Backlight module preparation method and device

Abstract

The application discloses a backlight module preparation method and device, comprising: setting an LED test light bar according to the model size of a display module; adjusting the driving electrical property parameters of the LED test light bar, so that the whole machine display reaches a target color point value, and a first electrical property parameter is obtained; calculating the working current data of a single LED lamp bead according to the first electrical property parameter, and obtaining the luminous flux and color coordinates of various LED lamp beads; constructing a colorimetric mixing formula and calculating the white light color point theoretical value of the backlight module; according to the white light color point theoretical value, combining the preselected wavelength of a blue light chip, fluorescent powder and glue type, obtaining the matching ratio of the fluorescent powder, and preparing the backlight module according to the matching ratio of the fluorescent powder. Through the whole machine test in advance, the target color point value of the white light LED device is calculated according to the test data, so that the preparation accuracy of the white light LED device is improved, repeated test verification is avoided, the development cycle of the liquid crystal display is shortened, and the development cost is effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of light strip manufacturing technology, specifically to a method and apparatus for manufacturing a backlight module. Background Technology

[0002] Current LCD displays primarily use edge-lit backlight modules for illumination. Since conventional edge-lit backlight modules employ white LED devices for encapsulation, sample LED strips are fabricated and assembled with the display module for testing to confirm whether the overall white point position is close to the design requirements. However, ordinary edge-lit backlight modules lack local dimming capabilities, and different models use different glass and LCD modules, which can affect the quality and white point position. Therefore, if the expected quality and white point position are not achieved, the white LED devices need to be re-fabricated, and another sample needs to be made for verification. This repetitive testing and verification method results in a long development cycle and high development costs for LCD displays. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art. This invention provides a backlight module manufacturing method and apparatus. By assembling a test light strip with several LED beads with the display module for whole-machine testing, the target color point value of the white LED device is calculated based on the test data, thereby improving the manufacturing accuracy of the white LED device, avoiding repeated experimental verification, shortening the development cycle of the liquid crystal display, and effectively reducing the development cost.

[0004] This invention provides a method for manufacturing a backlight module, the method comprising: Set the LED test light strip according to the model and size of the display module; The LED test light strip is assembled with the display module to perform a whole-machine lighting operation. The driving electrical parameters of the LED test light strip are adjusted so that the whole machine display reaches the target color point value, and the first electrical parameter is obtained. Based on the first electrical parameters and the electrical structure of the backlight module, calculate the working electrical data of a single LED bead, and query the luminous flux and color coordinates of various LED beads based on the working electrical data; Based on the luminous flux and color coordinates of each LED, a colorimetric mixing formula is constructed and the theoretical value of the white light color point of the backlight module is calculated. Based on the theoretical value of the white light color point, combined with the pre-selected blue light chip wavelength, phosphor and adhesive type, the phosphor mixing ratio is obtained, and the backlight module is prepared according to the phosphor mixing ratio.

[0005] Furthermore, the step of setting the LED test light strip according to the model and size of the display module includes: Based on the operating current and voltage requirements of the display module model and the dimensions of the display module, calculate the total number of LED beads in the LED test light strip and the spacing between the LED beads.

[0006] Furthermore, the process of assembling the LED test light strip with the display module and performing a full-machine lighting operation, adjusting the driving electrical parameters of the LED test light strip to ensure the full-machine display reaches the target color point value, and obtaining the first electrical parameter includes: After assembling the LED test light strip with the display module, the whole machine is lit up, and the coordinates of the white light point of the whole machine display status are obtained by testing equipment. By adjusting the driving electrical parameters of the LED test light strip, the coordinates of the white light color point are adjusted to match the target color point value, and the first electrical parameter of the target color point value is achieved.

