.

[0036] In one embodiment of the present invention, a first spring is connected to the bottom of the rotating rod 6, and the other end of the first spring is connected to the adjusting frame 9. A first guide rod is connected to the top of the adjusting frame 9, and the first guide rod passes through the hole formed in the center of the first spring and is slidably connected to the rotating rod 6. The first spring is provided to quickly push the adjusting frame 9 back to the initial position, and the first guide rod limits the first spring to reduce the occurrence of deformation and misalignment of the first spring. A limit protrusion is provided on the inner side of the transmission sleeve 8, and the limit protrusion is slidably connected to the rotating rod 6. By providing the limit protrusion, the rotating rod 6 drives the transmission sleeve 8 to rotate during rotation, thereby driving the wave rod 12 to move and push the silicon wafer.

[0037] As one embodiment of the present invention, the adjusting screw 10 is composed of three screw sections, and the screw threads at both ends are opposite. Both ends of the screw are threadedly connected to the adjusting plate 136. By setting the adjusting screw 10 to a three-section structure, the adjusting screw 10 drives the connecting block 11 and the adjusting plate 136 to move simultaneously during the rotation process, which makes it easier for the staff to adjust the swing amplitude according to the silicon wafer size.

[0038] As one embodiment of the present invention, the top of the adjusting plate 136 is sloping, and a ball bearing is installed on the sloping part. The ball bearing fits against the sloping surface of the conical ring 134. By providing the ball bearing, friction damage to the adjusting plate 136 during the rotation of the conical ring 134 is reduced.

[0039] In one embodiment of the present invention, a second spring is connected above the sliding plate 133, and the other end of the second spring is connected to the fixed plate 131. The elastic coefficient of the second spring is greater than that of the first spring. A second guide rod is also connected above the sliding plate 133, and the second guide rod passes through the central hole of the second spring and is slidably connected to the fixed plate 131. By providing the second spring, the adjustment frame 9 is prevented from directly pushing the sliding plate 133 to move during the vertical reciprocating motion, thereby improving the stability of the vertical reciprocating motion of the adjustment frame 9. Furthermore, the second guide rod limits the second spring, reducing the possibility of deformation and misalignment of the second spring.

[0040] In one embodiment of the present invention, a torsion spring is connected to the pivot position where the rotating plate 143 is connected to the transmission rod 5. The other end of the torsion spring is connected to the inner wall of the transmission rod 5. By providing the torsion spring, the rotating plate 143 pushes the limiting block 144 into the groove of the cleaning frame 3 for fixing, thereby ensuring the limiting effect of the limiting block 144.

[0041] Working principle of the invention:

[0042] First, when cleaning the silicon wafer, after placing the silicon wafer inside the cleaning frame 3, the cleaning frame 3 is lowered into the inner groove of the main body 1 of the cleaning machine by the robotic arm. During the descent, the transmission rod 5 will be embedded into the groove of the docking block 4. The docking protrusion 141 on the inner side of the docking block 4 will be inserted into the bottom of the transmission rod 5. After the docking protrusion 141 is in contact with the limiting rod 142 on the inner side of the transmission rod 5, it will push the limiting rod 142 to move upward. The upward movement of the limiting rod 142 will push the rotating plate 143 to rotate. Since one end of the rotating plate 143 is located in the direction groove of the limiting block 144, the rotation of the rotating plate 143 will drive the limiting block 144 to move downward. The downward movement of the limiting block 144 will separate it from the cleaning frame 3, releasing the fixation of the transmission rod 5.

[0043] Secondly, during the cleaning process, the reciprocating screw slide of the main body 1 of the cleaning machine is activated. The operation of the reciprocating screw slide drives the cleaning frame 3 to reciprocate horizontally. The reciprocating horizontal movement of the cleaning frame 3 drives the gear 7 to reciprocate horizontally. Since the gear 7 is meshed with the transmission rod 5 and the transmission rod 5 is slidably connected to the docking block 4, the gear 7 will rotate during its reciprocating horizontal movement. The rotation of the gear 7 drives the rotating rod 6 to rotate, which in turn drives the transmission sleeve 8 to rotate. The rotation of the transmission sleeve 8 drives the adjusting frame 9 to rotate, which in turn drives the connecting block 11 to rotate. The rotation of the connecting block 11 drives the wave rod 12 to rotate. During the reciprocating rotation of the wave rod 12, it pushes the stacked silicon wafers to swing. During the rotation of the adjusting frame 9, it also drives the transmission wheel 135 to rotate. Since the conical ring 134 and the wave sleeve 135 are connected, the silicon wafers will rotate horizontally. 2. The sliding connection is established, and the bottom protrusion of 132 is lower than the bottom of the conical ring 134. Therefore, the transmission wheel 135 will be in contact with the protrusion of the wave sleeve 132 during the rotation of the bottom of the conical ring 134. Since the rotating rod 6 is slidably connected to the transmission sleeve 8, and since the spring force coefficient of the second spring is greater than that of the first spring, the transmission wheel 135 will be affected by the bottom curved protrusion of the wave sleeve 132 during the rotation of the bottom of the conical ring 134 and will move vertically. The vertical movement of the transmission wheel 135 pushes the adjustment frame 9 to move vertically back and forth. The vertical back and forth movement of the adjustment frame 9 drives the wave rod 12 to move vertically back and forth. The wave rod 12, which rotates back and forth and moves vertically back and forth, pushes the silicon wafer to move, thereby creating gaps between the stacked silicon wafers and reducing the situation where impurities cannot be separated from the silicon wafer.