[0007] Furthermore, the step of calculating the operating electrical data of a single LED bead based on the first electrical parameters and the electrical structure of the backlight module, and querying the luminous flux and color coordinates of various LED beads based on the operating electrical data, includes: Continuous electrical tests were conducted on the LED chips required for the backlight module to obtain a data comparison table of luminous flux and color coordinates of the LED chips. The number of LED beads and their series-parallel connection structure are obtained based on the electrical structure of the backlight module. The working electrical data of a single LED bead are calculated based on the number of LED beads and their series-parallel connection structure. Based on the operating electrical data, obtain the luminous flux and color coordinates of each LED bead from the data lookup table.

[0008] Furthermore, the step of constructing a colorimetric mixing formula and calculating the theoretical value of the white light color point of the backlight module based on the luminous flux and color coordinates of each LED chip includes: Calculate the brightness ratio of LEDs of different colors based on the luminous flux of each LED; A chromaticity mixing formula is constructed by combining the color coordinates of each LED bead and the brightness ratio, and the theoretical value of the white light color point of the backlight module is calculated based on the chromaticity mixing formula.

[0009] Furthermore, the chromaticity mixing formula is as follows: ; ; in, The X-axis coordinates of the color points are the values ​​of the color points. The Y-axis coordinate value of the mixed color point. Let x be the x-coordinate value of the color coordinate of the i-th LED bead. Let be the ordinate value of the color coordinate of the i-th LED bead. Let be the brightness ratio of the i-th LED.

[0010] Furthermore, the preparation method further includes: The LED test strip is individually lit under the first electrical parameter condition to obtain the white light color point detection value of the LED test strip; The theoretical value of the white light color point is verified by using the detected white light color point value.

[0011] Furthermore, the step of obtaining the phosphor mixing ratio based on the theoretical value of the white light color point, combined with the pre-selected blue light chip wavelength, phosphor, and adhesive type, and preparing the backlight module according to the phosphor mixing ratio includes: On the CIE chromaticity diagram, the theoretical value of the white light color point is connected to the wavelength point of the blue light chip and extended to obtain the intersection of the extended line and the emission spectrum of the phosphor. The wavelength corresponding to the intersection point is set as the target wavelength of the phosphor. The phosphor ratio is adjusted according to the target wavelength, and the phosphor with the final ratio is then encapsulated into LED beads.

[0012] The present invention also provides a backlight module manufacturing apparatus, which is used to perform the backlight module manufacturing method. The manufacturing apparatus includes: an LED test strip and a color point detection device. The LED test strip is used to be adapted and installed with the display module and to perform a whole-machine lighting test. The color point detection device is used to detect the color point value of the light emitted by the LED test strip, or the color point detection device is used to detect the color point value in the whole-machine lighting state. The LED test light strip includes: a light board, a light guide plate, and a number of LED beads. The number of LED beads are disposed on the light board, and the light board is disposed on one side of the light guide plate to form a side-entry light strip structure.

[0013] Furthermore, the LED test light strip is electrically connected in a common anode configuration; or The LED test light strip is electrically connected using an independent anode connection.

[0014] This invention provides a backlight module manufacturing method and apparatus. By assembling a test light strip with several LED beads with a display module for whole-machine testing, the target color point value of the white LED device is calculated based on the test data. Combined with the structural design requirements of the white LED device, the phosphor ratio is adaptively adjusted, thereby improving the manufacturing accuracy of the white LED device, avoiding repeated experimental verification, shortening the development cycle of the liquid crystal display, and effectively reducing development costs. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a flowchart of the backlight module manufacturing method in an embodiment of the present invention; Figure 2 This is the CIE chromaticity diagram of the LED beads in this embodiment of the invention; Figure 3 This is a schematic diagram illustrating the correspondence between color dots and wavelengths in an embodiment of the present invention; Figure 4 This is a circuit diagram of the common anode electrical connection structure of the LED test light strip in an embodiment of the present invention; Figure 5 This is a circuit diagram illustrating the electrical connection structure of the independent anode of the LED test light strip in an embodiment of the present invention. Figure 6 This is a schematic diagram of the structure of the LED test light strip in an embodiment of the present invention. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Example 1: Please refer to Figures 1 to 3 This invention provides a method for manufacturing a backlight module, the method comprising: S11: Set the LED test light strip according to the model and size of the display module; Specifically, based on the operating current and voltage requirements of the display module model and the dimensions of the display module, the total number of LEDs in the LED test strip and the spacing between the LEDs are calculated. The dimensions of the display module are obtained, and the length of the test strip's lamp board is set to ensure that the lamp board length is compatible with the installation requirements of the display module.