[0044] Finally, when cleaning silicon wafers of different sizes is required, rotating the adjusting screw 10 causes the connecting block 11 to move within the adjusting frame 9. Since the adjusting screw 10 is threadedly connected to the connecting block 11, and the connecting block 11 is slidably connected to the adjusting frame 9, rotating the adjusting screw 10 will cause the connecting block 11 to move within the adjusting frame 9. This allows the position of the wave rod 12 to be adjusted, enabling the wave rod 12 to fit against the side of silicon wafers of different sizes during rotation. Furthermore, since the adjusting screw 10 is threadedly connected to the adjusting plate 136, and the adjusting plate 136 is slidably connected to the adjusting frame 9, the position of the wave rod 12 can be adjusted. The rotation of the adjusting screw 10 will drive the two sets of adjusting plates 136 to move. The movement of the adjusting plates 136 will push the conical ring 134 to move upward. The upward movement of the conical ring 134 will increase the expansion range of the bottom protrusion of the wave sleeve 132, thereby increasing the vertical movement range of the transmission wheel 135. This allows the vertical movement amplitude of the wave rod 12 to be adjusted, enabling the wave rod 12 to push the larger silicon wafer to swing, and further increasing the gap during the silicon wafer swing process, thus improving the cleaning effect of the silicon wafer.

[0045] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A tank-type cleaning machine for photovoltaic silicon wafer production, comprising a cleaning machine body (1), characterized in that: The cleaning machine body (1) is equipped with a reciprocating screw slide table on the inner side, and a docking frame (2) is connected to the slider of the reciprocating screw slide table. The cleaning machine body (1) is provided with a cleaning frame (3), and both ends of the cleaning frame (3) are slidably connected to the docking frame (2). A docking block (4) is connected to the inner side of the cleaning machine body (1). A transmission rod (5) is slidably connected to the frame of the cleaning frame (3), and the transmission rod (5) is slidably connected to the docking block (4). A rotating rod (6) is rotatably connected to the frame of the cleaning frame (3). A gear (7) is sleeved on the rotating rod (6), and the gear (7) is meshed with the transmission rod (5). A transmission sleeve (8) is slidably connected to the outer side of the rotating rod (6). An adjustment frame (9) is connected to the bottom of the transmission sleeve (8). An adjustment screw (10) is rotatably connected to the adjustment frame (9). A connecting block (11) is threadedly connected to the adjustment screw (10), and a wave rod (12) is connected to the bottom of the connecting block (11). Vibration assembly (13), which is disposed above the adjustment frame (9); Limiting component (14), the limiting component (14) is disposed inside the transmission rod (5); The vibration assembly (13) has a fixed plate (131) connected to the inner side of the cleaning frame (3), and the fixed plate (131) is slidably connected to the transmission sleeve (8). The bottom of the fixed plate (131) is connected to a wave sleeve (132), and a sliding plate (133) is sleeved on the outer side of the wave sleeve (132). The bottom of the sliding plate (133) is connected to a conical ring (134), and the conical ring (134) is slidably connected to the wave sleeve (132). The upper part of the adjustment frame (9) is connected to a transmission wheel (135), and the transmission wheel (135) is in contact with the bottom of the conical ring (134). The adjustment screw (10) is threadedly connected to an adjustment plate (136), and the adjustment plate (136) is in contact with the conical ring (134). The adjustment plate (136) is slidably connected to the adjustment frame (9). The bottom protrusion of the wave sleeve (132) is lower than the bottom position of the conical ring (134). The limiting component (14) has a docking protrusion (141) connected to the inner side of the docking block (4). The transmission rod (5) is slidably connected to the inner side of the limiting rod (142). The transmission rod (5) is rotatably connected to the upper inner side of the transmission rod (5), and the rotating plate (143) is in contact with the top of the limiting rod (142). The transmission rod (5) is slidably connected to the upper inner side of the limiting block (144), and the limiting block (144) is slidably connected to the cleaning frame (3). A square groove is provided on one side of the limiting block (144), and the other end of the rotating plate (143) in contact with the limiting rod (142) is located in the square groove of the limiting block (144). The bottom of the rotating rod (6) is connected to a first spring, and the other end of the first spring is connected to the adjustment frame (9). The top of the adjustment frame (9) is connected to a first guide rod, and the first guide rod passes through the hole formed in the center of the first spring and is slidably connected to the rotating rod (6). The transmission sleeve (8) has a limiting protrusion on its inner side, and the limiting protrusion is slidably connected to the rotating rod (6); A second spring is connected above the sliding plate (133), and the other end of the second spring is connected to the fixed plate (131). The spring force coefficient of the second spring is greater than that of the first spring. A second guide rod is also connected above the sliding plate (133), and the second guide rod passes through the central hole of the second spring and is slidably connected to the fixed plate (131).

2. The tank-type cleaning machine based on photovoltaic silicon wafer production according to claim 1, characterized in that: The adjusting screw (10) consists of three screw sections, with opposite threads at both ends, and both ends of the screw are threadedly connected to adjusting plates (136).

3. The tank-type cleaning machine based on photovoltaic silicon wafer production according to claim 1, characterized in that: The top of the adjustment plate (136) is sloping, and a ball bearing is installed on the sloping part, and the ball bearing fits against the sloping surface of the conical ring (134).

4. A tank-type cleaning machine for photovoltaic silicon wafer production according to claim 1, characterized in that: A torsion spring is connected to the pivot position where the rotating plate (143) is connected to the transmission rod (5), and the other end of the torsion spring is connected to the inner wall of the transmission rod (5).

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