[0019] Furthermore, the design scheme of the LED test light strip is adjusted according to the model of the display module. Based on the working current and voltage of the design scheme, the current and voltage of a single RGB device are converted. Then, the total number of LED beads and their arrangement spacing on the light board of the LED test light strip are calculated so that more LEDs can be placed in the denser spacing, thereby improving the overall brightness and power of the LED test light strip.

[0020] Specifically, the test light strip is a side-lit light strip. By setting side-lit LED beads in conjunction with a light guide plate, an ultra-thin display structure is achieved. According to the display panel size requirements of the display module, the thickness of the light guide plate adapted to the test light strip needs to be adjusted. Commonly used light guide plates have thicknesses of 1.0T, 2.0T, and 3.0T. According to the LED bead model and size requirements of the test light strip, a device with a suitable light guide plate thickness is selected to ensure that the light guide plate can cover the light-emitting surface of the LED, so as to ensure that the light source emitted by the LED can be uniformly reflected within the light guide plate.

[0021] Specifically, the LED test strip can be electrically connected via a common anode connection. This means that several LEDs on the LED test strip can be electrically connected via a common anode connection. Based on this common anode connection structure, the circuit board of the LED test strip has a positive terminal and three negative terminals corresponding to the red, blue, and green LED chips. Since the power parameters of the red, blue, and green LED chips are different, voltage divider resistors are set in the working circuits corresponding to the red, blue, and green LED chips in the circuit design of the circuit board. This allows for adjustment of the operating current and voltage data of each device according to the power parameter requirements of the red, blue, and green LED chips.

[0022] Furthermore, the voltage divider resistor is an adjustable resistor, which can meet the precise adjustment of the electrical driving parameters of the red light chip, blue light chip and green light chip.

[0023] Furthermore, the electrical connection method of the LED test light strip can also be an independent anode connection, that is, the red light chip, blue light chip and green light chip on the LED test light strip are driven by three different power supplies, so that devices of different colors can be driven by adaptive power supplies according to their own parameters to meet the display requirements of mixed light illumination color points.

[0024] S12: Assemble the LED test light strip with the display module and perform a whole-machine lighting operation. Adjust the driving electrical parameters of the LED test light strip so that the whole machine display reaches the target color point value and obtain the first electrical parameter.

[0025] Specifically, after assembling the LED test light strip with the display module, the entire unit is lit up. The coordinates of the white light color point of the entire display state are obtained by using testing equipment. By adjusting the driving electrical parameters of the LED test light strip, the lighting effect of the LED test light strip and the display module can be adjusted, thereby achieving dynamic adjustment of the coordinates of the white light color point.

[0026] By adjusting the driving electrical parameters of the LED test light strip, the coordinates of the white light color point are adjusted to match the target color point value, achieving the first electrical parameter of the target color point value. When the coordinates of the white light color point match the target color point value, the white light display color point of the display module can meet the actual display requirements. By setting several LED beads on the light board and performing electrical debugging with the driving circuit, the driving electrical data of each LED bead can be changed, allowing the light emission color point value of the test LED bead to be easily adjusted to meet the color point display requirements of the display module assembly.

[0027] Specifically, the process of assembling the LED test light strip with the display module and performing a full-machine lighting operation, adjusting the driving electrical parameters of the LED test light strip to ensure the full-machine display reaches the target color point value, and obtaining the first electrical parameter includes: After assembling the LED test strip with the display module, the entire unit is powered on. The drive current and voltage of the display module are adjusted to ensure the display reaches the target color value. During testing, the output light color of the LED test strip is adjusted by dynamically adjusting its drive current and voltage, ensuring the light emission effect of the LED test beads meets the display module's requirements, i.e., the display module's color value reaches the target color value.

[0028] Furthermore, the driving current and voltage data under the target color point value are recorded and organized into the first electrical parameters. The LED test light strip is driven to light up under the first electrical parameters, and the display module can be used to achieve the display effect of the target color point.

[0029] S13: Based on the first electrical parameters and the electrical structure of the backlight module, calculate the working electrical data of a single LED bead, and query the luminous flux and color coordinates of various LED beads based on the working electrical data.

[0030] Specifically, continuous electrical tests are performed on the LED chips required for the backlight module to obtain a data lookup table of luminous flux and color coordinates of the LED chips; continuous electrical tests are also performed on the LED chip devices required for the backlight module to obtain the luminous flux and color coordinates of red, blue, and green chips under different electrical parameter conditions; the luminous flux, color coordinates, and corresponding electrical data of the red, blue, and green chips are matched one-to-one and organized into the data lookup table, which can meet the needs of quick lookup of the luminous flux and color coordinates of the red, blue, and green chips.

[0031] Based on the electrical structure of the backlight module, the number of LED beads and their series-parallel connection structure are obtained. The operating electrical data of a single LED bead are calculated based on this information. The driving electrical data under the required color point coordinates is obtained through the LED test light strip in conjunction with the display panel of the display module. Based on this driving electrical data, the operating electrical data of the red, blue, and green light chips are obtained. This allows for the acquisition of the luminous flux and color coordinates of the red, blue, and green light chips under this electrical data. The resulting white light color point value is then calculated based on the luminous flux and color coordinates of the devices with different light colors, enabling the adjustment of the target white light color point value according to the LED devices required by the backlight module.

[0032] Based on the operating electrical data, the luminous flux and color coordinates of each LED chip can be obtained from the data lookup table. By querying the data lookup table based on the operating electrical data, the luminous flux and color coordinates of the red, blue, and green LED chips can be obtained.

[0033] S14: Based on the luminous flux and color coordinates of each LED, construct a colorimetric mixing formula and calculate the theoretical value of the white light color point of the backlight module.

[0034] Specifically, the step of constructing a colorimetric mixing formula and calculating the theoretical value of the white light color point of the backlight module based on the luminous flux and color coordinates of each LED chip includes: Calculate the brightness ratio of LEDs of different colors based on the luminous flux of each LED; A chromaticity mixing formula is constructed by combining the color coordinates of each LED bead and the brightness ratio, and the theoretical value of the white light color point of the backlight module is calculated based on the chromaticity mixing formula.

[0035] Furthermore, the mixing ratio of the red, blue, and green light chips is calculated based on their luminous flux. By calculating the brightness ratio of the red, blue, and green light chips, the luminous efficacy of the LED device can be calculated according to the chromaticity mixing formula.

[0036] The chromaticity mixing formula is as follows: ; ; in, The X-axis coordinates of the color points are the values ​​of the color points. The Y-axis coordinate value of the mixed color point. Let x be the x-coordinate value of the color coordinate of the i-th LED bead. Let be the ordinate value of the color coordinate of the i-th LED bead. Let be the brightness ratio of the i-th LED.

[0037] Furthermore, the chromaticity mixing calculation is performed by combining the brightness ratio of each LED bead with the color coordinates to obtain the chromaticity mixing coordinates of the red, blue, and green light chips, so as to achieve accurate calculation of the light mixing of the light strip.

[0038] S15: Based on the theoretical value of the white light color point, combined with the pre-selected blue light chip wavelength, phosphor and adhesive type, obtain the phosphor mixing ratio, and prepare the backlight module according to the phosphor mixing ratio.

[0039] Specifically, the preparation method further includes: The LED test strip is individually lit under the first electrical parameter condition to obtain the white light color point detection value of the LED test strip. The white light color point detection value reflects the color point coordinate value of the mixed light of the LED beads in the LED test strip under the first electrical parameter condition.

[0040] The theoretical value of the white light color point is verified by the detected white light color point value. A comparative analysis is performed between the detected white light color point value and the theoretical white light color point value to obtain the difference data between them. This difference data is then compared with a preset detection threshold. If the difference data exceeds the preset detection threshold, the theoretical white light color point value is determined to not meet the assembly and installation requirements of the display module; if the difference data does not exceed the preset detection threshold, the theoretical white light color point value is determined to meet the assembly and installation requirements of the display module.

[0041] Furthermore, based on the parameter control range of the side-lit LED device, in this embodiment, the preset detection threshold is set to 0.0007.

[0042] Specifically, the white light color point detection value is combined with the target color point value of the display module to calculate the difference and obtain the first color point difference value. The first color point difference value reflects the color point difference between the LED test light strip and the target display effect of the display module under the first electrical parameter conditions. The first color point difference value can be recorded as a standard value. For display modules of the same model and specification, the target color point coordinates of the backlight module can be quickly confirmed through the first color point difference value, thereby improving the manufacturing efficiency of the light strip.

[0043] Specifically, the step of obtaining the phosphor mixing ratio based on the theoretical value of the white light color point, combined with the pre-selected blue light chip wavelength, phosphor, and adhesive type, and preparing the backlight module according to the phosphor mixing ratio includes: On the CIE (chromaticity diagram), the theoretical value of the white light color point is connected to the wavelength point of the blue light chip and extended to obtain the intersection of the extended line and the emission spectrum of the phosphor. The wavelength corresponding to the intersection point is set as the target wavelength of the phosphor. The phosphor ratio is adjusted according to the target wavelength, and the phosphor with the final ratio is used for LED chip encapsulation.

[0044] Specifically, based on the actual production specifications, the phosphor type and adhesive type required for the white light device of the backlight module are obtained. The target color point coordinates of the white light device are determined according to the target wavelength. The ratio of phosphor and adhesive is adjusted according to the target color point coordinates of the white light device so that the output of the white light device is concentrated within the required target color point coordinates, thereby improving the output quality of the white light device. The lamp bead structure formed based on the white light device can meet the lighting requirements of the display module, thereby avoiding the tedious operation of repeated test verification, improving production efficiency, and shortening the production cycle.

[0045] Specifically, in this embodiment, taking a 21.5-inch RGB side-lit light strip as an example, the light strip uses 96 RGB LEDs with a diameter of 30mm. The LED strip is 30mm thick and uses a 12S8P layout, which means 8 groups of LED beads connected in parallel. Each group of LED beads has 12 LED beads connected in series, and the LED strip is driven by three independent power supplies.

[0046] Reference Appendix Figure 2 The colorimetric diagram is used to set the display color point of the display module to reach the standard white point D65. The color coordinates of the standard white point are (0.3127, 0.3290). In the overall color calibration of the display module, the coordinates of D65 are used as the standard color point for adjustment.

[0047] Furthermore, based on the specifications of the RGB LED chips, the electrical specifications of the red, blue, and green chips in the RGB LED chips were obtained: R (2020 chip, current ≤150mA, voltage ≤10V), G (1818 chip, current ≤120mA, voltage approximately ≤5V), and B (1734 chip, current ≤150mA, voltage ≤5V). Continuous electrical tests were performed on the red, blue, and green chips using an optical testing machine, with the test current gradually increased in 1mA increments. The luminous flux and color coordinates of each chip were tested within the range of 1mA to 150mA, and a data comparison table for the RGB LED chips was compiled.

[0048] Specifically, by setting up LED test light strips in conjunction with the display module for testing, the first electrical parameter is obtained when the display module as a whole achieves the standard color point. The first electrical parameter is: Test current: R(A)=160mA, G(A)=64mA, B(A)=784mA; Test voltages R(V) = 23.28V, G(V) = 28.45V, B(V) = 36.13V; Based on the structure of the LED strip 12S8P, and combined with the first electrical parameters, the voltage and current parameters of the red, blue, and green LED chips within a single LED are calculated as follows: Operating current: R(A)=20mA, G(A)=8mA, B(A)=98mA; Operating voltage: R(V)=1.94V, G(V)=2.37V, B(V)=3.01V; Based on the operating current and operating voltage, the luminous flux and color coordinate data corresponding to the red, green, and blue light chips under the first electrical parameter are obtained by consulting the data lookup table: The luminous flux is: R=4.90lm, G=5.58lm, B=7.51lm; The color coordinates are: Rx,Ry=(0.69011, 0.30663), Gx,Gy=(0.19440, 0.73694), Bx,By=(0.14940, 0.03151).

[0049] Specifically, the brightness ratio of the red, green, and blue light chips is calculated based on the luminous flux. The calculation process is as follows: The total luminous flux is: 4.90 + 5.58 + 7.51 = 17.99 lm; The luminous flux ratio of the red light chip is: 4.90 / 17.99 = 27.24%; The luminous flux ratio of the green LED chip is: 5.58 / 17.99 = 31.02%; The luminous flux ratio of the blue light chip is: 7.51 / 17.99 = 41.74%; Normalized brightness ratio: .

[0050] A chromaticity mixing formula is constructed based on the brightness ratio and the color coordinate data: , ; ; ; The theoretical value of the coordinates of the white light color point after the light strip is mixed is: .

[0051] Compare the theoretical values ​​of the white light color point coordinates obtained with the test values ​​of the color point coordinates obtained by lighting the LED test strip individually. If the difference between the two is less than 0.0007, it means that the theoretical values ​​of the white light color point coordinates meet the lighting requirements.

[0052] Based on the color point coordinate data measured from the selected RGB LED strip, the color point coordinates after light mixing can be accurately located. By combining the types of phosphor and adhesive required for actual production and the requirements of the color point coordinates, the ratio of phosphor and adhesive can be finely adjusted, which can improve the accuracy of LED chip packaging preparation.

[0053] This invention provides a backlight module manufacturing method. By assembling a test light strip with several LED beads with a display module for whole-machine testing, the target color point value of the white LED device is calculated based on the test data. Combined with the structural design requirements of the white LED device, the phosphor ratio is adaptively adjusted, thereby improving the manufacturing accuracy of the white LED device, avoiding repeated experimental verification, shortening the development cycle of the liquid crystal display, and effectively reducing development costs.

[0054] Example 2: Please refer to Figures 4 to 6 This invention provides a backlight module manufacturing apparatus, which is used to perform the backlight module manufacturing method. The manufacturing apparatus includes: an LED test strip and a color point detection device. The LED test strip is used to be adapted and installed with the display module and to perform a whole-machine lighting test. The color point detection device is used to detect the color point value of the light emitted by the LED test strip, or the color point detection device is used to detect the color point value in the whole-machine lighting state. The LED test light strip includes: a light board 1, a light guide plate 3, and a plurality of LED beads 2. The plurality of LED beads 2 are disposed on the light board 1. The light board 1 is disposed on one side of the light guide plate 3 to form a side-lit light strip structure. The plurality of LED beads 2 on the light board 1 emit light to the light guide plate 3, so that the light guide plate 3 emits mixed white light outward. Based on the color point detection device, the emitted light color of the LED test light strip can be detected to obtain the mixed color point coordinate value of the LED test light strip.

[0055] Specifically, the LED test light strip also includes: a reflective film 5, a diffusion film 4, a side wall light-shielding film 6, and a top surface light-shielding film 7. The diffusion film 4 is disposed on the light-emitting surface of the light guide plate 3 and is used to adjust the uniformity of the light emitted from the light guide plate 3. The light passing through the diffusion film 4 is refracted and scattered by the acrylic spheres, rough surfaces, or diffusion particles inside the diffusion film 4, and finally the light is uniformized, making the light visual effect more uniform and improving the overall quality of the panel.

[0056] The reflective film 5 is disposed on the side opposite to the light-emitting surface of the light guide plate 3, and is used to reflect the light inside the light guide plate 3, improve the utilization rate of the light inside the light guide plate 3, and ensure that the light guide plate 3 has good light emission efficiency.

[0057] Furthermore, the sidewall light-shielding film 6 covers the sidewalls of the light guide plate 3 and the lamp plate 1 to reduce light loss of the LED test light strip in the sidewall direction. The top surface light-shielding film 7 covers the junction of the lamp plate 1 and the light guide plate 3, which can block the light emission position of the lamp plate 1, avoid light spots on the LED test light strip, and improve the uniformity and consistency of light emission from the LED test light strip.

[0058] One side of the light guide plate 3 is provided with a dotted structure for reflecting and diffusing light. After the light guide plate 3 is assembled with the display panel of the display module, it can achieve the lighting display effect of the display module.

[0059] The LED beads 2 of the light panel 1 are arranged in an array, and the array structure of the LED beads 2 emits a linear light source, which shines into the light guide plate 3 from one side. Since the light emitted by the LED beads 2 is refracted and totally internally reflected inside the light guide plate 3, the light shines on the dots of the light guide plate 3 and is scattered, realizing total internal reflection of the light, so that the light is output from the side of the light guide plate 3 without dots, forming a surface light source to meet the lighting display requirements of the display module.

[0060] Specifically, the LED test strip can be electrically connected via a common anode connection. This means that several LED beads 2 on the LED test strip can be electrically connected via a common anode connection. Based on this common anode connection structure, a positive terminal and three negative terminals corresponding to the red, blue, and green LED chips are provided on the circuit board of the LED test strip. Since the power parameters of the red, blue, and green LED chips are different, voltage divider resistors are set in the working circuits corresponding to the red, blue, and green LED chips in the circuit design of the circuit board. This allows for adjustment of the operating current and voltage data of each device according to the power parameter requirements of the red, blue, and green LED chips.

[0061] Furthermore, the voltage divider resistor is an adjustable resistor, which can meet the precise adjustment of the electrical driving parameters of the red light chip, blue light chip and green light chip.

[0062] Furthermore, the electrical connection method of the LED test light strip can also be an independent anode connection, that is, the red light chip, blue light chip and green light chip on the LED test light strip are driven by three different power supplies, so that devices of different colors can be driven by adaptive power supplies according to their own parameters to meet the display requirements of mixed light illumination color points.

[0063] This invention provides a backlight module manufacturing apparatus. By assembling a test light strip with several LED beads 2 with a display module for whole-machine testing, the target color point value of the white LED device is calculated based on the test data. Combined with the structural design requirements of the white LED device, the phosphor ratio is adaptively adjusted, thereby improving the manufacturing accuracy of the white LED device, avoiding repeated experimental verification, shortening the development cycle of the liquid crystal display, and effectively reducing development costs.

[0064] Furthermore, the above provides a detailed description of the backlight module fabrication method and apparatus provided by the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A method for manufacturing a backlight module, characterized in that, The preparation method includes: Set the LED test light strip according to the model and size of the display module; The LED test light strip is assembled with the display module to perform a whole-machine lighting operation. The driving electrical parameters of the LED test light strip are adjusted so that the whole machine display reaches the target color point value, and the first electrical parameter is obtained. Based on the first electrical parameters and the electrical structure of the backlight module, calculate the working electrical data of a single LED bead, and query the luminous flux and color coordinates of various LED beads based on the working electrical data; Based on the luminous flux and color coordinates of each LED, a colorimetric mixing formula is constructed and the theoretical value of the white light color point of the backlight module is calculated. Based on the theoretical value of the white light color point, combined with the pre-selected blue light chip wavelength, phosphor and adhesive type, the phosphor mixing ratio is obtained, and the backlight module is prepared according to the phosphor mixing ratio.

2. The backlight module manufacturing method as described in claim 1, characterized in that, The step of setting the LED test light strip according to the model and size of the display module includes: Based on the operating current and voltage requirements of the display module model and the dimensions of the display module, calculate the total number of LED beads in the LED test light strip and the spacing between the LED beads.

3. The backlight module manufacturing method as described in claim 1, characterized in that, The process of assembling the LED test light strip with the display module and lighting up the entire device, adjusting the driving electrical parameters of the LED test light strip to make the entire display reach the target color point value, and obtaining the first electrical parameter includes: After assembling the LED test light strip with the display module, the whole machine is lit up, and the coordinates of the white light point of the whole machine display status are obtained by testing equipment. By adjusting the driving electrical parameters of the LED test light strip, the coordinates of the white light color point are adjusted to match the target color point value, and the first electrical parameter of the target color point value is achieved.

4. The backlight module manufacturing method as described in claim 1, characterized in that, The step of calculating the operating electrical data of a single LED bead based on the first electrical parameters and the electrical structure of the backlight module, and querying the luminous flux and color coordinates of various LED beads based on the operating electrical data, includes: Continuous electrical tests were conducted on the LED chips required for the backlight module to obtain a data comparison table of luminous flux and color coordinates of the LED chips. The number of LED beads and their series-parallel connection structure are obtained based on the electrical structure of the backlight module. The working electrical data of a single LED bead are calculated based on the number of LED beads and their series-parallel connection structure. Based on the operating electrical data, obtain the luminous flux and color coordinates of each LED bead from the data lookup table.

5. The backlight module manufacturing method as described in claim 1, characterized in that, The process of constructing a colorimetric mixing formula and calculating the theoretical value of the white light color point of the backlight module based on the luminous flux and color coordinates of each LED chip includes: Calculate the brightness ratio of LEDs of different colors based on the luminous flux of each LED; A chromaticity mixing formula is constructed by combining the color coordinates of each LED bead and the brightness ratio, and the theoretical value of the white light color point of the backlight module is calculated based on the chromaticity mixing formula.

6. The backlight module manufacturing method as described in claim 5, characterized in that, The chromaticity mixing formula is as follows: ； ； in, The X-axis coordinates of the blending color points. The Y-axis coordinate of the color point. Let x be the x-coordinate value of the color coordinate of the i-th LED bead. Let be the ordinate value of the color coordinate of the i-th LED bead. Let be the brightness ratio of the i-th LED.

7. The backlight module manufacturing method as described in claim 1, characterized in that, The preparation method further includes: The LED test strip is individually lit under the first electrical parameter condition to obtain the white light color point detection value of the LED test strip; The theoretical value of the white light color point is verified by using the detected white light color point value.

8. The backlight module manufacturing method as described in claim 1, characterized in that, The step of obtaining the phosphor mixing ratio based on the theoretical value of the white light color point, combined with the pre-selected blue light chip wavelength, phosphor, and adhesive type, and preparing the backlight module according to the phosphor mixing ratio includes: On the CIE chromaticity diagram, the theoretical value of the white light color point is connected to the wavelength point of the blue light chip and extended to obtain the intersection of the extended line and the emission spectrum of the phosphor. The wavelength corresponding to the intersection point is set as the target wavelength of the phosphor. The phosphor ratio is adjusted according to the target wavelength, and the phosphor with the final ratio is then encapsulated into LED beads.

9. A backlight module manufacturing apparatus, characterized in that, The fabrication apparatus is used to perform the backlight module fabrication method as described in any one of claims 1 to 8. The fabrication apparatus includes: an LED test strip and a color point detection device. The LED test strip is used to be adapted and installed with the display module and to perform a whole-machine lighting test. The color point detection device is used to detect the color point value of the light emitted by the LED test strip, or the color point detection device is used to detect the color point value in the whole-machine lighting state. The LED test light strip includes: a light board, a light guide plate, and a number of LED beads. The number of LED beads are disposed on the light board, and the light board is disposed on one side of the light guide plate to form a side-entry light strip structure.

10. The backlight module manufacturing apparatus as described in claim 9, characterized in that, The LED test light strip is electrically connected in a common anode configuration; or The LED test light strip is electrically connected using an independent anode connection.

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